An anti-deformation leveling mechanism for a suction cup module on a wafer debonding device

Abstract

The present invention belongs to the field of anti-deformation of suction cup modules, and in particular, is an anti-deformation leveling mechanism for suction cup modules on wafer debonding equipment. In view of the fact that existing suction cup groups on the market are easy to deform, inconvenient to adjust, and cannot ensure that the bottom of the suction cup is completely parallel, the following scheme is proposed: an anti-deformation leveling mechanism for suction cup modules on wafer debonding equipment, comprising a mounting plate, a horizontal plate fixedly provided at the lower end of the mounting plate, a connecting tube fixedly provided at the lower end of the horizontal plate, a sleeve fixedly provided at the lower end of the connecting tube, and a fixing plate fixedly provided on the inner wall of the sleeve. In the present invention, by providing a double-layer guide device, it can be well ensured that the suction cup will not shake or deform due to long-term work when it is working, and an infrared device and a marking line are provided. When a single suction cup is deformed, it can be manually adjusted according to the infrared irradiation point.

Description

Technical Field

[0001] The invention relates to the technical field of wafer debonding equipment, and in particular to an anti-deformation leveling mechanism for a suction cup module on a wafer debonding equipment. Background Art

[0002] The wafer debonding equipment uses negative pressure to achieve the debonding operation on the wafer. The wafer plane needs to remain absolutely level with the plane of the negative pressure suction cup. The existing level adjustment technical solutions for the negative pressure suction cup include screw column leveling method, center sphere leveling method, etc. The screw leveling method is affected by the thread accuracy and it is difficult to achieve absolute level, and the accuracy is low; the center sphere leveling method has the problem of heat deformation of the connecting plate, and has a short life and is not durable.

[0003] The invention with the existing patent number (CN216354125U) proposes an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device. The device is used for the anti-deformation leveling mechanism of the suction cup module on the wafer debonding device. Interlaced center air leveling screws, leveling nuts and connecting screws are installed at the corners of the connecting plate, which solves the problem of deformation of the heating plate under force. The device has the advantages of simple and efficient operation and long service life. However, the device cannot ensure that the bottom ends of the four suction cups are located in the same plane during adjustment, and the device only uses manual adjustment, which may have a great possibility of error. In view of the above problems, the present invention proposes an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device to facilitate people's use. Summary of the invention

[0004] The invention proposes an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device, which solves the problem that existing devices on the market cannot ensure that the bottom ends of multiple suction cups are in the same parallel and are not convenient to use.

[0005] In order to achieve the above-mentioned objectives, the present invention adopts the following technical scheme: an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device, comprising a mounting plate, a horizontal plate is fixedly provided at the lower end of the mounting plate, a connecting tube is fixedly provided at the lower end of the horizontal plate, a sleeve is fixedly provided at the lower end of the connecting tube, a fixing plate is fixedly provided on the inner wall of the sleeve, a threaded rod is fixedly provided on the inner wall of the upper end of the sleeve, a driven gear is fixedly provided on the outer wall of the threaded rod, a threaded sleeve is provided on the sliding sleeve of the outer wall of the threaded rod, a connecting block is fixedly provided on one side of the threaded sleeve, a moving rod is fixedly provided on one side of the connecting block, a limiting hole is provided inside the fixing plate, and a fixing seat is fixedly provided on the lower end of the moving rod.

[0006] A suction cup connecting plate is fixedly provided at the lower end of the fixing seat, and limiting rods are fixedly provided on both sides of the suction cup connecting plate. A limiting groove is provided on the inner wall of the sleeve, and vertical plates are fixedly provided on the outer walls of both sides of the sleeve. Guide grooves are provided on both sides of the vertical plates, and guide plates are slidably provided inside the guide grooves. A supporting column is fixedly provided at the lower end of the horizontal plate, and a fixing sleeve is fixedly provided on the outer wall of the lower end of the supporting column, and infrared devices are fixedly provided on both sides of the fixing sleeve.

[0007] Preferably, a mounting hole is provided inside the mounting plate.

[0008] Preferably, a rotating rod is provided on one side of the sleeve, a driving gear is fixedly provided on the outer wall of one end of the rotating rod close to the driven gear, and the driving gear is meshed with the driven gear.

[0009] Preferably, a rotating block is fixedly provided on one end of the rotating rod away from the driven gear.

[0010] Preferably, a side of the limiting rod close to the limiting groove passes into the interior of the limiting groove, and the limiting rod is in the shape of a cylinder.

[0011] Preferably, the guide plate is rectangular in shape, the lower end surface of the guide plate is fixedly connected to the upper end of the suction cup body, and the outer wall of the guide plate is fixedly provided with a marking line.

[0012] Preferably, the number of the support columns is two.

[0013] Preferably, the number of the sleeves is four.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. In the present invention, a structure that can manually adjust the suction cup body is provided. When the bottom end of the suction cup is unbalanced, the rotating block is rotated to drive the threaded rod to rotate, thereby driving the suction cup body to move up and down, thereby facilitating the adjustment of the position of the suction cup body and making the work more convenient.

[0016] 2. In the present invention, a structure for limiting the suction cup body is provided, and shaking may occur during the up and down movement of the suction cup body. The device is provided with a limit rod and a limit groove. When the suction cup body moves, the limit rod slides in the limit groove, and the first limit can be performed without shaking.

[0017] 3. In the present invention, a secondary limiting structure is provided outside the sleeve, and an infrared device is provided. It can be judged whether the suction cup base is located in the same plane according to the position of the marking line irradiated by the infrared output end, so that the later adjustment is more accurate and the use is relatively convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device proposed by the present invention;

[0019] Figure 2 A partial cross-sectional view of an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device proposed by the present invention;

[0020] Figure 3 A partial cross-sectional view of an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device proposed by the present invention;

[0021] Figure 4 A secondary limit structure diagram of an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device proposed by the present invention;

[0022] Figure 5 This is a partial structural view of an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device proposed by the present invention.

[0023] In the figure: 1. mounting plate; 2. mounting hole; 3. horizontal plate; 4. connecting tube; 5. sleeve; 6. fixing plate; 7. threaded rod; 8. driven gear; 9. rotating rod; 10. driving gear; 11. threaded sleeve; 12. connecting block; 13. moving rod; 14. limiting hole; 15. fixing seat; 16. suction cup connecting plate; 17. limiting rod; 18. limiting groove; 19. suction cup body; 20. vertical plate; 21. guide plate; 22. guide groove; 23. marking line; 24. support column; 25. fixing sleeve; 26. infrared device; 27. rotating block. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0025] refer to Figure 1-5, an anti-deformation leveling mechanism for a suction cup module on a wafer debonding device, comprising a mounting plate 1, the mounting plate 1 is used to open a mounting hole 2, a horizontal plate 3 is fixedly arranged at the lower end of the mounting plate 1, the horizontal plate 3 is used to set a connecting tube 4, the lower end of the horizontal plate 3 is fixedly arranged with a connecting tube 4, the lower end of the connecting tube 4 is fixedly arranged with a sleeve 5, the sleeve 5 is used to set a threaded rod 7, the inner wall of the sleeve 5 is fixedly arranged with a fixing plate 6, the fixing plate 6 is used to open a limiting hole 14, the upper inner wall of the sleeve 5 is fixedly arranged with a threaded rod 7, the outer wall of the threaded rod 7 is fixedly arranged with a driven gear 8, the outer wall of the threaded rod 7 is slidingly sleeved with a threaded sleeve 11, the threaded sleeve 11 is used to drive a moving rod 13 to move, a connecting block 12 is fixedly arranged on one side of the threaded sleeve 11, and a moving rod 13 is fixedly arranged on one side of the connecting block 12, a limiting hole 14 is opened inside the fixing plate 6, the limiting hole 14 is used to limit the moving rod 13, and a fixing seat 15 is fixedly arranged at the lower end of the moving rod 13.

[0026] A suction cup connecting plate 16 is fixedly provided at the lower end of the fixing seat 15, and the suction cup connecting plate 16 is used to connect the suction cup body 19. Limit rods 17 are fixedly provided on both sides of the suction cup connecting plate 16. A limiting groove 18 is provided on the inner wall of the sleeve 5. Vertical plates 20 are fixedly provided on the outer walls of both sides of the sleeve 5. Guide grooves 22 are provided on both sides of the vertical plates 20. Guide plates 21 are slidably provided inside the guide grooves 22. A support column 24 is fixedly provided at the lower end of the cross plate 3, and a fixing sleeve 25 is fixedly provided on the outer wall of the lower end of the support column 24. Infrared devices 26 are fixedly provided on both sides of the fixing sleeve 25.

[0027] A mounting hole 2 is provided inside the mounting plate 1, and the mounting hole 2 facilitates a stable connection between the mounting plate 1 and the connection location.

[0028] Among them, a rotating rod 9 is provided on one side of the sleeve 5, and the rotating rod 9 is used to set a driving gear 10. The outer wall of one end of the rotating rod 9 close to the driven gear 8 is fixed with a driving gear 10, and the driving gear 10 is used to drive the driven gear 8 to rotate, and the driving gear 10 is meshed with the driven gear 8.

[0029] A rotating block 27 is fixedly provided at one end of the rotating rod 9 away from the driven gear 8 , and the rotating block 27 facilitates the user to rotate the rotating rod 9 .

[0030] The side of the limiting rod 17 close to the limiting groove 18 passes into the inside of the limiting groove 18 , and the limiting rod 17 is in the shape of a cylinder.

[0031] Among them, the guide plate 21 is rectangular in shape, the lower end surface of the guide plate 21 is fixedly connected to the upper end of the suction cup body 19, and the outer wall of the guide plate 21 is fixedly provided with a marking line 23. The marking line 23 cooperates with the infrared device 26 to facilitate the operator to detect whether the position of the infrared irradiation is consistent.

[0032] There are two support columns 24 .

[0033] Among them, the number of sleeves 5 is four, and the four sleeves 5 can better adsorb objects and are more convenient to use.

[0034] Working principle: When manual adjustment of the suction cup is selected, the rotating block 27 is rotated to drive the rotating rod 9 to rotate, thereby driving the driving gear 10 to rotate, thereby driving the driven gear 8 to rotate, thereby driving the threaded rod 7 to rotate, thereby driving the threaded sleeve 11 to move, thereby driving the moving rod 13 to move, thereby driving the suction cup connecting plate 16 to move, thereby driving the limit rod 17 to move inside the limit groove 18 set on the inner wall of the sleeve 5, and the limit rod 17 can limit the suction cup connecting plate 16 for the first time from the inside, start the infrared device 26, and the infrared irradiation point is located on the marking line 23 of the guide plate 21. When the suction cup connecting plate 16 moves, the suction cup body 19 drives the guide plate 21 to slide inside the vertical plate 20. The position of the infrared irradiation on the marking line 23 is used to detect whether the bottom ends of multiple suction cup bodies 19 are located in the same plane. When the infrared irradiation points are different, it means that there is an error in the position of the suction cup body 19. After manual adjustment, when the irradiation lines are all located at the same position, the bottom ends of the suction cups are parallel, so as to work.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An anti-deformation leveling mechanism for a suction cup module on a wafer debonding device, comprising a mounting plate (1), characterized in that: A transverse plate (3) is fixedly provided at the lower end of the mounting plate (1), a connecting tube (4) is fixedly provided at the lower end of the transverse plate (3), a sleeve (5) is fixedly provided at the lower end of the connecting tube (4), a fixing plate (6) is fixedly provided on the inner wall of the sleeve (5), a threaded rod (7) is fixedly provided on the inner wall of the upper end of the sleeve (5), a driven gear (8) is fixedly provided on the outer wall of the threaded rod (7), a threaded sleeve (11) is slidingly sleeved on the outer wall of the threaded rod (7), a connecting block (12) is fixedly provided on one side of the threaded sleeve (11), a moving rod (13) is fixedly provided on one side of the connecting block (12), a limiting hole (14) is provided inside the fixing plate (6), and a fixing seat (15) is fixedly provided on the lower end of the moving rod (13); A suction cup connecting plate (16) is fixedly provided at the lower end of the fixing seat (15), and limiting rods (17) are fixedly provided on both sides of the suction cup connecting plate (16). A limiting groove (18) is provided on the inner wall of the sleeve (5), and vertical plates (20) are fixedly provided on the outer walls of both sides of the sleeve (5). Guide grooves (22) are provided on both sides of the vertical plates (20), and guide plates (21) are slidably provided inside the guide grooves (22). A support column (21) is fixedly provided at the lower end of the horizontal plate (3). 4), a fixing sleeve (25) is fixedly provided on the outer wall of the lower end of the support column (24), infrared devices (26) are fixedly provided on both sides of the fixing sleeve (25), a rotating rod (9) is provided on one side of the sleeve (5), a driving gear (10) is fixedly provided on the outer wall of one end of the rotating rod (9) close to the driven gear (8), the driving gear (10) is meshed with the driven gear (8), and a rotating block (27) is fixedly provided on one end of the rotating rod (9) away from the driven gear (8).

2. The anti-deformation leveling mechanism for a suction cup module on a wafer debonding device according to claim 1, characterized in that: A mounting hole (2) is provided inside the mounting plate (1).

3. The anti-deformation leveling mechanism for a suction cup module on a wafer debonding device according to claim 1, characterized in that: A side of the limiting rod (17) close to the limiting groove (18) extends into the interior of the limiting groove (18), and the limiting rod (17) is in the shape of a cylinder.

4. The anti-deformation leveling mechanism for a suction cup module on a wafer debonding device according to claim 1, characterized in that: The guide plate (21) is rectangular in shape, the lower end surface of the guide plate (21) is fixedly connected to the upper end of the suction cup body (19), and a marking line (23) is fixedly provided on the outer wall of the guide plate (21).

5. The anti-deformation leveling mechanism for a suction cup module on a wafer debonding device according to claim 1, characterized in that: The number of the support columns (24) is two.

6. The anti-deformation leveling mechanism for a suction cup module on a wafer debonding device according to claim 1, characterized in that: The number of the sleeves (5) is four.

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