Flexible phased array antenna and method of manufacturing

Abstract

The application provides a flexible phased array antenna and a preparation method, which comprises a feed port module, a power divider module, a phase shifter module and a phased array antenna unit; the feed port module is used for receiving a feed signal; the power divider module is used for completing distribution of the feed signal to each phase shifter signal; the phase shifter module is used for completing phase shifting of a signal required by each phased array antenna unit; and the phased array antenna unit is used for radiating the signal to space; the feed port module, the power divider module and the phased array antenna unit are prepared on a substrate, and the phase shifter module is attached to the substrate. The application adopts a process based on an LCP substrate, can complete preparation of the feed port module, the power divider module and the phased array antenna unit on one substrate at the same time, and the phase shifter module can be attached to the above-mentioned substrate through a micro assembly process; and the micro coaxial type feed port module and the power divider module prepared based on the LCP substrate can realize feed and power division functions with a frequency of up to 110 GHz.

Description

Technical Field

[0001] This invention relates to the field of radio frequency technology, and more specifically, to a flexible phased array antenna and its fabrication method. Background Technology

[0002] In modern society, antennas, as fundamental components for wireless transmission of radio frequency signals, are increasingly used in various applications. Phased array antennas, in particular, can achieve rapid electrical scanning and possess strong application flexibility because they can directly change the radiation pattern by altering the phase of the feed signal. However, when deploying traditional planar phased array antennas, limited space often restricts the actual area of ​​the antenna.

[0003] Therefore, the development of flexible phased array antennas that can conform to the surface of objects is receiving increasing attention. Conformal phased array antennas can achieve the maximum scanning angle without altering the aerodynamic structure of the object itself, thus helping to improve the object's stealth capabilities. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a flexible phased array antenna and its fabrication method. This invention features an integrated fabrication method, simple process, low transmission loss, and conformal adaptability.

[0005] The flexible phased array antenna provided by the present invention includes a feed port module, a power divider module, a phase shifter module, and a phased array antenna unit;

[0006] The power supply port module is used to receive power supply signals;

[0007] The power divider module is used to distribute the power supply signal to each phase shifter signal;

[0008] The phase shifter module is used to perform phase shifting of the signals required by each phased array antenna element;

[0009] The phased array antenna unit is used to radiate signals into space; the feed port module, the power divider module, and the phased array antenna unit are fabricated on a substrate, and the phase shifter module is attached to the substrate.

[0010] Preferably, the phase shifter module is connected to the power divider module and the phased array antenna unit via gold wire bonding for radio frequency connection.

[0011] Preferably, the power feed module, power divider module, phase shifter module, and phased array antenna unit are fabricated on an LCP substrate using a micro-coaxial structure.

[0012] Preferably, the phase shifter module is bonded to the LCP substrate using a micro-assembly process.

[0013] Preferably, the phased array antenna element is fabricated on a flexible LCP substrate to give the phased array antenna element flexible and conformal characteristics.

[0014] The flexible phased array antenna provided by the present invention includes: a first layer plate, a second layer plate, a third layer plate and a fourth layer plate stacked sequentially;

[0015] The first layer includes a first bottom copper clad layer, a first substrate layer, and a top copper clad layer stacked sequentially.

[0016] The second layer includes a first outer conductor wall formed by a second substrate layer, an inner conductor support layer, and an inner conductor transmission layer formed by a top copper cladding layer; the first outer conductor wall and the inner conductor support layer are formed on the top copper cladding layer; the inner conductor support layer is located inside the first outer conductor wall; the inner conductor transmission layer is formed at the end of the inner conductor support layer;

[0017] The third layer includes a second outer conductor wall, which is formed on the first outer conductor wall;

[0018] The fourth layer includes a second bottom copper clad layer and a fourth substrate layer; the second bottom copper clad layer is formed on the wall of the second outer conductor to form the upper surface of the outer conductor with a micro-coaxial structure; the fourth substrate layer 209 is formed on the second bottom copper clad layer 208;

[0019] The sidewalls 210 of the first outer conductor wall 204 and the second outer conductor wall 207 form the two outer conductors of the micro-coaxial structure. The two outer conductors, together with the top copper cladding layer and the second bottom copper cladding layer, form the complete micro-coaxial structure outer conductor.

[0020] Preferably, the inner conductor transmission layer is a top-surface copper-clad layer;

[0021] The first outer conductor wall and the second outer conductor wall are grown using an electroforming process.

[0022] Preferably, it also includes a phase shifter chip; the phase shifter chip is placed on the inner conductor support layer.

[0023] Preferably, the first bottom copper cladding layer forms the metal ground layer of the phased array antenna unit, the first substrate layer forms the dielectric layer of the phased array antenna unit, and the top copper cladding layer forms the antenna electrode layer of the phased array antenna unit.

[0024] The method for fabricating a flexible phased array antenna according to the present invention includes the following steps:

[0025] Based on the fabrication technology of LCP substrate, feed port module, power divider module and phased array antenna unit with micro coaxial structure are fabricated on LCP substrate.

[0026] Phase shifter modules are integrated using micro-assembly processes;

[0027] The radio frequency connection between the phase shifter, power divider, and phased array antenna unit is completed by gold wire bonding.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] This invention employs an LCP substrate-based process, which allows for the simultaneous fabrication of a feed port module, a power divider module, and a phased array antenna unit on a single substrate. Furthermore, the phase shifter module can be bonded to the substrate using a micro-assembly process. The micro-coaxial type feed port module and power divider module fabricated based on the LCP substrate can achieve feed and power division functions at frequencies up to 110 GHz.

[0030] In the power supply port and power divider of the micro-coaxial structure of this invention, since the radio frequency signal is transmitted on the inner conductor of the micro-coaxial structure and the inner conductor is wrapped by the outer conductor, it can effectively shield external interference. This special 3D structure of the micro-coaxial structure can achieve low-loss, high-power, and high-isolation transmission of radio frequency signals, and can achieve high-quality transmission of terahertz radio frequency signals.

[0031] The present invention is a flexible phased array antenna based on an LCP substrate design. It has excellent flexibility and can conform to the surface of an object, thereby achieving a larger beam scanning angle. Furthermore, the feed port and power divider fabricated using the micro-coaxial structure of the LCP substrate have extremely low losses, enabling the transmission of radio frequency signals up to the terahertz band.

[0032] Compared with phased array antennas of other structures, this invention has a simpler manufacturing process and higher integration; the feed port and power divider fabricated by the micro-coaxial structure used in this invention have very low loss and strong isolation. Attached Figure Description

[0033] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0034] Figure 1 This is a schematic diagram of the flexible phased array antenna in an embodiment of the present invention;

[0035] Figure 2 This is a schematic cross-sectional view of the power supply port and the power divider in an embodiment of the present invention;

[0036] Figure 3 This is a schematic cross-sectional view of the phase shifter in an embodiment of the present invention;

[0037] Figure 4 This is a schematic cross-sectional view of the flexible phased array antenna in an embodiment of the present invention.

[0038] In the picture:

[0039] 11 is the power supply module; 12 is the power divider module; 13 is the gold wire; 14 is the phase shifter module; 15 is the phased array antenna unit. Detailed Implementation

[0040] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention. These all fall within the scope of protection of the present invention.

[0041] Figure 1 This is a schematic diagram of the flexible phased array antenna in an embodiment of the present invention, as shown below. Figure 1 As shown, the flexible phased array antenna provided by the present invention includes:

[0042] The power supply module 11, the power divider module 12, the phase shifter module 14, and the phased array antenna unit 15;

[0043] The power supply module 11 is used to receive power supply signals;

[0044] The power divider module 12 is used to distribute the power supply signal to each phase shifter signal;

[0045] The phase shifter module 14 is used to perform phase shifting of the signals required by each phased array antenna element;

[0046] The phased array antenna unit 15 is used to radiate signals into space; the feed port module 11, the power divider module 12 and the phased array antenna unit 15 are fabricated on a substrate, and the phase shifter module 14 is attached to the substrate.

[0047] The power supply module 11 and the power divider module 12 are both micro-coaxial structures. They are connected to the phase shifter module 14 via gold wire 13 and transmit the signal to the phased array antenna element 15. The bases of the power supply module 11, the power divider module 12, the phase shifter module 14, and the phased array antenna element 15 are all fabricated based on flexible LCP technology.

[0048] Figure 2 This is a schematic cross-sectional view of the power feed port and power divider in an embodiment of the present invention, as shown below. Figure 2As shown, the power supply module 11 and the power divider 12 module have a common micro-coaxial structure. The first layer of the power supply module 11 and the power divider 12 module includes a first bottom copper clad layer 201, a first substrate layer 202 and a top copper clad layer 203 stacked in sequence, wherein the top copper clad layer 203 serves as the lower surface of the outer conductor of the micro-coaxial structure.

[0049] The second layer of the power supply module 11 and the power divider 12 module includes a first outer conductor wall 204 formed by a second substrate layer, an inner conductor support layer 205, and an inner conductor transmission layer formed by a top copper cladding layer 206.

[0050] The first outer conductor wall 204 and the inner conductor support layer 205 are formed on the top copper cladding layer 203; the inner conductor support layer 205 is located inside the first outer conductor wall 204;

[0051] The inner conductor transmission layer is formed at the end of the inner conductor support layer 205, and the inner conductor transmission layer adopts a top copper cladding layer 206.

[0052] The third layer of the power supply module 11 and the power divider 12 module includes a second outer conductor wall 207 of a micro-coaxial structure formed by the third substrate layer.

[0053] The second outer conductor wall 207 is formed on the first outer conductor wall 204;

[0054] The fourth layer of the power supply module 11 and the power divider module 12 includes the outer conductor upper surface of the micro-coaxial structure formed by the second bottom copper cladding layer 208 and the fourth substrate layer 209.

[0055] The second bottom copper cladding layer 208 is formed on the second outer conductor wall 207, forming the upper surface of the outer conductor of the micro coaxial structure.

[0056] The fourth substrate layer 209 is formed on the second bottom copper cladding layer 208.

[0057] The first outer conductor wall 204 and the second outer conductor wall 207 are grown by electroforming process to form the two outer conductors of the micro coaxial structure. The two outer conductors, together with the top copper cladding layer 203 and the second bottom copper cladding layer 208, form a complete micro coaxial structure outer conductor.

[0058] Figure 3 This is a schematic cross-sectional view of the phase shifter in an embodiment of the present invention, as shown below. Figure 3 As shown, the phase shifter module 14 shares the first and second layers of the micro coaxial structure with the power supply module 11 and the power divider module 12.

[0059] The first layer of the phase shifter module 14 includes a first bottom copper cladding layer 201, a first substrate layer 202, and a top copper cladding layer 203. The second layer of the phase shifter module 14 includes a wall 204 formed by the substrate layer and an inner conductor support layer 205, on which the phase shifter chip 36 is placed.

[0060] Figure 4 This is a schematic cross-sectional view of the flexible phased array antenna in an embodiment of the present invention. Figure 4 As shown, the phased array antenna unit 15 shares the first layer of the micro coaxial structure with the feed port module 11, the power divider module 12, and the phase shifter module 14.

[0061] The first bottom copper cladding layer 201 forms the metal ground layer 41 of the phased array antenna unit 15, the first substrate layer 202 forms the dielectric layer 42 of the phased array antenna unit 15, and the top copper cladding layer 203 forms the antenna electrode layer 43 of the phased array antenna unit 15.

[0062] In summary, the flexible phased array antenna in this invention is entirely fabricated using flexible LCP substrate technology. The first step, circuit board fabrication based on the LCP substrate, completes the processing of the feed port module 11, power divider module 12, and phased array antenna unit 15. The second step, micro-assembly of the phase shifter chip, completes the entire fabrication process. Radio frequency signal transmission mostly employs micro-coaxial structures; combined with the low-loss LCP substrate, high-quality transmission of radio frequency signals up to the terahertz band can be achieved. The flexibility of the LCP substrate also helps the phased array antenna system conform to the surface of objects with specific shapes, enabling a wider scanning angle and a larger radiation area within a limited space.

[0063] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various modifications or variations within the scope of the claims, which do not affect the essence of the present invention.

Claims

1. A flexible phased array antenna, characterized in that, It includes a feed port module, a power divider module, a phase shifter module, and a phased array antenna unit; The power supply port module is used to receive power supply signals; The power divider module is used to distribute the power supply signal to each phase shifter signal; The phase shifter module is used to perform phase shifting of the signals required by each phased array antenna element; The phased array antenna element is used to radiate signals into space; The power supply module, the power divider module, and the phased array antenna unit are fabricated on a single substrate, and the phase shifter module is bonded to the substrate. The power supply module, the power divider module, the phase shifter module, and the phased array antenna unit are fabricated on an LCP substrate using a micro-coaxial structure. The phase shifter module is connected to the power divider module and the phased array antenna unit via gold wire bonding for radio frequency communication. The phase shifter module is bonded to the LCP substrate using a micro-assembly process. The phased array antenna unit is fabricated on a flexible LCP substrate to give it flexible and conformal characteristics.

2. A flexible phased array antenna as described in claim 1, characterized in that, include: The first, second, third, and fourth layers of boards are stacked in sequence; The first layer includes a first bottom copper clad layer, a first substrate layer, and a top copper clad layer stacked sequentially. The second layer includes a first outer conductor wall formed by a second substrate layer, an inner conductor support layer, and an inner conductor transmission layer formed by a top copper cladding layer; the first outer conductor wall and the inner conductor support layer are formed on the top copper cladding layer; the inner conductor support layer is located inside the first outer conductor wall; the inner conductor transmission layer is formed at the end of the inner conductor support layer; The third layer includes a second outer conductor wall, which is formed on the first outer conductor wall; The fourth layer includes a second bottom copper clad layer and a fourth substrate layer; the second bottom copper clad layer is formed on the wall of the second outer conductor to form the upper surface of the outer conductor with a micro-coaxial structure; the fourth substrate layer is formed on the second bottom copper clad layer; The sidewalls of the first outer conductor wall and the second outer conductor wall form the two outer conductors of the micro-coaxial structure. The two outer conductors, together with the top copper cladding layer and the second bottom copper cladding layer, form the complete micro-coaxial structure outer conductor. The first bottom copper cladding layer forms the metal ground layer of the phased array antenna unit, the first substrate layer forms the dielectric layer of the phased array antenna unit, and the top copper cladding layer forms the antenna electrode layer of the phased array antenna unit.

3. The flexible phased array antenna according to claim 2, characterized in that, The inner conductor transmission layer adopts a top surface copper cladding layer; The first outer conductor wall and the second outer conductor wall are grown using an electroforming process.

4. The flexible phased array antenna according to claim 2, characterized in that, It also includes a phase shifter chip; the phase shifter chip is placed on the inner conductor support layer.

5. A method for fabricating the flexible phased array antenna according to claim 1, characterized in that, Includes the following steps: Based on the fabrication technology of LCP substrate, feed port module, power divider module and phased array antenna unit with micro coaxial structure are fabricated on LCP substrate. The phase shifter module is integrated using micro-assembly technology; the radio frequency connection between the phase shifter, power divider, and phased array antenna unit is completed using gold wire bonding.

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