Display panel and display module

Abstract

The present application provides a display panel and a display module, wherein the display panel has a binding area, and the display panel includes: a substrate; an input terminal, an output terminal, and a base layer located in the binding area and on the substrate, wherein the base layer includes at least two sub-base layers located between the input terminal and the output terminal, and the at least two sub-base layers are spaced apart in the direction from the input terminal to the output terminal. Since at least two sub-base layers are spaced apart, there is a gap between two adjacent sub-base layers, and the base layer is disconnected at the gap so that the base layer forms a discontinuous film layer, so that the forces of the sub-base layers located on both sides of the gap cannot be transmitted to each other. Therefore, the display panel and the display module provided by the present application can alleviate the poor binding between the driver chip and the display panel, thereby ensuring the display effect of the display panel and the display module.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display module. Background Art

[0002] Organic Light-Emitting Diode (OLED) has the characteristics of active luminescence, high contrast, ultra-lightness, low temperature resistance, fast response speed, low power consumption, wide viewing angle, and strong shock resistance, so it is used more and more.

[0003] In the related art, the display panel includes a display area and a binding area. The display panel in the binding area is bound and connected to the driving chip, thereby realizing the transmission of electrical signals between the driving chip and the display panel.

[0004] However, the above-mentioned display panel and the driving chip are prone to poor binding, thereby affecting the display effect of the display panel and the display module. Summary of the invention

[0005] In view of at least one of the above technical problems, an embodiment of the present application provides a display panel and a display module, which can alleviate the poor binding between the driving chip and the display panel, thereby ensuring the display effect of the display panel and the display module.

[0006] In order to achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0007] A first aspect of an embodiment of the present application provides a display panel, the display panel having a binding area, the display panel comprising: a substrate; an input terminal, an output terminal and a base layer located in the binding area and on the substrate, the base layer comprising at least two sub-base layers located between the input terminal and the output terminal, and the at least two sub-base layers are spaced apart in a direction from the input terminal to the output terminal.

[0008] The display panel mentioned in the embodiment of the present application may include a binding area, and the display panel in the binding area may be used to bind the driver chip. The display panel may include a substrate, and a base layer, an input terminal and an output terminal are arranged on the substrate in the binding area. The base layer may include at least two sub-base layers between the input terminal and the output terminal, and at least two sub-base layers are arranged at intervals along the direction from the input terminal to the output terminal. There is a gap between two adjacent sub-base layers, and the base layer is disconnected at the gap. Since at least two sub-base layers are arranged at intervals, the base layer can form a discontinuous film layer, so that the forces of the sub-base layers on both sides of the gap cannot be transmitted to each other. The force of the base layer close to the input terminal cannot be transmitted to the base layer close to the output terminal through the gap, and the force of the base layer close to the output terminal cannot be transmitted to the base layer close to the input terminal through the gap, so that the forces of the base layer close to the input terminal and the base layer close to the output terminal can be alleviated, and the risk of the base layer peeling off from other structural layers can be reduced, thereby alleviating the poor binding between the driver chip and the display panel, and ensuring the display effect of the display panel and the display module.

[0009] In a possible implementation, the display panel further includes a supporting terminal, and the supporting terminal is located between the input terminal and the output terminal;

[0010] At least two sub-base layers are located between the support terminal and the input terminal; and / or at least two sub-base layers are located between the support terminal and the output terminal;

[0011] It can be realized that the support terminal is provided in the same layer and with the same material as the input terminal and / or the output terminal.

[0012] In this way, the force of the base layer close to the supporting terminal can be alleviated from being transmitted to the base layer close to the input terminal and / or the base layer close to the output terminal.

[0013] In a possible embodiment, the display panel includes at least one isolation member, which is located on the substrate, with a gap between each two adjacent sub-base layers, one gap and one isolation member are correspondingly arranged, and the orthographic projection of the isolation member on the substrate covers the orthographic projection of the gap on the substrate; what can be realized is that the display panel also includes a display area adjacent to the binding area, the display panel includes a plurality of metal layers located in the display area and stacked on the substrate along the thickness direction of the display panel, and at least one of the isolation member, the input terminal and the output terminal is arranged in the same layer and the same material as at least one of the plurality of metal layers.

[0014] In this way, the isolation member is used to prevent the gap from exposing the organic layer under the base layer, thereby protecting the organic layer.

[0015] In a possible implementation manner, along the direction from the input terminal to the output terminal, two adjacent sub-base layers are respectively located on two opposite sides of the isolation member and are connected to the side surface of the isolation member.

[0016] In one possible embodiment, the isolation member is used to separate the base layer to form spaced sub-base layers and a protective base layer located on the side of the isolation member away from the substrate, and along the direction from the input terminal to the output terminal, the width of the isolation member on the side away from the substrate is greater than the width of the isolation member on the side close to the substrate.

[0017] In a possible implementation, the isolating member is used to isolate the base layer to form a sub-base layer arranged at intervals and a protective base layer located on the side of the isolating member away from the substrate, and from the direction close to the substrate to the direction away from the substrate, the isolating member includes a first isolating layer, a second isolating layer and a third isolating layer stacked in sequence, along the direction from the input terminal to the output terminal, the width of the third isolating layer is greater than the width of the second isolating layer, and the third isolating layer includes a bottom surface facing the second isolating layer, and a portion of the bottom surface that does not contact the second isolating layer and a side surface of the second isolating layer define a groove;

[0018] It can be implemented that the material of the first isolation layer and / or the third isolation layer includes titanium, molybdenum or indium tin oxide, and the material of the second isolation layer includes aluminum or silver.

[0019] In this way, by providing the grooves, it is convenient to form the base layer into a disconnected sub-base layer and a protection base layer located on the side of the isolation member away from the substrate.

[0020] In a possible implementation manner, at least parts of two adjacent sub-base layers cover the surface of the corresponding isolation member on a side facing away from the substrate.

[0021] In a possible implementation, the display panel further includes an organic layer, wherein the organic layer is located between the base layer and the substrate, and at least a portion of the organic layer is located between the isolation member and the substrate.

[0022] In a possible implementation, there are multiple output terminals, and in the plane where the display panel is located, along a direction perpendicular to the input terminal to the output terminal, the multiple output terminals are arranged at intervals, and the arrangement length of the multiple output terminals is less than or equal to the extension length of the gap;

[0023] And / or, there are multiple input terminals, and in the plane where the display panel is located, the multiple input terminals are arranged at intervals along a direction perpendicular to the input terminals to the output terminals, and the arrangement length of the multiple input terminals is less than or equal to the extension length of the gap.

[0024] In this way, the gap can effectively alleviate the stress of the base layer near each output terminal in the output terminal group; and / or, the gap can effectively alleviate the stress of the base layer near each input terminal in the input terminal group.

[0025] A second aspect of an embodiment of the present application provides a display module, comprising a driving chip and the display panel of the first aspect, wherein the driving chip is bound and connected to the display panel.

[0026] The display module provided by the embodiment of the present application may include a display panel, and the display panel may include a binding area, and the display panel in the binding area may be used to bind the driver chip. The display panel may include a substrate, and a base layer, an input terminal and an output terminal are arranged on the substrate in the binding area. The base layer may include at least two sub-base layers between the input terminal and the output terminal, and at least two sub-base layers are arranged at intervals along the direction from the input terminal to the output terminal. There is a gap between two adjacent sub-base layers, and the base layer is disconnected at the gap. Since at least two sub-base layers are arranged at intervals, the base layer can form a discontinuous film layer, so that the forces of the sub-base layers on both sides of the gap cannot be transmitted to each other. The force of the base layer close to the input terminal cannot be transmitted to the base layer close to the output terminal through the gap, and the force of the base layer close to the output terminal cannot be transmitted to the base layer close to the input terminal through the gap, so that the force of the base layer close to the input terminal and the base layer close to the output terminal can be alleviated, and the risk of the base layer peeling off from other structural layers is reduced, thereby alleviating the poor binding between the driver chip and the display panel, and ensuring the display effect of the display panel and the display module.

[0027] The construction of the present application and its other inventive objectives and beneficial effects will be more clearly understood through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 A top view of a display panel provided in an embodiment of the present application;

[0030] Figure 2 A top view of a display panel in a binding area provided in an embodiment of the present application;

[0031] Figure 3 A schematic diagram of the structure of the isolation element and the sub-base layer provided in the embodiment of the present application;

[0032] Figure 4 Another structural schematic diagram of the isolation member and the sub-base layer provided in the embodiment of the present application;

[0033] Figure 5 Another schematic diagram of the structure of the isolation member and the sub-base layer provided in the embodiment of the present application;

[0034] Figure 6A schematic diagram of the structure of the first isolation layer, the second isolation layer and the third isolation layer provided in an embodiment of the present application;

[0035] Figure 7 Another schematic diagram of the structure of the isolation member and the sub-base layer provided in an embodiment of the present application.

[0036] Description of reference numerals:

[0037] 10: display module; 100: display panel;

[0038] 100a: display area; 100b: non-display area;

[0039] 100c: binding region; 110: substrate;

[0040] 120: dielectric layer; 130: organic layer;

[0041] 140: base layer; 142: sub-base layer;

[0042] 143: Protect the base layer; 144: Gap;

[0043] 150: conductive terminal; 151: input terminal;

[0044] 152: output terminal; 153: support terminal;

[0045] 160: isolation member; 160a: first isolation layer;

[0046] 160b: second isolation layer; 160c: third isolation layer;

[0047] 161: first surface; 162: second surface;

[0048] 163: groove; 164: side surface;

[0049] 165: bottom surface; 166: top surface;

[0050] 200: driving chip; 210: first pad;

[0051] 220: second pad; 230: supporting pad;

[0052] 300: Anisotropic conductive adhesive. DETAILED DESCRIPTION

[0053] The inventor has found that in the related art, the display panel may include a substrate and a planarization layer and an inorganic insulating layer sequentially stacked on the substrate. The display panel may include a binding area, and the display panel in the binding area may be used to bind a driver chip. The driver chip is provided with a first pad and a second pad. The display panel located in the binding area is provided with a first terminal and a second terminal. During the binding process, the driver chip needs to be pressed onto the display panel in the binding area so that the first terminal and the first pad, and the second terminal and the second pad are pressed and electrically connected, thereby realizing signal transmission between the display panel and the driver chip.

[0054] However, when the driving chip is pressed against the display panel of the binding area, the first pad and the second pad squeeze the inorganic insulating layer below, causing the inorganic insulating layer near the first pad (i.e., the first terminal) and the second pad (i.e., the second terminal) to be subjected to greater stress and deformation. The inorganic insulating layer is simultaneously subjected to the first squeezing force of the first pad and the second squeezing force of the second pad. The first squeezing force is transmitted along the inorganic insulating layer toward the second terminal, and the second squeezing force is transmitted along the inorganic insulating layer toward the first terminal, further increasing the stress on the inorganic insulating layer near the first terminal and the second terminal, causing it to deform more. Since the planarization layer below the inorganic insulating layer is formed of organic materials, the bonding force of the inorganic insulating layer formed by the organic material and the inorganic material is poor. If the inorganic insulating layer near the first terminal and the second terminal is deformed greatly, it is easy to cause the inorganic insulating layer and the planarization layer to peel off at that location. As time goes on, the peeling position of the inorganic insulating layer will be transmitted from the position near the first terminal and the position near the second terminal to each other, resulting in further increase in the degree of peeling of the inorganic insulating layer and the planarization layer. This may result in poor binding between the driver chip and the display panel, or even breakage of metal traces in the binding area, thus affecting the display effect of the display panel and the display module.

[0055] Based on at least one of the above technical problems, the embodiment of the present application provides a display panel and a display module, wherein the display panel has a binding area, and the display panel in the binding area can be used to bind a driver chip. The display panel may include a substrate, and a base layer, an input terminal, and an output terminal are arranged on the substrate in the binding area. The base layer may include at least two sub-base layers located between the input terminal and the output terminal, and the at least two sub-base layers are arranged at intervals along the direction from the input terminal to the output terminal. There is a gap between two adjacent sub-base layers, and the base layer is disconnected at the gap. Since at least two sub-base layers are arranged at intervals, the base layer can form a discontinuous film layer, so that the forces of the sub-base layers located on both sides of the gap cannot be transmitted to each other. The force of the base layer close to the input terminal cannot be transmitted to the base layer close to the output terminal through the gap, and the force of the base layer close to the output terminal cannot be transmitted to the base layer close to the input terminal through the gap, so that the forces of the base layer close to the input terminal and the base layer close to the output terminal can be alleviated, and the risk of the base layer peeling off from other structural layers can be reduced, thereby alleviating the poor binding between the driver chip and the display panel, and ensuring the display effect of the display panel and the display module.

[0056] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0057] The following will be combined Figure 1-Figure 7 The display module 10 provided in the embodiment of the present application is described.

[0058] The present embodiment provides a display module 10, which can be applied to display devices such as electronic paper, mobile phones, tablet computers, televisions, monitors, laptop computers, digital photo frames, smart bracelets, smart watches, super personal computers, and navigators.

[0059] like Figure 3 As shown, the display module 10 may include a display panel 100 and a driving chip 200 , and the display panel 100 and the driving chip 200 are bound and connected.

[0060] The display panel 100 includes an organic light-emitting diode (OLED) display panel, a micro light-emitting diode (Micro LED or μLED) display panel, or a liquid crystal display (LCD) display panel.

[0061] like Figure 1 and Figure 3 As shown, the display panel 100 includes a display area 100a and a non-display area 100b, and the display area 100a and the non-display area 100b are arranged adjacent to each other. Optionally, the non-display area 100b surrounds the periphery of the display area 100a. The non-display area 100b includes a binding area 100c, and the display panel 100 located in the binding area 100c is used to bind the driving chip 200.

[0062] like Figure 2 As shown, the display panel 100 includes a first direction X, which may be the width direction of the display panel 100; the display panel 100 includes a second direction Y, which may be the length direction of the display panel 100; the display panel 100 includes a third direction, which may be the thickness direction of the display panel 100. The first direction X, the second direction Y and the third direction are different, for example, the first direction X, the second direction Y and the third direction are perpendicular to each other. The length, width and thickness in the embodiments of the present application are only for the convenience of description and do not mean any limitation on the size. For example, the width may be greater than, equal to or less than the length.

[0063] In an optional embodiment, in the display area 100a, the display panel 100 includes an array substrate and a light-emitting layer on the array substrate. A plurality of pixel circuits are arranged in an array in the array substrate, and the pixel circuits are electrically connected to the light-emitting layer, and the pixel circuits are used to provide a driving current for the light-emitting layer. The pixel circuits include a thin film transistor (TFT) and a capacitor structure.

[0064] The light emitting layer includes an anode layer, a cathode layer and a light emitting material layer located between the anode layer and the cathode layer. The anode layer is located on the side of the cathode layer facing the substrate 110. The anode layer is a pixel electrode and the cathode layer is a common electrode.

[0065] See also Figure 3As shown, the array substrate includes a substrate 110, and the substrate 110 can provide support for the remaining structural layers that are subsequently arranged. The substrate 110 includes a rigid substrate or a flexible substrate. The array substrate also includes a semiconductor layer, a first metal layer, a second metal layer, a third metal layer and a fourth metal layer that are sequentially stacked on the substrate 110, and an insulating layer is provided between each adjacent two layers of the semiconductor layer, the first metal layer, the second metal layer and the third metal layer. A planarization layer is provided between the third metal layer and the fourth metal layer, and the planarization layer provides a good plane support. For example, the material of the planarization layer includes an organic material such as polyimide (PI for short), polyacrylate, epoxy resin, polyethylene (PE), polypropylene, polystyrene, polyethylene terephthalate, polymethyl methacrylate (PMMA), polyethylene naphthalate or polyimide, etc.

[0066] In an optional embodiment, the semiconductor layer includes an active layer of multiple thin film transistors, the first metal layer includes a scanning line, a first electrode of a capacitor structure, a light-emitting control line and at least one of the gates of the multiple thin film transistors; the second metal layer includes a reference line and at least one of the second electrode of the capacitor structure; the third metal layer includes the source / drain of the transistor; and the fourth metal layer includes a power line.

[0067] In an optional embodiment, in the display area 100a, a touch layer is provided on a side of the light-emitting layer away from the array substrate, the touch layer includes a fifth metal layer and a sixth metal layer, the sixth metal layer is located on a side of the fifth metal layer away from the substrate 110, the fifth metal layer includes a first touch line, and the sixth metal layer includes a second touch line. One of the first touch line and the second touch line is a bridge layer, and the other of the first touch line and the second touch line is a touch function layer. An insulating layer is provided between the first touch line and the second touch line to electrically insulate the first touch line and the second touch line. For example, the material of the insulating layer may be silicon nitride.

[0068] In an optional embodiment, the substrate 110 extends from the display area 100 a to the non-display area, that is, the substrate 110 is disposed in both the display area 100 a and the non-display area 100 b .

[0069] In an optional embodiment, in the non-display area 100b, a dielectric layer 120 is disposed on the substrate 110, and at least one of the insulating layers in the display area 100a (including the semiconductor layer, the first metal layer, the second metal layer, and the insulating layer between each adjacent two layers of the third metal layer) is disposed in the same layer and material as the dielectric layer 120, thereby simplifying the preparation process of the dielectric layer 120.

[0070] The "same layer, same material" in the embodiments of the present application means that the base film layer is formed of the same material, and after the base film layer is patterned and / or processed by other processes, different parts of the base film layer are respectively formed into multiple structural film layers. The processing processes of the formed different structural film layers are the same or different, and the formed different structural film layers have the same or different thicknesses, and can also be on the same horizontal plane or different horizontal planes.

[0071] In an optional embodiment, in the non-display area 100b, an organic layer 130 is disposed on the side of the dielectric layer 120 away from the substrate 110, and the planarization layer in the display area 100a can be disposed in the same layer and material as the organic layer 130, thereby simplifying the preparation process of the organic layer 130. A base layer 140 is disposed on the side of the organic layer 130 and the dielectric layer 120 away from the substrate 110 to avoid corrosion by water, oxygen, etc. Optionally, the base layer 140 is disposed in the same layer and material as the insulating layer (the insulating layer between the first touch control wiring and the second touch control wiring), thereby simplifying the preparation process of the base layer 140. Of course, at least one of the organic layer 130, the dielectric layer 120 and the base layer 140 may not be disposed in the same layer and material as the structural layer located in the display area 100a, but may be prepared separately.

[0072] like Figure 3 As shown, a conductive terminal 150 is disposed on the substrate. At least one of the plurality of metal layers located in the display area 100a, such as the first metal layer, the second metal layer, the third metal layer, the fourth metal layer, the fifth metal layer and the sixth metal layer, may extend to the non-display area 100b to form a conductive terminal. Figure 3 As shown, the conductive terminal 150 is formed by stacking a second metal layer, a third metal layer, a fourth metal layer and a sixth metal layer.

[0073] In an alternative embodiment, participating Figure 2 As shown, the conductive terminal 150 includes an input terminal 151, and the number of the input terminal 151 includes a plurality. The conductive terminal 150 includes an output terminal 152, and the number of the output terminal 152 includes a plurality. The input terminal 151 and the output terminal 152 can be arranged at intervals along the first direction X, or the input terminal 151 and the output terminal 152 can be arranged at intervals along the second direction Y. The embodiment of the present application is described by taking the input terminal 151 and the output terminal 152 as an example of being arranged at intervals along the first direction X.

[0074] like Figure 3As shown, the conductive terminal 150 also includes a support terminal 153, and the support terminal 153 can be located between the input terminal 151 and the output terminal 152. The number of the support terminal 153 includes multiple. In the binding process of the driver chip 200 and the display panel 100, the support terminal 153 can support the driver chip 200 between the input terminal 151 and the output terminal 152 to prevent the driver chip 200 from being depressed by force. Among them, the support terminal 153 may have no other functional characteristics except for the supporting function. Optionally, the support terminal 153 is set in the same layer and material as the input terminal 151 and / or the output terminal 152, so that the support terminal 153 and the input terminal 151 and / or the output terminal 152 are substantially the same in deformation when under pressure, so as to improve the binding effect between the driver chip 200 and the display panel 100. It should be noted that the support terminal 153 can also be made of different materials from the input terminal 151 and the output terminal 152.

[0075] In an alternative embodiment, see Figure 2 As shown, a plurality of input terminals 151 arranged at intervals along the second direction Y form an input terminal group A, the number of input terminal group A includes at least one, and when the number of input terminal group A is multiple, the multiple input terminal groups A are arranged at intervals along the first direction X. A plurality of output terminals 152 arranged at intervals along the second direction Y form an output terminal group B, the number of output terminal group B includes at least one, and when the number of output terminal group B is multiple, the multiple output terminal groups B are arranged at intervals along the first direction X. A plurality of support terminals 153 arranged at intervals along the second direction Y form a support terminal group C, the number of support terminal group C includes at least one, and when the number of support terminal group C is multiple, the multiple support terminal groups C are arranged at intervals along the first direction X. The support terminal group C is located between the input terminal group A and the output terminal group B.

[0076] Among them, see Figure 3 As shown, the driver chip 200 is provided with a first pad 210 and a second pad 220 corresponding to the input terminal 151 and the output terminal 152. The driver chip 200 is also provided with a support pad 230 corresponding to the support terminal 153. When the driver chip 200 is bound to the display panel 100, the input terminal 151 is attached to and electrically connected to the first pad 210, the output terminal 152 is attached to and electrically connected to the second pad 220, and the support terminal 153 is attached to the support pad 230. Taking the connection between the input terminal 151 and the first pad 210 as an example, the input terminal 151 and the first pad 210 are welded. Alternatively, an anisotropic conductive film (ACF) 300 is provided between the driver chip 200 and the display panel 100, and the input terminal 151 and the first pad 210 can be connected through the anisotropic conductive film 300.

[0077] In some embodiments, Figure 3 As shown, the base layer 140 located between the input terminal 151 and the output terminal 152 includes at least two sub-base layers 142, and the at least two sub-base layers 142 are arranged along the first direction X ( Figure 2 ) are arranged at intervals. The base layer 140 located between the input terminal 151 and the output terminal 152 is disconnected to form at least two sub-base layers 142, and there is a gap 144 between each two adjacent sub-base layers 142. Since at least two sub-base layers 142 are arranged at intervals, the base layer 140 forms a discontinuous film layer, that is, the base layer 140 is disconnected at the gap 144, so that the forces between the two sub-base layers 142 located on both sides of the gap 144 along the first direction X cannot be transmitted to each other. The force on the sub-base layer 142 near the input terminal 151 cannot be transmitted to the sub-base layer 142 near the output terminal 152 through the gap 144, and the force on the sub-base layer 142 near the output terminal 152 cannot be transmitted to the sub-base layer 142 near the input terminal 151 through the gap 144, thereby alleviating the force on the base layer 140 near the input terminal 151 and the base layer 140 near the output terminal 152, reducing the risk of the base layer 140 and the organic layer 130 being peeled off, thereby alleviating the poor binding between the driving chip 200 and the display panel 100, and ensuring the display effect of the display panel 100 and the display module 10. Optionally, the number of the at least two sub-base layers 142 can be 2, 3, 4 or 5 or more.

[0078] In an optional embodiment, if Figure 3As shown, at least two sub-base layers 142 are located between the support terminal 153 and the input terminal 151, and the base layer 140 between the support terminal 153 and the input terminal 151 includes at least two sub-base layers 142, thereby preventing the force of the base layer 140 near the support terminal 153 from being transmitted to the base layer 140 near the input terminal 151. In addition, when the base layer 140 near the support terminal 153 is peeled off, the gap 144 can prevent the peeling position from spreading toward the base layer 140 near the input terminal 151, thereby alleviating the force on the base layer 140 near the input terminal 151, reducing the risk of peeling of the base layer 140 and the organic layer 130 at this location, thereby alleviating the poor binding between the driving chip 200 and the display panel 100, and ensuring the display effect of the display panel 100 and the display module 10. In addition, at least two sub-base layers 142 are located between the support terminal 153 and the output terminal 152, and the base layer 140 between the support terminal 153 and the output terminal 152 includes at least two sub-base layers 142, thereby preventing the force of the base layer 140 near the support terminal 153 from being transmitted to the base layer 140 near the output terminal 152. In addition, when the base layer 140 near the support terminal 153 is peeled off, the gap 144 can prevent the peeling position from spreading toward the base layer 140 near the output terminal 152, thereby alleviating the force on the base layer 140 near the output terminal 152, reducing the risk of peeling of the base layer 140 and the organic layer 130 at this location, thereby alleviating the poor binding between the driving chip 200 and the display panel 100, and ensuring the display effect of the display panel 100 and the display module 10.

[0079] Among them, the base layer 140 located between the support terminal 153 and the input terminal 151 can be disconnected to form at least two sub-base layers 142, or the base layer 140 located between the support terminal 153 and the output terminal 152 can be disconnected to form at least two sub-base layers 142, or the base layer 140 located between the support terminal 153 and the input terminal 151 and the base layer 140 located between the support terminal 153 and the output terminal 152 can be disconnected at the same time to form at least two sub-base layers 142.

[0080] like Figure 4As shown, an isolator 160 is provided at the gap 144, and the number of isolators 160 includes at least one, and the isolators 160 and the gaps 144 can be provided one by one. The isolator 160 is used to prevent the gap 144 from exposing the organic layer 130, thereby protecting the organic layer 130. Among them, the isolator 160 is located on the side of the organic layer 130 away from the substrate 110, so as to prevent water, oxygen, etc. from entering the organic layer 130 covered with the isolator 160 from the side of the isolator 160 away from the substrate 110. The orthographic projection of the gap 144 on the substrate 110 can be located within the orthographic projection of the isolator 160 on the substrate 110, so that the gap 144 cannot expose the organic layer 130, and the isolator 160 forms a complete protection for the organic layer 130.

[0081] The spacer 160 includes a first surface 161 and a second surface 162 which are spaced apart and arranged opposite to each other along the thickness direction of the display panel 100, and a side surface 164 located between the first surface 161 and the second surface 162. The first surface 161 is located on a side of the spacer 160 away from the substrate 110, and the second surface 162 is located on a side of the spacer 160 facing the substrate 110.

[0082] Illustratively, multiple metal layers located in the display area 100a, for example, at least one of the fourth metal layer, the fifth metal layer and the sixth metal layer, extend to the non-display area 100b to form the isolation member 160, thereby simplifying the preparation process of the isolation member 160. The principle has been explained and will not be repeated here.

[0083] In an optional embodiment, if Figure 3 As shown, the isolation member 160 is located in the gap 144, and the first surface 161 and a portion of the side surface 164 are exposed outside the base layer 140. The first surface 161 and a portion of the side surface 164 do not cover the base layer 140. Along the direction from the input terminal 151 to the output terminal 152 (i.e., the first direction X), two adjacent sub-base layers 142 are respectively located on opposite sides of the isolation member 160 and connected to the side surface 164 of the isolation member 160.

[0084] Exemplarily, along the direction from the input terminal 151 to the output terminal 152, the isolation member 160 has a width W ( Figure 5). The width W of the isolation member 160 on the side away from the substrate 110 is greater than the width W of the isolation member 160 on the side close to the substrate 110. For example, the width W of the isolation member 160 gradually increases from the direction close to the substrate 110 to the direction away from the substrate 110, that is, the shape of the cross section (i.e., the longitudinal section) of the isolation member 160 perpendicular to the substrate 110 is an inverted trapezoid. The isolation member 160 can be used to separate the base layer 140. When the base layer 140 is formed on the side of the isolation member 160 and the organic layer 130 away from the substrate 110, the base layer 140 is not easily formed on the side wall surface 164, so that the base layer 140 is disconnected by setting the inverted trapezoidal isolation member 160, forming a sub-base layer 142 spaced apart on opposite sides of the isolation member 160 and a protective base layer 143 located on the first surface 161 ( Figure 5 ).

[0085] For example, Figure 4 and Figure 5 As shown, a groove 163 is provided on the isolation member 160, and a side surface 164 of the isolation member 160 is recessed toward the center of the isolation member 160 to form the groove 163. The isolation member 160 provided with the groove 163 is used to separate the base layer 140. When the base layer 140 is formed on the side of the isolation member 160 and the organic layer 130 away from the substrate 110, the base layer 140 is not easily formed in the groove 163, so that the side surface 164 cannot be covered by the base layer 140, so that the base layer 140 is disconnected by providing the isolation member 160 with the groove 163, forming the sub-base layer 142 spaced apart on the opposite sides of the isolation member 160 and the protective base layer 143 located on the first surface 161.

[0086] Optional, see Figure 6As shown, from the direction close to the substrate 110 to the direction away from the substrate 110, the isolation member 160 includes a first isolation layer 160a, a second isolation layer 160b and a third isolation layer 160c which are stacked in sequence. The etching rate of the second isolation layer 160b is greater than the etching rate of the third isolation layer 160c. In the process of forming the isolation member 160, the isolation member 160 is etched by a chemical etchant. Since the etching rate of the second isolation layer 160b is relatively high and the etching rate of the third isolation layer 160c is relatively low, the etching of the side of the second isolation layer 160b is more serious than the etching of the side of the third isolation layer 160c. Along the direction from the input terminal 151 to the output terminal 152, the width of the third isolation layer 160c is relatively large and the width of the second isolation layer 160b is relatively small. The third isolation layer 160c includes a bottom surface 165 facing the second isolation layer 160b, and the portion of the bottom surface 165 of the third isolation layer 160c that does not contact the second isolation layer 160b and the side surface of the second isolation layer 160b define a groove 163. In addition, the etching speed of the second isolation layer 160b can be greater than the etching speed of the first isolation layer 160a. Along the direction from the input terminal 151 to the output terminal 152, the widths of the first isolation layer 160a and the third isolation layer 160c are larger, and the width of the second isolation layer 160b is smaller. The first isolation layer 160a includes a top surface 166 facing the second isolation layer 160b, and the portion of the bottom surface 165 that does not contact the second isolation layer 160b, the portion of the top surface 166 that does not contact the second isolation layer 160b, and the side surface of the second isolation layer 160b define a groove 163.

[0087] Among them, the isolation member 160 can only be provided with the second isolation layer 160b and the third isolation layer 160c without the first isolation layer 160a, so that the structure of the isolation member 160 is relatively simple. Alternatively, the isolation member 160 is provided with the first isolation layer 160a, the second isolation layer 160b and the third isolation layer 160c at the same time, and the first isolation layer 160a and the third isolation layer 160c play a protective role for the second isolation layer 160b. Optionally, taking the isolation member 160 as an example in which the first isolation layer 160a, the second isolation layer 160b and the third isolation layer 160c are provided, the material of the first isolation layer 160a and / or the third isolation layer 160c may include at least one of titanium, molybdenum and indium tin oxide, and the material of the second isolation layer 160b may include at least one of aluminum and silver.

[0088] In an optional embodiment, if Figure 7As shown, part of the first surface 161 is exposed outside the base layer 140. At least part of two adjacent sub-base layers 142 covers the surface of the corresponding isolation member 160 on the side away from the substrate 110. That is, at least part of two adjacent sub-base layers 142 covers the first surface 161. The parts of the two sub-base layers 142 covering the first surface 161 are arranged at intervals. For example, the isolation member 160 can be first formed on the surface of the organic layer 130 away from the substrate 110, and then the base layer 140 is formed on the side of the isolation member 160 and the organic layer 130 away from the substrate 110, and then the base layer 140 on the first surface 161 is patterned to disconnect the base layer 140.

[0089] In an optional embodiment, if Figure 2 As shown, along the second direction Y, the extension length D2 of the isolation member 160 is greater than or equal to the gap 144 ( Figure 3 ). The embodiment of the present application is described by taking the example that the extension length D2 of the isolation member 160 along the second direction Y is equal to the extension length of the gap 144 along the second direction Y.

[0090] For example, Figure 2 As shown, along the second direction Y, the extension length D1 of the input terminal group A (i.e., the arrangement length of the multiple input terminals 151 along the second direction Y) is less than or equal to the extension length D2 of the gap 144, so that the gap 144 can effectively alleviate the stress condition of the base layer 140 near each input terminal 151 in the input terminal group A.

[0091] For example, Figure 2 As shown, along the second direction Y, the extension length D3 of the output terminal group B (i.e., the arrangement length of the multiple output terminals 152 along the second direction Y) is less than or equal to the extension length D2 of the gap 144, so that the gap 144 can effectively alleviate the stress condition of the base layer 140 near each output terminal 152 in the output terminal group B.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: The display panel has a binding area, and the display panel includes: substrate; An input terminal, an output terminal and a base layer located in the binding area and on the substrate, wherein the base layer includes at least two sub-base layers located between the input terminal and the output terminal, and the at least two sub-base layers are arranged at intervals along a direction from the input terminal to the output terminal; Also included is a support terminal, the support terminal is located between the input terminal and the output terminal; At least two of the sub-base layers are located between the support terminal and the input terminal; and / or at least two of the sub-base layers are located between the support terminal and the output terminal; It includes at least one isolating member, which is located on the substrate. There is a gap between every two adjacent sub-base layers. One gap and one isolating member are correspondingly arranged. The orthographic projection of the isolating member on the substrate covers the orthographic projection of the gap on the substrate.

2. The display panel according to claim 1, characterized in that: The support terminal is provided in the same layer and with the same material as the input terminal and / or the output terminal.

3. The display panel according to claim 1 or 2, characterized in that: The display panel also includes a display area adjacent to the binding area, and the display panel includes a plurality of metal layers located in the display area and stacked on the substrate along the thickness direction of the display panel, and at least one of the isolation member, the input terminal and the output terminal is arranged in the same layer and material as at least one of the plurality of metal layers.

4. The display panel according to claim 3, characterized in that: Along the direction from the input terminal to the output terminal, two adjacent sub-base layers are respectively located on two opposite sides of the isolation member and connected to the side surface of the isolation member.

5. The display panel according to claim 3, characterized in that: The isolation member is used to separate the base layer to form the sub-base layers that are spaced apart and a protective base layer located on the side of the isolation member away from the substrate. Along the direction from the input terminal to the output terminal, the width of the isolation member on the side away from the substrate is greater than the width of the isolation member on the side close to the substrate.

6. The display panel according to claim 3, characterized in that: The isolation member is used to isolate the base layer to form the sub-base layers arranged at intervals and a protective base layer located on the side of the isolation member away from the substrate. From the direction close to the substrate to the direction away from the substrate, the isolation member includes a first isolation layer, a second isolation layer and a third isolation layer stacked in sequence. Along the direction from the input terminal to the output terminal, the width of the third isolation layer is greater than the width of the second isolation layer. The third isolation layer includes a bottom surface facing the second isolation layer, and the portion of the bottom surface that does not contact the second isolation layer and the side surface of the second isolation layer define a groove.

7. The display panel according to claim 6, characterized in that: The material of the first isolation layer and / or the third isolation layer includes titanium, molybdenum or indium tin oxide, and the material of the second isolation layer includes aluminum or silver.

8. The display panel according to claim 3, characterized in that: At least parts of two adjacent sub-base layers cover the surface of the corresponding isolation member on a side away from the substrate.

9. The display panel according to claim 3, characterized in that: An organic layer is also included. The organic layer is located between the base layer and the substrate, and at least a portion of the organic layer is located between the isolation member and the substrate.

10. The display panel according to claim 3, characterized in that: There are multiple output terminals, and in the plane where the display panel is located, along a direction perpendicular to the input terminal to the output terminal, the multiple output terminals are arranged at intervals, and the arrangement length of the multiple output terminals is less than or equal to the extension length of the gap; And / or, there are multiple input terminals, and in the plane where the display panel is located, the multiple input terminals are arranged at intervals along a direction perpendicular to the input terminals to the output terminals, and the arrangement length of the multiple input terminals is less than or equal to the extension length of the gap.

11. A display module, characterized in that: It comprises a driving chip and a display panel as described in any one of claims 1 to 10, wherein the driving chip is bound and connected to the display panel.

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