MOSFET heat sinks and electronic equipment

Abstract

This application discloses a MOSFET heat sink and an electronic device. The MOSFET heat sink includes a heat sink body and a lead portion. The lead portion is used to connect the MOSFET heat sink to the circuit board through lead holes on the circuit board. The MOSFET heat sink has a first heat insulation hole that penetrates the MOSFET heat sink along the thickness direction of the heat sink body. The first heat insulation hole is located on the lead portion; or the first heat insulation hole is located on the heat sink body and is close to the lead portion; or the first heat insulation hole is located at the connection between the lead portion and the heat sink body. The MOSFET heat sink provided by this application can effectively eliminate soldering defects, improve the yield of circuit boards and electronic products, and reduce material and labor costs.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a MOSFET heat sink and electronic equipment. Background Technology

[0002] In the manufacturing process of electronic devices, wave soldering is often used to solder components to circuit boards. Wave soldering involves directly contacting the soldering surface of the component board with high-temperature liquid solder to achieve the soldering purpose. During the soldering process, the high-temperature liquid solder is maintained at an angle, and a special device makes the liquid solder form waves, hence the name "wave soldering". Its main material is solder bar.

[0003] When soldering heat sinks for MOSFETs onto circuit boards inside electronic devices, wave soldering is often used to solder the pins of the MOSFET heat sinks onto the circuit board. However, when soldering the pins to the circuit board using wave soldering, solder bridging often occurs at the pins.

[0004] Soldering can create solder spikes at the solder joint, which may puncture the insulation between the solder pad and the metal casing, causing a short circuit and arcing. On the other hand, soldering not only wastes solder, but the resulting solder ball also contains air bubbles, resulting in poor solder absorption and hidden defects. This wastes manpower to rework the solder joints of the pins, reducing production efficiency.

[0005] Application content

[0006] The main purpose of this application is to provide a MOSFET heat sink and electronic device, which aims to solve the technical problem of solder entrapment when the MOSFET heat sink and the circuit board are connected by wave soldering in the prior art.

[0007] This application proposes a MOSFET heat sink, including a heat sink body and a pin portion. The pin portion is used to connect the MOSFET heat sink to the circuit board through pin holes on the circuit board. The MOSFET heat sink has a first heat insulation hole, which penetrates the MOSFET heat sink along the thickness direction of the heat sink body.

[0008] Wherein, the first heat insulation hole is disposed on the pin portion; or

[0009] The first heat insulation hole is disposed on the heat sink body, and the first heat insulation hole is close to the pin portion; or

[0010] The first heat insulation hole is located at the connection between the pin portion and the heat sink body.

[0011] This application also provides an electronic device, including the above-mentioned MOS transistor heat sink and circuit board, wherein the MOS transistor heat sink is disposed on the circuit board, and the circuit board is provided with pin holes that cooperate with and connect to the pin portion.

[0012] This application discloses a MOSFET heat sink and an electronic device. The MOSFET heat sink includes a heat sink body and a lead portion. The lead portion is used to connect the MOSFET heat sink to the circuit board through lead holes on the circuit board. The MOSFET heat sink has a first heat insulation hole that penetrates the MOSFET heat sink along the thickness direction of the heat sink body. The first heat insulation hole is disposed on the lead portion; or, the first heat insulation hole is disposed on the heat sink body near the lead portion; or the first heat insulation hole is disposed at the connection between the lead portion and the heat sink body. Through the above configuration, the thermal conductivity between the lead portion and the heat sink body is reduced during soldering, that is, the heat dissipation efficiency at the solder joint of the lead portion is reduced. This avoids the solder melt from cooling prematurely and forming a solder slag due to excessive heat dissipation at the solder joint, effectively preventing the formation of a solder slag, improving the yield of circuit boards and electronic products, and reducing material and labor costs. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of one embodiment of the heat sink for the MOSFET in this application;

[0015] Figure 2 This is a schematic diagram of another embodiment of the heat sink for the MOSFET in this application;

[0016] Figure 3 This is a schematic diagram of another embodiment of the heat sink for the MOSFET in this application;

[0017] Figure 4 This is a schematic diagram showing the parameter markings of the first heat insulation hole in one embodiment of the MOS transistor heat sink of this application;

[0018] Figure 5 This is a schematic diagram of another embodiment of the heat sink for the MOS transistor in this application;

[0019] Figure 6 This is a schematic diagram of another embodiment of the heat sink for the MOSFET in this application;

[0020] Figure 7 This is a schematic diagram of yet another embodiment of the heat sink for the MOSFET in this application;

[0021] Figure 8 This is a three-dimensional structural diagram of the circuit board of this application.

[0022] Explanation of reference numerals in the attached figures:

[0023] 10. MOSFET heat sink; 20. Circuit board.

[0024] 100, Heat sink body; 101, Contact area; 200, Pin portion; 201, First pin portion; 202, Second pin portion; 300, First heat insulation hole; 301, First target heat insulation hole; 302, Second target heat insulation hole; 400, Second heat insulation hole. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0026] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0027] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0029] In existing technologies, wave soldering is typically used to solder the leads of a heatsink to the pin holes of a circuit board to connect the heatsink and the circuit board. One main reason for the solder joint enlargement is that the copper foil at the heatsink leads is relatively large, resulting in faster heat dissipation and causing the solder at the solder joint to cool prematurely and form an enlargement. Another main reason is that the heat at the solder joint is conducted to the heatsink through the leads, increasing the heat dissipation rate at the solder joint and causing the solder to cool prematurely and form an enlargement.

[0030] The formation of solder bridging not only wastes solder, forms solder spikes, and punctures the insulation between the solder pad and the metal casing, causing short circuits and arcing; at the same time, the solder bridging contains air bubbles and has poor soldering inside, which is defective and requires labor to rework and modify the soldering of the pins.

[0031] like Figure 1 , Figure 2 , Figure 3 as well as Figure 4 As shown, this application provides a MOSFET heat sink 10, which includes a heat sink body 100 and a lead portion 200. The lead portion 200 is used to connect the MOSFET heat sink to the circuit board through lead holes on the circuit board. The MOSFET heat sink 10 has a first heat insulation hole 300, which penetrates the MOSFET heat sink 10 along the thickness direction of the heat sink body 100.

[0032] It should be noted that the first heat insulation hole 300 can penetrate the MOSFET heat sink 10 perpendicularly along the thickness direction of the heat sink body 100, or it can penetrate the MOSFET heat sink 10 obliquely along the thickness direction of the heat sink body 100.

[0033] In this embodiment, the specific number of pin portions 200 can be set according to actual needs. When there are multiple pin portions 200, the pin portions 200 can all be arranged on the same side of the heat sink body 100, or they can be arranged on opposite sides of the heat sink body 100.

[0034] In some embodiments, the heat sink body 100 may have a connection hole, through which the MOSFET can be connected to the MOSFET heat sink 10 so that the MOSFET can dissipate heat through the MOSFET heat sink 10 during operation.

[0035] As one embodiment, the first heat insulation holes 300 can be entirely disposed on the pin portion 200, as detailed in the following document. Figure 1Therefore, by setting the first heat insulation hole 300 in the pin portion 200, the heat conduction path from the pin portion 200 to the heat sink body 100 can be reduced, thereby reducing the heat dissipation effect of the heat sink body 100 on the solder joint of the pin portion 200, thus preventing the solder liquid from condensing too early and forming a solder ring at the solder joint.

[0036] In another embodiment, the first heat insulation holes 300 can also be entirely disposed on the heat sink body 100. More specifically, the first heat insulation holes 300 can be disposed on the heat sink body 100 near the pin portion 200. For details, please refer to [reference needed]. Figure 3 Therefore, by setting the first heat insulation hole 300 on the heat sink body 100, the heat dissipation area of ​​the heat sink body 100 is reduced, thereby reducing the heat dissipation effect of the heat sink body 100 on the solder joint of the pin portion 200, thus preventing the solder liquid from condensing too early and forming a blister at the solder joint.

[0037] Furthermore, as another embodiment, the first heat insulation hole 300 can also be provided at the connection between the pin portion 200 and the heat sink body 100, as detailed in the following document. Figure 2 This not only reduces the heat dissipation area of ​​the heat sink body 100, but also reduces the heat conduction path from the pin portion 200 to the heat sink body 100, thereby better reducing the heat dissipation effect of the heat sink body 100 on the solder joint of the pin portion 200, and thus more effectively preventing the solder liquid from condensing too early and forming a solder ring at the solder joint.

[0038] In some embodiments, the heat sink body 100 and the pin portion 200 may be integrally formed or separately formed. When the heat sink body 100 and the pin portion 200 are integrally formed, the end of the pin portion 200 is directly connected to the side of the heat sink body 100, that is, the pin portion 200 is the part of the heat sink body 100 that protrudes from the side.

[0039] In some embodiments, when the heat sink body 100 and the pin portion 200 are separately disposed, refer to Figure 4 The pin portion 200 is fixed to the side of the heat sink body 100, and a portion of the pin portion 200 is disposed inside the side of the heat sink body 100, meaning that a portion of the pin portion 200 and the heat sink body 100 have overlapping contact areas. The fixing can be any of the following connection methods: riveting, pressing, die casting, embedding, and welding. The heat sink body 100 has a contact area 101 that contacts the pin portion, and a first heat insulation hole 300 is disposed in this contact area 101.

[0040] It should be noted that the contact area 101 is the connection point when the heat sink body 100 and the pin portion 200 are fixed together, that is, the contact area 101 is the part of the pin portion 200 that is fixed to the heat sink body 100.

[0041] It is understandable that by placing the first heat insulation hole 300 in the contact area 101 between the two, the heat conduction path between the pin portion 200 and the heat sink body 100 can be reduced, while the heat dissipation area of ​​the pin portion 200 itself can be further reduced, the heat dissipation efficiency of the solder liquid at the solder of the pin portion can be reduced, and the solder liquid at the solder of the pin portion can be prevented from condensing too early and causing solder clogging.

[0042] By implementing the above settings, the solder at the pin 200 solder joint can be prevented from cooling prematurely and forming a solder rim, effectively avoiding solder rim formation, improving the yield of circuit boards and electronic products, and reducing material and labor costs.

[0043] It is understood that the shape of the first heat insulation hole 300 can be, for example, a square hole, an elongated hole, a round hole, or an irregularly shaped hole, and the embodiments of this application do not limit this.

[0044] Furthermore, to further reduce the heat dissipation rate of the solder at the solder joint, in some embodiments, the heat sink body 100 and the lead portion 200 may be made of materials with different thermal conductivity rates. Specifically, the heat sink body 100 is made of a first material, and the lead portion 200 is made of a second material, wherein the thermal conductivity rate of the first material is greater than that of the second material.

[0045] It should be noted that the heat sink body 100 made of the first material and the pin portion 200 made of the second material can be separate or integrated.

[0046] Understandably, to ensure the heat dissipation effect of the MOSFET heatsink 10 on the MOSFET, the heatsink body 100 needs to have excellent thermal conductivity to quickly absorb and dissipate the heat generated by the MOSFET. To avoid solder bridging at the lead portion 200, its heat dissipation rate needs to be reduced. Therefore, a material with low thermal conductivity can be used to reduce the rate at which heat is conducted from the solder to the heatsink body 100, thereby reducing the cooling rate of the solder.

[0047] In some embodiments, the first material of the heat sink body 100 can be copper, and the second material of the pin portion 200 can be a metal material with a lower thermal conductivity than copper, such as aluminum or iron.

[0048] In some embodiments, a first heat insulation hole 300 is provided on the MOSFET heat sink made of two materials. The first heat insulation hole 300 may be provided on the heat sink body 100 made of the first material. The first heat insulation hole 300 may also be provided on the lead portion 200 made of the second material. The first heat insulation hole 300 may also be provided on both the heat sink body 100 and the lead portion 200.

[0049] It is understood that the heat sink for the MOSFET made of the two materials described above can adopt any of the aforementioned embodiments of the first heat insulation hole 300 or the second heat insulation hole 400. By using two materials to make the heat sink for the MOSFET, the heat dissipation rate at the solder joint of the pin portion 200 is reduced. Furthermore, the first heat insulation hole 300 can further reduce the heat dissipation rate at the solder joint of the pin portion 200, thereby eliminating the solder clogging phenomenon caused by soldering.

[0050] In this embodiment, to ensure that the first heat insulation hole 300 can effectively reduce the condensation rate of the solder liquid at the solder joint on the pin portion 200, when the first heat insulation hole 300 is opened, the distance between the two ends of the first heat insulation hole 300 (i.e., the length between the upper and lower ends of the first heat insulation hole 300) is usually set to be greater than or equal to the sum of the lower foot elevation height of the pin portion 200 and the thickness of the heat sink body 100. At the same time, in order to prevent the pin portion 200 from easily breaking, the lower foot width of the pin portion 200 is usually set to be greater than or equal to three times the thickness of the heat sink body 100.

[0051] In this embodiment, the opening area of ​​the first heat insulation hole 300 can be determined based on the lower foot elevation height of the pin portion 200 and the thickness of the heat sink body 100. It should be noted that the pin portion 200 includes a first protrusion protruding relative to the heat sink body 100, and the first protrusion has a second protrusion protruding relative to the first protrusion. The lower foot portion is the first protrusion, and the lower foot elevation height is the protrusion length of the first protrusion relative to the side of the heat sink body 100.

[0052] Please refer to the following: Figure 5 Furthermore, the pin portion 200 may include a first pin portion 201 and a second pin portion 202 spaced apart on the side of the heat sink body 100. The first pin portion 201 is connected to the side near the end of the side. The second pin portion 202 is connected to the side further away from the end of the side than the first pin portion 201. That is, the pin portion located on the side of the heat sink body 100 is the first pin portion 201, and the pin portion located on the heat sink body 100 further away from the side than the first pin portion 201 is the second pin portion 202.

[0053] In some embodiments, the first heat insulation hole 300 includes a first target heat insulation hole 301 and a second target heat insulation hole 302. The first target heat insulation hole 301 is disposed at the connection between the first pin portion 201 and the heat sink body 100, and the second target heat insulation hole 302 is disposed at the connection between the second pin portion 202 and the heat sink body 100. It should be noted that... Figure 5The placement of the first target heat insulation hole 301 and the second target heat insulation hole 302 is only one example. In other embodiments, the first target heat insulation hole 301 may also be placed on the first pin portion 201, or on the heat sink body 100 and close to the first pin portion 201; similarly, the second target heat insulation hole 302 may also be placed on the second pin portion 202, or on the heat sink body 100 and close to the second pin portion 202.

[0054] In some embodiments, since the end of the first pin portion 201 near the side, i.e., the heat diffusion angle of the heat sink body 100 corresponding to the first pin portion 201 is smaller than that of the heat sink body 100 corresponding to the first pin portion 201, the heat conduction path that needs to be reduced on the first pin portion 201 is equivalent to the heat conduction path that needs to be reduced on the second pin portion 202. Therefore, in order to ensure that the condensation rate of the solder liquid at the solder joints on the first pin portion 201 and the second pin portion 202 is as similar as possible, and to prevent the solder liquid at the solder joints on the second pin portion 202 from condensing earlier than the solder liquid at the solder joints on the first pin portion 201, the first heat insulation hole 300 on the first pin portion 201 can be relatively smaller than the first heat insulation hole 300 on the second pin portion 202; that is, the opening area of ​​the first target heat insulation hole 301 on the first pin portion 201 is smaller than the opening area of ​​the second target heat insulation hole 302 on the second pin portion 202.

[0055] In some embodiments, the shapes of the first heat insulation holes 300 formed on the first pin portion 201 and the second pin portion 202 may be different. For example, such as... Figure 5 As shown, the first heat insulation hole 300 on the first pin portion 201 is an elongated hole, and the first heat insulation hole 300 on the second pin portion 202 is a "T" shaped hole.

[0056] In other embodiments, the first heat insulation holes 300 on the first pin portion 201 and the second pin portion 202 have the same shape, for example, they can both be round holes.

[0057] Understandably, to eliminate solder bridging, it is necessary to minimize the heat dissipation rate of the solder at the solder joint. Therefore, the opening area of ​​the first heat insulation hole 300 can be appropriately increased to reduce the heat dissipation area of ​​the lead portion 200 and the heat conduction path between the lead portion 200 and the heat sink body 100. Thus, in some embodiments, the opening area of ​​the first heat insulation hole 300 near the heat sink body 100 is larger than the opening area of ​​the first heat insulation hole 300 near the solder joint, thereby forming an irregularly shaped hole, such as a "T"-shaped hole.

[0058] In one embodiment, when the first heat insulation hole 300 is provided at the connection between the pin portion 200 and the heat sink body 100, in order to ensure that the first heat insulation hole 300 can effectively reduce the condensation rate of the solder liquid at the solder joint on the pin portion 200 and avoid forming a solder rim at the solder joint, the opening area S1 of the first target heat insulation hole 301 opened on the first pin portion 201 is greater than or equal to (the lower foot elevation height of the first pin portion 201 × the thickness of the heat sink body 100) + (the thickness of the heat sink body 100 × the thickness of the heat sink body 100); the opening area S2 of the second target heat insulation hole 302 opened on the second pin portion 202 is greater than or equal to (the lower foot elevation height of the second pin portion 202 × the thickness of the heat sink body 100) + (5 × the thickness of the heat sink body 100 × the thickness of the heat sink body 100).

[0059] For example, when the first heat insulation hole 300 is disposed at the connection between the pin portion 200 and the heat sink body 100, that is, when the first target heat insulation hole 301 is disposed at the connection between the first pin portion 201 and the heat sink body 100, and the second target heat insulation hole 302 is disposed at the connection between the second pin portion 202 and the heat sink body 100, as... Figure 6 As shown, the first target heat insulation hole 301 on the first pin portion 201 is elongated, and the second target heat insulation hole 302 on the second pin portion 202 is T-shaped. The relevant parameters of the elongated hole and the T-shaped hole are as follows: Figure 6 As shown.

[0060] Wherein, A is the lower foot elevation height of the first pin portion 201 and the lower foot elevation height of the second pin portion 202; T is the thickness of the heat sink body 100; Y is the distance between the two ends of the first target heat insulation hole 301 and the distance between the two ends of the first target heat insulation hole 301; X is the width of the lower foot portion of the first pin portion 201 and the second pin portion 202; H is the distance from the edge of the first target heat insulation hole 301 to the edge of the heat sink body 100.

[0061] It should be noted that, in some embodiments, in order to ensure the basic strength and manufacturability of the MOS heat sink 10, the distance from the edge of the first target heat insulation hole 301 opened on the first pin portion 201 to the edge of the MOS heat sink 10 needs to be greater than or equal to the thickness of the heat sink body 100.

[0062] Furthermore, in order to avoid the situation where the heat dissipation is too fast in a short period of time due to the excessively large opening, the distance from the edge of the first target heat insulation hole 301 opened on the first pin portion 201 to the edge of the MOS tube heat sink 10 can be set to be less than or equal to 1.5 times the thickness of the heat sink body 100.

[0063] It should be noted that the distance from the edge of the first target heat insulation hole 301 to the edge of the MOS tube heat sink 10 is the distance between the edge of the first target heat insulation hole 301 and the edge of its nearest MOS tube heat sink 10.

[0064] Since Y≥A+T, X≥3T, and T≤H≤1.5T, the opening area of ​​the first target heat insulation hole 301 on the first pin portion 201 can be calculated as follows (rounded corners are calculated as right-angled sides): S1=(X-2H)*Y; the opening area of ​​the second target heat insulation hole 302 on the second pin portion 202 is: S2=A*(X-2H)+(X+2T)*(YA). Therefore, the minimum area of ​​the first target heat insulation hole 301 on the first pin portion 201 can be determined as: S1=(3T-2T)*(A+T)=AT+T2; the minimum area of ​​the second target heat insulation hole 302 on the second pin portion 202 is: S2=A*(3T-2T)+(3T+2T)*(YA)=5YT-4AT=AT+5T2.

[0065] It should be noted that when the first target heat insulation hole 301 is provided at the connection between the first pin portion 201 and the heat sink body 100, and the second target heat insulation hole 302 is provided at the connection between the second pin portion 202 and the heat sink body 100, other shapes of first target heat insulation holes 301 and second target heat insulation holes 302 may also be provided on the first pin portion 201 and the second pin portion 202. Figure 6 The shapes of the first target heat insulation holes 301 and 302 opened on the first pin portion 201 and the second pin portion 202, as well as the relevant parameters of the first target heat insulation holes 301 and 302, do not impose any limitations on this solution. Figure 6 This is just one example.

[0066] In some embodiments, to further reduce the heat dissipation rate of the solder liquid at the solder joint, the opening area of ​​the first target heat insulation hole 301 and the second target heat insulation hole 302 can be set to be greater than their respective minimum opening area.

[0067] In some embodiments, the value of the lower pin elevation height A of the pin portion 200 in the MOSFET heat sink 10 can be 2mm≤A≤5mm, and the value of the thickness T of the heat sink body 100 can be 0.5mm≤T≤2mm.

[0068] Please see Figure 7 Based on the above, those skilled in the art can further implement the following: a first heat insulation hole 300 is disposed on the pin portion 200, and a second heat insulation hole 400 is disposed on the heat sink body 100 near the first heat insulation hole 300, and the second heat insulation hole 400 penetrates the heat sink body 100 in a direction parallel to the heat sink body 100.

[0069] That is, a first heat insulation hole 300 is provided on the pin portion 200, and a second heat insulation hole 400 is provided on the heat sink body 100 near the pin portion 200. The purpose and effect are to further reduce the heat conduction efficiency between the pin portion 200 and the heat sink body 100. Essentially, it is equivalent to reducing the heat conduction path between the pin portion 200 and the heat sink body 100, thereby reducing the heat conduction efficiency and reducing the heat dissipation rate of the solder liquid at the soldering point.

[0070] In some embodiments, the second heat insulation hole 400 provided on the heat sink body 100 is arc-shaped and surrounds or partially surrounds the first heat insulation hole 300 to reduce the heat conduction efficiency between the pin portion 200 and the heat sink body 100.

[0071] In some embodiments, the heat sink body 100 is provided with a plurality of spaced second heat insulation holes 400 surrounding the pin portion 200.

[0072] In some possible embodiments, the first heat insulation hole 300 is arc-shaped and is disposed around the pin portion 200.

[0073] In some other possible embodiments, the heat sink body 100 has a plurality of first heat insulation holes 300, which are spaced apart and arranged around the pin portion 200 located at one end of the heat sink body 100.

[0074] In some embodiments, a second heat insulation hole 400 is provided on the heat sink body 100, and the second heat insulation hole 400 is arranged in an arc shape around or partially around the first heat insulation hole 300.

[0075] Please see Figure 8 This application also provides an electronic device, including a MOSFET heat sink 10 and a circuit board 20. The MOSFET heat sink 10 is disposed on the circuit board 20, and the circuit board 20 is provided with pin holes that mate with the pin portion 200 of the MOSFET heat sink 10. Since this electronic device adopts all or part of the above-described technical solutions of the MOSFET heat sink 10, it has at least all the beneficial effects of the MOSFET heat sink 10, which will not be elaborated here.

[0076] It should be noted that the electronic device can be a power supply containing a circuit board, a computer host, a monitor, a mobile communication device, or a home appliance, etc.

[0077] The above description is merely an optional embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the content of the specification and drawings of this application under the concept of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A heat sink for a MOSFET, comprising a heat sink body and a lead portion, wherein the lead portion is used to connect the MOSFET heat sink to the circuit board via lead holes on the circuit board, characterized in that, The MOS transistor heat sink has a first heat insulation hole, which penetrates the MOS transistor heat sink along the thickness direction of the heat sink body. Wherein, the first heat insulation hole is disposed on the pin portion; or The first heat insulation hole is disposed on the heat sink body, and the first heat insulation hole is close to the pin portion; or The first heat insulation hole is disposed at the connection between the pin portion and the heat sink body; The pin portion is fixed to the heat sink body, and the heat sink body and the pin portion have a contact area that contacts each other. The first heat insulation hole is disposed in the contact area. The heat sink body is made of a first material, and the pin portion is made of a second material. The thermal conductivity of the first material is greater than that of the second material.

2. The MOS transistor heat sink according to claim 1, characterized in that, The opening area of ​​the first heat insulation hole is determined by the height of the lower foot of the pin portion and the thickness of the heat sink body.

3. The heat sink for a MOS transistor according to claim 1, characterized in that, The pin portion includes a first pin portion and a second pin portion, both of which are connected to the side of the heat sink body; The first pin portion is connected to the side edge near the end of the side edge; The second pin portion is connected to the end of the side away from the side.

4. The MOS transistor heat sink according to claim 3, characterized in that, The first heat insulation hole includes a first target heat insulation hole and a second target heat insulation hole; The first target heat insulation hole is disposed on the first pin portion; or the first target heat insulation hole is disposed at the connection between the first pin portion and the heat sink body; or the first target heat insulation hole is disposed on the heat sink body, and the first target heat insulation hole is close to the first pin portion. The second target heat insulation hole is disposed on the second pin portion; or the second target heat insulation hole is disposed at the connection between the second pin portion and the heat sink body; or the second target heat insulation hole is disposed on the heat sink body, and the second target heat insulation hole is close to the second pin portion; The opening area of ​​the first target heat insulation hole is smaller than the opening area of ​​the second target heat insulation hole.

5. The MOS transistor heat sink according to claim 4, characterized in that, The distance from the edge of the first target heat insulation hole to the edge of the MOS tube heat sink is greater than or equal to the thickness of the heat sink body.

6. The MOS transistor heat sink according to claim 4, characterized in that, The distance from the edge of the first target heat insulation hole to the edge of the MOS tube heat sink is less than or equal to 1.5 times the thickness of the heat sink body.

7. The MOS transistor heat sink according to claim 1, characterized in that, A second heat insulation hole is provided on the heat sink body near the first heat insulation hole, and the second heat insulation hole penetrates the heat sink body along the thickness direction of the heat sink body.

8. The MOS transistor heat sink according to claim 7, characterized in that, The second heat insulation hole is arc-shaped and is arranged around the first heat insulation hole.

9. An electronic device, characterized in that, include: The heat sink for the MOS transistor according to any one of claims 1-8; The circuit board, wherein the MOS transistor heat sink is disposed on the circuit board, and the circuit board is provided with pin holes that mate with the pin portion of the MOS transistor heat sink.

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