Ultra-thin temperature distribution plate element structure and manufacturing method thereof

Abstract

The present invention relates to an ultra-thin temperature equalizing plate element structure and a manufacturing method thereof, wherein the ultra-thin temperature equalizing plate element structure comprises a first sheet, a second sheet, a first capillary structure and a second capillary structure. The first sheet has a first surface, the first surface has a first groove structure, and the first groove structure has a first supporting structure. The second sheet has a second surface corresponding to the first surface, the edge of the second surface is tightly welded to the edge of the first surface, and a closed accommodation space is formed between the first groove structure of the first surface and the second surface. The first capillary structure is formed in the first groove structure. The second capillary structure is formed between the first supporting structure and the second surface. The capillary structure of the present invention can be formed by one-time printing and sintering of slurry, which is beneficial to the sealing process, and the second capillary structure serves as part of the supporting structure. Therefore, the present invention can effectively improve the flow rate and flow rate of the liquid working fluid, and is also beneficial to the slurry printing and sintering capillary structure process and the diffusion welding sealing process.

Description

Technical Field

[0001] The present invention relates to a temperature distribution plate element structure and a manufacturing method thereof, and in particular to an ultra-thin temperature distribution plate element structure with a capillary structure placed in a special position and a manufacturing method thereof. Background Art

[0002] The development trend of electronic and handheld communication devices continues towards thinner design and higher functionality, leading to increasing demands for the computing speed and performance of the microprocessors within these devices. Microprocessors, core components of electronic and communication products, generate heat at high speeds, becoming the primary heat generator in these devices. If this heat is not dissipated promptly, it can create localized processing hotspots. Without effective thermal management solutions and cooling systems, microprocessors often overheat, preventing them from performing properly and even impacting the lifespan and reliability of the entire electronic device system. Therefore, electronic products require excellent heat dissipation capabilities, especially for ultra-thin devices like smartphones and tablet PCs.

[0003] Currently, an effective way to dissipate and conduct heat from hot spots in electronic and communications products is to place the heat-absorbing end of a thin vapor chamber (evaporator) in contact with the device's microprocessor. The high heat generated by the microprocessor is conducted and distributed to the housing, where it is radiated into the air. A vapor chamber is essentially a closed chamber containing a working fluid. Rapid heat conduction or dissipation is achieved through the continuous circulation of the working fluid within the chamber, as well as convection between the gas and liquid at the absorbing and condensing ends.

[0004] The conventional method for making an ultra-thin temperature spreader is to etch grooves into a sheet copper substrate and then lay a copper screen mesh or a woven mesh in the grooves. In actual application, the copper mesh must first be cut according to the shape and size of the groove before it can be laid in the groove. The copper mesh is pressed with a graphite jig and sintered at a high temperature to form a capillary structure on the surface of the groove. The sheet copper substrate is then welded in such a way that the grooves are included to form an airway cavity. The sheet copper substrate is further sealed, water-filled, and vacuumed to make a temperature spreader or a plate-type heat pipe with a capillary structure, such as Figure 1 shown.

[0005] However, the copper screen mesh is only cross-woven, and the capillary structure is simple. Due to the limitation of airway space, the capillary structure of ultra-thin heat spreader components with a thickness of less than 0.3 mm often only has a space of tens of microns (um) thick. Therefore, the capillary force exerted by ordinary copper mesh as a capillary structure is often insufficient. In addition, the shape of ultra-thin heat spreader components is thin and not square, which is not conducive to the weaving, cutting, laying of copper mesh and pressing of graphite jigs during mass production. Overall, the process of making the capillary structure of ultra-thin heat spreader components with copper mesh is relatively complicated and not conducive to high-yield mass production.

[0006] Furthermore, when a single vapor chamber needs to handle the cooling of multiple hot spots, or when the vapor chamber is tilted, the flow rate and velocity of the liquid working fluid vary at different locations. Composite capillary structures of varying shapes and locations can help balance the flow rate and velocity of the liquid working fluid, but the current structure and process still have room for improvement. Summary of the Invention

[0007] In view of this, the purpose of the present invention is to provide an ultra-thin temperature equalizing plate element structure and its manufacturing method, which can effectively overcome the defects of the existing technology, improve the flow rate and flow rate of the liquid working fluid, and is also beneficial to the slurry printing and sintering capillary structure process and diffusion welding sealing process.

[0008] To achieve the above objectives, the present invention discloses an ultra-thin temperature equalizing plate element structure, which is characterized by comprising:

[0009] A first sheet material having a first surface, the first surface having a first groove structure, and the first groove structure having a first support structure protruding from the first groove structure;

[0010] a second sheet having a second surface corresponding to the first surface, wherein an edge of the second surface is airtightly welded to an edge of the first surface, and a sealed accommodation space is formed between the first groove structure of the first surface and the second surface;

[0011] a first capillary structure formed in the first trench structure; and

[0012] A second capillary structure is formed between the first supporting structure and the second surface.

[0013] The second surface further has a second groove structure, the second groove structure has a second supporting structure, and the second capillary structure is formed between the first supporting structure and the second supporting structure.

[0014] The height of the first supporting structure is smaller than the edge height of the first surface, or the height of the second supporting structure is smaller than the edge height of the second surface.

[0015] Among them, the first capillary structure and the second capillary structure are formed by a slurry through a drying, cracking and sintering process. The thickness of the ultra-thin temperature equalizing plate element structure is not greater than 1.0 mm, and further has a working fluid placed in the enclosed accommodating space, and the enclosed accommodating space is in a vacuum negative pressure state.

[0016] The first capillary structure is a boat-shaped porous capillary structure, and a sidewall gap is provided between the first capillary structure and the first groove structure.

[0017] The first groove structure has a groove sidewall, a sidewall gap is formed between the boat-shaped porous capillary structure and the groove sidewall, and a width of an upper surface of the first capillary structure is greater than a width of a lower surface of the first capillary structure.

[0018] Also disclosed is a method for manufacturing an ultra-thin temperature-equalizing plate element structure, which is characterized by comprising:

[0019] Providing a first sheet material having a first surface, wherein the first surface has a first groove structure, and a first supporting structure is provided in the first groove structure;

[0020] Laying a slurry on the first groove structure and covering the first support structure, the slurry containing a metal powder;

[0021] Heating the slurry to sinter the metal powder, thereby generating a first capillary structure formed in the first groove structure and a second capillary structure formed on the first support structure;

[0022] Covering the first sheet with a second sheet, wherein the second sheet has a second surface corresponding to the first surface; and

[0023] The edges of the first sheet and the second sheet are heated to seal the first sheet and the second sheet to form an ultra-thin temperature distribution plate element structure.

[0024] Wherein, the height of the first supporting structure is smaller than the edge height of the first surface.

[0025] The metal powder includes a plurality of copper particles and a plurality of cuprous oxide particles, and the step of heating the slurry to sinter the metal powder is further as follows:

[0026] The metal powder is sintered in a hydrogen-containing atmosphere to reduce the cuprous oxide particles and connect them to form a plurality of chain-like copper members. The chain-like copper members are coupled to each other, and the copper particles form spherical copper members and are dispersed between the chain-like copper members, thereby forming a first capillary structure in the first trench structure and a second capillary structure on the first support structure.

[0027] The slurry further comprises a plurality of copper particles, an organic solvent and a polymer, and the step of heating the slurry to sinter the metal powder is further as follows:

[0028] The slurry is heated to remove the organic solvent, crack the polymer, and sinter the metal powder, thereby generating a first capillary structure formed in the first groove structure and a second capillary structure formed on the first support structure. The first capillary structure is a boat-shaped porous capillary structure, and a sidewall gap is formed between the first capillary structure and the first groove structure.

[0029] In summary, the present invention utilizes a first capillary structure within the first groove structure of a thin heat spreader element and a second capillary structure on the first support structure to form a composite capillary structure within the heat spreader. The second capillary structure, squeezed between the support structure and the second sheet, increases the flow rate of the liquid working fluid within the first capillary structure, serves as a regulator for the flow of the liquid working fluid within the multiple grooves, and can also function as a component of the support structure. Furthermore, the first and second capillary structures of the ultra-thin heat spreader element of the present invention can be formed through a single printing and sintering process using a slurry, facilitating the implementation of diffusion soldering and sealing processes for the element. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Illustration of a conventional temperature-equalizing plate made of a copper mesh as a capillary structure;

[0031] Figure 2 A schematic cross-sectional view of an ultra-thin vapor chamber element structure in accordance with one embodiment of the present invention is shown;

[0032] Figure 3A 、 3B 3C is a schematic cross-sectional view illustrating the structure of an ultra-thin vapor chamber element in different embodiments of the present invention;

[0033] Figure 4A A schematic diagram of a thin temperature-vaporizing plate having a boat-shaped porous capillary structure according to one embodiment is shown;

[0034] Figure 4B Draw Figure 4A Schematic diagram of a boat-shaped porous capillary structure in an embodiment;

[0035] Figure 5 Draw Figure 4A A schematic diagram of the flow direction of the liquid working fluid in a specific embodiment;

[0036] Figure 6 A flowchart illustrating a method for manufacturing an ultra-thin vapor chamber structure according to one embodiment of the present invention is provided;

[0037] Figure 7 Schematic diagram of the manufacturing method of the ultra-thin temperature equalizing plate element structure of the present invention. DETAILED DESCRIPTION

[0038] To facilitate a clearer and more comprehensive understanding of the advantages, spirit, and features of the present invention, the following detailed description and discussion will be provided using specific embodiments with reference to the accompanying drawings. It should be noted that these embodiments are merely representative of the present invention, and the specific methods, devices, conditions, materials, and the like exemplified herein are not intended to limit the present invention or the corresponding embodiments. Furthermore, the elements in the figures are merely intended to illustrate their relative positions and are not drawn to scale. The step numbers of the present invention are merely for distinguishing between steps and do not represent the order of the steps. This is to be noted above.

[0039] See also Figure 2 . Figure 2 The figure shows a cross-sectional schematic diagram of an ultra-thin temperature equalizing plate element structure in a specific embodiment of the present invention. The ultra-thin temperature equalizing plate element structure V in this specific embodiment includes a first sheet 1, a second sheet 2, a first capillary structure 41, and a second capillary structure 42. The first sheet 1 has a first surface 10, the first surface 10 has a first groove structure 100, and the first groove structure has a first support structure 101. The second sheet 2 has a second surface 20 corresponding to the first surface 10, and the edge of the second surface 20 is airtightly welded to the edge of the first surface 10, forming a sealed accommodation space between the first groove structure 100 of the first surface 10 and the second surface 20. The first capillary structure 41 is formed in the first groove structure 100. The second capillary structure 42 is formed between the first support structure 101 and the second surface 20. A vacuum airway space 5 is formed between the first capillary structure 41 and the second surface 20.

[0040] The first trench structure 100 is created by etching the first sheet 1. The first capillary structure 41 within the first trench structure 100 and the second capillary structure 42 on the first support structure 101 form a composite capillary structure within the temperature-maintaining plate. The first and second capillary structures 41, 42 can be simultaneously printed and sintered using a slurry. Using screen printing or stencil printing, the diffusion weld seals around the first sheet 1 of the ultra-thin temperature-maintaining plate component are masked, while the slurry is printed and applied to the first trench structure 100 and the first support structure 101.

[0041] The second capillary structure 42, squeezed between the first support structure 101 and the second sheet 2, increases the flow rate of the liquid working fluid within the first capillary structure. When multiple spaced-apart groove structures are formed on the first surface 10, the flow rates of the liquid working fluid in different groove structures may vary. The second capillary structure 42 can also regulate the flow rate of the liquid working fluid between the different groove structures, ensuring a balanced distribution of the liquid working fluid and maintaining heat dissipation efficiency.

[0042] In one embodiment, the first sheet 1 and the second sheet 2 are made of copper, a copper alloy, titanium, or a titanium alloy. Copper and copper alloys are excellent thermal conductors and have low production costs. Titanium and titanium alloys offer high strength, low weight, and excellent resistance to corrosion, fatigue, and cracking. Therefore, copper, copper alloys, titanium, and titanium alloys are preferred materials for the present invention.

[0043] In another embodiment, the first sheet 1 and the second sheet 2 are made of stainless steel, which has a higher hardness than copper. A thin layer of copper is electroplated on the first and second surfaces, respectively. The thin copper layer on the sheet surfaces facilitates diffusion welding, effectively increasing thermal conductivity.

[0044] Placing the second capillary structure 42 on the first support structure 101 increases the vertical height of that area. For example, when processing and sealing the first and second sheets 1 and 2 to form a thin vapor chamber element, the combined thickness of the first sheet 1, first support structure 101, second sheet 2, and second capillary structure 42 is greater than the combined thickness at the edges of the first and second sheets 1 and 2, affecting flatness and sealing yield. Therefore, appropriate reprocessing of the first support structure 101 and the corresponding structures is necessary.

[0045] See also Figure 2 、 Figure 3A 、 3B , 3C. Figure 3A 、 3B 3C is a cross-sectional view showing the structure of the ultra-thin heat spreader element in different embodiments of the present invention. Figure 3A As shown, in one embodiment, the second surface 20 of the second sheet 2 is etched corresponding to the first support structure 101, with the etching depth being exactly equal to the height of the second capillary structure 42. Thus, when the first and second sheets 1 and 2 are sealed together to form a thin vapor chamber element, the thickness at the first support structure 101 is the same as the thickness at the edge.

[0046] exist Figure 3B In the embodiment, to prevent the height of the second capillary structure 42 from affecting the flatness and sealing yield, the second support structure 201 is etched a second time to further reduce the height of the second support structure 201. In other words, the thickness D201 of the second sheet 2 at the second support structure 201 is less than the thickness D20 at its edge.

[0047] The second surface 20 further comprises a second groove structure 200, which is formed by etching the second sheet 2. The second groove structure 200 comprises a second support structure 201, and a second capillary structure 42 is formed between the first support structure 101 and the second support structure 201. The second groove structure 200 can expand the vacuum air passage space 5 between the first capillary structure 41 and the second surface 20.

[0048] exist Figure 3C In the embodiment, to prevent the height of the second capillary structure 42 from affecting flatness and sealing yield, the first support structure 101 can be etched a second time to reduce its height, and then the second capillary structure 42 is disposed thereon. That is, the thickness D101 of the first sheet 10 at the first support structure 101 is less than the thickness D10 at its edge.

[0049] Of course, the first support structure 101 and the second support structure 201 can be etched again simultaneously to reduce their heights to match the height of the second capillary structure 42. In practice, the height of the second capillary structure 42 must be stable or adjustable to accurately match the height after sealing.

[0050] For example, the first capillary structure 41 and the second capillary structure 42 are simultaneously formed from a slurry through a sintering process. By adjusting the composition ratio of the slurry, a predetermined height of the second capillary structure 42 can be obtained. Then, the first sheet or the second sheet is etched according to the predetermined height of the second capillary structure 42.

[0051] The first capillary structure 41 and the second capillary structure 42 are both porous capillary structures formed by sintering metal powder, and the average pore size is less than 10 μm. Capillary structures with this pore size have better capillary force.

[0052] The thickness of the ultra-thin heat spreader element structure V of the present invention is no more than 1.0 mm, and can be effectively applied to mobile communication devices, such as 5G smartphones, tablet computers, or various electronic products that emphasize thinness and lightness. When the element structure is limited to such a thin and flat structure, the pressure difference between the inside and outside of the heat spreader element will cause the thickness of the periphery and the middle area of the element to be different, which will seriously affect the appearance flatness, yield and durability of the element. Therefore, the design of the present invention utilizes the second capillary structure 42 as an extension of the height of the support structure 101, and it is increasingly important to make the overall thickness of the heat spreader element more uniform and flat. In a specific embodiment, the second capillary structure 42 of the present invention is formed into a multi-porous capillary structure by sintering, and is then squeezed by the second sheet 2 to form a capillary structure with better structural strength. The second capillary structure 42 can also function as an auxiliary capillary structure of the heat spreader to enhance the thermal conductivity of the thin heat spreader.

[0053] See also Figure 4A and Figure 4B . Figure 4A A schematic diagram of a thin vapor chamber according to another embodiment of the present invention is shown; Figure 4B Draw Figure 4A Schematic diagram of the first capillary structure 41 of the medium-thin temperature equalizing plate. Figure 4A and Figure 4BAs shown, the first capillary structure 41 of this embodiment is a boat-shaped porous capillary structure, and a sidewall gap 106 is formed between the first capillary structure 41 and the first trench structure 100. The first trench structure 100 has a trench sidewall 104, and the sidewall gap 106 is formed between the first capillary structure 41 and the trench sidewall 104.

[0054] The first capillary structure 41 has an upper surface 411, a lower surface 412, and side surfaces 414. The upper surface 411 has a central recessed area 415 and a raised edge area 417, giving it a boat-like shape. The width of the upper surface 411 of the first capillary structure 41 is greater than the width of the lower surface 412. The lower surface 412 is attached to the bottom surface of the groove. The side surfaces 414 gradually taper inward from the upper surface 411 toward the lower surface 412. This boat-shaped multi-porous capillary structure provides multiple capillary effects, increasing the velocity of the liquid working fluid.

[0055] See also Figure 5 . Figure 5 Draw Figure 4A Schematic diagram of the flow direction of the liquid working fluid in a specific embodiment. Figure 5 The figure only shows the working fluid flow in a single groove structure. The ultra-thin vapor chamber element structure V further comprises a liquid working fluid 3 (Working Fluid) placed within a first capillary structure 41 or a second capillary structure 42 within a sealed space, which is maintained at a negative vacuum pressure. The working fluid flows and circulates within the capillary structure and the vacuum airway space in both liquid and vapor phases, achieving rapid heat transfer.

[0056] The composite capillary structure described in the above embodiment can be composed of a first capillary structure 41, a second capillary structure 42, a groove structure 10, and a sidewall gap 106. Because the sidewall gap 106 is a long, fine groove with good permeability to the liquid-phase working fluid, and the first and second capillary structures 41, 42 provide a good capillary pressure differential, they combine to rapidly transport the liquid-phase working fluid. The channels in the sidewall gap 106 complement the porous capillary structure, serving together as a channel for transporting the liquid-phase working fluid 3 within the vapor chamber. The second capillary structure 42 regulates the flow of the liquid-phase working fluid 3 across the grooves.

[0057] Liquid-phase working fluid 3 is poured into the heat spreader element. The liquid-phase working fluid 3 is adsorbed within the first and second capillary structures 41, 42, and the sidewall gap 106. The amount of water in the liquid-phase working fluid 3 in the sidewall gap 106 may be higher than the average amount of water in the first and second capillary structures 41, 42. During actual operation of a heat spreader element with this structure, the liquid-phase working fluid 3 in the sidewall gap 106 and the liquid-phase working fluid 3 in the first and second capillary structures 41, 42 move in the same direction (direction of the arrow). However, the fluid resistance in the sidewall gap 106 is smaller, and the liquid-phase working fluid 3 flows faster. The fluid resistance in the first and second capillary structures 41, 42 is greater, and the liquid-phase working fluid 3 flows slower, but it is the source of power for liquid flow. The liquid-phase working fluid 3 in the sidewall gap can also be replenished into the first and second capillary structures 41, 42.

[0058] The composite capillary structure formed using the fabrication method described in the above embodiment achieved a pure water transport rate of over 35 mm / sec in a counter-gravity vertical water absorption test, more than twice the pure water transport rate of a copper mesh capillary structure. This significantly improves the capillary force of the vapor chamber element.

[0059] See also Figure 6 and Figure 7 . Figure 6 A flowchart illustrating the steps of a method for manufacturing an ultra-thin vapor chamber element structure according to another embodiment of the present invention is shown; Figure 7 Draw Figure 6 Schematic diagram of the manufacturing method of the ultra-thin temperature distribution board component structure. Figure 6 and Figure 7 As shown, the manufacturing method of the ultra-thin temperature-averaging plate element structure of this specific embodiment includes the following steps: step S1, providing a first sheet having a first surface, the first surface having a first groove structure, and the first groove structure having a first supporting structure; step S2, laying a slurry on the first groove structure and covering the first supporting structure, the slurry containing metal powder; step S3, heating the slurry to sinter the metal powder to produce a first capillary structure formed in the first groove structure and a second capillary structure formed on the first supporting structure; step S4, covering a second sheet on the first sheet, the second sheet having a second surface corresponding to the first surface; step S5, heating the edges of the first sheet and the second sheet to seal and form an ultra-thin temperature-averaging plate element structure.

[0060] comparison Figure 7 As shown in FIG. 1 , step S1 is to provide a first sheet 1 having a first surface 10 . The first surface 10 has a groove structure 100 . The groove structure 100 has a support structure 101 .

[0061] Step S2 is to lay a slurry 40 to cover the groove structure 100 and the support structure 101. The slurry 40 contains a metal powder, a solvent, and a polymer. Specifically, in step S2, a screen 70 can be used to cover the first sheet 1, especially to cover the edge of the first sheet 1. The mesh holes on the screen 70 correspond to the groove structure 100 of the first sheet 1. The slurry 40 is placed on one end of the screen 70. Then, a scraper 71 is used to scrape the slurry 40 through the holes to the other end of the screen 70. Part of the slurry 40 falls into the groove structure 100 and fills and covers the groove structure 100 and the support structure 101.

[0062] The laying can be a screen printing process, a stencil printing process or a dispensing process.

[0063] Step S3 is to heat the slurry 40 to volatilize the solvent, decompose and remove the polymer, and reduce and sinter the metal powder, thereby simultaneously forming a first capillary structure 41 in the trench structure 100 and a second capillary structure 42 on the support structure 101 .

[0064] Specifically, the slurry 40 is first heated at a low temperature to evaporate the solvent, shrinking its volume and converging into a solidified composite material. The temperature is then increased to crack and remove the polymer, evenly distributed among the metal powder. The polymer is cracked and burned away. Finally, the temperature is raised to the metal powder sintering temperature, simultaneously forming the porous first capillary structure 41 and the second capillary structure 42.

[0065] The metal powder includes a plurality of copper (Cu) particles and a plurality of cuprous oxide (Cu2O) particles, and the step S3 of heating the slurry to sinter the metal powder further comprises heating the slurry in a hydrogen-containing atmosphere to sinter the metal powder, so that the cuprous oxide particles are reduced and connected to each other to form a plurality of chain-like copper components. The chain-like copper components are coupled to each other, and the copper particles form spherical copper components and are dispersed between the chain-like copper components, thereby forming a first capillary structure 41 in the first trench structure 100 and a second capillary structure 42 on the first support structure 101, both of which are formed simultaneously.

[0066] The particle size of cuprous oxide particles is smaller than that of copper particles, with an average particle size of less than 5 μm, while the average particle size of copper particles is greater than 10 μm. Cuprous oxide has a hexahedral, octagonal rhombus-shaped crystal structure, which, at high temperatures, extends along its farthest ends into a chain-like shape. In a hydrogen-containing atmosphere, cuprous oxide gradually reduces to copper, but once reduced to copper, it loses the kinetic energy required to extend along its farthest ends into a chain-like shape. Therefore, the hydrogen-containing atmosphere and temperature must be precisely controlled to reduce and sinter the cuprous oxide into a copper chain.

[0067] In the step S3 of heating the slurry to sinter the metal powder, the first capillary structure 41 is a boat-shaped porous capillary structure, and a sidewall gap 106 is defined between the first capillary structure 41 and the first groove structure 100 .

[0068] Step S4 involves first providing a second sheet 2 having a second surface 20 corresponding to the first surface 10, a second groove structure 200 corresponding to the first groove structure 100, and a second support structure 201 corresponding to the first support structure 101. In principle, the first and second sheets 1 and 2 have the same length and width, but may have different thicknesses. The first and second sheets 1 and 2 are then stacked, corresponding to the groove and support structures, such that the second capillary structure 42 is sandwiched between the first and second support structures 101 and 201. If the second sheet 2 lacks the second groove structure 200 and the second support structure 201, the second capillary structure 42 is sandwiched between the first support structure 101 and the second surface 20.

[0069] The height of the first support structure 101 is less than the edge height of the first surface 10 ; or the height of the second support structure 201 is less than the edge height of the second surface 20 ; or both.

[0070] Step S5 involves applying pressure and heating to the edges of the first and second sheets 1 and 2 to seal them together, forming an ultra-thin temperature vapor chamber element structure. Step S5 can be performed by diffusion welding, which utilizes high temperature and pressure to cause atoms to diffuse between the contacting surfaces of the first and second sheets 1 and 2, thereby embedding and bonding the edges of the first and second sheets 1 and 2.

[0071] In summary, the present invention utilizes a first capillary structure within the first groove structure of a thin heat spreader element and a second capillary structure on the first support structure to form a composite capillary structure within the heat spreader. The second capillary structure, squeezed between the support structure and the second sheet, increases the flow rate of the liquid working fluid within the first capillary structure, serves as a regulator for the flow of the liquid working fluid within the multiple grooves, and can also function as a component of the support structure. Furthermore, the first and second capillary structures of the ultra-thin heat spreader element of the present invention can be formed through a single printing and sintering process using a slurry, facilitating the implementation of diffusion soldering and sealing processes for the element.

[0072] The primary and secondary capillary structures are formed by applying a slurry and then heating it, facilitating mass production. The slurry contains cuprous oxide, which, after reduction sintering, forms a chain-like copper structure with appropriate porosity. The primary capillary structure exhibits a boat-like shape, enhancing the overall composite structure and further increasing the flow rate of the liquid working fluid.

[0073] The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention. The disclosure of the preferred embodiments is not intended to limit the scope of the present invention. Rather, the intent is to encompass various modifications and equivalent arrangements within the scope of the patent application. Therefore, the scope of the patent application should be interpreted broadly based on the above description to encompass all possible modifications and equivalent arrangements.

Claims

1. An ultra-thin temperature distribution plate element structure, characterized in that Include: A first sheet material has a first surface, the first surface has a first groove structure, the first groove structure has a first support structure protruding from the first groove structure, and the first groove structure has a groove sidewall; a second sheet having a second surface corresponding to the first surface, wherein an edge of the second surface is airtightly welded to an edge of the first surface, and a sealed accommodation space is formed between the first groove structure of the first surface and the second surface; a first capillary structure formed in the first groove structure, the first capillary structure being a boat-shaped porous capillary structure, a sidewall gap being defined between the first capillary structure and a sidewall of the groove, and a width of an upper surface of the first capillary structure being greater than a width of a lower surface of the first capillary structure; as well as A second capillary structure is formed between the first supporting structure and the second surface.

2. The ultra-thin temperature vapor chamber element structure according to claim 1, characterized in that: The second surface further has a second groove structure. A second supporting structure is formed in the second groove structure. The second capillary structure is formed between the first supporting structure and the second supporting structure.

3. The ultra-thin temperature equalizing plate element structure according to claim 2, characterized in that: The height of the first supporting structure is smaller than the edge height of the first surface, or the height of the second supporting structure is smaller than the edge height of the second surface.

4. The ultra-thin temperature vapor chamber element structure according to claim 1, wherein: The first capillary structure and the second capillary structure are formed by a slurry through a drying, cracking, and sintering process. The thickness of the ultra-thin temperature-averaging plate element structure is no more than 1.0 mm, and further has a working fluid placed in the enclosed accommodating space, and the enclosed accommodating space is in a vacuum negative pressure state.

5. A method for manufacturing an ultra-thin temperature-equalizing plate element structure, characterized in that Include: Providing a first sheet material having a first surface, wherein the first surface has a first groove structure, and the first groove structure has a first supporting structure and a groove sidewall; Laying a slurry on the first groove structure and covering the first support structure, the slurry containing a metal powder; Heating the slurry to sinter the metal powder, thereby forming a first capillary structure in the first groove structure and a second capillary structure on the first support structure, wherein the first capillary structure is a boat-shaped porous capillary structure, a sidewall gap is defined between the first capillary structure and the sidewall of the groove, and a width of an upper surface of the first capillary structure is greater than a width of a lower surface of the first capillary structure; Covering the first sheet with a second sheet, wherein the second sheet has a second surface corresponding to the first surface; as well as The edges of the first sheet and the second sheet are heated to seal the first sheet and the second sheet to form an ultra-thin temperature distribution plate element structure.

6. The method for manufacturing an ultra-thin temperature vapor chamber element structure according to claim 5, wherein: The height of the first supporting structure is smaller than the edge height of the first surface.

7. The method for manufacturing an ultra-thin temperature vapor chamber element structure according to claim 5, wherein: The metal powder includes a plurality of copper particles and a plurality of cuprous oxide particles, and the step of heating the slurry to sinter the metal powder is further: The metal powder is sintered in a hydrogen-containing atmosphere to reduce the cuprous oxide particles and connect them to form a plurality of chain-like copper members. The chain-like copper members are coupled to each other, and the copper particles form spherical copper members and are dispersed between the chain-like copper members, thereby forming a first capillary structure in the first trench structure and a second capillary structure on the first support structure.

8. The method for manufacturing an ultra-thin temperature vapor chamber element structure according to claim 5, wherein: The slurry further comprises a plurality of copper particles, an organic solvent and a polymer, and the step of heating the slurry to sinter the metal powder further comprises: The slurry is heated to remove the organic solvent, decompose the polymer and sinter the metal powder, thereby generating a first capillary structure formed in the first groove structure and a second capillary structure formed on the first supporting structure.

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