High-precision fast-axis collimation system for semiconductor laser and application thereof

Abstract

This invention relates to a fast-axis collimation system for a high-precision semiconductor laser and its application, belonging to the field of semiconductor fast-axis collimation technology. It includes an air-floating platform, a vision system, a COS positioning and power supply system, a high-precision six-axis motion control system, and a beam quality analysis system. The high-precision six-axis motion control system is mounted on the air-floating platform. The COS positioning and power supply system is located on one side of the high-precision six-axis motion control system, and the vision system is located on the other side. The beam quality analysis system is located on the beam output side of the COS positioning and power supply system. This invention automates the fast-axis collimation of the semiconductor laser by using the beam quality analysis system and the vision system to control and adjust the position of the collimating lens in six directions in real time, improving collimation accuracy, avoiding manual operation, and increasing production efficiency.

Description

TECHNICAL FIELD

[0001] The application relates to a high-precision fast-axis collimation system of a semiconductor laser and application thereof, and belongs to the technical field of fast-axis collimation of semiconductor lasers. BACKGROUND

[0002] Semiconductor lasers have a wide range of applications in the fields of medical treatment, display, pumping and industrial processing due to their small size, light weight, high conversion efficiency and long service life. In recent years, with the rapid development of epitaxial growth technology of semiconductor materials, optimization technology of semiconductor laser waveguide structure, cavity surface passivation technology, high-stability packaging technology and high-efficiency heat dissipation technology, especially under the impetus of direct semiconductor laser industrial processing applications and high-power fiber laser pumping requirements, high-power and high-beam-quality semiconductor lasers have developed rapidly.

[0003] The light beam emitted by the light-emitting chip in the semiconductor laser is a divergent elliptical light beam, the direction parallel to the light-emitting surface is the slow-axis direction, and the divergence angle is about 10°; the direction perpendicular to the light-emitting surface is the fast-axis direction, and the divergence angle can reach 40°. In order to effectively ensure the light-emitting quality of the semiconductor laser, a fast-axis collimation lens must be used to collimate the light beam emitted by the light-emitting chip in the fast-axis direction.

[0004] Traditional fast-axis collimation of a laser is generally achieved by using a manual clamp to place a fast-axis collimation lens in front of a COS cavity, then manually adjusting a six-axis platform, determining the position of the fast-axis collimation lens by observing the position of a light spot at a long distance, and then curing the lens by point gluing. The manual operation is low in efficiency and poor in precision, and the labor cost is high.

[0005] A semiconductor laser fast-axis collimation device is disclosed in Chinese patent document CN207572715U, which comprises a base, a chip carrier mounted on the base, an adjusting frame mounted on the base, a lens clamp mounted on the adjusting frame, an image acquisition assembly mounted on the base, and an optical detection assembly mounted on the base. The image acquisition assembly is used to identify the position of the fast-axis collimation lens through image detection, and the adjusting frame is used to adjust the position and angle of the lens clamp so that the laser beam forms a light spot on the optical detection assembly. The device clamps the fast-axis collimation lens by using a pneumatic cylinder. The clamp is prone to damage the lens due to the influence of compressed gas. In addition, the lens positioning precision is poor. Furthermore, fast-axis collimation requires very high precision, reaching the micron level. However, the device is connected by assembly, which is poor in assembly precision and low in motion precision. Moreover, the device can only power and couple one COS, which is low in efficiency and prone to damage and contaminate the COS cavity. SUMMARY

[0006] To address the shortcomings of existing technologies, this invention provides a fast-axis collimation system for high-precision semiconductor lasers. By using a beam quality analysis system and a vision system to control and adjust the position of the fast-axis collimation lens in six directions in real time, the fast-axis collimation of the semiconductor laser is automated, improving collimation accuracy, avoiding manual operation, and increasing production efficiency.

[0007] The present invention also provides an application of the fast axis collimation system of the above-mentioned high-precision semiconductor laser.

[0008] Terminology Explanation:

[0009] COS (chip on submount): A laser chip packaged on a submount heat sink.

[0010] The technical solution of the present invention is as follows:

[0011] A fast-axis collimation system for a high-precision semiconductor laser includes an air-bearing platform, a vision system, a COS positioning and power supply system, a high-precision six-axis motion control system, and a beam quality analysis system. The high-precision six-axis motion control system is installed on the air-bearing platform. The COS positioning and power supply system is installed on one side of the high-precision six-axis motion control system. The vision system is installed on one side of the COS positioning and power supply system. The beam quality analysis system is installed on the light-emitting side of the COS positioning and power supply system.

[0012] Preferably, the high-precision six-axis motion control system has a clamp on the operating table to hold the fast-axis collimating lens.

[0013] In a further preferred embodiment, the clamp includes a clamping platform with two elastic clamping plates on the platform, which clamp the fast-axis collimating lens.

[0014] Preferably, the COS positioning and power supply system includes a cylinder, a positioning device, a conductive device, a connecting plate, a fixing clamp, an ultraviolet mercury lamp, and a fixing base. The positioning device is provided on the top surface of the fixing base, and the cylinder is provided on the side of the fixing base. The cylinder is connected to the connecting plate, which is an L-shaped plate. Fixing clamps are provided on both sides of the top of the connecting plate, and an ultraviolet mercury lamp is provided inside the fixing clamp. The conductive device is fixed at the middle position of the top of the connecting plate and is located above the positioning device.

[0015] More preferably, the positioning device is an L-shaped mounting platform, and the positioning device is located on one side of the top surface of the fixed base.

[0016] Preferably, the conductive device includes a fixed block and spring pins. The fixed block is connected to the connecting plate, and spring pins are uniformly arranged inside the fixed block. The spring pins are connected to a power source and are located above the positioning device. When the cylinder extends or retracts, it drives the spring pins to move up and down through the connecting plate. The spring pins can both energize the COS on the positioning device and fix the COS by compression.

[0017] In a further preferred embodiment, the number of spring pins is twice the number of COS pins, with two adjacent spring pins corresponding to one COS pin, ensuring that the COS pins are energized.

[0018] Preferably, the cylinder, vision system, high-precision six-axis motion control system, and beam quality analysis system are all connected to a computer control system.

[0019] The operation steps for applying the fast-axis collimation system of the aforementioned high-precision semiconductor laser are as follows:

[0020] (1) Place the COS on the protruding end of the positioning device, with the light-emitting side of the COS corresponding to the clamp. The cylinder retracts, driving the spring pin to press down and fix the COS while energizing the COS.

[0021] (2) A fast-axis collimating lens is placed inside the clamp;

[0022] (3) The high-precision six-axis motion control system controls the fine adjustment of the clamp, the beam quality analysis system monitors the beam quality at different positions of the fast axis collimating lens in real time, and the vision system monitors the distance between the fast axis collimating lens and the COS end face to prevent the fast axis collimating lens from hitting the COS end face and damaging the fast axis collimating lens and COS. When the beam quality reaches the set value, the position of the fast axis collimating lens in six directions is recorded.

[0023] (4) The fast axis collimating lens is retracted, and adhesive is applied to the COS.

[0024] (5) After the dispensing is completed, the fast axis collimating lens returns to the recording position, the ultraviolet mercury lamp is turned on, and the adhesive is cured until the curing is complete;

[0025] (6) The cylinder extends, the spring needle disengages from the COS, and then the COS after alignment is completed is removed.

[0026] The beneficial effects of this invention are as follows:

[0027] 1. This invention uses a beam quality analysis system and a vision system to control and adjust the position of the collimating lens in six directions in real time, thereby automating the fast axis collimation of semiconductor lasers, improving collimation accuracy, avoiding manual operation, and increasing production efficiency.

[0028] 2. The vision system of the present invention can monitor the position of the fast-axis collimating lens in real time, prevent the fast-axis collimating lens from hitting the COS cavity surface and avoid damage, and allow personnel to observe the position of the collimating lens.

[0029] 3. This invention is simple to assemble, has high motion precision, is easy to operate, and is easy to achieve full automation. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the present invention;

[0031] Figure 2 This is a side view of the structure of the present invention;

[0032] Figure 3 This is a schematic diagram of the high-precision six-axis motion control system of the present invention;

[0033] Figure 4 This is a schematic diagram of the COS positioning and power supply system of the present invention;

[0034] Figure 5 This is a schematic diagram of the beam quality analysis system of the present invention;

[0035] Figure 6 This is a schematic diagram of the air flotation platform system structure of the present invention;

[0036] Figure 7 This is a side view of the positioning device of the present invention;

[0037] In the diagram, 1. COS positioning and power supply system; 2. Beam quality analysis system; 3. High-precision six-axis motion control system; 4. Vision system; 5. Clamp; 6. Cylinder; 7. Positioning device; 8. Spring pin; 9. Connecting plate; 10. Fixing clamp; 11. Ultraviolet mercury lamp; 12. Fixing base; 13. COS. Detailed Implementation

[0038] The present invention will be further described below with reference to the embodiments and accompanying drawings, but is not limited thereto.

[0039] Example 1:

[0040] like Figures 1-6 As shown, this embodiment provides a fast-axis collimation system for a high-precision semiconductor laser, including an air-floating platform, a vision system 4, a COS positioning and power supply system 1, a high-precision six-axis motion control system 3, and a beam quality analysis system 2. The high-precision six-axis motion control system 3 is installed on the air-floating platform, the COS positioning and power supply system 1 is installed on one side of the high-precision six-axis motion control system 3, the vision system 4 is installed on one side of the COS positioning and power supply system 1, and the beam quality analysis system is installed on the light-emitting side of the COS positioning and power supply system 1.

[0041] The high-precision six-axis motion control system is a six-axis motion platform, which is an existing device used to achieve six-axis position adjustment of the fast-axis collimating lens. The beam quality analysis system adopts the existing beam analyzer Ophir-Spiricon, model NS-GE / 9 / 5-Pro. The vision system is an existing device that uses an industrial camera and a long lens to monitor the distance between the fast-axis collimating lens and the COS end face.

[0042] The high-precision six-axis motion control system 3 has a clamp 5 on its operating table, which clamps the fast-axis collimating lens.

[0043] The clamping device 5 includes a clamping platform with two elastic clamping plates that clamp the fast-axis collimating lens. The clamping platform is L-shaped and, in conjunction with the positioning device, ensures that the fast-axis collimating lens can fit the COS.

[0044] COS positioning and power supply system 1 includes a cylinder 6, a positioning device 7, a conductive device, a connecting plate 9, a fixing clamp 10, an ultraviolet mercury lamp 11, and a fixing base 12. The positioning device 7 is provided on the top surface of the fixing base 12, and the cylinder 6 is provided on the side of the fixing base 12. The cylinder 6 is connected to the connecting plate 9, which is an L-shaped plate. Fixing clamps 10 are provided on both sides of the top of the connecting plate 9. The ultraviolet mercury lamp 11 is provided inside the fixing clamp 10. The conductive device is fixed at the middle position of the top of the connecting plate 9, and the conductive device is located above the positioning device.

[0045] The conductive device includes a fixed block and spring pins 8. The fixed block is connected to the connecting plate, and spring pins are evenly arranged inside the fixed block. The spring pins are connected to a power source and are located above the positioning device. When the cylinder extends or retracts, it drives the spring pins to move up and down through the connecting plate. The spring pins can both energize the COS on the positioning device and fix the COS by compression.

[0046] The number of spring pins 8 is twice the number of COS pins, and two adjacent spring pins correspond to one COS pin, ensuring that the COS pins are energized.

[0047] The cylinder, vision system, high-precision six-axis motion control system, and beam quality analysis system are all connected to a computer control system.

[0048] The operation steps for applying the fast-axis collimation system of the aforementioned high-precision semiconductor laser are as follows:

[0049] (1) Place the COS on the protruding end of the positioning device, with the light-emitting side of the COS corresponding to the clamp. The cylinder retracts, driving the spring pin to press down and fix the COS while energizing the COS.

[0050] (2) A fast-axis collimating lens is placed inside the clamp;

[0051] (3) The high-precision six-axis motion control system controls the fine adjustment of the clamp, the beam quality analysis system monitors the beam quality at different positions of the fast axis collimating lens in real time, and the vision system monitors the distance between the fast axis collimating lens and the COS end face to prevent the fast axis collimating lens from hitting the COS end face and damaging the fast axis collimating lens and COS. When the beam quality reaches the set value, the position of the fast axis collimating lens in six directions is recorded.

[0052] (4) The fast axis collimating lens is retracted, and adhesive is applied to the COS.

[0053] (5) After the dispensing is completed, the fast axis collimating lens returns to the recording position, the ultraviolet mercury lamp is turned on, and the adhesive is cured until the curing is complete;

[0054] (6) The cylinder extends, the spring needle disengages from the COS, and then the COS after alignment is completed is removed.

[0055] Example 2:

[0056] A fast-axis collimation system for a high-precision semiconductor laser, with the structure described in Embodiment 1, differs in that the positioning device 7 is an L-shaped mounting stage, as shown below. Figure 7 As shown, the positioning device is located on one side of the top surface of the fixed base.

Claims

1. An application of a fast-axis collimation system for a high-precision semiconductor laser, characterized in that, The system includes an air-floating platform, a vision system, a COS positioning and power supply system, a high-precision six-axis motion control system, and a beam quality analysis system. The high-precision six-axis motion control system is installed on the air-floating platform. The COS positioning and power supply system is installed on one side of the high-precision six-axis motion control system. The vision system is installed on one side of the COS positioning and power supply system. The beam quality analysis system is installed on the light-emitting side of the COS positioning and power supply system. The high-precision six-axis motion control system is equipped with a clamp on its operating table; The COS positioning and power supply system includes a cylinder, a positioning device, a conductive device, a connecting plate, a fixing clamp, an ultraviolet mercury lamp, and a fixing base. The positioning device is installed on the top surface of the fixing base, and the cylinder is installed on the side of the fixing base. The cylinder is connected to the connecting plate, which is an L-shaped plate. Fixing clamps are installed on both sides of the top of the connecting plate, and ultraviolet mercury lamps are installed inside the fixing clamps. The conductive device is fixed in the middle of the top of the connecting plate and is located above the positioning device. The conductive device includes a fixed block and spring pins. The fixed block is connected to the connecting plate. Spring pins are evenly and fixedly arranged inside the fixed block. The spring pins are connected to a power source and are located above the positioning device. The operation steps for applying the fast-axis collimation system of the aforementioned high-precision semiconductor laser are as follows: (1) Place the COS on the protruding end of the positioning device, with the light-emitting side of the COS corresponding to the clamp. The cylinder retracts, driving the spring pin to press down, fixing the COS while simultaneously energizing the COS. (2) A fast-axis collimating lens is placed inside the clamp; (3) The high-precision six-axis motion control system controls the fine adjustment of the clamp, the beam quality analysis system monitors the beam quality at different positions of the fast axis collimating lens in real time, and the vision system monitors the distance between the fast axis collimating lens and the COS end face. When the beam quality reaches the set value, the position of the fast axis collimating lens in six directions is recorded. (4) The fast-axis collimating lens is retracted, and adhesive is applied to the COS; (5) After the dispensing is completed, the fast axis collimating lens returns to the recording position, the ultraviolet mercury lamp is turned on, and the adhesive is cured until the curing is complete; (6) The cylinder extends, the spring needle disengages from the COS, and then the COS after alignment is completed is removed.

2. The application of the fast-axis collimation system for a high-precision semiconductor laser as described in claim 1, characterized in that, The clamp includes a clamping platform with two elastic clamping plates.

3. The application of the fast-axis collimation system for a high-precision semiconductor laser as described in claim 1, characterized in that, The positioning device is an L-shaped mounting platform, and the positioning device is located on one side of the top surface of the fixed base.

4. The application of the fast-axis collimation system for a high-precision semiconductor laser as described in claim 1, characterized in that, The number of spring pins is twice the number of COS, and two adjacent spring pins correspond to one COS.

5. The application of the fast-axis collimation system for a high-precision semiconductor laser as described in claim 1, characterized in that, The cylinder, vision system, high-precision six-axis motion control system, and beam quality analysis system are all connected to a computer control system.

Images