Peeling apparatus and method for peeling hard substrate

Abstract

This application discloses a peeling apparatus and a method for peeling a rigid substrate. The flexible display assembly includes a rigid substrate, a flexible display device, and a process protective film stacked sequentially. The process protective film includes an adhesion portion and an epitaxial portion surrounding the adhesion portion, the epitaxial portion extending from the edge of the adhesion portion to the outer edge of the rigid substrate. The transfer apparatus includes a rotating shaft and a transfer stage rotatably connected to the rotating shaft. A retractable first vacuum chuck and a second vacuum chuck are provided on the transfer stage. During the peeling process of the rigid substrate, when transferring the flexible display assembly (after the rigid substrate and flexible substrate have been separated) using the transfer apparatus, the first vacuum chuck adsorbs the epitaxial portion of the process protective film, and the second vacuum chuck adsorbs the rigid substrate. This prevents the rigid substrate and flexible substrate from detaching or shifting relative to each other, thereby improving product yield.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a peeling device and a method for peeling off rigid substrates. Background Technology

[0002] In recent years, flexible display and foldable display technologies have developed rapidly, becoming a key focus for universities and research institutes both domestically and internationally, and a crucial technology that display companies and terminal manufacturers are vying to develop. Currently, flexible display products mainly employ the S2S (sheet-to-sheet) manufacturing process, using rigid substrates such as glass as carriers, combined with methods such as flexible substrate attachment / removal or glass thinning. The attachment / removal method involves first attaching the flexible substrate onto the rigid substrate to prepare the display functional layer, forming a flexible display device. This means the flexible display device consists of a flexible substrate and a display functional layer sequentially stacked on the rigid substrate. After the flexible display device is prepared, the rigid substrate is peeled off, and the flexible display device is removed. This method does not affect the manufacturing precision of the display device, and the manufacturing equipment and processes are similar to those used in traditional liquid crystal displays, requiring minimal adjustments. Therefore, it is closer to mass production applications in the short term. The other method, glass thinning, has very high requirements for the thinning process, and the production yield needs improvement.

[0003] The attachment and removal process often employs laser lift-off (LLO) technology. This involves using a laser to directly act on the interface between the flexible and rigid substrates. The high-energy laser breaks the bonding force between the two substrates, thus separating the rigid substrate from the flexible display device. However, after laser scanning, the contact interface between the flexible and rigid substrates carbonizes, generating many tiny particles. To maintain the cleanliness of the LLO working cavity, it is not suitable to peel off the rigid substrate at this point. Furthermore, when transferring the separated flexible display device and rigid substrate, they are prone to detachment or uncontrollable relative displacement, leading to a decrease in product yield. Summary of the Invention

[0004] This application provides a stripping device and a rigid substrate stripping method to solve the technical problem in the prior art that when transferring a flexible display component with a separated rigid substrate and flexible substrate, the rigid substrate and flexible substrate are prone to detachment or uncontrollable relative displacement, resulting in a decrease in product yield.

[0005] This application provides a peeling device for transferring a flexible display component during a peeling process. The flexible display component includes a rigid substrate, a flexible display device, and a process protective film stacked sequentially. The process protective film includes an adhesive portion and an epitaxial portion surrounding the adhesive portion. The epitaxial portion extends from the edge of the adhesive portion to the outer edge of the rigid substrate.

[0006] The stripping device includes:

[0007] Rotation axis; and

[0008] A transfer stage is rotatably connected to the rotating shaft. The transfer stage is provided with multiple retractable first vacuum suction cups and multiple second vacuum suction cups, with the multiple first vacuum suction cups arranged around the multiple second vacuum suction cups.

[0009] The first vacuum chuck is used to adsorb the epitaxial portion, and the second vacuum chuck is used to adsorb the rigid substrate.

[0010] Optionally, in some embodiments of this application, the transfer table includes a first gripping part and a second gripping part, wherein the first gripping part is connected to the rotating shaft, and the second gripping part is connected to the first gripping part;

[0011] The first gripping part is a hollow frame, the first gripping part is arranged around the second gripping part, the first vacuum suction cup is arranged on the first gripping part, and the second vacuum suction cup is arranged on the second gripping part.

[0012] Optionally, in some embodiments of this application, a plurality of first vacuum suction cups are equally spaced on the first gripping part, and a plurality of second vacuum suction cups are equally spaced on the second gripping part.

[0013] Optionally, in some embodiments of this application, the distance between adjacent first vacuum suction cups is less than the distance between adjacent second vacuum suction cups.

[0014] Optionally, in some embodiments of this application, the adsorption area of ​​the first vacuum suction cup is larger than the adsorption area of ​​the second vacuum suction cup.

[0015] Accordingly, this application also provides a method for peeling off a hard substrate, comprising:

[0016] The flexible display assembly is transferred to the first peeling platform. The flexible display assembly includes a rigid substrate, a flexible display device, and a process protective film stacked in sequence. The process protective film includes a bonding portion and an epitaxial portion disposed around the bonding portion. The epitaxial portion extends from the edge of the bonding portion to the outer edge of the rigid substrate.

[0017] The rigid substrate is separated from the flexible display device using a laser lift-off process;

[0018] The flexible display component is transferred to a second peeling platform using any of the peeling devices provided in this application, wherein the first vacuum chuck is used to adsorb the epitaxial portion and the second vacuum chuck is used to adsorb the rigid substrate;

[0019] The rigid substrate is peeled off from the flexible display device.

[0020] Optionally, in some embodiments of this application, the step of transferring the flexible display component to the first stripping platform includes:

[0021] Adjust the extension length of the first vacuum chuck and the second vacuum chuck so that the first vacuum chuck adsorbs the epitaxial portion and / or the second vacuum chuck adsorbs the rigid substrate, so as to transfer the flexible display assembly to the first peeling platform;

[0022] The vacuum system of the first stripping platform is turned on, so that the first stripping platform adsorbs the process protective film.

[0023] Optionally, in some embodiments of this application, the step of transferring the flexible display component to the second stripping platform includes:

[0024] Adjust the extension length of the first vacuum chuck and the second vacuum chuck so that the first vacuum chuck adsorbs the epitaxial portion, or so that the first vacuum chuck adsorbs the epitaxial portion and the second vacuum chuck adsorbs the rigid substrate, so as to transfer the flexible display component from the first peeling platform to the second peeling platform;

[0025] Turn on the vacuum system of the second stripping platform to allow the second stripping platform to adsorb the process protective film.

[0026] Optionally, in some embodiments of this application, the step of peeling the rigid substrate from the flexible display device includes:

[0027] Adjust the extension length of the first vacuum chuck to separate the first vacuum chuck from the epitaxial portion, while the second vacuum chuck continues to adsorb the rigid substrate;

[0028] Rotate the rotating shaft to lift the transfer stage from one side to the other, so that the rigid substrate is peeled off from the flexible display device.

[0029] Optionally, in some embodiments of this application, the step of rotating the rotation axis and lifting the transfer stage from one side to the other to peel the rigid substrate off the flexible display device includes:

[0030] Rotate the rotating shaft 1 to 3 degrees in the first direction so that the transfer table rotates 1 to 3 degrees from one side of the transfer table to the other side, and hold for 1 to 2 seconds;

[0031] Continue to rotate the rotating shaft 3 to 5 degrees along the first direction, so that the transfer table continues to rotate 3 to 5 degrees from one side of the transfer table to the other side, and hold for 1 to 2 seconds;

[0032] The transfer stage is lifted vertically until the rigid substrate is peeled off the flexible display device.

[0033] This application provides a peeling device and a method for peeling a rigid substrate. The peeling device is used to transfer a flexible display assembly during the peeling process. The flexible display assembly includes a rigid substrate, a flexible display device, and a process protective film stacked sequentially. The process protective film includes an adhesion portion and an epitaxial portion surrounding the adhesion portion, extending from the edge of the adhesion portion to the outer edge of the rigid substrate. The peeling device includes a rotating shaft and a transfer stage rotatably connected to the rotating shaft. A retractable first vacuum chuck and a second vacuum chuck are provided on the transfer stage. Using the peeling device provided in this application, when transferring the flexible display assembly during the peeling process, the first vacuum chuck adsorbs the epitaxial portion of the process protective film, and the second vacuum chuck adsorbs the rigid substrate. This prevents the rigid substrate and the flexible substrate from detaching or shifting relative to each other during the transfer process, thereby improving product yield. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a first structural schematic diagram of the flexible display component provided in this application;

[0036] Figure 2 This is a schematic diagram of the display function layer provided in this application;

[0037] Figure 3 yes Figure 1 A top view of the flexible display component shown;

[0038] Figure 4 This is a schematic diagram of the second structure of the flexible display component provided in this application;

[0039] Figure 5This is a schematic diagram of the third structure of the flexible display component provided in this application;

[0040] Figure 6 This is a first structural schematic diagram of the stripping device provided in this application;

[0041] Figure 7 yes Figure 6 A schematic diagram of the cross-sectional structure of the peeling device shown at XX'.

[0042] Figure 8 This is a second structural schematic diagram of the stripping device provided in this application;

[0043] Figure 9 This is a schematic diagram of the third structure of the stripping device provided in this application;

[0044] Figure 10 This is a schematic flowchart of the rigid substrate peeling method provided in this application;

[0045] Figure 11 This is a schematic diagram of the flexible display component and the first peeling platform provided in this application;

[0046] Figure 12 This is a first structural schematic diagram of the peeling device provided in this application for grasping a flexible display component;

[0047] Figure 13 This is a schematic diagram of the second structure of the peeling device provided in this application for grasping the flexible display component;

[0048] Figure 14 This is a schematic diagram of laser separation of rigid substrates provided in this application;

[0049] Figure 15 This is a schematic diagram of the flexible display component and the second stripping platform provided in this application;

[0050] Figure 16 This is a schematic diagram of the structure of the peeling device provided in this application for grasping a flexible display assembly whose rigid substrate and flexible substrate have been separated;

[0051] Figure 17 This is a first schematic diagram of the peeling off of the rigid substrate provided in this application;

[0052] Figure 18 This is a second schematic diagram of the peeling off of the rigid substrate provided in this application;

[0053] Figure 19 This is a schematic diagram of the process for removing the protective film provided in this application.

[0054] Explanation of reference numerals in the attached figures:

[0055] 10: Flexible display component; 11: Rigid substrate; 12: Flexible substrate; 121: First flexible layer; 122: Buffer layer; 123: Second flexible layer; 13: Display functional layer; 131: Array layer; 132: Light-emitting layer; 133: Encapsulation layer; 134: Polarizer; 14: Process protection film; 141: Protective film layer; 142: Adhesive layer; 14a: Bonding part; 14b: Epitaxial part; 15: Barrier layer; 16: Support layer; 20: Peeling device; 21: Rotating shaft; 22: Transfer stage; 221: First gripping part; 222: Second gripping part; 23: First vacuum chuck; 24: Second vacuum chuck; 25: Connecting part; L1: First distance; L2: Second distance; 30: First peeling platform; 40: Second peeling platform. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0057] Please see Figure 1 , Figure 1 This is a first structural schematic diagram of the flexible display assembly provided in this application. The flexible display assembly 10 includes a rigid substrate 11, a flexible display device, and a process protection film 14. The flexible display device includes a flexible substrate 12 and a display functional layer 13 stacked sequentially. The flexible substrate 12 is disposed on the rigid substrate 11. The display functional layer 13 is disposed on the side of the flexible substrate 12 away from the rigid substrate 11. The process protection film 14 is disposed on the side of the display functional layer 13 away from the rigid substrate 11.

[0058] In this application, the rigid substrate 11 may be a glass substrate, but this application is not limited to this. For example, the rigid substrate 11 may also be a rigid resin substrate, etc.

[0059] In this application, the flexible substrate can be made of polyimide (PI), polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene glycol terephthalate (PET), or polyethylene naphthalate dicarboxylate (PEN). Specifically, the flexible substrate 12 can be a single-layer flexible polyimide film to improve the flexibility of the flexible display component 10.

[0060] Please also refer to the following in this application: Figure 2 , Figure 2 This is a schematic diagram of the display functional layer provided in this application. In this application, the display functional layer 13 includes, but is not limited to, an array layer 131, a light-emitting layer 132, an encapsulation layer 133, and a polarizer 134.

[0061] Specifically, the array layer 131 may include an active layer, a gate insulating layer, and a gate layer sequentially stacked on the flexible substrate 12 along a direction away from the rigid substrate 11, and an interlayer dielectric layer covering the active layer, the gate insulating layer, and the gate layer. The active layer includes a channel region and source and drain regions located on either side of the channel region. The source and drain electrodes disposed on the interlayer dielectric layer are electrically connected to the source and drain regions, respectively. A passivation layer is also covered on the source and drain electrodes. An electrode is disposed on the passivation layer, and this electrode is electrically connected to the drain electrode through a via formed in the passivation layer. It should be noted that the specific film structure of the array layer 131 is not shown in the accompanying drawings, but it is understood that the structure and specific arrangement of the array layer 131 are common techniques in the art and will not be described in detail here.

[0062] Furthermore, this application does not limit the structure of the thin-film transistors formed in the array layer 131. The thin-film transistors can be top-gate thin-film transistors, bottom-gate thin-film transistors, dual-gate thin-film transistors, or single-gate thin-film transistors. The above embodiments are merely illustrative of the array layer 131 and should not be construed as limiting this application.

[0063] Specifically, the light-emitting layer 132 includes, but is not limited to, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer stacked along a direction away from the rigid substrate 11. In some embodiments, the light-emitting layer 132 may further include a hole blocking layer and an electron blocking layer. The specific film layer configuration of the light-emitting layer 132 is not shown in the accompanying drawings. The film layer structure and its specific configuration of the light-emitting layer 132 are common techniques in the art and will not be described in detail here.

[0064] Specifically, the encapsulation layer 133 typically includes at least one inorganic layer and at least one organic layer alternately stacked. The inorganic layer can be selected from inorganic materials such as alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, and zinc oxide to block water and oxygen. The organic layer can be selected from organic materials such as epoxy resin, polyimide, polyethylene terephthalate, polycarbonate, and polyethylene to improve the flexibility of the flexible display component 10.

[0065] In this application, the process protective film 14 includes a bonding portion 14a and an epitaxial portion 14b disposed around the bonding portion 14a. The bonding portion 14a is bonded to the side of the display functional layer 13 away from the rigid substrate 11, and the epitaxial portion 14b protrudes from the edge of the bonding portion 14a to the outer edge of the rigid substrate 11.

[0066] For details, please refer to Figure 3 , Figure 3 This application provides Figure 1 The diagram shows a top view of the flexible display assembly. It should be noted that this application uses the example of a rigid substrate 11 having a size equal to the flexible substrate 12 for illustration, but this should not be construed as a limitation of the application. For example, in some embodiments, the size of the rigid substrate 11 may be larger than the size of the flexible substrate 12.

[0067] The process protective film 14 is larger than the rigid substrate 11. The epitaxial portion 14b protrudes to the outer edge of the rigid substrate 11 with a width d of 10 mm to 30 mm. For example, the width d can be 10 mm, 15 mm, 20 mm, 25 mm, 30 mm, etc.

[0068] For further information, please refer to [link / reference]. Figure 1 The process protective film 14 includes a protective film layer 141 and an adhesive layer 142. The protective film layer 141 is bonded to the display functional layer 13 via the adhesive layer 142. The protective film layer 141 is made of any one of the following materials: polyimide, polyethylene, polypropylene, polystyrene, polyethylene terephthalate, or polyethylene naphthalate. Therefore, the process protective film 14 has good flexibility and can protect and support the display functional layer 13. The thickness of the protective film layer 141 is 50 micrometers to 100 micrometers. For example, the thickness of the protective film layer 141 can be 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, etc. The adhesive layer 142 is typically made of polyurethane adhesive. The thickness of the adhesive layer 142 is 25 micrometers to 75 micrometers. For example, the thickness of the adhesive layer 142 can be 25 micrometers, 35 micrometers, 50 micrometers, 60 micrometers, 75 micrometers, etc.

[0069] It should be noted that a relatively weak adhesive force is formed between the adhesive layer 142 and the display functional layer 13. This adhesive force is between 3 g / f (GF) and 5 g / f. A g / f is a unit of force, referring to the magnitude of the gravitational force exerted on one gram of a substance. Therefore, the adhesive layer 142 serves both to provide a certain degree of adhesion and fixation, and can be easily removed after the process is completed without leaving any residue that affects the performance of the display functional layer 13.

[0070] In the flexible display assembly 10 provided in this application, the flexible display device includes a flexible substrate 12 and a display functional layer 13. Since the flexible display device has relatively low rigidity, forming the flexible display device on a rigid substrate 11 reduces the difficulty of the manufacturing process. Simultaneously, the process protection film 14 is larger than the flexible substrate 12 and is attached to the side of the display functional layer 13 away from the flexible substrate 12, thus providing good support and protection.

[0071] Please see Figure 4 , Figure 4 This is a schematic diagram of the second structure of the flexible display component provided in this application. Figure 1 The difference in the flexible display component 10 shown is that, in this embodiment, the flexible substrate 12 includes a first flexible layer 121, a buffer layer 122, and a second flexible layer 123 that are sequentially stacked on the rigid substrate 11.

[0072] Specifically, the first flexible layer 121 and the second flexible layer 123 can be made of organic materials such as polyimide, polyethylene terephthalate, polycarbonate, and polyethylene. The thickness of the first flexible layer 121 is 6 micrometers to 15 micrometers. For example, the thickness of the first flexible layer 121 is 6 micrometers, 8 micrometers, 12 micrometers, 14 micrometers, 15 micrometers, etc. The thickness of the second flexible layer 123 is 6 micrometers to 15 micrometers. For example, the thickness of the second flexible layer 123 is 6 micrometers, 8 micrometers, 12 micrometers, 14 micrometers, 15 micrometers, etc. The buffer layer 122 is made of inorganic materials. This inorganic material can be alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, etc., to improve the barrier effect of the flexible substrate 12 against water vapor.

[0073] Please see Figure 5 , Figure 5 This is a schematic diagram of the third structure of the flexible display component provided in this application. Figure 4 The flexible display component 10 shown differs in that, in this embodiment, the flexible display component 10 further includes a barrier layer 15. The barrier layer 15 is located between the flexible substrate 12 and the display functional layer 13.

[0074] Specifically, the barrier layer 15 can adopt an alternating organic / inorganic structure or an alternating inorganic / inorganic structure. The barrier layer 15 has the function of blocking water and oxygen, which can further play a protective role.

[0075] Please also refer to Figure 1 and Figure 6 , Figure 6 This is a first structural schematic diagram of the peeling device provided in this application. In this application, the peeling device 20 can be used to transfer the flexible display component 10 described in any of the above embodiments. The peeling device 20 includes a rotating shaft 21 and a transfer stage 22. The transfer stage 22 is rotatably connected to the rotating shaft 21. The rotating shaft 21 drives the transfer stage 22 to rotate. The transfer stage 22 is provided with a plurality of retractable first vacuum suction cups 23 and a plurality of second vacuum suction cups 24. The plurality of first vacuum suction cups 23 are arranged around the plurality of second vacuum suction cups 24. Among them, the first vacuum suction cups 23 are used to adsorb the epitaxial portion 14b. The second vacuum suction cups 24 are used to adsorb the rigid substrate 11.

[0076] The shape and size of the rotating shaft 21 can be set according to actual needs. In addition, the rotation of the rotating shaft 21 can be controlled by an external mechanical device or manually, which is a technology well known to those skilled in the art and will not be described in detail here.

[0077] The transfer stage 22 and the rotating shaft 21 can be fixedly connected, detachably connected, or integrally connected; they can be directly connected or indirectly connected through an intermediate medium; those skilled in the art can make the connection according to the specific circumstances. In this application, the transfer stage 22 is fixedly connected to the rotating shaft 21 through the connecting part 25, but this should not be construed as a limitation of this application.

[0078] Please also refer to Figure 7 , Figure 7 yes Figure 6 The diagram shows a cross-sectional view of the peeling device along point XX'. It can be understood that the process protective film 14 is larger than the rigid substrate 11, and the extension portion 14b of the process protective film 14 protrudes to the outer edge of the rigid substrate 11. Therefore, multiple first vacuum suction cups 23 are arranged around multiple second vacuum suction cups 24, and the extension lengths of the first vacuum suction cups 23 and the second vacuum suction cups 24 are adjusted so that the extension length of the first vacuum suction cups 23 is greater than that of the second vacuum suction cups 24. This allows the first vacuum suction cups 23 and the second vacuum suction cups 24 to respectively adsorb the extension portion 14b and the rigid substrate 11. Based on this, the process protective film 14, as a carrier for the flexible display device, ensures that the flexible display device will not detach or shift relative to itself during transport, thereby smoothly transferring the flexible display assembly 10.

[0079] It should be noted that the transfer stage 22 may be equipped with control knobs or other lifting control devices (not shown in the figure) to control the extension and retraction of the first vacuum suction cup 23 and the second vacuum suction cup 24, so as to adjust the extension and retraction length of the first vacuum suction cup 23 and the second vacuum suction cup 24. Furthermore, by connecting the other end of the first vacuum suction cup 23 and the second vacuum suction cup 24 to a vacuum pumping device, the first vacuum suction cup 23 and the second vacuum suction cup 24 can respectively adsorb the process protective film 14 and the rigid substrate 11. This is a technology well known to those skilled in the art and will not be described in detail here.

[0080] In this application, the first distance L1 between adjacent first vacuum chucks 23 is smaller than the second distance L2 between adjacent second vacuum chucks 24. It is understood that because the rigid substrate 11 is more rigid than the process protective film 14, the second vacuum chucks 24 readily adsorb the rigid substrate 11. Therefore, by setting the first distance L1 between adjacent first vacuum chucks 23 to be smaller than the second distance L2 between adjacent second vacuum chucks 24, the adsorption force of the first vacuum chucks 23 on the process protective film 14 can be increased, preventing the process protective film 14 from detaching during transfer. Simultaneously, the number of second vacuum chucks 24 is reduced, lowering production costs.

[0081] The specific values ​​of the first distance L1 and the second distance L2 can be set according to actual needs, and this application does not impose specific limitations on them.

[0082] Furthermore, in some embodiments, the adsorption area of ​​the first vacuum suction cup 23 is larger than that of the second vacuum suction cup 24. Similarly, by increasing the adsorption area of ​​the first vacuum suction cup 23, the adsorption force of the first vacuum suction cup 23 on the process protective film 14 can be increased, preventing the process protective film 14 from falling off during the transfer process. Specifically, the adsorption areas of the first vacuum suction cup 23 and the second vacuum suction cup 24 depend on the opening size of the first vacuum suction cup 23 and the second vacuum suction cup 24. The openings of the first vacuum suction cup 23 and the second vacuum suction cup 24 can be circular, square, etc. The opening size of the first vacuum suction cup 23 and the second vacuum suction cup 24 can be set according to the requirements of the process adsorption force.

[0083] Furthermore, in this application, the planar shape of the transfer stage 22 can be rectangular, rhomboid, or other irregular pattern, and this application does not specifically limit it.

[0084] For example, in some embodiments, please refer to Figure 8 , Figure 8 This is a second structural schematic diagram of the stripping device provided in this application. (and...) Figure 6The difference in the peeling device 20 shown is that, in this embodiment, the transfer table 22 includes a first gripping part 221 and a second gripping part 222. The first gripping part 221 is connected to the rotating shaft 21. The second gripping part 222 is connected to the first gripping part 221. The first gripping part 221 is a hollow frame. The first gripping part 221 is arranged around the second gripping part 222. A first vacuum suction cup 23 is disposed on the first gripping part 221. A second vacuum suction cup 24 is disposed on the second gripping part 222.

[0085] It should be noted that, based on the condition that multiple first vacuum suction cups 23 are arranged around multiple vacuum suction cups 24, the second gripping part 222 can be configured in any shape. Specifically, in this embodiment, the second gripping part 222 includes two parts arranged side by side, used to adsorb the two ends of the rigid substrate 11 respectively.

[0086] In this embodiment, by setting the first gripping part 221 as a hollow frame, the weight of the peeling device 20 can be reduced and the process consumables can be reduced.

[0087] Furthermore, multiple first vacuum suction cups 23 are equally spaced on the first gripping part 221, and multiple second vacuum suction cups 24 are equally spaced on the second gripping part 222. This improves the uniformity of adsorption by the first vacuum suction cups 23 and the second vacuum suction cups 24, and enhances the stability of the transfer process.

[0088] Specifically, multiple first vacuum suction cups 23 can be arranged in one or more rows on the first gripping part 221. Multiple second vacuum suction cups 24 can be arranged in one or more rows on the second gripping part 222. The distance between adjacent first vacuum suction cups 23 can be set according to the adsorption capacity of the first vacuum suction cups 23 for the process protective film 14. It can be understood that the smaller the distance between the first vacuum suction cups 23 and the greater the distribution density of the first vacuum suction cups 23, the stronger the adsorption capacity for the process protective film 14. The same applies to the second vacuum suction cups 24, which will not be described in detail here.

[0089] In other embodiments, please refer to Figure 9 , Figure 9 This is a schematic diagram of the third structure of the stripping device provided in this application. Figure 8 The difference in the peeling device 20 shown is that, in this embodiment, the second gripping part 222 is also a hollow frame. It is understood that when the size of the flexible display assembly 10 is large, the weight of the rigid substrate 11 increases. To improve the reliability of the transfer, it is necessary to increase the adsorption force of the peeling device 20 on the flexible display assembly 10. Therefore, by setting the second gripping part 222 as a hollow frame and providing a second vacuum suction cup 24 thereon, the second vacuum suction cup 24 can adsorb the periphery of the rigid substrate 11, thereby improving the stability of the adsorption.

[0090] Accordingly, this application also provides a method for peeling off a hard substrate. For details, please refer to [link / reference needed]. Figure 10 , Figure 10 This is a schematic flowchart of the rigid substrate peeling method provided in this application. The rigid substrate peeling method specifically includes the following steps:

[0091] 101. Transfer the flexible display assembly to the first peeling platform. The flexible display assembly includes a rigid substrate, a flexible display device, and a process protective film stacked sequentially. The process protective film includes a bonding portion and an epitaxial portion surrounding the bonding portion, the epitaxial portion extending from the edge of the bonding portion to the outer edge of the rigid substrate. The flexible display device includes a flexible substrate and a display functional layer stacked sequentially on the rigid substrate.

[0092] Specifically, such as Figure 11 As shown, the flexible display component 10 is the flexible display component 10 described in any embodiment of this application, and will not be described again here. The flexible display component 10 in the accompanying drawings is only for illustrating the rigid substrate peeling method of this application and should not be construed as limiting this application.

[0093] The first stripping platform 30 is a laser stripping platform used for laser stripping operations. Laser stripping platforms are a technology well-known to those skilled in the art and will not be described in detail here.

[0094] At this point, the rigid substrate 11 and the flexible substrate 12 are not yet separated. Therefore, the flexible display component 10 can be transferred to the first stripping platform 30 using conventional techniques in the art. For example, the flexible display component 10 can be transferred to the first stripping platform 30 using tools such as a robotic arm.

[0095] Of course, in other embodiments of this application, the flexible display component 10 can be transferred to the first peeling platform 30 using the peeling device provided in this application. Transferring the flexible display component 10 to the first peeling platform 30 then includes the following steps:

[0096] 1011. Control the extension and retraction lengths of the first vacuum suction cup and the second vacuum suction cup, so that the first vacuum suction cup adsorbs the epitaxial portion, and / or the second vacuum suction cup adsorbs the rigid substrate, so as to transfer the flexible display assembly to the first peeling platform.

[0097] Specifically, such as Figure 12 As shown, in one embodiment of this application, the extension and retraction lengths of the first vacuum chuck 23 and the second vacuum chuck 24 are controlled by a control knob or other lifting control device, so that the first vacuum chuck 23 adsorbs the epitaxial portion 14b and the second vacuum chuck 24 separates from the rigid substrate 11.

[0098] Understandably, since the rigid substrate 11 and the flexible substrate 12 are not separated at this time and are firmly bonded, the flexible display component 10 can be stably transferred simply by adsorbing the epitaxial portion 14b using the first vacuum chuck 23. This also reduces the power consumption required for the second vacuum chuck 24 to operate.

[0099] Specifically, such as Figure 13 As shown, in another embodiment of this application, the extension and retraction lengths of the first vacuum chuck 23 and the second vacuum chuck 24 are controlled by a control knob or other lifting control device, so that the first vacuum chuck 23 is separated from the epitaxial portion 14b and the second vacuum chuck 24 adsorbs the rigid substrate 11.

[0100] Similarly, since the rigid substrate 11 and the flexible substrate 12 are not separated at this time and are firmly bonded, the flexible display component 10 can be stably transferred simply by adsorbing the rigid substrate 11 with the second vacuum chuck 24. At the same time, this reduces the power consumption required for the first vacuum chuck 23 to operate.

[0101] Of course, in other embodiments of this application, when the size of the flexible display component 10 is large, in order to improve the reliability of the transfer, the first vacuum chuck 23 can simultaneously adsorb the epitaxial portion 14b and the second vacuum chuck 24 can adsorb the rigid substrate 11, which will not be described in detail here.

[0102] 1012. Turn on the vacuum system of the first stripping platform to allow the first stripping platform to adsorb the process protective film.

[0103] For details, please continue reading. Figure 11 After the flexible display component 10 is transferred to the first peeling platform 30, the process protective film 14 adheres to the first peeling platform 30. At this time, the vacuum system of the first peeling platform 30 is activated, and the first peeling platform 30 firmly adsorbs the process protective film 14. Because the process protective film 14 has good flexibility and support, it ensures that the vacuum of the first peeling platform 30 is not conducted to the display functional layer 13, thereby avoiding adsorption marks on the side of the display functional layer 13 close to the first peeling platform 30; it also ensures that the flexible display component 10 can be fully unfolded horizontally without affecting the adjustment of the laser focal plane in subsequent steps.

[0104] It should be noted that the first stripping platform 30 has a vacuum system, which is a technology well known to those skilled in the art and will not be described in detail here.

[0105] 102. The rigid substrate is separated from the flexible display device by a laser lift-off process.

[0106] Specifically, such as Figure 14As shown, a high-energy excimer laser is used to irradiate the side of the rigid substrate 11 away from the flexible substrate 12. The direction of laser irradiation is adjusted to be perpendicular to the flexible substrate 12. The laser penetrates the rigid substrate 11 and is focused at the interface between the flexible substrate 12 and the rigid substrate 11, scanning the entire flexible substrate 12. Since the flexible substrate 12 is formed of organic materials such as polyimide, the polyimide absorbs the laser energy, and the bond energy between the flexible substrate 12 and the rigid substrate 11 is broken. The polyimide itself decomposes and carbonizes, accompanied by the release of a small amount of gas, thereby achieving a complete separation between the flexible substrate 12 and the rigid substrate 11.

[0107] The power of the laser can be set according to actual needs.

[0108] 103. The flexible display component is transferred to the second peeling platform using a peeling device, wherein the first vacuum chuck is used to adsorb the epitaxial portion and the second vacuum chuck is used to adsorb the rigid substrate.

[0109] Specifically, such as Figure 15 As shown, the second peeling platform 40 is a film peeling platform. It is understood that after laser scanning, the contact interface between the flexible substrate 12 and the rigid substrate 11 carbonizes, generating many tiny particles. To maintain the cleanliness of the LLO working cavity, it is not suitable to peel the rigid substrate 11 from the flexible substrate 12 at this time. Therefore, the flexible display assembly 10, with the rigid substrate 11 and flexible substrate 12 already separated, needs to be transferred to the second peeling platform 40 before peeling the rigid substrate 11.

[0110] Specifically, step 103 includes the following steps:

[0111] 1031. Adjust the extension length of the first vacuum chuck and the second vacuum chuck so that the first vacuum chuck adsorbs the epitaxial portion, or so that the first vacuum chuck adsorbs the epitaxial portion and the second vacuum chuck adsorbs the rigid substrate, so as to transfer the flexible display component from the first peeling platform to the second peeling platform.

[0112] Specifically, in some embodiments, such as Figure 16 As shown, the extension and retraction lengths of the first vacuum chuck 23 and the second vacuum chuck 24 are controlled by a control knob or other lifting control device, so that the first vacuum chuck 23 adsorbs the epitaxial portion 14b and the second vacuum chuck 24 adsorbs the rigid substrate 11. Then, the flexible display assembly 10 is transferred from the first peeling platform 30 to the second peeling platform 40.

[0113] During the transfer process, the process protective film 14 acts as a carrier to lift the display functional layer 13 and the rigid substrate 11 upwards, so that the rigid substrate 11 does not fall off during the transfer process; at the same time, the weak adhesiveness of the process protective film 14 fixes the entire display functional layer 13, and the process protective film 14, the display functional layer 13 and the rigid substrate 11 will not undergo relative displacement during the transfer process.

[0114] Furthermore, since the rigid substrate 11 is more rigid than the process protective film 14, it is easier for the rigid substrate 11 to be adsorbed. Therefore, during the transfer process, the vacuum flow rate of the first vacuum chuck 23 can be set to be greater than the vacuum flow rate of the second vacuum chuck 24, so that both the process protective film 14 and the rigid substrate 11 can be uniformly adsorbed, thereby improving the stability of the transfer.

[0115] Of course, in other embodiments, when the flexible display component 10 is small, the extension and retraction lengths of the first vacuum chuck 23 and the second vacuum chuck 24 can be controlled by a control knob or other lifting control device, so that the first vacuum chuck 23 adsorbs the epitaxial portion 14b and the second vacuum chuck 24 separates from the rigid substrate 11, thereby achieving the transfer of the flexible display component 10. The process protective film 14, as a carrier, lifts the display functional layer 13 and the rigid substrate 11 upwards, which also prevents the rigid substrate 11 from falling off during the transfer process.

[0116] 1032. Turn on the vacuum system of the second stripping platform to allow the second stripping platform to adsorb the process protective film.

[0117] For details, please continue reading. Figure 15 After the flexible display component 10 is transferred to the second peeling platform 40, the process protective film 14 adheres to the second peeling platform 40. At this time, the vacuum system of the second peeling platform 40 is activated, and the second peeling platform 40 firmly adheres to the process protective film 14. Because the process protective film 14 has good flexibility and support, it ensures that the vacuum level of the second peeling platform 40 is not conducted to the display functional layer 13, thereby avoiding adsorption marks left on the side of the display functional layer 13 close to the second peeling platform 40. At the same time, fixing the flexible display component 10 facilitates the subsequent peeling of the rigid substrate 11.

[0118] It should be noted that the second stripping platform 40 has a vacuum system, which is a technology well known to those skilled in the art and will not be described in detail here.

[0119] 104. Peel the rigid substrate off the flexible display device.

[0120] Specifically, such as Figure 17 and Figure 18 As shown, step 104 includes the following steps:

[0121] 1041. Adjust the extension length of the first vacuum chuck to separate the first vacuum chuck from the epitaxial portion, while the second vacuum chuck continues to adsorb the rigid substrate.

[0122] Specifically, the extension and retraction lengths of the first vacuum chuck 23 and the second vacuum chuck 24 are controlled by a control knob or other lifting control device, so that the first vacuum chuck 23 is separated from the epitaxial portion 14b, while the second vacuum chuck 24 continues to adsorb the rigid substrate 11.

[0123] 1042. Rotate the rotating shaft to lift the transfer stage from one side to the other so that the rigid substrate is peeled off from the flexible substrate.

[0124] Specifically, the rotating shaft 21 is rotated 1 to 3 degrees along the first direction, causing the transfer stage 22 to rotate 1 to 3 degrees from one side of the transfer stage 22 to the other side. This is held for 1 to 2 seconds. At this time, the rigid substrate 11 is adsorbed by the second vacuum suction cup 24 on the transfer stage 22. Therefore, one side of the rigid substrate 11 tilts upwards by 1 to 3 degrees along the first direction, creating an opening A. The rotating shaft 21 is then rotated 3 to 5 degrees along the first direction, causing the transfer stage 22 to continue rotating 3 to 5 degrees from one side of the transfer stage 22 to the other side. This is held for 1 to 2 seconds. At this time, one side of the rigid substrate 11 tilts upwards by an even larger opening A along the first direction. Finally, the peeling device 20 is vertically lifted, and the rigid substrate 11 is peeled off from the flexible substrate 12.

[0125] The first direction is clockwise as shown in the figure. Of course, in other embodiments, the first direction can also be counterclockwise.

[0126] In addition, after removing the rigid substrate 11, the process protective film 14 also needs to be removed to obtain the flexible display device. For details, please refer to [link to relevant documentation]. Figure 19 , Figure 19 This is a schematic diagram of the process for removing the process protective film. The steps for removing the process protective film 14 are as follows: First, a support layer 16 is attached to the side of the flexible substrate 12 away from the process protective film. Then, the process protective film 14 is peeled off from the display functional layer 13.

[0127] The support layer 16 can be made of any one of the following materials: polyimide film, polyester resin, steel sheet, Invar alloy, copper sheet, or aluminum sheet. The support layer 16 can be bonded to the flexible substrate 12 using optical acrylic pressure-sensitive adhesive to provide support and protection.

[0128] Because the adhesion between the display functional layer 13 and the process protective film 14 is less than the adhesion between the display functional layer 13 and the support layer 16, the process protective film 14 can be easily peeled off. After the process protective film 14 is peeled off from the display functional layer 13, the flexible display device includes the support layer 16, the flexible substrate 12, and the display functional layer 13. The flexible display device can be a flexible display panel, or a flexible OLED (Organic Light-Emitting Diode) display panel or an AMOLED (Active-matrix Organic Light-Emitting Diode) display panel; this application does not specifically limit it in this regard.

[0129] This application provides a method for peeling off a rigid substrate. During the peeling process using the peeling device provided in this application, when transferring a flexible display component, a first vacuum suction cup adsorbs the epitaxial portion of the process protective film, and a second vacuum suction cup adsorbs the rigid substrate. During the transfer process, the process protective film acts as a carrier, lifting the display functional layer and the rigid substrate upwards, preventing the rigid substrate from detaching during transfer. Simultaneously, the weak adhesiveness of the process protective film secures the entire display functional layer. During the transfer process, the process protective film, the flexible display device (including a flexible substrate and the display functional layer sequentially stacked on the rigid substrate), and the rigid substrate do not experience relative displacement, thereby improving product yield.

[0130] The peeling apparatus and rigid substrate peeling method provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A peeling apparatus characterized by comprising: A flexible display assembly is transferred, the flexible display assembly comprising a rigid substrate, a flexible display device and a process protection film which are sequentially stacked, the process protection film comprising a fitting portion and an extension portion which is disposed around the fitting portion and extends from an edge of the fitting portion to outside of an edge of the rigid substrate; The peeling device comprises: a rotating shaft; and a transfer table which is rotationally connected to the rotating shaft, the transfer table being provided with a plurality of first vacuum suction cups and a plurality of second vacuum suction cups which are retractable, the plurality of first vacuum suction cups being disposed around the plurality of second vacuum suction cups; wherein the first vacuum suction cups are used for adsorbing the extension portion, and the second vacuum suction cups are used for adsorbing the rigid substrate; the distance between adjacent first vacuum suction cups is smaller than the distance between adjacent second vacuum suction cups; and the adsorption area of the first vacuum suction cups is larger than the adsorption area of the second vacuum suction cups.

2. The peeling apparatus according to claim 1, characterized by The transfer table comprises a first grabbing portion and a second grabbing portion, the first grabbing portion is connected to the rotating shaft, and the second grabbing portion is connected to the first grabbing portion; wherein the first grabbing portion is a hollow frame, the first grabbing portion is disposed around the second grabbing portion, the first vacuum suction cups are disposed on the first grabbing portion, and the second vacuum suction cups are disposed on the second grabbing portion.

3. The peeling apparatus according to claim 2, characterized by The plurality of first vacuum suction cups are equidistantly disposed on the first grabbing portion, and the plurality of second vacuum suction cups are equidistantly disposed on the second grabbing portion.

4. A hard substrate peeling method characterized by, comprises: transferring a flexible display assembly to a first peeling platform, the flexible display assembly comprising a rigid substrate, a flexible display device and a process protection film which are sequentially stacked, the process protection film comprising a fitting portion and an extension portion which is disposed around the fitting portion and extends from an edge of the fitting portion to outside of an edge of the rigid substrate; separating the rigid substrate from the flexible display device by a laser peeling process; transferring the flexible display assembly to a second peeling platform by using the peeling device according to any one of claims 1 to 3, wherein the first vacuum suction cups are used for adsorbing the extension portion, and the second vacuum suction cups are used for adsorbing the rigid substrate; peeling the rigid substrate from the flexible display device.

5. The hard substrate peeling method according to claim 4, wherein The step of transferring the flexible display assembly to the first peeling platform comprises: adjusting the retractable length of the first vacuum suction cups and the second vacuum suction cups so that the first vacuum suction cups adsorb the extension portion and / or the second vacuum suction cups adsorb the rigid substrate, to transfer the flexible display assembly to the first peeling platform; turning on the vacuum system of the first peeling platform so that the first peeling platform adsorbs the process protection film.

6. The hard substrate peeling method according to claim 4, wherein The step of transferring the flexible display assembly to the second peeling platform comprises: adjusting the retractable length of the first vacuum suction cups and the second vacuum suction cups so that the first vacuum suction cups adsorb the extension portion or the first vacuum suction cups adsorb the extension portion and the second vacuum suction cups adsorb the rigid substrate, to transfer the flexible display assembly from the first peeling platform to the second peeling platform; Turning on a vacuum system of the second peeling platform to make the second peeling platform adsorb the process protection film.

7. The hard substrate peeling method according to any one of claims 4 to 6, wherein The step of peeling the hard substrate from the flexible display device comprises: Adjusting the telescopic length of the first vacuum chuck to separate the first vacuum chuck from the epitaxial part, and the second vacuum chuck continues to adsorb the hard substrate; Rotating the rotating shaft to lift the transfer table from one side to the other side to peel the hard substrate from the flexible display device.

8. The hard substrate peeling method according to claim 7, wherein The step of rotating the rotating shaft to lift the transfer table from one side to the other side to peel the hard substrate from the flexible display device comprises: Rotating the rotating shaft by 1-3 degrees in a first direction to rotate the transfer table by 1-3 degrees from one side to the other side, and standing still for 1-2 seconds; Continuing to rotate the rotating shaft by 3-5 degrees in the first direction to continue to rotate the transfer table by 3-5 degrees from one side to the other side, and standing still for 1-2 seconds; Lifting the transfer table vertically until the hard substrate is peeled from the flexible display device.

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