Processing system

Abstract

The processing system of the present invention includes: a holding device capable of rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object with an energy beam; an object measuring device for measuring the object; and a control device for controlling at least one of the beam irradiation device and the rotating device based on information related to the object measured by the object measuring device and information about the rotation axis of the rotating device, thereby processing the object by irradiating the object held by the holding device with an energy beam from the beam irradiation device.

Description

Technical Field

[0001] This invention relates to the technical field of a processing system that can use energy beams to process objects. Background Technology

[0002] Patent document 1 describes a processing system that processes an object by irradiating it with a laser. In this processing system, it is required to process the object appropriately.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Description of U.S. Patent Application No. 4,427,872 Summary of the Invention

[0006] According to a first embodiment, a processing system is provided, comprising: a holding device capable of rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; and a control device for controlling at least one of the beam irradiation device and the rotating device based on information related to the object measured by the object measuring device and information about the rotation axis of the rotating device, to process the object by irradiating the object held by the holding device with an energy beam from the beam irradiation device.

[0007] According to a second embodiment, a processing system is provided, comprising: a holding device capable of rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; and a control device for controlling at least one of the beam irradiation device and the rotating device based on the deviation of the object from the rotation axis of the rotating device as measured by the object measuring device, to process the object by irradiating the object held by the holding device with an energy beam from the beam irradiation device.

[0008] According to a third embodiment, a processing system is provided, comprising: a holding device capable of rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; and a control device for controlling at least one of the beam irradiation device and the rotating device based on information related to the object measured by the object measuring device and information on at least one of the position and orientation of the rotating device, to process the object by irradiating the object held by the holding device with an energy beam from the beam irradiation device.

[0009] According to a fourth embodiment, a processing system is provided, comprising: a holding device capable of rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; a beam measuring device for measuring the energy beam from the beam irradiation device; and a control device for controlling the beam irradiation device based on information related to the energy beam measured by the beam measuring device, thereby processing the object by irradiating the object held by the holding device with the energy beam from the beam irradiation device.

[0010] According to a fifth embodiment, a processing system is provided, comprising: a holding device rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; a beam measuring device for measuring the energy beam from the beam irradiation device; a moving device for moving at least one of the beam irradiation device and the beam measuring device; and a control device for controlling at least the moving device, the control device moving at least one of the beam irradiation device and the beam measuring device to a position where the beam measuring device can measure the energy beam from the beam irradiation device, and moving at least one of the beam irradiation device and the beam measuring device to a position where at least a portion of the beam measuring device can be measured by the object measuring device.

[0011] According to a sixth embodiment, a processing system is provided, comprising: a holding device rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; a beam measuring device for measuring the energy beam from the beam irradiation device; a moving device for moving at least one of the beam irradiation device and the beam measuring device; an acquisition device for acquiring information related to at least one of the positions of the beam irradiation device and the beam measuring device; and a control device for controlling at least the moving device, wherein the control device moves at least one of the beam irradiation device and the beam measuring device to an irradiable position where the beam irradiation device can irradiate at least a portion of the beam measuring device with the energy beam, the acquisition device is used to acquire irradiation position information related to the position of the beam irradiation device moved to the irradiable position and the position of the beam measuring device, and the acquisition device is used to control the position of the beam irradiation device and the position of the beam measuring device based on the irradiation position information.

[0012] According to a seventh embodiment, a processing system is provided, comprising: a holding device rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; a beam measuring device for measuring the energy beam from the beam irradiation device; a moving device for moving at least one of the beam irradiation device and the beam measuring device; an acquisition device for acquiring information related to at least one of the positions of the beam irradiation device and the beam measuring device; and a control device for controlling at least the moving device, wherein the control device moves at least one of the beam irradiation device and the beam measuring device to a measurable position in which the object measuring device can measure at least a portion of the beam measuring device, the acquisition device is used to acquire measurement position information related to the position of the beam irradiation device moved to the measurable position and the position of the beam measuring device, and the position of the beam irradiation device and the position of the beam measuring device are controlled based on the measurement position information.

[0013] According to an eighth embodiment, a processing system is provided, comprising: a holding device capable of rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the three-dimensional shape of the surface of the object; and a control device for controlling at least one of the beam irradiation device and the rotating device based on the measurement results of the object measuring device, thereby processing the object by irradiating the object held by the holding device with an energy beam from the beam irradiation device.

[0014] According to a ninth embodiment, a processing system is provided, comprising: a holding device for holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; and a control device for controlling the beam irradiation device based on the measurement result of the object by the object measuring device, wherein the beam irradiation device changes the irradiation position of the energy beam on the surface of the object along the surface of the object during the period when the beam irradiation device irradiates the object with the energy beam, and the control device controls the beam irradiation device based on the measurement result of the object including processing marks produced by the energy beam.

[0015] According to a tenth embodiment, a processing system is provided, comprising: a holding device for holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; a control device for controlling at least one of the beam irradiation device and the rotating device based on the measurement result of the object by the object measuring device; and a moving device for moving the rotating device, wherein the object measuring device measures the object whenever the moving device moves the rotating device in a direction, and the control device controls at least one of the beam irradiation device and the moving device based on the measurement result of the object by the object measuring device during the irradiation of the object by the beam irradiation device with the energy beam.

[0016] According to the eleventh embodiment, a processing system is provided, comprising: a holding device for holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; and a control device for controlling at least one of the beam irradiation device and the rotating device based on the measurement result of the object by the object measuring device, wherein the object measuring device measures the object whenever the rotating device rotates the object by a predetermined rotation angle, and the control device controls the beam irradiation device based on the measurement result of the object measuring device.

[0017] According to a twelfth embodiment, a processing system is provided, comprising: a holding device for holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; a control device for controlling at least one of the beam irradiation device and the rotating device based on the measurement result of the object by the object measuring device; and a beam measuring device disposed on the rotating device for measuring the energy beam from the beam irradiation device.

[0018] According to a thirteenth embodiment, a processing system is provided, comprising: a holding device capable of rotatably holding an object; a rotating device for rotating the holding device; a beam irradiation device for irradiating the object held by the holding device with an energy beam; an object measuring device for measuring the object; a changing device for changing the irradiation position of the energy beam irradiated onto the object; and a control device for controlling at least one of the rotating device and the changing device, the control device controlling the rotating device and the changing device based on information related to the object measured by the object measuring device, so as to rotate the holding device and change the irradiation position, thereby processing the object by irradiating the object held by the holding device with an energy beam from the beam irradiation device. Attached Figure Description

[0019] Figure 1 This is a perspective view schematically showing the appearance of the processing system of this embodiment.

[0020] Figure 2 This is a system structure diagram showing the system structure of the processing system in this embodiment.

[0021] Figure 3 (a) to (c) are cross-sectional views showing the removal processes performed on the workpiece.

[0022] Figure 4 It is a cross-sectional view showing the structure of the illumination optical system.

[0023] Figure 5 It is a cross-sectional view showing the structure of the rotating device.

[0024] Figure 6 It is a plan view showing the structure of the measuring device.

[0025] Figure 7 It is a cross-sectional view showing the structure of the measuring device.

[0026] Figure 8 It is a flowchart representing the process of processing actions.

[0027] Figure 9 It is a three-dimensional view of a workpiece in the process of being processed.

[0028] Figure 10 It is a cross-sectional view showing the machining light that is irradiated onto the workpiece.

[0029] Figure 11 This is a cross-sectional view showing another example of machining light irradiating a workpiece.

[0030] Figure 12 This is a perspective view showing another example of machining light irradiating a workpiece.

[0031] Figure 13 This is a cross-sectional view showing an example of a beam collector.

[0032] Figure 14 This is a flowchart representing the process of generating information for the first axis.

[0033] Figure 15 It is a plan view showing the height image of the test workpiece as an example of the measurement results of the test workpiece.

[0034] Figure 16 This is a top view of the test workpiece.

[0035] Figure 17 (a) is a top view of an ideal test workpiece where the direction of rotation extends parallel (or coincides with) the direction of movement of the stage. Figure 17 (b) means equivalent to Figure 17 (a) is a plan view of the height image of the test workpiece as shown in the measurement results. Figure 17 (c) is a top view of the test workpiece, indicating that the direction in which the rotation axis extends is not parallel (or inconsistent) with the direction of movement of the stage. Figure 17 (d) means equivalent to Figure 17 (c) is a plan view of the height image of the test workpiece as shown in the measurement results.

[0036] Figure 18 This is a flowchart illustrating another example of the process of generating information for the first axis.

[0037] Figure 19 (a) is a plan view representing the height image of the ideal test workpiece, where the direction of rotation is parallel (or consistent) with the direction of movement of the stage. Figure 19 (b) is a plan view showing the height image of the test workpiece, which is not parallel (or inconsistent) to the direction of movement of the stage, corresponding to the direction of the rotation axis.

[0038] Figure 20 This is a flowchart representing the process of generating information for the second axis.

[0039] Figure 21 (a) is a top view of an ideal test workpiece where the direction in which the rotation axis extends is parallel (or consistent with) the scanning direction of the machining light. Figure 21 (b) means equivalent to Figure 21 (a) is a plan view of the height image of the test workpiece as shown in the measurement results. Figure 21 (c) is a top view of the test workpiece, indicating that the direction in which the rotation axis extends is not parallel (or inconsistent) with the scanning direction of the machining light. Figure 21(d) means equivalent to Figure 21 (c) is a plan view of the height image of the test workpiece as shown in the measurement results.

[0040] Figure 22 (a) and Figure 22 (b) is a top view showing the workpieces that have clamping errors.

[0041] Figure 23 It is a flowchart representing the process of generating third-axis information (especially the process of generating eccentricity error information).

[0042] Figure 24 It is a cross-sectional view showing the ideal case of a workpiece rotating with its central axis aligned with its rotation axis.

[0043] Figure 25 It means Figure 24 The graph shows the relationship between the position of the workpiece's endpoint in the Z-axis direction and the workpiece's rotation angle.

[0044] Figure 26 It is a cross-sectional view showing the rotation of a workpiece where the central axis is parallel but not aligned with the axis of rotation.

[0045] Figure 27 It means Figure 26 The graph shows the relationship between the position of the workpiece's endpoint in the Z-axis direction and the workpiece's rotation angle.

[0046] Figure 28 It is a cross-sectional view showing the rotation of a workpiece where the central axis is parallel but not aligned with the axis of rotation.

[0047] Figure 29 It means Figure 28 The graph shows the relationship between the position of the workpiece's endpoint in the Z-axis direction and the workpiece's rotation angle.

[0048] Figure 30 This is a cross-sectional view showing an example of the irradiation position of a processing light EL controlled based on eccentricity error information.

[0049] Figure 31 It is a flowchart representing the process of generating third-axis information (especially the process of generating deflection error information).

[0050] Figure 32 This is a top view showing the workpiece that has developed an angular error.

[0051] Figure 33 (a) is a cross-sectional view showing the machining head illuminating the measuring device with machining light. Figure 33 (b) is a plan view showing the machining head illuminating the measuring device with machining light. Figure 33(c) is a graph showing the light reception results of the light-receiving elements included in the measuring device on the processing light.

[0052] Figure 34 It is a cross-sectional view representing the processing light.

[0053] Figure 35 (a) is a cross-sectional view showing the machining light illuminating the workpiece from a direction twisted relative to the axis of rotation. Figure 35 (b) is a cross-sectional view of the processing light with the aperture angle controlled.

[0054] Figure 36 This is a cross-sectional view showing the measuring device used to measure the processing light.

[0055] Figure 37 This is a cross-sectional view showing the measuring device used to measure the processing light.

[0056] Figure 38 This is a cross-sectional view showing the measuring device used to measure the processing light.

[0057] Figure 39 This is a cross-sectional view showing the measuring device used to measure the processing light.

[0058] Figure 40 (a) is a cross-sectional view showing an example of the relative baseline, the processing baseline, and the measurement baseline. Figure 40 (b) is a plan view showing an example of the relative baseline, the processing baseline, and the measurement baseline.

[0059] Figure 41 It is a perspective view schematically showing the appearance of the machining system of the first modified example.

[0060] Figure 42 It is a perspective view schematically showing the appearance of the machining system of the second variation.

[0061] Figure 43 This is a system structure diagram representing the system structure of the machining system in the second variation.

[0062] Figure 44 This is a cross-sectional view showing the structure of the illumination optical system in the second modified example.

[0063] Figure 45 It is a perspective view schematically showing the appearance of the machining system of the third variation.

[0064] [Explanation of Symbols]

[0065] 1: Processing equipment

[0066] 11: Processing head

[0067] 2: Measuring device

[0068] 3: Platform device

[0069] 32: Platform

[0070] 35: Rotating device

[0071] 3521: Rotation axis

[0072] 3522: Rotary shaft

[0073] 36: Measuring device

[0074] 361: Beam passing through components

[0075] 362: Light receiving element

[0076] 363: Opening

[0077] 364: Attenuation region

[0078] 365: Through the region

[0079] 366: Mark

[0080] EL: Processing light

[0081] ML: Measurement of light

[0082] W: Workpiece

[0083] SYS: Machining System Detailed Implementation

[0084] Hereinafter, embodiments of the machining system will be described with reference to the accompanying drawings. The following describes a machining system SYS that uses a machining beam EL, which is an example of an energy beam, to machine a workpiece W, and embodiments of the machining system and measuring components will be explained. However, the present invention is not limited to the embodiments described below.

[0085] Furthermore, in the following explanation, an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis is used to describe the positional relationships of the various constituent elements of the machining system SYS. Additionally, for ease of explanation, the X-axis and Y-axis directions are assumed to be horizontal (i.e., defined directions within the horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction orthogonal to the horizontal plane, essentially a vertical direction). The directions of rotation (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as θX, θY, and θZ, respectively. Here, the Z-axis direction can also be considered the direction of gravity. Furthermore, the XY plane can also be considered horizontal.

[0086] (1) Structure of the machining system SYS

[0087] First, refer to Figure 1as well as Figure 2 The structure of the processing system SYS in this embodiment will be explained. Figure 1 This is a perspective view schematically showing the appearance of the processing system SYS of this embodiment. Figure 2 This is a system structure diagram showing the system structure of the processing system SYS in this embodiment.

[0088] like Figure 1 as well as Figure 2 As shown, the machining system SYS includes a machining device 1, a measuring device 2, a stage device 3, and a control device 4. The machining device 1, measuring device 2, and stage device 3 are housed within a housing 5. However, the machining device 1, measuring device 2, and stage device 3 may not be housed within the housing 5. That is, the machining system SYS may also not include the housing 5 housing the machining device 1, measuring device 2, and stage device 3. Furthermore, Figure 1 In the X-axis direction, the measuring device 2 is positioned closer to the rotating device 35 than the machining device 1, but it can also be configured in the opposite direction.

[0089] The processing device 1 can process the workpiece W under the control of the control device 4. The workpiece W is an object processed by the processing device 1. The workpiece W can be, for example, a metal, an alloy (e.g., duralumin), a semiconductor (e.g., silicon), a resin, a composite material such as carbon fiber reinforced plastic (CFRP), glass, ceramic, or any other material.

[0090] The processing apparatus 1 can also irradiate the workpiece W with processing light EL to perform a removal process that removes a portion of the workpiece W. The removal process may also include at least one of the following: planar processing, cylindrical processing, hole-making processing, smoothing processing, cutting processing, and engraving processing (in other words, engraving processing) that forms arbitrary text or patterns (in other words, carving).

[0091] Here, refer to Figure 3 Figures (a) to (c) illustrate an example of removal processing using processing light EL. Figure 3 Figures (a) to (c) are cross-sectional views showing the removal processes performed on workpiece W. Figure 3As shown in (a), the processing apparatus 1 irradiates a processing light EL onto a target irradiation area EA set (in other words, formed) on the surface of the workpiece W. When the processing light EL is irradiated onto the target irradiation area EA, the energy of the processing light EL is transferred to the target irradiation area EA and the portion adjacent to the target irradiation area EA in the workpiece W. During the heat transfer caused by the energy of the processing light EL, the material constituting the target irradiation area EA and the portion adjacent to the target irradiation area EA in the workpiece W melts due to the heat caused by the energy of the processing light EL. The molten material becomes droplets and disperses. Alternatively, the molten material evaporates due to the heat caused by the energy of the processing light EL. As a result, the target irradiation area EA and the portion adjacent to the target irradiation area EA in the workpiece W are removed. That is, as... Figure 3 As shown in (b), a recess (in other words, a groove) is formed on the surface of the workpiece W. At this point, it can be said that the processing apparatus 1 processes the workpiece W using the principle of so-called thermal processing. Furthermore, the processing apparatus 1 uses the galvanometer lens 1214 (described later) to move the target irradiation area EA on the surface of the workpiece W. That is, the processing apparatus 1 uses the processing light EL to scan the surface of the workpiece W. As a result, as... Figure 3 As shown in (c), the surface of the workpiece W is at least partially removed along the scanning trajectory of the processing light EL (i.e., the movement trajectory of the target irradiation area EA). Therefore, by causing the processing apparatus 1 to scan the surface of the workpiece W along the desired scanning trajectory corresponding to the area to be removed, the processing apparatus 1 is able to properly remove the portion of the workpiece W to be removed.

[0092] On the other hand, based on the characteristics of the processing light EL, the processing apparatus 1 can also process the workpiece W using the principle of non-thermal processing (e.g., ablation processing). That is, the processing apparatus 1 can also perform non-thermal processing (e.g., ablation processing) on ​​the workpiece W. For example, when a pulsed light with a emission time of picosecond or less (or, depending on the case, nanosecond or femtosecond or less) is used as the processing light EL, the material constituting the target irradiation area EA in the workpiece W and the portion close to the target irradiation area EA evaporates and disperses instantaneously. In addition, when a pulsed light with a emission time of picosecond or less (or, depending on the case, nanosecond or femtosecond or less) is used as the processing light EL, the material constituting the target irradiation area EA in the workpiece W and the portion close to the target irradiation area EA sometimes sublimates without going through a molten state. Therefore, the effect of heat caused by the energy of the processing light EL on the workpiece W can be suppressed to a great extent, and a concave portion (in other words, a groove) can be formed on the surface of the workpiece W.

[0093] In the case of removal processing, the processing apparatus 1 may also form a riblet structure on the workpiece W. The riblet structure may also be a structure capable of reducing the surface resistance of the workpiece W to the fluid (especially at least one of frictional resistance and turbulent frictional resistance). The riblet structure may also include a structure capable of reducing noise generated when the fluid moves relative to the surface of the workpiece W. The riblet structure may also include, for example, a structure consisting of a plurality of grooves extending along a first direction (e.g., the Y-axis direction) along the surface of the workpiece W and arranged along a second direction (e.g., the X-axis direction), the second direction being along the surface of the workpiece W and intersecting the first direction.

[0094] In the case of removal processing, the processing apparatus 1 can also form arbitrary structures of arbitrary shapes on the surface of the workpiece W. As an example of an arbitrary structure, a structure that generates vortices in the flow of fluid on the surface of the workpiece W can be listed. As another example of an arbitrary structure, a structure used to impart hydrophobicity to the surface of the workpiece W can be listed. As yet another example of an arbitrary structure, a micro-nanoscale fine texture structure (typically an uneven structure) formed regularly or irregularly can be listed. Such a fine texture structure may also include at least one of a sharkskin structure and a dimple structure that reduces resistance caused by fluids (gases and / or liquids). The fine texture structure may also include a lotus surface structure that has at least one of hydrophobic and self-cleaning functions (e.g., a lotus effect). The fine texture structure may also include at least one of the following: a fine protrusion structure with liquid transport function (see U.S. Patent Publication No. 2017 / 0044002); a texture structure with hydrophilic function; a texture structure with antifouling function; a moth-eye structure with at least one of reflectivity reduction function and hydrophobic function; a texture structure that enhances light of a specific wavelength through interference to produce structural color; a pillar array structure with adhesive function utilizing van der Waals' force; a texture structure with aerodynamic noise reduction function; a honeycomb structure with droplet trapping function; and a texture structure that improves the adhesion to layers formed on the surface.

[0095] Again in Figure 1 as well as Figure 2 In order to process workpiece W, the processing device 1 includes a processing light source 11, a processing head 12, a head drive system 13, and a position measuring device 14.

[0096] The processing light source 11 emits at least one of infrared light, visible light, ultraviolet light, and extreme ultraviolet light as the processing light EL. However, other types of light may also be used as the processing light EL. The processing light EL may also include pulsed light (i.e., multiple pulsed beams). The processing light EL may also be a laser. In this case, the processing light source 11 may also include a laser light source (e.g., a semiconductor laser such as a laser diode (LD)). The laser light source may also include at least one of a fiber laser, a CO2 laser, a yttrium aluminum garnet (YAG) laser, and an excimer laser. However, the processing light EL may not be a laser. The processing light source 11 may also include any light source (e.g., at least one of a light-emitting diode (LED) and a discharge lamp).

[0097] The machining head 12 irradiates the workpiece W with machining light EL from the machining light source 11. Therefore, the machining head 12 can also be referred to as a beam irradiation device. Figure 1 In the example shown, a stage 32 for placing a workpiece W is disposed below the machining head 12. Therefore, the machining head 12 illuminates the workpiece W by emitting machining light EL downwards from the machining head 12. To illuminate the workpiece W with the machining light EL, the machining head 12 includes an illumination optical system 121. Hereinafter, with reference to... Figure 4 Meanwhile, the illumination optical system 121 will be explained. Figure 4 This is a cross-sectional view schematically showing the structure of the illumination optical system 121.

[0098] like Figure 4 As shown, the illumination optical system 121 includes, for example, a focusing position changing optical system 1210, an aperture angle changing optical system 1211, an ellipticity changing optical system 1212, an optical rotation optical system 1213, a galvanometer mirror 1214, and an fθ lens 1215. However, the illumination optical system 121 may also exclude at least one of the focusing position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the optical rotation optical system 1213.

[0099] The focusing position changing optical system 1210 is an optical component capable of changing the focusing position (i.e., the convergence position) of the processing light EL along the travel direction of the processing light EL. The focusing position changing optical system 1210 may, for example, include multiple lenses arranged along the travel direction of the processing light EL. In this case, the focusing position of the processing light EL can also be changed by moving at least one of the multiple lenses along the optical axis direction.

[0100] The aperture angle changing optical system 1211 is an optical component capable of changing the aperture angle of the processing light EL emitted from the processing head 12. In this embodiment, "aperture angle of the processing light EL" may also refer to the angle formed by the outermost ray of the processing light EL. Alternatively, in this embodiment, "aperture angle of the processing light EL" may also refer to the angle formed by the outermost ray of the processing light EL and the principal ray of the processing light EL. In this case, the aperture angle changing optical system 1211 can essentially be considered as changing the numerical aperture of the illumination optical system 121. Furthermore, the aperture angle changing optical system 1211 may also be referred to as an aperture angle changing device.

[0101] The ellipticity-changing optical system 1212 is an optical component capable of changing the ellipticity of the processing light EL emitted from the processing head 12. Specifically, the ellipticity-changing optical system 1212 changes the ellipticity of a point of the processing light EL within a plane intersecting the illumination axis EX along the travel direction of the processing light EL. For example, the ellipticity-changing optical system 1212 may also include optical components (e.g., at least one of a toric lens and a cylindrical lens) with different refractive powers in two orthogonal directions, changing the ellipticity by rotating the optical components about the optical axis or about an axis parallel to the optical axis. For example, the ellipticity-changing optical system 1212 may also include multiple optical components, changing the ellipticity by changing the spacing of the optical axis directions of the multiple optical components, etc. Here, at least one of the multiple optical components may also be an optical component having a refractive power asymmetrical about the optical axis. In addition, the illumination axis EX is typically an axis extending along the principal ray of the processing light EL. The principal ray of the processing light EL can also be a line connecting the center of light quantity on a first cross-section that intersects the direction of travel of the processing light EL, and the center of light quantity on a second cross-section that intersects the direction of travel and is different from the first cross-section. Figure 4 In the example shown, the illumination axis EX is parallel to the optical axis AX of the fθ lens 1215, but the illumination axis EX may also be tilted relative to the optical axis AX of the fθ lens 1215. Figure 4 In the example shown, the illumination axis EX is parallel to the Z-axis, but the illumination axis EX can also be tilted relative to the Z-axis.

[0102] Furthermore, changing the ellipticity can also be considered substantially equivalent to changing at least one of the aperture angle of the processing light EL within the first surface containing the illumination axis EX, and the aperture angle of the processing light EL within the second surface containing the illumination axis EX and intersecting the first surface. Therefore, the ellipticity changing optical system 1212 can also be referred to as an aperture angle changing optical system or an aperture angle changing device. In this case, the aperture angle changing optical system 1211 can also function as at least a part of the ellipticity changing optical system 1212.

[0103] The optical rotation optical system 1213 is an optical component capable of rotating a point of the processed light EL about the optical axis AX (especially about the illumination axis EX) within a plane intersecting the illumination axis EX. In this embodiment, the optical rotation optical system 1213 rotates about the optical axis AX (especially about the illumination axis EX) in the direction of the maximum value of the diameter of the point of the processed light EL (i.e., the cross-section of the processed light EL) on the entrance pupil surface of the fθ lens 1215. That is, the optical rotation optical system 1213 rotates about the optical axis AX (especially about the illumination axis EX) in the direction where the diameter of the point of the processed light EL (i.e., the cross-section of the processed light EL) on the entrance pupil surface of the fθ lens 1215 reaches its maximum. This can also be considered as the optical rotation optical system 1213 rotating about the optical axis AX (especially about the illumination axis EX) in the direction of either the major axis or the minor axis of the point of the processed light EL on the entrance pupil surface of the fθ lens 1215. For example, the optical rotation optical system 1213 may also include an optical component rotatable about an optical axis, thereby rotating the point of the processed optical EL by rotating the optical component about the optical axis. Such an optical component may also be called a beam rotator. Therefore, the optical rotation optical system 1213 may also be called a beam rotating component. Furthermore, the ellipticity changing optical system 1212 and the optical rotation optical system 1213 may also be used concurrently.

[0104] The processing light EL, transmitted through the focusing position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the optical rotation optical system 1213, is incident on the galvanometer mirror 1214. The galvanometer mirror 1214 changes the emission direction of the processing light EL by deflecting it (i.e., changing the emission angle of the processing light EL). Therefore, the galvanometer mirror 1214 can also be referred to as a beam deflection device. Furthermore, Figure 4 This illustrates an example where the emission direction of the machining light EL from the galvanometer lens 1214 is altered within the YZ plane. The galvanometer lens 1214 can also change the irradiation position of the machining light EL relative to the machining head 12 (e.g., the irradiation position of the machining light EL on the surface of the workpiece W) by changing the emission direction of the machining light EL from the galvanometer lens 1214. That is, the galvanometer lens 1214 can also change (i.e., move) the irradiation position of the machining light EL by deflecting it. Therefore, the galvanometer lens 1214 can also be referred to as a beam irradiation position changing device. Furthermore, Figure 4This illustrates an example where the irradiation position of the processing light EL is changed in the Y-axis direction. Furthermore, the galvanometer lens 1214 can also change the travel direction (i.e., the direction in which the irradiation axis EX extends) of the processing light EL from the processing head 12 by changing the emission direction of the processing light EL from the galvanometer lens 1214. In other words, the galvanometer lens 1214 can also change at least one of the irradiation position and the travel direction of the processing light EL. Therefore, the galvanometer lens 1214 can also be referred to as a beam irradiation state changing device capable of changing the irradiation state of a processing light EL, including at least one of the irradiation position and the travel direction.

[0105] The galvanometer mirror 1214 includes, for example, an X-scanning mirror 1214X and a Y-scanning mirror 1214Y. The X-scanning mirror 1214X and the Y-scanning mirror 1214Y are tilt-angle variable mirrors whose angles relative to the optical path of the processing light EL incident on each mirror are changeable. The X-scanning mirror 1214X reflects the processing light EL toward the Y-scanning mirror 1214Y. The X-scanning mirror 1214X can oscillate or rotate about a rotation axis along the Y-axis. By oscillating or rotating the X-scanning mirror 1214X, the processing light EL scans the surface of the workpiece W along the X-axis. By oscillating or rotating the X-scanning mirror 1214X, the target illumination area EA moves along the X-axis on the surface of the workpiece W. The Y-scanning mirror 1214Y reflects the processing light EL toward the fθ lens 1215. The Y-scanning mirror 1214Y can oscillate or rotate about a rotation axis along the X-axis. By oscillating or rotating the Y-scanning mirror 1214Y, the processing light EL scans the surface of the workpiece W along the Y-axis. By swinging or rotating the Y-scanning mirror 1214Y, the target irradiation area EA moves along the Y-axis on the surface of the workpiece W.

[0106] With this galvanometer lens 1214, the machining light EL can scan the machining emission area PSA defined with reference to the machining head 12. That is, with the galvanometer lens 1214, the target irradiation area EA can move within the machining emission area PSA defined with reference to the machining head 12. In addition, the machining emission area PSA refers to the area (in other words, range) where machining is performed by means of the machining apparatus 1 with the positional relationship between the machining head 12 and the workpiece W fixed (i.e., without change). Typically, the machining emission area PSA is set to be the same as, or narrower than, the maximum range that the machining light EL biased by the galvanometer lens 1214 can scan with the positional relationship between the machining head 12 and the workpiece W fixed. When the processing emission area PSA is smaller than the part of the workpiece W to be processed, the following actions are repeated: processing a part of the workpiece W by scanning the processing emission area PSA set on a part of the workpiece W with the processing light EL, and changing the position of the processing emission area PSA on the workpiece W by changing the relative position relationship between the processing head 12 and the workpiece W.

[0107] Alternatively, the illumination optical system 121 may include any optical component other than or replacing the galvanometer mirror 1214, capable of deflecting the processing light EL (i.e., changing at least one of the emission direction and illumination position of the processing light EL). As an example of such an optical component, a multifaceted mirror having multiple reflecting surfaces at different angles can be cited. The multifaceted mirror can rotate during the period when the processing light EL is irradiated onto a reflecting surface to change the incident angle of the processing light EL relative to the reflecting surface, and switch the reflecting surface irradiated by the processing light EL among the multiple reflecting surfaces. Furthermore, the illumination optical system 121 may also include a return light reduction optical system with polarizing optical components.

[0108] The fθ lens 1215 is an optical system for directing the processing light EL from the galvanometer lens 1214 toward the workpiece W. Specifically, the fθ lens 1215 is an optical element that focuses the processing light EL from the galvanometer lens 1214 onto a focusing surface that intersects the optical axis AX of the fθ lens 1215. Therefore, the fθ lens 1215 can also be referred to as a focusing optical system. The focusing surface of the fθ lens 1215 can, for example, be located on the emission side of the fθ lens 1215. The focusing surface of the fθ lens 1215 can, for example, be located on the surface of the workpiece W. In this case, the fθ lens 1215 can focus the processing light EL from the galvanometer lens 1214 onto the surface of the workpiece W.

[0109] Again in Figure 1 as well as Figure 2 In this process, the head drive system 13, under the control of the control device 4, moves the processing head 12, and even the irradiation optical system 121, along at least one of the X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis directions. Therefore, the head drive system 13 can also be referred to as a moving device. Figure 1 An example is shown where the head drive system 13 moves the machining head 12 along the Z-axis. In this case, the head drive system 13 may also include, for example, a Z-slider member 131 extending along the Z-axis. The Z-slider member 131 is disposed on a support frame 6, which is mounted on a table 31 (described later) via a vibration damping device. The support frame 6 may also include, for example, a pair of foot members 61, disposed on the table 31 via a vibration damping device and extending along the Z-axis; and a beam member 62, disposed on the pair of foot members 61 in a manner connecting the upper ends of the pair of foot members 61 and extending along the X-axis. The Z-slider member 131 is disposed on the beam member 62, for example, via a support member 63 extending along the Z-axis. The machining head 12 is connected to the Z-slider member 131 in a manner movable along the Z-slider member 131.

[0110] When the machining head 12 moves, the positional relationship between the machining head 12 and the stage 32 (described later) changes. Furthermore, when the machining head 12 moves, the positional relationship between the machining head 12 and the rotating device 35 (described later), which is mounted on the stage 32, changes. Furthermore, when the machining head 12 moves, the positional relationship between the machining head 12 and the workpiece W held by the rotating device 35 changes. Therefore, moving the machining head 12 can also be considered equivalent to changing the positional relationships between the machining head 12 and the stage 32, the rotating device 35, and the workpiece W. Moreover, when the machining head 12 moves, the irradiation position of the machining light EL on the surface of the workpiece W moves relative to the surface of the workpiece W. That is, the irradiation position of the machining light EL on the surface of the workpiece W changes on the surface of the workpiece W. Therefore, moving the machining head 12 can also be considered equivalent to changing the irradiation position of the machining light EL on the surface of the workpiece W.

[0111] The position measuring device 14 can measure (in other words, detect) the position of the machining head 12. That is, the position measuring device 14 is a device that can acquire information related to the position of the machining head 12. The position measuring device 14 may also include, for example, at least one of an encoder and a laser interferometer.

[0112] The measuring device 2 can measure the workpiece W under the control of the control device 4. Furthermore, since the measuring device 2 measures the workpiece W, it can also be called an object measuring device or a workpiece measuring device. For measuring the workpiece W, the measuring device 2 includes a measuring head 21, a head drive system 22, and a position measuring device 23.

[0113] The measuring head 21 can measure the workpiece W under the control of the control device 4. In this embodiment, the measuring head 21 performs three-dimensional measurement on the surface of the workpiece W. That is, the measuring head 21 measures the three-dimensional shape of the surface of the workpiece W. Therefore, the measuring head 21 may also include a three-dimensional measuring device 211 capable of measuring the three-dimensional shape of the surface of the workpiece W. Workpiece measurement information related to the measurement result of the measuring head 21 on the workpiece W (i.e., the measurement result of the three-dimensional measuring device 211 on the workpiece W) is output from the measuring head 21 to the control device 4. The control device 4 controls the operation of the machining system SYS based on the workpiece measurement information. Specifically, the control device 4 controls the machining system SYS (e.g., at least one of the machining device 1, the measuring device 2, and the stage device 3) based on the workpiece measurement information so that the machining system SYS can properly process the workpiece W. In addition, the measuring device 2, the measuring head 21, or the three-dimensional shape measuring device 211 can also be called an object information acquisition device or a workpiece information acquisition device because they acquire workpiece measurement information related to the three-dimensional shape of the surface of the workpiece W.

[0114] The three-dimensional measuring device 211 can also measure the workpiece W non-contactly. For example, the three-dimensional measuring device 211 can also measure the workpiece W optically. That is, the three-dimensional measuring device 211 can also use any measuring beam, such as measuring light, to measure the workpiece W. For example, the three-dimensional measuring device 211 can also use optical sectioning to measure the workpiece W, which is a method of projecting slit light onto the surface of the workpiece W and measuring the shape of the projected slit light. For example, the three-dimensional measuring device 211 can also use white interferometry to measure the workpiece W by measuring the interference pattern of white light passing through the workpiece W and white light not passing through the workpiece W. For example, the three-dimensional measuring device 211 may also use at least one of the following methods to measure the workpiece W: pattern projection, time-of-flight, moire topography (specifically, grating illumination or grating projection), holographic interferometry, autocollimation, stereo method, astigmatism, critical angle method, knife-edge method, interferometry, and confocal method. The pattern projection method involves projecting a light pattern onto the surface of the workpiece W and measuring the shape of the projected pattern. The time-of-flight method involves projecting light onto the surface of the workpiece W at multiple locations on the workpiece W and determining the distance to the workpiece W based on the time until the projected light returns. For example, the three-dimensional measuring device 211 may also measure the workpiece W by photographing it illuminated by illumination light. In either case, the three-dimensional measuring device 211 may include: a light source that emits a measuring light ML (e.g., slit light, white light, or illumination light); and a light receiver that receives light from the workpiece W illuminated by the measuring light ML (e.g., reflected light from the measuring light). In addition, the three-dimensional measuring instrument 211 can also contact and measure the workpiece W.

[0115] The measuring head 21 measures the workpiece W in units of the measurement emission area MSA. The measurement emission area MSA represents the area (in other words, range) measured by the measuring head 21 with the positional relationship between the measuring head 21 and the workpiece W fixed (i.e., without change). Typically, the measurement emission area MSA is set to be the same as or narrower than the maximum range of the measuring head 21 that can illuminate the measuring light ML with the positional relationship between the measuring head 21 and the workpiece W fixed (i.e., without change). Additionally, the measurement emission area MSA may also be referred to as the measurable range or measurable area of ​​the measuring head 21.

[0116] Figure 1 In the example shown, the measuring head 21 is aligned relative to the processing head 12 in such a way that the measuring axis MX of the measuring head 21 is not aligned with the irradiation axis EX along the travel direction of the processing light EL. Figure 1In the example shown, the measurement axis MX is parallel to the illumination axis EX. Alternatively, the measurement axis MX may also be an axis extending along the optical axis of the optical system included in the measurement head 21. The measurement axis MX may also be an axis extending along the principal ray of the measurement light ML from the measurement head 21. Alternatively, as explained in the first variation described later, the measurement axis MX may not be parallel to the illumination axis EX.

[0117] Under the control of the control device 4, the head drive system 22 moves the measuring head 21 along at least one of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions. Therefore, the head drive system 22 can also be referred to as a moving device. Figure 1 This illustrates an example of a head drive system 22 moving a measuring head 21 along the Z-axis. In this case, the head drive system 22 may also include, for example, a Z-slider member 221 extending along the Z-axis. The Z-slider member 221 may also be disposed on the beam member 62 via a support member 64 extending along the Z-axis. The measuring head 21 is connected to the Z-slider member 221 in a manner movable along the Z-slider member 221.

[0118] When the measuring head 21 moves, the positional relationships between the measuring head 21 and the stage 32, the rotating device 35, and the workpiece W change. Therefore, moving the measuring head 21 can also be considered equivalent to changing the positional relationships between the measuring head 21 and the stage 32, the rotating device 35, and the workpiece W.

[0119] The position measuring device 23 can measure (in other words, detect) the position of the measuring head 21. That is, the position measuring device 23 is a device that can acquire information related to the position of the measuring head 21. The position measuring device 23 may also include, for example, at least one of an encoder and a laser interferometer.

[0120] The stage device 3 includes a platform 31, a stage 32, a stage drive system 33, a position measuring device 34, a rotation device 35, and a measuring device 36.

[0121] The platform 31 is disposed on the bottom surface of the frame 5 (or on a supporting surface such as the floor surface on which the frame 5 is mounted). A platform 32 is disposed on the platform 31. A vibration damping device (not shown) for reducing the transmission of vibrations from the platform 31 to the platform 32 may also be provided between the bottom surface of the frame 5 or the supporting surface such as the floor surface on which the frame 5 is mounted and the platform 31. Furthermore, the aforementioned support frame 6 may also be disposed on the platform 31.

[0122] The stage 32 is a mounting device for placing the workpiece W. The stage 32 may also be able to hold the workpiece W placed on the stage 32. Alternatively, the stage 32 may not be able to hold the workpiece W placed on the stage 32. In this case, the workpiece W may also be placed on the stage 32 without clamps.

[0123] In this embodiment, the rotating device 35 is disposed on the stage 32. As will be detailed later, the rotating device 35 is a device that rotates the chuck 353, which is a holding device that rotatably holds the workpiece W. Therefore, in this embodiment, the workpiece W can be placed on the stage 32 or held by the rotating device 35 via the chuck 353. The processing head 12 can irradiate the workpiece W placed on the stage 32 with the processing light EL, or the workpiece W held by the rotating device 35 with the processing light EL. The measuring head 21 can measure the workpiece W placed on the stage 32 or the workpiece W held by the rotating device 35. Unless otherwise specified, the workpiece W is assumed to be held by the rotating device 35. In addition, since the rotating device 35 rotates the chuck 353 that holds the workpiece W, the rotating device 35 can also be regarded as a device that rotates the workpiece W.

[0124] The stage drive system 33 moves the stage 32 under the control of the control device 4. Therefore, the stage drive system 33 can also be referred to as a moving device. When the stage 32 moves, the rotating device 35 disposed on the stage 32 also moves with the stage 32. Moreover, when the stage 32 moves, the workpiece W placed on the stage 32 or held by the rotating device 35 on the stage 32 also moves with the stage 32. The stage drive system 33 moves the stage 32, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. Figure 1 In the example shown, the stage drive system 33 moves the stage 32 along the X-axis and Y-axis, respectively. That is, Figure 1 In the example shown, the stage drive system 33 moves the stage 32 along the direction of the XY plane, which intersects the respective travel directions of the processing light EL and the measurement light ML. In this case, the stage drive system 33 may also include, for example, an X-sliding member 331 extending along the X-axis direction. Figure 1 In the example shown, there are two X-sliding members 331 arranged parallel to each other, and a Y-sliding member 332 extending along the Y-axis direction. Figure 1 The example shown is a Y-sliding member 332. Two X-sliding members 331 are arranged on the platform 31 along the Y-axis. The Y-sliding member 332 is connected to the two X-sliding members 331 in a manner that allows it to move along the two X-sliding members 331. The platform 32 is connected to the Y-sliding member 332 in a manner that allows it to move along the Y-sliding member 332. Additionally, Figure 1 The example shows multiple X-sliding members 331, but there can also be only one X-sliding member. Furthermore, the platform 32 can also be a structure that is levitated and supported on the platform 31 using air bearings.

[0125] When the stage 32 moves, the positional relationships of the stage 32, the rotating device 35, and the workpiece W with respect to the machining head 12 and the measuring head 21 change. Therefore, moving the stage 32 can also be considered equivalent to changing the positional relationships of the stage 32, the rotating device 35, and the workpiece W with respect to the machining head 12 and the measuring head 21. Furthermore, when the stage 32 moves, the irradiation position of the machining light EL on the surface of the workpiece W moves relative to the surface of the workpiece W. That is, the irradiation position of the machining light EL on the surface of the workpiece W changes on the surface of the workpiece W. Therefore, moving the stage 32 can also be considered equivalent to changing the irradiation position of the machining light EL on the surface of the workpiece W.

[0126] The position measuring device 34 can measure (in other words, detect) the position of the stage 32. That is, the position measuring device 34 is a device that can acquire information related to the position of the stage 32. The position measuring device 34 may also include, for example, at least one of an encoder and a laser interferometer. Since the position measuring device 34 can acquire information related to the position of the stage 32, it can also be referred to as a stage position information acquisition device.

[0127] As described above, the rotating device 35 is a device for rotating the chuck 353, which is a holding device for rotatably holding the workpiece W. Here, the structure of the rotating device 35 will be referred to... Figure 5 While explaining. Figure 5 This is a cross-sectional view showing the structure of the rotating device 35.

[0128] like Figure 5 As shown, the rotating device 35 includes a support frame 351 and a rotary motor 352. The support frame 351 is disposed on a platform 32. The rotary motor 352 is supported by the support frame 351. The rotary motor 352 operates to rotate the rotation shaft 3521. The rotation shaft 3521 may also be along a direction intersecting the direction of gravity. Figure 5 In the example shown, the component extends along the X-axis direction. That is, Figure 5In the example shown, the rotary motor 352 rotates a rotation axis 3521 extending along the X-axis about a rotation axis 3522 extending along the X-axis. The rotation axis 3522 is an axis extending along the rotation axis 3521 through its center of rotation. However, the rotation axis 3521 may also extend in a direction different from the X-axis. The rotary motor 352 may also rotate the rotation axis 3521 extending in a direction different from the X-axis about a rotation axis 3522 extending in a direction different from the X-axis. Furthermore, the rotation axis 3521 may be configured such that the angle of the rotation axis 3522 relative to the X-axis (e.g., an angle in the XZ plane, an angle in the XY plane) is variable. That is, the rotation axis 3521 may also be movable in at least one of the θz and θy directions. Moreover, Figure 5 Although not shown in the figure, the rotating device 35 includes a rotor encoder for detecting the rotation angle of the rotating motor 352 or the rotation angle of the rotating shaft 3521, and its output is sent to the control device 4. The rotor encoder can also be referred to as a rotation detection device that can detect the rotation angle of the rotating device.

[0129] A chuck 353 is connected to the rotating shaft 3521. The chuck 353 is a holding device that holds the workpiece W. Figure 5 In the example shown, the chuck 353 uses a plurality of jaws 3532 included in the chuck 353 to clamp the workpiece W which is in contact with the retaining surface 3531 of the chuck 353, thereby retaining the workpiece W. In particular, Figure 5 In the example shown, the rotation axis 3521 extends along the X-axis direction, so the chuck 353 uses multiple jaws 3532 extending along the X-axis direction to clamp the workpiece W in contact with the holding surface 3531 along the YZ plane intersecting the X-axis, thereby holding the workpiece W. However, the method by which the chuck 353 holds the workpiece W is not limited to... Figure 5 The method shown.

[0130] The rotary motor 352 rotates the rotary shaft 3521, thereby causing the chuck 353, which is connected to the rotary shaft 3521, to rotate about the rotary shaft 3522. As a result, the workpiece W held by the chuck 353 also rotates about the rotary shaft 3522. Therefore, it can also be said that the rotary device 35 functions as a spindle table capable of rotating the workpiece W held by the chuck 353. Figure 5 In the example shown, the rotating device 35 rotates the workpiece W about the X-axis.

[0131] Again in Figure 1 as well as Figure 2In this system, the measuring device 36 is a device capable of measuring the machining light EL from the machining head 12. Therefore, the measuring device 36 can also be referred to as a beam measuring device. Furthermore, at least a portion of the measuring device 36 can be measured by the measuring head 21. At this time, at least a portion of the measuring device 36 can also be considered as a mark (or identifier) ​​that can be measured by the measuring head 21. Machining light measurement information related to the measurement result of the machining light EL by the measuring device 36 and mark measurement information related to the measurement result of the measuring head 21 on the measuring device 36 are respectively output from the measuring head 21 to the control device 4. The control device 4 controls the operation of the machining system SYS based on at least one of the machining light measurement information and the mark measurement information. Specifically, the control device 4 controls the machining system SYS (e.g., at least one of the machining device 1, the measuring device 2, and the stage device 3) based on at least one of the machining light measurement information and the mark measurement information so that the machining system SYS can properly process the workpiece W.

[0132] Here, refer to Figures 6 to 7 The structure of the measuring device 36 is explained. Figure 6 This is a plan view showing the structure of the measuring device 36. Figure 7 This is a cross-sectional view showing the structure of the measuring device 36. Additionally, Figure 7 Equivalent to Figure 6 VI-VI' section view.

[0133] like Figure 6 as well as Figure 7 As shown (and thus, as described) Figure 5 As shown), the measuring device 36 is disposed on (i.e., disposed on) the rotating device 35. Figures 5 to 7 In the example shown, the measuring device 36 is disposed on the support frame 351 of the rotating device 35. The measuring device 36 may also be disposed on the upper surface 3511 of the support frame 351 (i.e., the surface facing the processing head 12 and the measuring head 21) so that the measuring device 36 measures the processing light EL and the measuring head 21 measures at least a portion of the measuring device 36. However, the measuring device 36 may also be disposed on a surface of the support frame 351 different from the upper surface. The measuring device 36 may also be disposed on a component different from the support frame 351. For example, the measuring device 36 may also be disposed on the stage 32. At least a portion of the measuring device 36 may also be detached from the support frame 351. Alternatively, the measuring device 36 may be integrated with the support frame 351. Moreover, multiple measuring devices 36 may also be disposed on the support frame 351. Additionally, the measuring device 36 may also be disposed on the chuck 353. Multiple measuring devices 36 may also be disposed on the chuck 353.

[0134] like Figure 6 as well as Figure 7As shown, the measuring device 36 includes a beam-passing member 361 and a light-receiving element 362. The beam-passing member 361 is a plate-like member along the XY plane. The shape of the beam-passing member 361 in the XY plane is rectangular, but it can also be any other shape (e.g., circular or elliptical). Alternatively, the beam-passing member 361 can be flat, but it can also be curved. The dimension of one side of the beam-passing member 361 is, for example, several millimeters to tens of millimeters, but it can also be other dimensions. The light-receiving element 362 includes a light-receiving surface 3621 extending along the XY plane. The shape of the light-receiving surface 3621 in the XY plane is rectangular, but it can also be any other shape (e.g., circular or elliptical). The dimension of one side of the light-receiving surface 3621 can be the same as, smaller than, or larger than the dimension of one side of the beam-passing member 361.

[0135] The beam passing member 361 and the light receiving element 362 are disposed inside a recess 3512 (i.e., a recess) formed in the support frame 351. That is, the beam passing member 361 and the light receiving element 362 are disposed in the recess 3512, which is recessed from the upper surface 3511 of the support frame 351 toward the -Z side. However, it is also possible that at least one of the beam passing member 361 and the light receiving element 362 is disposed at a different position than the recess 3512.

[0136] Within the recess 3512, the beam-passing member 361 is positioned above the light-receiving element 362. That is, the beam-passing member 361 is positioned closer to the processing head 12 and the measuring head 21 than the light-receiving element 362. At this time, as... Figure 7 As shown, the surface of the beam-passing member 361 (specifically, the surface facing the machining head 12 and the measuring head 21, and the +Z side surface) can also be located below the upper surface 3511. As a result, the measuring device 36 will not protrude from the surface of the support frame 351, thus reducing the likelihood of the workpiece W or the like accidentally contacting the measuring device 36 (especially the beam-passing member 361). Consequently, the likelihood of the beam-passing member 361 being damaged and / or contaminated due to contact with the workpiece W or the like is reduced. However, the surface of the beam-passing member 361 can be located at the same height as the upper surface 3511, or it can be located above the upper surface 3511.

[0137] The beam passing member 361 includes a glass substrate 3611 and an attenuation film 3612, the attenuation film 3612 being formed on at least a portion of the surface of the glass substrate 3611. The attenuation film 3612 is a member that attenuates the processing light EL incident on the attenuation film 3612. Furthermore, in this embodiment, "attenuation of the processing light EL by the attenuation film 3612" includes not only the case where the intensity of the processing light EL passing through the attenuation film 3612 is less than the intensity of the processing light EL incident on the attenuation film 3612, but also the case where the processing light EL incident on the attenuation film 3612 is blocked (i.e., shielded). Therefore, when the processing light EL is incident on the attenuation film 3612, the processing light EL attenuated by the attenuation film 3612 is incident on the light receiving element 362 via the attenuation film 3612, or the processing light EL is blocked by the attenuation film 3612 and does not incident on the light receiving element 362. Alternatively, the attenuation film 3612 can also be formed from a chromium film or a chromium oxide film.

[0138] At least one opening 363 is formed in the attenuation film 3612. Figures 6 to 7 In the example shown, a plurality of openings 363 are formed in the attenuation film 3612. The openings 363 are through holes penetrating the attenuation film 3612 in the Z-axis direction. Therefore, when the processing light EL is incident on the openings 363 formed in the attenuation film 3612, the processing light EL passes through the member 361 via the openings 363. That is, the processing light EL is not attenuated or blocked by the attenuation film 3612, and is incident on the light-receiving element 362 via the openings 363.

[0139] Thus, the portion of the glass substrate 3611 where the attenuation film 3612 is formed (i.e., the portion where the opening 363 is not formed) functions as an attenuation region 364 for attenuating the processing light EL. On the other hand, the portion of the glass substrate 3611 where the attenuation film 3612 is not formed (i.e., the portion where the opening 363 is formed) functions as a passage region 365 for the processing light EL to pass through. In this case, the passage region 365 does not attenuate the processing light EL passing through it. However, the passage region 365 can also allow the processing light EL passing through it. That is, the passage region 365 may not be a region where all (i.e., 100%) of the processing light EL incident on it passes through, or it may be a region where only a portion of the processing light EL incident on it passes through. However, the attenuation rate of the processing light EL in the passage region 365 is less than the attenuation rate of the processing light EL in the attenuation region 364. Typically, the attenuation region 364 is arranged adjacent to the passage region 365. That is, region 365 is configured in attenuation region 364.

[0140] Since the measuring device 36 is disposed on the support frame 3511 (i.e., disposed on the rotating device 35), the positional relationship between the attenuation region 364 and the passage region 365 and the rotating device 35 is fixed. That is, the positional relationship between the attenuation region 364 and the passage region 365 and the rotating device 35 is a predetermined relationship known to the control device 4.

[0141] The passage area 365 formed by the opening 363 may also be formed with a mark (i.e., pattern) 366 of a prescribed shape in a plane (typically, the XY plane) along the surface of the attenuation film 3612. The mark 366 can function as a mark that can be measured by the measuring head 21.

[0142] For example, such as Figure 6 As shown, a slit-shaped mark 366 (also referred to as a slit mark) may also be formed in the beam passing member 361. The slit-shaped mark 366 is formed by a passing region 365 having a single linear (e.g., slit-like) shape in a plane along the surface of the attenuation film 3612. Figure 6 In the example shown, multiple marks 366 with different angles relative to the X and Y axes are formed in the beam-passing member 361. However, marks 366 with other shapes may also be formed in the beam-passing member 361. For example, marks 366 formed by multiple linear passing regions 365 extending along one direction and arranged along another direction intersecting the first direction may be formed in the beam-passing member 361 (the marks 366 may also be referred to as fine marks). For example, marks 366 formed by passing regions 365 with rectangular shapes in a plane along the surface of the attenuation film 3612 may also be referred to as rectangular marks in the beam-passing member 361. For example, a mark 366 (also referred to as a cross mark) may be formed on the beam passing member 361. The mark 366 is formed by a plurality of linear passing regions 365 extending along a first direction and arranged along a second direction intersecting the first direction, and a plurality of linear passing regions 365 extending along a third direction intersecting the first direction and arranged along a fourth direction intersecting the third direction. For example, a mark (also referred to as a search mark) formed by two first linear passing regions 365 and a second linear passing region 365 may be formed on the beam passing member 361. The two first linear passing regions 365 extend along a fifth direction and are separated along a sixth direction orthogonal to the fifth direction, and the second linear passing region 365 extends along a seventh direction that is inclined (i.e., intersecting obliquely) relative to the fifth direction.

[0143] The light-receiving element 362 is a light-receiving section that can receive (e.g., detect) processing light EL incident on the light-receiving element 362 through the passing region 365 (i.e., the opening 363) using the light-receiving surface 3621. As an example of the light-receiving section, a photoelectric converter capable of photoelectric conversion of the received processing light EL can be cited.

[0144] When the beam passing member 361 has multiple passing regions 365, the light receiving element 362 can also receive the processing light EL incident on the light receiving element 362 via the multiple passing regions 365 using the light receiving surface 3621. Alternatively, the light receiving surface 3621 can be formed from a photoelectric conversion surface of a photoelectric conversion element. For example, the light receiving element 362 can receive the processing light EL incident on the light receiving element 362 via the first passing region 365 using a first portion of the light receiving surface 3621. For example, the light receiving element 362 can receive the processing light EL incident on the light receiving element 362 via the second passing region 365 using a second portion of the light receiving surface 3621. Thus, in this embodiment, the measuring device 36 may not include multiple light receiving elements 362 corresponding to the multiple passing regions 365. The measuring device 36 only needs to include the light receiving element 362 common to the multiple passing regions 365. However, the measuring device 36 may also include a plurality of light-receiving elements 362 corresponding to a plurality of passing regions 365 respectively.

[0145] When the light-receiving element 362 receives the processing light EL via the passing area 365, the focusing position of the processing light EL can also be set at or near the passing area 365 of the beam passing member 361. On the other hand, when processing the workpiece W using the processing light EL, the focusing position of the processing light EL can also be set at or near the surface of the workpiece W. Therefore, the control device 4 can also set the focusing position of the processing light EL to an appropriate position by controlling the focus-changing optical system 1210.

[0146] If we consider the case where workpiece W is processed by irradiation with processing light EL, at least a portion of measuring device 36 may also be processed (essentially damaged) by irradiation with processing light EL. Therefore, the intensity of processing light EL (e.g., the amount of energy per unit area in a plane intersecting the direction of travel of processing light EL) can be controlled so that the intensity of processing light EL irradiating measuring device 36 (e.g., the amount of energy per unit area on the light-receiving surface 3621 of light-receiving element 362) is less than the intensity of processing light EL irradiating workpiece W for processing workpiece W (e.g., the amount of energy per unit area on the surface of workpiece W). For example, control device 4 can also reduce the intensity of processing light EL by controlling processing light source 11. For example, control device 4 can also reduce the intensity of processing light EL by controlling an extinction member (not shown) disposed on the emission side of processing light source 11.

[0147] The light-receiving result of the light-receiving element 362 includes information related to the state of the processing light EL incident on the light-receiving element 362. For example, the light-receiving result of the light-receiving element 362 includes information related to the intensity of the processing light EL incident on the light-receiving element 362 (specifically, the intensity within the plane intersecting the XY plane). More specifically, the light-receiving result of the light-receiving element 362 includes information related to the intensity distribution of the processing light EL within the plane along the XY plane. The light-receiving result of the light-receiving element 362 is output to the control device 4 as the processing light measurement information. In addition, as described above, when the mark 366 is measured by the measuring head 21, the measurement result of the measuring head 21 on the mark 366 is output to the control device 4 as the mark measurement information.

[0148] Again in Figure 1 as well as Figure 2 In this system, the control device 4 controls the operation of the machining system SYS. For example, the control device 4 can also set the machining conditions for the workpiece W and control at least one of the machining device 1, the measuring device 2, and the stage device 3 to machine the workpiece W according to the set machining conditions.

[0149] Control device 4 controls the operation of machining system SYS. Control device 4 may include, for example, a computing device and a storage device. The computing device may include, for example, at least one of a central processing unit (CPU) and a graphics processing unit (GPU). The storage device may include, for example, a memory. Control device 4 executes a computer program through the computing device, thereby functioning as a device for controlling the operation of machining system SYS. The computer program is a computer program for causing the computing device to perform (i.e., execute) the actions to be performed by control device 4 as described later. That is, the computer program is a computer program for causing control device 4 to function so that machining system SYS performs the actions described later. The computer program executed by the computing device may be recorded in the storage device (i.e., recording medium) included in control device 4, or recorded in any storage medium (e.g., hard disk or semiconductor memory) built into or external to control device 4. Alternatively, the computing device may download the computer program to be executed from a device external to control device 4 via a network interface.

[0150] Control device 4 may not be located inside the machining system SYS. For example, control device 4 may be located outside the machining system SYS as a server, etc. In this case, control device 4 and machining system SYS may be connected via wired and / or wireless networks (or data buses and / or communication lines). As a wired network, for example, a network with an interface using at least one of the following serial bus methods: Institute of Electrical and Electronics Engineers (IEEE) 1394, RS-232x, RS-422, RS-423, RS-485, and Universal Serial Bus (USB) may be used. As a wired network, a network with an interface using a parallel bus method may also be used. As a wired network, a network using an Ethernet (registered trademark) interface, such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T, may also be used. As a wireless network, a network utilizing radio waves may also be used. As an example of a network utilizing radio waves, networks conforming to IEEE 802.1x (such as at least one of a Wireless Local Area Network (LAN) and Bluetooth) can be cited. Infrared networks can also be used as wireless networks. Optical communication networks can also be used as wireless networks. In this case, the control device 4 and the machining system SYS can be configured to transmit and receive various information via the network. Furthermore, the control device 4 can also send commands or control parameters to the machining system SYS via the network. The machining system SYS may also include a receiving device that receives commands or control parameters from the control device 4 via the network. The machining system SYS may also include a transmitting device (i.e., an output device that outputs information to the control device 4) that sends commands or control parameters to the control device 4 via the network. Alternatively, a first control device performing a portion of the processing performed by the control device 4 may be located inside the machining system SYS, while a second control device performing another portion of the processing performed by the control device 4 may be located outside the machining system SYS.

[0151] Furthermore, the recording medium for the computer program executed by the recording control device 4 may be at least one of the following: a Compact Disc Read Only Memory (CD-ROM), a Compact Disc-Recordable (CD-R), a Compact Disc Rewritable (CD-RW), a floppy disk, a Magneto-Optical Disc (MO), a Digital Versatile Disc Read Only Memory (DVD-ROM), a Digital Versatile Disc Random Access Memory (DVD-RAM), a Digital Versatile Disc-Recordable (DVD-R), DVD+R, a Digital Versatile Disc-Rewritable (DVD-RW), DVD+RW, and Blu-ray discs, magnetic media such as magnetic tapes, optical disks, semiconductor memory such as USB storage devices, and other media capable of storing programs. The recording medium may also include a machine capable of recording computer programs (e.g., a general-purpose or special-purpose machine with a computer program installed in a state that can be executed in at least one form, such as software or firmware). Furthermore, the various processes or functions contained in the computer program may be implemented by logic processing blocks implemented within the control device 4 by executing the computer program through the control device 4 (i.e., the computer), or by hardware such as a specified gate array (FPGA, ASIC) included in the control device 4, or by a form in which logic processing blocks and partial hardware modules that implement a portion of the hardware elements coexist.

[0152] (2) Operation of the machining system SYS

[0153] Next, the operation of the machining system SYS will be described. As described above, the machining system SYS performs a machining operation to machine at least a portion of the surface of the workpiece W using the machining light EL. Furthermore, before performing the machining operation (or after completing the machining operation or during the machining operation), the machining system SYS performs an axis information generation operation to generate rotation axis information related to the rotation axis 3522 of the rotating device 35 using the measuring device 2. Furthermore, before performing the machining operation (or after completing the machining operation or during the machining operation), the machining system SYS performs a light state information generation operation to generate light state information related to the state of the machining light EL using the measuring device 36. Furthermore, before performing the machining operation (or after completing the machining operation or during the machining operation), the machining system SYS performs an origin information generation operation to generate origin information related to the machining origin PO of the machining device 1 and the measuring origin MO of the measuring device 2 using the measuring device 36. Therefore, the machining operation, axis information generation operation, light state information generation operation, and origin information generation operation will be described sequentially below.

[0154] Furthermore, for ease of explanation, the following describes the machining operations, axis information generation operations, optical state information generation operations, and origin information generation operations performed when machining a cylindrical workpiece W held by chuck 353. However, these operations can also be performed on workpieces W with shapes different from cylindrical shapes. Furthermore, these operations can also be performed on workpieces W not held by chuck 353 (i.e., placed on stage 32).

[0155] (2-1) Processing Actions

[0156] First, refer to Figure 8 The description explains the machining action used to machine at least a portion of the surface of workpiece W using machining light EL. Figure 8 It is a flowchart representing the process of processing actions.

[0157] like Figure 8As shown, firstly, the measuring head 21 measures the workpiece W held by the chuck 353 (step S11). At this time, the measuring head 21 can also measure the workpiece W while it is rotating via the rotating device 35. That is, the measuring head 21 can measure at least a portion of the workpiece W during the period when the rotating device 35 is rotating it. Alternatively, the measuring head 21 can also measure a stationary workpiece W. When the measuring head 21 measures a stationary workpiece W, the rotating device 35 can also rotate the workpiece W by a predetermined angle whenever the measuring head 21 measures the measurement target portion of the workpiece W's surface where the measurement emission area MSA is set, so that a new measurement target portion of the workpiece W's surface that the measuring head 21 has not yet measured is included in the measurement emission area MSA. That is, the machining system SYS can also alternately perform the measuring head 21's measurement of the workpiece W and the rotating device 35's rotation of the workpiece W. Specifically, the measuring head 21 measures the first measurement target portion of the workpiece W's surface when the measurement emission area MSA is set on the first measurement target portion of the workpiece W's surface. Subsequently, under the control of the control device 4, the rotating device 35 rotates the workpiece W by a predetermined angle to set a measurement emission area MSA on the second measurement object portion of the workpiece W's surface, which is different from the first measurement object portion. Then, the measuring head 21 measures the second measurement object portion of the workpiece W's surface with the measurement emission area MSA set on it. This process is repeated. As a result, the measuring head 21 can sequentially measure multiple measurement object portions obtained by subdividing (zoning) the surface of the workpiece W. At this time, the measurement object portion with the measurement emission area MSA set after the rotating device 35 rotates the workpiece W can also partially overlap with the measurement object portion with the measurement emission area MSA set before the rotating device 35 rotates the workpiece W. That is, the predetermined measurement object portion to be measured by the measuring head 21 after the rotating device 35 rotates the workpiece W can also partially overlap with the measurement object portion already measured by the measuring head 21 before the rotating device 35 rotates the workpiece W. However, the portion of the workpiece W to be measured after the rotating device 35 rotates may not overlap with the portion of the workpiece W to be measured before the rotating device 35 rotates the workpiece W. That is, the predetermined portion of the workpiece W to be measured by the measuring head 21 after the rotating device 35 rotates the workpiece W may not overlap with the portion of the workpiece W to be measured by the measuring head 21 before the rotating device 35 rotates the workpiece W.

[0158] Furthermore, when the measuring head 21 measures a stationary workpiece W, the stage 32 can also move the workpiece W by a predetermined amount each time the measuring head 21 measures a portion of the workpiece W's surface where a measurement emission area MSA is set, so that new portions of the workpiece W's surface that the measuring head 21 has not yet measured are included in the measurement emission area MSA. The direction of movement of the workpiece W can also be parallel to the rotation axis 3522 of the rotating device 35. Alternatively, the direction of movement of the workpiece W can be intersecting the rotation axis 3522. In this way, the machining system SYS can alternately perform the measurement of the workpiece W by the measuring head 21 and the movement of the workpiece W by the stage 32.

[0159] Subsequently, the control device 4 sets the processing conditions for the workpiece W based on the workpiece measurement information related to the measurement result of the measuring head 21 on the workpiece W in step S11 (step S12). The processing conditions may, for example, include conditions related to the processing light EL. Conditions related to the processing light EL may include, for example, conditions related to at least one of the intensity of the processing light EL, the timing of the processing light EL's irradiation, and the irradiation time of the processing light EL. The processing conditions may also include, for example, conditions related to the movement of the processing head 12. Conditions related to the movement of the processing head 21 may include, for example, conditions related to at least one of the moving speed of the processing head 12, the timing of the moving of the processing head 12, and the amount of movement of the processing head 12. The processing conditions may also include, for example, conditions related to the movement of the stage 32. Conditions related to the movement of the stage 32 may include, for example, conditions related to at least one of the moving speed of the stage 32, the timing of the moving of the stage 32, and the amount of movement of the stage 32. The processing conditions may also include, for example, conditions related to the rotation of the workpiece W by the rotating device 35. The conditions related to the rotation of workpiece W may also include, for example, conditions related to at least one of the rotational speed of workpiece W, the timing of the rotation of workpiece W, and the amount of rotation of workpiece W (i.e., the rotation angle).

[0160] Subsequently, the machining system SYS processes the workpiece W according to the machining conditions set in step S12 (step S13). That is, the machining head 12 irradiates the workpiece W with machining light EL and moves according to the machining conditions set in step S12. The stage 32 moves according to the machining conditions set in step S12. The rotating device 35 rotates the workpiece W according to the machining conditions set in step S12.

[0161] The machining head 12 can also irradiate the workpiece W, which is rotating via the rotating device 35, with machining light EL, thereby machining the workpiece W. That is, the machining head 12 can also irradiate the workpiece W with machining light EL for at least a portion of the time while the rotating device 35 is rotating the workpiece W, thereby machining the workpiece W. Alternatively, the machining head 12 can also machine the workpiece W by irradiating the workpiece W with machining light EL when it is stationary. When the machining head 12 irradiates the workpiece W with machining light EL, the rotating device 35 can also rotate the workpiece W by a predetermined angle whenever the machining head 12 processes the workpiece W's surface portion that is contained in the machining emission area PSA, so that new workpiece portions on the surface of the workpiece W that have not yet been processed by the machining head 12 are included in the machining emission area PSA. That is, the machining system SYS can also alternately perform the machining of the workpiece W by the machining head 12 (i.e., the irradiation of the workpiece W by the machining light EL emitted by the machining head 12) and the rotation of the workpiece W by the rotating device 35. Specifically, with a processing emission area PSA set on the first processing target portion of the workpiece W's surface, the processing head 12 irradiates the first processing target portion of the workpiece W's surface with processing light EL, thereby processing the first processing target portion. Subsequently, under the control of the control device 4, the rotating device 35 rotates the workpiece W by a predetermined angle to set a processing emission area PSA on a second processing target portion of the workpiece W's surface that is different from the first processing target portion. Then, with the processing emission area PSA set on the second processing target portion of the workpiece W's surface, the processing head 12 irradiates the second processing target portion of the workpiece W's surface with processing light EL, thereby processing the second processing target portion. This process is repeated. As a result, the processing head 12 can sequentially process multiple processing target portions obtained by subdividing (segmenting, dividing) the surface of the workpiece W. Furthermore, at this time, the control device 4 can also move the workpiece W by a predetermined amount to set a processing emission area PSA on the second processing target portion of the workpiece W's surface that is different from the first processing target portion. At this time, the movement direction of the workpiece W is typically along the rotation axis 3522 of the rotating device 35, but it can also be in a direction that intersects the rotation axis 3522.

[0162] In either case, the machining system SYS uses a rotating device 35 to rotate the workpiece W (more specifically, it uses the rotating device 35 to rotate the chuck 353 that holds the workpiece W) in order to machine the surface of the workpiece W using the machining light EL. This can also be considered as the machining system SYS using the machining light EL to perform lathe machining on the surface of the workpiece W. When the machining light EL is a laser, it can also be considered as the machining system SYS using the machining light EL to perform laser lathe machining on the surface of the workpiece W.

[0163] The workpiece W is rotated by the rotating device 35, thus showing a three-dimensional view of the workpiece W during processing. Figure 9 As shown, the machining head 12 can machine a strip-shaped region Wb that extends circumferentially on the surface of the workpiece W. At this time, the machining system SYS can also repeatedly machine the strip-shaped region Wb while moving the workpiece W relative to the machining light EL. That is, the machining system SYS can also machine the surface of the workpiece W using the machining light EL while moving the workpiece W relative to the machining light EL. The machining system SYS can also machine the strip-shaped region Wb on the surface of the workpiece W using the machining light EL while moving the irradiation position of the machining light EL on the surface of the workpiece W relative to the surface of the workpiece W. Specifically, as... Figure 9 As shown, the machining system SYS can also process the strip-shaped region Wb on the surface of the workpiece W using the machining light EL while moving the irradiation position of the machining light EL on the surface of the workpiece W parallel to the rotation axis 3522. That is, the machining system SYS can also alternately perform the following actions: rotating the workpiece W by using the rotating device 35 to process the strip-shaped region Wb on the surface of the workpiece W using the machining light EL; and moving the irradiation position of the machining light EL on the surface of the workpiece W parallel to the rotation axis 3522 when the rotation of the rotating device 35 on the workpiece W has stopped. As a result, the machining system SYS can process the entire workpiece W (or the part of the surface of the workpiece W that should be processed by the machining light EL). In addition, the action of moving the irradiation position of the machining light EL parallel to the rotation axis 3522 includes not only the action of making the irradiation position of the machining light EL parallel to the rotation axis 3522 as it appears, but also the action of moving the irradiation position of the machining light EL in a direction that is not strictly parallel to the rotation axis 3522 but is unobstructed even if it is substantially parallel.

[0164] As described above, the machining head 12 illuminates the workpiece W with a machining light EL traveling along the Z-axis. That is, the machining head 12 illuminates the workpiece W with a machining light EL whose illumination axis EX becomes parallel to the Z-axis. At this time, a cross-sectional view showing the machining light EL illuminating the workpiece W is shown below. Figure 10 As shown, the machining head 12 can also irradiate the workpiece W with machining light EL from a direction intersecting the rotation axis 3522 of the rotating device 35 (i.e., the central axis CS of the workpiece W). That is, the machining head 12 can also irradiate the workpiece W with machining light EL whose irradiation axis EX intersects the rotation axis 3522. At this time, since the machining head 12 is positioned above the workpiece W, the machining head 12 can also irradiate the upper surface of the workpiece W (i.e., the surface facing the machining head 12). That is, the machining head 12 can also irradiate a portion of the surface of the workpiece W with machining light EL from a direction along the normal NL of that portion.

[0165] Alternatively, a cross-sectional view showing another example of the machining light EL irradiated onto the workpiece W, i.e. Figure 11As shown, the machining head 12 can also irradiate the workpiece W with machining light EL from a direction that is twisted relative to the rotation axis 3522 of the rotating device 35 (i.e., the central axis CS of the workpiece W). That is, the machining head 12 can also irradiate the workpiece W with machining light EL whose irradiation axis EX is twisted relative to the rotation axis 3522. In addition, the twisting direction relative to the rotation axis 3522 can also be referred to as the direction along the axis that is in a twisted position relative to the rotation axis 3522. In this case, typically, the machining head 12 irradiates the workpiece W with machining light EL from a direction that intersects the normal NL of the part for a certain part of the surface. For example, the machining head 12 can also irradiate the workpiece W with machining light EL that travels along an irradiation axis EX that forms an angle greater than 0 degrees with the normal NL of the part for a certain part of the surface. For example, the machining head 12 can also irradiate the workpiece W with machining light EL that travels along an irradiation axis EX that forms an angle greater than 30 degrees with the normal NL of the part for a certain part of the surface. For example, the machining head 12 may also irradiate a portion of the surface of the workpiece W with a machining light EL traveling along an irradiation axis EX at an angle greater than 60 degrees to the normal NL of that portion. For example, the machining head 12 may also irradiate a portion of the surface of the workpiece W with a machining light EL traveling along an irradiation axis EX at an angle greater than 70 degrees to the normal NL of that portion. For example, the machining head 12 may also irradiate a portion of the surface of the workpiece W with a machining light EL traveling along an irradiation axis EX at an angle greater than 80 degrees to the normal NL of that portion. For example, the machining head 12 may also irradiate a portion of the surface of the workpiece W with a machining light EL traveling along an irradiation axis EX at an angle of 90 degrees to the normal NL of that portion. Furthermore, Figure 11 This illustrates an example of a machining light EL that travels along an irradiation axis EX that forms a 90-degree angle with the normal NL of the workpiece W to a portion of the surface of the workpiece W by the machining head 12.

[0166] When the machining light EL is irradiated onto the workpiece W from a direction twisted relative to the rotation axis 3522, the machining system SYS can also change the irradiation position of the machining light EL along a direction intersecting the rotation axis 3522. Since the workpiece W is cylindrical, the direction intersecting the rotation axis 3522 (i.e., the direction intersecting the central axis CS of the workpiece W) corresponds to the radial direction of the workpiece W. Therefore, the machining system SYS can also change the irradiation position of the machining light EL along the radial direction of the workpiece W. Alternatively, when the machining light EL is irradiated onto the workpiece W from a direction intersecting the rotation axis 3522, the machining system SYS can also change the irradiation position of the machining light EL along a direction intersecting the rotation axis 3522.

[0167] For example, such as Figure 11As shown, the machining system SYS can also change the illumination position of the machining light EL along the Y-axis direction, which intersects the rotation axis 3522 and the illumination axis EX (in this case, the illumination position can also refer to the focusing position, the same below). At this time, the machining system SYS can also change the illumination position of the machining light EL along the Y-axis direction to bring the illumination position of the machining light EL closer to the rotation axis 3522. For example, the machining system SYS can also change the illumination position of the machining light EL along the Y-axis direction so that the illumination position of the machining light EL in the second period after the first period is closer to the rotation axis 3522 relative to the illumination position of the machining light EL in the first period. Figure 11 In the example shown, the machining system SYS can also change the irradiation position of the machining light EL along the Y-axis direction so that the irradiation position of the machining light EL moves toward the +Y side.

[0168] For example, such as Figure 11 As shown, the machining system SYS can also change the irradiation position of the machining light EL along the Z-axis direction, which intersects the rotation axis 3522 and is along the irradiation axis EX. In this case, with the change in irradiation position, the defocusing amount of the machining light EL irradiating the surface of the workpiece W changes. As a result, with the change in irradiation position, the integrated flux of the machining light EL irradiating the surface of the workpiece W changes. For example, at the very beginning of machining of the workpiece W, the machining system SYS can change the irradiation position of the machining light EL to irradiate the surface of the workpiece W with a machining light EL that has a relatively high integrated flux. Typically, since the integrated flux reaches its maximum when the focusing position of the machining light EL is on the surface of the workpiece W, the machining system SYS can also change the irradiation position of the machining light EL so that the focusing position of the machining light EL is on the surface of the workpiece W. As a result, the amount of machining on the workpiece W per irradiation by the machining light EL increases relatively. Therefore, the machining system SYS can perform rough machining of the workpiece W relatively quickly. On the other hand, during the finishing of workpiece W, in order to finely adjust the machining amount of workpiece W by relatively reducing the machining amount of workpiece W in a single irradiation of the machining light EL, the machining system SYS changes the irradiation position of the machining light EL to irradiate the surface of workpiece W with a machining light EL of relatively lower integral flux. Typically, the machining system SYS may also change the irradiation position of the machining light EL so that the focusing position of the machining light EL is away from the surface of workpiece W (i.e., irradiating the surface of workpiece W with a defocused machining light EL). Alternatively, the machining system SYS may also reduce the intensity of the machining light EL to irradiate the surface of workpiece W with a machining light EL of relatively lower integral flux.

[0169] The aforementioned Figure 10 as well as Figure 11This indicates the holding surface 3531 of the chuck 353 where the workpiece W contacts when the machining head 12 holds the workpiece W with the chuck 353 (a surface along the YZ plane, see reference). Figure 5 An example of a workpiece W (e.g., a side surface of a cylindrical workpiece W) being illuminated by a machining light EL, where parallel surfaces intersect. Figure 10 as well as Figure 11 This diagram illustrates an example of a machining head 12 irradiating a workpiece W, which extends along a rotation axis 3522, with a machining light EL. On the other hand, a perspective view showing another example of a machining light EL irradiating a workpiece W is also provided. Figure 12 As shown, the machining head 12 can also irradiate the surface Ws of the workpiece W, which intersects the rotation axis 3522, with machining light EL. Here, machining light EL can also irradiate the surface Ws of the workpiece W from a direction orthogonal to the direction (X direction) of the rotation axis 3522. Machining light EL can also irradiate the surface Ws of the workpiece W from a direction that is not orthogonal to the direction (X direction) of the rotation axis 3522 but intersects it. Machining light EL can also irradiate the surface Ws of the workpiece W from a direction that is in a torsional position relative to the direction of the rotation axis 3522. Furthermore, machining light EL can also irradiate the surface Ws of the workpiece W from the direction of the rotation axis 3522.

[0170] When a machining light EL is applied to a workpiece W, light generated by the machining light EL may be emitted from the workpiece W. This light may include, for example, reflected light from the machining light EL on the workpiece W, scattered light from the machining light EL on the workpiece W, and transmitted light that has passed through the machining light EL on the workpiece W. Alternatively, at least a portion of the machining light EL traveling toward the workpiece W may not illuminate the workpiece W and may travel directly past it. In this case, the stage device 3 may also include a beam collector 37, which can terminate the light generated by the machining light EL and the portion of the machining light EL that is not illuminated to the workpiece W (hereinafter, both are collectively referred to as "excess light"). An example of the beam collector 37 is shown in... Figure 13 .like Figure 13 As shown, the beam collector 37 is positioned opposite the machining head 12 regarding the irradiation position of the machining light EL on the surface of the workpiece W. Figure 13In the example shown, the beam collector 37 has a portion positioned on the -Z side relative to the irradiation position of the machining light EL on the surface of the workpiece W. The beam collector 37 includes an irradiation surface 371 from which excess light is irradiated. Therefore, the irradiation surface 371 is positioned in the optical path of the excess light. The irradiation surface 371 can both absorb and scatter excess light. In order to reduce the possibility of excess light irradiated to the irradiation surface 371 returning to the machining head 12, the irradiation surface 371 may also be configured to be inclined relative to the irradiation axis EX of the machining light EL. For example, the irradiation surface 371 may also be configured such that the angle between the irradiation surface 371 and the irradiation axis EX is an acute angle. Moreover, the irradiation surface 371 may not be planar. For example, the irradiation surface 371 may also be a curved surface including at least one of a convex surface and a concave surface. In addition, the irradiation surface 371 of the beam collector 37 may also be provided at a position away from the focusing position of the machining light EL. The beam collector 37 can be mounted on the stage 32 or on a different component (e.g., at least one of the platform 31 and the frame 5).

[0171] Again in Figure 8 In step S14, the surface of the workpiece W, which has been processed by the processing light EL, is measured by the measuring head 21. At this time, the measurement of the workpiece W by the measuring head 21 can be performed in parallel with the processing of the workpiece W by the processing head 12. Specifically, the measuring head 21 can also measure the second portion of the surface of the workpiece W, which has been processed by the processing light EL, during at least a portion of the period when the processing head 12 irradiates the first portion of the surface of the workpiece W. Alternatively, the measurement of the workpiece W by the measuring head 21 can be performed even when the processing of the workpiece W by the processing head 12 has stopped.

[0172] Subsequently, the control device 4 determines whether the machining amount of the workpiece W is appropriate based on the workpiece measurement information related to the measurement result of the measuring head 21 on the workpiece W in step S14 (step S15). That is, the control device 4 determines whether the machining amount of the workpiece W based on the machining conditions set in step S12 is a pre-defined or assumed appropriate amount.

[0173] If the determination result in step S15 is that the machining amount of workpiece W is inappropriate (step S15: No), then the control device 4 resets the machining conditions based on the workpiece measurement information related to the measurement result of the measuring head 21 on workpiece W in step S14, so that the machining amount of workpiece W becomes appropriate (step S16). On the other hand, if the determination result in step S15 is that the machining amount of workpiece W is appropriate (step S15: Yes), then the control device 4 may not reset the machining conditions. Subsequently, the machining system SYS repeats the actions up to steps S13 to S16 until the machining of workpiece W is completed (step S17).

[0174] Thus, in this embodiment, the machining system SYS measures the workpiece W before machining in step S11, processes the workpiece W based on the prior measurement results in step S13, measures the processed workpiece W after machining in step S14, and resets the machining conditions based on the subsequent measurement results in step S16. Therefore, the machining system SYS can properly process the workpiece W. In particular, the machining system SYS includes both a machining head 12 and a measuring head 21, so the actions up to steps S11 to S17 can be performed without removing the workpiece W from the chuck 353.

[0175] (2-2) Axis Information Generation Action

[0176] Next, the axis information generation operation for generating rotation axis information related to the rotation axis 3522 of the rotating device 35 using the measuring device 2 will be described. In this embodiment, the machining system SYS may also perform at least one of the first to third axis information generation operations. The first axis information generation operation is an operation for generating assembly error information related to the deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32 as rotation axis information. In the following description, the deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32 is referred to as "assembly error (i.e., the assembly error of the rotating device 35 relative to the stage 32)". The second axis information generation operation is an operation for generating scanning error information related to the deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the irradiation position of the machining light EL on the surface of the workpiece W by the flowmeter 1214 (i.e., the scanning direction of the machining light EL) as rotation axis information. In the following description, the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the galvanometer lens 1214 towards the machining light EL is referred to as "scanning error". The third axis information generation operation is an operation used to generate clamping error information related to the deviation of the workpiece W held by the rotation axis 3522 and the chuck 353 as rotation axis information. In the following description, the deviation of the workpiece W held by the rotation axis 3522 and the chuck 353 is referred to as "clamping error". The first to third axis information generation operations will be described in sequence below.

[0177] Furthermore, rotation axis information can also be considered as information related to at least one of the position and orientation of rotation axis 3522 (and even at least one of the position and orientation of rotation device 35). For example, assembly error information can also be considered as information related to at least one of the position and orientation of rotation axis 3522 (and even at least one of the position and orientation of rotation device 35) relative to the movement direction of stage 32. For example, scanning error information can also be considered as information related to at least one of the position and orientation of rotation axis 3522 (and even at least one of the position and orientation of rotation device 35) relative to the operation direction of machining light EL. For example, clamping error information can also be considered as information related to at least one of the position and orientation of rotation axis 3522 (and even at least one of the position and orientation of rotation device 35) relative to workpiece W. This can also be viewed as the control device 4 controlling at least one of the processing device 1 (e.g., processing head 12) and the stage device 3 (e.g., rotating device 35) based on information related to at least one of the position and orientation of the rotating axis 3522 (or even at least one of the position and orientation of the rotating device 35) in order to process the workpiece W.

[0178] (2-2-1) First axis information generation action (assembly error)

[0179] First, the first axis information generation operation for generating assembly error information related to the deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32, i.e., the assembly error, will be explained. Ideally, the direction in which the rotation axis 3522 extends is parallel (or consistent with) the direction of movement of the stage 32. For example, in this embodiment, the rotation axis 3522 is an axis extending along the X-axis direction, so the direction in which the rotation axis 3522 extends is parallel (or consistent with) the X-axis in the stage coordinate system used to control the position of the stage 32. However, in reality, due to the assembly accuracy when the rotating device 35 is positioned on the stage 32 or the assembly accuracy when the chuck 353 is mounted on the rotation axis 352, the direction in which the rotation axis 3522 extends may become non-parallel (or inconsistent) with the direction of movement of the stage 32. Moreover, due to the movement accuracy of the stage 32, the direction in which the rotation axis 3522 extends may become non-parallel (or inconsistent) with the direction of movement of the stage 32. Therefore, the machining system SYS generates assembly error information related to the deviation (i.e., assembly error) between the direction in which the rotary axis 3522 extends and the direction of movement of the stage 32, by performing a first axis information generation action. Hereinafter, while referring to... Figure 14 Meanwhile, the action of generating the first axis information is explained. Figure 14 This is a flowchart representing the process of generating information for the first axis.

[0180] like Figure 14As shown, the test workpiece (hereinafter referred to as "test workpiece Wt") used for generating the first axis information is held by the chuck 353 (step S21). At this time, the test workpiece Wt is held by the chuck 353 in such a way that the central axis CSt of the test workpiece Wt is aligned with the rotation axis 3522. In addition, a workpiece with known roundness and straightness can be used as the test workpiece Wt.

[0181] The test workpiece Wt is, for example, a workpiece whose shape can be calculated based on the measurement results of the test workpiece Wt by the measuring device 2, including its central axis CSt. As an example of such a test workpiece Wt, a test workpiece Wt with a cylindrical shape can be cited. Figure 15 This represents an example of the measurement results of measuring device 2 on a test workpiece Wt with a cylindrical shape, namely, the height image of the test workpiece Wt. Figure 15 And later Figure 17 (b) Figure 17 (d) Figure 19 , Figure 21 (b) and Figure 21 In the height image of (d), the shades represent height information; lighter colors indicate higher height (+Z axis side), and darker colors indicate lower height (+Z axis side). For example... Figure 15 As shown, the height image of the test workpiece Wt is projected in such a way that the portion along the central axis CSt is higher than the portion other than the portion along the central axis CSt. Since the shape of the test workpiece Wt is an ideal cylindrical shape, the control device 4 can calculate the central axis CSt of the test workpiece Wt based on the measurement results of the test workpiece Wt by the measuring device 2. The calculated central axis CSt can be used as the rotation axis 3522. This is because, as described above, the test workpiece Wt is held by the chuck 353 in such a way that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. In addition, if the workpiece W to be processed can be used as the test workpiece Wt, in step S21, the workpiece W can also be held by the chuck 353 instead of the test workpiece Wt.

[0182] Subsequently, the machining system SYS repeatedly performs the actions of using the measuring device 2 to measure a portion of the test workpiece Wt (step S22) and moving the stage 32 (step S24) until the required number of actions to measure a portion of the test workpiece Wt are performed. Specifically, for example, a top view of the test workpiece Wt is shown... Figure 16As shown, the measuring device 2 sets a measurement emission area MSA on the first measurement target portion Wt11 of the surface of the test workpiece Wt, and measures the first measurement target portion Wt11. Subsequently, the machining system SYS moves the stage 32 along a direction. For example, the machining system SYS moves the stage 32 along a direction parallel to the direction in which the rotation axis 3522 should originally extend. For example, if the rotation axis 3522 should originally extend along the X-axis direction, the machining system SYS moves the stage 32 along the X-axis direction of the stage coordinate system. Along with the movement of the stage 32, the measurement emission area MSA moves on the surface of the test workpiece Wt. At this time, the machining system SYS moves the stage 32 to set a measurement emission area MSA on the surface of the test workpiece Wt for the second measurement target portion Wt12 adjacent to the first measurement target portion Wt11. Subsequently, the measuring device 2 measures the second measurement target portion Wt12. The same operation is repeated until the required number of measurements of a portion of the test workpiece Wt is performed (step S23).

[0183] Subsequently, the control device 4 generates assembly error information based on the measurement results of the test workpiece Wt in step S22 (step S25). Here, while referring to... Figure 17 (a) through (d) explain the actions involved in generating assembly error information.

[0184] Figure 17 (a) represents an ideal test workpiece Wt in which the direction in which the rotation axis 3522 extends (i.e., the direction in which the central axis CSt extends) is parallel (or consistent with) the direction of movement of the stage 32. The height of the measured result corresponding to the test workpiece Wt is as shown in the figure. Figure 17 As shown in (b), the height image is equivalent to an image generated by connecting multiple images corresponding to multiple measurements of the test workpiece Wt along the movement direction of the measurement emission region MSA. Figure 17 As shown in (b), the control device 4 can calculate the rotation axis 3522 (central axis CSt) based on the test workpiece Wt reflected in the height image. That is, the control device 4 can acquire information related to the rotation axis 3522. Furthermore, the measurement emission area MSA moves along with the stage 32, so the height image of the test workpiece Wt is an image extending along the movement direction of the stage 32. Therefore, the control device 4 can calculate the movement direction of the stage 32 based on the height image itself. Specifically, the control device 4 can also calculate the direction (e.g., the long side direction of the height image) connecting multiple images corresponding to multiple measurements of the test workpiece Wt as the movement direction of the stage 32. Figure 17In the example shown in (b), since the direction in which the rotation axis 3522 extends is parallel (or consistent with) the direction of movement of the stage 32, the direction in which the rotation axis 3522 extends as calculated by the control device 4 is parallel (or consistent with) the direction of movement of the stage 32 as calculated by the control device 4.

[0185] on the other hand, Figure 17 (c) indicates a test workpiece Wt whose direction of rotation 3522 (i.e., the direction of central axis CSt) is not parallel (or inconsistent) with the direction of movement of stage 32. The height of the measured result of the test workpiece Wt is equivalent to... Figure 17 As shown in (d). Figure 17 As shown in (d), at this time, the direction in which the rotation axis 3522 calculated by the control device 4 extends is not parallel (or inconsistent) with the direction of movement of the platform 32 calculated by the control device 4.

[0186] Therefore, the control device 4 can calculate the relationship (especially the deviation) between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32. As a result, the control device 4 can generate assembly error information related to the deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32.

[0187] In addition, the aforementioned Figure 17 In the example, control device 4 uses the height image corresponding to the measurement result of the test workpiece Wt to ​​calculate the rotation axis 3522 (center axis CSt). However, control device 4 may also use the contour of the test workpiece Wt to ​​calculate the rotation axis 3522 (center axis CSt), or alternatively. In this case, control device 4 may also calculate the centerline of the two sides extending along the X-axis direction in the contour of the test workpiece Wt as the rotation axis 3522 (center axis CSt). In this case, as described later, the machining system SYS may also repeatedly perform the action of measuring a part of the test workpiece Wt and the action of moving the stage 32 along another direction (e.g., the Y-axis direction) that intersects the direction in which the rotation axis 3522 should originally extend.

[0188] Furthermore, the assembly error information also includes information related to the assembly error of the chuck 353 relative to the rotating axis 352. At this time, the machining system SYS can also implement the aforementioned... Figure 14 After the process, the rotating device 35 is rotated by a specified angle (e.g., 60 degrees) to implement... Figure 14 The control device 4 can also repeat this process a predetermined number of times (for example, six times, in which case it is performed whenever the rotation angle of the rotating shaft 352 is 0 degrees, 60 degrees, 120 degrees, 180 degrees, 240 degrees, or 300 degrees). Figure 14 (The process), and will be carried out a specified number of times. Figure 14The results of the process are averaged to calculate the deviation of the central axis CSt caused by assembly errors. Furthermore, by repeatedly rotating the test workpiece Wt and measuring in this manner, the effects of the deflection caused by the weight of the test workpiece Wt can be distinguished from assembly errors.

[0189] The generated assembly error information can also be referenced by the control device 4 for performing the processing operation. That is, the assembly error information can also be referenced by the control device 4 during the processing of workpiece W by irradiating the workpiece W with the processing light EL. Specifically, the control device 4 can also control the processing system SYS based on the assembly error information so that even if there is a deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32, the workpiece W can be processed in the same way as if there were no deviation. For example, the control device 4 can also control at least one of the processing head 12 (especially the galvanometer mirror 1214) and the stage 32 based on the assembly error information so that even if there is a deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32, the irradiation position of the processing light EL can be moved on the surface of the workpiece W in the same way as if there were no deviation. Typically, the control device 4 can also control at least one of the machining head 12 (especially the galvanometer lens 1214) and the stage 32 based on assembly error information, so that the irradiation position of the machining light EL on the surface of the workpiece W is moved along the direction extending from the rotation axis 3522. As a result, the machining system SYS can machine the workpiece W with higher precision compared to the case where the assembly error information is not used. In addition, in order to provide the control device 4 with reference to the assembly error information during the machining process of machining the workpiece W by irradiating the machining light EL onto the workpiece W, the first axis information generation operation can also be performed before the machining operation.

[0190] In addition to the control device 4 controlling at least one of the machining head 12 (especially the galvanometer mirror 1214) and the stage 32 based on assembly error information, or alternatively, the rotating device 35 can also be reassembled onto the stage 32 based on the assembly error information. Typically, the rotating device 35 can be reassembled onto the stage 32 in such a way that the direction in which the rotation axis 3522 extends is parallel (or consistent) with the direction of movement of the stage 32. In this case, the deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32 disappears, and thus the machining system SYS can machine the workpiece W with higher precision.

[0191] Furthermore, in the aforementioned description, to generate assembly error information, the machining system SYS repeatedly performs actions to measure and test a portion of the workpiece Wt, and moves the stage 32 along a direction parallel to the direction where the rotation axis 3522 should originally extend (in the example, the X-axis direction). However, the machining system SYS may also repeatedly perform actions to measure and test a portion of the workpiece Wt, and move the stage 32 along another direction intersecting the direction where the rotation axis 3522 should originally extend (e.g., the Y-axis direction). In this case, the control device 4 can also generate assembly error information related to the deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32.

[0192] Furthermore, in the aforementioned description, the test workpiece Wt is held by the chuck 353 in such a way that the central axis CSt of the test workpiece Wt is aligned with the rotation axis 3522. However, in reality, the chuck 353 may not be able to hold the test workpiece Wt in such a way that the central axis CSt of the test workpiece Wt is always aligned with the rotation axis 3522. Therefore, it is also possible that whenever... Figure 14 When the first axis information generation action shown ends, the chuck 353 returns to holding the test workpiece Wt. That is, it can also be that whenever... Figure 14 When the first axis information generation action shown is completed, the test workpiece Wt is removed from the chuck 353, and then the test workpiece Wt is held back in the chuck 353. After the test workpiece Wt is held back in the chuck 353, the machining system SYS can resume operation. Figure 14 The first axis information generation action is shown. As a result, multiple assembly errors are calculated through multiple first axis information generation actions. The control device 4 can also generate assembly error information based on the multiple assembly errors calculated in this way. For example, the control device 4 can also generate assembly error information related to the average value of multiple assembly errors. As a result, the influence caused by the misalignment between the center axis CSt of the test workpiece Wt and the rotation axis 3522 is reduced.

[0193] Furthermore, the deviation between the direction in which the rotary axis 3522 extends and the direction of movement of the stage 32 can be considered equivalent to the deviation between the rotary axis 3522 and the travel surface of the stage 32. Therefore, assembly error can also be called stage travel error. Thus, if assembly error can also be considered equivalent to stage travel error, then the machining system SYS can also be considered as... Figure 14 To perform actions other than or in lieu of the actions shown. Figure 18 The actions shown generate assembly error information (i.e., platform travel error information related to platform travel error).

[0194] Specifically, such as Figure 18As shown, the test workpiece Wt is held by the chuck 353 (step S31). Alternatively, if the workpiece W to be processed can be the test workpiece Wt, in step S31, the workpiece W can also be held by the chuck 353 instead of the test workpiece Wt.

[0195] Subsequently, the machining system SYS processes multiple portions of the surface of the test workpiece Wt. Specifically, firstly, the machining system SYS sets a machining emission area PSA for a first machining target portion of the surface of the test workpiece Wt, and processes at least a portion of the first machining target portion (step S32). Then, the machining system SYS moves the stage 32 along a direction. For example, the machining system SYS moves the stage 32 along a direction parallel to the direction in which the rotation axis 3522 should originally extend (step S33). For example, if the rotation axis 3522 should originally extend along the X-axis direction, the machining system SYS moves the stage 32 along the X-axis direction of the stage coordinate system. Accompanying the movement of the stage 32, the machining emission area PSA moves on the surface of the test workpiece Wt. At this time, the machining system SYS moves the stage 32 to set a machining emission area PSA for a second machining target portion on the surface of the test workpiece Wt that is different from the first machining target portion. Then, the machining system SYS processes at least a portion of the second machining target portion (step S34). At this time, the irradiation position of the processing light EL in the processing emission area PSA when processing at least a portion of the second processing object is the same as the irradiation position of the processing light EL in the processing emission area PSA when processing at least a portion of the first processing object. Therefore, the processing mark on the second processing object is located at a position that is away from the processing mark on the first processing object along the moving direction of the stage 32 in step S33 by the amount of movement of the stage 32 in step S33. Furthermore, Figure 18 This example illustrates machining two portions of the surface of the test workpiece Wt, but it is also possible to machine three or more portions of the surface of the test workpiece Wt.

[0196] Subsequently, the measuring device 2 measures the surface of the test workpiece Wt (especially the parts that were machined in steps S32 and S34, the machining marks) (step S35).

[0197] Subsequently, the control device 4 generates assembly error information based on the measurement results of the test workpiece Wt in step S35 (step S36). Here, while referring to... Figure 19 (a) to (b) explain the actions involved in generating assembly error information.

[0198] Figure 19(a) represents the height image of the ideal test workpiece Wt, corresponding to the direction in which the rotation axis 3522 extends is parallel (or consistent with) the direction of movement of the stage 32. For example... Figure 19 As shown in (a), the control device 4 can calculate the rotation axis 3522 based on the test workpiece Wt reflected in the height image. Furthermore, as described above, the multiple machining marks are spaced apart along the movement direction of the stage 32. Therefore, the control device 4 can calculate the movement direction of the stage 32 based on the relative positional relationship of the multiple machining marks reflected in the height image. Specifically, the control device 4 can also calculate the direction along the line connecting the multiple machining marks as the movement direction of the stage 32. Figure 19 In the example shown in (a), since the direction in which the rotation axis 3522 extends is parallel (or consistent) with the direction of movement of the stage 32, the direction in which the rotation axis 3522 extends as calculated by the control device 4 is parallel (or consistent) with the direction of movement of the stage 32 as calculated by the control device 4.

[0199] on the other hand, Figure 19 (b) represents the height image of the test workpiece Wt when the direction in which the rotation axis 3522 extends is not parallel (or inconsistent) with the direction of movement of the stage 32. For example... Figure 19 As shown in (b), at this time, the direction in which the rotation axis 3522 calculated by the control device 4 extends is not parallel (or inconsistent) with the direction of movement of the platform 32 calculated by the control device 4.

[0200] Therefore, the control device 4 can calculate the relationship (especially the deviation) between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32. As a result, the control device 4 can generate assembly error information related to the deviation between the direction in which the rotation axis 3522 extends and the direction of movement of the stage 32.

[0201] (2-2-2) Second axis information generation action (scanning error)

[0202] Next, the second axis information generation operation for generating scanning error information related to the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the galvanometer lens 1214 on the processing light EL, i.e., the scanning error, will be explained. Ideally, the direction in which the rotation axis 3522 extends is parallel (or consistent with) the scanning direction of the processing light EL. For example, in this embodiment, the rotation axis 3522 is an axis extending along the X-axis direction, so the direction in which the rotation axis 3522 extends is parallel (or consistent with) the scanning direction of the X-scanning mirror 1214X included in the galvanometer lens 1214 on the processing light EL. However, in reality, due to the assembly accuracy when the rotating device 35 is positioned on the stage 32 or the assembly accuracy when the chuck 353 is mounted on the rotation axis 352, the direction in which the rotation axis 3522 extends may become non-parallel (or inconsistent) with the scanning direction of the galvanometer lens 1214 on the processing light EL. Furthermore, due to assembly errors or scanning accuracy issues with the galvanometer lens 1214, the direction in which the rotation axis 3522 extends may become non-parallel (or inconsistent) with the scanning direction of the processing light EL. Therefore, the processing system SYS generates scanning error information related to this deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL (i.e., scanning error) by performing a second axis information generation operation. Alternatively, if the direction in which the rotation axis 3522 extends is parallel to the scanning direction of the galvanometer lens 1214 on the processing light EL, the second axis information generation operation can be omitted. Hereinafter, while referring to… Figure 20 Meanwhile, the process of generating information for the second axis is explained. Figure 20 This is a flowchart representing the process of generating information for the second axis.

[0203] like Figure 20 As shown, the test workpiece Wt used for the second axis information generation operation is held by the chuck 353 (step S41). At this time, the test workpiece Wt is held by the chuck 353 with its central axis CSt aligned with the rotation axis 3522. Alternatively, the test workpiece Wt used for the second axis information generation operation can be the same as the test workpiece Wt used for the first axis information generation operation. If the workpiece W to be processed can be the test workpiece Wt, in step S41, the workpiece W can also be held by the chuck 353 instead of the test workpiece Wt.

[0204] Subsequently, the machining system SYS uses a galvanometer lens 1214 to deflect the machining light EL, thereby forming a straight groove GV on the surface of the test workpiece Wt (see reference). Figure 21(a) (step S42). Specifically, for example, the machining system SYS controls the galvanometer mirror 1214 to move the irradiation position of the machining light EL along a direction parallel to the direction that the rotation axis 3522 should originally extend on the surface of the test workpiece Wt, thereby forming a straight groove GV extending in one direction on the surface of the test workpiece Wt. For example, if the rotation axis 3522 should originally extend along the X-axis direction, the machining system SYS controls the X-scanning mirror 1214X to form a straight groove GV extending in the X-axis direction on the surface of the test workpiece Wt. During the period when the machining light EL is irradiated on the test workpiece Wt to ​​form the groove GV, the machining head 12 and the stage 32 do not move.

[0205] Subsequently, the measuring device 2 measures the surface of the test workpiece Wt (especially the part where the straight groove GV is formed in step S42, the machining marks) (step S43).

[0206] Subsequently, the control device 4 generates scanning error information based on the measurement results of the test workpiece Wt in step S42 (step S44). Here, while referring to... Figure 21 (a) to (d) explain the actions involved in generating scan error information.

[0207] Figure 21 (a) represents an ideal test workpiece Wt in which the direction in which the rotation axis 3522 extends (i.e., the direction in which the central axis CSt extends) is parallel (or consistent with) the scanning direction of the machining light EL. The height of the measurement result corresponding to the test workpiece Wt is as shown in the figure. Figure 21 As shown in (b). Figure 21 As shown in (b), the control device 4 can calculate the rotation axis 3522 (center axis CSt) based on the test workpiece Wt reflected in the height image. Furthermore, the control device 4 can calculate the scanning direction of the machining light EL based on the direction in which the groove GV reflected in the height image extends. This is because the groove GV extends along the scanning direction of the machining light EL, therefore the direction in which the groove GV extends is the same as the scanning direction of the machining light EL. Figure 21 In the example shown in (b), the direction in which the rotation axis 3522 extends is parallel (or consistent) with the scanning direction of the processing light EL. Therefore, the direction in which the rotation axis 3522 extends as calculated by the control device 4 is parallel (or consistent) with the scanning direction of the processing light EL as calculated by the control device 4.

[0208] on the other hand, Figure 21 (c) indicates a test workpiece Wt whose direction of extension of the rotation axis 3522 is not parallel (or inconsistent) with the scanning direction of the processing light EL. The height of the measured result for the test workpiece Wt is equivalent to... Figure 21As shown in (d). Figure 21 As shown in (d), at this time, the direction in which the rotation axis 3522 extends, calculated by the control device 4, is not parallel (or inconsistent) with the scanning direction of the processing light EL calculated by the control device 4.

[0209] Therefore, the control device 4 can calculate the relationship (especially the deviation) between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL. As a result, the control device 4 can generate scanning error information related to the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL.

[0210] In addition, the aforementioned Figure 21 In the example, control device 4 uses the height image corresponding to the measurement result of the test workpiece Wt to ​​calculate the rotation axis 3522 (center axis CSt). However, control device 4 may also use the contour of the test workpiece Wt to ​​calculate the rotation axis 3522 (center axis CSt). In this case, control device 4 may also calculate the centerline of the two sides extending along the X-axis direction in the contour of the test workpiece Wt as the rotation axis 3522 (center axis CSt). In this case, as described later, the machining system SYS may also repeatedly perform the action of measuring a part of the test workpiece Wt and the action of moving the stage 32 along another direction (e.g., the Y-axis direction) that intersects the direction in which the rotation axis 3522 should originally extend.

[0211] Furthermore, the machining system SYS can also be implemented after the aforementioned... Figure 20 After the process, the rotating device 35 is rotated by a specified angle (e.g., 60 degrees) to implement... Figure 20 The control device 4 can also repeat this process a predetermined number of times (for example, six times, in which case it is performed whenever the rotation angle of the rotating shaft 352 is 0 degrees, 60 degrees, 120 degrees, 180 degrees, 240 degrees, or 300 degrees). Figure 20 (The process), and will be carried out a specified number of times. Figure 20 The results of the process are averaged to calculate the scanning error information.

[0212] In addition, the machining system SYS can also be implemented after the above-mentioned... Figure 20 After the procedure, the test workpiece Wt is removed from the chuck 353 and held in place again by the chuck 353 before implementation. Figure 20 The process.

[0213] The generated scanning error information can also be referenced by the control device 4 for performing the aforementioned processing operation. That is, the scanning error information can also be referenced by the control device 4 during the processing of workpiece W by irradiating the workpiece W with the processing light EL. Specifically, the control device 4 can also control the processing system SYS based on the scanning error information so that even if a deviation occurs between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL, the workpiece W can be processed in the same way as if no deviation occurs. For example, the control device 4 can also control at least one of the processing head 12 (especially the galvanometer lens 1214) and the stage 32 based on the scanning error information so that even if a deviation occurs between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL, the irradiation position of the processing light EL can be moved on the surface of the workpiece W in the same way as if no deviation occurs. Typically, the control device 4 can also control at least one of the machining head 12 (especially the galvanometer lens 1214) and the stage 32 based on the scanning error information, so that the irradiation position of the machining light EL on the surface of the workpiece W moves along the direction extending from the rotation axis 3522. Alternatively, the control device 4 can control the machining head 12 (especially the galvanometer lens 1214) even when the stage 32 does not move during machining. As a result, the machining system SYS can machine the workpiece W with higher precision compared to the case where the scanning error information is not used. In addition, in order to provide the control device 4 with reference to the scanning error information during the machining process of machining the workpiece W by irradiating the workpiece W with the machining light EL, the second axis information generation operation can also be limited to the machining operation.

[0214] Furthermore, in the aforementioned description, to generate scanning error information, the machining system SYS controls the galvanometer mirror 1214 to move the irradiation position of the machining light EL along a direction parallel to the direction that the rotation axis 3522 should originally extend. However, the machining system SYS can also control the galvanometer mirror 1214 to move the irradiation position of the machining light EL along a direction intersecting the direction that the rotation axis 3522 should originally extend. For example, the machining system SYS can also control the Y-scanning mirror 1214Y to form a straight groove GV extending along the Y-axis on the surface of the test workpiece Wt. In this case, the control device 4 can also generate scanning error information related to the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the machining light EL.

[0215] Furthermore, in the aforementioned description, the test workpiece Wt is held by the chuck 353 in such a way that the central axis CSt of the test workpiece Wt is aligned with the rotation axis 3522. However, in reality, as mentioned above, the chuck 353 may not be able to hold the test workpiece Wt in such a way that the central axis CSt of the test workpiece Wt is always aligned with the rotation axis 3522. Therefore, it is also possible that whenever... Figure 20 When the second axis information generation action shown ends, the chuck 353 returns to holding the test workpiece Wt. That is, it can also be that whenever... Figure 20 When the second axis information generation action shown is completed, the test workpiece Wt is removed from the chuck 353, and then the test workpiece Wt is held back in the chuck 353. After the test workpiece Wt is held back in the chuck 353, the machining system SYS can resume operation. Figure 20 The second axis information generation action is shown. As a result, multiple scanning errors are calculated through multiple second axis information generation actions. The control device 4 can also generate scanning error information based on the multiple scanning errors calculated in this way. For example, the control device 4 can also generate scanning error information related to the average value of the multiple scanning errors. As a result, the influence caused by the misalignment between the center axis CSt of the test workpiece Wt and the rotation axis 3522 is reduced.

[0216] (2-2-3) Third axis information generation action (clamping error)

[0217] Next, the third-axis information generation operation, which generates clamping error information related to the deviation of the workpiece W held by the rotation axis 3522 and the chuck 353, i.e., the clamping error, will be explained. Ideally, the chuck 353 holds the workpiece W with the rotation axis 3522 aligned with the central axis CS of the workpiece W. However, due to factors such as the mounting accuracy of the workpiece W relative to the chuck 353, the chuck 353 may be unable to hold the workpiece W with the rotation axis 3522 aligned with the central axis CS. For example, a top view of the workpiece W that has resulted in a clamping error would be shown... Figure 22 As shown in (a), the chuck 353 can hold the workpiece W even when a clamping error has occurred, where the rotation axis 3522 is parallel but not aligned with the central axis CS. For example, a top view showing the workpiece W with the clamping error is shown below. Figure 22As shown in (b), the chuck 353 may hold the workpiece W even when a clamping error occurs where the rotation axis 3522 is not parallel to the central axis CS. For ease of explanation, the clamping error where the rotation axis 3522 is parallel but not aligned with the central axis CS is referred to as "eccentricity error." Eccentricity error can also be considered as an error related to the positional relationship between the rotation axis 3522 and the central axis CS. Furthermore, the clamping error where the rotation axis 3522 is not parallel to the central axis CS is referred to as "angle error." Angle error can also be considered as an error related to the angular relationship between the rotation axis 3522 and the central axis CS. Therefore, the machining system SYS can also generate eccentricity error information related to eccentricity error as clamping error information by performing a third-axis information generation operation. The machining system SYS can also generate angle error information related to angle error as clamping error information by performing a third-axis information generation operation. The actions for generating eccentricity error information and the actions for generating angle error information will be explained sequentially below.

[0218] (2-2-3-1) Actions for generating eccentricity error information

[0219] First, refer to Figure 23 The process of generating eccentricity error information is explained. Figure 23 It is a flowchart representing the process of generating eccentricity error information.

[0220] like Figure 23 As shown, the workpiece W is held by the chuck 353 (step S51). Subsequently, the machining system SYS repeatedly performs the actions of measuring at least a portion of the workpiece W using the measuring device 2 (step S52) and rotating the workpiece W by a predetermined angle using the rotating device 35 (step S54) until the workpiece W has rotated to a required angle larger than the predetermined angle. For example, the required angle may be at least 360 degrees. That is, the machining system SYS repeatedly performs the actions of measuring at least a portion of the workpiece W using the measuring device 2 (step S52) and rotating the workpiece W using the rotating device 35 (step S54) until the workpiece W has rotated at least one revolution. Here, the required angle may be greater than 360 degrees or less than 360 degrees. Furthermore, the machining head 12 may not move during the actions from step S52 to step S54.

[0221] Subsequently, the control device 4 generates eccentricity error information based on the measurement results of the workpiece W in step S52 (step S55). Here, while referring to... Figures 24 to 29 On the one hand, the action of generating eccentricity error information is explained.

[0222] Figure 24 This is a cross-sectional view showing the rotation of an ideal workpiece W with its central axis CS aligned with the rotation axis 3522. (Example) Figure 24As shown, when the central axis CS coincides with the rotation axis 3522, even if the workpiece W rotates via the rotation device 35, the position of the endpoint (end portion) of the end portion of the workpiece W's surface located in the direction intersecting the rotation axis 3522 will not change in one direction. Hereinafter, for ease of explanation, the endpoint PZ of the end portion of the workpiece W's surface located in the Z-axis direction intersecting the rotation axis 3522 will be used as the endpoint in the explanation. In this case, as indicated... Figure 24 The graph shown illustrates the relationship between the position of endpoint PZ of workpiece W along the Z-axis and the rotation angle θ of workpiece W. Figure 25 As shown, even if the workpiece W is rotated by the rotating device 35, the position (i.e., height) of the endpoint PZ in the Z-axis direction will not change. That is, the position (i.e., height) of the endpoint PZ in the Z-axis direction is a fixed value independent of the rotation angle θ.

[0223] on the other hand, Figure 26 This is a cross-sectional view showing the rotation of workpiece W when the central axis CS is parallel but not aligned with the rotation axis 3522. For example... Figure 26 As shown, when the central axis CS and the rotation axis 3522 are not aligned, when the workpiece W rotates via the rotation device 35, the position of the endpoint of the workpiece W's surface that forms the end in the direction intersecting the rotation axis 3522 changes in one direction corresponding to the rotation of the workpiece W. Specifically, as shown... Figure 26 The graph shown illustrates the relationship between the position of endpoint PZ of workpiece W along the Z-axis and the rotation angle θ of workpiece W. Figure 27 As shown, when the workpiece W rotates via the rotating device 35, the position (i.e., height) of the endpoint PZ in the Z-axis direction varies sinusoidally in response to the rotation of the workpiece W. That is, the position of the endpoint PZ in the Z-axis direction becomes a value that varies sinusoidally in response to the rotation angle θ. At this time, the greater the eccentricity error corresponding to the distance between the central axis CS and the rotation axis 3522, the greater the variation in the position of the endpoint PZ in the Z-axis direction (i.e., the difference between the maximum and minimum values ​​of the position of the endpoint PZ in the Z-axis direction).

[0224] Figure 28 Also with Figure 26 Similarly, a cross-sectional view showing the rotation of workpiece W, where the central axis CS is parallel but not aligned with the rotation axis 3522. However, in Figure 28 In the example shown, with the rotation angle θ being zero degrees, the endpoint PZ moves away from the rotation axis 3522 only in the Z-axis direction. Figure 26 The difference in the example shown is that, with the rotation angle θ at zero degrees, the endpoint PZ leaves not only the Z-axis direction from the rotation axis 3522, but also the Y-axis direction intersecting the Z-axis direction. In this case, as indicated... Figure 28The graph shown illustrates the relationship between the position of endpoint PZ of workpiece W along the Z-axis and the rotation angle θ of workpiece W. Figure 29 As shown, when the workpiece W rotates via the rotating device 35, the position (i.e., height) of the endpoint PZ in the Z-axis direction varies sinusoidally in relation to the rotation of the workpiece W. However, Figure 29 The variation in the position of endpoint PZ in the Z-axis direction shown is related to Figure 28 The difference between the changes in the position of endpoint PZ along the Z-axis shown is that the phase of the change is different.

[0225] Therefore, the control device 4 calculates the relationship between the position of the endpoint PZ of the workpiece W in the Z-axis direction and the rotation angle θ of the workpiece W based on the measurement results of the workpiece W by the measuring device 2, thereby calculating the eccentricity error. Specifically, the control device 4 can calculate the change in the position of the endpoint PZ in the Z-axis direction based on the relationship between the position of the endpoint PZ in the Z-axis direction and the rotation angle θ, and can calculate the distance between the central axis CS and the rotation axis 3522 (i.e., the eccentricity error) based on the change in the position of the endpoint PZ in the Z-axis direction. Furthermore, the control device 4 can calculate the phase of the change in the position of the endpoint PZ in the Z-axis direction based on the relationship between the position of the endpoint PZ in the Z-axis direction and the rotation angle θ, and can calculate the state of the workpiece W corresponding to the rotation angle θ of the workpiece W (specifically, information related to the direction of the central axis CS of the workpiece W relative to the rotation axis 3522) based on the phase. That is, the control device 4 can generate eccentricity error information related to the deviation between the central axis CS and the rotation axis 3522 of the workpiece W, i.e., the eccentricity error.

[0226] In addition, the control device 4 can also determine the rotation axis 3522 based on the contour of the workpiece W, and determine the eccentricity error based on the displacement of the determined rotation axis 3522.

[0227] The generated eccentricity error information can also be referenced by the control device 4 for performing the aforementioned machining operation. That is, the eccentricity error information can also be referenced by the control device 4 during the machining process of workpiece W by irradiating it with machining light EL. Specifically, the control device 4 can also control the machining system SYS based on the eccentricity error information so that even when eccentricity error occurs, workpiece W can be machined in the same way as when no eccentricity error occurs. For example, the control device 4 can also control the irradiation position of machining light EL based on the eccentricity error information so that even when eccentricity error occurs, the surface of workpiece W can be irradiated with machining light EL in the same way as when no eccentricity error occurs. Furthermore, in order to provide the control device 4 with reference to the eccentricity error information during the machining process of workpiece W by irradiating it with machining light EL, the generation of the eccentricity error information can also be performed prior to the machining operation.

[0228] An example of the illumination position of the processing light EL controlled based on eccentricity error information is shown below. Figure 30 . Figure 30 This illustrates an example of irradiating the workpiece W with the machining light EL from a direction twisted relative to the rotation axis 3522 (specifically, the end point PY located in the Y-axis direction intersecting the rotation axis 3522). Figure 30 As shown, when an eccentricity error occurs, the position of endpoint PY in the Y-axis direction changes corresponding to the rotation of workpiece W. In this case, control device 4 can also control the irradiation position of the machining light EL along the Y-axis direction (at this time, a focused position) to irradiate endpoint PY with the machining light EL. For example, control device 7 can also control the irradiation position of the machining light EL along the Y-axis direction (at this time, a focused position) by controlling the galvanometer mirror 1214. As a result, compared to the case where eccentricity error information is not used, machining system SYS can machine workpiece W with higher precision.

[0229] (2-2-3-2) Actions for generating deflection angle error information

[0230] Then, while referring to Figure 31 The process of generating the deviation angle error information is explained. Figure 31 It is a flowchart representing the process of generating deflection error information.

[0231] like Figure 31 As shown, the machining system SYS performs steps S51 to S54, which are also performed during the generation of eccentricity error information. However, the machining system SYS performs steps S51 to S54 at multiple different locations (e.g., two locations) of the workpiece W. Specifically, as shown in the top view of the workpiece W where the eccentricity error has occurred... Figure 32As shown, the machining system SYS repeatedly performs the actions of using the measuring device 2 to measure the first measurement object portion W21 of the workpiece W (step S52) and using the rotating device 35 to rotate the workpiece W by a predetermined angle (step S54) until the workpiece W has rotated to the required angle (step S53). That is, the machining system SYS performs steps S51 to S54 at the first position P1 of the workpiece W where the first measurement object portion W21 is located. Subsequently, the machining system SYS moves the stage 32 along the rotation axis 3522. At this time, the machining system SYS moves the stage 32 so that the measuring device 2 can measure the second measurement object portion W22 of the workpiece W (step S62). Since the stage 32 moves along the rotation axis 3522, the position of the second measurement object portion W22 along the direction of the rotation axis 3522 is different from the position of the first measurement object portion W21 along the direction of the rotation axis 3522. Subsequently, the machining system SYS repeatedly performs the actions of using the measuring device 2 to measure the second measurement object portion W22 of the workpiece W (step S52) and using the rotating device 35 to rotate the workpiece W by a predetermined angle (step S54) until the workpiece W has rotated to the required angle (step S53). That is, the machining system SYS performs steps S51 to S54 at the second position P2 of the workpiece W where the second measurement object portion W22 is located. The above actions are repeated until it is determined that it is not necessary to perform steps S51 to S54 at other positions of the workpiece W (step S61).

[0232] Subsequently, the control device 4 generates eccentricity error information based on the measurement results of the workpiece W in step S52 (step S63). Specifically, the control device 4 calculates the eccentricity error at each of the multiple positions along the rotation axis 3522 based on the measurement results of the workpiece W in step S52. For example, as Figure 32 As shown, the control device 4 calculates the eccentricity error of the first position P1 and the eccentricity error of the second position P2. Subsequently, the control device 4 calculates the angular error (e.g., the angle between the central axis CS and the rotation axis 3522) based on the calculated multiple eccentricity errors. That is, the control device 4 can generate angular error information related to the deviation of the central axis CS and the rotation axis 3522 of the workpiece W, i.e., the angular error.

[0233] The generated angular error information can also be referenced by the control device 4 for performing the aforementioned machining operation. Furthermore, the control method using the angular error information can be the same as the control method using the eccentricity error information, therefore its detailed description is omitted. As a result, compared to the case where the angular error information is not used, the machining system SYS can machine the workpiece W with higher precision. Additionally, in order to provide the control device 4 with reference to the angular error information during the machining process of irradiating the workpiece W with the machining light EL, the generation of the angular error information can also be performed prior to the machining operation.

[0234] Furthermore, assembly error information (especially the assembly error when the chuck 353 is installed onto the rotating shaft 352) can also be generated through the same action as the third axis information generation action.

[0235] (2-3) Light state information generation action

[0236] Next, the operation of generating light state information related to the state of the processing light EL using the measuring device 36 will be described. In this embodiment, the light state information may, for example, include intensity distribution information related to the intensity distribution in the angular direction relative to the illumination axis EX of the processing light EL. The light state information may, for example, include travel direction information related to the travel direction of the processing light EL. The light state information may, for example, include passing position information related to the position traversed by the processing light EL in a plane intersecting the travel direction of the processing light EL. Therefore, the operation of generating intensity distribution information, the operation of generating travel direction information, and the operation of generating passing position information will be described in sequence below.

[0237] (2-3-1) Actions for generating intensity distribution information

[0238] First, the action of generating intensity distribution information related to the intensity distribution in the angular direction relative to the irradiation axis EX of the processing light EL will be explained.

[0239] To generate intensity distribution information, the machining system SYS uses measuring device 36 to measure the intensity distribution of the machining light EL. The following refers to... Figure 33 (a) through (c) describe the operation of measuring the intensity distribution of the processed light EL using the measuring device 36. Figure 33 (a) is a cross-sectional view showing the machining head 12 irradiating the measuring device 36 with machining light EL. Figure 33 (b) is a plan view showing the machining head 12 irradiating the measuring device 36 with machining light EL. Figure 33 (c) is a graph showing the light reception results of the light receiving element 362 included in the measuring device 36 on the processing light EL.

[0240] like Figure 33As shown in (a) and (b), the control device 4 controls the stage drive system 33 to move the stage 32 to a position where the machining head 12 can irradiate the mark 366, which constitutes the passage area 365 through which the machining light EL can pass (i.e., to move the rotating device 35 on which the measuring device 36 is arranged). That is, the control device 4 moves the stage 32 so that the mark 366 is located within the machining emission area PSA. At this time, the control device 4 may also move the machining head 12 in addition to or instead of the stage 32. Subsequently, the control device 4 causes the machining head 12 to irradiate the mark 366 with the machining light EL.

[0241] At this time, as Figure 33 As shown in (a) and (b), under the control of the control device 4, the processing head 12 uses the galvanometer lens 1214 to deflect the processing light EL, thereby causing the processing light EL to scan at least a portion of the surface of the measuring device 36 (specifically, the surface including the portion where the mark 366 is formed). In particular, the processing head 12 causes the processing light EL to scan at least a portion of the surface of the measuring device 36 such that, in a plane along the XY plane, the processing light EL (more specifically, the target irradiation area EA of the processing light EL) transversely cuts the passage area 365 forming the mark 366. Alternatively, the processing light EL can also scan at least a portion of the surface of the measuring device 36 by moving the stage 32 under the control of the control device 4.

[0242] As a result, at some point during the scanning of at least a portion of the surface of the measuring device 36 by the processing light EL, the processing light EL is irradiated onto the mark 366. That is, at some point during the scanning of at least a portion of the surface of the measuring device 36 by the processing light EL, the processing light EL is received by the light-receiving element 362. As a result, the control device 4, as... Figure 33 As shown in (c), a light-receiving signal is acquired as processing light measurement information corresponding to the light-receiving result of the processing light EL. This light-receiving signal indicates that the intensity of the processing light EL during the period when at least a portion of the processing light EL is irradiated through the passage region 365 is greater than the intensity of the processing light EL during the period when the processing light EL is not irradiated through the passage region 365 constituting the mark 366. That is, the control device 4 can acquire information related to the intensity distribution of the processing light EL as processing light measurement information. At this time, it can also be said that the measuring device 36 measures the intensity distribution of the processing light EL. Furthermore, Figure 33 The horizontal axis of (c), i.e. time (light exposure time), can be read as the relative position along the scanning direction (Y-axis direction) of the processing light EL and the measuring device 36.

[0243] The machining system SYS repeatedly measures the machining light EL while changing the relative position of the measuring device 36 and the machining head 12 along the irradiation axis EX, which is the direction of travel of the machining light EL. Specifically, the control device 4 moves at least one of the machining head 12 and the stage 32 so that the position of the measuring device 36 relative to the machining head 12 is a first position. Then, the measuring device 36 measures the machining light EL. Subsequently, the control device 4 moves at least one of the machining head 12 and the stage 32 so that the position of the measuring device 36 relative to the machining head 12 is a second position different from the first position along the irradiation axis EX. Typically, the control device 4 moves along the irradiation axis EX... Figure 33 In the example shown in (a), at least one of the processing head 12 and the stage 32 is moved along the Z-axis. Subsequently, the measuring device 36 measures the processing light EL. That is, the measuring device 36 measures the processing light EL at a first position along the irradiation axis EX (i.e., the direction in which the processing light EL travels), and at a second position along the irradiation axis EX (i.e., the direction in which the processing light EL travels), different from the first position. Here, the change in the distance between the focusing position of the processing light EL along the irradiation axis EX and the measuring device 36 can also be made by means of the focusing position changing optical system 1210.

[0244] Subsequently, the control device 4 generates intensity distribution information related to the intensity distribution of the processing light EL based on the processing light measurement information. Specifically, the processing light measurement information represents the intensity distribution of the processing light EL on the surface of the beam passing through the member 361. Here, the operation of measuring the processing light EL is performed repeatedly while changing the relative positional relationship between the measuring device 36 and the processing head 12 in the direction along the irradiation axis EX. Therefore, as shown in the cross-sectional view of the processing light EL... Figure 34 As shown, the processing light measurement information represents the intensity distribution of processing light EL on multiple surfaces PN at different positions along the direction of the irradiation axis EX, intersecting the irradiation axis EX. The control device 4 can also synthesize the intensity distributions of the processing light EL on the multiple surfaces PN at different positions along the irradiation axis EX, and generate intensity distribution information related to the intensity distribution in the angular direction relative to the irradiation axis EX of the processing light EL based on the synthesized three-dimensional intensity distribution. Alternatively, the control device 4 can also infer (in other words, supplement) the intensity distribution PN of the processing light EL between the multiple surfaces based on the intensity distributions of the processing light EL on the multiple surfaces at different positions along the irradiation axis EX, to generate intensity distribution information related to the intensity distribution in the angular direction relative to the irradiation axis EX of the processing light EL.

[0245] Alternatively, when measuring the machining light EL in the machining system SYS, the relative positional relationship between the measuring device 36 and the machining head 12 may not need to be changed in the direction along the irradiation axis EX. Specifically, the control device 4 may also control the relative positional relationship between the focusing position of the machining light EL and the measuring device 36, so that the focusing position of the machining light EL moves away from the passage area 365 constituting the mark 366 in the direction along the irradiation axis EX. That is, the control device 4 may also control the relative positional relationship between the focusing position of the machining light EL and the measuring device 36, so that the measuring device 36 measures the machining light EL at a position different from the focusing position of the machining light EL in the direction along the irradiation axis EX. In other words, the control device 4 may also control the relative positional relationship between the focusing position of the machining light EL and the measuring device 36 to irradiate the mark 366 with the defocused machining light EL.

[0246] Subsequently, the control device 4 generates intensity distribution information related to the intensity distribution of the processing light EL based on the processing light measurement information. Specifically, as described above, the processing light measurement information represents the intensity distribution of the processing light EL on the light-receiving surface 3621 of the light-receiving element 362. Furthermore, the distance (so-called defocusing amount) between the focusing position of the processing light EL and the measuring device 36 along the irradiation axis EX is known information for the control device 4. This is because the control device 4 controls the relative positional relationship between the focusing position of the processing light EL and the measuring device 36 so that the focusing position of the processing light EL moves away from the passage area 365 constituting the mark 366 along the irradiation axis EX. As a result, the control device 4 can infer (in other words, supplement) the intensity distribution of the processing light EL on multiple surfaces at different positions along the irradiation axis EX based on the intensity distribution and defocusing amount of the processing light EL represented by the processing light measurement information. That is, the control device 4 can generate intensity distribution information related to the intensity distribution in the angular direction relative to the irradiation axis EX of the processing light EL.

[0247] The generated intensity distribution information can also be referenced by the control device 4 for performing the aforementioned processing action. That is, the intensity distribution information can also be referenced by the control device 4 during the processing of workpiece W by irradiating it with the processing light EL. In addition, in order to provide the control device 4 with reference to the intensity distribution information during the processing of workpiece W by irradiating it with the processing light EL, the generation of the intensity distribution information can also be performed before the processing action.

[0248] For example, the control device 4 can also control at least one of the irradiation position and the travel direction of the machining light EL based on the intensity distribution information, so as to irradiate the machining light EL to the desired position of the workpiece W. In this case, the control device 4 can also control at least one of the irradiation position and the travel direction of the machining light EL by controlling the galvanometer mirror 1214.

[0249] For example, the control device 4 can also calculate the aperture angle of the processing light EL based on the intensity distribution information, and control the aperture angle of the processing light EL based on the calculated aperture angle so that the aperture angle of the processing light EL becomes the desired angle. In this case, the control device 4 can also control the aperture angle of the processing light EL by controlling the aperture angle change optical system 1211. This aperture angle control can also be performed, for example, when the processing light EL is irradiated onto the workpiece W from a direction twisted relative to the rotation axis 3522. For example, a cross-sectional view showing the processing light EL irradiating the workpiece W from a direction twisted relative to the rotation axis 3522 is shown. Figure 35 As shown in (a), when the aperture angle of the machining light EL is large, the machining light EL may not only irradiate the portion of the workpiece W's surface that should be irradiated, but may also accidentally irradiate the portion of the workpiece W's surface that should not be irradiated. That is, the machining light EL may accidentally irradiate the portion of the workpiece W's surface that should not be irradiated. Therefore, a cross-sectional view showing the machining light EL with controlled aperture angle is shown... Figure 35 As shown in (b), the control device 4 can also reduce the aperture angle of the machining light EL. As a result, the possibility of the machining light EL being irradiated onto a portion of the surface of the workpiece W that should not be irradiated by the machining light EL is reduced.

[0250] Furthermore, the control device 4 can also generate intensity distribution information after the aperture angle change optical system 1211 performs the aperture angle change operation on the processing light EL. The control device 4 can also control the aperture angle of the processing light EL based on the intensity distribution information obtained in the generation operation.

[0251] Additionally, under the control of the control device 4, the processing head 12 can also irradiate a processing light EL onto multiple marks 366 with different slit shapes along their long sides. For example, under the control of the control device 4, the processing head 12 can also irradiate a multiple mark 366 with intersecting (typically orthogonal) long sides with the processing light EL. In this case, the control device 4 can calculate the ellipticity of the processing light EL based on the processing light measurement information. The control device 4 can also control the ellipticity of the processing light EL based on the calculated ellipticity to make the ellipticity of the processing light EL the desired ellipticity. In this case, the control device 4 can also control the ellipticity of the processing light EL by controlling the ellipticity changing optical system 1212. Moreover, the control device 4 can also rotate the processing light EL around the optical axis AX (especially around the illumination axis EX) based on the calculated ellipticity so that the direction of the maximum value of the diameter of the point of the processing light EL on the entrance pupil surface of the fθ lens 1215 becomes the desired direction. In this case, the control device 4 can also rotate the processing light EL around the optical axis AX (especially around the illumination axis EX) by controlling the light rotation optical system 1213. Additionally, the control device 4 can also generate intensity distribution information after the optical rotation optical system 1213 performs the operation of changing the ellipticity of the processing light. The control device 4 can also control the ellipticity of the processing light EL based on the intensity distribution information obtained in the generation operation.

[0252] (2-3-2) Action to generate travel direction information

[0253] Next, the operation of generating travel direction information related to the travel direction of the machining light EL (i.e., the direction in which the irradiation axis EX extends) will be explained. In order to generate travel direction information, the machining system SYS uses the measuring device 36 to measure the machining light EL.

[0254] Specifically, as shown in the cross-sectional view of the measuring device 36 for measuring the processed optical EL, Figure 36 As shown, during the period when processing light EL is emitted from the processing head 12, the control device 4 moves the stage 32 (i.e., moves the rotating device 35 on which the measuring device 36 is arranged) so that the measuring device 36 can measure the processing light EL (i.e., so that the light receiving element 362 can receive the processing light EL). At this time, the processing head 12 may also deflect the processing light EL without using the galvanometer lens 1214. The control device 4 obtains information from the position measuring device 34 related to the position of the stage 32 (i.e., the position of the measuring device 36) when the measuring device 36 measures the processing light EL.

[0255] Subsequently, the control device 4 assumes that the direction of travel of the processing light EL, which is the object of measurement, is along the Z-axis (i.e., the irradiation axis EX is along the Z-axis), and moves the stage 32 in the direction along the irradiation axis EX (i.e., the Z-axis direction). That is, the control device 4 moves the measuring device 36 in the direction along the irradiation axis EX (i.e., the Z-axis direction). Alternatively, the control device 4 may move the processing head 12 in the Z-axis direction in addition to moving the stage 32 in the Z-axis direction. As a result, the measuring device 36 measures the processing light EL again from a position different from the previously measured position in the direction along the irradiation axis EX (i.e., the Z-axis direction). That is, the measuring device 36 measures the processing light EL at a first position in the direction along the irradiation axis EX (i.e., the Z-axis direction), and measures the processing light EL at a second position different from the first position in the direction along the irradiation axis EX (i.e., the Z-axis direction). At this time, since the travel direction of the processing light EL, which is being measured, is actually along the Z-axis, the measuring device 36 can measure the processing light EL even if it moves along the direction of the irradiation axis EX (i.e., the Z-axis direction). On the other hand, as shown in the cross-sectional view of the measuring device 36 for measuring the processing light EL... Figure 37 As shown, when the travel direction of the processing light EL, which is the object of measurement, is not actually along the Z-axis (i.e., the travel direction of the processing light EL is inclined relative to the Z-axis), if the measuring device 36 is only moved along the direction of the irradiation axis EX (i.e., the Z-axis direction), the measuring device 36 may be unable to measure the processing light EL. Therefore, as shown in the cross-sectional view of the measuring device 36 for measuring the processing light EL, Figure 38 As shown, the control device 4 can also move the stage 32 in directions intersecting the irradiation axis EX (i.e., the Z-axis direction) in addition to the direction along the irradiation axis EX (e.g., at least one of the X-axis and Y-axis directions), so that the measuring device 36 can measure the processing light EL (i.e., the light-receiving element 362 can receive the processing light EL). The control device 4 obtains information from the position measuring device 34 related to the position of the stage 32 (i.e., the position of the measuring device 36) when the measuring device 36 measures the processing light EL.

[0256] Subsequently, the control device 4 generates travel direction information related to the travel direction of the processing light EL based on information related to the position of the measuring device 36 when it measures the processing light EL. Specifically, the control device 4 generates travel direction information based on information related to the position of the measuring device 36 when it measures the processing light EL before moving it along the irradiation axis EX (i.e., the Z-axis direction) (hereinafter referred to as the "first measurement position"), and information related to the position of the measuring device 36 when it measures the processing light EL after moving it along the irradiation axis EX (i.e., the Z-axis direction) (hereinafter referred to as the "second measurement position"). For example, the control device 4 may also generate travel direction information based on the first measurement position and the second measurement position in a direction intersecting the irradiation axis EX (e.g., at least one of the X-axis direction and the Y-axis direction). Specifically, when the first and second measurement positions are at the same location in a direction intersecting the irradiation axis EX (e.g., at least one of the X-axis and Y-axis directions), it can be inferred that the travel direction of the processing light EL is along the Z-axis. Conversely, when the first and second measurement positions are at different locations in a direction intersecting the irradiation axis EX (e.g., at least one of the X-axis and Y-axis directions), it can be inferred that the travel direction of the processing light EL is tilted relative to the Z-axis. In this case, the tilt of the processing light EL's travel direction relative to the Z-axis can be calculated based on the distance between the first and second measurement positions in the direction intersecting the irradiation axis EX (e.g., at least one of the X-axis and Y-axis directions) and the distance between the first and second measurement positions in the direction along the irradiation axis EX (i.e., the Z-axis direction). Thus, the control device 4 generates travel direction information.

[0257] The generated travel direction information can also be referenced by the control device 4 for performing the aforementioned processing action. That is, the travel direction information can also be referenced by the control device 4 during the processing of workpiece W by irradiating it with the processing light EL. For example, the control device 4 can also control at least one of the irradiation position and the travel direction of the processing light EL based on the travel direction information to irradiate the processing light EL at a desired position on workpiece W. In this case, the control device 4 can also control at least one of the irradiation position and the travel direction of the processing light EL by controlling the galvanometer lens 1214. Furthermore, the device disclosed in U.S. Patent Application Publication No. 2018 / 0169788 can be used as the galvanometer lens 1214 for controlling the irradiation position and the travel direction of the processing light EL. Moreover, in order to provide the control device 4 with reference to the travel direction information during the processing of workpiece W by irradiating it with the processing light EL, the generation of the travel direction information can also be performed prior to the processing action.

[0258] (2-3-3) Generate actions based on location information

[0259] Next, the operation of generating transit position information related to the position traversed by the processing light EL in the plane intersecting with the travel direction of the processing light EL will be explained. In order to generate transit position information, the processing system SYS uses measuring device 36 to measure the processing light EL.

[0260] Specifically, as shown in the cross-sectional view of the measuring device 36 for measuring the processed optical EL, Figure 39As shown, the control device 4 controls the processing head 12 to set the irradiation position of the processing light EL on the processing head 12 to multiple locations. At this time, the control device 4 can also, for example, use the galvanometer lens 1214 to deflect the processing light EL, thereby changing the irradiation position of the processing light EL on the processing head 12. For example, the control device 4 can also control the processing head 12 to set the irradiation position of the processing light EL on the processing head 12 to a first irradiation position IP#1. During the period when the irradiation position of the processing light EL on the processing head 12 is at the first irradiation position IP#1, the measuring device 36 measures the processing light EL. The control device 4 obtains information from the position measuring device 34 related to the position of the stage 32 (i.e., the position of the measuring device 36) when the measuring device 36 measures the processing light EL irradiated to the first irradiation position IP#1. Subsequently, the control device 4 can also control the processing head 12 to set the irradiation position of the processing light EL on the processing head 12 to a second irradiation position IP#2. The second irradiation position IP#2 differs from the first irradiation position IP#1, for example, in a direction along a plane intersecting the travel direction of the processing light EL (e.g., along a plane in the XY plane). During the period when the processing light EL irradiates the processing head 12 at the second irradiation position IP#2, the measuring device 36 measures the processing light EL. The control device 4 obtains information from the position measuring device 34 related to the position of the stage 32 (i.e., the position of the measuring device 36) when the measuring device 36 measures the processing light EL irradiated at the second irradiation position IP#2.

[0261] The measuring device 36 can also measure the processing light EL that is irradiated to multiple irradiation positions via multiple marks 366. For example, the measuring device 36 can also measure the light EL irradiated to multiple irradiation positions via the first mark 366 (e.g., Figure 39 The processing light EL is irradiated to the first irradiation position IP#1 via the mark 366#1 in the diagram. For example, the measuring device 36 can also measure the processing light EL irradiated to the first irradiation position IP#1 via the second mark 366 (e.g., Figure 39 The processing light EL is irradiated to the second irradiation position IP#2 by the marking 366#2 in the diagram. Alternatively, the measuring device 36 may not move within a plane intersecting the travel direction of the processing light EL (e.g., a plane along the XY plane) during the measurement of the processing light EL irradiated to multiple irradiation positions. However, it is also possible that the measuring device 36 moves within a plane intersecting the travel direction of the processing light EL (e.g., a plane along the XY plane) for at least a portion of the period during the measurement of the processing light EL irradiated to multiple irradiation positions.

[0262] Alternatively, the measuring device 36 can also measure the processing light EL that is illuminated to multiple illumination positions via a single mark 366. For example, the control device 4 can also move the stage 32 (i.e., the measuring device 36) to a first stage position so that the mark 366 is located at a first illumination position IP#1. During the period when the mark 366 is located at the first illumination position IP#1, the measuring device 366 measures the processing light EL that is illuminated to the first illumination position IP#1 via the mark 366. Subsequently, the control device 4 can also move the stage 32 (i.e., the measuring device 36) to a second stage position different from the first stage position so that the mark 366 is located at a second illumination position IP#2. During the period when the mark 366 is located at the second illumination position IP#2, the measuring device 366 measures the processing light EL that is illuminated to the second illumination position IP#2 via the mark 366.

[0263] Subsequently, the control device 4 generates passing position information related to the position of the measuring device 36 when the measuring device 36 measures the machining light EL. This passing position information is related to the position traversed by the machining light EL in the plane intersecting the direction of travel of the machining light EL. The generated passing position information can also be referenced by the control device 4 for performing the aforementioned machining operation. That is, the passing position information can also be referenced by the control device 4 during the machining process of machining workpiece W by irradiating the machining light EL onto the workpiece W. For example, the control device 4 can also control at least one of the irradiation position and the direction of travel of the machining light EL based on the passing position information to irradiate the machining light EL at the desired position of the workpiece W. At this time, the control device 4 can also control at least one of the irradiation position and the direction of travel of the machining light EL by controlling the galvanometer mirror 1214. In addition, in order to provide the control device 4 with reference to the passing position information during the machining process of machining workpiece W by irradiating the machining light EL onto the workpiece W, the generation of the passing position information can also be performed before the machining operation.

[0264] When multiple markers 366 are used to measure the machining light EL irradiated at multiple irradiation positions, the positional relationship between the multiple markers 366 and the rotation axis 3522 can also be in a predetermined relationship. That is, the relative positional relationship between the multiple markers 366 and the rotation axis 3522 can also be information known to the control device 4. In this case, the control device 4 can determine the relationship between the rotation axis 3522 and the irradiation position of the machining light EL based on the positional information and information related to the relative positional relationship between the multiple markers 366 and the rotation axis 3522. As a result, the control device 4 can irradiate the machining light EL at the desired position of the workpiece W rotating about the rotation axis 3522.

[0265] As described above, when a single marker 366 is used to measure the machining light EL irradiated at multiple irradiation positions, the stage 32 moves. At this time, the moving surface of the stage 32 (i.e., the surface that the stage 32 moves on and intersects the direction of travel of the machining light EL) and the rotation axis 3522 can also be in a predetermined relationship. That is, the relative positional relationship between the moving surface of the stage 32 and the rotation axis 3522 can also be information known to the control device 4. At this time, the control device 4 can determine the relationship between the rotation axis 3522 and the irradiation position of the machining light EL based on the positional information and information related to the relative positional relationship between the moving surface of the stage 32 and the rotation axis 3522. As a result, the control device 4 can irradiate the workpiece W rotating around the rotation axis 3522 at the desired position with the machining light EL.

[0266] (2-4) Origin Information Generation Action

[0267] Next, the origin information generation operation for generating origin information related to the machining origin PO of the machining apparatus 1 and the measurement origin MO of the measuring apparatus 2 using the measuring device 36 will be described. The origin information may also include information related to the distance between the machining origin PO and the measurement origin MO. The origin information may also include information related to the distance between the apparatus origin AO of the machining system SYS (e.g., the origin of the stage coordinate system used to control the position of the stage 32) and the machining origin PO. The origin information may also include information related to the distance between the apparatus origin AO and the measurement origin MO. The machining origin PO corresponds to the position of the stage 32 when the center of the machining emission area PSA coincides with the reference position (e.g., the center) of the stage 32 and the focusing position of the machining light EL coincides with the surface of the stage 32. The measurement origin MO corresponds to the position of the stage 32 when the center of the measurement emission area MSA coincides with the reference position (e.g., the center) of the stage 32 and the focusing position of the measurement light ML coincides with the surface of the stage 32.

[0268] In the following description, the distance between the machining origin PO and the measurement origin MO is called the "relative baseline BLrlt", the distance between the device origin AO and the machining origin PO is called the "machining baseline BLprc", and the distance between the device origin AO and the measurement origin MO is called the "measurement baseline BLmsr". An example of the relative baseline BLrlt, the machining baseline BLprc, and the measurement baseline BLmsr is shown below. Figure 40 (a) and (b). For example... Figure 40As shown in (a) and (b), the relative baseline BLrlt may also include at least one of the following components: ΔXrlt, which corresponds to the distance between the machining origin PO and the measurement origin PO in the X-axis direction; ΔYrlt, which corresponds to the distance between the machining origin PO and the measurement origin PO in the Y-axis direction; and ΔZrlt, which corresponds to the distance between the machining origin PO and the measurement origin PO in the Z-axis direction. The machining baseline BLprc may also include at least one of the following components: ΔXprc, which corresponds to the distance between the device origin AO and the machining origin PO in the X-axis direction; ΔYprc, which corresponds to the distance between the device origin AO and the machining origin PO in the Y-axis direction; and ΔZprc, which corresponds to the distance between the device origin AO and the machining origin PO in the Z-axis direction. The measurement baseline BLmsr may also include at least one of the following components: ΔXmsr, which is equivalent to the distance between the device origin AO and the measurement origin MO in the X-axis direction; ΔYmsr, which is equivalent to the distance between the device origin AO and the measurement origin MO in the Y-axis direction; and ΔZmsr, which is equivalent to the distance between the device origin AO and the measurement origin MO in the Z-axis direction.

[0269] To generate origin information, the control device 4 may also set the device origin AO. However, if the origin information does not contain information related to the device origin AO, the control device 4 may not set the device origin AO. To set the device origin AO, the control device 4 controls the measuring head 21 to measure the reference mark formed on the rotating device 35 (or other components such as the stage 32) for defining the device origin AO. In this embodiment, the device origin AO is set at a position with a predetermined positional relationship relative to the reference mark. At this time, the control device 4 obtains information from the position measuring device 34 related to the position of the stage 32 when the measuring head 21 measures the reference mark. Subsequently, the control device 4 may also set the position with a predetermined positional relationship to the obtained position of the stage 32 as the device origin AO.

[0270] Subsequently, the control device 4 calculates the positions of the machining origin PO and the measurement origin MO.

[0271] To calculate the position of the measurement origin MO, the control device 4 acquires the measurement result of the measuring head 21 on the mark 366. Specifically, the control device 4 moves the stage 32 along the X-axis and Y-axis directions by controlling the stage drive system 33, so that the reference of the measuring device 36 (e.g., the mark 366) is located at the center of the measurement emission area MSA (i.e., the measuring device 36 is moved). Then, the control device 4 moves the stage 32 along the Z-axis direction so that the focusing position of the measuring light ML is aligned with the surface of the rotating device 35 (specifically, the surface of the measuring device 36 disposed on the rotating device 35). At this time, the control device 4 can either move the measuring head 21 by controlling the head drive system 22 or not move the measuring head 21. Subsequently, the measuring head 21 measures the mark 366. Then, the control device 4 acquires the position of the stage 32 (i.e., the position of the measuring device 36) at the time point when the measuring head 21 measures the mark 366 from the position measuring device 34. Here, the acquired position of the stage 32 corresponds to the position of the measurement origin MO. Therefore, the control device 4 can calculate the distance between the position of the stage 32 at the time point when the measuring head 21 measures mark 366 and the device origin AO, and calculate the measurement baseline BLmsr based on the calculated distance. The control device 4 can calculate the distance between the position of the stage 32 at the time point when the measuring head 21 measures mark 366 and the machining origin PO whose position is calculated using the method described later, and calculate the relative baseline BLrlt based on the calculated distance.

[0272] After calculating at least one of the relative baseline BLRlt and the measurement baseline BLMSR, the control device 4 can also move at least one of the stage 32 and the measuring head 21 based on at least one of the relative baseline BLRlt and the measurement baseline BLMSR during the period when the measuring head 21 measures the workpiece W, etc. That is, the control device 4 can also control the position of at least one of the stage 32 and the measuring head 21 based on at least one of the relative baseline BLRlt and the measurement baseline BLMSR during the period when the measuring head 21 measures the workpiece W, etc. As a result, the measurement emission area MSA can be set at an appropriate position in the stage coordinate system with the device origin AO as the reference. That is, the machining system SYSa can appropriately machine the workpiece W based on the appropriate measurement results of the measuring device 2 on the workpiece W.

[0273] Subsequently, in order to calculate the position of the machining origin PO, the control device 4 acquires the measurement results (i.e., machining light measurement information) of the machining light EL passing through the passage area 365 constituting the mark 366 from the measuring device 366. Specifically, the control device 4 moves the stage 32 along the X-axis and Y-axis directions by controlling the stage drive system 33, so that the reference of the measuring device 36 (e.g., the mark 366) is located at the center of the machining emission area PSA (i.e., the measuring device 36 is moved). Furthermore, the control device 4 moves the stage 32 along the Z-axis direction so that the focusing position of the machining light EL is aligned with the surface of the rotating device 35 (specifically, the surface of the measuring device 36 disposed on the rotating device 35). At this time, the control device 4 can move the machining head 12 either by controlling the head drive system 13 or not move the machining head 12. Subsequently, the machining head 12 irradiates the mark 366 with the machining light EL. As a result, the light receiving element 362 receives the machining light EL passing through the passage area 365 constituting the mark 366. The control device 4 obtains the position of the stage 32 (i.e., the position of the measuring device 36) at the time point when the light-receiving element 362 receives the processing light EL. The obtained position of the stage 32 corresponds to the position of the processing origin PO. Therefore, the control device 4 can calculate the distance between the position of the stage 32 at the time point when the light-receiving element 362 receives the processing light EL via the mark 366 and the device origin AO, and calculate the processing baseline BLprc based on the calculated distance. The control device 4 can calculate the distance between the position of the stage 32 at the time point when the light-receiving element 362 receives the processing light EL via the mark 366 and the measuring origin MO whose position was calculated using the aforementioned method, and calculate the relative baseline BLrlt based on the calculated distance.

[0274] After calculating at least one of the relative baseline BLRLT and the machining baseline BLprc, the control device 4 can also move at least one of the stage 32 and the machining head 12 based on at least one of the relative baseline BLRLT and the machining baseline BLprc during the machining of the workpiece W by the machining head 12. That is, the control device 4 can also control the position of at least one of the stage 32 and the machining head 12 based on at least one of the relative baseline BLRLT and the machining baseline BLprc during the machining of the workpiece W by the machining head 12. As a result, the machining emission area PSA can be set at an appropriate position in the stage coordinate system with the device origin AO as the reference. That is, the machining system SYSa can properly machine the workpiece W.

[0275] (3) Technical effects of the machining system SYS

[0276] The machining system SYS described above can use machining light EL to properly machine workpiece W. Furthermore, the machining system SYS can use measuring light ML to properly measure workpiece W.

[0277] In particular, the machining system SYS can use measurement light ML to generate the rotation axis information and machine the workpiece W based on the rotation axis information. Therefore, compared with the case where the workpiece W is machined without using the rotation axis information, the machining system SYS can properly machine the workpiece W that is held in a rotational manner.

[0278] Furthermore, the machining system SYS can use the measuring device 36 to generate the aforementioned optical state information and process the workpiece W based on the optical state information. Therefore, compared to processing the workpiece W without using optical state information, the machining system SYS can appropriately process the workpiece W using machining light EL.

[0279] Furthermore, the machining system SYS can use the measuring device 36 to generate the origin information and machine the workpiece W based on the origin information. Therefore, compared to machining the workpiece W without using the origin information, the machining system SYS can use the machining light EL to properly machine the workpiece W.

[0280] (4) Variations

[0281] Next, a variation of the machining system SYS will be described.

[0282] (4-1) First variation

[0283] First, refer to Figure 41 The machining system SYS of the first modified example (hereinafter, the machining system SYS of the first modified example will be referred to as "machining system SYSa") will be described. Figure 41 This is a perspective view schematically representing the appearance of the machining system SYSa in the first modified example.

[0284] like Figure 41 As shown, the machining system SYSa in the first modified example differs from the machining system SYSa in which the measuring axis MX is parallel to the irradiation axis EX in that the measuring axis MX of the measuring head 21 intersects the irradiation axis EX along the travel direction of the machining light EL. Furthermore, Figure 41 In the example shown, the illumination axis EX is parallel to the Z-axis, but the illumination axis EX can also be tilted relative to the Z-axis. Furthermore, Figure 41 In the example shown, the measuring axis MX is tilted relative to the Z-axis, but the measuring axis EX can also be parallel to the Z-axis. Other features of the machining system SYSa can also be the same as those of the machining system SYS.

[0285] (4-2) Second variation

[0286] Then, while referring to Figure 42The machining system SYS of the second variation (hereinafter, the machining system SYS of the second variation will be referred to as "machining system SYSb") will be described. Figure 42 This is a perspective view schematically showing the appearance of the machining system SYSb in the second variant.

[0287] like Figure 42 As shown, the difference between the machining system SYSb of the second modification example and the machining system SYS in which the measuring axis MX and the irradiation axis EX are not aligned is that the measuring axis MX of the measuring head 21 is aligned with the irradiation axis EX along the travel direction of the machining light EL. In this case, the system structure diagram showing the system structure of the machining system SYSb of the second modification example is as follows: Figure 43 As shown, the machining system SYSb differs from the machining system SYS in that it includes machining device 1b instead of machining device 1. Furthermore, the machining system SYSb may not include measuring device 2. Other features of the machining system SYSb may be the same as those of the machining system SYS. The machining device 1b differs from the machining device 1 in that it includes machining head 12b instead of machining head 12. Other features of the machining device 1b may be the same as those of the machining device 1. The machining head 12b differs from the machining head 12 in that it includes illumination optical system 121b instead of illumination optical system 121. Furthermore, the machining head 12b differs from the machining head 12 in that it includes a three-dimensional measuring device 211. Other features of the machining head 12b may be the same as those of the machining head 12.

[0288] The structure of the illumination optical system 121b is shown in Figure 44 .like Figure 44As shown, the illumination optical system 121b, compared to the illumination optical system 121, includes a combining optical system 1216b. Other features of the illumination optical system 121b may also be the same as those of the illumination optical system 121. The combining optical system 1216b combines the processing light EL, which has passed through the focusing position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the optical rotation optical system 1213, with the measurement light ML from the three-dimensional measurement device 211. For example, in order to combine the processing light EL and the measurement light ML, the combining optical system 1216b may also include a polarization beam splitter. Either the processing light EL or the measurement light ML incident on the polarization beam splitter may be reflected by the polarization separation surface of the polarization beam splitter. The other of the processing light EL and the measurement light ML incident on the polarization beam splitter may also pass through the polarization separation surface of the polarization beam splitter. As a result, the polarization beam splitter will cause the processing light EL and the measurement light ML, which are incident on it from different directions, to exit in the same direction (specifically, towards the galvanometer mirror 1214). Therefore, the illumination axis EX of the processing light EL is aligned with the measurement axis MX of the measurement light ML. However, the illumination axis EX of the processing light EL and the measurement axis MX of the measurement light ML may not be aligned (i.e., they may be parallel to each other with a slight lateral offset). Furthermore, a dichroic mirror can be used instead of a polarization beam splitter to combine and separate the processing light EL and the measurement light ML. In this case, the wavelengths of the processing light EL and the measurement light ML may also be different.

[0289] In addition, the machining system SYSb may also include a measuring device 2.

[0290] (4-3) Third variation

[0291] Then, while referring to Figure 45 The machining system SYS of the third variation (hereinafter, the machining system SYS of the third variation will be referred to as "machining system SYSc") will be described. Figure 45 This is a perspective view schematically representing the appearance of the machining system SYSc in the third variation.

[0292] like Figure 45 As shown, the machining system SYSc of the third variation differs from the machining system SYS in that the rotation axis 3521 extends in a direction intersecting the direction of gravity, in that the rotation axis 3521 extends in the direction of gravity. The machining system SYSc also differs from the machining system SYS in that the rotation axis 3522 extends in a direction intersecting the direction of gravity, in that the rotation axis 3522 extends in the direction of gravity. Other features of the machining system SYSa may be the same as those of the machining system SYS.

[0293] (4-4) Other variations

[0294] In the description, the machining system SYS processes the workpiece W by irradiating the workpiece W with machining light EL. However, the machining system SYS can also process the workpiece W by irradiating the workpiece W with any energy beam. In this case, the machining system SYS may include a beam source capable of irradiating any energy beam, in addition to or replacing the machining light source 11. Examples of arbitrary energy beams include at least one of charged particle beams and electromagnetic waves. Examples of charged particle beams include at least one of electron beams and focused ion beams.

[0295] The elements of the various embodiments described can be appropriately combined. Some of the elements of the various embodiments may also be omitted. The elements of the various embodiments can be appropriately substituted for the elements of other embodiments. Furthermore, to the extent permitted by law, all publicly available publications and U.S. patent publications relating to the apparatus, etc., cited in the various embodiments are incorporated herein by reference.

[0296] Furthermore, the present invention may be appropriately modified without departing from the spirit or idea of ​​the invention as can be read from the claims and the specification as a whole, and the processing system accompanying the modifications described above is also included in the technical concept of the present invention.

Claims

1. A processing system, comprising: A holding device that can rotate to hold an object; A rotating device to rotate the holding device; A beam irradiation device that irradiates an object held by the holding device with an energy beam; An object measuring device for measuring the object; A beam measuring device for measuring the energy beam from the beam irradiation device; as well as The control device controls the beam irradiation device based on information related to the energy beam measured by the beam measuring device. The object is processed by irradiating it with an energy beam from the beam irradiation device, which is held by the holding device. The control device controls the rotating device to rotate the object after it has been measured by the object measuring device. The object measuring device measures the surface of the object after it has been rotated by the rotating device.

2. The processing system according to claim 1, wherein The beam measuring device measures the intensity distribution in the angular direction relative to the irradiation axis along the direction in which the energy beam travels.

3. The processing system according to claim 2, wherein The control device controls the irradiation position of the energy beam based on the measurement results of the beam measuring device.

4. The processing system according to claim 3, wherein The control device controls the direction of the energy beam based on the measurement results of the beam measuring device.

5. The processing system according to claim 3, wherein The beam irradiation device includes a beam irradiation state changing device, which changes at least one of the irradiation position of the energy beam relative to the beam irradiation device and the travel direction of the energy beam from the beam irradiation device.

6. The processing system according to claim 2, wherein The beam irradiation device includes an aperture angle changing device for changing the aperture angle of the energy beam. The control device controls the aperture angle based on the measurement results of the beam measuring device.

7. The processing system according to claim 6, wherein When the aperture angle changing device is configured as a first aperture angle changing device, the beam irradiation device includes a second aperture angle changing device, the second aperture angle changing device changing at least one of a first aperture angle of the energy beam on a first surface along the irradiation axis of the energy beam's travel direction, and a second aperture angle of the energy beam on a second surface including the irradiation axis and intersecting the first surface. The control device controls at least one of the first aperture angle and the second aperture angle based on the measurement results of the beam measuring device.

8. The processing system according to claim 1, wherein The beam irradiation device includes: A focusing optical system for focusing the energy beam; and a beam rotating member for changing the direction of the beam about the optical axis of the focusing optical system to the maximum value of the diameter of the beam profile on the entrance pupil of the focusing optical system.

9. The processing system according to claim 1, wherein The beam measuring device measures the energy beam at a first position in the direction in which the energy beam travels, and measures the energy beam at a second position in the direction in which the energy beam travels, which is different from the first position.

10. The processing system according to claim 1, wherein The beam measuring device measures the energy beam at a first position in the direction in which the energy beam travels. In the direction of travel, the first position is different from the focusing position where the energy beam is focused.

11. The processing system according to claim 1, wherein The beam measuring device measures the direction of travel of the energy beam.

12. The processing system according to claim 11, wherein The beam measuring device measures the energy beam at a first position in the direction of its travel, and measures the energy beam at a second position in the direction of its travel that is different from the first position. The direction of travel of the energy beam is measured based on the first position and the second position in the direction intersecting with the direction in which the energy beam travels.

13. The processing system according to claim 11, wherein The irradiation position of the energy beam is controlled based on the direction of travel of the energy beam as measured by the beam measuring device.

14. The processing system according to claim 11, wherein The direction of travel of the energy beam is controlled based on the direction of travel of the energy beam as measured by the beam measuring device.

15. The processing system according to claim 1, wherein The beam measuring device measures the position of the energy beam as it passes through a plane that intersects with the direction in which the energy beam travels.

16. The processing system according to claim 1, wherein The beam measuring device measures the energy beam when the energy beam is positioned relative to the beam irradiation device at a first position, and measures the energy beam when the energy beam is positioned relative to the beam irradiation device at a second position different from the first position.

17. The processing system according to claim 16, wherein The beam measuring device includes: The first beam passage portion is located within the attenuation region that causes the energy beam to attenuate. And a second beam passage portion, located within the attenuation region and different from the first beam passage portion, The positional relationship between the first beam passing portion and the second beam passing portion is in a predetermined relationship with the rotation axis of the rotating device.

18. The processing system according to claim 17, wherein When the irradiation position of the energy beam is set to the first position, the beam measuring device receives the energy beam that has passed through the first beam passage portion. When the irradiation position of the energy beam is set to the second position, the beam measuring device receives the energy beam that has passed through the second beam passage portion.

19. The processing system according to claim 16, wherein The rotating device is mounted on a movable platform that can move along a surface that intersects the direction of travel of the energy beam.

20. The processing system according to claim 19, wherein The beam measuring device includes a beam passing section disposed within an attenuation region that causes the energy beam to attenuate. The rotation axis of the rotating device and the intersecting surface to which the moving platform moves are in a prescribed relationship.

21. The processing system according to claim 20, wherein When the movable platform is located at the first platform position, the beam measuring device receives the energy beam that has passed through the beam-passing portion. When the moving platform is located at a second platform position different from the first platform position, the beam measuring device receives the energy beam that has passed through the beam passing portion.

22. The processing system according to claim 1, wherein The beam measuring device includes a beam passing section disposed within an attenuation region that causes the energy beam to attenuate. The beam passes through a portion in a predetermined relationship with the position of the rotating device.

23. The processing system according to claim 1, wherein The irradiation axis along the direction of travel of the energy beam from the beam irradiation device is not aligned with the measurement axis of the object measuring device.

24. The processing system according to claim 23, wherein The irradiation axis is parallel to the measurement axis.

25. The processing system according to claim 23, wherein The irradiation axis intersects the measurement axis.

26. The processing system according to claim 1, wherein The irradiation axis along the direction of travel of the energy beam from the beam irradiation device is aligned with the measurement axis of the object measuring device.

27. The processing system according to any one of claims 1 to 26, wherein The object measuring device performs three-dimensional measurements on the surface of the object.

28. The processing system according to any one of claims 1 to 26, wherein The measurement range on the object after it has been rotated by the rotating device partially overlaps with the measurement range on the object before it was rotated by the rotating device.

29. The processing system according to any one of claims 1 to 26, wherein The object measuring device measures the object as it rotates through the rotating device.

30. The processing system according to any one of claims 1 to 26, further comprising: The moving device moves at least one of the beam irradiation device and the beam measuring device. The control device moves at least one of the beam irradiation device and the beam measuring device, such that the beam measuring device can measure the energy beam from the beam irradiation device. At least one of the beam irradiation device and the beam measuring device is moved so that at least a portion of the beam measuring device can be measured by the object measuring device.

31. A processing system, comprising: A holding device that can rotate to hold an object; A rotating device to rotate the holding device; A beam irradiation device that irradiates an object held by the holding device with an energy beam; An object measuring device for measuring the object; A beam measuring device for measuring the energy beam from the beam irradiation device; A moving device that moves at least one of the beam irradiation device and the beam measuring device; as well as The control device controls at least the moving device. The control device moves at least one of the beam irradiation device and the beam measuring device to a position where the beam measuring device can measure the energy beam from the beam irradiation device. At least one of the beam irradiation device and the beam measuring device is moved to a position where at least a portion of the beam measuring device can be measured by the object measuring device. The rotation device is controlled such that the object is rotated after it has been measured by the object measuring device. The object measuring device measures the surface of the object that has been rotated by the rotating device.

32. The processing system according to claim 31, wherein The control device controls the moving device based on first information relating to the position of at least one of the beam irradiation device and the beam measuring device when the beam measuring device measures the energy beam from the beam irradiation device, and second information relating to the position of at least one of the beam irradiation device and the beam measuring device when the object measuring device measures at least a portion of the beam measuring device.

33. The processing system according to claim 31 or 32 further comprises: The acquisition device acquires information relating to at least one of the positions of the beam irradiation device and the beam measuring device. The control device moves at least one of the beam irradiation device and the beam measuring device to an irradiable position where the beam irradiation device can irradiate at least a portion of the beam measuring device with the energy beam. The acquisition device is used to acquire irradiation position information related to at least one of the positions of the beam irradiation device, which has been moved to the irradiable position, and the position of the beam measuring device. The position of the beam irradiation device and the position of the beam measuring device are controlled based on the irradiation position information.

34. A processing system, comprising: A holding device that can rotate to hold an object; A rotating device to rotate the holding device; A beam irradiation device that irradiates an object held by the holding device with an energy beam; An object measuring device for measuring the object; A beam measuring device for measuring the energy beam from the beam irradiation device; A moving device that moves at least one of the beam irradiation device and the beam measuring device; The acquisition device acquires information relating to at least one of the positions of the beam irradiation device and the beam measuring device. as well as The control device controls at least the moving device. The control device moves at least one of the beam irradiation device and the beam measuring device to an irradiable position where the beam irradiation device can irradiate at least a portion of the beam measuring device with the energy beam. The acquisition device is used to acquire irradiation position information related to at least one of the positions of the beam irradiation device, which has been moved to the irradiable position, and the position of the beam measuring device. Based on the irradiation position information, at least one of the positions of the beam irradiation device and the beam measuring device is controlled. The rotation device is controlled such that the object is rotated after it has been measured by the object measuring device. The object measuring device measures the surface of the object that has been rotated by the rotating device.

35. The processing system according to claim 34, further comprising: The control device moves at least one of the beam irradiation device and the beam measuring device to a measurable position where the object measuring device can measure at least a portion of the beam measuring device. The acquisition device is used to acquire measurement position information related to at least one of the positions of the beam irradiation device, which has been moved to the measurable position, and the position of the beam measuring device. The position of the beam irradiation device and the position of the beam measuring device are controlled based on the measured position information.

36. A processing system, comprising: A holding device that can rotate to hold an object; A rotating device to rotate the holding device; A beam irradiation device that irradiates an object held by the holding device with an energy beam; An object measuring device for measuring the object; A beam measuring device for measuring the energy beam from the beam irradiation device; A moving device that moves at least one of the beam irradiation device and the beam measuring device; The acquisition device acquires information relating to at least one of the positions of the beam irradiation device and the beam measuring device. as well as The control device controls at least the moving device. The control device moves at least one of the beam irradiation device and the beam measuring device to a measurable position where the object measuring device can measure at least a portion of the beam measuring device. The acquisition device is used to acquire measurement position information related to at least one of the position of the beam irradiation device that has been moved to the measurable position and the position of the beam measuring device. The position of the beam irradiation device and the position of the beam measuring device are controlled based on the measured position information. The rotation device is controlled such that the object is rotated after it has been measured by the object measuring device. The object measuring device measures the surface of the object that has been rotated by the rotating device.

37. The processing system according to claim 36, wherein The beam irradiation device irradiates the object, as measured by the object measuring device, with the energy beam. The object measuring device measures the object after it has been irradiated by the energy beam.

38. The processing system according to claim 36, wherein The beam irradiation device irradiates the energy beam onto the object that is rotating through the rotating device.

39. The processing system according to claim 36, wherein The rotating device causes the object, which has been irradiated by the energy beam through the beam irradiation device, to rotate. The beam irradiation device irradiates the object, which has been rotated by the rotating device, with the energy beam.

40. The processing system according to claim 36, wherein The beam irradiation device irradiates the energy beam from a direction intersecting the rotation axis of the rotating device.

41. The processing system according to claim 36, wherein The beam irradiation device irradiates the energy beam from a direction that is twisted relative to the rotation axis of the rotating device.

42. The processing system according to claim 40, wherein The position at which the energy beam from the beam irradiation device irradiates the object is variable along a direction parallel to the axis of rotation.

43. The processing system according to claim 36, wherein The retaining device includes a retaining surface that contacts the object when the object is held. The beam irradiation device irradiates the surface of the object that intersects with the surface parallel to the maintaining surface with the energy beam.

44. The processing system according to claim 36, wherein The beam irradiation device irradiates the surface of the object, which intersects the rotation axis of the rotating device, with the energy beam.

45. The processing system according to claim 36, further comprising: A moving device that moves at least one of the beam irradiation device and the rotating device.

46. ​​The processing system according to claim 36, wherein The beam irradiation device includes a beam irradiation position changing device, which changes the irradiation position of the energy beam relative to the beam irradiation device.

47. The processing system according to claim 36, wherein The rotation axis of the rotating device extends in a direction that intersects with the direction of gravity.

48. The processing system according to claim 36, wherein The rotation axis of the rotating device extends along the direction of gravity.

49. The processing system according to claim 36, wherein While using the rotating device to rotate the holding device, a laser beam is used as the energy beam to perform laser lathe processing on the surface of the object.

50. A processing system, comprising: Holding device, for holding an object; A rotating device to rotate the holding device; A beam irradiation device that irradiates an object held by the holding device with an energy beam; An object measuring device for measuring the object; A control device that controls at least one of the beam irradiation device and the rotation device based on the measurement results of the object by the object measuring device. as well as A beam measuring device, disposed on the rotating device, measures the energy beam from the beam irradiation device. The control device controls the rotating device to rotate the object after it has been measured by the object measuring device. The object measuring device measures the surface of the object after it has been rotated by the rotating device.

51. The processing system according to claim 50, wherein The beam measuring device includes: a beam passing member having an attenuation region for attenuating the energy beam and a passing region for allowing the energy beam to pass through; and a detection unit for detecting the energy beam that has passed through the passing region.

52. The processing system according to claim 50 or 51, further comprising: The moving device causes the rotating device to move. The control device controls the position of the rotating device based on information related to the position of the rotating device when the beam measuring device detects the energy beam, and information related to the position of the rotating device when the object measuring device measures at least a portion of the beam measuring device.

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