Printed substrate and electronic machine

Abstract

Embodiments of the present application provide a printed substrate in which a characteristic difference of wiring is suppressed and an electronic device. According to the printed substrate of the embodiments, a first insulator and a second insulator each extend in a first direction and are arranged adjacent to each other in a second direction intersecting the first direction. A third insulator extends in the second direction and includes a first portion located above in a third direction intersecting the first and second directions with respect to the first insulator and a second portion located below in the third direction with respect to the second insulator. A fourth insulator extends in the second direction and is arranged adjacent to the third insulator in the first direction and includes a third portion located below with respect to the first insulator and a fourth portion located above with respect to the second insulator. A first conductive body and a second conductive body each extend in the first direction and are arranged in the second direction at a first pitch. The first pitch is n times (n is an integer of 1 or more) a first distance based on a separation of the first and second portions or a separation of the third and fourth portions.

Description

[0001] [Related Application]

[0002] This application claims priority to Japanese Patent Application No. 2021-101858 (Filing date: June 18, 2021). This application incorporates the entire contents of the base application by reference thereto. TECHNICAL FIELD

[0003] Embodiments of the present application relate to a printed substrate and an electronic machine. BACKGROUND

[0004] A printed wiring substrate including a glass cloth using glass fibers, and an electronic machine including the printed wiring substrate are known. The glass cloth is a cloth having insulating properties in which a plurality of glass fibers are woven. Further, the printed wiring substrate has a wiring having electrical conductivity. In such an electronic machine, the wiring provided in the printed wiring substrate sometimes transmits a signal having a relatively high frequency. SUMMARY

[0005] Embodiments of the present application provide a printed substrate and an electronic machine in which a characteristic difference of a wiring is suppressed.

[0006] The printed substrate of the embodiment includes a first to fourth insulator, and a first to second conductor. The first insulator and the second insulator respectively extend in a first direction, and are disposed adjacent to each other in a second direction intersecting the first direction. The third insulator is disposed extending in the second direction, includes a first portion intersecting the first insulator and located above the first insulator in a third direction intersecting the first and second directions, and a second portion intersecting the second insulator and located below the second insulator in the third direction. The fourth insulator is disposed adjacent to the third insulator in the first direction and extending in the second direction, includes a third portion intersecting the first insulator and located below the first insulator, and a fourth portion intersecting the second insulator and located above the second insulator. The first conductor and the second conductor respectively extend in the first direction, and are disposed arranged at a first pitch in the second direction. The first pitch is n times (n is an integer of 1 or more) a first distance based on a separation of the first and second portions or a separation of the third and fourth portions. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a block diagram showing an example of a configuration of an electronic machine of the embodiment.

[0008] Figure 2 is a cross-sectional view showing a cross-sectional configuration of a printed substrate of the embodiment along line II-II.

[0009] Figure 3 is a plan view showing the planar configuration of the printed substrate along the III-III line, which represents an embodiment.

[0010] Figure 4 is a sectional view showing details of the cross-sectional configuration of the region IV of the printed substrate, which represents an embodiment.

[0011] Figure 5 is a sectional view showing the cross-sectional configuration of a model of the printed substrate used for simulation.

[0012] Figure 6 is a plan view showing the planar configuration of a model in the XY plane of the printed substrate used for simulation, which represents an embodiment.

[0013] Figure 7 is a graph showing the relationship between the differential pass characteristic and the frequency in the first example of the embodiment.

[0014] Figure 8 is a graph showing the relationship between the differential phase conversion characteristic and the frequency in the first example of the embodiment.

[0015] Figure 9 is a graph showing the relationship between the differential pass characteristic and the frequency in the second example of the embodiment.

[0016] Figure 10 is a graph showing the relationship between the differential phase conversion characteristic and the frequency in the second example of the embodiment.

[0017] Figure 11 is a graph showing the relationship between the differential pass characteristic and the frequency in the comparative example.

[0018] Figure 12 is a graph showing the relationship between the differential phase conversion characteristic and the frequency in the comparative example.

[0019] Figure 13 is a sectional view showing a part of the printed substrate of the first variation example of the embodiment.

[0020] Figure 14 is a plan view showing an example of the configuration of the electronic machine of the second variation example of the embodiment.

[0021] Figure 15 is a sectional view showing a part of the printed substrate of the third variation example of the embodiment. DETAILED DESCRIPTION

[0022] Embodiments will be described below with reference to the accompanying drawings. In the description, the same reference numerals are used for components having substantially the same function and configuration. In addition, the embodiments shown below illustrate the technical idea. The embodiments do not specify the material, shape, configuration, arrangement, and the like of the components. Various modifications can be added to the embodiments. In the embodiments described below, "connected" includes direct connection and indirect connection via a certain medium.

[0023] [1] Embodiment

[0024] A printed substrate of an embodiment and an electronic device including the printed substrate will be described.

[0025] [1-1] Configuration

[0026] [1-1-1] Overall configuration of electronic device 1

[0027] Figure 1 is a plan view showing an example of the configuration of an electronic device of an embodiment. As shown in Figure 1 , the electronic device 1 includes a transmission device 2, a reception device 3, and a printed wiring substrate (hereinafter, simply referred to as a printed substrate) 10.

[0028] The transmission device 2 is, for example, a package device that seals an IC (Integrated Circuit) chip with a resin. The transmission device 2 is provided on the printed substrate 10. The transmission device 2 transmits a signal to the reception device 3 via a wiring (not shown) provided on the printed substrate 10.

[0029] The reception device 3 is, for example, a package device that seals an IC chip with a resin. The reception device 3 is provided on the printed substrate 10. The reception device 3 receives a signal transmitted by the transmission device 2 via a wiring provided on the printed substrate 10.

[0030] The printed substrate 10 is a multilayer substrate including a plurality of wirings formed of an electrically conductive body.

[0031] Furthermore, in the accompanying drawings referenced in this specification, the planes defined by the X and Y directions correspond to planes parallel to the surfaces of the printed substrate 10. The Z direction corresponds to the vertical direction relative to the surfaces of the printed substrate 10. Additionally, in this embodiment, the surface of the printed substrate 10 where the transmitting device 2 and the receiving device 3 are disposed is designated as the upper surface. The surface of the printed substrate 10 where the transmitting device 2 and the receiving device 3 are not disposed is designated as the lower surface. Furthermore, in this embodiment, the direction along the Z direction from the lower surface of the printed substrate 10 toward the upper surface is designated as the upward direction. The direction along the Z direction from the upper surface of the printed substrate 10 toward the lower surface is designated as the downward direction. Furthermore, in this embodiment, the side along the Z direction from the lower surface toward the upper surface is designated as the upper side, and the direction from the lower surface toward the upper surface is designated as the upward or +Z direction. The side along the Z direction from the upper surface toward the lower surface is designated as the lower side, and the direction from the upper surface toward the lower surface is designated as the downward or -Z direction. Alternatively, the transmitting device 2 may be disposed on one of the upper or lower surfaces of the printed substrate 10, and the receiving device 3 may be disposed on the other surface of the upper or lower surface of the printed substrate 10.

[0032] [1-1-2] Structure of the printed substrate 10

[0033] (Overall structure of printed substrate 10)

[0034] Figure 2 The printed substrate representing the embodiment is along line II-II (refer to...). Figure 1 A sectional view of the cross-section of a structure. For example... Figure 2 As shown, the printed substrate 10 is a multilayer substrate comprising insulators 11, 13, 15, 16, 18 and 20, and conductors 12, 14a, 14b, 17 and 19.

[0035] Insulator 11 is an insulating substrate. Insulator 11 is disposed extending in the XY plane. Insulator 11 insulates wiring disposed on the upper side of insulator 11 from wiring disposed on the lower side of insulator 11.

[0036] Conductor 12 is a conductive wiring. Conductor 12 is connected to insulator 11 on its underside and is disposed extending in the XY plane. Conductor 12 electrically connects transmitting device 2 and receiving device 3, for example, through a through-hole (not shown). When the electronic device 1 is operated, a ground voltage is applied to conductor 12. The ground voltage is the ground potential in electronic device 1. Therefore, conductor 12 can also be referred to as a ground plane.

[0037] Insulator 13 is solder resist. Insulator 13 is disposed on the underside of conductor 12 in a manner that covers conductor 12. Insulator 13 insulates conductor 12 from the outside of printed substrate 10.

[0038] The conductive bodies 14a and 14b are each a wiring having conductivity. The conductive bodies 14a and 14b are a group of wirings that transmit differential signals. The conductive bodies 14a and 14b and the insulating body 15 are provided on the upper side of the insulating body 11 in contact with the insulating body 11. The conductive bodies 14a and 14b are each provided so as to extend in the X direction. The conductive bodies 14a and 14b are provided so as to be arranged in the Y direction. The conductive bodies 14a and 14b transmit differential signals from the transmitting device 2 to the receiving device 3 via a via not shown, for example. In the present embodiment, the pitch of a plurality of conductive bodies arranged in a certain direction represents the length or distance from the center of a certain conductive body to the center of an adjacent conductive body in a certain direction. The pitch in the Y direction of the conductive body 14a and the conductive body 14b is defined as the pitch "P1".

[0039] The insulating body 15 is a substrate having insulating properties. The insulating body 15 is provided on the upper side of the insulating body 11 in contact with the insulating body 11 and extends in the XY plane. A portion of the insulating body 15 is provided between the conductive body 14a and the conductive body 14b to insulate the conductive body 14a and the conductive body 14b.

[0040] The insulating body 16 is a substrate having insulating properties. The insulating body 16 is provided on the upper side of each of the conductive bodies 14a and 14b in contact with them respectively, on the upper side of the insulating body 15 in contact with the insulating body 15, and extends in the XY plane. The insulating body 16 insulates a wiring provided on the upper side of the insulating body 16 from a wiring (for example, the conductive bodies 14a and 14b) provided on the lower side of the insulating body 16.

[0041] The conductive body 17 is a wiring having conductivity. The conductive body 17 is provided on the upper side of the insulating body 16 in contact with the insulating body 16 and extends in the XY plane. The conductive body 17 electrically connects between the transmitting device 2 and the receiving device 3 via a via not shown, for example. The conductive body 17 is applied with a ground voltage when the electronic device 1 is operated. The conductive body 17 can also be referred to as a ground layer.

[0042] The insulating body 18 is a substrate having insulating properties. The insulating body 18 is provided on the upper side of the conductive body 17 in contact with the conductive body 17 and extends in the XY plane. The insulating body 18 insulates a wiring provided on the upper side of the insulating body 18 from a wiring (for example, the conductive body 17) provided on the lower side of the insulating body 18.

[0043] The conductive body 19 is a wiring having conductivity. The conductive body 19 is provided on the upper side of the insulating body 18 in contact with the insulating body 18. The conductive body 19 is provided so as to extend in the X direction. The conductive body 19 transmits a signal from the transmitting device 2 to the receiving device 3 without passing through a via.

[0044] The insulator 20 is solder resist. The insulator 20 is provided on the upper side of the conductor 19 in a manner so as to cover the conductor 19. The insulator 20 is further provided on the upper side of the insulator 18 in a manner so as to cover the region where the conductor 19 is not provided. The insulator 20 insulates the conductor 19 from the outside of the printed substrate 10.

[0045] (Configuration of the fabric structure 100)

[0046] Figure 3 is a plan view of the planar configuration of the printed substrate of the embodiment along the III-III line (refer to Figure 2 ) in the XY plane. Figure 3 shows the planar configuration of a portion of the insulator 11 included in the printed substrate 10 in the XY plane.

[0047] The insulator 11 includes the fabric structure 100. The fabric structure 100 includes a plurality of insulators 101 and a plurality of insulators 102. In the Figure 3 The plurality of insulators 101 includes insulators 101-1 to 101-7 in the illustrated region. The plurality of insulators 102 includes insulators 102-1 to 102-7 in the Figure 3 The plurality of insulators 102 includes insulators 102-1 to 102-7 in the

[0048] The fabric structure 100 functions as a base material of the insulator 11. The fabric structure 100 has a constitution obtained by weaving the insulators 101 and the insulators 102. The plurality of insulators 101 is the weft yarn of the fabric structure 100. The plurality of insulators 102 is the warp yarn of the fabric structure 100. The fabric structure 100 is, for example, glass cloth. In this case, the insulators 101 and 102 are glass fibers, respectively.

[0049] The plurality of insulators 101 is provided so as to extend in the X direction and be arranged in the Y direction, respectively. The plurality of insulators 102 is provided so as to extend in the Y direction and be arranged in the X direction, respectively. Details are explained focusing on the insulators 101-1 and 101-2, and the insulators 102-1 and 102-2.

[0050] The insulators 101-1 and 101-2 are provided so as to extend in the X direction and be adjacent in the Y direction, respectively.

[0051] The insulator 102-1 is provided so as to extend in the Y direction. The insulator 102-1 includes an upper portion that crosses the insulator 101-1 and is located above the insulator 101-1, and a lower portion that crosses the insulator 101-2 and is located below the insulator 101-2.

[0052] The insulator 102-2 is disposed adjacent to the insulator 102-1 in the X direction and extends in the Y direction. The insulator 102-2 includes a lower portion that crosses the insulator 101-1 and is located below the insulator 101-1, and an upper portion that crosses the insulator 101-2 and is located above the insulator 101-2.

[0053] Hereinafter, the insulator 101 disposed at the odd-numbered insulator 101, like the insulator 101-1, 101-3, 101-5, and 101-7, is referred to as an insulator 101odd. The insulator 101 disposed at the even-numbered insulator 101, like the insulator 101-2, 101-4, and 101-6, is referred to as an insulator 101even. The insulator 102 disposed at the odd-numbered insulator 102, like the insulator 102-1, 102-3, 102-5, and 102-7, is referred to as an insulator 102odd. The insulator 102 disposed at the even-numbered insulator 102, like the insulator 102-2, 102-4, and 102-6, is referred to as an insulator 102even.

[0054] The configurations of the adjacent insulator 101odd and 101even, and the adjacent insulator 102odd and 102even are the same as the configurations described with respect to the insulator 101-1 and 101-2, and the insulator 102-1 and 102-2. That is, in the fabric configuration 100, the configuration described with respect to the insulator 101-1 and 101-2, and the insulator 102-1 and 102-2 is repeatedly disposed in the X direction and the Y direction. Specifically, the insulator 101odd and 101even are repeatedly disposed in the Y direction. In the insulator 102, the upper portion and the lower portion are repeatedly disposed along the Y direction. The insulator 102odd and 102even are repeatedly disposed in the X direction. In the insulator 101, the upper portion and the lower portion are repeatedly disposed along the X direction.

[0055] Further, the insulator 16 and 18 also each include the fabric configuration 100 as with the insulator 11.

[0056] (Details of the configuration of the print substrate 10)

[0057] Figure 4 is a cross-sectional view showing the cross-sectional configuration of the region IV (see Figure 2 ) of the print substrate according to the embodiment. Figure 4 Details of the cross-sectional configuration of the print substrate 10 in the YZ plane are shown. As Figure 4 shown, the insulator 11 and 16 each further include an insulator 110. In the following description, the thickness is described as the length, size, or height in the Z direction.

[0058] As Figure 4As shown, the thickness of the fabric structure 100 in the Z direction is larger in portions where the insulator 101 and the insulator 102 cross, that is, in the upper portion or the lower portion of the insulator 102. The position of the upper portion of the insulator 102 is defined as the position where the thickness of the fabric structure 100 is largest in the upper portion of the insulator 102. The position of the lower portion of the insulator 102 is defined as the position where the thickness of the fabric structure 100 is largest in the lower portion of the insulator 102. In the insulator 102, the interval between the position of the upper portion and the position of the lower portion in the Y direction is a period "P2". The period "P2" corresponds to the length, size, or distance in the Y direction. The period "P2" can also be referred to as the pitch "P2". Since the upper portion and the lower portion of the insulator 102 are repeatedly provided in the Y direction, the portion where the thickness of the fabric structure 100 is larger is repeatedly provided in the Y direction with the period "P2". For example, the portion where the thickness of the fabric structure 100 is larger is referred to as a belly portion.

[0059] In addition, the thickness of the fabric structure 100 in the Z direction is smaller in portions where the insulator 101 and the insulator 102 do not cross. The portion where the thickness of the fabric structure 100 is smaller is also repeatedly provided in the Y direction with the period "P2", like the portion where the thickness of the fabric structure 100 is larger. For example, the portion where the thickness of the fabric structure 100 is smaller is referred to as a node portion.

[0060] The insulator 110 is an epoxy resin. The insulator 110 fills the gaps of the fabric structure 100 and covers the fabric structure 100. Thus, the insulator 110 functions as a reinforcing material for the fabric structure 100. In addition, the upper surface and the lower surface of each of the insulators 11 and 16 formed by the insulator 110 are flat surfaces in the XY plane. Thus, the flatness of each layer in the printed substrate 10 is ensured.

[0061] In the Z direction, the portion where the belly portion of the fabric structure 100 is present in the insulator 11 is thicker in the fabric structure 100 and thinner in the insulator 110. In addition, the portion where the node portion of the fabric structure 100 is present in the insulator 11 is thinner in the fabric structure 100 and thicker in the insulator 110. The same applies to the insulator 16. Furthermore, the insulator 18 can have the same configuration as the insulators 11 and 16, including the fabric structure 100 and the insulator 110, but the insulator 18 is not shown in FIG. 1. Figure 4

[0062] Regarding the conductive bodies 14a and 14b, the pitch "P1" in the Y direction is set to be one or more integral multiples of the period "P2" of the fabric structure 100 (P1 = n x P2, where n is an integer of one or more). In the embodiment, the pitch "P1" is equal to the period "P2" (n = 1). Figure 4 In the embodiment, the case where the pitch "P1" is equal to the period "P2" (n = 1) is exemplified.

[0063] [1-2] Effects ​

[0064] According to the printed substrate 10 of the embodiment described above, it is possible to suppress a difference in characteristics of the wiring. Hereinafter, a detailed effect of the printed substrate 10 of the embodiment will be described.

[0065] The relative dielectric constant or the dielectric loss tangent and the like of the base material (i.e., the fabric structure 100) and the reinforcing material (i.e., the insulator 110) included in the printed substrate 10 are different. Therefore, in the printed substrate 10, it is possible that the relative dielectric constant or the dielectric loss tangent and the like are different between a portion where the base material is thick and the reinforcing material is thin and a portion where the base material is thin and the reinforcing material is thick. If a plurality of wirings are provided in portions where the physical properties are different, it is possible that the characteristics of the wirings are also different.

[0066] In the printed substrate 10 of the embodiment, the pitch "P1" of the conductors 14a and 14b that function as wirings that transmit a differential signal is set to be one or more integral multiples of the period "P2" of the fabric structure 100. Since the pitch "P1" of the conductors 14a and 14b and the period "P2" of the fabric structure 100 have a relationship of one or more integral multiples, the configuration in the thickness direction (i.e., the Z direction) of the printed substrate 10 in the portions where the conductors 14a and 14b exist is substantially equal. Thus, it is possible to suppress a difference in characteristics of the wirings.

[0067] If the characteristics of the wirings that transmit a differential signal are different, it is possible that the signal quality is deteriorated, and the speed or the frequency of the signal that can be transmitted via the wirings is limited. In the printed substrate 10 of the embodiment, it is possible to suppress a difference in characteristics of the wirings, and thus it is possible to stably transmit a high-speed or high-frequency signal. That is, the electronic device 1 including the printed substrate 10 of the embodiment can stably transmit a high-speed or high-frequency signal from the transmitting device 2 to the receiving device 3.

[0068] [2] Evaluation by simulation

[0069] For the above-described embodiment and the following comparative examples, a model of a printed substrate was prepared to simulate the characteristics of the wirings, and evaluation was performed. Hereinafter, the model of the printed substrate used for the simulation, the simulation conditions, and the simulation results will be described in order.

[0070] [2-1] Model of printed substrate used for simulation

[0071] A model of a printed substrate that simply represents the configuration of the printed substrate 10 indicated by the embodiment was prepared to perform the simulation. Figure 5 is a cross-sectional view that represents the cross-sectional configuration of the model of the printed substrate used for the simulation. As shown in FIG. 17, the model of the printed substrate includes a base material 100 and a reinforcing material 110. The base material 100 is a fabric structure 100, and the reinforcing material 110 is an insulator 110. Figure 5The model of the printed substrate used in the simulation includes fabric constructions 100a and 100b, an insulator 110a, and conductors 12, 14a, 14b, and 17. Figure 5 The model of the printed substrate used in the simulation includes fabric constructions 100a and 100b, an insulator 110a, and conductors 12, 14a, 14b, and 17. Figure 4 The model of the printed substrate used in the simulation includes fabric constructions 100a and 100b, an insulator 110a, and conductors 12, 14a, 14b, and 17.

[0072] The fabric construction 100a corresponds to the fabric construction 100 included in the insulator 11 described in the embodiment. The fabric construction 100b corresponds to the fabric construction 100 included in the insulator 16 described in the embodiment. The insulator 110a corresponds to the insulator 110 included in the insulator 11, the insulator 15, and the insulator 110 included in the insulator 16 described in the embodiment, respectively.

[0073] The fabric construction 100a has a construction in which the thickness in the Z direction varies repeatedly in the Y direction with a period "P2". The thickness of the node portion of the fabric construction 100a is "D1". The thickness of the web portion of the fabric construction 100a is "D2" thicker in the Z direction and "D3" thinner than the thickness "D1" of the node portion. The web portion of the fabric construction 100a is provided in the Y direction across a width "W1" from the node portion to the central portion of the node portion. The fabric construction 100b also has the same construction as the fabric construction 100a.

[0074] In the model of the printed substrate used in the simulation, the thickness of each of the fabric constructions 100a and 100b is equal to the thickness of each of the insulators 11 and 16 described in the embodiment. That is, the web portion of each of the fabric constructions 100a and 100b has a portion directly in contact with the adjacent conductor.

[0075] The thickness of each of the conductors 12, 14a, 14b, and 17 is "D4". The conductors 14a and 14b are provided in the Y direction at a pitch "P1". The width of each of the conductors 14a and 14b in the Y direction is "W2". In addition, in the Y direction, the distance from the node position of the fabric construction 100a to the midpoint of the conductors 14a and 14b closer to the midpoint is defined as "ΔY".

[0076] With respect to each parameter, the values used in the simulation are listed below.

[0077] P2: 500 um

[0078] W1: 200 um

[0079] W2: 100 um

[0080] D1: 50 um

[0081] D2: 50 um

[0082] D3: 50 um

[0083] D4: 15 um

[0084] Further, the length of each of the conductors 14a and 14b in the X direction was set to 5 mm. In the model of the printed substrate used for the simulation, the relative permittivity of the fabric structure 100a and 100b was set to 5.5, and the relative permittivity of the insulator 110a was set to 3.6.

[0085] Figure 6 is a plan view showing a planar structure in the XY plane of the model of the printed substrate used for the simulation. In Figure 6 , the fabric structure 100a, and the conductors 14a and 14b are extracted and shown in the model of the printed substrate used for the simulation.

[0086] As shown in Figure 6 , the fabric structure 100a also has a structure in which the thickness of the fabric structure 100a periodically repeats a variation in the X direction as well as in the Y direction. Figure 6 An example in which the variation in the thickness is a period "P2" in both the X direction and the Y direction is shown. The fabric structure 100b also has the same structure as the fabric structure 100a.

[0087] Further, in Figure 5 and Figure 6 , a case in which the pitch "P1" of the conductors 14a and 14b is 1 time the period "P2" of the fabric structure 100a is exemplified.

[0088] [2-2] Simulation Conditions

[0089] The first example of the embodiment, the second example of the embodiment, and the comparative example were simulated. The conditions of each example and the details of the simulation are sequentially described.

[0090] First, the conditions of each example are described. In the first example of the embodiment, the pitch "P1" of the conductors 14a and 14b was set to 500 um. That is, in the first example of the embodiment, the pitch "P1" of the differential lines is 1 time the period "P2" of the fabric structure 100a.

[0091] In the second example of the embodiment, the pitch "P1" of the conductors 14a and 14b was set to 1000 um. That is, in the second example of the embodiment, the pitch "P1" of the differential lines is 2 times the period "P2" of the fabric structure 100a.

[0092] In the comparative example, the pitch "P1" of the conductors 14a and 14b was set to 230 um. That is, in the comparative example, the pitch "P1" of the differential lines is not an integer number of times the period "P2" of the fabric structure 100a.

[0093] Next, the simulation details are described. In the simulation, "ΔY" was changed from 0 μm to 100 μm by 10 μm each time, and the line characteristics for each "ΔY" were simulated.

[0094] The simulated line characteristics were the differential pass characteristic Sdd21 and the differential to single conversion characteristic Scd21. The differential pass characteristic Sdd21 indicates the amount of attenuation of a differential signal when the differential signal passes through a differential line. The differential pass characteristic Sdd21 is preferably small in the amount of attenuation. The differential to single conversion characteristic Scd21 indicates the amount of conversion from a differential signal to a single signal when the differential signal passes through a differential line. The differential to single conversion characteristic Scd21 is preferably small in the amount of conversion.

[0095] [2-3] Simulation Results

[0096] In Figures 7 to 12 the simulation results are shown. Figure 7 is a graph showing the relationship between the differential pass characteristic and the frequency in the first example of the embodiment. Figure 8 is a graph showing the relationship between the differential to single conversion characteristic and the frequency in the first example of the embodiment. Figure 9 is a graph showing the relationship between the differential pass characteristic and the frequency in the second example of the embodiment. Figure 10 is a graph showing the relationship between the differential to single conversion characteristic and the frequency in the second example of the embodiment. Figure 11 is a graph showing the relationship between the differential pass characteristic and the frequency in the comparative example. Figure 12 is a graph showing the relationship between the differential to single conversion characteristic and the frequency in the comparative example.

[0097] Figure 7 , Figure 9 and Figure 11 The vertical axis of each indicates the differential pass characteristic Sdd21. Figure 7 , Figure 9 and Figure 11 The lower the vertical axis of each, the more negative the differential pass characteristic Sdd21 is in absolute value. Figure 7 , Figure 9 and Figure 11 The ranges of the vertical axes of each are the same. Figure 8 , Figure 10 and Figure 12 The vertical axis of each indicates the differential to single conversion characteristic Scd21. Figure 8 , Figure 10 and Figure 12 The lower the vertical axis of each, the more negative the differential to single conversion characteristic Scd21 is in absolute value. Figure 8 , Figure 10 and Figure 12 The ranges of the vertical axes of each are the same. Figures 7 to 12The unit for each vertical axis is decibels. Figures 7 to 12 The horizontal axis of each represents frequency. Figures 7 to 12 The horizontal axis for each is in gigahertz (GHz). Figures 7 to 12 In the diagram, multiple lines are used to represent the simulation results of changing "ΔY".

[0098] like Figure 7 and Figure 9 As shown, in the first and second embodiments, even when "ΔY" is changed, the variation in the differential pass characteristic Sdd21 is suppressed to a small extent. Furthermore, in the first and second embodiments, the attenuation in the differential pass characteristic Sdd21 is suppressed to a small extent throughout the entire frequency range shown. Conversely, as... Figure 11 As shown, in the comparative example, if "ΔY" is changed, the differential transmission characteristic Sdd21 will change. Furthermore, the attenuation in the differential transmission characteristic Sdd21 of the comparative example is greater than the attenuation in the differential transmission characteristic Sdd21 of the first and second embodiments. Additionally, in the comparative example, the higher the frequency, the greater the difference in the differential transmission characteristic Sdd21, and the greater the attenuation.

[0099] like Figure 8 and Figure 10 As shown, in the first and second embodiments, even when "ΔY" changes, the variation in the differential in-phase conversion characteristic Scd21 is suppressed within a certain range. Furthermore, in the first and second embodiments, the conversion amount in the differential in-phase conversion characteristic Scd21 is suppressed to a smaller extent. In contrast, as... Figure 12 As shown, in the comparative example, if "ΔY" is changed, the differential in-phase conversion characteristic Scd21 changes more significantly than in the first and second embodiments. Furthermore, the conversion amount in the differential in-phase conversion characteristic Scd21 of the comparative example is greater than the conversion amount in the differential in-phase conversion characteristic Scd21 of the first and second embodiments.

[0100] Thus, simulations confirm that by constructing the printed substrate in such a way that the spacing of the differential wiring is an integer multiple of the period of the fabric structure thickness in the insulator, the characteristic differences of the wiring can be suppressed.

[0101] [3] Other variations, etc.

[0102] In the manufacturing of printed circuit substrates, manufacturing errors can occur in both the spacing of the wiring and the periodicity of the fabric thickness in the insulator. Therefore, when determining whether the spacing of the differential wiring is an integer multiple of 1 or more of the periodicity of the fabric thickness, the influence of manufacturing errors must be taken into account. The following refers to... Figure 4A method that takes into account the influence of manufacturing errors will be described, for example, in the case of the printed board 10 described in the manufacturing example and the case of observing the cross-sectional configuration.

[0103] When the printed board 10 is actually manufactured, the interval between the adjoining upper and lower portions in the insulator 102 can be influenced by manufacturing errors. As a result, when the cross section is observed and the interval between the adjoining upper and lower portions is measured, the interval between the adjoining upper and lower portions can be larger than the period "P2" or smaller than the period "P2" depending on the measurement site.

[0104] Therefore, for example, in the case of estimating the relationship between the pitch of the differential lines and the period of the thickness of the fabric configuration from the cross-sectional configuration of the printed board, it is preferable to take into account the influence of manufacturing errors. As a method of taking into account the influence of manufacturing errors, for example, after the interval is measured, a distance corresponding to the period of the thickness of the fabric configuration based on the measurement result and the influence of manufacturing errors is determined, and the distance is compared with the pitch of the lines. Specifically, first, in the member corresponding to the insulator 102, the interval between the adjoining upper and lower portions is measured. Next, based on the result of the measured interval and the predicted influence of manufacturing errors, a first distance is determined. Next, the first distance is compared with the pitch of the differential lines, and thus it is determined whether the pitch of the differential lines is one or more integral multiples of the period of the thickness of the fabric configuration.

[0105] Methods of determining the first distance will be described.

[0106] For example, the interval between the adjoining upper and lower portions can be measured at two sites, and based on the measurement result at the first site and the measurement result at the second site, the first distance can be determined. For example, the first distance can be the distance between the measurement result at the first site and the measurement result at the second site, or the average of the measurement result at the first site and the measurement result at the second site. In addition, the first site and the second site can be sites that are apart from each other by a distance corresponding to the period of the thickness of the fabric configuration. Figure 4 The first site can be acquired from the cross section corresponding to the first site, or the second site can be acquired from the cross section corresponding to the second site. Figure 4 The first site can be acquired from the cross section corresponding to the first site, or the second site can be acquired from the cross section corresponding to the second site. Figure 4 The second site can be acquired from the cross section parallel to the cross section corresponding to the first site in the paper depth direction of the site located at Figure 4 The second site can be acquired from the cross section parallel to the cross section corresponding to the first site in the paper depth direction of the site located at

[0107] In addition, for example, the interval can be measured at a plurality of sites, and the average and the standard deviation can be calculated from the plurality of measurement results, and thus the first distance can be determined based on the average and the standard deviation. For example, the interval can be measured at 100 sites, and the average AVR and the standard deviation σ can be calculated from the measurement results at the 100 sites, and the range represented by AVR ± 2 x σ can be set as the first distance.

[0108] In addition, when the pitch of the wiring is measured, a manufacturing error can be taken into account. For example, in a case where the width (width corresponding to the width W2 in FIG. 6) of the conductor that functions as the wiring is different between the upper side and the lower side of the conductor, the width central part of the wider width can be regarded as the central part of the conductor, for example. Figure 5

[0109] In the embodiment, the conductors 14a and 14b that function as the wiring that transmits a differential signal are sandwiched between the ground layers. The wiring that is sandwiched between the ground layers is referred to as a strip line, for example. The plurality of wirings that transmit a signal are not limited to the strip line. The plurality of wirings that transmit a signal can be sandwiched between a layer of a conductor to which a power supply voltage is applied, that is, a power supply layer, or can be sandwiched between the power supply layer and the ground layer, for example. Here, the power supply voltage is a power supply potential in the electronic device 1. In addition, the plurality of wirings that transmit a signal can be sandwiched between layers of conductors to which different voltages are applied.

[0110] Figure 13 is a cross-sectional view of a portion of a printed substrate of a first modification of the embodiment. As shown in Figure 13 , the printed substrate 10a of the first modification has a configuration in which a group of differential wirings that transmit a differential signal is replaced with a group of conductors 19a and 19b, with respect to the printed substrate 10 of the embodiment. Figure 13 A region including the conductors 17, 19a, and 19b, and the insulators 18 and 20 in the printed substrate 10a is extracted and is shown. The conductors 19a and 19b are provided on the upper side of the insulator 18 in contact with the insulator 18. The conductors 19a and 19b are each provided so as to extend in the X direction. The conductors 19a and 19b are provided so as to be arranged in the Y direction. The pitch of the conductors 19a and 19b in the Y direction is a pitch "P1". The pitch "P1" is an integer number of one or more times the period "P2" of the fabric structure 100 included in the insulator 18. The insulator 20 is provided on the upper side of each of the conductors 19a and 19b so as to cover the conductors 19a and 19b. The insulator 20 is further provided on the upper side of the insulator 18 so as to cover a region in which the conductors 19a and 19b are not provided. The conductor 17 is a ground layer. A wiring that is adjacent to the ground layer on one side via an insulator and is adjacent to the outside of the printed substrate on the other side is also referred to as a microstrip line. The plurality of wirings that transmit a signal can also be the wiring referred to as a microstrip line as shown in Figure 13 . In addition, in the printed substrate 10a of the first modification, the insulator 20 can be omitted.

[0111] ​In the embodiment, a case where the belly positions of the fabric structures 100 included in the insulators 11 are aligned in the Y direction with the belly positions of the fabric structures 100 included in the insulators 16 is described as an example. The belly positions of the fabric structures 100 included in the insulators 11, 16, and 18 can not be aligned in the Y direction.

[0112] In the embodiment, a case where the insulators 11, 16, and 18 each include one piece of the fabric structure 100 is described as an example. The number of pieces of the fabric structure 100 included in each insulator is not limited to one. For example, the insulators 11, 16, and 18 can each have a configuration in which a plurality of pieces of the fabric structure 100 are stacked in the Z direction.

[0113] In the embodiment, a case where the transmission device 2 and the reception device 3 are provided on the printed substrate 10 is described as an example. The transmission device 2 or the reception device 3 can not be provided on the printed substrate 10.

[0114] Figure 14 is a plan view showing an example of a configuration of an electronic machine according to a second modification of the embodiment. As shown in Figure 14 the second modification of the electronic machine 1a includes the transmission device 2, the reception device 3, the printed substrates 10-1 and 10-2, and the socket SK. The printed substrate 10-1 includes the conductors 14a-1 and 14b-1. The printed substrate 10-2 includes the connector section CC and the conductors 14a-2 and 14b-2.

[0115] The transmission device 2 and the socket SK are provided on the printed substrate 10-1. The transmission device 2 and the socket SK are electrically connected via the conductors 14a-1 and 14b-1. The group of the conductors 14a-1 and 14b-1 functions as a wiring that transmits a differential signal. The conductors 14a-1 and 14b-1 are respectively provided so as to extend in the X direction and to be arranged in the Y direction. The pitch of the conductors 14a-1 and 14b-1 in the Y direction is one or more integral multiples of the period of the thickness of the fabric structure included in the insulator that is adjacent to the conductors 14a-1 and 14b-1 in the Z direction.

[0116] The reception device 3 is provided on the printed substrate 10-2. The connector section CC is configured to be electrically connectable to the socket SK. The reception device 3 and the connector section CC are electrically connected via the conductors 14a-2 and 14b-2. The group of the conductors 14a-2 and 14b-2 functions as a wiring that transmits a differential signal. Figure 14The state in which the connector portion CC is embedded in the socket SK is shown. In this state, the conductors 14a-2 and 14b-2 are respectively provided extending in the X direction and arranged in the Y direction. The pitch of the conductors 14a-2 and 14b-2 in the Y direction is 1 or more integer times the period of the thickness of the fabric structure included in the insulator abutting the conductors 14a-2 and 14b-2 in the Z direction.

[0117] The transmission device 2 and the reception device 3 are electrically connected via the conductors 14a-1 and 14b-1, the socket SK, the connector portion CC, and the conductors 14a-2 and 14b-2.

[0118] In this way, for the wiring connected from the IC chip to the socket, or the wiring connected from the connector to the IC chip, the same effect as the embodiment is obtained by setting the pitch of the differential wiring to 1 or more integer times the period of the thickness of the fabric structure in the insulator.

[0119] In the embodiment, the case in which the group of the conductors 14a and 14b transmits a differential signal is exemplified. The signal transmitted by the group of the plurality of wirings is not limited to a differential signal, but is a plurality of signals transmitted by the group of the plurality of wirings, such as 3-phase signals, 5-phase signals, and the like. The plurality of wirings is not limited to 2 wirings corresponding to a differential signal, but is a plurality of wirings, such as 3 wirings corresponding to 3-phase signals, 5 wirings corresponding to 5-phase signals, and the like.

[0120] Figure 15 is a cross-sectional view showing a part of a printed substrate of a third modification example of the embodiment. As shown in Figure 15 The printed substrate 10b of the third modification example has a group of the plurality of wirings transmitting a signal further including the conductors 14c to 14e, with respect to the printed substrate 10 of the embodiment. Figure 15A region in the printed substrate 10b containing the conductors 12, 14a to 14e, and 17, and the insulators 11, 15, and 16 is extracted and indicated. The conductors 14a to 14e are a group of multi-phase signal lines that transmit a 5-phase signal from the transmitting device 2 to the receiving device 3. Each of the conductors 14c to 14e is provided on the upper side of the insulator 11 in contact with the insulator 11, like each of the conductors 14a and 14b. Each of the conductors 14c to 14e is provided extending in the X direction, like each of the conductors 14a and 14b. The conductors 14a to 14e are provided in alignment in the Y direction. The pitch in the Y direction between two conductors 14 adjacent in the Y direction among the conductors 14a to 14e is a pitch "P1". The pitch "P1" is one or more integral multiples of a period "P2" of the fabric structure 100 contained in the insulator 11. The other configurations of the printed substrate 10b are the same as those of the printed substrate 10. In this way, the printed substrate of the third modified example of the embodiment, like the printed substrate of the embodiment, can suppress the characteristics of the respective plurality of lines from differing, by providing a plurality of conductors that transmit multi-phase signals in alignment at the pitch "P1".

[0121] In the embodiment, a case where the transmitting device 2 and the receiving device 3 are provided on the upper surface of the printed substrate 10 is described as an example. A case where components are provided on only one surface of a printed substrate like this is referred to as, for example, single-sided mounting. The method of providing components on a printed substrate is not limited to single-sided mounting. For example, double-sided mounting can be performed, in which components are provided on both the upper surface and the lower surface of the printed substrate.

[0122] The embodiments of the present application have been described, but these embodiments are presented as examples, and are not intended to limit the scope of the application. These novel embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the scope of the application. These embodiments or variations thereof are included in the scope or spirit of the application, and are included in the scope of the application and equivalents thereof recited in the claims.

[0123] [Explanation of Symbols]

[0124] 1, 1a Electronic device

[0125] 2 Transmitting device

[0126] 3 Receiving device

[0127] 10, 10-1, 10-2, 10a, 10b Printed substrate

[0128] 11 Insulator

[0129] 12 Conductor

[0130] 13 Insulator

[0131] 14a, 14a-1, 14a-2, 14b, 14b-1, 14b-2, 14c, 14d, 14e electric conductor

[0132] 15 insulator

[0133] 16 insulator

[0134] 17 electric conductor

[0135] 18 insulator

[0136] 19, 19a, 19b electric conductor

[0137] 20 insulator

[0138] 100, 100a, 100b textile construction

[0139] 101, 101-1, 101-2, 101-3, 101-4, 101-5, 101-6, 101-7, 101even, 101odd insulator

[0140] 102, 102-1, 102-2, 102-3, 102-4, 102-5, 102-6, 102-7, 102even, 102odd insulator

[0141] 110, 110a insulator

[0142] CC connector portion

[0143] SK socket

Claims

1. A printed substrate, comprising: The first insulator and the second insulator extend in the first direction and are disposed adjacent to each other in the second direction that intersects the first direction; A third insulator, extending in the second direction, includes a first portion and a second portion, the first portion intersecting the first insulator and located above the first insulator in a third direction intersecting the first and second directions, and the second portion intersecting the second insulator and located below the second insulator in the third direction. A fourth insulator, adjacent to the third insulator in the first direction and extending in the second direction, comprises a third portion and a fourth portion, the third portion intersecting the first insulator and located below the first insulator, and the fourth portion intersecting the second insulator and located above the second insulator; The first conductor and the second conductor extend in the first direction and are arranged at a first interval in the second direction; as well as The third conductor is extended in a plane extending in the first and second directions; and The first conductor and the second conductor are disposed above the first to fourth insulators; The third conductor is disposed below the first conductor and the second conductor, and below the first to fourth insulators; The first spacing is n times the first distance (n is an integer greater than or equal to 1) based on the interval between the first part and the second part or the interval between the third part and the fourth part; The printed substrate further includes a 13th insulator that fills the gaps between the first to fourth insulators and covers the first to fourth insulators; as well as The 14th insulator is connected to the 13th insulator on its upper side and is disposed extending in the plane; and The first conductor and the second conductor are respectively grounded to the third insulator; A portion of the 14th insulator is disposed between the 1st conductor and the 2nd conductor, thereby insulating the 1st conductor from the 2nd conductor.

2. The printed substrate according to claim 1, further comprising a fifth insulator and a sixth insulator, the fifth insulator and the sixth insulator extending in the first direction and disposed adjacent to the first insulator or the second insulator in the second direction. The third insulator further includes a fifth portion and a sixth portion, the fifth portion intersecting the fifth insulator and being located above the fifth insulator, and the sixth portion intersecting the sixth insulator and being located below the sixth insulator. The fourth insulator further includes a seventh portion and an eighth portion, the seventh portion intersecting the fifth insulator and located below it, and the eighth portion intersecting the sixth insulator and located above it. The first distance is then based on the interval between the fifth part and the sixth part or the interval between the seventh part and the eighth part.

3. The printed substrate according to claim 2, wherein The first distance is the length between the interval between the first part and the second part and the interval between the fifth part and the sixth part, or the interval between the seventh part and the eighth part.

4. The printed substrate according to claim 1 or 2, further comprising: A seventh insulator, extending in the second direction, includes a ninth portion and a tenth portion, the ninth portion intersecting the first insulator and located above it, and the tenth portion intersecting the second insulator and located below it relative to the second insulator; and An eighth insulator, adjacent to the seventh insulator in the first direction and extending in the second direction, comprises an eleventh portion and a twelfth portion. The eleventh portion intersects the first insulator and is located below it, while the twelfth portion intersects the second insulator and is located above it. The first distance is then based on the interval between the 9th and 10th portions or the interval between the 11th and 12th portions.

5. The printed substrate according to claim 1, further comprising: a 9th insulator and a 10th insulator, each extending in the first direction and disposed adjacent to each other in the second direction; An 11th insulator, extending in the second direction, includes a 13th portion and a 14th portion, the 13th portion intersecting the 9th insulator and located above the 9th insulator, and the 14th portion intersecting the 10th insulator and located below the 10th insulator; A 12th insulator, adjacent to the 11th insulator in the first direction and extending in the second direction, comprises a 15th portion and a 16th portion, the 15th portion intersecting the 9th insulator and located below it, and the 16th portion intersecting the 10th insulator and located above it; and The fourth conductor is extended in the plane of the first direction and the second direction; The interval between the 13th and the 14th portions, or the interval between the 15th and the 16th portions, is equal to the interval between the 1st and the 2nd portions, or the interval between the 3rd and the 4th portions, and The 9th to 12th insulators are disposed above the 1st and 2nd conductors, and the 4th conductor is disposed above the 9th to 12th insulators.

6. The printed substrate according to claim 1, wherein The relative permittivity of each of the first to fourth insulators is different from that of the thirteenth insulator.

7. The printed substrate according to claim 1, wherein The first to fourth insulators each contain glass fibers.

8. The printed substrate according to claim 1, wherein The group of the first conductor and the second conductor is a group of differential wiring for transmitting differential signals.

9. The printed substrate according to claim 1, further comprising a fifth conductor, the fifth conductor extending in the first direction and arranged in the second direction at the first spacing with respect to the first conductor or the second conductor, and The first conductor, the second conductor, and the fifth conductor are wiring for transmitting multiphase signals.

10. An electronic machine comprising: a printed substrate according to claim 1, and The first device and the second device are disposed on the printed substrate, and The first device and the second device communicate using differential signals via the first conductor and the second conductor.

11. An electronic machine comprising: a printed substrate according to claim 1, and The first device disposed on the printed substrate, and The first device communicates with an external device on the printed substrate using differential signals via the first conductor and the second conductor.

Images