A multi-functional integrated radio frequency universal vertical interconnect SoM architecture

Abstract

The application provides a multi-functional comprehensive radio frequency general vertical interconnection SoM architecture, which comprises a multi-functional comprehensive radio frequency general SoM, an interconnection structure and a SoM carrier plate; the multi-functional comprehensive radio frequency general SoM comprises a circuit architecture for radio frequency transceiving and processing; an output end of the multi-functional comprehensive radio frequency general SoM is connected with one end of the interconnection structure; the interconnection structure is an interconnection connector for transmitting radio frequency signals and digital signals; the other end of the interconnection structure is connected with an input end of the SoM carrier plate; and the SoM carrier plate comprises a radio frequency front-end circuit, a debugging connector and a network port. The application can reduce the difficulty of design and integration through the general SoM and the customized SoM carrier plate, meanwhile, the high performance and flexibility of the SoM can be enjoyed, the product life cycle management is facilitated, and the bill of materials (BOM) cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of communication technology, and more specifically to a multifunctional integrated radio frequency universal vertical interconnect SoM architecture. Background Technology

[0002] Typically, SoM (Solar Module) provides various core components of an embedded processing system, such as the processor core, communication interfaces, and memory modules, on a single printed circuit board (PCB). It effectively optimizes the design process and reduces design time for system designers. On the software side, it can process data locally without latency, unleashing the potential of edge computing; on the hardware side, it reduces the difficulty of PCB design and integration while enjoying the high performance and flexibility of FPGAs.

[0003] The current R&D system for integrated radio frequency equipment in China is complex, with different research institutes and even different departments within the same organization using different system solutions, increasing the cost of equipment development. Therefore, designing universal daughter cards with embedded FPGAs, RF transceivers, and other key components during the equipment development process is an effective way to promote rapid equipment upgrades. Summary of the Invention

[0004] This invention aims to address the problem of excessively high development costs caused by repeated production runs due to differences in peripheral interfaces and circuits in traditional integrated RF products. It provides a multi-functional integrated RF universal vertical interconnect SoM architecture, which combines a universal multi-functional integrated RF SoM with user-customized carrier boards to reduce the difficulty of new product development and improve production efficiency.

[0005] This invention provides a multifunctional integrated RF universal vertical interconnect SoM architecture, including a vertically interconnected multifunctional integrated RF universal SoM, an interconnect structure, and a SoM carrier board;

[0006] The multi-functional integrated RF general-purpose SoM includes a circuit architecture for RF transceiver and processing. The output of the multi-functional integrated RF general-purpose SoM is connected to one end of the interconnect structure, which is an interconnect connector that includes RF signal and digital signal transmission. The other end of the interconnect structure is connected to the input of the SoM carrier board. The SoM carrier board includes RF front-end circuitry, debugging connectors, and Ethernet ports.

[0007] The present invention discloses a multifunctional integrated RF universal vertical interconnect SoM architecture. As a preferred embodiment, the multifunctional integrated RF universal SoM includes a basic circuit architecture, and the SoM carrier board includes a customized architecture. The shape of the SoM carrier board can be customized.

[0008] The basic circuit architecture includes: RF channel, PSOC, DDR, Flash, and resistors and capacitors;

[0009] The multifunctional comprehensive radio frequency general SoM is in a power self-closed loop structure, and the multifunctional comprehensive radio frequency general SoM is connected above the SoM carrier board.

[0010] The multifunctional comprehensive radio frequency general SoM includes a radio frequency unit, a clock unit, a processing unit, a power module, a storage unit and a SoM printed board.

[0011] The output end of the radio frequency unit is connected with the interconnection structure and the SoM carrier board.

[0012] The clock unit provides working clock for the radio frequency unit and the processing unit.

[0013] The multifunctional comprehensive radio frequency general SoM includes a radio frequency unit, a clock unit, a processing unit, a power module, a storage unit and a SoM printed board.

[0014] The clock unit includes external reference clock enable control and / or internal reference clock enable control.

[0015] The multifunctional comprehensive radio frequency general SoM includes a radio frequency unit, a clock unit, a processing unit, a power module, a storage unit and a SoM printed board.

[0016] The multifunctional comprehensive radio frequency general SoM includes a radio frequency unit, a clock unit, a processing unit, a power module, a storage unit and a SoM printed board.

[0017] The SoM printed board is a 14-layer structure printed board prepared by using a mixed pressure process.

[0018] Part of the surface of the radio frequency wiring of the SoM printed board is exposed to half-closed copper skin to provide a basis for isolation cavity design.

[0019] The SoM printed board is provided with a fixing hole for fixed connection with the SoM carrier board.

[0020] The multifunctional comprehensive radio frequency general vertical interconnection SoM architecture comprises a balun and an attenuation circuit connected to a SoM printed board.

[0021] The multifunctional comprehensive radio frequency general vertical interconnection SoM architecture comprises a high-frequency connector as the interconnection structure, which is used for radio frequency signal interconnection, Serdes signal interconnection and control signal interconnection, and can be used for transmission of radio frequency signals of not less than 8GHz and transmission of digital signals of not less than 12.5Gbps, the pins of the interconnection structure comprise high-speed digital signal pins, radio frequency signal pins and ground pins, the ground pins are arranged between the high-speed digital signal pins and the radio frequency signal pins to achieve isolation, and the transceiving channels are arranged on both sides of the connector of the interconnection structure to enhance the isolation between the transceiving signals.

[0022] The multifunctional comprehensive radio frequency general vertical interconnection SoM architecture comprises a high-frequency connector as the interconnection structure, which is used for radio frequency signal interconnection, Serdes signal interconnection and control signal interconnection, and can be used for transmission of radio frequency signals of not less than 8GHz and transmission of digital signals of not less than 12.5Gbps, the pins of the interconnection structure comprise high-speed digital signal pins, radio frequency signal pins and ground pins, the ground pins are arranged between the high-speed digital signal pins and the radio frequency signal pins to achieve isolation, and the transceiving channels are arranged on both sides of the connector of the interconnection structure to enhance the isolation between the transceiving signals.

[0023] The multifunctional comprehensive radio frequency general vertical interconnection SoM architecture comprises a high-frequency connector as the interconnection structure, which is used for radio frequency signal interconnection, Serdes signal interconnection and control signal interconnection, and can be used for transmission of radio frequency signals of not less than 8GHz and transmission of digital signals of not less than 12.5Gbps, the pins of the interconnection structure comprise high-speed digital signal pins, radio frequency signal pins and ground pins, the ground pins are arranged between the high-speed digital signal pins and the radio frequency signal pins to achieve isolation, and the transceiving channels are arranged on both sides of the connector of the interconnection structure to enhance the isolation between the transceiving signals.

[0024] The technical scheme of the present application is a multifunctional comprehensive radio frequency general vertical interconnection SoM architecture, which comprises a multifunctional comprehensive radio frequency general SoM, an interconnection structure and a SoM carrier board.

[0025] The present application has the following advantages:

[0026] (1) The application designs a multifunctional comprehensive radio frequency general vertical interconnection SoM architecture, which can realize various comprehensive radio frequency application functions by matching the user customized carrier board with the general multifunctional comprehensive radio frequency SoM, greatly improves the flexibility and scalability of the product, and reduces the research and development and material costs.

[0027] (2) The application integrates nearly 400 devices such as radio frequency channels, PSOCs, DDRs, Flash and resistors and capacitors on a 60cm*80cm single printed board (PCB), and realizes the main functions of the original single board level comprehensive electronic system with less than 200 devices on the customized carrier board, so that the design workload is reduced by 2 / 3.

[0028] (3) The application directly leads out the radio frequency channel to the high frequency connector on the multifunctional comprehensive radio frequency SoM, maintains the radio frequency broadband characteristics of the SoM, and the required balun and filter structure bandwidth of the user can be designed on demand on the carrier board, which effectively improves the application flexibility of the SoM

[0029] (4) The application selects a mixed pressure process to ensure the performance of multiple radio frequency channels while considering the cost, uses high frequency board materials on the top and bottom layers of the PCB to ensure the performance of radio frequency and Serdes, and selects different board materials in the middle layer to reduce the cost. In order to further enhance the radio frequency wiring isolation, the surface copper exposure method is used to provide a basis for the design of the isolation cavity.

[0030] (5) The interconnection structure of the application selects a high frequency connector to meet the transmission requirements of 8GHz radio frequency signals and 12.5Gbps digital signals. In the signal arrangement design of the interconnection structure, isolation design is made between all radio frequency and high speed digital signals to reduce mutual crosstalk and ensure signal quality.

[0031] (6) The application designs a basic carrier board, which includes radio frequency, debugging, network port and the like of the user using the general SoM. In order to ensure the connection reliability, the general SoM is mounted on the basic carrier board, and the four corner fixing holes are reinforced with screws to meet the needs of various users. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is a schematic diagram of the multifunctional comprehensive radio frequency general vertical interconnection SoM architecture;

[0033] Figure 2 It is a front view of the multifunctional comprehensive radio frequency general SoM of the multifunctional comprehensive radio frequency general vertical interconnection SoM architecture;

[0034] Figure 3 It is a printed board structure diagram of the multifunctional comprehensive radio frequency general vertical interconnection SoM architecture;

[0035] Figure 4aa) is a schematic diagram of the design stack-up of a multifunctional integrated RF universal vertical interconnect SoM architecture;

[0036] Figure 4b b is a schematic diagram of the design stack-up of a multifunctional integrated RF universal vertical interconnect SoM architecture.

[0037] Figure label:

[0038] 100. Multifunctional Integrated RF General Purpose SoM; 101. RF Unit; 102. Clock Unit; 103. Processing Unit; 104. Power Module; 105. Storage Unit; 106. SoM Printed Circuit Board; 107. Balun; 108. Attenuation Circuit; 200. Interconnect Structure; 300. SoM Carrier Board; 301. Ethernet Port; 302. RF Circuit; 303. Channel; 304. Power Supply; 305. Debug Interface; 306. Basic Carrier Board Body. Detailed Implementation

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0040] Example 1

[0041] like Figure 1 As shown in Figure 4, a multifunctional integrated RF universal vertical interconnect SoM architecture includes a vertically interconnected multifunctional integrated RF universal SoM100, an interconnect structure 200, and a SoM carrier board 300.

[0042] The multi-functional integrated RF general purpose SoM100 includes a circuit architecture for RF transceiver and processing. The output of the multi-functional integrated RF general purpose SoM100 is connected to one end of the interconnect structure 200, which is an interconnect connector that includes RF signal and digital signal transmission. The other end of the interconnect structure 200 is connected to the input of the SoM carrier board 300, which includes RF front-end circuitry, debugging connectors, and Ethernet ports.

[0043] The multi-functional integrated RF general-purpose SoM100 includes a basic circuit architecture, while the SoM carrier board 300 includes a customized architecture, and the form factor of the SoM carrier board 300 can be customized.

[0044] The basic circuit architecture includes: RF channel, PSOC, DDR, Flash, and resistors and capacitors;

[0045] The multi-functional integrated RF general purpose SoM100 has a power self-closed loop structure and is connected to the top of the SoM carrier board 300.

[0046] The multifunctional comprehensive radio frequency general SoM 100 comprises a radio frequency unit 101, a clock unit 102, a processing unit 103, a power module 104, a storage unit 105, a SoM printed board 106, a balun 107 and an attenuation circuit 108, and the radio frequency unit 101, the clock unit 102, the processing unit 103, the power module 104, the storage unit 105, the balun 107 and the attenuation circuit 108 are arranged on the front surface of the SoM printed board 106;

[0047] The output end of the radio frequency unit 101 is connected with the SoM carrier board 300 through the interconnection structure 200; when a radio frequency signal is received, the radio frequency signal is output to the radio frequency unit 101 through the interconnection structure 200 for amplification, filtering, demodulation, frequency conversion and DAC, and then output to the processing unit 103 for data processing; when a radio frequency signal is transmitted, the processing unit 103 provides configuration information to control the radio frequency unit 101 to generate a transmission signal which is output to the SoM carrier board 300 through the interconnection structure 200;

[0048] The clock unit 102 provides working clock for the radio frequency unit 101 and the processing unit 103;

[0049] The output end of the radio frequency unit 101 is connected with the interconnection structure 200 through the GCPW differential microstrip line;

[0050] The clock unit 102 generates a clock signal through a low-temperature drift 40MHz crystal oscillator and provides working clock for the radio frequency unit 101 and the processing unit 103 through a clock splitter, and the clock unit 102 comprises external reference clock enable control and / or internal reference clock enable control;

[0051] The power module 104 comprises at least two power supplies;

[0052] The front surface of the SoM printed board 106 is provided with a radio frequency chip, a PSOC chip, a DDR chip and a Flash chip, and the back surface of the SoM printed board 106 is provided with a capacitor and a resistor and connected with the interconnection structure 200;

[0053] As shown in Figure 3 The SoM printed board 106 is a 14-layer structure printed board prepared by using a mixed pressing process, the top layer and the bottom layer of the SoM printed board 106 are RO4350B radio frequency board materials used for radio frequency and high-speed signal wiring, and the middle layer is S1000-2 used for control and low-speed signal wiring;

[0054] Part of the surface of the radio frequency wiring of the SoM printed board 106 is exposed to half-closed copper skin to provide a basis for isolation cavity design;

[0055] The SoM printed board 106 is provided with a fixing hole used for fixed connection with the SoM carrier board 300;

[0056] The multi-functional integrated RF general purpose SoM100 also includes connections on the SoM printed circuit board 106;

[0057] Interconnection structure 200 is a high-frequency connector. Interconnection structure 200 performs radio frequency signal interconnection, SerDes signal interconnection and control signal interconnection. Interconnection structure 200 can transmit radio frequency signals of not less than 8 GHz and digital signals of not less than 12.5 Gbps. The pins of interconnection structure 200 include high-speed digital signal pins, radio frequency signal pins and ground pins. The ground pin is set on the high-speed digital signal pins and radio frequency signal pins for isolation. The transmit and receive channels are arranged on both sides of the interconnection structure connector to enhance the isolation between transmit and receive signals.

[0058] SoM carrier board 300 includes: network port 301, radio frequency circuit 302, channel 303, power supply 304, debugging interface 305 and base carrier board body 306. The base carrier board body 306 is manufactured using a mixed pressing process. The back of the multi-functional integrated radio frequency general SoM100 is fixed to the upper part of the base carrier board body 306 by screws.

[0059] Network port 301, power supply 304, debugging interface 305 and interconnect structure 200 are all connected above the base carrier board body 306, while radio frequency circuit 302 and channel 303 are all connected below the base carrier board body 306.

[0060] Example 2

[0061] like Figure 1 As shown in Figure 4, a multifunctional integrated RF universal vertical interconnect SoM architecture includes a multifunctional integrated RF universal SoM100, an interconnect structure 200, and a SoM carrier board 300. Specifically: the multifunctional integrated RF universal SoM100 includes an RF unit 101, a clock 102, a processing unit 103, a power supply 104, and a storage unit 105, covering the common circuit architecture for RF transceiver and processing in integrated RF applications, and implementing a self-closed-loop power supply on the SoM; the interconnect structure 200 includes interconnects for RF, SerDes, and control signals, meeting the transmission requirements of RF signals no lower than 8GHz and digital signals no lower than 12.5Gbps; the SoM carrier board 300 includes a network port 301, RF circuitry 302, channels 303, a power supply 304, and a debugging interface 305, and the channel architecture and carrier board shape can be customized according to specific user needs to meet diverse requirements.

[0062] The radio frequency (RF) unit 101 is interconnected with the interconnection structure 200 and the processing unit 103. During reception, the RF signal is transmitted through the interconnection structure 200 to the RF unit 101, where it undergoes amplification, filtering, demodulation, frequency conversion, and DAC processing before being transmitted to the processing unit 103 for data processing. During transmission, the processing unit 103 provides configuration information to control the RF unit 101 to generate a transmission signal that is transmitted through the interconnection structure 200.

[0063] Clock 102 unit is generated by low temperature drift 40MHz crystal oscillator, through clock divider, respectively for the program part and logic part of processing unit 103 and radio frequency unit 101 provide working clock. At the same time support external reference clock and internal reference clock enable control.

[0064] Power supply 104 module is provided by two pieces of LTM4644 chip digital part and interface power supply, using 3 pieces of TPS74401 for the requirement of higher analog power supply, 1 piece of TPS51200 for the end of storage 105 unit power supply.

[0065] SoM100 in 60cm×80cm single block printed board PCB on the front side of the radio frequency, PSOC, DDR, Flash and other chips, back tightly placed connector, 0603 and below the package of resistance and capacitance, completed nearly 400 devices dense design, with less than 200 devices on the customized carrier board to realize the main function of the original single board level integrated electronic system, reduce the design workload by 2 / 3. At the same time, 10 radio frequency transceiver channels are directly introduced to the high frequency connector through GCPW differential microstrip line, which maintains the radio frequency wide characteristics of SoM not less than 8GHz, and the user required balun, filter and other structure bandwidth can be designed on demand on the carrier board, which effectively improves the application flexibility of SoM.

[0066] As shown in Figure 3 To ensure the quality of radio frequency and high-speed digital signal, the PCB adopts mixed voltage process 14 layer structure, the total thickness is 1.8mm. The top and bottom layers are selected as RO4350B radio frequency board material for radio frequency and high-speed signal wiring, and the middle layer is selected as S1000-2 for control and low-speed signal wiring, so as to reduce the cost of product. The surface of the radio frequency wiring part is exposed semi-closed copper skin to provide basis for the design of isolation cavity. Six fixing holes with diameter of 3.5mm are reserved in the whole plate for the fixed connection between SoM and carrier board.

[0067] The interconnection structure 200 selects high-speed interconnection connector, which meets the transmission requirements of 8GHz radio frequency signal and 12.5Gbps digital signal. In the pin design, all high-speed digital signal and radio frequency signal pins are isolated by ground pins, and the transmit and receive channels are arranged on both sides of the connector, so as to enhance the isolation degree between transmit and receive signals.

[0068] The basic carrier board design also adopts mixed voltage process, with size of 120mm×140mm and thickness of 2.5mm. It contains the radio frequency front-end circuit of user's general SoM, debugging connector, network port and other basic units, which is convenient for user to develop and verify;

[0069] The laminated design is shown in Figures 4a-4b

[0070] ​The above merely describes preferred specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art, according to the technical solution and inventive concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A multi-function, integrated radio frequency general purpose vertical interconnect SoM architecture, characterized by: The multifunctional comprehensive radio frequency general SoM (100), an interconnection structure (200), and a SoM carrier board (300) are vertically interconnected; The multifunctional comprehensive radio frequency general SoM (100) comprises a radio frequency transceiving and processing circuit architecture, the output end of the multifunctional comprehensive radio frequency general SoM (100) is connected to one end of the interconnection structure (200), the interconnection structure (200) is an interconnection connector comprising radio frequency signal and digital signal transmission, the other end of the interconnection structure (200) is connected to the input end of the SoM carrier board (300), and the SoM carrier board (300) comprises a radio frequency front-end circuit, a debugging connector, and a network port. The multifunctional comprehensive radio frequency general SoM (100) comprises a basic circuit architecture, and the SoM carrier board (300) comprises a customized architecture, and the shape of the SoM carrier board (300) is customizable. The basic circuit architecture comprises a radio frequency channel, a PSOC, a DDR, a Flash, and a resistance-capacitance. The multifunctional comprehensive radio frequency general SoM (100) is a power self-closing loop structure, and the multifunctional comprehensive radio frequency general SoM (100) is connected above the SoM carrier board (300).

2. The multi-functional integrated RF general purpose vertical interconnect SoM architecture of claim 1, wherein: The multifunctional comprehensive radio frequency general SoM (100) comprises a radio frequency unit (101), a clock unit (102), a processing unit (103), a power module (104), a storage unit (105), and a SoM printed board (106), and the radio frequency unit (101), the clock unit (102), the processing unit (103), the power module (104), and the storage unit (105) are arranged on the front surface of the SoM printed board (106). The output end of the radio frequency unit (101) is interconnected with the SoM carrier board (300) through the interconnection structure (200); when a radio frequency signal is received, the radio frequency signal is output to the radio frequency unit (101) through the interconnection structure (200) for amplification, filtering, demodulation, frequency conversion, and DAC, and then output to the processing unit (103) for data processing; when a radio frequency signal is transmitted, the processing unit (103) provides configuration information to control the radio frequency unit (101) to generate a transmission signal, which is output to the SoM carrier board (300) through the interconnection structure (200); The clock unit (102) provides working clock for the radio frequency unit (101) and the processing unit (103).

3. The multifunctional comprehensive radio frequency general vertically interconnected SoM architecture according to claim 2, wherein: The output end of the radio frequency unit (101) is connected to the interconnection structure (200) through a GCPW differential microstrip line; The clock unit (102) generates a clock signal through a low-temperature drift 40MHz crystal oscillator and then provides working clock for the radio frequency unit (101) and the processing unit (103) through a clock splitter, and the clock unit (102) comprises external reference clock enabling control and / or internal reference clock enabling control.

4. The multi-functional integrated RF general purpose vertical interconnect SoM architecture of claim 2, wherein: The power module (104) comprises at least two power supplies.

5. The multi-functional integrated RF general purpose vertical interconnect SoM architecture of claim 2, wherein: The front of the SoM printed board (106) is provided with a radio frequency chip, a PSOC chip, a DDR chip and a Flash chip, and the back of the SoM printed board (106) is provided with a capacitor, a resistor and is connected with the interconnection structure (200); The SoM printed board (106) is a 14-layer structure printed board prepared by using a mixed pressing process, the top layer and the bottom layer of the SoM printed board (106) are RO4350B radio frequency board materials used for radio frequency and high-speed signal wiring, and the middle layer is S1000-2 used for control and low-speed signal wiring; Part of the surface of the radio frequency wiring of the SoM printed board (106) is exposed to half-closed copper skin to provide a basis for isolation cavity design; The SoM printed board (106) is provided with a fixing hole for fixed connection with the SoM carrier board (300).

6. The multi-functional integrated RF general purpose vertical interconnect SoM architecture of claim 2, wherein: The multifunctional comprehensive radio frequency general SoM (100) further comprises a balun (107) and an attenuation circuit (108) connected to the SoM printed board (106).

7. The multi-functional integrated RF general purpose vertical interconnect SoM architecture of claim 1, wherein: The interconnection structure (200) is a high-frequency connector, the interconnection structure (200) performs radio frequency signal interconnection, Serdes signal interconnection and control signal interconnection, the interconnection structure (200) can perform transmission of radio frequency signals not lower than 8GHz and transmission of digital signals not lower than 12.5Gbps, the pins of the interconnection structure (200) include high-speed digital signal pins, radio frequency signal pins and ground pins, the ground pins are arranged between the high-speed digital signal pins and the radio frequency signal pins to perform isolation, and the transceiving channels are arranged on both sides of the interconnection structure connector to enhance the isolation degree between the transceiving signals.

8. The multi-functional integrated RF general purpose vertical interconnect SoM architecture of claim 1, wherein: The SoM carrier board (300) comprises a network port (301), a radio frequency circuit (302), a channel (303), a power supply (304), a debugging interface (305) and a basic carrier board body (306), the basic carrier board body (306) is prepared by using a mixed pressing process, and the back of the multifunctional comprehensive radio frequency general SoM (100) is fixed on the upper part of the basic carrier board body (306) by screws.

9. The multi-functional integrated RF general purpose vertical interconnect SoM architecture of claim 8, wherein: The network port (301), the power supply (304), the debugging interface (305) and the interconnection structure (200) are connected above the basic carrier board body (306), and the radio frequency circuit (302) and the channel (303) are connected below the basic carrier board body (306).

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