Electroplating tank and electroplating production line having the same

Abstract

The present invention provides an electroplating tank and an electroplating production line having the same, belonging to the field of electroplating technology, wherein the electroplating tank comprises: a tank body, which has an electroplating channel for passing the product to be electroplated, and the bottom of the tank body has a liquid inlet for replenishing the liquid; a pressure plate, which is arranged above the front end of the electroplating channel, and has a liquid containing cavity inside the pressure plate, and the liquid containing cavity is suitable for being connected with a liquid supply source, and the lower surface of the pressure plate has a plurality of liquid outlets; in the electroplating tank of the present invention, before the product to be electroplated enters the electroplating channel, the pressure plate arranged above the product to be electroplated releases a large amount of liquid flow toward the upper surface of the product to be electroplated, and the liquid flow produces a downward pressure effect on the product to be electroplated, so as to offset the impact of the lower liquid on the product to be electroplated, and prevent the product to be electroplated from bulging upward and rubbing against the upper wall of the electroplating channel.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, and in particular to an electroplating tank and an electroplating production line having the same. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis.

[0003] The electroplating tank is a device used for electroplating. In the prior art electroplating tanks used for electroplating thin film products, replenishing liquid is generally injected from the bottom to ensure the concentration of the electrolyte in the electroplating tank.

[0004] However, when using the existing electroplating tank, during the process of replenishing the electrolyte, the replenished liquid easily impacts the product to be electroplated upward, causing the product to arch upward and rub against the anode box, causing damage to the product. Summary of the invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect in the prior art that the electroplating tank easily arches the product to be electroplated when replenishing the electrolyte, thereby providing an electroplating tank and an electroplating production line having the electroplating tank.

[0006] In order to solve the above technical problems, the present invention provides an electroplating tank, comprising:

[0007] A tank body, the interior of which has a plating channel for passing the product to be electroplated, and the bottom of the tank body has a liquid inlet for replenishing the liquid;

[0008] A pressing plate is arranged above the front end of the electroplating channel. The pressing plate has a liquid containing cavity therein. The liquid containing cavity is suitable for being connected to a liquid supply source. The lower surface of the pressing plate has a plurality of liquid outlet holes.

[0009] Optionally, the accommodating cavity in the pressure plate is divided into two layers, an upper layer and a lower layer, by a horizontal partition plate in the middle, and the horizontal partition plate has a through hole for passing liquid.

[0010] Optionally, the through hole and the liquid outlet hole are arranged in a staggered manner.

[0011] Optionally, a delivery port for communicating with a liquid supply source is provided on the upper surface of the pressure plate, and the through hole is arranged in a avoidance manner at a position on the horizontal partition plate directly opposite to the delivery port.

[0012] Optionally, the number of rows of the through holes is less than the number of rows of the liquid outlet holes.

[0013] Optionally, the through holes have two rows, and the liquid outlet holes have three rows.

[0014] Optionally, it further includes: a supporting roller, which is arranged below the electroplating channel opposite to the liquid outlet hole of the pressing plate.

[0015] Optionally, a buffer cover is provided above the liquid inlet, and the buffer cover extends to the outside of the product to be electroplated in a transverse direction perpendicular to the moving direction of the product to be electroplated, and the ends of the two extended ends of the buffer cover have openings.

[0016] Optionally, the buffer cover has vertical partitions arranged at intervals, and the vertical partitions are provided with a plurality of through holes.

[0017] The present invention provides an electroplating production line, comprising: an electroplating tank as described in any one of the above schemes.

[0018] The technical solution of the present invention has the following advantages:

[0019] 1. In the electroplating tank provided by the present invention, before the product to be electroplated enters the electroplating channel, a pressure plate is arranged above the product to be electroplated, which releases a large amount of liquid flow toward the upper surface of the product to be electroplated. The liquid flow produces a downward pressure effect on the product to be electroplated to offset the impact of the lower liquid on the product to be electroplated, thereby preventing the product to be electroplated from bulging upward and rubbing against the upper wall of the electroplating channel.

[0020] 2. The electroplating tank provided by the present invention supports the bottom of the product to be electroplated before entering the electroplating channel through the support roller, thereby preventing the liquid flow of the pressure plate from exerting excessive downward pressure on the product to be electroplated, and ensuring that the product to be electroplated can smoothly enter the electroplating channel.

[0021] 3. The electroplating tank provided by the present invention is provided with a buffer cover on the liquid medicine inlet, so as to prevent the liquid medicine from directly impacting upward from the liquid medicine inlet onto the product to be electroplated in the electroplating tank, thereby reducing the upward arch formed on the product to be electroplated.

[0022] 4. The electroplating production line provided by the present invention has any of the above advantages because it adopts the electroplating tank described in any of the above schemes. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A three-dimensional diagram of the internal structure of an implementation manner of an electroplating tank provided in an embodiment of the present invention;

[0025] Figure 2 for Figure 1 The upper perspective view of the middle pressure plate;

[0026] Figure 3 for Figure 2 Exploded diagram of

[0027] Figure 4 for Figure 1 A three-dimensional view of the medium pressure plate;

[0028] Figure 5 for Figure 4 Exploded diagram of

[0029] Figure 6 for Figure 1 A side view of the internal structure of the medium plating tank;

[0030] Figure 7 for Figure 6 A magnified image of area A;

[0031] Figure 8 The bottom surface of the electroplating tank is a three-dimensional diagram of the internal structure;

[0032] Fig. 9 for Figure 8 A side cross-sectional view of

[0033] Fig.10 for Fig. 9 A three-dimensional image of a buffer cover area.

[0034] Description of reference numerals:

[0035] 1. Tank body; 2. Plating channel; 3. Liquid inlet; 4. Press plate; 5. Liquid outlet; 6. Horizontal partition; 7. Through hole; 8. Delivery port; 9. Support roller; 10. Buffer cover; 11. Opening; 12. Vertical partition; 13. Through hole; 14. Product to be electroplated. DETAILED DESCRIPTION

[0036] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0040] like Figure 1 , Figure 2 As shown, a specific implementation of an electroplating tank provided in this embodiment includes: a tank body 1, wherein the tank body 1 has an electroplating channel 2 for passing the product to be electroplated, and the bottom of the tank body 1 has a liquid inlet 3 for replenishing the liquid; a pressing plate 4 is arranged above the front end of the electroplating channel 2, wherein the pressing plate 4 has a liquid containing cavity, and the liquid containing cavity is suitable for communicating with a liquid supply source, and the lower surface of the pressing plate 4 has a plurality of liquid outlet holes 5. Specifically, the liquid outlet holes 5 are distributed along the width direction of the tank body 1, so as to cover the width of the entire product 14 to be electroplated.

[0041] In the electroplating tank provided in the present embodiment, before the product to be plated enters the electroplating channel 2, a pressure plate 4 is arranged above the product to be plated, which releases a large amount of liquid flow toward the upper surface of the product to be plated. The liquid flow exerts a downward pressure on the product to be plated to offset the impact of the liquid below on the product to be plated, thereby preventing the product to be plated from bulging upward and rubbing against the upper wall of the electroplating channel 2.

[0042] like Figure 3As shown, in the electroplating tank provided in this embodiment, the middle of the accommodating cavity in the pressing plate 4 is arranged into two layers, upper and lower, by a horizontal partition 6, and the horizontal partition 6 has a through hole 7 for passing liquid. By arranging the accommodating cavity in the pressing plate 4 into multiple layers, the impact of the liquid introduced from the liquid supply source can be reduced, and the stability of the liquid sprayed from the accommodating cavity can be improved, thereby stably pressing down the electroplated product. Furthermore, the through hole 7 and the liquid outlet hole 5 are arranged in a staggered manner, thereby further reducing the flow rate of the liquid in the accommodating cavity and improving stability.

[0043] like Figure 3 As shown, in the electroplating tank provided in this embodiment, the number of rows of the through holes 7 is less than the number of rows of the liquid outlet holes 5, so as to gradually slow down the flow rate of the liquid in the accommodating chamber. Specifically, the through holes 7 have two rows, and the liquid outlet holes 5 have three rows. In addition, as an alternative embodiment, the through holes 7 can also be arranged in three rows, and the liquid outlet holes 5 can be arranged in four rows, etc.

[0044] like Figure 4 , Figure 5 As shown, in the electroplating tank provided in this embodiment, the upper surface of the pressing plate 4 is provided with a delivery port 8 for communicating with a liquid supply source, and the through hole 7 is arranged on the horizontal partition 6 at a position directly opposite to the delivery port 8. Through this arrangement, the liquid entering the receiving chamber through the delivery port 8 is prevented from directly entering the second layer, thereby reducing the flow rate of the liquid in the receiving chamber and improving the stability of control.

[0045] like Figure 6 , Figure 7 As shown, the electroplating tank provided in this embodiment further includes: a support roller 9, and the support roller 9 is arranged below the electroplating channel 2 opposite to the liquid outlet 5 of the pressing plate 4. The support roller 9 supports the bottom of the product to be electroplated before entering the electroplating channel 2, thereby preventing the liquid flow of the pressing plate 4 from generating excessive downward pressure on the product to be electroplated, and ensuring that the product to be electroplated can smoothly enter the electroplating channel 2.

[0046] like Figure 8 , Fig. 9 As shown, in the electroplating tank provided by this embodiment, the liquid inlet 3 extends to the outside of the product to be electroplated along a horizontal direction perpendicular to the moving direction of the product to be electroplated, and the ends of the two extended ends of the buffer cover 10 have openings 11. The liquid replenished from the liquid inlet 3 first enters the buffer cover 10 for buffering, and then enters the tank body 1 through the openings 11 at both ends. Through this arrangement, the buffer cover 10 can pass the liquid to both sides of the product to be electroplated, thereby reducing the impact of the replenished liquid on the product to be electroplated 14. Fig.10As shown, in the electroplating tank provided in this embodiment, the buffer cover 10 has a plurality of vertical partitions 12 arranged at intervals, and the vertical partitions 12 are provided with a plurality of through holes 13. Through the arrangement of the vertical partitions 12 and the through holes 13 on the vertical partitions 12, the replenished liquid medicine passes through the through holes 13 on the plurality of vertical partitions 12 in sequence, thereby further reducing the flow rate of the liquid medicine and reducing the impact on the electroplated product 14.

[0047] In addition, this embodiment also provides an electroplating production line, including: at least one electroplating tank as described in the above embodiment, when in operation, the product 14 to be electroplated passes through each of the electroplating tanks in turn for electroplating.

[0048] Obviously, the above embodiments are merely examples for clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the present invention.

Claims

1. An electroplating tank, characterized in that: include: A tank body (1) has an electroplating channel (2) for passing a product to be electroplated, the bottom of the tank body (1) has a liquid inlet (3) for replenishing liquid medicine, a buffer cover (10) is provided above the liquid inlet (3), the buffer cover (10) extends to the outside of the product to be electroplated in a lateral direction perpendicular to the moving direction of the product to be electroplated, and the ends of the two extended ends of the buffer cover (10) have openings; A pressure plate (4) is arranged above the front end of the electroplating channel (2). The pressure plate (4) has a liquid containing cavity therein. The liquid containing cavity is suitable for being connected to a liquid supply source. The lower surface of the pressure plate (4) has a plurality of liquid outlet holes (5).

2. The electroplating tank according to claim 1, characterized in that: The middle of the accommodating cavity in the pressure plate (4) is arranged into two layers, upper and lower, by a horizontal partition (6), and the horizontal partition (6) has a through hole (7) for passing liquid.

3. The electroplating tank according to claim 2, characterized in that: The through hole (7) and the liquid outlet hole (5) are arranged in a staggered manner.

4. The electroplating tank according to claim 2, characterized in that: The upper surface of the pressure plate (4) is provided with a delivery port (8) for communicating with a liquid supply source, and the through hole (7) is arranged on the horizontal partition (6) at a position directly opposite to the delivery port (8).

5. The electroplating tank according to claim 2, characterized in that: The number of rows of the through holes (7) is less than the number of rows of the liquid outlet holes (5).

6. The electroplating tank according to claim 5, characterized in that: The through holes (7) have two rows, and the liquid outlet holes (5) have three rows.

7. The electroplating tank according to claim 1, characterized in that: Also includes: A support roller (9) is arranged below the electroplating channel (2) opposite to the liquid outlet hole (5) of the pressing plate (4).

8. The electroplating tank according to any one of claims 1 to 7, characterized in that: The buffer cover (10) has vertical partitions (12) arranged at intervals therein, and the vertical partitions (12) are provided with a plurality of through holes (13).

9. An electroplating production line, characterized in that: include: The electroplating tank according to any one of claims 1 to 8.

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