Substrate fixing device and applicable substrate assembly structure

Abstract

The present invention provides a substrate fixing device and a substrate assembly structure applicable thereto. The substrate fixing device includes a base and a locking piece. The base corresponds to a supporting substrate. The substrate has a through-hole. The locking piece is located on the base, spatially arranged corresponding to the through-hole, and includes a supporting portion, a positioning portion, an adhesive portion, an end portion and a fixed colloid. The supporting portion is arranged on the base to support the substrate. The positioning portion is arranged on the supporting surface of the supporting portion and extends along the through-hole. The adhesive portion is connected to the positioning portion, passes through the surface of the substrate from the through-hole of the substrate, and a gap is formed between the outer peripheral wall of the adhesive portion and the inner peripheral wall of the through-hole. The end portion is connected to the positioning portion through the adhesive portion. The fixed colloid ring is arranged outside the outer peripheral wall of the adhesive portion, connected between the end portion and the positioning portion, covers the outer peripheral portion of the substrate adjacent to the through-hole, and fills the gap.

Description

Technical Field

[0001] The present invention relates to the field of power electronics technology, and more specifically, to a substrate fixing device and a substrate assembly structure applicable thereto, so as to maintain the stability of the overall structure and enable the substrate assembly structure to withstand the high temperature process of reflow soldering. Background Art

[0002] As electronic modules continue to become increasingly integrated and miniaturized, securing the module to the heat sink within limited space has become a challenge. The dense density of electronic components on circuit boards limits the area available for heat sink mounting. Furthermore, due to manufacturing process requirements, the assembled structure must undergo multiple high-temperature processes such as reflow soldering to add additional components.

[0003] However, the traditional method of fixing the circuit board and the heat sink with screws, while capable of being made of high-temperature resistant metal to meet high-temperature resistance requirements, requires sufficient area for structural fixation and assembly to maintain an electrical safety zone, hindering the development of overall structural miniaturization. Furthermore, using traditional soldering to secure the assembly structure between the circuit board and the heat sink can cause the solder paste to remelt during high-temperature reflow soldering, potentially leading to electrical failure of surrounding electronic components. Using high-melting-point solder paste not only increases the difficulty of the welding process but also creates cracks in the solder paste after high-temperature soldering, reducing reliability.

[0004] In view of this, how to provide a substrate fixing device and its applicable substrate assembly structure to fix the substrate in a smaller space, simplify the assembly manufacturing process, and enable the substrate assembly structure to withstand the high temperature during reflow soldering and maintain reliability is indeed a very urgent issue in this field. Summary of the Invention

[0005] The object of the present invention is to provide a substrate fixing device and a substrate assembly structure applicable thereto. By combining an inverted hook-shaped structure with a snap-fit ​​formed by a fixing colloid, the substrate is stably fixed to the base, preventing the substrate from moving relative to the substrate fixing device, and being combined into a whole, and can withstand the high-temperature process of subsequent reflow soldering. Since the solidified colloid has good adhesion, strong tensile and compressive strength, good high and low temperature resistance, and is not easy to peel off, a snap-fit ​​can be formed by surrounding the inverted hook-shaped structure composed of metal material to ensure that the substrate assembly structure does not separate or loosen during high-temperature soldering. Furthermore, the inverted hook-shaped structure composed of metal material has high mechanical strength and occupies little space on the substrate, which is conducive to the integrated design of the module.

[0006] Another object of the present invention is to provide a substrate fixing device and a substrate assembly structure suitable for the same. The substrate on the substrate fixing device supports the bottom surface of the substrate through a supporting portion, and is positioned by fitting the positioning portion into the through-hole of the substrate, while the connecting end of the adhesive portion is in a hook-shaped structure, and combined with the fixing colloid, the substrate can be firmly fixed. Since the fixing colloid is in a fluid state before solidification, it is easy to fill the gap between the through-hole of the substrate and the adhesive portion, and adhere to the adhesive portion between the positioning portion and the end. After solidification, the fixing colloid can fasten the substrate to the base as a whole through a locking piece, while withstanding the high temperature process of multiple reflow soldering. Furthermore, the positioning of the substrate fixing device and the substrate, as well as the filling and solidification of the fixing colloid, can all be automated. The stability and high temperature resistance of the substrate assembly structure can also withstand the high temperature process of multiple reflow soldering, further realizing an automated process. When the substrate assembly structure is used, for example, to fix a circuit substrate to a heat sink, components can be assembled through a high-temperature process called multiple reflow soldering steps after the circuit substrate and heat sink are fixed. This increases process variability, simplifies the heat sink assembly process, and achieves full process automation, thereby reducing product costs and improving product competitiveness.

[0007] To achieve the aforementioned objectives, the present invention provides a substrate fixing device comprising a base and at least one locking member. The base supports a corresponding substrate. The substrate comprises at least one through-hole, and a first surface and a second surface opposite to each other, wherein the at least one through-hole passes through the first surface and the second surface, and the first surface faces the base. At least one locking member is located on the base, spatially corresponding to the at least one through-hole, and each of the at least one locking member comprises a supporting portion, a positioning portion, an adhesive portion, an end portion, and a fixing adhesive. The supporting portion is disposed on the base and comprises a supporting surface, wherein the supporting portion is connected between the first surface of the substrate and the base, and the supporting surface is in contact with the first surface. The positioning portion is disposed on the supporting surface of the supporting portion and extends along the at least one through-hole. The adhesive portion is connected to the positioning portion, the adhesive portion passes through the second surface from one of the at least one through-holes of the substrate, and a gap is formed between an outer peripheral wall of the adhesive portion and an inner peripheral wall of the at least one through-hole. The end portion is connected to the positioning portion via the adhesive portion. The fixed colloid ring is arranged outside the peripheral wall of the adhesive attachment portion, connected between the end portion and the positioning portion, covers the peripheral edge portion of the second surface adjacent to at least one through hole, and fills the gap.

[0008] To achieve the aforementioned objectives, the present invention further provides a substrate assembly structure comprising a substrate and a substrate fixing device. The substrate comprises at least one through-hole, and a first surface and a second surface opposite to each other, wherein the at least one through-hole extends through both the first and second surfaces. The substrate fixing device comprises a base and at least one locking member. The base supports the substrate, with the first surface facing the base. The at least one locking member is located on the base, spatially corresponding to the at least one through-hole, and each of the at least one locking members comprises a supporting portion, a positioning portion, an adhesive portion, an end portion, and a fixing adhesive. The supporting portion is disposed on the base and comprises a supporting surface, wherein the supporting portion is connected between the first surface of the substrate and the base, and the supporting surface is in contact with the first surface. The positioning portion is disposed on the supporting surface of the supporting portion and extends along the at least one through-hole. The adhesive portion is connected to the positioning portion, and the adhesive portion passes through the second surface from within one of the at least one through-holes of the substrate, and a gap is formed between an outer peripheral wall of the adhesive portion and an inner peripheral wall of the at least one through-hole. The end portion is connected to the positioning portion via the adhesive portion. The fixed colloid ring is arranged outside the peripheral wall of the adhesive attachment portion, connected between the end portion and the positioning portion, covers the peripheral edge portion of the second surface adjacent to at least one through hole, and fills the gap.

[0009] The beneficial effects of the present invention are that embodiments of the present invention provide a substrate fixing device and a substrate assembly structure applicable thereto. By combining an inverted hook-shaped structure with a snap-fit ​​formed by a fixing colloid, the substrate is stably fixed to the base, preventing the substrate from moving relative to the substrate fixing device, and being combined into a single unit that can withstand the high-temperature process of subsequent reflow soldering. Because the solidified colloid has good adhesion, strong tensile and compressive strength, good high and low temperature resistance, is not easy to peel off, and has good electrical conductivity, the inverted hook-shaped structure formed around the metal material can form a snap-fit, ensuring that the substrate assembly structure does not separate or loosen during the high-temperature soldering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 The structure of the substrate assembly structure according to the first preferred embodiment of the present invention is schematically shown in an exploded view.

[0011] Figure 2 The schematic diagram shows an exploded view of the substrate assembly structure of the first preferred embodiment of the present invention from another perspective.

[0012] Figure 3 A three-dimensional diagram schematically shows a substrate assembly structure according to a first preferred embodiment of the present invention.

[0013] Figure 4 A cross-sectional view schematically shows a substrate assembly structure according to a first preferred embodiment of the present invention.

[0014] Figures 5A to 5C The assembly process of the substrate assembly structure according to the first preferred embodiment of the present invention is schematically shown.

[0015] Figures 6A to 6C The cross-sectional shapes of the supporting portion, the positioning portion, and the adhesive portion in different embodiments of the substrate fixing device of the present invention are schematically shown.

[0016] Figure 7 The relative size relationship among the supporting portion, the positioning portion, the adhesive portion and the end portion of the substrate fixing device according to the first preferred embodiment of the present invention is schematically shown.

[0017] Figure 8 The diagram schematically illustrates the relative dimensional relationship between the positioning portion, the adhesive portion, and the end portion of the substrate in the substrate assembly structure of the first preferred embodiment of the present invention.

[0018] Figure 9A The figure schematically shows a partial structural diagram of a substrate fixing device before assembly according to a second preferred embodiment of the present invention.

[0019] Figure 9B A partial structural cross-sectional view schematically shows a substrate assembly structure according to a second preferred embodiment of the present invention.

[0020] Figure 10A The figure schematically shows a partial structural diagram of a substrate fixing device before assembly according to a third preferred embodiment of the present invention.

[0021] Figure 10B A partial structural cross-sectional view schematically shows a substrate assembly structure according to a third preferred embodiment of the present invention.

[0022] The reference numerals are as follows:

[0023] 1. 1a, 1b: Substrate assembly structure

[0024] 10: Substrate

[0025] 11: Perforation

[0026] 110: Inner wall

[0027] 12: First surface

[0028] 13: Second surface

[0029] 14: Electronic devices

[0030] 15: Magnetic components

[0031] 16: Connectors

[0032] 2, 2a, 2b: Substrate fixing device

[0033] 20: Base

[0034] 21: Depression

[0035] 30: Locking hardware

[0036] 31: Support

[0037] 310: Support surface

[0038] 32: Positioning unit

[0039] 33: Attached rubber part

[0040] 330: Outer wall

[0041] 34: end

[0042] 340: Contact surface

[0043] 35: Fixed colloid

[0044] G: Gap

[0045] H1: First height clearance

[0046] H2: Second height clearance

[0047] Hpcb: substrate height

[0048] θ1, θ2: angle

[0049] Circumscribed circle diameter

[0050] Aperture DETAILED DESCRIPTION

[0051] Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various variations without departing from the scope of the present invention, and that the description and drawings herein are intended to be illustrative, not limiting, in nature. For example, if the following description of a first feature being positioned on or above a second feature includes embodiments in which the first and second features are in direct contact, it also includes embodiments in which the additional feature is positioned between the first and second features, such that the first and second features may not be in direct contact. Furthermore, reference symbols and / or designations may be repeated across different embodiments in the present disclosure. This repetition is for simplicity and clarity and is not intended to limit the relationship between the various embodiments and / or the described structures. Furthermore, to facilitate description of the relationship between one component or feature and another component(s) or feature(s) in the drawings, spatially relative terms such as "under," "below," "lower," "above," "upper," and similar terms may be used. In addition to the orientations shown in the drawings, spatially relative terms are used to cover different orientations of the device in use or operation. The device may also be positioned differently (e.g., rotated 90 degrees or in other orientations), and the description of the spatially relative terms used should be interpreted accordingly. In addition, when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, the numerical values ​​are stated as accurately as possible in the specific examples. In addition, it is understood that although terms such as "first," "second," and "third" may be used in the claims to describe different components, these components should not be limited by these terms. In the embodiments, these components described accordingly are represented by different component symbols. These terms are intended to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as used in this manner includes any or all combinations of one or more of the related listed items. Except in the operating / working examples, or unless explicitly stated, all numerical ranges, amounts, values ​​and percentages disclosed herein (such as those percentages of angles, time durations, temperatures, operating conditions, amount ratios and the like) should be understood as being modified by the term "about" or "substantially" in all embodiments. Accordingly, unless otherwise indicated, the numerical parameters stated in this disclosure and the appended claims are approximate values ​​that may vary as needed. For example, each numerical parameter should be interpreted at least according to the number of significant figures described and by applying ordinary rounding principles. Ranges can be expressed in this article as from one endpoint to the other or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

[0052] Figure 1 and Figure 2 The structure of the substrate assembly structure according to the first preferred embodiment of the present invention is schematically shown in an exploded view. Figure 3 A three-dimensional diagram schematically shows a substrate assembly structure according to a first preferred embodiment of the present invention. Figure 4 A cross-sectional view of the substrate assembly structure of the first preferred embodiment of the present invention is schematically shown. In this embodiment, the substrate assembly structure 1 is formed by fixing the substrate 10 by the substrate fixing device 2. The substrate 10 is, for example but not limited to, a circuit substrate, including at least one through-hole 11 and a first surface 12 and a second surface 13 opposite to each other, and the at least one through-hole 11 passes through the first surface 12 and the second surface 13. In this embodiment, the substrate fixing device 2 corresponds to the supporting substrate 10, and the structure forms the substrate assembly structure 1 to facilitate subsequent processes such as high-temperature reflow soldering. In this embodiment, the substrate fixing device 2 includes a base 20 and at least one locking member 30. The base 20 supports the substrate 10, and the first surface 12 of the substrate 10 faces the base 20. At least one locking member 30 is arranged on the base 20, spatially relative to the at least one through-hole 11 on the substrate 10. In this embodiment, the substrate 10 includes, for example, three through-holes 11, which are respectively adjacent to the three corners of the substrate 10. The at least one locking member 30 includes three locking members 30, spatially corresponding to the three through-holes 11. The three locking members 30 on the base 20 pass through the three through-holes 11 of the substrate 10, thereby securely supporting and positioning the substrate 10 on the base 20. Of course, the present invention is not limited to this. In other embodiments, the base 20 supports the substrate 10 and is secured by a single locking member 30.

[0053] In this embodiment, at least one locking member 30 includes a supporting portion 31, a positioning portion 32, an adhesive portion 33, an end portion 34, and a fixing adhesive 35. The supporting portion 31 is disposed on the base 20 and includes a supporting surface 310. The supporting portion 31 is connected between the first surface 12 of the substrate 10 and the base 20, with the supporting surface 310 contacting the first surface 12 of the substrate 10. The positioning portion 32 is disposed on the supporting surface 310 of the supporting portion 31 and extends along the at least one through-hole 11. The adhesive portion 33 is connected to the positioning portion 32 and extends through the second surface 13 of the at least one through-hole 11 of the substrate 20. An outer peripheral wall 330 of the adhesive portion 33 forms a gap G with an inner peripheral wall 110 of the at least one through-hole 11. The end portion 34 is connected to the positioning portion 33 via the adhesive portion 33. The fixing adhesive 35 is disposed around the outer peripheral wall 330 of the adhesive portion 33 and connected between the end portion 34 and the positioning portion 32. It covers the outer peripheral portion of the second surface 13 of the substrate 10 adjacent to the at least one through-hole 11 and fills the gap G. It is worth noting that the support portion 31, positioning portion 32, adhesive portion 33, and end portion 34 of the at least one locking member 30 form an inverted hook structure on the base 20. The inverted hook structure, combined with the snap formed by the fixing adhesive 35, stably secures the substrate 10 to the base 20, preventing the substrate 10 from moving relative to the substrate securing device 2. The assembly forms a complete unit, facilitating subsequent processing or meeting the client's application requirements.

[0054] In this embodiment, the base 20 is, for example, a heat sink. A substrate 10, such as a circuit substrate, is provided with at least one electronic device 14, a magnetic component 15, and a conductive connector 16. The base 20 also includes a recessed portion 21, which accommodates large components such as the magnetic component 15 provided on the substrate 10, thereby improving overall power density and heat dissipation efficiency. Furthermore, to enhance the scalability of the manufacturing process, simplify the assembly of heat sink components, and enable automated production, the substrate assembly structure 1, formed by securing the base 20 (e.g., a heat sink) and the substrate 10 (e.g., a circuit substrate) via at least one fastener 30, can undergo at least one reflow soldering process. For example, when the substrate assembly structure 1 is electrically connected to another device via the conductive connector 16, the soldered connection between the base 20 and the substrate 10 is prevented from remelting due to reheating, causing displacement or detachment. This improves the reliability and scalability of the manufacturing process, simplifies the assembly of heat sink components, and enables automated production. Furthermore, at least one electronic device 14, such as a switch, is pressed between the base 20 and the substrate 10. The base 20 and the substrate 10 are fastened by the locking member 30. This can also prevent the solder joints between the electronic device 14 and the substrate 10 from remelting and shifting or falling off during high-temperature reflow soldering. In addition, the positioning of the substrate fixing device 2 and the substrate 10, as well as the filling and curing of the fixing colloid 35, can all be produced automatically. The stability and high temperature resistance of the substrate fixing device 2 can withstand the high-temperature process of multiple reflow soldering, further realizing the automated process. When the substrate fixing device 2 is fixed to the circuit substrate 10, after the circuit substrate 10 and the base 20 of the heat dissipation base plate are fixed to form the substrate assembly structure 1, at least one electronic device 14, a magnetic component 15, and a conductive member 16 can be assembled through the high-temperature process of multiple reflow soldering, thereby increasing the process variability, simplifying the heat dissipation assembly process, and realizing full process automation, thereby achieving the purpose of reducing product costs and improving product competitiveness. Of course, at least one electronic device 14 , the magnetic component 15 , and the conductive member 16 may also be pre-placed on the substrate 10 . The present invention is not limited thereto and will not be further elaborated.

[0055] Figures 5A to 5C The assembly process of the substrate assembly structure according to the first preferred embodiment of the present invention is schematically shown. Figures 1 to 4 as well as Figures 5A to 5C . In this embodiment, the inverted hook-shaped structure formed by the support portion 31, the positioning portion 32, the adhesive portion 33 and the end portion 34 on the base 20 can be made of, for example, a metal material and formed as one piece. The metal material can be, for example, steel or copper plated with nickel and tin to provide sufficient mechanical strength. In this embodiment, the inverted hook-shaped structure formed by the support portion 31, the positioning portion 32, the adhesive portion 33 and the end portion 34 can be formed as one piece with the base 20, or connected by mechanical insertion, such as Figure 5AAs shown, the present invention is not limited thereto. When the substrate 10 is assembled with the substrate fixing device 2, the through-hole 11 of the substrate 10 is aligned with the locking member 30, and the hook-shaped structure formed by the support portion 31, the positioning portion 32, the adhesive portion 33, and the end portion 34 passes through the through-hole 11 of the substrate 10. The substrate 10 on the substrate fixing device 2 is supported by the support portion 31, the support surface 310 is in contact with the first surface 12 of the substrate 10, and the positioning portion 32 is fitted into the through-hole 11 of the substrate 10 for positioning. Figure 5B Then, the fixing glue 35 is arranged around the outer peripheral wall 330 of the adhesive portion 33, connected between the end 34 and the positioning portion 32, covering the outer peripheral edge portion of the second surface 13 of the substrate 10 adjacent to at least one through-hole 11, and filling the gap G to form a buckle, as shown. Figure 5C As shown, the substrate 10 can be firmly fixed on the substrate fixing device 2, while ensuring that the substrate assembly structure 1 will not separate or loosen even during a high-temperature welding process.

[0056] In this embodiment, the fixing colloid 35 is composed, for example, of an epoxy resin adhesive. Because the fixing colloid 35 is fluid before being cured by high-temperature baking, it easily fills the gap G between the inner peripheral wall 110 of the through-hole 11 of the substrate 10 and the outer peripheral wall 330 of the adhesive portion 33, and adheres to the adhesive portion 33 between the positioning portion 32 and the end portion 34. After curing, the fixing colloid 35 secures the substrate 10 to the base 20 via the locking member 30 to form a single substrate assembly structure 1. When the substrate assembly structure 1 is used, for example, to secure a circuit substrate to a heat sink, it has sufficient heat resistance to withstand multiple high-temperature reflow processes. Therefore, after the circuit substrate and the heat sink are secured, components can be assembled through multiple high-temperature reflow processes, increasing process variability, simplifying the heat sink assembly process, and achieving full process automation, thereby reducing product costs and enhancing product competitiveness.

[0057] Figures 6A to 6C The cross-sectional shapes of the supporting portion, the positioning portion, and the adhesive portion in different embodiments of the substrate fixing device of the present invention are schematically shown. Figure 7 The relative size relationship among the supporting portion, the positioning portion, the adhesive portion and the end portion of the substrate fixing device according to the first preferred embodiment of the present invention is schematically shown. Figure 8 The diagram schematically illustrates the relative dimensional relationships of the substrate relative to the positioning portion, adhesive portion, and end portion in the substrate assembly structure of the first preferred embodiment of the present invention. In this embodiment, the support portion 31, positioning portion 32, adhesive portion 33, and end portion 34 of the locking member 30 are each cylindrical, and the cross-sectional shape of the cylindrical shape is selected from the group consisting of a square, a polygon, and a circle. Figure 6A As shown, the support portion 31, the positioning portion 32 and the adhesive portion 33 of the locking member 30 are all circular in cross section. Figure 6BAs shown, the support portion 31, the positioning portion 32 and the adhesive portion 33 of the locking member 30 are all square in cross section. Figure 6C As shown, the support portion 31, positioning portion 32 and adhesive portion 33 of the locking member 30 are all polygonal in cross-section. Of course, the present invention is not limited to this. In other embodiments, the support portion 31, positioning portion 32 and adhesive portion 33 of the locking member 30 may have different cross-sections, and the end portion 34 may also have the same cross-sections. This will not be repeated here. In this embodiment, Figure 7 Combine Figure 8 As shown, the support portion 31 has a circumscribed circle diameter The positioning portion 32 has a circumscribed circle diameter The adhesive portion 33 has a circumscribed circle diameter The end portion 34 has a circumscribed diameter In addition, the through hole 11 of the substrate 10 has an aperture In this embodiment, the circumscribed circle diameter of the support portion 31 is Larger than the aperture of the through hole 11 of the substrate 10 Thus, the supporting surface 310 of the supporting portion 31 is able to support the substrate 10. In this embodiment, the circumscribed circle diameter of the positioning portion 32 is Not larger than the diameter of at least one through hole 11 Preferably, the circumscribed diameter of the positioning portion 32 is The aperture of the perforation 11 Considering the influence of process tolerance, the circumscribed circle diameter of the positioning portion 32 is The aperture of the perforation 11 The difference is not greater than 0.1 mm, so that the positioning portion 32 is fitted into the through hole 11 of the substrate 10 and accurately positioned. In this embodiment, the circumscribed circle diameter of the end portion 34 is Nor larger than the diameter of the through hole 11 In order to facilitate the end portion 34 to pass through the through hole 11, the positioning portion 32 cooperates with the through hole 11 to achieve positioning. Considering the influence of process tolerance, the aperture of the through hole 11 is The diameter of the circumscribed circle of the end 34 The difference is not greater than 0.1 mm. In this embodiment, the diameter of the circumscribed circle of the adhesive portion 33 is is smaller than the diameter of at least one through hole 11 And the aperture The diameter of the circumscribed circle of the adhesive portion 33 The difference is at least 0.25 mm, so that the outer peripheral wall 330 of the adhesive portion 33 and the inner peripheral wall 110 of the through hole 11 form a sufficient gap G to fill the fixed adhesive 35. In this embodiment, the circumscribed circle diameter of the adhesive portion 33 is smaller than the circumscribed diameter of the end portion 34 It is also smaller than the circumscribed diameter of the positioning portion 32 The diameter of the circumscribed circle of the adhesive portion 33 The minimum diameter can be 0.4mm, and the circumscribed circle diameter of the positioning part 32 The diameter of the circumscribed circle of the end 34 The minimum thickness can be as small as 0.7 mm, which can provide sufficient mechanical strength while minimizing the area occupied on the substrate 10.

[0058] Furthermore, in this embodiment, when the fixed adhesive 35 is formed, a first height gap H1 is formed between the upper surface of the positioning portion 32, which is positioned within the through-hole 11 and is away from the first surface 12, and the second surface 13 of the substrate. H1 is less than the substrate height Hpcb between the first and second surfaces 12, 13 of the substrate 10, thereby providing a sufficient gap G to fill the fixed adhesive 35. Furthermore, a second height gap H2 of not less than 0.25 mm is maintained between the adhesive application point of the end portion 35 and the second surface 13 of the substrate 10 to ensure that the fluid adhesive can smoothly flow into and fill the gap G formed between the outer peripheral wall 330 of the adhesive attachment portion 33 and the inner peripheral wall 110 of the through-hole 11. Of course, the present invention is not limited to this.

[0059] Figure 9A The figure schematically shows a partial structural diagram of a substrate fixing device before assembly according to a second preferred embodiment of the present invention. Figure 9B The schematic diagram shows a partial cross-sectional view of the substrate assembly structure of the second preferred embodiment of the present invention. In this embodiment, the substrate assembly structure 1a and Figures 1 to 8 The substrate assembly structure 1 shown is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. Figures 1 to 8 In the illustrated substrate assembly structure 1 , the angle between the contact surface 340 of the end portion 34 and the peripheral wall 330 of the adhesive portion 33 is approximately 90°. In this embodiment, the peripheral wall 330 of the adhesive portion 33 and the contact surface 340 of the end portion 34 also form an angle θ1 = 30°. Prior to high-temperature curing, the fixing adhesive 35 is fluid and easily flows into the gap G, adhering to the contact surface 340 and the peripheral wall 330. The effective contact area formed by the fluid fixing adhesive 35, the contact surface 340 of the end portion 34, and the peripheral wall 330 of the adhesive portion 33 is sufficient to provide the locking member 30 with a secure fixation of the substrate 10 to the substrate fixture 2a.

[0060] Figure 10A The figure schematically shows a partial structural diagram of a substrate fixing device before assembly according to a third preferred embodiment of the present invention. Figure 10B The schematic diagram shows a partial structural cross-sectional view of the substrate assembly structure of the third preferred embodiment of the present invention. In this embodiment, the substrate assembly structure 1b and Figures 1 to 8The illustrated substrate assembly structure 1 is similar, and like component numbers represent like components, structures, and functions, so a detailed description thereof will not be repeated here. In this embodiment, the outer wall 330 of the adhesive portion 33 and the contact surface 340 of the end portion 34 further form an angle θ2 = 150°. The effective contact area formed by the fixing adhesive 35, the contact surface 340 of the end portion 34, and the outer wall 330 of the adhesive portion 33 is sufficient to allow the locking member 30 to securely secure the substrate 10 to the substrate fixture 2b.

[0061] As can be seen from the above, when the angle between the contact surface 340 of the end portion 34 and the outer peripheral wall of the adhesive portion 33 is between 30° and 150°, the effective contact area between the fixed adhesive 35 and the undercut structure can be prevented from being too small. In other words, the shape of the undercut formed by the contact surface 340 of the end portion 34 and the outer peripheral wall 330 of the adhesive portion 33 can be designed to be horizontal, or the contact surface 340 of the end portion 34 can be tilted relative to the horizontal direction, for example, within a range of ±60°, to form an angle of any value between 30° and 150°. Of course, the present invention is not limited to this.

[0062] In summary, an embodiment of the present invention provides a substrate fixing device and a substrate assembly structure applicable thereto. By combining a hook-shaped structure with a fixing colloid to form a buckle, the substrate is stably fixed on the base, preventing the substrate from moving relative to the substrate fixing device, and being combined into a whole, and can withstand the high temperature process of subsequent reflow soldering. Since the solidified colloid has good adhesion, strong tensile and compressive strength, good high and low temperature resistance, is not easy to peel off, and has good electrical conductivity, a buckle can be formed by being ringed on the hook-shaped structure composed of metal materials to ensure that the substrate assembly structure does not separate or loosen during high-temperature soldering. Furthermore, the hook-shaped structure composed of metal materials has high mechanical strength and occupies little space on the substrate, which is conducive to the integrated design of the module. On the other hand, the substrate on the substrate fixing device supports the bottom surface of the substrate through the supporting part, and is positioned by the positioning part fitting into the through-hole of the substrate, and the connecting end of the adhesive part is a hook-shaped structure, which can be combined with the fixing colloid to firmly fix the substrate. Since the fixing colloid is in a fluid state before solidification, it is easy to fill the gap between the through-hole and the adhesive portion of the substrate, and adhere to the adhesive portion between the positioning portion and the end portion. After solidification, the fixing colloid can fasten the substrate to the base as a whole through the locking piece, and has sufficient heat resistance to withstand the high-temperature process of multiple reflow soldering. Furthermore, the positioning of the substrate fixing device and the substrate, as well as the filling and curing of the fixing colloid, can all be produced automatically. The stability and high-temperature resistance of the substrate assembly structure can also withstand the high-temperature process of multiple reflow soldering, further realizing the automation process. When the substrate assembly structure is used, for example, to fix a circuit substrate and a heat dissipation base plate, after the circuit substrate and the heat dissipation base plate are fixed, the components can be assembled through the high-temperature process of multiple reflow soldering, thereby increasing the adjustability of the process, simplifying the heat dissipation assembly process, and realizing full process automation, thereby achieving the purpose of reducing product costs and improving product competitiveness.

[0063] The present invention can be modified in various ways by those skilled in the art, but all of these modifications are within the protection scope of the appended claims.

Claims

1. A substrate fixing device, comprising: A base corresponding to a substrate, wherein the substrate includes at least one through-hole, and a first surface and a second surface opposite to each other, the at least one through-hole passes through the first surface and the second surface, and the first surface faces the base; as well as At least one locking member is located on the base and is spatially arranged in a one-to-one correspondence with the at least one through-hole, and each of the at least one locking member includes: a supporting portion disposed on the base and comprising a supporting surface, wherein the supporting portion is connected between the first surface of the substrate and the base, and the supporting surface is in contact with the first surface; a positioning portion, disposed on the supporting surface of the supporting portion and extending along the at least one through-hole; an adhesive portion connected to the positioning portion, the adhesive portion passing through the second surface from one of the at least one through-holes of the substrate, and a gap formed between an outer peripheral wall of the adhesive portion and an inner peripheral wall of the at least one through-hole; an end portion connected to the positioning portion through the adhesive portion and having a contact surface connected to the outer peripheral wall of the adhesive portion, wherein the contact surface and the outer peripheral wall form an angle ranging from 30° to 150°; and A fixed colloid is arranged around the outer peripheral wall of the adhesive portion, connected between the end portion and the positioning portion, covers the outer peripheral portion of the second surface adjacent to the at least one through hole and the contact surface of the end portion, and fills the gap. 2 . The substrate fixing device according to claim 1 , wherein the supporting portion, the positioning portion, the adhesive portion and the end portion are respectively in a column shape, and a cross-sectional shape of the column shape is selected from one of the group consisting of a square, a polygon and a circle. 3 . The substrate fixing device as claimed in claim 2 , wherein a diameter of a circumscribed circle of the supporting portion is larger than a hole diameter of the at least one through hole. 4 . The substrate fixing device according to claim 2 , wherein a diameter of a circumscribed circle of the positioning portion is not larger than a hole diameter of the at least one through hole, and a difference between the hole diameter and the circumscribed circle diameter of the positioning portion is not larger than 0.1 mm. The substrate fixing device as claimed in claim 2 , wherein a diameter of a circumscribed circle of the end portion is not greater than a hole diameter of the at least one through hole. 6 . The substrate fixing device according to claim 2 , wherein a circumscribed circle diameter of the adhesive portion is smaller than a hole diameter of the at least one through hole, and a difference between the hole diameter and the circumscribed circle diameter of the adhesive portion is not less than 0.25 mm. 7 . The substrate fixing device as claimed in claim 1 , wherein the fixing colloid is made of epoxy resin glue. 8 . The substrate fixing device according to claim 1 , wherein the supporting portion, the positioning portion, the adhesive portion, and the end portion are made of a metal material and are integrally formed.

9. A substrate assembly structure, comprising: A substrate comprising at least one through-hole, and a first surface and a second surface opposite to each other, wherein the at least one through-hole passes through the first surface and the second surface; as well as A substrate fixing device comprising: a base, supporting the substrate, with the first surface facing the base; and At least one locking member is located on the base and is spatially arranged in a one-to-one correspondence with the at least one through-hole, and each of the at least one locking member includes: a supporting portion disposed on the base and comprising a supporting surface, wherein the supporting portion is connected between the first surface of the substrate and the base, and the supporting surface is in contact with the first surface; a positioning portion, disposed on the supporting surface of the supporting portion and extending along the at least one through-hole; an adhesive portion connected to the positioning portion, the adhesive portion passing through the second surface from one of the at least one through-holes of the substrate, and a gap formed between an outer peripheral wall of the adhesive portion and an inner peripheral wall of the at least one through-hole; an end portion connected to the positioning portion through the adhesive portion and having a contact surface connected to the outer peripheral wall of the adhesive portion, wherein the contact surface and the outer peripheral wall form an angle ranging from 30° to 150°; and A fixed colloid is arranged around the outer peripheral wall of the adhesive portion, connected between the end portion and the positioning portion, covers the outer peripheral portion of the second surface adjacent to the at least one through hole and the contact surface of the end portion, and fills the gap. 10 . The substrate assembly structure according to claim 9 , wherein the substrate is a circuit substrate, and the base is a heat dissipation device. 11 . The substrate assembly structure according to claim 10 , wherein the circuit substrate has at least one electronic device thereon, and the at least one electronic device is disposed on the circuit substrate by at least one reflow soldering technology. 12 . The substrate assembly structure according to claim 9 , wherein the supporting portion, the positioning portion, the adhesive portion, and the end portion are respectively in a columnar shape, and a cross-sectional shape of the columnar shape is selected from one of the group consisting of a square, a polygon, and a circle. 13 . The substrate assembly structure according to claim 12 , wherein a diameter of a circumscribed circle of the support portion is larger than a hole diameter of the at least one through hole. The substrate assembly structure according to claim 12 , wherein a diameter of a circumscribed circle of the positioning portion is not larger than a hole diameter of the at least one through hole, and a difference between the hole diameter and the diameter of the circumscribed circle of the positioning portion is not larger than 0.1 mm. 15 . The substrate assembly structure as claimed in claim 12 , wherein a diameter of a circumscribed circle of the end portion is not greater than a diameter of the at least one through hole. 16 . The substrate assembly structure according to claim 12 , wherein a circumscribed circle diameter of the adhesive portion is smaller than a hole diameter of the at least one through hole, and a difference between the hole diameter and the circumscribed circle diameter of the adhesive portion is not less than 0.25 mm.

17. The substrate assembly structure as described in claim 9, wherein there is a first height gap between the upper surface of the positioning portion away from the first surface of the substrate and the second surface of the substrate, there is a second height gap between the glue hanging point at the end and the second surface of the substrate, and there is a substrate height between the first surface and the second surface of the substrate, wherein the first height gap is less than the substrate height, and the second height gap is not less than 0.25 mm. 18 . The substrate assembly structure according to claim 9 , wherein the at least one through-hole comprises three through-holes respectively disposed adjacent to corners of the substrate, and the at least one locking member comprises three locking members respectively corresponding to the three through-holes in space.

19. The substrate assembly structure as claimed in claim 9, wherein the fixing colloid is made of epoxy resin glue. 20 . The substrate assembly structure according to claim 9 , wherein the supporting portion, the positioning portion, the adhesive portion, and the end portion are made of a metal material and are integrally formed. 21 . The substrate assembly structure according to claim 20 , wherein the metal material is a steel material or a copper-nickel-plated tin-plated material.

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