A method of manufacturing a conductive assembly

Abstract

The application discloses a manufacturing method of a conducting assembly, which comprises the following steps: obtaining a plastic base, a contact probe and tin paste, wherein the plastic base is provided with a conductive circuit and a hole slot close to the conductive circuit; heating the contact probe and inserting one end of the contact probe into the hole slot to make the contact probe and the plastic base heat fusion connection, at this time, the other end of the contact probe extends out of the hole slot; filling the tin paste in the hole slot to conduct the contact probe and the conductive circuit. The conducting assembly manufactured by the manufacturing method of the conducting assembly has a novel structure, the contact probe and the plastic base are heat fusion connected, the contact probe and the plastic base have large bonding strength, and the structural stability of the conducting assembly is improved; the tin paste can not only conduct the contact probe and the conductive circuit, but also effectively fill the hole slot, and the good product rate of the conducting assembly is ensured; the existence of the hole slot can not only position the contact probe, but also facilitate the insertion of the contact probe, and can collect the heat fusion excess material and the tin paste.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical conductive structures, and in particular to a method for manufacturing a conductive component. Background Art

[0002] In the prior art, there is a conductive assembly comprising a plastic base and a contact spring. The plastic base is provided with a conductive circuit. The contact spring is welded to a pad on the plastic base and electrically connects to the conductive circuit. The conductive circuit is electrically connected to an external device via a contact portion of the contact spring. In this conductive assembly, the contact spring relies solely on the welding area to ensure bonding strength, which can easily lead to undetected solder joints and cause product failure during use. In other words, existing conductive assemblies suffer from poor structural stability. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a method for manufacturing a conductive component with a more stable structure.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: a method for manufacturing a conductive component, comprising the following steps:

[0005] Obtain a plastic base, a contact probe, and solder paste, wherein the plastic base is provided with a conductive circuit and a hole groove arranged near the conductive circuit;

[0006] Heating the contact probe and inserting one end of the contact probe into the hole to thermally fuse the contact probe to the plastic base, while the other end of the contact probe extends out of the hole;

[0007] The hole groove is filled with solder paste to connect the contact probe and the conductive circuit.

[0008] The beneficial effects of the present invention are: the conductive component manufactured by implementing the manufacturing method of the conductive component has a novel structure, eliminates the contact spring, and the contact probe is hot-melt connected to the plastic base. The bonding strength between the contact probe and the plastic base is high, which greatly reduces the risk of accidental separation of the contact probe and the plastic base, and is beneficial to improving the structural stability of the conductive component; the solder paste can not only connect the contact probe and the conductive circuit, but also effectively fill the hole groove to ensure the yield of the conductive component; the existence of the hole groove can not only position the contact probe to facilitate the insertion of the contact probe, but also collect hot-melt residue and solder paste, realizing multiple uses of one thing. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a flowchart of a method for manufacturing a conductive component according to a first embodiment of the present invention;

[0010] Figure 2A schematic structural diagram of a conductive component obtained by implementing the method for manufacturing a conductive component according to the first embodiment of the present invention;

[0011] Figure 3 for Figure 2 Cross-sectional view of the structure shown.

[0012] Description of labels:

[0013] 1. Plastic base; 11. Hole slot; 111. Hot melt section; 112. Tin-containing section; 12. Conductive circuit;

[0014] 2. Contact probe;

[0015] 3. Solder paste. DETAILED DESCRIPTION

[0016] To illustrate the technical content, achieved objectives and effects of the present invention in detail, the following description is given in conjunction with the embodiments and accompanying drawings.

[0017] Please refer to Figures 1 to 3 A method for manufacturing a conductive component comprises the following steps:

[0018] Obtain a plastic base 1, a contact probe 2, and solder paste 3, wherein the plastic base 1 is provided with a conductive circuit 12 and a hole 11 disposed near the conductive circuit 12;

[0019] Heat the contact probe 2 and insert one end of the contact probe 2 into the hole 11 to heat-melt the contact probe 2 and the plastic base 1. At this time, the other end of the contact probe 2 extends out of the hole 11.

[0020] The hole 11 is filled with solder paste 3 to connect the contact probe 2 and the conductive circuit 12 .

[0021] From the above description, it can be seen that the beneficial effects of the present invention are: the conductive component manufactured by implementing the manufacturing method of the conductive component has a novel structure, eliminates the contact spring, and the contact probe 2 is hot-melt connected to the plastic base 1. The bonding strength between the contact probe 2 and the plastic base 1 is large, which greatly reduces the risk of accidental separation of the contact probe 2 and the plastic base 1, and is beneficial to improving the structural stability of the conductive component; the solder paste 3 can not only connect the contact probe 2 and the conductive circuit 12, but also effectively fill the hole groove 11 to ensure the yield of the conductive component; the existence of the hole groove 11 can not only position the contact probe 2 and facilitate the insertion of the contact probe 2, but also collect hot-melt residue and solder paste 3, realizing multiple uses of one thing.

[0022] Furthermore, the hole groove 11 includes a connected hot melt section 111 and a tin-containing section 112, the tin-containing section 112 is connected to the surface of the plastic base 1, the diameter of the tin-containing section 112 is larger than the diameter of the hot melt section 111, and the diameter of one end of the contact probe 2 inserted into the hole groove 11 is larger than the diameter of the hot melt section 111.

[0023] As can be seen from the above description, the diameter of the tin-containing section 112 is larger than the diameter of the hot-melt section 111 , which facilitates the processing and molding of the plastic base 1 .

[0024] Furthermore, when the hole 11 is filled with the solder paste 3 , the solder paste 3 does not protrude from the end surface of the solder containing section 112 away from the hot melt section 111 .

[0025] As can be seen from the above description, the proper amount of solder paste 3 can ensure the stability of the conduction between the contact probe 2 and the conductive circuit 12 and the consistency of the conductive component processing.

[0026] Furthermore, the draft angle of the hot melt section 111 is 1°-3°.

[0027] As can be seen from the above description, the existence of the draft angle not only facilitates demoulding of the plastic base 1 during the injection molding process, but also facilitates insertion of the contact probe 2 after heating.

[0028] Furthermore, the tin-containing section 112 is in an inverted truncated cone shape as a whole.

[0029] As can be seen from the above description, the inverted frustum-shaped tin-containing section 112 can facilitate the filling of the solder paste 3 .

[0030] Furthermore, the angle between the truncated cone generatrix of the tin-containing section 112 and the rotation center axis is 20°-40°.

[0031] As can be seen from the above description, the melted solder paste 3 can flow smoothly into the bottom of the solder containing section 112 , thereby improving the phenomenon of bubbles generated inside the solder paste 3 .

[0032] Furthermore, the solder paste 3 is low-temperature solder paste.

[0033] From the above description, it can be seen that low-temperature solder paste will not affect the plastic base 1, which is beneficial to ensuring the consistency of the dimensions of the conductive components.

[0034] Furthermore, the conductive circuit 12 is laser engraved on the plastic base 1 .

[0035] As can be seen from the above description, the conductive circuit 12 is easy to form.

[0036] Furthermore, the conductive circuit 12 is an antenna.

[0037] It can be seen from the above description that the conductive component can be an antenna component.

[0038] Furthermore, the contact probe 2 is a spring-type probe.

[0039] As can be seen from the above description, the spring-type probe can more stably connect the conductive circuit 12 with the external structure.

[0040] Example 1

[0041] Please refer to Figures 1 to 3 , Embodiment 1 of the present invention is: a method for manufacturing a conductive component, comprising the following steps,

[0042] Obtain a plastic base 1, a contact probe 2 and solder paste 3, wherein the plastic base 1 is provided with a conductive circuit 12 and a hole 11 arranged near the conductive circuit 12; the contact probe 2 can be an integrated columnar structure or a spring-type probe.

[0043] Heat the contact probe 2 and insert one end of the contact probe 2 into the hole 11 to heat-melt the contact probe 2 and the plastic base 1. At this time, the other end of the contact probe 2 extends out of the hole 11.

[0044] The hole 11 is filled with solder paste 3 to conduct the contact probe 2 and the conductive circuit 12. Preferably, the solder paste 3 is low-temperature solder paste.

[0045] Specifically, the aperture 11 includes a connected hot melt section 111 and a tin-receiving section 112. The tin-receiving section 112 is connected to the surface of the plastic base 1. The diameter of the tin-receiving section 112 is larger than the diameter of the hot melt section 111. The diameter of the end of the contact probe 2 inserted into the aperture 11 is larger than the diameter of the hot melt section 111. Therefore, when the heated end of the contact probe 2 is inserted into the hot melt section 111, the wall surface of the hot melt section can be melted, and the contact probe 2 can be tightly fitted with the plastic base 1. Preferably, the hot melt section 111 and the tin-receiving section 112 are coaxially arranged.

[0046] When the hole 11 is filled with solder paste 3 , the solder paste 3 does not protrude from the end surface of the solder containing section 112 away from the hot melt section 111 , that is, the solder paste 3 does not protrude from the surface of the plastic base 1 .

[0047] The draft angle of the hot melt section 111 is 1°-3°. In this embodiment, the draft angle of the hot melt section 111 is 2°. As a preferred embodiment, the diameter of the contact probe 2 is larger than the diameter of the small opening of the hot melt section 111 (i.e., the end of the hot melt section 111 away from the tin-containing section 112) and smaller than the diameter of the large opening of the hot melt section 111 (i.e., the end of the hot melt section 111 close to the tin-containing section 112). In this way, the existence of the draft angle not only facilitates the demolding of the plastic base 1, but also guides the contact probe 2 during the insertion process of the contact probe 2 into the plastic base 1.

[0048] Optionally, the tin holding section 112 is in the shape of an inverted truncated cone, and the angle between the truncated cone generatrix of the tin holding section 112 and the central axis of rotation is 20°-40°. It is easy to understand that the diameter of the small opening of the tin holding section 112 (i.e., the end of the tin holding section 112 close to the hot melt section 111) is larger than the diameter of the large opening of the hot melt section 111 (i.e., the end of the hot melt section 111 close to the tin holding section 112).

[0049] The conductive circuit 12 is laser engraved on the plastic base 1. In this embodiment, the conductive circuit 12 is an antenna, or in other words, the conductive circuit 12 is used as an antenna. In other embodiments, the conductive circuit 12 can only be an electrical connection structure for connection and conduction.

[0050] When heating the contact probe 2 , the entire contact probe 2 may be heated, or the end portion of the contact probe 2 may be locally heated. The specific method may be selected according to actual production conditions.

[0051] Optionally, when heating the contact probe 2, the area of ​​the plastic base 1 corresponding to the hot melt section 111 is simultaneously heated on the outside of the plastic base 1; or, the wall surface of the hot melt section 111 is simultaneously heated inside the hot melt section 111. In this way, the plastic base 1 can be softened in a local area, thereby making it easier to insert the contact probe 2.

[0052] In summary, the conductive component manufactured by the manufacturing method of the conductive component provided by the present invention has a novel structure, eliminates the contact spring, and the contact probe is connected to the plastic base by hot melt. The bonding strength between the contact probe and the plastic base is strong, which greatly reduces the risk of accidental separation of the contact probe and the plastic base, and is conducive to improving the structural stability of the conductive component; the solder paste can not only connect the contact probe and the conductive circuit, but also effectively fill the hole groove to ensure the yield rate of the conductive component; the existence of the hole groove can not only position the contact probe and facilitate the insertion of the contact probe, but also collect hot melt residue and solder paste, realizing multiple uses of one thing. The draft angle of the hot melt section of the hole groove not only facilitates the demolding of the plastic base, but also plays a role in guiding the insertion of the contact probe.

[0053] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's description and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a conductive component, characterized in that: The following steps are included: Obtain a plastic base, a contact probe, and solder paste, wherein the plastic base is provided with a conductive circuit and a hole groove arranged near the conductive circuit; Heating the contact probe and inserting one end of the contact probe into the hole to thermally fuse the contact probe to the plastic base, while the other end of the contact probe extends out of the hole; Filling the hole with solder paste to connect the contact probe and the conductive circuit; The hole groove includes a connected hot melt section and a tin containing section, the tin containing section is connected to the surface of the plastic base, the hot melt section is located below the tin containing section, the caliber of the tin containing section is larger than the caliber of the hot melt section, and the diameter of one end of the contact probe inserted into the hole groove is larger than the caliber of the hot melt section.

2. The method for manufacturing a conductive component according to claim 1, wherein: When the hole groove is filled with solder paste, the solder paste does not protrude from the end surface of the solder containing section away from the hot melt section.

3. The method for manufacturing a conductive component according to claim 1, wherein: The draft angle of the hot melt section is 1°-3°.

4. The method for manufacturing a conductive component according to claim 3, wherein: The included angle between the truncated cone generatrix of the tin-containing section and the rotation center axis is 20°-40°.

5. The method for manufacturing a conductive component according to claim 1, wherein: The tin-containing section is in an inverted truncated cone shape as a whole.

6. The method for manufacturing a conductive component according to claim 1, wherein: The solder paste is low-temperature solder paste.

7. The method for manufacturing a conductive component according to claim 1, wherein: The conductive circuit is laser engraved on the plastic base.

8. The method for manufacturing a conductive component according to claim 1, wherein: The conductive circuit is an antenna.

9. The method for manufacturing a conductive component according to claim 1, wherein: The contact probe is a spring-type probe.

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