Transfer device and its manufacturing method, detection method and detection device

Abstract

The present invention relates to a transfer device and a manufacturing method, a detection method and a detection device thereof. The transfer device comprises a transfer head. A colloidal crystal layer is formed on a protrusion of the transfer head. The Bragg reflection effect of the colloidal crystal microsphere structure can present characteristics of different light colors. Whether the protrusion is abnormal is determined based on the light reflected by the colloidal crystal layer on each protrusion, thereby realizing the detection of whether abnormal protrusions appear on the transfer head.

Description

Technical Field

[0001] The present invention relates to the field of chip transfer, and in particular to a transfer device and a manufacturing method thereof, a detection method and a detection device. Background Art

[0002] Micro LED is sought after by various manufacturers due to its advantages such as high brightness, wide color gamut coverage and high contrast ratio. It is called the next-generation display device and its popularity has continued to rise in recent years; however, there are still many problems to be overcome in the actual production process. For example, the Micro LED display panel includes several pixel areas. In some application scenarios, each pixel area includes a red LED chip, a blue LED chip, and a green LED chip. In the production process of the Micro LED display panel, a transfer head is required to transfer the red, green and blue LED chips from their respective growth substrates to the display backplane and electrically connect them to the corresponding pads on the display backplane through a bonding process. The current bonding process generally requires heating (mostly above 150°C) to achieve the connection between the LED chip and the display backplane through a simple metal solder.

[0003] PDMS (Polydimethylsiloxane) transfer head is an important medium for realizing Micro-LED transfer, which is divided into flat transfer head and raised transfer head. At present, the transfer head is made by high-precision template method. The raised transfer head prepared by this method is completely supported by PDMS glue. The PDMS material itself is thermoplastic. It has to withstand certain temperature and pressure in actual use, which often causes the raised transfer head to deform due to heat and extrusion. Since the most critical factor of the raised transfer head is the flatness between the raised protrusions, TTV (highest point height-lowest point height) is required to be less than 2um, that is, the height difference between each protrusion is required to be less than 2um. The protrusion of the raised transfer head is prone to irreversible deformation or damage during the cyclic reciprocating heat and pressure process. In this application, the irreversible deformation or damage is referred to as abnormal protrusion. The generation of abnormal protrusions will cause TTV changes, resulting in the inability of the raised transfer head to be used in the process. However, there is currently no effective means to detect whether abnormal protrusions appear on the raised transfer head.

[0004] Therefore, how to detect whether abnormal protrusions appear on the protruding transfer head is an urgent problem to be solved. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a transfer device and a manufacturing method, a detection method and a detection device thereof, aiming to solve the problem in the related art of how to detect whether an abnormal protrusion appears on a protruding transfer head.

[0006] The present application provides a transfer device, comprising a transfer head and a colloidal crystal layer arranged on the transfer head, wherein the transfer head comprises:

[0007] A substrate, and at least one protrusion disposed on the back side of the substrate, the protrusion being used to adhere to the chip to be transferred so as to pick up and transfer the chip to be transferred;

[0008] The colloidal crystal layer is formed on the protrusion, at least partially covering the side of the protrusion that is in contact with the chip to be transferred, and the colloidal crystal layer includes orderly arranged colloidal crystal microspheres.

[0009] The above-mentioned transfer device includes a protrusion-type transfer head with at least one protrusion formed on a substrate, and a colloidal crystal layer is formed on the protrusion of the protrusion-type transfer head, and the colloidal crystal layer includes orderly arranged colloidal crystal microspheres, and at least partially covers the side of the protrusion that is in contact with the chip to be transferred; the Bragg reflection effect based on the colloidal crystal microsphere structure can present characteristics of different light colors, so whether the protrusion is abnormal can be determined based on the light reflected by the Bragg reflection effect of the colloidal crystal layer on each protrusion, thereby realizing the detection of whether there is an abnormal protrusion on the protrusion-type transfer head, avoiding the transfer head with abnormal protrusions from continuing to be used, resulting in chip transfer failure or unqualified transfer.

[0010] Based on the same inventive concept, the present application also provides a method for manufacturing a transfer device, which is used to manufacture the transfer device as described above, comprising:

[0011] Making a transfer head mold, the transfer head mold comprising a template substrate main body, a transfer head pattern formed on the template substrate main body, the transfer head pattern comprising a groove forming the protrusion;

[0012] forming the colloidal crystal layer at least at the bottom of the groove;

[0013] Filling a preset material on the transfer head pattern and performing a curing process to obtain the transfer head;

[0014] The transfer head mold is removed, and the colloidal crystal layer remains on the transfer head.

[0015] In the transfer device manufactured by the above-mentioned transfer device manufacturing method, a colloidal crystal layer is formed on the side of the protrusion of the transfer head that is in contact with the chip to be transferred. The colloidal crystal layer includes colloidal crystal microspheres arranged in an orderly manner. The Bragg reflection effect of the colloidal crystal microsphere structure can present characteristics of different light colors. Whether the protrusion is abnormal can be determined based on the light reflected by the Bragg reflection effect of the colloidal crystal layer on each protrusion, thereby realizing the detection of whether abnormal protrusions appear on the transfer head.

[0016] Based on the same inventive concept, the present application also provides a method for manufacturing a transfer device, which is used to manufacture the transfer device as described above, comprising:

[0017] Making the transfer head;

[0018] The colloidal crystal layer is formed on the protrusions.

[0019] In the transfer device manufactured by the above-mentioned transfer device manufacturing method, a colloidal crystal layer is also formed on the side of the protrusion of the transfer head that is in contact with the chip to be transferred. Therefore, it is also possible to determine whether the protrusion is abnormal based on the light reflected by the Bragg reflection of the colloidal crystal layer on the protrusion, thereby realizing the detection of whether an abnormal protrusion appears on the transfer head.

[0020] Based on the same inventive concept, the present application also provides a detection method of the transfer device as described above, comprising:

[0021] Placing the transfer device under a preset light environment, with the colloidal crystal layer on the protrusion facing the light incident direction;

[0022] The light reflected by the colloidal crystal layer on the protrusion is detected, and whether the protrusion is abnormal is determined according to the detection result.

[0023] In the above detection method, the transfer device is placed in a preset light environment, and the side of the protrusion of the transfer head that is in contact with the chip to be transferred faces the light incident direction, so that the colloidal crystal layer formed on the protrusion faces the light incident direction. Therefore, whether the protrusion is abnormal can be determined based on the detection result of the light reflected by the colloidal crystal layer on the protrusion, thereby realizing the detection of whether an abnormal protrusion appears on the transfer head.

[0024] Based on the same inventive concept, the present application also provides a detection device for a transfer device, comprising:

[0025] The light detection device is used to detect the light reflected by the colloidal crystal layer on the protrusion when the transfer device is placed in a preset light environment and the colloidal crystal layer on the protrusion faces the light incident direction, and determine whether the protrusion is abnormal based on the detection result.

[0026] The above-mentioned light detection equipment, when the transfer device is placed in a preset light environment, and the side of the protrusion of the transfer head that is in contact with the chip to be transferred is facing the light incident direction, so that the colloidal crystal layer formed on the protrusion is facing the light incident direction, can determine whether the protrusion is abnormal based on the detection result of the light reflected by the colloidal crystal layer on the detection protrusion, thereby realizing the detection of whether an abnormal protrusion appears on the transfer head. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1-1 It is a schematic diagram of a transfer head in the related art;

[0028] Figure 1-2 for Figure 1-1 Schematic diagram of the state of the middle transfer head after use;

[0029] Figure 2 A schematic diagram of the structure of the transfer head device provided in the embodiment of the present application;

[0030] Figure 3 A schematic diagram of orderly arrangement of colloidal crystal microspheres provided in an embodiment of the present application;

[0031] Figure 4 Schematic diagram of the transfer head device structure provided in the embodiment of the present application Figure 2 ;

[0032] Figure 5 Schematic diagram of the transfer head device structure provided in the embodiment of the present application Figure 3 ;

[0033] Figure 6 Schematic diagram of the transfer head device structure provided in the embodiment of the present application Figure 4 ;

[0034] Figure 7 A schematic diagram of a method for manufacturing a transfer head device provided in another optional embodiment of the present application;

[0035] Figure 8 A schematic diagram of a process for forming an alternating crystal layer provided for another optional embodiment of the present application;

[0036] Fig. 9 A schematic diagram of a transfer head device manufacturing process provided in another optional embodiment of the present application;

[0037] Figure 10-1 A schematic diagram of a method for manufacturing a transfer head device provided in yet another optional embodiment of the present application;

[0038] Figure 10-2 A schematic diagram of a transfer head device manufacturing process provided in another optional embodiment of the present application;

[0039] Fig.11 A schematic diagram of a process of forming an alternating crystal layer provided for another optional embodiment of the present application;

[0040] Fig.12 A schematic diagram of a detection method for a transfer head device provided in another optional embodiment of the present application;

[0041] Fig.13 A schematic diagram of a hybrid energy band structure provided for another optional embodiment of the present application;

[0042] Figure 14-1 A schematic diagram of the structure of a transfer device without abnormal protrusions provided in another optional embodiment of the present application;

[0043] Figure 14-2 A schematic diagram of a light reflection area of ​​a transfer device structure without abnormal protrusions provided in another optional embodiment of the present application;

[0044] Figure 14-3 A schematic diagram of the structure of a transfer device with an abnormal protrusion provided in another optional embodiment of the present application;

[0045] Figure 14-4 A schematic diagram of a light reflection area of ​​a transfer device structure with an abnormal protrusion provided in another optional embodiment of the present application;

[0046] Fig.15 A schematic diagram of the structure of another detection device of the transferable device of the present application;

[0047] Description of reference numerals:

[0048] 1, 13-protrusions, 11-support substrate, 12-carrying substrate, 121-substrate material, 131-protrusion material, 14-colloidal crystal layer, 141-microsphere mixed liquid, 15-template substrate body, 151-groove, 61-light detection device, 611-wavelength acquisition device, 612-analysis device. DETAILED DESCRIPTION

[0049] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0051] In the related art, the protrusion of the protruding transfer head is prone to irreversible deformation or damage during the cyclic reciprocating heat and pressure process, thus becoming an abnormal protrusion. The generation of abnormal protrusions will cause TTV changes, resulting in the protruding transfer head being unable to be used in the process. For example, see Figure 1-1 The transfer head shown in the figure has a plurality of protrusions 1 for picking up the chips to be transferred. In the process of picking up and transferring the chips to be transferred, the protrusions 1 are prone to irreversible deformation or damage during the repeated heating and pressure process, thus becoming abnormal protrusions. For example, see Figure 1-2As shown, the protrusion A1 is partially missing, the protrusion A2 is tilted, and the protrusion A3 is deformed by pressure. These three protrusions are abnormal protrusions. When the transfer head with abnormal protrusions is used continuously, it is easy to cause chip transfer failure or transfer failure. However, there is currently no effective means to detect whether there are abnormal protrusions on the protrusion transfer head.

[0052] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0053] This embodiment provides a transfer device, which includes a transfer head and a colloidal crystal layer, wherein the transfer head includes:

[0054] A substrate having a front side and a back side relative to each other; the transfer head further comprises at least one protrusion arranged on the back side of the substrate, the protrusion being used to adhere to the chip to be transferred so as to pick up and transfer the chip to be transferred; the substrate in this embodiment may include but is not limited to a carrier substrate, the protrusion of the transfer head being arranged on the back side of the carrier substrate; in some examples, the substrate may also include a supporting substrate adhered to the front side of the carrier substrate, or at least partially embedded in the carrier substrate, the supporting substrate may be but is not limited to a quartz substrate, a sapphire substrate, a glass substrate or a metal substrate.

[0055] The chip to be transferred in this embodiment may include but is not limited to an LED chip, and the LED chip may be but is not limited to a micro light-emitting chip. The micro light-emitting chip in this embodiment refers to a um-level light-emitting chip, for example, it may include but is not limited to at least one of a Mini LED chip and a Micro LED chip. Of course, the micro light-emitting chip may also be replaced with a chip of other sizes according to demand, which will not be described here; and the chip in this embodiment is not limited to a light-emitting chip, and may also be replaced with other chips equivalent to the light-emitting chip according to demand.

[0056] In this embodiment, the number of protrusions provided on the back of the substrate can be flexibly set, and can be set to one protrusion according to application requirements, or can be set to two or more protrusions according to requirements, and the spacing between the protrusions can be flexibly set according to specific application requirements, for example, it can be set according to but not limited to the corresponding pad layout in the chip bonding area of ​​the circuit backplane. The circuit backplane in this embodiment may include but is not limited to a display backplane and a lighting backplane.

[0057] In this embodiment, the colloidal crystal layer of the transfer device is formed on the protrusion of the transfer head, at least partially covering the side of the protrusion that is in contact with the chip to be transferred, and the colloidal crystal layer includes colloidal crystal microspheres arranged in an orderly manner. The Bragg reflection effect based on the colloidal crystal microsphere structure can present the characteristics of different light colors, so it is possible to determine whether the protrusion is abnormal based on the light reflected by the Bragg reflection effect of the colloidal crystal layer on each protrusion (for example, it can be based on but not limited to the color or wavelength of the reflected light), thereby realizing the detection of whether an abnormal protrusion appears on the protruding transfer head, and avoiding the transfer head with abnormal protrusions from being used continuously, resulting in chip transfer failure or unqualified transfer.

[0058] It should be understood that the colloidal crystal layer in this embodiment may cover the entire side of the protrusion of the transfer head that is in contact with the chip to be transferred, or may only cover a portion of it. Figure 2 As shown, the transfer head includes a substrate, which includes a carrier substrate 12 and a support substrate 11 disposed on the carrier substrate 12, and a plurality of protrusions 13 formed on the back of the support substrate 11. The transfer device also includes a colloidal crystal layer 14 covering the entire side of the protrusion 13 of the transfer head that is in contact with the chip to be transferred. An example of the orderly arranged colloidal crystal microspheres included in the colloidal crystal layer 14 is shown in Figure 3 shown.

[0059] In one example of this embodiment, Figure 3 The colloidal crystal microspheres shown may be but are not limited to nano-scale colloidal crystal microspheres, for example, the particle size of the colloidal crystal microspheres may be greater than or equal to 173 nanometers and less than or equal to 190 nanometers; for example, in some application scenarios, the particle size of the colloidal crystal microspheres may be but are not limited to 173 nanometers, 175 nanometers, 180 nanometers, 189 nanometers or 190 nanometers. It should be understood that in some application examples, Figure 3 The particle sizes of the colloidal crystal microspheres shown may be the same, or some of the colloidal crystal microspheres may have different particle sizes. Of course, in some application scenarios of this embodiment, the particle size of the colloidal crystal microspheres may also be micrometer-level or smaller than nanometer-level.

[0060] For another example of this embodiment, see Figure 4 As shown, the transfer device shown in this figure is Figure 2 Compared with the transfer device shown in the figure, the main difference is that the colloidal crystal layer 14 partially covers the side of the protrusion 13 of the transfer head that is in contact with the chip to be transferred.

[0061] Another example of this embodiment is shown in Figure 5 As shown, the transfer device shown in this figure is Figure 2Compared with the transfer device shown in the figure, the main difference is that the colloidal crystal layer 14 not only covers the entire side of the protrusion 13 of the transfer head that is in contact with the chip to be transferred, but also covers the side of the protrusion 13. The colloidal crystal layer 14 can cover the entire side of the protrusion 13, or only partially cover the side of the protrusion 13.

[0062] For another example of this embodiment, see Figure 6 As shown, the transfer device shown in this figure is Figure 2 Compared with the transfer device shown in the figure, the main difference is that the colloidal crystal layer 14 not only covers the side of the protrusion 13 of the transfer head that is in contact with the chip to be transferred, but also covers the side of the protrusion 13 and the back of the carrier substrate 12. The colloidal crystal layer 14 can cover the side of the protrusion 13 in its entirety or only partially cover the side of the protrusion 13; similarly, the colloidal crystal layer 14 can cover the back of the carrier substrate 12 in its entirety or only partially cover the back of the carrier substrate 12.

[0063] According to the above examples, it can be seen that in this embodiment, the area covered by the colloidal crystal layer 14 at least partially covers the side where the protrusion 13 is bonded to the chip to be transferred, and the colloidal crystal layer 14 satisfies the Bragg reflection effect. The specific area covered by the colloidal crystal layer 14 can be flexibly set and is not limited to the coverage areas shown in the above examples.

[0064] Similarly, in the present embodiment, the material of the colloidal crystal microspheres included in the colloidal crystal layer 14 can also be flexibly selected under the condition of satisfying the Bragg reflection effect. For example, the colloidal crystal microspheres include but are not limited to at least one of silicon dioxide Sio2 microspheres and polymer material microspheres, wherein the polymer material microspheres may include but are not limited to polystyrene microspheres, polyacrylic acid microspheres and at least one of the nano-scale microspheres copolymerized by a plurality of monomers. It should be understood that in some examples of the present embodiment, the colloidal crystal microspheres included in the colloidal crystal layer 14 may be colloidal crystal microspheres of a material, such as Sio2 microspheres, polystyrene microspheres, polyacrylic acid microspheres and one of the nano-scale microspheres copolymerized by a plurality of monomers. Of course, the colloidal crystal microspheres included in the colloidal crystal layer 14 may also include colloidal crystal microspheres of a plurality of materials, such as at least two of Sio2 microspheres, polystyrene microspheres, polyacrylic acid microspheres and nano-scale microspheres copolymerized by a plurality of monomers.

[0065] In some examples of this embodiment, the colloidal crystal layer disposed on the protrusion may also include: a preset material for forming the protrusion filled in the gaps between the colloidal crystal microspheres of the colloidal crystal layer. In some examples of this embodiment, the colloidal crystal microspheres may occupy 74% of the space of the colloidal crystal layer, and the remaining 26% of the space is occupied by the preset material for forming the protrusion. Of course, the space ratio occupied by the colloidal crystal microspheres and the preset material for forming the protrusion can be flexibly set according to application requirements; the preset material for forming the protrusion is filled in the gaps between the colloidal crystal microspheres, which can ensure that after the colloidal crystal layer is formed on the protrusion, it can still form a reliable bond with the chip to be transferred, so as to pick up and transfer the chip to be transferred.

[0066] In the present embodiment, the above protrusions can be formed by direct contact with the chip to be transferred, but not limited to, to form adhesion, and the chip to be transferred is separated from the chip on the temporary substrate or the growth substrate by the adhesion force, and transferred to the circuit backplane. At this time, the selection of the preset material for forming the protrusion can meet the adhesion between the protrusion and the chip to be transferred, which is greater than the bonding force between the chip to be transferred and the temporary substrate or the growth substrate to achieve the pickup of the chip, and is less than the bonding force between the chip to be transferred and the circuit backplane or other circuit board after the chip to be transferred is transferred to the circuit backplane or other circuit board and the bonding is completed, so as to complete the release of the chip to be transferred. For example, in one example, the material of the protrusion can include but is not limited to PDMS, and of course it can also be replaced by other materials that meet the above conditions. In this example, the material of the carrier substrate can be the same as the protrusion, and the protrusion can be formed in an integrated manner with the carrier substrate, or it can be formed in an integrated manner without being formed. Of course, in other examples, the material of the protrusion can also be different from the material of the carrier substrate.

[0067] In some other examples of this embodiment, the spaces between the colloidal crystal microspheres of the colloidal crystal layer disposed on the protrusions may not include the preset material for forming the protrusions, and the spaces may remain empty.

[0068] The transfer device provided in this embodiment includes a protrusion-type transfer head having at least one protrusion formed on a substrate, and a colloidal crystal layer is formed on the protrusion of the protrusion-type transfer head, the colloidal crystal layer includes colloidal crystal microspheres arranged in an orderly manner, and at least partially covers the side of the protrusion that is in contact with the chip to be transferred; the Bragg reflection effect based on the colloidal crystal microsphere structure can present characteristics of different light colors, so whether the protrusion is abnormal can be determined based on the light reflected by the Bragg reflection effect of the colloidal crystal layer on each protrusion, thereby realizing the detection of whether there is an abnormal protrusion on the protrusion-type transfer head, avoiding the transfer head with abnormal protrusions from being continued to be used, resulting in chip transfer failure or unqualified transfer, and is more conducive to improving the yield rate of lighting products or display products and reducing costs.

[0069] Another optional embodiment:

[0070] For ease of understanding, this embodiment provides an exemplary method for manufacturing a transfer device, which is used to manufacture the transfer device shown above. In this embodiment, a colloidal crystal layer can be formed on the protrusion of the transfer head during the process of manufacturing the transfer head. The manufacturing process is shown in Figure 7 As shown, it includes but is not limited to:

[0071] S701: Making a transfer head mold.

[0072] The transfer head mold prepared in this step includes a template substrate body, a transfer head pattern formed on the template substrate body, and the transfer head pattern includes a groove corresponding to the protrusion formed on the transfer head. The template substrate body in this embodiment can be, but not limited to, a silicon substrate body, and can also be replaced by other materials. And the transfer head pattern can be formed by, but not limited to, etching and other methods.

[0073] S702: forming a colloidal crystal layer at least at the bottom of the groove of the transfer head pattern.

[0074] It should be understood that when the colloidal crystal layer is formed at the bottom of the groove, the formed colloidal crystal layer can completely cover the bottom of the groove to form Figure 2 The colloidal crystal layer 14 shown may also cover a portion of the bottom of the groove to form Figure 4 The colloidal crystal layer 14 is shown. Of course, the colloidal crystal layer can also cover the sidewalls of the groove to form Figure 5 The colloidal crystal layer 14 shown can also cover the side wall of the groove and the side of the template substrate body that forms the transfer head pattern to form a Figure 6 A colloidal crystal layer 14 is shown.

[0075] In this embodiment, the colloidal crystal layer is formed at least at the bottom of the groove. Figure 8 As shown, it may include but is not limited to:

[0076] S801: Mixing colloidal crystal microspheres in a volatile solvent to obtain a microsphere mixed solution.

[0077] Select matching colloidal crystal microspheres and disperse them in a volatile solvent to obtain a microsphere mixed solution. The selected volatile solvent has no effect on the preset material for forming the protrusion. For example, when the preset material is a PDMS material, the selected volatile solvent may be, but is not limited to, an oil-type solvent. For example, an inert solvent (oil phase solvent non-aqueous phase) such as isopropanol that is rapidly volatile and has no effect on the PDMS material, disperse the colloidal crystal microspheres (such as SiO2 microspheres) in an inert solvent such as isopropanol that is rapidly volatile and has no effect on the PDMS material to obtain a microsphere mixed solution.

[0078] S802: Coat the microsphere mixture at least on the bottom of the groove.

[0079] After coating the microsphere mixture at least on the bottom of the groove, the colloidal crystal microspheres self-assemble by gravity to form a similar Figure 3 The three-dimensional ordered cubic or faceted cubic structure shown.

[0080] In some examples of this embodiment, it can be evenly coated on the bottom of the groove by, but not limited to, inkjet printing technology or spraying technology.

[0081] S703: Filling the transfer head pattern with a preset material and performing a curing process to obtain a transfer head.

[0082] In this embodiment, after the transfer head pattern is filled with the preset material, a portion of the preset material is filled into the gaps between the colloidal crystal microspheres.

[0083] For example, in some examples, the transfer head pattern may be filled with a preset material to form the transfer head by, but not limited to, molding, spraying, spin coating, etc. In this example, the protrusions may be made of PDMS material, which can be used to bond the chip, and has a stronger adhesiveness than the bonding adhesive on the temporary substrate, but weaker than the welding force of the metal solder after welding, and the PDMS material in this embodiment may be a UV-curable silicone material; the thermal curing shrinkage of the UV-curable silicone material is low, and the array structure after actual curing is best matched with the actual design, which can further improve the yield rate of the protrusions.

[0084] S704: The transfer head mold is removed, and the colloidal crystal layer remains on the transfer head, thereby obtaining a transfer device.

[0085] In order to facilitate further understanding, this embodiment is combined with Figure 7 The specific manufacturing process of a transfer device shown is described as an example, see Fig. 9 As shown, it includes but is not limited to:

[0086] S901: After cleaning the template substrate main body 15, a transfer head pattern is formed on the template substrate main body 15. The transfer head pattern includes a groove 151 for forming a protrusion.

[0087] S902: coating the microsphere mixture 141 at least on the bottom of the groove of the transfer head pattern.

[0088] S903: After the volatile solvent evaporates, the colloidal crystal microspheres self-assemble to form a colloidal crystal layer 14 by gravity.

[0089] S904: Filling the transfer head pattern with a preset material and performing a curing process to obtain a transfer head.

[0090] In this embodiment, after the transfer head pattern is filled with the preset material, a portion of the preset material is filled into the gaps between the colloidal crystal microspheres. Fig. 9 As shown, the filled preset material includes a substrate material 121 for forming a carrier substrate and a protrusion material 131 for forming protrusions.

[0091] S905: attaching the support substrate 11 to the filled preset material, and curing the preset material to obtain a transfer head.

[0092] S906: removing the transfer head mold, and the colloidal crystal layer 14 remains on the transfer head, thereby obtaining a transfer device.

[0093] The transfer device prepared by the above method has a colloidal crystal layer formed on the protrusion of the transfer device. The Bragg reflection effect of the colloidal crystal microsphere structure can present the characteristics of different light colors. Therefore, it is possible to determine whether the protrusion is abnormal based on the light reflected by the Bragg reflection effect of the colloidal crystal layer on each protrusion, thereby realizing the detection of whether abnormal protrusions appear on the protrusion transfer head, thereby avoiding various problems caused by the continued use of the transfer head with abnormal protrusions. In this embodiment, after the transfer device is prepared, the transfer device can be used to pick up and transfer the chip to be transferred, and then the transfer head of the transfer device can be detected.

[0094] Yet another optional embodiment:

[0095] For ease of understanding, this embodiment provides another exemplary method for making a transfer device, which is used to make the transfer device shown above. In this embodiment, after the transfer head is made, a colloidal crystal layer can be formed on the protrusion of the transfer head. The production process can be referred to Figure 10-1 As shown, it includes but is not limited to:

[0096] S1001: Make the transfer head.

[0097] In one example, the method for making the transfer head may be but is not limited to the above Fig. 9 The method shown is different in that S902 and S903 are omitted.

[0098] S1003: forming a colloidal crystal layer on the protrusions of the transfer head.

[0099] For example, in one example, the process of forming a colloidal crystal layer on the protrusions is shown in Fig.11 As shown, it may include but is not limited to:

[0100] S1101: Mixing colloidal crystal microspheres in a volatile solvent to obtain a microsphere mixed solution.

[0101] This step may adopt but is not limited to the step shown in S801 above, which will not be described in detail here.

[0102] S1102: coating the microsphere mixture on at least one side of the protrusion that is in contact with the chip to be transferred. As the volatile solvent evaporates, the colloidal crystal microspheres self-assemble under gravity to form a colloidal crystal layer.

[0103] The area on the protrusion where the microsphere mixture is coated can be flexibly selected according to the needs, for example, Figure 2 , Figure 4-Figure 6 The colloidal crystal layer shown in FIG. 1 is coated with a microsphere mixture on a corresponding area on the transfer head, which will not be described in detail here.

[0104] In some examples of this embodiment, after the transfer head is manufactured in the above S1001 and before the colloidal crystal layer is formed on the protrusion, the following steps may also be included:

[0105] The chip to be transferred is transferred using the prepared transfer head, so that the colloidal crystal layer can be directly made on the used transfer head, and the light reflected by the Bragg reflection of the colloidal crystal layer is used to determine whether the protrusion is abnormal, thereby realizing the detection of whether abnormal protrusions appear on the protruding transfer head.

[0106] In order to facilitate further understanding, this embodiment is combined with Figure 10-1 The specific manufacturing process of a transfer device shown is described as an example, see Figure 10-2 As shown, it includes but is not limited to:

[0107] S1002: coating the microsphere mixture 141 on the protrusion 13 of the manufactured transfer head.

[0108] S1004: After the volatile solvent evaporates, the colloidal crystal microspheres self-assemble on the protrusions 13 to form a colloidal crystal layer 14 through gravity.

[0109] Another optional embodiment:

[0110] This embodiment provides a detection method for detecting the transfer device shown in the above embodiments. Fig.12 As shown, it includes but is not limited to:

[0111] S1201: placing the transfer device under a preset light environment, with the colloidal crystal layer disposed on the protrusion of the transfer device facing (ie, facing) the light incident direction, so that light can be incident on the colloidal crystal layer.

[0112] In this embodiment, the preset light environment in S1201 may be a preset natural light environment or a preset light source illumination environment; as long as the light incident on the colloidal crystal layer on the protrusions meets the detection conditions.

[0113] S1202: Detect the light reflected by the colloidal crystal layer on the protrusion, and determine whether the protrusion is abnormal based on the detection result.

[0114] For ease of understanding, this example uses the Bragg reflection principle to illustrate the following, as shown in the following Bragg formula (i.e., the following formula (1)):

[0115]

[0116] In the above formula (1), k is a coefficient, D is the particle size of the colloidal crystal microsphere, n is the refractive index of the colloidal crystal microsphere, and θ is the light incident angle. Therefore, when the material of the colloidal crystal microsphere is selected, its refractive index n can be determined. For a protrusion that does not have an abnormality, its normal light incident angle θ can be obtained under a preset light environment; then a preset standard color can be selected to determine its wavelength. For example, when blue is selected, the wavelength λ of blue can be determined; then the above parameters are substituted into the above formula (1) to obtain the value of the particle size D of the crystal microsphere. Then, when forming a colloidal crystal layer, the material and particle size of the colloidal crystal microsphere determined above can be used to form a colloidal crystal layer. In this way, when the transfer head is under the same detection environment, for a protrusion that does not have an abnormality on the transfer head, the color of the light reflected from the colloidal crystal layer on the protrusion is the same as the preset standard color or the difference is within the preset standard range; while the color of the light reflected from the colloidal crystal layer on the abnormal protrusion with an abnormality is the same as the preset standard color, or is not within the preset standard range.

[0117] Therefore, in an example of this embodiment, detecting the light reflected by the colloidal crystal layer on the protrusion in S1202 and determining whether the protrusion is abnormal according to the detection result may include:

[0118] Observe the actual color of the light reflected by the colloidal crystal layer on the protrusion, and determine whether the protrusion is abnormal based on the difference between the observed actual color and the preset standard color. The observation in this embodiment can be directly visually observed by humans, and the detection method is simple and effective.

[0119] For example, in one example, the colloidal crystal microspheres are Sio2 microspheres, and n is a constant value. The particle size of the corresponding Sio2 microspheres is between 173 nanometers and 190 nanometers. At this time, the wavelength of the light reflected by the colloidal crystal layer is in the band of 420 nanometers to 460 nanometers, and it will appear blue. Therefore, in some examples, Sio2 microspheres with a particle size between 173 nanometers and 190 nanometers can be selected to form a colloidal crystal layer, and the preset standard color is set to blue. Then, by observing whether the actual color of the light reflected by the colloidal crystal layer on the protrusion is blue, if not, it can be determined whether the protrusion is abnormal.

[0120] See also Fig.13 For ease of understanding, this embodiment is described below in conjunction with Fig.13 The schematic diagram of the hybrid energy band structure shown is used to verify this.

[0121] Fig.13 In the figure, the area shown in B represents the incomplete band gap of the colloidal crystal template with face-centered cubic structure in the Γ-L region, and the corresponding wavelength range is calculated according to the formula: λ=α / ω, where λ refers to the wavelength, α refers to the normalized constant of the colloidal crystal, and ω is the normalized frequency of the colloidal crystal. Through software simulation, it can be known that: taking the SiO2 colloidal crystal with a face-centered cubic structure of 189nm as an example, its normalized frequency range is 0.62 to 0.66. Through calculation, the reflection wavelength range is 436 nanometers to 465 nanometers, and the wavelength of blue light of 457 nanometers is within its theoretical reflection range, so it can be verified from both theoretical calculation and model simulation that the above detection method in this embodiment is feasible and accurate.

[0122] Based on the above principle, after testing, for a specific single blue light wavelength, the particle size of the Sio2 microspheres is selected to be 189nm, and the blue wavelength is 457nm; therefore, in some examples, the particle size of the Sio2 microspheres can be selected to form a colloidal crystal layer, and the preset standard color is blue. It should be understood that based on the above principle, the preset standard color can be adjusted by flexibly adjusting at least one of the material and particle size of the colloidal crystal microspheres, and it is not limited to the corresponding relationship between the Sio2 material and particle size and the blue wavelength in the above example.

[0123] In another example of this embodiment, detecting the light reflected by the colloidal crystal layer on the protrusion in S1202 and determining whether the protrusion is abnormal according to the detection result may further include:

[0124] Obtain the actual wavelength λ1 of the light reflected by the colloidal crystal layer on the protrusion;

[0125] According to λ1, the actual light incident angle θ1 of the protrusion is calculated by the following formula (2);

[0126]

[0127] In the above formula (2), k is a coefficient, D is the particle size of the colloidal crystal microspheres, and n is the refractive index of the colloidal crystal microspheres.

[0128] According to the difference between the actual light incident angle θ1 and the preset standard light incident angle θ0, it is determined whether the protrusion is abnormal. The standard light incident angle θ0 in this embodiment is the incident angle of light obtained under the above detection environment when the protrusion is not abnormal. Therefore, according to the difference between the actual light incident angle θ1 and the preset standard light incident angle θ0, it can be determined whether the corresponding protrusion is squeezed, deformed, missing, or tilted; and according to the specific difference between the two, it can also be determined to characterize the deformation amount of the corresponding protrusion.

[0129] It can be seen that through the detection method provided by this embodiment, when the protrusion on the transfer head is deformed under pressure, it cannot be restored. According to the Bragg formula, its deformation causes its actual light incident angle to change, that is, θ in formula (1) changes. When D and n are determined, λ changes, so the color of the light reflected by the colloidal crystal layer changes, thereby showing the color difference; and in some examples, the color of the light reflected by the colloidal crystal layer on the protrusion is different under different extrusion conditions. Through statistics, the specific extrusion situation can be further determined according to the corresponding light color, such as the color corresponding to different deformation amounts. Therefore, during the detection, the use status of the protrusion can be intuitively judged according to the color of the light reflected by the colloidal crystal layer on each protrusion; the test is simple, efficient, low-cost, and high-accuracy.

[0130] For ease of understanding, the following Figure 14-1 to Figure 14-4 An example is shown for illustration.

[0131] See also Figure 14-1 to Figure 14-2 As shown, in Figure 14-1 In the state shown, each protrusion 13 on the transfer head is in a normal state, and under a preset light environment, the reflected light area 51 of the colloidal crystal layer on the protrusion is blue.

[0132] See also Figure 14-3 As shown, Figure 14-1 After the transfer device in the figure was used for a period of time, the protrusions C1, C2 and C3 became abnormal, and the protrusion C4 was a normal protrusion. Under the same test environment, see Figure 14-4 As shown, the reflected light areas corresponding to the protrusions C1, C2 and C3 are no longer blue. Therefore, according to the color of the reflected light area corresponding to the protrusion, it can be intuitively determined whether the protrusion has become an abnormal protrusion during use.

[0133] This embodiment also provides a detection device for detecting the transfer device shown in the above embodiments, see Fig.15 As shown, it includes but is not limited to:

[0134] The light detection device 61 is used to detect the light reflected by the colloidal crystal layer on the protrusion when the transfer device is placed in a preset light environment and the side of the protrusion that is in contact with the chip to be transferred faces the light incident direction, and determine whether the protrusion is abnormal based on the detection result. The detection process can refer to but is not limited to the above example, and will not be repeated here.

[0135] In some other examples of this embodiment, the detection device may also include a conveying device for conveying the transfer device to be detected to a preset light environment, or a light source device for generating a corresponding light source, etc.

[0136] See also Fig.15As shown, in some examples of this embodiment, the light detection device 61 may include but is not limited to:

[0137] A wavelength collection device 611 is used to collect the actual wavelength λ1 of the light reflected by the colloidal crystal layer on the protrusion; the wavelength collection device 611 may be, but is not limited to, a spectrometer;

[0138] The analysis device 612 is used to calculate the actual light incident angle θ1 of the protrusion according to λ1 by using the above formula (2), and determine whether the protrusion is abnormal according to the difference between the actual light incident angle θ1 and the preset standard light incident angle θ0.

[0139] Yet another optional embodiment:

[0140] This embodiment also provides a display screen, including a frame and a display panel; the display panel is fixed on the frame; the display panel includes a display backplane, and a plurality of micro-light-emitting chips arranged on the display backplane, wherein the plurality of micro-light-emitting chips are transferred to the display backplane through the transfer device in the above embodiments, so that the micro-light-emitting chips on the display backplane have better consistency after bonding, thereby improving the display effect of the display screen. The display screen can be applied to, but not limited to, various intelligent mobile terminals, vehicle-mounted terminals, PCs, monitors, electronic billboards, etc.

[0141] This embodiment also provides a spliced ​​display screen, including a spliced ​​display screen that can be formed by splicing at least two display screens as shown above. Since the micro-light-emitting chips of the display screens have better consistency after bonding, the consistency of the micro-light-emitting chips between the spliced ​​display screens after bonding can be further ensured, thereby improving the visual effect.

[0142] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A transfer device, characterized in that: The transfer device comprises: a transfer head and a colloidal crystal layer for Bragg reflection arranged on the transfer head, wherein the transfer head comprises: A substrate, and at least one protrusion disposed on the back side of the substrate, the protrusion being used to adhere to the chip to be transferred so as to pick up and transfer the chip to be transferred; The colloidal crystal layer is formed on the protrusion, at least partially covering the side of the protrusion that is in contact with the chip to be transferred, and the colloidal crystal layer includes orderly arranged colloidal crystal microspheres.

2. The transfer device according to claim 1, characterized in that The colloidal crystal microspheres are nano-scale colloidal crystal microspheres, and the particle size of the colloidal crystal microspheres is greater than or equal to 173 nanometers and less than or equal to 190 nanometers.

3. The transfer device according to claim 2, characterized in that The particle size of the colloidal crystal microspheres is 189 nanometers.

4. The transfer device according to any one of claims 1 to 3, characterized in that: The colloidal crystal microspheres include at least one of silica microspheres and polymer microspheres.

5. The transfer device according to any one of claims 1 to 3, characterized in that: The colloidal crystal layer also includes a preset material filled in the gaps between the colloidal crystal microspheres to form the protrusions.

6. A method for manufacturing a transfer device, characterized in that: Used to make the transfer device as described in any one of claims 1 to 5, comprising: Making a transfer head mold, the transfer head mold comprising a template substrate main body, a transfer head pattern formed on the template substrate main body, the transfer head pattern comprising a groove forming the protrusion; forming the colloidal crystal layer at least at the bottom of the groove; Filling a preset material on the transfer head pattern and performing a curing process to obtain the transfer head; removing the transfer head mold, and the colloidal crystal layer remains on the transfer head; or, Making the transfer head; The colloidal crystal layer is formed on the protrusions.

7. The method for manufacturing a transfer device according to claim 6, characterized in that: The forming of the colloidal crystal layer at least at the bottom of the groove comprises: Mixing the colloidal crystal microspheres in a volatile solvent to obtain a microsphere mixed solution; The microsphere mixed solution is coated at least on the bottom of the groove, and the colloidal crystal microspheres are self-assembled by gravity to form the colloidal crystal layer through the volatilization of the volatile solvent; Or, forming the colloidal crystal layer on the protrusions comprises: Mixing the colloidal crystal microspheres in a volatile solvent to obtain a microsphere mixed solution; The microsphere mixture is coated on at least one surface of the protrusion that is in contact with the chip to be transferred, and the colloidal crystal microspheres self-assemble under gravity to form the colloidal crystal layer through the volatilization of the volatile solvent.

8. A method for detecting a transfer device according to any one of claims 1 to 5, characterized in that: include: Placing the transfer device under a preset light environment, with the colloidal crystal layer on the protrusion facing the light incident direction; detecting light reflected by the colloidal crystal layer on the protrusion, and determining whether the protrusion is abnormal according to the detection result; Determining whether the protrusion is abnormal according to the detection result includes at least one of the following: Observing the actual color of light reflected by the colloidal crystal layer on the protrusion, and determining whether the protrusion is abnormal based on the difference between the actual color and a preset standard color; Obtaining the actual wavelength λ1 of the light reflected by the colloidal crystal layer on the protrusion; According to the λ, the actual light incident angle θ1 of the protrusion is calculated by the following formula; The k is a coefficient, the D is the particle size of the colloidal crystal microsphere, and the n is the refractive index of the colloidal crystal microsphere; Whether the protrusion is abnormal is determined according to the difference between the actual light incident angle θ1 and the preset standard light incident angle θ0.

9. A detection device for detecting the transfer device according to any one of claims 1 to 5, characterized in that: include: The light detection device is used to detect the light reflected by the colloidal crystal layer on the protrusion when the transfer device is placed in a preset light environment and the colloidal crystal layer on the protrusion faces the light incident direction, and determine whether the protrusion is abnormal based on the detection result.

Images