Embedded component circuit board and manufacturing method thereof and electronic device

Abstract

The present application discloses an embedded component circuit board, a manufacturing method thereof, and an electronic device, wherein the embedded component circuit board includes: a conductive block, the conductive block is provided with at least one blind groove; a heat-conducting material layer, which is arranged on the conductive block, and the heat-conducting material layer is provided with at least one first through groove opposite to the blind groove; a core plate, which is arranged on the heat-conducting material layer, and the core plate is provided with at least one second through groove opposite to the first through groove; an embedded component is arranged in the through first through groove, second through groove and blind groove, and a conductive medium is filled between at least one side of the embedded component and the groove walls of the first through groove, second through groove and blind groove, so that the conductive block is electrically connected to the core plate through the conductive medium. In the above manner, the embedded component circuit board in the present application effectively avoids the use of expensive conductive adhesive film to achieve the heat and electricity conduction requirements between the core plate and the conductive block, thereby reducing the corresponding material usage cost.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to an embedded component circuit board and a manufacturing method and an electronic device thereof. Background Art

[0002] With the rapid development of electronic technology, higher and higher requirements are put forward for the connection between PCB (circuit board) and devices, especially for power amplifier and radio frequency products. The connection between PCB and devices must meet the requirements of heat dissipation and signal grounding. In other words, it is necessary to provide a shorter electrical connection loop for signal layer switching to reduce external radiation. Therefore, under normal circumstances, the surface of the PCB needs to be processed (such as chemical nickel-gold), and then bonded with a conductive adhesive film with thermal conductivity and copper block (copper block has a strong heat dissipation function) to meet the thermal and electrical conductivity requirements of the contact interface.

[0003] However, in order to achieve the interface thermal and electrical conductivity between the PCB and the heat dissipation copper block, the industry currently generally uses conductive adhesive film, and the conductive adhesive is usually mainly composed of a resin matrix, conductive particles, and dispersing additives, auxiliaries, etc., and the filler particles that have both conductive and thermal conductive functions are generally gold, silver, silver-coated copper and other powders. The biggest disadvantage is that the thermal and conductive particles are relatively expensive, and have low heat resistance, chemical resistance and toughness. Summary of the invention

[0004] The present application provides an embedded component circuit board and a manufacturing method and an electronic device thereof, so as to solve the problems in the prior art that the conductive adhesive film used to achieve thermal and conductive connection between the circuit board and the heat dissipation copper block is relatively expensive, has low heat resistance, and has poor chemical resistance and toughness.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide an embedded component circuit board, wherein the embedded component circuit board includes: a conductive block, the conductive block is provided with at least one blind groove; a thermal conductive material layer, which is arranged on the conductive block, and the thermal conductive material layer is provided with at least one first through groove opposite to the blind groove; a core board, which is arranged on the thermal conductive material layer, and the core board is provided with at least one second through groove opposite to the first through groove; an embedded component, which is arranged in the through first through groove, second through groove and blind groove, and a conductive medium is filled between at least one side of the embedded component and the groove walls of the first through groove, the second through groove and the blind groove, so that the conductive block is electrically connected to the core board through the conductive medium.

[0006] Among them, the distance between the inner wall of the first through groove and the outer side of the embedded component is greater than the distance between the inner wall of the second through groove and the outer side of the embedded component, and the conductive medium is also filled into the gap in the first through groove corresponding to the gap between the core plate and the conductive block, and the conductive block is electrically connected to the side surface of the core plate facing the conductive block through the conductive medium.

[0007] The distance between the inner side wall of the first through groove and the outer side surface of the embedded component is 1-20 mm greater than the distance between the inner side wall of the second through groove and the outer side surface of the embedded component.

[0008] A conductive layer is also provided on the inner wall of the second through groove of the core board, the distance between the inner wall of the first through groove and the outer side of the embedded component is equal to the distance between the inner wall of the second through groove and the outer side of the embedded component, and the conductive block is electrically connected to the conductive layer through a conductive medium.

[0009] The embedded component includes an assembly lead, which is attached to the other side of the core board away from the conductive block, so as to realize electrical connection between the embedded component and the core board.

[0010] Wherein, a conductive medium is also filled between the bottom of the embedded component and the bottom of the blind groove.

[0011] Wherein, the thermally conductive material layer is a thermally conductive prepreg.

[0012] The thermal conductive material layer is made of graphene conductive adhesive material, so that the conductive block is electrically connected to the core board through the conductive medium and the thermal conductive material layer.

[0013] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a method for manufacturing an embedded component circuit board, wherein the method for manufacturing the embedded component circuit board includes: providing a conductive block, the conductive block is provided with at least one blind groove; arranging a thermal conductive material layer on the conductive block, the thermal conductive material layer is provided with at least one first through groove opposite to the blind groove; arranging a core board on the thermal conductive material layer, the core board is provided with at least one second through groove opposite to the first through groove; arranging a conductive medium at the bottom of the blind groove; arranging the embedded component through the first through groove, the second through groove and the blind groove on the conductive medium, and making a gap between at least one side of the embedded component and the groove wall of the through first through groove, the second through groove and the blind groove; melting the conductive medium so that the melted conductive medium fills the gap, so that the conductive block is electrically connected to the core board through the conductive medium.

[0014] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide an electronic device, wherein the electronic device includes the embedded component circuit board as described in any of the above items.

[0015] The beneficial effects of the present application are: different from the prior art, the embedded component circuit board in the present application includes: a conductive block, a thermal conductive material layer, a core board and an embedded component; and the conductive block is provided with at least one blind groove, the thermal conductive material layer is provided with at least one first through groove opposite to the blind groove, and the core board is provided with at least one second through groove opposite to the first through groove, the embedded component is arranged in the through first through groove, the second through groove and the blind groove, and a conductive medium is filled between at least one side of the embedded component and the groove walls of the first through groove, the second through groove and the blind groove, so that the conductive block can be electrically connected to the core board through the conductive medium, thereby effectively avoiding the use of expensive conductive adhesive film to achieve the thermal and electrical conductivity requirements between the core board and the conductive block, so as to reduce the material usage cost of producing the embedded component circuit board, and the heat resistance, chemical resistance and toughness of the thermal conductive material layer and the conductive medium are also relatively high. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0017] Figure 1 It is a structural schematic diagram of the first embodiment of the embedded component circuit board of the present application;

[0018] Figure 2 It is a structural schematic diagram of the second embodiment of the embedded component circuit board of the present application;

[0019] Figure 3a It is a flow chart of an embodiment of a method for manufacturing an embedded component circuit board of the present application;

[0020] Figure 3b-3g yes Figure 3a A schematic structural diagram of an implementation method corresponding to S35-S36;

[0021] Figure 4 It is a structural schematic diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0022] In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved more clearly, the technical solutions of the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0023] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0024] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of the first embodiment of the embedded component circuit board of the present application. In this embodiment, the embedded component circuit board 1 includes: a conductive block 11, a thermal conductive material layer 12, a core board 13 and an embedded component 14.

[0025] Among them, the embedded component circuit board 1 specifically refers to an embedded component 14, and the embedded component 14 and the corresponding core board 13 need to both dissipate heat and meet the signal grounding requirements. It can specifically be a power amplifier radio frequency product, or any other reasonable circuit board, and this application does not limit this.

[0026] Specifically, at least one blind groove is provided on the conductive block 11 in the embedded component circuit board 1, and the thermal conductive material layer 12 is further arranged on a side surface of the conductive block 11 corresponding to the opening of the blind groove, and on the thermal conductive material layer 12, at least one first through groove is opened corresponding to the blind groove on each conductive block 11.

[0027] The core plate 13 is further disposed on a side surface of the heat-conducting material layer 12 facing away from the conductive block 11 , and the core plate 13 is provided with at least one second through groove corresponding to each first through groove in the heat-conducting material layer 12 .

[0028] It can be understood that the number of the second through grooves is equal to that of the first through grooves and the blind grooves, and the three are interconnected. The core board 13 can specifically include at least one layer of sub-bodies, or at least two layers of sub-bodies, and at least two layers of sub-bodies are provided with through grooves at the same position, i.e., second through grooves, and each of the sub-bodies can be a copper-clad plate or other material that can be used to manufacture circuit boards, and a semi-cured sheet can be stacked between each two adjacent sub-bodies. It can be seen that the core board 13 can be specifically used to implement the circuit design logic of the embedded component circuit board 1 to achieve the corresponding electrical connection.

[0029] Furthermore, the embedded component 14 is arranged in the through first through slot, second through slot and blind slot, that is, the thickness of the embedded component 14 is greater than the sum of the thickness of the first through slot and the second through slot, and can pass through the first through slot and the second through slot and be attached to the bottom of the blind slot. At least one side of the embedded component 14 is spaced from the slot walls of the first through slot, the second through slot and the blind slot, and there is a gap, and the gap is filled with a conductive medium 15, so that the conductive block 11 can be electrically connected to the core board 13 through the conductive medium 15. That is, the core board 13 is electrically connected to the conductive block 11, so that the core board 13 and the embedded component 14 can be grounded through the conductive block 11 signal.

[0030] Optionally, the conductive block 11 is any reasonable metal block such as a copper block or a silver block that can achieve both heat dissipation and conduction, and the present application does not limit this.

[0031] Optionally, the thermally conductive material layer 12 is a low-flow and insulating thermally conductive semi-cured sheet, so that it can dissipate heat from the core plate 13 by being laminated between the core plate 13 and the conductive block 11. In other embodiments, the thermally conductive material layer 12 can also be made of a material that is both thermally conductive and has a certain conductive function, such as a graphene conductive adhesive material, and while dissipating heat from the core plate 13, it can also compensate and enhance the electrical connection between the core plate 13 and the conductive block 11 achieved by the conductive medium 15, so that the conductive block 11 can be electrically connected to the core plate 13 through the conductive medium 15 and the thermally conductive material layer 12.

[0032] Optionally, the conductive medium 15 can specifically be a metal block that can be melted to fill the gap between the embedded component 14 and the first through groove, the second through groove and the blind groove, and then solidified, such as a tin metal sheet or any other reasonable medium with conductive properties, and the present application does not limit this.

[0033] It can be seen that compared with laminating the conductive adhesive film between the core board 13 and the conductive block 11 to achieve the bonding, thermal conductivity and electrical conductivity between the core board 13 and the conductive block 11. Obviously, the use of the thermal conductive material layer 12 to achieve the bonding and thermal conductivity between the core board 13 and the conductive block 11, and the use of the conductive medium 15 to achieve the electrical conductivity between the core board 13 and the conductive block 11, the corresponding implementation cost is lower, and the material usage cost of manufacturing the embedded component circuit board 1 can be effectively reduced. The heat resistance, chemical resistance and toughness of the thermal conductive material layer 12 and the conductive medium 15 are also relatively high.

[0034] The distance between the inner wall of the first through-slot in the thermally conductive material layer 12 and the outer side of the embedded component 14 is greater than the distance between the inner wall of the second through-slot in the core plate 13 and the outer side of the embedded component 14, that is, the cross-sectional dimension of the second through-slot is greater than the cross-sectional dimension of the first through-slot. The partial structure on the side of the core plate 13 facing the conductive block 11 also has a gap with the conductive block 11, and the conductive layer of the core plate 13 is exposed through the partial structure, and the gap, that is, the gap in the first through-slot corresponding to the gap between the core plate 13 and the conductive block 11, is also filled with a conductive medium 15, so that the conductive block 11 can be electrically connected to the partial structure on the side of the core plate 13 facing the conductive block 11 through the conductive medium 15, and thus achieve electrical connection with the core plate 13.

[0035] Optionally, the distance between the inner wall of the first through slot and the outer side of the embedded component 14 is 1-20 mm greater than the distance between the inner wall of the second through slot and the outer side of the embedded component 14 , so as to effectively achieve electrical connection between the core board 13 and the conductive block 11 .

[0036] The embedded component 14 further includes an assembly lead 141 , and the assembly lead 141 is attached to the other side of the core board 13 away from the conductive block 11 , so as to realize electrical connection between the embedded component 14 and the core board 13 .

[0037] It is understandable that the depth of the blind groove in the conductive block 11 is specifically determined by the thickness of the embedded component 14 protruding from the first through groove and the second through groove after passing through the first through groove and the second through groove, so that when the embedded component 14 abuts against the bottom of the blind groove, the distance between its assembly lead 141 and the other side of the core board 13 away from the conductive block 11 can be as short as possible, and it can be directly attached to the other side of the core board 13 to ensure a shorter routing distance and better electrical connection performance. Among them, the assembly lead 141 specifically refers to the welding pin on the embedded component 14. In other embodiments, when the thickness of the embedded component 14 is equal to the sum of the depths of the first through groove and the second through groove, the blind groove may not be formed in the conductive block 11, and the bottom of the embedded component 14 may directly abut against one side of the conductive block 11.

[0038] Optionally, a conductive medium 15 is also filled between the bottom of the embedded component 14 and the bottom of the blind groove, and the conductive medium 15 can be a metal block stacked between the bottom of the embedded component 14 and the bottom of the blind groove, for example, a tin metal sheet is melted and filled into the gap between the embedded component 14 and the through first through groove, the second through groove and the blind groove, and then solidified. In other embodiments, the conductive medium 15 can also only fill the gap between the side wall of the embedded component 14 and the through first through groove, the second through groove and the blind groove, which is not limited in this application.

[0039] See also Figure 2 , Figure 2 Schematic diagram of the structure of the second embodiment of the embedded component circuit board of the present application. Figure 1 The difference between the first embodiment of the embedded component circuit board provided in the present application is that a conductive layer 26 is further provided on the inner side wall of the second through groove of the core board 23 in the embedded component circuit board 2 .

[0040] Furthermore, the distance between the inner side wall of the first through-groove in the thermally conductive material layer 22 in the embedded component circuit board 2 and the outer side surface of the embedded component 24 is equal to the distance between the inner side wall of the second through-groove in the core board 23 and the outer side surface of the embedded component 24, so that the conductive block 21 can be electrically connected to the conductive layer 26 via the conductive medium 25 to achieve electrical connection with the core board 23.

[0041] In other embodiments, the distance between the inner wall of the first through groove in the thermally conductive material layer 22 and the outer side of the embedded component 24 may also be greater than the distance between the inner wall of the second through groove in the core board 23 and the outer side of the embedded component 24, so that the conductive block 21 can be electrically connected to the core board 23 through the conductive layer 26 and the conductive medium 25 filled in the first through groove corresponding to the gap between the core board 13 and the conductive block 11.

[0042] Based on the general inventive concept, the present application also provides a method for manufacturing an embedded component circuit board, please refer to Figure 3a-3g ,in, Figure 3a It is a flow chart of the first embodiment of the method for manufacturing an embedded component circuit board of the present application. Figure 3b-3g yes Figure 3a The structural diagram of an implementation method corresponding to S35-S36 in FIG. 1 includes the following steps:

[0043] S31: Provide a conductive block, wherein the conductive block is provided with at least one blind groove.

[0044] Specifically, Figure 3b As shown, a conductive block 31 is provided, and at least one blind groove 311 is formed on the conductive block 31 , that is, the depth of the blind groove 311 is less than the thickness of the conductive block 31 .

[0045] Optionally, the conductive block 31 is any reasonable metal block such as a copper block or a silver block that can achieve both heat dissipation and conduction, and the present application does not limit this.

[0046] For the convenience of explanation, in this embodiment, one blind slot 311 is provided in the conductive block 31 for explanation. In other embodiments, the blind slot 311 may be provided with only 2, 3, 5 or any other reasonable number of blind slots 311, and this application does not limit this.

[0047] S32: a heat-conducting material layer is provided on the conductive block, and at least one first through groove is provided on the heat-conducting material layer opposite to the blind groove.

[0048] Furthermore, if Figure 3c As shown, a thermal conductive material layer 32 is attached to one side of the conductive block 31 corresponding to the opening of the blind slot 311 , and at least one first through slot 321 is opened on the thermal conductive material layer 32 corresponding to the blind slot 311 on each conductive block 31 .

[0049] Optionally, the thermally conductive material layer 32 is a low-flow and insulating thermally conductive prepreg, so that it can dissipate heat from the core board 33 by being laminated between the core board 33 and the conductive block 31. In other embodiments, the thermally conductive material layer 32 can also be made of a material that has both thermal conductivity and certain electrical conductivity, such as graphene conductive adhesive material, etc., which is not limited in the present application.

[0050] S33: a core plate is arranged on the heat-conducting material layer, wherein the core plate is provided with at least one second through groove facing the first through groove.

[0051] Furthermore, if Figure 3d As shown, a core plate 33 is attached to the side of the heat conductive material layer 32 facing away from the conductive block 31 , and the core plate 33 is provided with at least one second through groove 331 corresponding to each first through groove 321 in the heat conductive material layer 32 .

[0052] It is understandable that the number of the second through slots 331, the first through slots 321 and the blind slots 311 are equal to each other, and the three are interconnected. The core board 33 may specifically include at least one layer of sub-bodies, or may include at least two layers of sub-bodies, and at least two layers of sub-bodies are provided with through slots at the same position, i.e., the second through slots 331, and each of the sub-bodies may be a copper-clad plate or other material that can be used to manufacture circuit boards, and a semi-cured sheet may be stacked between each two adjacent sub-bodies. It can be seen that the core board 33 can be specifically used to implement the circuit design logic of the embedded component circuit board to achieve the corresponding electrical connection.

[0053] S34: A conductive medium is provided at the bottom of the blind groove.

[0054] Specifically, Figure 3e As shown, a conductive medium 34 is disposed at the bottom of each blind groove 311 in the conductive block 31 .

[0055] Optionally, the conductive medium 34 is a metal block, such as a tin metal sheet or any other reasonable medium with conductive properties, which is not limited in the present application.

[0056] S35: placing an embedded component through the first through slot, the second through slot and the blind slot on the conductive medium, and allowing a gap to exist between at least one side of the embedded component and the slot walls of the first through slot, the second through slot and the blind slot.

[0057] Furthermore, if Figure 3f As shown, an embedded component 35 is passed through the first through slot 321, the second through slot 331 and the blind slot 311 and attached to the conductive medium 34, that is, the thickness of the embedded component 35 is greater than the sum of the thickness of the first through slot 321 and the second through slot 331, and can pass through the first through slot 321 and the second through slot 331 and be attached to the conductive medium 34. At least one side of the embedded component 35 is spaced from the slot walls of the first through slot 321, the second through slot 331 and the blind slot 311, and there is a gap.

[0058] S36: Melting the conductive medium so that the melted conductive medium fills the gap, thereby electrically connecting the conductive block to the core board through the conductive medium.

[0059] Furthermore, if Figure 3g As shown, the conductive medium 34 is melted, for example, placed in an oven to heat and melt the conductive medium 34, so that the melted conductive medium 34 fills the gap formed between the embedded component 35 and the first through groove 321, the second through groove 331 and the blind groove 311, so that the conductive block 31 can be electrically connected to the core board 33 through the conductive medium 34.

[0060] It can be seen that compared with laminating the conductive adhesive film between the core board 33 and the conductive block 31 to achieve the bonding, heat conduction and electrical conductivity between the core board 33 and the conductive block 31. Obviously, the use of the thermal conductive material layer 32 to achieve the bonding and heat conduction between the core board 33 and the conductive block 31, and the use of the conductive medium 34 to achieve the electrical conductivity between the core board 33 and the conductive block 31, the corresponding implementation cost is lower, and it can effectively reduce the material cost of manufacturing the embedded component circuit board, and the heat resistance, chemical resistance and toughness of the thermal conductive material layer 32 and the conductive medium 34 are also relatively high.

[0061] In one embodiment, the distance between the inner wall of the first through-slot 321 in the thermally conductive material layer 32 and the outer side of the embedded component 35 is greater than the distance between the inner wall of the second through-slot 331 in the core plate 33 and the outer side of the embedded component 35, that is, the cross-sectional dimension of the second through-slot 331 is greater than the cross-sectional dimension of the first through-slot 321. A gap is also formed between the partial structure of the side of the core plate 33 facing the conductive block 31 and the conductive block 31, and the conductive layer of the core plate 33 is exposed through the partial structure, and the gap, that is, the gap in the first through-slot 321 corresponding to the gap between the core plate 33 and the conductive block 31, is also filled with a conductive medium 34, so that the conductive block 31 can be electrically connected to the partial structure of the side of the core plate 33 facing the conductive block 31 through the conductive medium 34, and thus achieve electrical connection with the core plate 33.

[0062] Optionally, the distance between the inner wall of the first through slot 321 and the outer side of the embedded component 35 is 1-20 mm greater than the distance between the inner wall of the second through slot 331 and the outer side of the embedded component 35 to effectively achieve electrical connection between the core board 33 and the conductive block 31 .

[0063] In one embodiment, the embedded component 35 further includes an assembly lead, and the assembly lead is attached to the other side of the core board 33 away from the conductive block 31 , so as to achieve electrical connection between the embedded component 35 and the core board 33 .

[0064] It is understandable that the depth of the blind groove 311 in the conductive block 31 is specifically determined by the thickness of the embedded component 35 protruding from the first through groove 321 and the second through groove 331 after passing through the first through groove 321 and the second through groove 331, so that when the embedded component 35 abuts against the bottom of the blind groove 311, the distance between its assembly lead and the other side of the core board 33 away from the conductive block 31 can be as short as possible, and it can be directly attached to the other side of the core board 33 to ensure a shorter routing distance and better electrical connection performance. The assembly lead specifically refers to the welding pin on the embedded component 35. In other embodiments, when the thickness of the embedded component 35 is equal to the sum of the depths of the first through groove 321 and the second through groove 331, the blind groove 311 may not be formed in the conductive block 31, and the bottom of the embedded component 35 may directly abut against one side of the conductive block 31.

[0065] Based on the general inventive concept, the present application also provides an electronic device, see Figure 4 , Figure 4 1 is a schematic diagram of the structure of an embodiment of the electronic device of the present application. The electronic device 41 includes an embedded component circuit board 411, and the embedded component circuit board 411 is the embedded component circuit board 1 or the embedded component circuit board 2 as described above, which will not be described in detail here.

[0066] Different from the prior art, the embedded component circuit board in the present application includes: a conductive block, a thermal conductive material layer, a core board and an embedded component; wherein the conductive block is provided with at least one blind groove, the thermal conductive material layer is provided with at least one first through groove opposite to the blind groove, and the core board is provided with at least one second through groove opposite to the first through groove, the embedded component is arranged in the through first through groove, the second through groove and the blind groove, and a conductive medium is filled between at least one side of the embedded component and the groove walls of the first through groove, the second through groove and the blind groove, so that the conductive block can be electrically connected to the core board through the conductive medium, thereby effectively avoiding the use of expensive conductive adhesive film to achieve the thermal and electrical conductivity requirements between the core board and the conductive block, so as to reduce the material usage cost of producing the embedded component circuit board, and the heat resistance, chemical resistance and toughness of the thermal conductive material layer and the conductive medium are also relatively high.

[0067] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board with embedded components, It is characterized in that The embedded component circuit board comprises: A conductive block, wherein the conductive block is provided with at least one blind slot; A heat-conducting material layer is arranged on the conductive block, and the heat-conducting material layer is provided with at least one first through groove facing the blind groove; wherein the heat-conducting material layer is a heat-conducting prepreg or is made of a graphene conductive adhesive material; A core plate is arranged on the thermal conductive material layer, and the core plate is provided with at least one second through groove facing the first through groove; An embedded component is disposed in the first through slot, the second through slot and the blind slot, and a conductive medium is filled between at least one side of the embedded component and the slot walls of the first through slot, the second through slot and the blind slot; wherein the conductive medium is a metal block; Among them, the distance between the inner wall of the first through-groove and the outer side of the embedded component is greater than the distance between the inner wall of the second through-groove and the outer side of the embedded component, and the conductive medium is also filled into the gap in the first through-groove corresponding to the gap between the core board and the conductive block, and the conductive block is electrically connected to the side surface of the core board facing the conductive block through the conductive medium, so that the core board and the embedded component are signal-grounded through the conductive block.

2. The embedded component circuit board according to claim 1, It is characterized in that The distance between the inner side wall of the first through-groove and the outer side surface of the embedded component is 1-20 mm greater than the distance between the inner side wall of the second through-groove and the outer side surface of the embedded component.

3. The embedded component circuit board according to claim 1, It is characterized in that A conductive layer is also provided on the inner side wall of the second through groove of the core board, the distance between the inner side wall of the first through groove and the outer side surface of the embedded component is equal to the distance between the inner side wall of the second through groove and the outer side surface of the embedded component, and the conductive block is electrically connected to the conductive layer through the conductive medium.

4. The embedded component circuit board according to claim 1, It is characterized in that The embedded component includes an assembly lead, and the assembly lead is attached to the other side of the core board away from the conductive block, so that the embedded component is electrically connected to the core board.

5. The embedded component circuit board according to claim 1, It is characterized in that The conductive medium is also filled between the bottom of the embedded component and the bottom of the blind groove.

6. A method for manufacturing an embedded component circuit board, It is characterized in that The method for manufacturing the embedded component circuit board comprises: Providing a conductive block, wherein the conductive block is provided with at least one blind groove; A heat-conducting material layer is arranged on the conductive block, and the heat-conducting material layer is provided with at least one first through groove facing the blind groove; wherein the heat-conducting material layer is a heat-conducting prepreg or is made of a graphene conductive adhesive material; A core plate is arranged on the thermal conductive material layer, and the core plate is provided with at least one second through groove facing the first through groove; A conductive medium is arranged at the bottom of the blind groove; wherein the conductive medium is a metal block; An embedded component is disposed on the conductive medium through the first through-slot, the second through-slot and the blind slot, and a gap is formed between at least one side of the embedded component and the slot walls of the first through-slot, the second through-slot and the blind slot; wherein the distance between the inner side wall of the first through-slot and the outer side surface of the embedded component is greater than the distance between the inner side wall of the second through-slot and the outer side surface of the embedded component; The conductive medium is melted to fill the gap with the melted conductive medium, so that the conductive block is electrically connected to a side surface of the core board facing the conductive block through the conductive medium, and the core board and the embedded component are signal-grounded through the conductive block.

7. An electronic device, comprising the embedded component circuit board according to any one of claims 1 to 5.

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