Cavity Position Monitoring Method, Device, Computer Equipment, Storage Medium

Abstract

The present application relates to a method, device, computer device, storage medium, and computer program product for monitoring the position of a cavity. The method includes: placing a wafer to be measured in a target area within the cavity, where the wafer to be measured includes a chip area and a marking area, and the chip area has a coating; obtaining the position information of a plurality of test points, where the test points are located in a preset area of the cavity, and the preset area is located within the target area; detecting the sheet resistance of the wafer to be measured at the test points according to the position information of each of the test points; and determining the offset situation between the preset area and the marking area according to the sheet resistance of the wafer to be measured at each of the test points. By using this method, there is no need to additionally use a special wafer, which can save manpower and equipment production capacity and reduce the production cost of samples.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor coating, and particularly to a method, device, computer device, storage medium, and computer program product for monitoring the position of a cavity. Background Art

[0002] In the semiconductor coating process, a physical vapor deposition device (Physical Vapor Deposition, abbreviated as PVD) is often used to deposit a metal thin film on a wafer. In actual production, in order to maintain the stability of the machine tool performance, prevent the reduction of the process yield, and extend the life of the machine tool and its components, it is necessary to take corresponding maintenance or replacement measures for the corresponding components of the machine tool at regular intervals, that is, preventive maintenance (abbreviated as PM). However, after the PVD cavity undergoes PM, the marked shielding area inside the PVD cavity may shift, so that the alignment marks for protecting the wafer cannot be covered by the metal film, so it is necessary to confirm whether the marked shielding area has shifted.

[0003] Generally, an engineer visually inspects the film formation situation of a special wafer for testing in the PVD cavity to determine whether the marked shielding area has shifted. When the alignment mark is within the marked shielding area on the special wafer, it indicates that the marked shielding area of the cavity has not shifted; when the alignment mark is outside the marked shielding area on the special wafer, it indicates that the marked shielding area of the cavity has shifted.

[0004] However, the current method of visually inspecting film formation often requires an engineer to manually take out the special wafer for visual observation. This will greatly consume the equipment productivity of the laser marking machine tool and the PVD machine tool and the wafer production cost. Summary of the Invention

[0005] Based on this, it is necessary to provide a method, device, computer device, computer-readable storage medium, and computer program product for monitoring the position of a cavity that can improve the machine tool efficiency and reduce the labor and material costs for the above technical problems.

[0006] In a first aspect, the present application provides a method for monitoring the position of a cavity. The method includes:

[0007] Placing a wafer to be tested in a target area inside the cavity, the wafer to be tested includes a chip area and a marking area, and the chip area has a coating;

[0008] Obtaining the position information of a plurality of test points, the test points are located in a preset area of the cavity, and the preset area is located within the target area;

[0009] Detecting the sheet resistance of the wafer to be tested at the test points according to the position information of each test point;

[0010] Determine the offset between the preset area and the marked area according to the sheet resistance of the wafer to be measured at each test point.

[0011] In one embodiment, obtain the position information of a plurality of test points, including:

[0012] Obtain the position information of the target area in the cavity;

[0013] Output a first floor plan including the target area;

[0014] Receive a first instruction to select a preset area on the first floor plan, and obtain the position information of the preset area on the first floor plan;

[0015] Output a second floor plan including the preset area;

[0016] Receive a second instruction to select a test point on the second floor plan, and obtain the position information of the test point on the second floor plan;

[0017] Determine the position information of the test point in the cavity according to the position information of the target area in the cavity, the position information of the preset area on the first floor plan, and the position information of the test point on the second floor plan.

[0018] In one embodiment, determine the position information of the test point in the cavity according to the position information of the target area in the cavity, the position information of the preset area on the first floor plan, and the position information of the test point on the second floor plan, including:

[0019] Establish a first coordinate system on the first floor plan to obtain the coordinates of the target area in the first coordinate system;

[0020] Determine the positional relationship between the preset area and the target area according to the coordinates of the target area in the first coordinate system and the position information of the preset area on the first floor plan;

[0021] Establish a second coordinate system on the second floor plan to obtain the coordinates of the preset area in the second coordinate system;

[0022] Determine the positional relationship between the test point and the preset area according to the coordinates of the preset area in the second coordinate system and the position information of the test point on the second floor plan;

[0023] Determine the position information of the test point in the cavity according to the position information of the target area in the cavity, the positional relationship between the preset area and the target area, and the positional relationship between the test point and the preset area.

[0024] In one embodiment, it further includes: a plurality of test points are distributed on at least three line segments intersecting at the same point, and the angle between every two of the line segments is less than or equal to 180°.

[0025] In one embodiment, it further includes: at least three of the test points are distributed on each of the line segments.

[0026] In one embodiment, determining the offset between the preset region and the marking region according to the sheet resistance of the wafer under test at each test point includes:

[0027] If the sheet resistance of the wafer under test at at least one test point is greater than 0, it is determined that there is an offset between the preset region and the marking region;

[0028] If the sheet resistance of the wafer under test at several test points is all 0, it is determined that there is no offset between the preset region and the marking region.

[0029] In a second aspect, the present application further provides a cavity position monitoring device. The device includes:

[0030] A sample placement module, configured to place the wafer under test in a target region within the cavity. The wafer under test includes a chip region and a marking region, and the chip region has a coating;

[0031] An acquisition module, configured to acquire the position information of several test points. The test points are located in a preset region of the cavity, and the preset region is located within the target region;

[0032] A test module, configured to detect the sheet resistance of the wafer under test at the test points according to the position information of each test point;

[0033] A judgment module, configured to determine the offset between the preset region and the marking region according to the sheet resistance of the wafer under test at each test point.

[0034] In a third aspect, the present application further provides a computer device. The computer device includes a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0035] Place the wafer under test in a target region within the cavity. The wafer under test includes a chip region and a marking region, and the chip region has a coating;

[0036] Acquire the position information of several test points. The test points are located in a preset region of the cavity, and the preset region is located within the target region;

[0037] Detect the sheet resistance of the wafer under test at the test points according to the position information of each test point;

[0038] Determine the offset between the preset region and the marking region according to the sheet resistance of the wafer under test at each test point.

[0039] Fourthly, the present application also provides a computer-readable storage medium. On the computer-readable storage medium, there is a computer program which, when executed by a processor, implements the following steps:

[0040] Place the wafer to be measured in the target area inside the cavity. The wafer to be measured includes a chip area and a marking area, and the chip area has a coating;

[0041] Obtain the position information of a number of test points. The test points are located in a preset area of the cavity, and the preset area is located inside the target area;

[0042] Detect the sheet resistance of the wafer to be measured at the test points according to the position information of each test point;

[0043] Determine the offset situation between the preset area and the marking area according to the sheet resistance of the wafer to be measured at each test point.

[0044] Fifthly, the present application also provides a computer program product. The computer program product includes a computer program which, when executed by a processor, implements the following steps:

[0045] Place the wafer to be measured in the target area inside the cavity. The wafer to be measured includes a chip area and a marking area, and the chip area has a coating;

[0046] Obtain the position information of a number of test points. The test points are located in a preset area of the cavity, and the preset area is located inside the target area;

[0047] Detect the sheet resistance of the wafer to be measured at the test points according to the position information of each test point;

[0048] Determine the offset situation between the preset area and the marking area according to the sheet resistance of the wafer to be measured at each test point.

[0049] The above method, device, computer equipment, storage medium and computer program product for monitoring the cavity position use the wafer to be tested placed in the target area of the equipment cavity as the detection object. The chip area of the wafer to be tested is coated, and the marking area of the sample to be tested is not coated. Determine the preset area of the cavity within the target area of the cavity, and then determine several test points to be tested through the preset area of the cavity. Finally, perform a sheet resistance test on the several test points. Since whether the wafer to be tested is coated at the test points will affect the sheet resistance test result, it is possible to judge whether the selected several test points within the preset area are coated through the sheet resistance test result. When the test result shows that none of the test points are coated, it means that there is no offset between the preset area and the marking area; when the test result shows that at least one test point is coated, it means that there is an offset between the preset area and the marking area. Automatically test the sheet resistance of the selected test points through the equipment, and judge the cavity position offset situation according to the test values, without the need to additionally use a specially made wafer for testing, and perform laser marking and coating on the specially made wafer, which can save the equipment production capacity of the laser marking machine and the PVD machine, and reduce the production cost of the wafer. Description of the Drawings

[0050] Figure 1 It is an application environment diagram of the cavity position monitoring method in an embodiment;

[0051] Figure 2 It is a schematic flowchart of the cavity position monitoring method in an embodiment;

[0052] Figure 3 It is a schematic flowchart of the cavity position monitoring method in an embodiment;

[0053] Figure 4 It is a schematic diagram of the first plan view in an embodiment;

[0054] Figure 5 It is a schematic diagram of the second plan view in an embodiment;

[0055] Figure 6 It is a second plane test diagram including several test points in an embodiment;

[0056] Figure 7 It is a schematic flowchart of the cavity position monitoring method in an embodiment;

[0057] Figure 8 It is a first coordinate schematic diagram of the first plan view in an embodiment;

[0058] Figure 9 It is a second coordinate schematic diagram of the second plane in an embodiment;

[0059] Figure 10 It is a schematic flowchart of the cavity position monitoring method in an embodiment;

[0060] Figure 11 It is the internal structure diagram of a computer device in an embodiment. Detailed implementation manners

[0061] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0062] As described in the background art, currently, the visual inspection film forming method is used to judge the offset of the marked shielding area inside the cavity. Since the visual inspection film forming method often requires the use of a special wafer, after being marked on the special wafer by a laser marking machine, it is then placed in a coating equipment for coating. This method often consumes a large amount of equipment production capacity and wafer production cost. Since the wafer after coating needs to be taken out manually, it may cause wafer contamination during sampling and visual inspection, thus resulting in deviation in accuracy.

[0063] The cavity position monitoring method provided by the embodiment of the present application can be applied to an application environment as Figure 1 shown. This application environment involves a monitoring device 110, a coating equipment 120, and a wafer to be tested 130. Among them, the monitoring device 110 communicates with the coating equipment 120 through a network, and the wafer to be tested 130 is placed in the cavity of the coating equipment 120. The monitoring device 110 can be but is not limited to various personal computers, laptop computers, smart phones, and tablet computers.

[0064] Among them, the monitoring device 110 places the wafer to be tested in the target area inside the cavity. The wafer to be tested includes a chip area and a marked area, and the chip area has a coating; obtains the position information of a plurality of test points, the test points are located in a preset area of the cavity, and the preset area is located inside the target area; detects the sheet resistance of the wafer to be tested at the test points according to the position information of each test point; determines the offset of the preset area and the marked area according to the sheet resistance of the wafer to be tested at each test point.

[0065] In one embodiment, as Figure 2 shown, a method for monitoring the cavity position is provided, including the following steps:

[0066] S10, place the wafer to be tested in the target area inside the cavity. The wafer to be tested includes a chip area and a marked area, and the chip area has a coating.

[0067] Among them, the cavity is the cavity of the coating equipment, and there is an area for placing the wafer inside the cavity, that is, the target area. Placing the wafer inside the cavity can coat the wafer.

[0068] The wafer to be measured is a wafer that has already been coated. The wafer includes a chip area and a marking area. The chip area is the area where the chip is formed by coating, so the coating position of the wafer to be measured is within the chip area. The marking area is the area on the wafer where alignment marks are set and is usually not coated to avoid obscuring the alignment marks.

[0069] Specifically, the monitoring device can control the robotic arm to place the wafer to be measured within the target area in the cavity. For example, the monitoring device controls the robotic arm to grasp a wafer to be measured from the placement location of the wafer to be measured, move the wafer to be measured to the target area in the cavity, and release it.

[0070] S20. Obtain the position information of a number of test points. The test points are located within a preset area of the cavity, and the preset area is located within the target area.

[0071] Among them, the preset area of the cavity is an area preset in the cavity where coating is not performed. If the preset area coincides with the marking area of the wafer to be measured, the alignment marks on the wafer to be measured can be protected from being obscured by the coating.

[0072] Specifically, the monitoring device can obtain the position information of the target area from the cavity equipment and obtain the positional relationship between a number of test points, the preset area, and the target area through the input / output interface, and then determine the position information of a number of test points.

[0073] Exemplarily, a number of test points can be evenly distributed within the preset area to cover the preset area of the cavity as completely as possible.

[0074] S30. Detect the sheet resistance of the wafer to be measured at each test point according to the position information of each test point.

[0075] Among them, the sheet resistance refers to the resistance from side to side of a square thin-film conductive material.

[0076] Specifically, the monitoring device can control the resistance measurement equipment to detect the sheet resistance at each test point, so as to obtain the sheet resistance of the wafer to be measured at the test point.

[0077] S40. Determine the offset situation between the preset area and the marking area according to the sheet resistance of the wafer to be measured at each test point.

[0078] Specifically, when the sheet resistance value of any test point indicates that the test point is covered by the thin film, the monitoring device determines that there is an offset between the preset area and the marking area; when the sheet resistance values of all test points indicate that none of the test points are covered by the thin film, the monitoring device determines that there is no offset between the preset area and the marking area.

[0079] The above-mentioned cavity position monitoring method first selects several test points within the preset area of the cavity for sheet resistance testing. Since the sheet resistance measurement result can indirectly indicate whether the test point is covered by the thin film, and the marking area is the area on the wafer where no film is coated, and the preset area is the area preset in the cavity where no coating is to be performed. When the sheet resistance value of a certain test point indicates that the test point is covered by the thin film, that is, a certain point in the preset area is covered by the thin film, it means that the preset area and the marking area are offset; when the sheet resistance values of all test points indicate that none of them are covered by the thin film, that is, the preset area and the marking area are not offset. The device automatically tests the sheet resistance of the selected test points, and judges the cavity position offset situation according to the test values, saving manpower and equipment production capacity and improving the monitoring accuracy.

[0080] In one embodiment, as Figure 3 shown, obtaining the position information of several test points includes the following steps:

[0081] S21, obtaining the position information of the target area in the cavity.

[0082] Among them, the position information of the target area in the cavity may include the coordinates in the coordinate system established for the space in the cavity.

[0083] Specifically, the monitoring device can obtain the position information of the target area in the cavity from the cavity equipment.

[0084] Exemplarily, the target area is located in the central area of the cavity, and the size and shape of the target area are the same as those of the wafer to be measured.

[0085] S22, outputting a first floor plan including the target area.

[0086] Among them, the first floor plan shows the size and shape information of the cavity and the target area, as well as the relative position information between the cavity and the target area.

[0087] Specifically, the monitoring device includes a display screen, and outputs the first floor plan through the display screen.

[0088] Exemplarily, as Figure 4 shown, the first floor plan shows the cavity base 1 and the target area 2. The target area 2 is circular, and the target area 2 is located in the central area of the cavity base 1.

[0089] S23, receiving a first instruction to select a preset area on the first floor plan, and obtaining the position information of the preset area on the first floor plan.

[0090] Among them, the position information of the preset area on the first floor plan may include the coordinates in the coordinate system established for the first floor plan.

[0091] Specifically, the monitoring device includes a touch screen corresponding to the display screen, and receives a first instruction for selecting a preset area on the first plan view through the touch screen, so as to obtain the size, shape and relative position of the preset area on the first plan view.

[0092] Exemplarily, the preset area is located within the target area, the size of the preset area is larger than the size of the alignment mark on the wafer, the position of the preset area is consistent with the position of the alignment mark on the wafer, and the shape of the preset area can be any shape.

[0093] S24. Output a second plan view including the preset area.

[0094] Wherein, the second plan view shows the size and shape information of the target area and the preset area, as well as the relative position information between the target area and the preset area.

[0095] Specifically, the monitoring device includes a display screen, and outputs the second plan view through the display screen.

[0096] Exemplarily, as Figure 5 shown, the preset areas 31 and 32 are located at the edge of the wafer 2 to be measured, and the symmetry axes of the preset areas 31 and 32 are on the same straight line, and this straight line passes through the center of the wafer 2 to be measured.

[0097] S25. Receive a second instruction for selecting a test point on the second plan view, and obtain the position information of the test point on the second plan view.

[0098] Wherein, the position information of the test point on the second plan view may include the coordinates for establishing a coordinate system for the second plan view.

[0099] Specifically, the monitoring device includes a touch screen corresponding to the display screen, and receives a second instruction for selecting a test point on the second plan view through the touch screen, so as to obtain the distribution and number of the test points, and the relative position on the second plan view.

[0100] Exemplarily, as Figure 6 shown, the test point 4 is located within the preset areas 31 and 32, the distribution of the test points should cover as much as possible the inside of the preset areas 31 and 32 and extend from the center to the edge, and the number of the test points is not less than 10.

[0101] S26. Determine the position information of the test point in the cavity according to the position information of the target area in the cavity, the position information of the preset area on the first plan view, and the position information of the test point on the second plan view.

[0102] Specifically, the position information of the target area in the cavity includes the coordinate values of the target area in a coordinate system established with the cavity as the reference object. The position information of the preset area on the first plane graph includes the coordinate values of the preset area in a coordinate system established with the target area as the reference object. The position information of the test point on the second plane graph includes the coordinate values of the test point in a coordinate system with the preset area as the reference object. According to the position information of the test point on the second plane, the positional relationship between the test point and the preset area can be determined; according to the position information of the preset area on the first plane, the positional relationship between the preset area and the target area can be determined, and thus the positional relationship between the test point and the target area can be determined; according to the position information of the target area in the cavity, the positional relationship of the target area in the cavity can be determined, and thus the position information of the test point in the cavity can be determined.

[0103] In the above embodiment, the position information of the target area in the cavity is obtained to determine the area where the wafer to be measured is coated in the cavity. Then, the position information of the preset area within the target area is obtained to determine the area where the wafer to be measured is not coated under the preset conditions. Finally, the position information of the test point within the preset area is obtained to determine the distribution of the test point within the preset area. Through the successive positioning of the interior of the cavity, the target area, and the preset area, the monitoring device completes the precise selection of the test point.

[0104] In one embodiment, according to the position information of the target area in the cavity, the position information of the preset area on the first plane graph, and the position information of the test point on the second plane graph, the position information of the test point in the cavity is determined, as Figure 7 shown, including the following steps:

[0105] S2611, establish a first coordinate system on the first plane graph to obtain the coordinates of the target area in the first coordinate system.

[0106] Specifically, the monitoring device establishes a coordinate system for the first plane graph output by the display screen. The monitoring device corresponds the position information of the target area in the cavity with the coordinates of the target area in the first coordinate system.

[0107] Exemplarily, as Figure 8 shown, the first coordinate system is X1Y1, the directions of the X1 axis and the Y1 axis are perpendicular to each other, and the origin of coordinates can be set at any point, such as the center point of the target area 2. The direction of the X1 axis is the horizontal direction of the first plane graph, the direction of the Y1 axis is the vertical direction of the first plane graph, and the coordinate scale can be adjusted according to the accuracy requirements.

[0108] S2612, according to the coordinates of the target area in the first coordinate system and the position information of the preset area on the first plane graph, determine the positional relationship between the preset area and the target area.

[0109] Specifically, after the touch screen receives a first instruction to select a preset area on the first floor plan, the touch screen will collect the data of the selected preset area range and feedback it to the monitoring device. The monitoring device obtains the position information of the preset area on the first floor plan, so as to determine the coordinates of the preset area in the first coordinate system. In the first floor plan, according to the coordinates of the target area in the first coordinate system and the coordinates of the preset area in the first coordinate system, the positional relationship between the preset area and the target area can be determined.

[0110] Exemplarily, there are two preset areas within the target area, namely the first preset area and the second preset area. The straight line passing through the center points of the first preset area and the second preset area passes through the center point of the target area.

[0111] S2613. Establish a second coordinate system on the second floor plan to obtain the coordinates of the preset area in the second coordinate system.

[0112] Specifically, the monitoring device establishes a coordinate system for the second floor plan output by the display screen. The monitoring device corresponds the coordinates of the preset area in the first coordinate system with the coordinates of the preset area in the second coordinate system.

[0113] Exemplarily, as Figure 9 shown, the second coordinate system is X2Y2, the directions of the X2 axis and the Y2 axis are perpendicular to each other, and the coordinate origin can be set at any point, such as the center point of target area 2. The direction of the X2 axis is parallel to the connection line of the center points of the first preset area and the second preset area, and the coordinate scale can be adjusted according to the accuracy requirements.

[0114] S2614. Determine the positional relationship between the test point and the preset area according to the coordinates of the preset area in the second coordinate system and the position information of the test point on the second floor plan.

[0115] Specifically, after the touch screen receives a second instruction to select a test point on the second floor plan, the monitoring device obtains the position information of the test point on the second floor plan. According to the position information of the test point on the second floor plan, the monitoring device can generate the coordinates of the test point in the second coordinate system. According to the coordinates of the preset area and the test point in the second coordinate system, the positional relationship between the test point and the preset area can be determined.

[0116] S2615. Determine the position information of the test point in the cavity according to the position information of the target area in the cavity, the positional relationship between the preset area and the target area, and the positional relationship between the test point and the preset area.

[0117] Specifically, the monitoring device can determine the positional relationship of the test point in the target area based on the positional relationship between the test point and the preset area, as well as the positional relationship between the preset area and the target area. Further, the monitoring device can determine the positional relationship of the test point in the cavity based on the positional relationship of the target area in the cavity.

[0118] In one embodiment, the positional information of the test point in the cavity is determined according to the positional information of the target area in the cavity, the positional information of the preset area on the first plane graph, and the positional information of the test point on the second plane graph. As Figure 10 shown, it includes the following steps:

[0119] S2621, establish a first coordinate system on the first plane graph to obtain the coordinates of the target area in the first coordinate system.

[0120] Specifically, step S2621 can be the same as step S2611, which will not be elaborated here.

[0121] S2622, determine the positional relationship between the preset area and the target area according to the coordinates of the target area in the first coordinate system and the positional information of the preset area on the first plane graph.

[0122] Specifically, step S2622 can be the same as step S2612, which will not be elaborated here.

[0123] S2623, obtain the positional relationship between the preset area and the test point.

[0124] Specifically, the position of the test point in the preset area can also be determined by the monitoring device according to the predetermined distribution rule of the test points, that is, the monitoring device can pre-determine the positional relationship between the test point and the preset area.

[0125] Exemplarily, as Figure 9 shown, all the test points are included in the preset area. In the X2-axis direction, there is a test point distribution line, and the angles between other test point distribution lines and this test point distribution line can be any angles such as 30°, 45°, 60°, etc. In the same test point distribution line, the distances between the test points are equal. The distance between the two ends of the test point distribution line does not exceed the range of the corresponding preset area. There are 26 selected test points, which are respectively denoted as (x1, y1), (x2, y2)…(x 26 , y 26 ). The test point (x1, y1) is located at the intersection of three distribution lines in the preset area 31, and the test point (x 14 , y 14 ) is located at the intersection of three distribution lines in the preset area 32. According to the test point distribution rule, the distance between the test points on the same distribution line is L. Therefore, first determine the test points (x1, y1) and (x 14 , y14 ), and then on the distribution line collinear with the X2 axis within the preset area 31, the coordinates of the test points are successively (x1 - 2*L, y1), (x1 - L, y1), (x1, y1), (x1 + L, y1), (x1 + 2*L, y1). On the distribution line collinear with the X2 axis within the preset area 32, the coordinates of the test points are successively (x 14 - 2*L, y1), (x 14 - L, y1), (x 14 , y1), (x 14 + L, y1), (x 14 + 2*L, y1). The included angles between the other two distribution lines and the distribution line collinear with the X2 axis are 60° and 120° respectively, and the distance between the test points on the distribution line is L. According to the above geometric rules, the coordinate values of the test points on the other two distribution lines are determined successively.

[0126] S2624. According to the position information of the target area in the cavity, the positional relationship between the preset area and the target area, and the positional relationship between the test points and the preset area, determine the position information of the test points in the cavity.

[0127] Specifically, step S2624 can be the same as step S2615, which will not be elaborated here.

[0128] In one embodiment, it further includes: a plurality of test points are distributed on at least three line segments intersecting at the same point, and the included angle between each two of the line segments is less than or equal to 180°.

[0129] Exemplarily, as Figure 9 shown, the distribution of the test points can be approximately in the shape of a "rice" character or any other shape that can roughly cover the preset area, which is to ensure that the coating situation inside the preset area can be reflected after testing all the test points in the preset area.

[0130] In one of the embodiments, it further includes: at least three of the test points are distributed on each of the line segments.

[0131] When the number of test points is too small, the measurement is not accurate enough. When the number of test points is too large, it will be time-consuming and consume computing efficiency.

[0132] Exemplarily, as Figure 9 shown, among the test points distributed approximately in the shape of a "rice" character, 5 test points are evenly distributed on each line segment.

[0133] In the above embodiments, through the reasonable selection of the distribution and quantity of the test points, the overall situation within the preset area can be reflected.

[0134] In one embodiment, the offset between the preset area and the marking area is determined according to the sheet resistance of the wafer under test at each test point, including: if the sheet resistance of the wafer under test at at least one test point is greater than 0, it is determined that there is an offset between the preset area and the marking area; if the sheet resistances of the wafer under test at several test points are all 0, it is determined that there is no offset between the preset area and the marking area.

[0135] Specifically, the resistance measuring device in the monitoring device measures the sheet resistance of each test point in sequence according to the test point number. After all the test points are measured, the values of each test point and the corresponding sheet resistance are summarized and output.

[0136] Exemplarily, Table 1 below shows some test points and the corresponding sheet resistance values.

[0137] Table 1

[0138]

[0139]

[0140] As shown in Table 1 above, the sheet resistance values of the test points numbered 4, 5, 9, and 10 are greater than 0, indicating that the test points numbered 4, 5, 9, and 10 are covered by the thin film. Further, it indicates that there is a coating situation in the preset area. Therefore, it can be determined that there is an offset between the preset area and the marking area.

[0141] In one embodiment, it further includes: counting the number of sheet resistance values greater than 0, and judging the offset degree of the preset area relative to the marking area.

[0142] Exemplarily, when the proportion of the number of sheet resistance values greater than 0 is more than one-third, it indicates a large offset degree.

[0143] In the above embodiment, by judging whether the preset area is covered by the thin film according to the sheet resistance values of several test points representing the range of the preset area, it is possible to monitor whether there is an offset between the preset area and the marking area of the wafer and the offset degree, and at the same time, it can also avoid wafer contamination caused by human contact, thereby affecting the accuracy of judging the offset.

[0144] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear description in this article, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0145] Based on the same inventive concept, an embodiment of the present application further provides a cavity position monitoring device for implementing the above-mentioned cavity position monitoring method. The solution provided by this device to solve the problem is similar to the solution described in the above method. Therefore, the specific limitations in one or more embodiments of the cavity position monitoring device provided below can refer to the limitations on the cavity position monitoring method in the above text, and will not be repeated here.

[0146] In one embodiment, a cavity position monitoring device is provided, including: a sample placement module, an acquisition module, a test module, and a judgment module; where:

[0147] The sample placement module is used to place the wafer to be tested in the target area inside the cavity. The wafer to be tested includes a chip area and a marking area, and the chip area has a coating.

[0148] The acquisition module is used to acquire the position information of a number of test points. The test points are located in a preset area of the cavity, and the preset area is located inside the target area.

[0149] The test module is used to detect the sheet resistance of the wafer to be tested at the test points according to the position information of each test point.

[0150] The judgment module is used to determine the offset situation between the preset area and the marking area according to the sheet resistance of the wafer to be tested at each test point.

[0151] In one of the embodiments, the acquisition module includes: an acquisition unit, a first output unit, a first receiving unit, a second output unit, a second receiving unit, and a determination unit; where:

[0152] The acquisition unit is used to acquire the position information of the target area inside the cavity.

[0153] The first output unit is used to output a first floor plan including the target area.

[0154] The first receiving unit is configured to receive a first instruction for selecting a preset area on a first plane graph, and obtain the position information of the preset area on the first plane graph.

[0155] The second output unit is configured to output a second plane graph including the preset area.

[0156] The second receiving unit is configured to receive a second instruction for selecting a test point on the second plane graph, and obtain the position information of the test point on the second plane graph.

[0157] The determination unit is configured to determine the position information of the test point in the cavity according to the position information of the target area in the cavity, the position information of the preset area on the first plane graph, and the position information of the test point on the second plane graph.

[0158] In one embodiment, the acquisition module further includes: a first establishment unit, a first determination unit, a second establishment unit, a second determination unit, and a third determination unit; wherein:

[0159] The first establishment unit is configured to establish a first coordinate system on the first plane graph, and obtain the coordinates of the target area in the first coordinate system.

[0160] The first determination unit is configured to determine the positional relationship between the preset area and the target area according to the coordinates of the target area in the first coordinate system and the position information of the preset area on the first plane graph.

[0161] The second establishment unit is configured to establish a second coordinate system on the second plane graph, and obtain the coordinates of the preset area in the second coordinate system.

[0162] The second determination unit is configured to determine the positional relationship between the test point and the preset area according to the coordinates of the preset area in the second coordinate system and the position information of the test point on the second plane graph.

[0163] The third determination unit is configured to determine the position information of the test point in the cavity according to the position information of the target area in the cavity, the positional relationship between the preset area and the target area, and the positional relationship between the test point and the preset area.

[0164] In one embodiment, a plurality of test points are distributed on at least three line segments intersecting at the same point, and the included angle between each two of the line segments is less than or equal to 180°.

[0165] In one embodiment, at least three of the test points are distributed on each of the line segments.

[0166] In one embodiment, the determination module is configured to determine that there is an offset between the preset area and the marking area if the sheet resistance of the wafer under test is greater than 0 at at least one test point; and determine that there is no offset between the preset area and the marking area if the sheet resistance of the wafer under test is 0 at a plurality of test points.

[0167] Each module in the above cavity position monitoring device can be implemented in whole or in part by software, hardware, and their combination. Each of the above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0168] In one embodiment, a computer device is provided. The computer device can be a terminal, and its internal structure diagram can be as Figure 10 shown. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner. The wireless manner can be implemented through WIFI, a mobile cellular network, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a cavity position monitoring method. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer covering the display screen, or a button, a trackball, or a touchpad provided on the shell of the computer device, or an external keyboard, touchpad, or mouse, etc.

[0169] Those skilled in the art can understand that Figure 10 the structure shown in

[0170] In one embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory. When the processor executes the computer program, the following steps are implemented: Place a wafer to be tested in a target area within a cavity. The wafer to be tested includes a chip area and a marking area, and the chip area has a coating; Obtain the position information of a number of test points, where the test points are located in a preset area within the cavity, and the preset area is located within the target area; Detect the sheet resistance of the wafer to be tested at the test points according to the position information of each test point; Determine the offset situation between the preset area and the marking area according to the sheet resistance of the wafer to be tested at each test point.

[0171] In one of the embodiments, when the processor executes the computer program, the following steps are further implemented: Obtain the position information of the target area within the cavity; Output a first floor plan including the target area; Receive a first instruction to select a preset area on the first floor plan to obtain the position information of the preset area on the first floor plan; Output a second floor plan including the preset area; Receive a second instruction to select a test point on the second floor plan to obtain the position information of the test point on the second floor plan; Determine the position information of the test point within the cavity according to the position information of the target area within the cavity, the position information of the preset area on the first floor plan, and the position information of the test point on the second floor plan.

[0172] In one of the embodiments, when the processor executes the computer program, the following steps are further implemented: Establish a first coordinate system on the first floor plan to obtain the coordinates of the target area in the first coordinate system; Determine the positional relationship between the preset area and the target area according to the coordinates of the target area in the first coordinate system and the position information of the preset area on the first floor plan; Establish a second coordinate system on the second floor plan to obtain the coordinates of the preset area in the second coordinate system; Determine the positional relationship between the test point and the preset area according to the coordinates of the preset area in the second coordinate system and the position information of the test point on the second floor plan; Determine the position information of the test point within the cavity according to the position information of the target area within the cavity, the positional relationship between the preset area and the target area, and the positional relationship between the test point and the preset area.

[0173] In one of the embodiments, a number of test points are distributed on at least three line segments intersecting at the same point, and the angle between each two of the line segments is less than or equal to 180°.

[0174] In one of the embodiments, at least three of the test points are distributed on each of the line segments.

[0175] In one of the embodiments, when the processor executes the computer program, the following steps are further implemented: If the sheet resistance of the wafer to be tested at at least one test point is greater than 0, it is determined that there is an offset between the preset area and the marking area; If the sheet resistance of the wafer to be tested at a number of test points is 0, it is determined that there is no offset between the preset area and the marking area.

[0176] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented: placing a wafer to be measured in a target area within a cavity, the wafer to be measured including a chip area and a marking area, and the chip area having a coating; obtaining position information of a plurality of test points, the test points being located in a preset area within the cavity, and the preset area being located within the target area; detecting sheet resistance of the wafer to be measured at the test points according to the position information of each test point; and determining an offset situation between the preset area and the marking area according to the sheet resistance of the wafer to be measured at each test point.

[0177] In one of the embodiments, when the computer program is executed by the processor, the following steps are further implemented: obtaining position information of the target area within the cavity; outputting a first floor plan including the target area; receiving a first instruction for selecting the preset area on the first floor plan to obtain position information of the preset area on the first floor plan; outputting a second floor plan including the preset area; receiving a second instruction for selecting a test point on the second floor plan to obtain position information of the test point on the second floor plan; and determining position information of the test point within the cavity according to the position information of the target area within the cavity, the position information of the preset area on the first floor plan, and the position information of the test point on the second floor plan.

[0178] In one of the embodiments, when the computer program is executed by the processor, the following steps are further implemented: establishing a first coordinate system on the first floor plan to obtain coordinates of the target area in the first coordinate system; determining a positional relationship between the preset area and the target area according to the coordinates of the target area in the first coordinate system and the position information of the preset area on the first floor plan; establishing a second coordinate system on the second floor plan to obtain coordinates of the preset area in the second coordinate system; determining a positional relationship between the test point and the preset area according to the coordinates of the preset area in the second coordinate system and the position information of the test point on the second floor plan; and determining position information of the test point within the cavity according to the position information of the target area within the cavity, the positional relationship between the preset area and the target area, and the positional relationship between the test point and the preset area.

[0179] In one of the embodiments, a plurality of test points are distributed on at least three line segments intersecting at the same point, and an angle between each two of the line segments is less than or equal to 180°.

[0180] In one of the embodiments, at least three of the test points are distributed on each of the line segments.

[0181] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented: if the sheet resistance of the wafer under test is greater than 0 at at least one test point, it is determined that there is an offset between the preset area and the marking area; if the sheet resistance of the wafer under test is 0 at a plurality of test points, it is determined that there is no offset between the preset area and the marking area.

[0182] In one embodiment, a computer program product is provided, including a computer program which, when executed by a processor, implements the following steps: placing the wafer under test in a target area within a cavity, the wafer under test including a chip area and a marking area, and the chip area having a coating; obtaining the position information of a plurality of test points, the test points being located within a preset area of the cavity, and the preset area being located within the target area; detecting the sheet resistance of the wafer under test at the test points according to the position information of each test point; and determining the offset situation between the preset area and the marking area according to the sheet resistance of the wafer under test at each test point.

[0183] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented: obtaining the position information of the target area within the cavity; outputting a first floor plan including the target area; receiving a first instruction to select a preset area on the first floor plan to obtain the position information of the preset area on the first floor plan; outputting a second floor plan including the preset area; receiving a second instruction to select a test point on the second floor plan to obtain the position information of the test point on the second floor plan; and determining the position information of the test point within the cavity according to the position information of the target area within the cavity, the position information of the preset area on the first floor plan, and the position information of the test point on the second floor plan.

[0184] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented: establishing a first coordinate system on the first floor plan to obtain the coordinates of the target area in the first coordinate system; determining the positional relationship between the preset area and the target area according to the coordinates of the target area in the first coordinate system and the position information of the preset area on the first floor plan; establishing a second coordinate system on the second floor plan to obtain the coordinates of the preset area in the second coordinate system; determining the positional relationship between the test point and the preset area according to the coordinates of the preset area in the second coordinate system and the position information of the test point on the second floor plan; and determining the position information of the test point within the cavity according to the position information of the target area within the cavity, the positional relationship between the preset area and the target area, and the positional relationship between the test point and the preset area.

[0185] In one embodiment, a plurality of test points are distributed on at least three line segments intersecting at the same point, and the angle between every two of the line segments is less than or equal to 180°.

[0186] In one embodiment, at least three of the test points are distributed on each of the line segments.

[0187] In one of the embodiments, when the computer program is executed by a processor, the following steps are further implemented: if the sheet resistance of the wafer to be measured is greater than 0 at at least one test point, it is determined that there is an offset between the preset area and the marked area; if the sheet resistance of the wafer to be measured is 0 at several test points, it is determined that there is no offset between the preset area and the marked area.

[0188] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, a database, or other media used in the embodiments provided in the present application can include at least one of non-volatile and volatile memories. Non-volatile memories can include read-only memory (ROM), magnetic tapes, floppy disks, flash memories, optical memories, high-density embedded non-volatile memories, resistive random access memories (ReRAM), magnetoresistive random access memories (MRAM), ferroelectric random access memories (FRAM), phase change memories (PCM), graphene memories, etc. Volatile memories can include random access memory (RAM) or external cache memories, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in the present application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., and are not limited thereto. The processors involved in the embodiments provided in the present application can be general-purpose processors, central processors, graphics processors, digital signal processors, programmable logics, data processing logics based on quantum computing, etc., and are not limited thereto.

[0189] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0190] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims

1. A method for monitoring the position of a cavity, characterized in that The method includes: Placing a wafer under test in a target area within a cavity, where the wafer under test includes a chip area and a marking area, and the chip area has a coating; Obtaining the position information of a number of test points, where the test points are located in a preset area within the cavity, and the preset area is within the target area; the distribution of the number of test points within the preset area covers the interior of the preset area; the position of the preset area is consistent with the position of the marking area on the wafer under test; Detecting the sheet resistance of the wafer under test at each of the test points according to the position information of each of the test points; Determining the offset situation between the preset area and the marking area according to the sheet resistance of the wafer under test at each of the test points; Among them, obtaining the position information of a number of test points includes: Obtaining the position information of the target area within the cavity; Outputting a first floor plan including the target area; Receiving a first instruction to select the preset area on the first floor plan, and obtaining the position information of the preset area on the first floor plan; Outputting a second floor plan including the preset area; Receiving a second instruction to select the test point on the second floor plan, and obtaining the position information of the test point on the second floor plan; Determining the position information of the test point within the cavity according to the position information of the target area within the cavity, the position information of the preset area on the first floor plan, and the position information of the test point on the second floor plan; Among them, determining the position information of the test point within the cavity according to the position information of the target area within the cavity, the position information of the preset area on the first floor plan, and the position information of the test point on the second floor plan includes: Establishing a first coordinate system on the first floor plan to obtain the coordinates of the target area in the first coordinate system; Determining the positional relationship between the preset area and the target area according to the coordinates of the target area in the first coordinate system and the position information of the preset area on the first floor plan; Establishing a second coordinate system on the second floor plan to obtain the coordinates of the preset area in the second coordinate system; Determining the positional relationship between the test point and the preset area according to the coordinates of the preset area in the second coordinate system and the position information of the test point on the second floor plan; Determining the position information of the test point within the cavity according to the position information of the target area within the cavity, the positional relationship between the preset area and the target area, and the positional relationship between the test point and the preset area.

2. The method according to claim 1, wherein The number of test points are distributed on at least three line segments intersecting at the same point, and the angle between each two line segments is less than or equal to 180°.

3. The method according to claim 2, characterized in that, At least three of the test points are distributed on each line segment.

4. The method according to claim 1, characterized in that, Determining the offset situation between the preset area and the marking area according to the sheet resistance of the wafer under test at each of the test points includes: If the sheet resistance of the wafer under test at at least one of the test points is greater than 0, it is determined that there is an offset between the preset region and the marked region; If the sheet resistance of the wafer under test at all of the several test points is 0, it is determined that there is no offset between the preset region and the marked region.

5. A device for monitoring the position of a cavity, characterized in that, The device includes: A sample placement module for placing a wafer under test in a target region within a cavity. The wafer under test includes a chip region and a marked region, and the chip region has a coating; An acquisition module for acquiring the position information of several test points. The test points are located in a preset region within the cavity, and the preset region is located within the target region; the distribution of the several test points within the preset region covers the interior of the preset region; the position of the preset region is consistent with the position of the marked region on the wafer under test; A test module for detecting the sheet resistance of the wafer under test at the test points according to the position information of each of the test points; A judgment module for determining the offset situation between the preset region and the marked region according to the sheet resistance of the wafer under test at each of the test points; Among them, the acquisition of the position information of several test points includes: Acquiring the position information of the target region within the cavity; Outputting a first floor plan including the target region; Receiving a first instruction to select the preset region on the first floor plan to obtain the position information of the preset region on the first floor plan; Outputting a second floor plan including the preset region; Receiving a second instruction to select the test point on the second floor plan to obtain the position information of the test point on the second floor plan; Determining the position information of the test point within the cavity according to the position information of the target region within the cavity, the position information of the preset region on the first floor plan, and the position information of the test point on the second floor plan; Among them, the determination of the position information of the test point within the cavity according to the position information of the target region within the cavity, the position information of the preset region on the first floor plan, and the position information of the test point on the second floor plan includes: Establishing a first coordinate system on the first floor plan to obtain the coordinates of the target region in the first coordinate system; Determining the positional relationship between the preset region and the target region according to the coordinates of the target region in the first coordinate system and the position information of the preset region on the first floor plan; Establishing a second coordinate system on the second floor plan to obtain the coordinates of the preset region in the second coordinate system; Determining the positional relationship between the test point and the preset region according to the coordinates of the preset region in the second coordinate system and the position information of the test point on the second floor plan; Determining the position information of the test point within the cavity according to the position information of the target region within the cavity, the positional relationship between the preset region and the target region, and the positional relationship between the test point and the preset region.

6. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, the steps of the method according to any one of claims 1 to 4 are implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, the steps of the method according to any one of claims 1 to 4 are implemented.

8. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, the steps of the method according to any one of claims 1 to 4 are implemented.

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