Bonding and Transfer Method of Grain Encapsulation

Abstract

The present invention discloses a method for bonding and transferring a grain package body. It provides a grain package body provided with positioning glue, and at the same time provides a vibrating base having an empty groove corresponding to the positioning glue. Through the alignment of the positioning glue and the empty groove, the grain package body can be positioned and accommodated in the vibrating base. Additionally, a target substrate is provided, and the target substrate is bonded to the vibrating base having the grain package body by a metal material. Then, the metal material is melted by a laser process to complete the welding. Finally, the vibrating base is removed and the positioning glue is removed through a glue removal process, thereby completing the bonding and transfer of the grain package body to the target substrate. By adopting such a process method, the present invention can meet the requirements of the industry for rapid mass transfer technology, and at the same time optimize the packaging yield of vertical light-emitting diode grain package bodies.

Description

Technical Field

[0001] The present invention relates to a method for bonding and transferring a vertical light-emitting diode die package, and particularly to a manufacturing method and steps capable of directly performing mass transfer on the die package structure. Background Art

[0002] A light-emitting diode (LED) is a light source made by semiconductor technology. It is formed by a group III-V compound semiconductor. Its light-emitting principle is to emit photons by the combination of electrons and holes in the semiconductor. Different from traditional light bulbs that need to operate at a high temperature of thousands of degrees, nor like fluorescent lamps that need to use high voltage to excite electron beams. Like ordinary electronic components, an LED only needs a voltage of 2 to 4 volts (V) and can operate normally in a general temperature environment. Compared with traditional tungsten filament light bulbs, it has the advantages of long lifespan, energy saving, low failure rate, stable light, high luminous efficiency, and high compatibility with various lamps. Therefore, its luminous lifespan is also longer than that of traditional light sources, and it has become the mainstream product in the current market.

[0003] Generally speaking, the die structure of a light-emitting diode can be divided into the following two types: horizontal structure and vertical structure. Generally speaking, compared with the horizontal light-emitting diode, the die of the vertical light-emitting diode can provide better reliability in terms of structural strength, optoelectronic parameters, thermal characteristics, light decay, and cost, etc., so it is widely used in the industry.

[0004] In recent years, with the progress of technology, these vertical light-emitting diode dies have gradually been mass transferred onto various electronic devices and their substrates. Up to now, several methods for transferring dies onto substrates have been disclosed in the prior art, including: surface mount technology (SMT), wafer-to-wafer transfer technology, and electrostatic transfer technology, etc. Among them, the surface mount technology needs to first encapsulate each die into an SMD (Surface Mount Device) component, and then use a surface mounter (SMT) to use a vacuum suction head to place each SMD component on the circuit board one by one, and then fix it on the substrate through a reflow oven. However, using the surface mount technology can only transfer a single die at a time. When a large amount of mass transfer is required in the industry, it often encounters problems of limited application and insufficient use.

[0005] As for the inter-wafer transfer technology, the native substrate of the die is bonded to the target substrate, and then the native substrate is peeled off to transfer the die to the target substrate. However, this method has strict requirements for the sizes of both the native substrate and the target substrate. At the same time, the pitch between the die settings on the substrate must also be consistent. Due to these requirements and limitations, its application is greatly restricted, so it does not meet the actual application needs. Regarding the electrostatic transfer technology, it is necessary to pick up, transfer, and re-place the die on the target substrate by electrostatic means. However, using this electrostatic transfer method is likely to cause damage to the die structure. At the same time, the contact between "hardware" during the transfer is also likely to cause damage and destruction to the substrate. In addition, it is also limited by the size of the static electrode.

[0006] Furthermore, when the die is transferred to the target substrate, even with well-trained manual operation or precise transfer technology, it is very difficult to achieve complete alignment and precision in the alignment of the die or its die package. In this case, inaccurate die alignment will further affect the difficulty and increase the complexity of the subsequent die fixing operation, and may even increase the cost and working hours of rework.

[0007] In view of this, considering the many problem points listed above, it is extremely necessary to adopt various considerations, so that professionals in this field truly have the need to develop a novel and creative manufacturing method, so as to solve the problems existing in the previously disclosed prior art, so that the efficiency of light-emitting diode dies can be optimized during mass transfer.

[0008] Therefore, the inventors of the present invention are aware of the improvement of the above-mentioned deficiencies, and based on years of relevant experience in this field, they have carefully observed and studied, and combined with the application of theory, and proposed a novel invention that effectively improves the above-mentioned deficiencies. It discloses a novel method for bonding and transferring vertical light-emitting diode dies. Through these innovative die bonding and transfer manufacturing methods, the optimal results and benefits during the mass transfer of die packages can be achieved. The applicant will provide specific architectures and implementation methods and elaborate them below. Summary of the Invention

[0009] In order to solve the above-mentioned many deficiencies, an object of the present invention is to provide an innovative method for bonding and transferring die packages. This bonding and transfer method can be applied to the transfer process of vertical light-emitting diode dies, and can be further widely applied to mass transfer requirements, meeting the technical needs of related industries for rapid and mass transfer.

[0010] By adopting the process steps disclosed in the present invention, it can be applied not only to the mass transfer process of vertical light-emitting diode chips. However, the application of the present invention is of course not limited thereto. The process steps provided by the present invention can also be applied to the mass transfer processes of various other chips. Once the disclosure content of this application is known, other alternative and modified exemplary examples will be obvious to those skilled in the art and all fall within the scope of the invention of the present invention. By adopting the technical solution disclosed in the present invention, the existing process steps and process costs for mass transferring the chip package can be effectively reduced. At the same time, the structure of the light-emitting diode chip package can also be optimized to avoid damaging its structure or generating damage in the structure.

[0011] Another object of the present invention is to provide a manufacturing method suitable for a vertical light-emitting diode chip package. The main design purpose of this manufacturing method is to directly perform alignment, welding on the chip package itself, and transfer the chip package to a target substrate. Among them, based on the present invention, operations can be directly performed on the package structure. When combined with the subsequent process of mass transferring the light-emitting diode chips, the alignment and wire bonding operations that need to be additionally performed in the traditional flip-chip bonding process and steps can be omitted, thereby saving the redundant time-consuming and labor costs, and meeting the rapid mass transfer requirements of the industry.

[0012] According to an embodiment of the present invention, the method for bonding and transferring such a chip package disclosed by the applicant mainly includes the following steps: First, provide a chip package with a positioning glue provided thereon; provide a vibration base with at least one empty slot corresponding to the positioning glue, so that the empty slot can accommodate the positioning glue; then, spray the chip package and vibrate the vibration base, so that the chip package can be positioned and accommodated in the vibration base by the alignment of the positioning glue and the empty slot. On the other hand, the present invention provides a target substrate with a plurality of drilled holes filled with a first metal material, and a second metal material is further coated on the upper surface of these drilled holes. Then, the target substrate is bonded to the vibration base with the chip package through the second metal material. Subsequently, a laser process is performed to melt the second metal material through the laser process to complete the welding of the target substrate and the chip package. Finally, the vibration base is removed, and the positioning glue is removed through a glue removal process to complete the bonding and transfer of the chip package to the target substrate.

[0013] Among them, according to an embodiment of the present invention, the positioning glue used in the present invention preferably has a material that can be selected as a UV-curable water glue. Under this condition, the glue removal process used in the present invention only needs to use deionized water to hydrolyze the UV-curable water glue and thus remove it. In one embodiment, the process time of the glue removal process is, for example, about between 20 and 40 minutes, and the process temperature is about between 60 and 90 degrees Celsius.

[0014] On the other hand, the target substrate used in the present invention preferably has a material that can be selected as a glass substrate. Among them, the diameter of the drilled hole can be, for example, at least 60 micrometers, and the first metal material (which can be, for example, copper) is filled into the drilled hole through a screen printing process or an electroplating process. The second metal material can be, for example, tin, and can be coated on the upper surface of the drilled hole through a screen printing process or a spray printing process. Under this condition, the temperature of the laser process performed in the present invention must reach at least about 240 to 265 degrees Celsius. The laser time for implementing this laser process can be, for example, between 0.3 seconds and 3 seconds to melt the solder (the second metal material), so that the target substrate and the die package are successfully soldered.

[0015] On another aspect, in order to achieve a more precise alignment effect between the positioning glue on the die package and the empty slots in the vibration base, in a preferred embodiment of the present invention, a magnetic material can also be selectively coated on the outer layer of the positioning glue used. At the same time, the empty slot corresponding to the positioning glue is designed as a magnetic cavity with magnetism. With this configuration relationship, the present invention can complete more accurate and precise alignment through the magnetic attraction between the magnetic material and the magnetic cavity. Specifically, in this preferred embodiment, the magnetic material preferably has a material that can be selected as a magnetic powder resin.

[0016] Therefore, according to the process steps and transfer method disclosed in the present invention, when it is designed that there are multiple empty slots in the vibration base, the present invention can successfully complete the bonding of a large number of die packages through the vibration base with these empty slots and transfer them to the target substrate in a large amount at one time. It can be seen from this that the technical solution disclosed in the present invention can successfully meet the current industry's demand for rapid and efficient mass transfer technology. At the same time, it can also optimize the structural yield of the vertical light-emitting diode die package.

[0017] In addition, by adopting the giant transfer method disclosed in the present invention, when applied to the transfer of vertical LED die packages, the vertical LED die can be selected from a group consisting of red, blue and green LED die, but the present invention is not limited to LED die in this wavelength range (red, blue, green). In other embodiments, these vertical LED die can also be made into LED die of other colors or white light (visible light) according to different set wavelength ranges, so as to widely apply the technical solutions disclosed in the present invention.

[0018] It is obvious that when technical personnel in this field understand the technical solution disclosed in the present invention and apply the bonding and transfer method of the grain package disclosed in the present invention, they can successfully eliminate the problems and deficiencies that still exist in the prior art. Therefore, it can be confirmed that the present invention is based on the ability to effectively reduce the excessively high costs and process steps in the existing giant transfer process, so that the present invention is not only highly competitive compared to the existing technology, but can also be effectively and widely used in related industries. At the same time, the present invention can also meet the giant transfer technology needs of the existing industry trends, and can also optimize its process yield, which is enough to show that the present invention is highly industrially applicable and has technical competitiveness in this field. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 FIG. 4 is a flow chart of the steps of a method for bonding and transferring a die package according to an embodiment of the present invention.

[0021] Figure 2 FIG. 4 is a schematic structural diagram of a chip package according to an embodiment of the present invention.

[0022] Figure 3 Based on Figure 2 Schematic diagram of a die package having positioning glue disposed thereon.

[0023] Figure 4 FIG. 4 is a schematic cross-sectional view of a vibration base with an empty slot according to an embodiment of the present invention.

[0024] Figure 5 It is a schematic diagram of a die package being positioned and accommodated in a vibration base according to an embodiment of the present invention.

[0025] Figure 6 Schematic diagram of the structural cross-section of the target substrate used according to an embodiment of the present invention.

[0026] Figure 7 According to an embodiment of the present invention, when the target substrate and the vibrating base with the die package are joined through Figure Two a metal material.

[0027] Figure 8 Schematic diagram after the target substrate and the die package are welded by melting the second metal material through a laser process according to an embodiment of the present invention.

[0028] Figure 9 Schematic diagram after removing the vibrating base and removing the positioning glue through a debonding process to complete the joining of the die package and transfer it to the target substrate according to an embodiment of the present invention.

[0029] Figure 10 Schematic diagram of the structure of the vibrating base with multiple die package alignment points and multiple empty slots used when performing mass transfer of die packages according to another embodiment of the present invention.

[0030] Figure 11 Schematic diagram of making the brightness of multiple die packages uniform by using a roller according to an embodiment of the present invention.

[0031] Wherein, 12, bonding wire; 20, carrier plate; 22R, red light-emitting diode die; 22B, blue light-emitting diode die; 22G, green light-emitting diode die; 24, upper electrode; 26, encapsulant; 33, positioning glue; 44, empty slot; 111, roller; 200, die package; 400, vibrating base; 422, die package alignment point; 600, target substrate; 601, first metal material; 602, second metal material; LS, laser process. Detailed implementation manners

[0032] Embodiments of the present invention will be further explained below in conjunction with relevant drawings. As much as possible, in the drawings and the specification, the same reference numerals represent the same or similar components. In the drawings, for the sake of simplicity and convenience of marking, the shapes and thicknesses may be exaggerated. It can be understood that the components not specifically shown in the drawings or described in the specification are in the forms known to those of ordinary skill in the art. Those of ordinary skill in the art can make various changes and modifications according to the content of the present invention.

[0033] The description of "an embodiment" or "one embodiment" in the following text refers to a specific element, structure, or feature related to at least one embodiment. Therefore, the multiple descriptions of "an embodiment" or "one embodiment" that appear in multiple places in the following text do not refer to the same embodiment. Furthermore, the specific components, structures, and features in one or more embodiments can be combined in a suitable manner.

[0034] The disclosure is specifically described by the following examples, which are only for illustrative purposes, because those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure.

[0035] In the following paragraphs, the present invention will provide a bonding and transfer method for a package structure suitable for vertical light-emitting diode chips. This manufacturing method can be applied to the mass transfer process of existing vertical light-emitting diode chip packages, and directly perform mass transfer on the chip package to optimize its mass transfer efficiency. Furthermore, the package structure of the chip package and its bonding and transfer method provided below can also be applied to other related technical architectures, and the present invention is not limited to the following disclosed embodiments.

[0036] Please refer to Figure 1 as shown, which discloses a flowchart of the steps of the bonding and transfer method of the chip package according to an embodiment of the present invention. According to the manufacturing method disclosed in the present invention, it includes the following steps: Step S102: First, provide a chip package and apply a positioning adhesive on it. Step S104: Then, provide a vibration base, in which at least one empty slot corresponding to the positioning adhesive is formed to accommodate the positioning adhesive through the empty slot. Step S106: Spray the chip package and vibrate the vibration base so that the chip package can be positioned and accommodated in the vibration base by the alignment of the positioning adhesive and the empty slot. Step S108: Next, provide another target substrate, which has a plurality of drilled holes filled with a first metal material, and a second metal material is coated on the upper surface of the drilled holes. Step S110: Bond the target substrate to the vibration base with the chip package through the second metal material. Step S112: Subsequently, perform a laser process to melt the second metal material by the laser process, so as to complete the welding of the target substrate and the chip package. Step S114: Finally, remove the aforementioned vibration base and remove the used positioning adhesive through a debonding process to complete the bonding and transfer of the chip package to the target substrate.

[0037] In order to enable the examiner to better understand the manufacturing method disclosed in the present invention, please refer to the structure and its component symbols shown in the present invention Figures 2 to 10 for the following detailed description. The present invention provides the following detailed description.

[0038] First, please refer to Figure 2 As shown, it discloses a schematic structural diagram of a grain package according to an embodiment of the present invention. According to the embodiment of the present invention, as shown in the figure, this grain package 200 can be, for example, a package structure of a vertical light-emitting diode grain. The vertical light-emitting diode grain can be selected, for example, from the group consisting of red, blue, and green light-emitting diode grains. As shown in the figure, it includes a red light-emitting diode grain 22R, a green light-emitting diode grain 22G, and a blue light-emitting diode grain 22B. The red light-emitting diode grain 22R, the green light-emitting diode grain 22G, and the blue light-emitting diode grain 22B are each wire-bonded to an upper electrode 24 through a bonding wire 12. A carrier plate 20 is used to carry the red light-emitting diode grain 22R, the green light-emitting diode grain 22G, the blue light-emitting diode grain 22B, and the upper electrode 24, and is encapsulated and covered with a packaging adhesive 26 to form the structure of the grain package 200. In one embodiment, the material of the carrier plate 20 can be, for example, a common resin carrier plate, and the packaging adhesive 26 can be, for example, a silicone material or an epoxy resin. Furthermore, in order to increase the contrast, the material of the packaging adhesive 26 can preferably also be a black silicone or epoxy resin. It is particularly worth noting that the vertical light-emitting diode grains cited in the present invention are not limited to being composed of red (R), blue (B), or green (G). In other implementation modes of applying the present invention, non-pure-color light-emitting diode grains can also be included, and the number of red, blue, and green light-emitting diode grains, or their arrangement patterns (such as arranged in an L shape in this embodiment, or can also be arranged in a straight line in other embodiments) are not limited by the exemplary examples cited in the present invention. The inventive concept of the present invention is that the mass transfer can be directly performed on the package structure of the grain package 200 without performing one-by-one or sequential transfer of single grains, and the optimal benefit of mass transfer can be achieved through the technical solution disclosed in the present invention. Therefore, the present invention is not limited by the internal structure or components of the grain package 200.

[0039] After that, after performing spot testing and confirming that the grain package 200 can operate normally, as in the present invention Figure 1 As shown in step S102, a positioning adhesive is provided on the grain package 200 of the present invention. The setting position of the positioning adhesive can be referred to, for example, in the present invention Figure 3 As shown, for example, those skilled in the art can, according to actual needs or design specifications, make the positioning adhesive 33, for example, be formed at the corner of the grain package 200, or other recognizable or asymmetric positions in the grain package 200 (for example: other positions avoiding the center point).

[0040] After that, again as in the present invention Figure 1As shown in step S104, the present invention further provides a vibration base. Please refer to Figure 4 shown, which discloses a cross-sectional schematic diagram of the vibration base 400 of an embodiment of the present invention. At least one cavity 44 corresponding to the aforementioned positioning glue 33 is formed in the vibration base 400. Parameters such as the appearance, size, and shape of the cavity 44 are designed corresponding to the positioning glue 33, so that the cavity 44 can be used to accommodate the aforementioned positioning glue 33.

[0041] After that, as in the present invention Figure 1 As shown in step S106, the present invention then sprays the die encapsulation body 200 and vibrates the vibration base 400, so that the die encapsulation body 200 can be positioned and accommodated in the vibration base 400 by aligning the positioning glue 33 on it with the cavity 44 in the vibration base 400, as shown in the drawings of the present invention Figure 5 drawn. In this illustration, the present invention fills the cavity 44 with a solid pattern to indicate that the positioning glue 33 is filled and aligned in the cavity 44.

[0042] On the other hand, please also refer to Figure 6 shown, which discloses a schematic diagram of the cross-sectional structure of the target substrate used in an embodiment of the present invention. As shown in the figure, a plurality of drill holes are formed in the target substrate 600, and these drill holes are filled with a first metal material 601, and a second metal material 602 is coated on the upper surface of these drill holes. Among them, according to an embodiment of the present invention, the material of the first metal material 601 can be, for example, copper, and through a screen printing process or an electroplating process, the metal copper can be filled in these drill holes. After that, through a screen printing process or a spray printing process, the second metal material 602 can be coated on the upper surface of these drill holes. The material of the second metal material 602 can be, for example, tin. Generally, the material of the target substrate 600 can be selected as a glass substrate, and the aperture of the drill holes provided therein can be, for example, at least 60 microns. However, these parameters are only one embodiment of the present invention, and those with ordinary knowledge in the art can naturally change or modify them according to the requirements of their products or components. However, the present invention is not limited by the parameters exemplified in these illustrative examples.

[0043] Therefore, in step S108, the present invention provides the target substrate 600, and in step S110, the target substrate 600 can be joined to the vibration base 400 having the die encapsulation body 200 through the second metal material 602. For the schematic diagram after the joining is completed, please refer to the drawings of the present invention Figure 7 shown.

[0044] After that, as in Figure 8As shown, the present invention proceeds with a laser process LS, and melts the second metal material 602 through the laser process LS. After the second metal material 602 is melted, the target substrate 600 and the die package 200 can be welded together (step S112). Among them, according to an embodiment of the present invention, the laser process LS performed by the present invention is a process with a heating time capable of reaching an instant high temperature. Generally speaking, according to the common knowledge and experience in the art, the temperature capable of melting solder (the second metal material 602) is approximately between 240 and 265 degrees Celsius. And among them, the laser time for performing the laser process LS can be implemented, for example, between 0.3 seconds and 3 seconds, the purpose of which is to be able to melt the solder (the second metal material 602), so that the target substrate 600 and the die package 200 are welded together.

[0045] After that, after completing the bonding and welding of the target substrate 600 and the die package 200, the present invention then proceeds as shown in step S114 of Figure 1 , and the aforementioned vibration base 400 can be removed, and through a debonding process, the positioning glue 33 on the aforementioned die package 200 can be removed, thereby completing the process of bonding and transferring the die package 200 onto the target substrate 600. The schematic diagram after completion of bonding and transfer is as shown in the accompanying drawings of the present invention Figure 9 shown.

[0046] Moreover, regarding the technical solution disclosed by the present invention, the so-called "debonding process" is mainly determined according to the positioning glue 33 used. According to a preferred embodiment of the present invention, the selected positioning glue 33 is preferably a UV-curable aqueous glue. When using such a UV-curable aqueous glue as the positioning glue on the die package 200, the "debonding process" can be relatively simple. For example, practitioners can directly use deionized water to hydrolyze the UV-curable aqueous glue and thus remove it. Among them, the process time of the debonding process is approximately between 20 and 40 minutes, and the process temperature is approximately between 60 and 90 degrees Celsius. In view of this, even when removing the positioning glue, the present invention does not need to use additional solvents or special debonding equipment, reducing the damage and destruction that these chemical solvents may cause to the structure of the substrate or the die package itself, and at the same time saving the huge cost and cumbersome procedures of additional debonding equipment. Thus, it is obvious that the present invention can easily remove the aforementioned positioning glue under relatively simple conditions without damaging the target substrate or the die package, which is one of the important inventive effects of the present invention.

[0047] Furthermore, in the implementation steps S102 to S106 of the present invention, when using the positioning glue 33 to align with the empty slot 44 of the vibration base 400 so that the die package 200 can be successfully positioned and accommodated in the vibration base 400, the present invention can further coat an outer layer of the positioning glue 33 with a magnetic material. At the same time, the empty slot 44 corresponding to the positioning glue 33 is designed as a magnetic cavity with magnetism. Through such magnetic attraction, the present invention can further make the magnetic material and the magnetic cavity in the vibration base 400 complete the alignment of the die package 200 through magnetic attraction. In an embodiment, the magnetic material coated on the outer layer of the positioning glue 33 of the die package 200 is preferably a kind of magnetic powder resin. Such a magnetic powder resin material can be easily removed together with the positioning glue 33 even during the subsequent glue removal process, without damaging the structure on the surface of the die package.

[0048] Furthermore, according to the die package bonding and transfer method disclosed by the present invention, it can be widely applied to the mass transfer of die packages 200. In this case, a plurality of the above-mentioned empty slots can be configured in the vibration base to accommodate these multiple die packages 200 to be transferred. For example, please refer to Figure 10 As shown in the figure, in this embodiment, a plurality of package alignment points 422 are provided in the vibration base 400. Each package alignment point 422 is used to provide alignment and accommodation for a die package 200. Therefore, an empty slot 44 is configured in each package alignment point 422 to accommodate the positioning glue of the die package 200. Through the alignment configuration relationship between the positioning glue and the empty slot 44, and by applying the process method disclosed above in the present invention, the present invention can make multiple die packages complete bonding and mass transfer to the target substrate through the vibration base 400 having these empty slots 44, meeting the requirements of mass transfer in the industry.

[0049] Also, in order to make the brightness of the die package (such as a vertical light-emitting diode die package) uniform, as shown in the figure of the present invention Figure 11 As shown, these die packages 200 to be transferred can be first placed in a drum 111 and rolled, so that these die packages 200 can be made uniform. After that, they are continuously sprayed onto the vibration base 400 to complete alignment.

[0050] Therefore, in view of the technical solutions provided by the applicant above, it can be clearly seen that the present invention aims to disclose a method for bonding and transferring a die package. Based on the manufacturing method disclosed in the present invention, it can directly transfer the die package. Since the prior art can only transfer the die or wafer itself, it is necessary to package and wire bond each die or wafer after the transfer. The present invention improves these technical deficiencies and can directly transfer the entire die package, greatly reducing the manufacturing cost, complexity, and complexity of the original manufacturing steps.

[0051] In addition, according to the method for bonding and transferring a die package disclosed in the present invention, a large number of die package structures can be sprayed and transferred in a one-time manner, achieving the effect of rapid and massive transfer. This not only effectively meets the requirements of the current technology for rapid and massive transfer of light-emitting diode dies but also effectively enhances the competitiveness of industrial production. In this case, the present invention can not only effectively improve the deficiencies existing in the prior art but also meet the packaging and massive transfer requirements in the case of die size reduction. Moreover, the packaging yield of vertical light-emitting diode dies can be optimized, realizing the extremely significant inventive effect of the present invention.

[0052] In view of this, the method for bonding and transferring a vertical light-emitting diode die package disclosed by the applicant helps to optimize the existing packaging, die bonding, and massive transfer processes. Compared with the prior art, it is obvious that through the disclosed embodiments and manufacturing steps of the present invention, many deficiencies existing in the prior art can be effectively solved, and better manufacturing performance can be provided. Moreover, based on the technical solutions disclosed in the present invention, it can be applied not only to common light-emitting diode dies but also to various electronic circuit components such as related semiconductor industries, integrated circuit industries, or power electronics. It is obvious that the technical solutions requested by the applicant in this case indeed have excellent industrial applicability and competitiveness. At the same time, the technical features, methods, and achieved effects disclosed in the present invention are significantly different from the current solutions and are not easily achievable by those familiar with the technology, so it should meet the patent requirements.

[0053] The above-described embodiments are only used to illustrate the technical ideas and features of the present invention, and their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. It should not be used to limit the patent scope of the present invention. That is, all equivalent changes or modifications made according to the spirit disclosed in the present invention should still be covered by the patent scope of the present invention.

Claims

1. A method for bonding and transferring a die package, characterized in that, comprising: providing a die package with a positioning adhesive disposed thereon; providing a vibrating base having at least one empty slot corresponding to the positioning adhesive, the empty slot being capable of accommodating the positioning adhesive; spraying the die package and vibrating the vibrating base so that the die package is positioned and accommodated in the vibrating base by alignment of the positioning adhesive with the empty slot. Wherein, in the step of disposing the positioning adhesive, it further includes: another magnetic material is coated on the outer layer of the positioning adhesive, and at the same time, the empty slot corresponding to the positioning adhesive is a magnetic cavity with magnetism, so that the magnetic material and the magnetic cavity are further aligned by magnetic attraction; providing a target substrate having a plurality of drilled holes filled with a first metal material, and a second metal material is coated on the upper surface of the drilled holes; bonding the target substrate to the vibrating base having the die package through the second metal material; performing a laser process to melt the second metal material by the laser process so that the target substrate and the die package are welded; and removing the vibrating base and removing the positioning adhesive through a debonding process to complete bonding and transferring the die package to the target substrate.

2. The method for bonding and transferring a die package according to claim 1, characterized in that, the material of the positioning adhesive is a UV-curable aqueous adhesive.

3. The method for bonding and transferring a die package according to claim 2, characterized in that, the debonding process uses deionized water to hydrolyze the UV-curable aqueous adhesive, thereby removing the UV-curable aqueous adhesive.

4. The method for bonding and transferring a die package according to claim 3, characterized in that, the process time of the debonding process is between 20 and 40 minutes.

5. The method for bonding and transferring a die package according to claim 3, characterized in that, the process temperature of the debonding process is between 60 and 90 degrees Celsius.

6. The method for bonding and transferring a die package according to claim 1, characterized in that, the first metal material is copper, and the first metal material can be filled into the drilled holes through a screen printing process or an electroplating process.

7. The method for bonding and transferring a die package according to claim 1, characterized in that, the second metal material is tin, and the second metal material can be coated on the upper surface of the drilled holes through a screen printing process or a spray printing process.

8. The method for bonding and transferring a die package according to claim 1, characterized in that, the material of the target substrate is a glass substrate.

9. The method for bonding and transferring a die package according to claim 1, characterized in that, the aperture of one of the drilled holes is at least 60 microns.

10. The method for bonding and transferring a die package according to claim 1, characterized in that, the magnetic material coated on the outer layer of the positioning adhesive of the die package is a magnetic powder resin.

11. The method for bonding and transferring a die package according to claim 1, characterized in that, A plurality of the empty slots are provided in the vibration base, so that a plurality of the die packages are joined by means of the vibration base having the empty slots and are massively transferred onto the target substrate.

12. The method for bonding and transferring die packages according to claim 11, wherein, in the step of spraying a plurality of the die packages, it further includes: placing a plurality of the die packages in a drum and rolling them, so as to make the die packages uniform.

13. The method for bonding and transferring die packages according to claim 1, wherein, the die package is a package structure of a vertical light-emitting diode die.

14. The method for bonding and transferring die packages according to claim 13, wherein, the vertical light-emitting diode die is selected from the group consisting of red, blue, and green light-emitting diode dies.

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