Substrate processing apparatus and liquid replacement method

Abstract

This invention provides a substrate processing apparatus and a liquid replacement method that can shorten the time required to replace the processing solution. One aspect of the substrate processing apparatus includes: a processing tank for liquid treatment of a substrate using a processing solution comprising a pharmaceutical solution and a replacement solution in a first mixing ratio; a circulation path for returning the processing solution taken from the processing tank to the processing tank; a liquid supply unit for separately supplying the pharmaceutical solution and the replacement solution to at least one of the processing tank and the circulation path; and a control device configured to control the liquid supply unit after cleaning the processing tank and the circulation path with the replacement solution, such that the pharmaceutical solution and the replacement solution are supplied at a second mixing ratio where the ratio of the replacement solution to the pharmaceutical solution is lower than the first mixing ratio.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a liquid replacement method. Background Technology

[0002] An immersion cleaning device is known that calculates the total input of each liquid based on the supply flow rate and supply time of the liquid supplied to the liquid treatment tank, and calculates the liquid concentration by determining the mixing ratio based on the calculated total input of each liquid (for example, see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-306089 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This invention provides a technique that can shorten the time required to replace the treatment fluid.

[0008] Technical solutions for solving technical problems

[0009] One aspect of the substrate processing apparatus of the present invention includes: a processing tank for liquid treatment of a substrate using a processing liquid comprising a pharmaceutical solution and a replacement solution in a first mixing ratio; a circulation path for returning the processing liquid taken from the processing tank to the processing tank; a liquid supply unit for separately supplying the pharmaceutical solution and the replacement solution to at least one of the processing tank and the circulation path; and a control device configured to control the liquid supply unit after the processing tank and the circulation path have been cleaned with the replacement solution, such that the pharmaceutical solution and the replacement solution are supplied at a second mixing ratio in which the ratio of the replacement solution to the pharmaceutical solution is lower than the first mixing ratio.

[0010] Invention Effects

[0011] According to the present invention, the time required for replacing the treatment fluid can be shortened. Attached Figure Description

[0012] Figure 1 This is a cross-sectional view showing an example of a substrate processing apparatus according to an embodiment.

[0013] Figure 2 yes Figure 1 Another cross-sectional view of the substrate processing device.

[0014] Figure 3 This is a diagram illustrating an example of the functional structure of a control device.

[0015] Figure 4 This is a diagram illustrating an example of how the adjustment parameters are calculated.

[0016] Figure 5 This is a flowchart illustrating an example of a liquid replacement process.

[0017] Figure 6 This is another example of a diagram illustrating the functional structure of a control device.

[0018] Figure 7 This is another example of how the adjustment parameters are calculated.

[0019] Figure 8 This is a flowchart illustrating another example of a liquid replacement process.

[0020] Figure 9 This is another example of a diagram illustrating the functional structure of a control device.

[0021] Figure 10 This is another example of how the adjustment parameters are calculated.

[0022] Figure 11 This is a flowchart illustrating yet another example of a liquid replacement process.

[0023] Figure 12 This is a graph showing the results obtained by measuring the temperature and H2O2 concentration of the treatment solution.

[0024] Explanation of reference numerals in the attached figures

[0025] 1. Substrate processing device

[0026] 2 Processing Module

[0027] 210 processing tank

[0028] 220 Liquid Supply Department

[0029] 241 Circulating Flow Path

[0030] 9. Control device

[0031] W substrate. Detailed Implementation

[0032] Hereinafter, non-limiting, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. Throughout the drawings, identical or corresponding parts or components are labeled with the same or corresponding reference numerals, and repeated descriptions are omitted.

[0033] [Concentration of the treatment solution during solution replacement]

[0034] Multiple substrates are immersed together in a processing tank containing a processing solution comprising a chemical solution and deionized water (DIW) in a first mixing ratio. This processing solution is used to liquid treat the multiple substrates in a batch substrate processing apparatus. The processing solution within the processing tank is circulated via a circulation path connected to the processing tank. In this substrate processing apparatus, the processing solution stored in the processing tank is periodically replaced (hereinafter referred to as "liquid replacement processing"). Liquid replacement processing includes a first liquid replacement processing and a second liquid replacement processing. After liquid replacement processing, the substrates are immersed in the processing solution stored in the processing tank.

[0035] The first liquid replacement process is the process of replacing the old (currently used) treatment solution stored in the treatment tank with a new treatment solution of the same specifications (type, concentration, etc.). The first liquid replacement process is performed, for example, during normal operation. In the first liquid replacement process, firstly, the old treatment solution stored in the treatment tank is drained, then a new treatment solution of the same specifications is supplied to the treatment tank, and then the concentration and temperature of the new treatment solution supplied to the treatment tank are adjusted to the set concentration and set temperature. During the first liquid replacement process, liquid containing the treatment solution components remains as residual liquid in the treatment tank and circulation path before the new treatment solution is supplied. Therefore, the concentration of the treatment solution in the treatment tank hardly decreases immediately after the new treatment solution is supplied. As a result, the concentration of the treatment solution reaches the set concentration within a short time.

[0036] The second liquid replacement process involves draining the old treatment liquid stored in the treatment tank and performing DIW cleaning, thereby replacing the DIW stored in the treatment tank with new treatment liquid. DIW cleaning will be explained later. The second liquid replacement process is performed, for example, during periodic maintenance after the first liquid replacement process has been performed a set number of times. In the second liquid replacement process, firstly, the DIW is drained from the treatment tank. Then, new treatment liquid of the same specifications as the old treatment liquid is supplied to the treatment tank. The concentration and temperature of the new treatment liquid supplied to the treatment tank are then adjusted to the set concentration and temperature. During the second liquid replacement process, before the new treatment liquid is supplied to the treatment tank, a liquid (DIW) containing almost no chemical components remains as residual liquid in the treatment tank and circulation path. Therefore, when the new treatment liquid is supplied to the treatment tank at the same concentration as the old treatment liquid, regardless of the amount of residual liquid, the concentration of the treatment liquid in the treatment tank is diluted immediately after the new treatment liquid is supplied, resulting in a decrease in the concentration of the treatment liquid in the treatment tank. As a result, the time from the supply of new treatment solution to the treatment tank until the concentration of the treatment solution reaches the set concentration becomes longer. In particular, when the capacity of the treatment tank and the circulation path increases, the amount of residual liquid remaining in the treatment tank and the circulation path increases, thus making it even longer for the concentration of the treatment solution to reach the set concentration.

[0037] As an example, the results were obtained by measuring the temperature of the treatment liquid and the H2O2 concentration of the treatment liquid in the treatment tank during the second liquid replacement treatment in the treatment tank where SC1 (NH4OH / H2O2 / H2O) was stored as the treatment liquid.

[0038] Figure 12 This is a graph showing the results obtained by measuring the temperature and H2O2 concentration of the treatment solution when NH4OH, H2O2 and H2O are supplied in the first mixing ratio during the second liquid replacement treatment. Figure 12 In the diagram, the horizontal axis represents time, the first (left) vertical axis represents the temperature of the treatment solution in the treatment tank, and the second (right) vertical axis represents the H2O2 concentration of the treatment solution in the treatment tank.

[0039] exist Figure 12 In this diagram, time t1 represents the moment when DIW begins to be discharged from the treatment tank. Time t2 represents the moment when new treatment solutions (NH4OH, H2O2, and H2O) begin to be supplied to the treatment tank. Time t3 represents the moment when, after the initial supply of new treatment solutions to the treatment tank, the circulation temperature adjustment process begins, adjusting the concentration and temperature of the new treatment solutions supplied to the treatment tank to the set concentration and temperature. Time t4 represents the moment when the temperature of the treatment solutions in the treatment tank reaches the set temperature. Time t5 represents the moment when the concentration of the treatment solutions in the treatment tank reaches the set concentration. DIW cleaning is completed before time t1.

[0040] like Figure 12 As shown, at the time point when DIW began to be discharged from the treatment tank (time t1), the H2O2 concentration was approximately zero. This is believed to be because DIW cleaning was performed before time t1, and the SC1 in the treatment tank was replaced with DIW.

[0041] Next, during the period from the point when DIW began to be discharged from the treatment tank (time t1) to the point when new treatment liquid began to be supplied into the treatment tank (time t2), the H2O2 concentration was approximately zero and hardly changed. This is believed to be because, although DIW was discharged from the treatment tank, it remained as residual liquid in the treatment tank and the circulation path.

[0042] Next, at the point in time (t3) immediately after the new treatment solution was supplied to the treatment tank, the H2O2 concentration increased, but was lower than the set concentration. This is believed to be because the liquid (DIW) containing almost no chemical components (NH4OH and H2O2) remained as residual liquid in the treatment tank and circulation path.

[0043] Next, at the time point (time t4) when the temperature of the treatment liquid in the treatment tank reached the set temperature, the H2O2 concentration did not reach the set temperature. At the time point (time t5) after a certain period of time from time t4, the H2O2 concentration reached the set temperature. This is believed to be because the H2O2 concentration deviated significantly from the set concentration at the time point (time t3) immediately after the new treatment liquid was supplied to the treatment tank.

[0044] Thus, in the second liquid replacement process, the time from the supply of new processing liquid to the processing tank until the H2O2 concentration of the processing liquid reaches the set concentration is longer than the time from the supply of new processing liquid to the processing liquid until the temperature of the processing liquid reaches the set temperature. Furthermore, the same applies to the NH4OH concentration of the processing liquid. As a result, the time required for the liquid replacement process increases, and the productivity of the substrate processing apparatus decreases.

[0045] Therefore, after intensive research, the inventors of this invention discovered that by supplying the drug solution and replacement solution to the treatment tank at a flow rate ratio determined based on the residual amount of replacement solution in the treatment tank and the circulation path, the time required for replacing the treatment solution can be shortened. A detailed description follows.

[0046] [Substrate Processing Device]

[0047] Reference Figure 1 and Figure 2 An example of the substrate processing apparatus 1 according to the embodiment will be described. The substrate processing apparatus 1 includes a processing module 2, a control device 9, etc.

[0048] Processing module 2 is a batch processing module that processes multiple (e.g., 25 to 100) substrates W simultaneously. The substrate W is, for example, a circular semiconductor wafer with a diameter of 300 mm. Processing module 2 includes a processing tank 210, a liquid supply unit 220, a liquid discharge unit 230, a liquid circulation unit 240, a holder 250, and a lifting mechanism 260.

[0049] The processing tank 210 stores a processing solution for liquid treatment of the substrate W. Liquid treatment includes, for example, a removal process that removes a portion of the substrate W. The processing solution is, for example, SC1. The processing tank 210 includes an inner tank 211, an outer tank 212, etc.

[0050] The inner tank 211 is a box-shaped tank that is open at the top. Multiple substrates W are immersed in the processing liquid stored in the inner tank 211 while being held by the holding device 250.

[0051] The outer tank 212 recovers the processing liquid overflowing from the inner tank 211. A liquid level sensor S1 and a temperature sensor S2 are installed in the outer tank 212. The liquid level sensor S1 is positioned at a pre-set height. The liquid level sensor S1 detects the liquid level in the outer tank 212 and sends the detected value to the control device 9. The temperature sensor S2 detects the temperature of the processing liquid in the outer tank 212 and sends the detected value to the control device 9. The temperature sensor S2 can also be installed in the inner tank 211, the circulation path 241, or a temperature regulator 244, etc. The circulation path 241 and the temperature regulator 244 will be explained later.

[0052] The liquid supply unit 220 supplies treatment liquid to the treatment tank 210. The liquid supply unit 220 includes an NH4OH supply unit 221, an H2O2 supply unit 222, and a DIW supply unit 223, etc.

[0053] The NH4OH supply unit 221 includes an NH4OH supply source 221a, an NH4OH supply flow path 221b, an on / off valve 221c, and a flow controller 221d. The NH4OH supply flow path 221b connects the NH4OH supply source 221a and the processing tank 210, supplying NH4OH from the NH4OH supply source 221a into the processing tank 210. The on / off valve 221c is inserted into the NH4OH supply flow path 221b and is used to open and close the NH4OH supply flow path 221b. The flow controller 221d is inserted into the NH4OH supply flow path 221b and controls the flow rate of NH4OH flowing in the NH4OH supply flow path 221b. The flow controller 221d is, for example, a liquid flow controller (LFC). The aforementioned NH4OH supply unit 221 controls the opening and closing of the valve 221c and the flow controller 221d based on instructions from the control device 9, supplying a specified flow rate of NH4OH to the inner tank 211 and the outer tank 212. Here, NH4OH is an example of a pharmaceutical solution, and the NH4OH supply unit 221 is an example of a pharmaceutical solution supply unit.

[0054] The H2O2 supply unit 222 includes an H2O2 supply source 222a, an H2O2 supply flow path 222b, an on / off valve 222c, and a flow controller 222d. The H2O2 supply flow path 222b connects the H2O2 supply source 222a and the processing tank 210, supplying H2O2 from the H2O2 supply source 222a into the processing tank 210. The on / off valve 222c is inserted into the H2O2 supply flow path 222b to open and close the H2O2 supply flow path 222b. The flow controller 222d is inserted into the H2O2 supply flow path 222b to control the flow rate of H2O2 flowing in the H2O2 supply flow path 222b. The flow controller 222d is, for example, an LFC (Liquid Gas Flow Controller). The H2O2 supply unit 222 controls the opening and closing of the valve 222c and the flow controller 222d based on instructions from the control device 9, supplying a specified flow rate of H2O2 to the inner tank 211 and the outer tank 212. Here, H2O2 is an example of a medicinal liquid, and the H2O2 supply unit 222 is an example of a medicinal liquid supply unit.

[0055] The DIW supply unit 223 includes a DIW supply source 223a, a DIW supply flow path 223b, an on / off valve 223c, and a flow controller 223d. The DIW supply flow path 223b connects the DIW supply source 223a and the processing tank 210, supplying DIW from the DIW supply source 223a into the processing tank 210. The on / off valve 223c is inserted into the DIW supply flow path 223b to open and close the DIW supply flow path 223b. The flow controller 223d is inserted into the DIW supply flow path 223b to control the flow rate of DIW flowing in the DIW supply flow path 223b. The flow controller 223d is, for example, an LFC (Liquid Flow Controller). Based on commands from the control device 9, the DIW supply unit 223 controls the on / off valve 223c and the flow controller 223d to supply a predetermined flow rate of DIW to the inner tank 211 and the outer tank 212. DIW is an example of a replacement fluid, and DIW supply unit 223 is an example of a replacement fluid supply unit. Furthermore, replacement fluid is also referred to as tank cleaning fluid, rinsing fluid, or conditioning fluid.

[0056] The liquid discharge section 230 discharges the processing liquid stored in the processing tank 210 to the outside. The liquid discharge section 230 includes a discharge container 231, a processing tank discharge flow path 232, an on / off valve 233, a circulation section discharge flow path 234, an on / off valve 235, etc.

[0057] The drain container 231 temporarily stores the treatment liquid discharged from the treatment tank 210 and the circulation path 241, and then discharges the stored treatment liquid to the outside. A drain volume sensor S3 is installed in the drain container 231. The drain volume sensor S3 detects the amount of treatment liquid discharged from the treatment tank 210 and the circulation path 241 and sends the detected value to the control device 9. For example, the drain volume sensor S3 detects the residual liquid volume in the drain container 231 before and after draining, and uses the difference between the two as the drain volume. The drain container 231 is connected to a concentration sensor S4 via an on / off valve 236. When the on / off valve 236 is opened, the treatment liquid flows from the drain container 231 into the concentration sensor S4. The concentration sensor S4 detects the concentration of the treatment liquid flowing into the drain container 231 and sends the detected value to the control device 9. In this way, the concentration sensor S4 functions as a discharge concentration sensor to detect the concentration of the treatment liquid in the discharge container 231.

[0058] The treatment tank drainage path 232 connects the bottom wall of the inner tank 211 and the drainage container 231. The treatment tank drainage path 232 discharges the treatment liquid from the bottom of the inner tank 211 into the drainage container 231.

[0059] The on / off valve 233 is inserted into the drainage flow path 232 of the treatment tank to open and close the drainage flow path 232. When the on / off valve 233 is opened, the treatment liquid is discharged from the inner tank 211 into the drainage container 231.

[0060] The circulation section drainage path 234 connects the circulation path 241 (described later) and the drainage container 231. The circulation section drainage path 234 discharges the treatment liquid from the circulation path 241 into the drainage container 231.

[0061] An on / off valve 235 is inserted into the drainage flow path 234 of the circulation section to open and close the drainage flow path 234. When the on / off valve 235 is opened, the treatment liquid is discharged from the circulation flow path 241 into the drainage container 231.

[0062] The liquid circulation unit 240 circulates the processing liquid in the processing tank 210. The liquid circulation unit 240 includes a circulation flow path 241, a filter 242, a circulation pump 243, a temperature regulator 244, and a horizontal pipe 245, etc.

[0063] The circulation path 241 draws the treatment solution from the outer tank 212 and transports it to the inner tank 211. Along the circulation path 241, starting from the outer tank 212 side, a filter 242, a circulation pump 243, a temperature regulator 244, and a leveling pipe 245 are sequentially installed. However, the order of the filter 242, circulation pump 243, and temperature regulator 244 is not limited to the illustrated example and can be appropriately replaced. Furthermore, the circulation path 241 is connected to a concentration sensor S4 via an on / off valve 246. When the on / off valve 246 is opened, the treatment solution flows from the outer tank 212 into the concentration sensor S4 through the circulation path 241. The concentration sensor S4 detects the concentration of the treatment solution flowing into the circulation path 241 and sends the detected value to the control device 9. Thus, the concentration sensor S4 functions as a treatment solution concentration sensor for detecting the concentration of the treatment solution within the treatment tank 210.

[0064] Filter 242 collects particles contained in the treatment fluid. Circulation pump 243 pressurizes and delivers the treatment fluid. Temperature regulator 244, such as a heater, regulates the temperature of the treatment fluid.

[0065] Horizontal pipes 245 supply the treatment fluid into the inner tank 211. Multiple horizontal pipes 245 extend in the Y-axis direction and are spaced apart in the X-axis direction. Each horizontal pipe 245 has multiple release ports 245a spaced apart along its length. Each release port 245a releases the treatment fluid directly upwards. This creates a curtain-like upward flow within the inner tank 211. Furthermore, the horizontal pipes 245 can be configured to allow independent control of the flow rate of each release port 245a. Additionally, the horizontal pipes 245 can also release a mixture of liquid and gas. N2 gas or similar gases can be used as the gas.

[0066] A holder 250 holds multiple substrates W. The holder 250 includes multiple arms 251 parallel to each other. Each arm 251, as shown... Figure 2 As shown, multiple substrates W are arranged parallel to the horizontal tube 245 (i.e., along the Y-axis direction) to hold each substrate W vertically.

[0067] The lifting mechanism 260 causes the holder 250 to move up and down. For example, the lifting mechanism 260 causes the holder 250 to move up and down between a position where the substrate W is immersed in the processing liquid and a position where the substrate W is fed in and out.

[0068] The control device 9 is, for example, a computer, including a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs for controlling various processes executed in the substrate processing apparatus 1. The control device 9 controls the operation of the substrate processing apparatus 1 by causing the CPU 91 to execute the programs stored in the storage medium 92.

[0069] [Control Device]

[0070] Reference Figure 3 and Figure 4 An example of the functional structure of the control device 9 in the substrate processing apparatus 1 will be described. Figure 3 The functional blocks shown are conceptual and do not necessarily need to be physically arranged as depicted. All or part of each functional block can be functionally or physically distributed / centralized in any unit. All or any part of the processing functions performed within each functional block can be implemented by a program executed by the CPU or as hardware based on wired logic. (Further details will follow later.) Figure 6 and Figure 9 The same applies to China.

[0071] The control device 9 includes a residual liquid volume calculation unit 901, a parameter generation unit 902, an action control unit 903, and a storage unit 904.

[0072] The residual liquid calculation unit 901 calculates the residual liquid volume in the processing tank 210 and the circulation path 241 based on the total capacity of the processing tank 210 stored in the storage unit 904 and the discharge volume of the processing liquid detected by the discharge volume sensor S3. The total capacity of the processing tank 210 is, for example, the amount of processing liquid stored in the processing tank 210 during liquid processing of the substrate W. The total capacity of the processing tank 210 is, for example, pre-input by a user or the like and stored in the storage unit 904.

[0073] For example, such as Figure 4 As shown in (a), when the total capacity is 100L and the discharge volume is 90L, the residual liquid calculation unit 901 calculates the residual liquid volume (10L) in the treatment tank 210 and the circulation path 241 by subtracting the discharge volume (90L) from the total capacity (100L). In this way, the residual liquid calculation unit 901 calculates the residual liquid volume based on the detection value of the discharge volume sensor S3, thus enabling the calculation of the accurate residual liquid volume for each liquid replacement process.

[0074] The parameter generation unit 902 generates adjustment parameters based on the general parameters stored in the storage unit 904 and the residual liquid volume calculated by the residual liquid volume calculation unit 901. The general parameters determine the mixing ratio (hereinafter referred to as the "first mixing ratio") of NH4OH, H2O2, and DIW in the treatment liquid stored in the treatment tank 210 during liquid treatment of the substrate W. The first mixing ratio is, for example, a volume ratio. However, the first mixing ratio can also be a mass ratio. The general parameters are used, for example, in the case of performing a first liquid replacement treatment. The adjustment parameters determine a second mixing ratio where the ratio of replacement liquid (DIW) to the chemical solution (NH4OH and H2O2) is lower than the first mixing ratio. Regarding the second mixing ratio, the higher the residual liquid volume calculated by the residual liquid volume calculation unit 901, the lower the ratio of replacement liquid to the chemical solution. The adjustment parameters are used, for example, in the case of performing a second liquid replacement treatment. Alternatively, the parameter generation unit 902 may generate adjustment parameters using, in addition to the general parameters and the residual liquid volume, the chemical solution concentration of the treatment liquid in the drain container 231 detected by the concentration sensor S4.

[0075] For example, such as Figure 4 As shown in (b), when the volume of DIW, determined by normal parameters, is 80L, the parameter generation unit 902 calculates the adjusted DIW volume (70L) by subtracting the residual liquid volume (10L) from the DIW volume (80L). Furthermore, the parameter generation unit 902 calculates the flow ratio of NH4OH, H2O2, and DIW based on the volumes of NH4OH (4L) and H2O2 (16L), determined by normal parameters, and the calculated adjusted DIW volume (70L). Thus, as... Figure 4 As shown in (c), an adjustment parameter can be generated that determines the flow ratio of NH4OH, H2O2 and DIW (NH4OH:H2O2:DIW = 1:4:17.5).

[0076] The motion control unit 903 controls the liquid supply unit 220 based on the normal parameters stored in the storage unit 904 or the adjustment parameters calculated by the parameter generation unit 902, so as to supply NH4OH, H2O2 and DIW into the treatment tank 210.

[0077] For example, the motion control unit 903 controls the fluid supply unit 220 to simultaneously supply NH4OH, H2O2, and DIW to the treatment tank 210 at a flow rate determined by parameters (normal parameters or adjustment parameters) selected by the user. Alternatively, NH4OH, H2O2, and DIW may not be supplied simultaneously.

[0078] For example, when performing the first liquid replacement process, the motion control unit 903 controls the liquid supply unit 220 to supply NH4OH, H2O2, and DIW to the treatment tank 210 at a flow rate determined by the normal parameters stored by the storage unit 904. During the first liquid replacement process, before new treatment liquid is supplied to the treatment tank 210, liquid containing the drug components (NH4OH and H2O2) remains as residual liquid in the treatment tank 210 and the circulation path 241. Therefore, immediately after new treatment liquid is supplied to the treatment tank 210 at the flow rate determined by the normal parameters, the concentration of the drug in the treatment liquid in the treatment tank 210 hardly decreases. As a result, the concentration of the drug in the treatment liquid reaches the set concentration within a short time.

[0079] For example, in the case of performing the second liquid replacement process, the motion control unit 903 controls the liquid supply unit 220 to supply NH4OH, H2O2, and DIW to the treatment tank 210 at a flow rate determined by the adjustment parameters generated by the parameter generation unit 902. During the second liquid replacement process, before new treatment liquid is supplied to the treatment tank 210, a liquid (DIW) containing almost no chemical components (NH4OH and H2O2) remains as residual liquid in the treatment tank 210 and the circulation path 241. Therefore, when new treatment liquid is supplied to the treatment tank 210 at a flow rate determined by the normal parameters, the treatment liquid in the treatment tank 210 is diluted by the residual liquid immediately after the new treatment liquid is supplied, and the chemical concentration of the treatment liquid in the treatment tank 210 decreases. On the other hand, because the flow rate after subtracting the supply flow rate of DIW from the residual liquid amount is determined in the adjustment parameters, the chemical concentration of the treatment liquid in the treatment tank 210 hardly decreases immediately after new treatment liquid is supplied to the treatment tank 210 at a flow rate determined by the adjustment parameters. As a result, the concentration of the drug solution in the treatment solution reaches the set concentration in a short period of time.

[0080] In addition, the motion control unit 903 controls the liquid supply unit 220 and the liquid discharge unit 230 based on the detection values ​​of the liquid level sensor S1, the temperature sensor S2 and the concentration sensor S4, so as to supply the processing liquid into the processing tank 210 and discharge the processing liquid stored in the processing tank 210 to the outside.

[0081] For example, if the concentration of the treatment solution in the treatment tank 210, as detected by the concentration sensor S4, deviates from the set concentration range, the operation control unit 903 controls the liquid supply unit 220 to supply treatment solution into the treatment tank 210, so that the concentration of the treatment solution is within the set concentration range. Specifically, if the concentration of the treatment solution in the treatment tank 210, as detected by the concentration sensor S4, is lower than the set concentration range, the operation control unit 903 controls the NH4OH supply unit 221 and / or the H2O2 supply unit 222 to supply the treatment solution into the treatment tank 210. On the other hand, if the concentration of the treatment solution in the treatment tank 210, as detected by the concentration sensor S4, is higher than the set concentration range, the operation control unit 903 controls the DIW supply unit 223 to supply DIW into the treatment tank 210. Alternatively, for example, the motion control unit 903 may use the concentration of the treatment liquid in the discharge container 231 detected by the concentration sensor S4 to control the liquid supply unit 220 to supply the treatment liquid into the treatment tank 210.

[0082] For example, when the liquid level in the outer tank 212 detected by the liquid level sensor S1 exceeds a threshold, the motion control unit 903 opens the on / off valves 233 and 235. As a result, the liquid in the processing tank 210 is discharged into the discharge container 231 through the processing tank discharge path 232, and the liquid in the circulation path 241 is discharged into the discharge container 231 through the circulation unit discharge path 234, thus lowering the liquid level in the outer tank 212.

[0083] For example, if the temperature of the processing liquid detected by the temperature sensor S2 deviates from the set temperature range, the action control unit 903 controls the temperature regulator 244 to bring the temperature of the processing liquid within the set temperature range.

[0084] The storage unit 904 stores various information, including the total capacity of the processing slot 210 and general parameters.

[0085] [Fluid Replacement Method]

[0086] Reference Figure 5 As an example of the liquid replacement method in the implementation, the liquid replacement process of the control device 9 replacing the processing liquid in the processing tank 210 and the circulation path 241 by controlling each part of the processing module 2 will be described. Figure 5 The fluid replacement process shown is performed when the user or others have performed the fluid replacement operation.

[0087] In step ST11, the control device 9 determines whether the user or others have selected to perform concentration ratio adjustment. If the selection to perform concentration ratio adjustment is determined in step ST11, the control device 9 proceeds the process to step ST12. Conversely, if the selection to perform concentration ratio adjustment is determined in step ST11, the control device 9 proceeds the process to step ST16. For example, if, at the time of liquid replacement treatment, the liquid in the treatment tank 210 is different from the new treatment liquid supplied to the treatment tank 210 during liquid replacement treatment, the user or others select to perform concentration ratio adjustment. For example, a case where the treatment tank 210 is filled with DIW through DIW cleaning can be cited. On the other hand, if the liquid in the treatment tank 210 is the same as the new treatment liquid supplied to the treatment tank 210 during liquid replacement treatment, the user or others select not to perform concentration ratio adjustment. Details regarding DIW cleaning will be explained later.

[0088] In step ST12, the control device 9 controls the liquid discharge section 230 to discharge the processing liquid stored in the processing tank 210 to the discharge container 231. For example, the control device 9 opens the on / off valves 233 and 235. As a result, the processing liquid in the processing tank 210 is discharged to the discharge container 231 via the processing tank discharge path 232, and the processing liquid in the circulation path 241 is discharged to the discharge container 231 via the circulation section discharge path 234. At this time, there is some processing liquid remaining in the circulation path 241 (including the filter 242 and the circulation pump 243) that has not been completely discharged. In particular, when the capacity of the processing tank 210 increases, the amount of residual liquid remaining in the processing tank 210 and the circulation path 241 increases. After the discharge from the processing tank 210 and the circulation path 241 to the discharge container 231 is completed, the control device 9 closes the on / off valves 233 and 235. Furthermore, in step ST12, the discharge volume sensor S3 detects the residual liquid volume in the discharge container 231 before and after the discharge from the treatment tank 210, and uses the difference between the two as the discharge volume from the treatment tank 210. Additionally, in step ST12, when discharging the treated liquid from the treatment tank 210 and the circulation path 241 into the discharge container 231, the circulation pump 243 may or may not be activated.

[0089] In step ST13, the control device 9 acquires the discharge volume detected by the discharge volume sensor S3 in step ST12.

[0090] In step ST14, the control device 9 calculates the amount of residual liquid in the processing tank 210 and the circulation path 241 based on the total capacity of the processing tank 210 stored in the storage unit 904 and the amount of liquid discharged in step ST13.

[0091] In step ST15, the control device 9 generates adjustment parameters based on the normal parameters stored in the storage unit 904 and the residual liquid volume calculated by the residual liquid volume calculation unit 901 in step ST14.

[0092] In step ST16, the control device 9 acquires the normal parameters stored in the storage unit 904.

[0093] In step ST17, the control device 9 controls the liquid discharge section 230 to discharge the processing liquid stored in the processing tank 210 into the discharge container 231. For example, the control device 9 discharges the processing liquid stored in the processing tank 210 into the discharge container 231 in the same manner as in step ST12.

[0094] In step ST18, the control device 9 controls the liquid supply unit 220 to supply new treatment liquid into the treatment tank 210 based on the adjustment parameters calculated in step ST15 or the normal parameters obtained in step ST16. For example, when performing the first liquid replacement treatment, the control device 9 controls the liquid supply unit 220 to supply NH4OH, H2O2, and DIW into the treatment tank 210 at a flow rate determined by the normal parameters stored in the storage unit 904. For example, the control device 9 controls the liquid supply unit 220 to supply NH4OH, H2O2, and DIW into the treatment tank 210 at a flow rate determined by the normal parameters or adjustment parameters. At this time, the adjustment parameters determine the flow rate after subtracting the supply flow rate of DIW from the residual liquid volume. Therefore, immediately after supplying NH4OH, H2O2, and DIW into the treatment tank 210 at the flow rate determined by the adjustment parameters, the concentrations of NH4OH and H2O2 in the treatment tank 210 hardly decrease.

[0095] In step ST19, the control device 9 controls the liquid supply unit 220, the liquid discharge unit 230, and the liquid circulation unit 240 to circulate the treatment liquid in the treatment tank 210 while adjusting the concentration and temperature of the treatment liquid to a set concentration and a set temperature. For example, the control device 9 controls the liquid supply unit 220 to supply at least one of NH4OH, H2O2, and DIW into the treatment tank 210 so that the concentration of the treatment liquid detected by the concentration sensor S4 is within the set concentration range. For example, if the liquid level of the treatment liquid in the outer tank 212 detected by the liquid level sensor S1 exceeds a threshold, the control device 9 opens the on / off valve 235. As a result, the treatment liquid in the outer tank 212 is discharged into the discharge container 231 through the circulation path 241 and the circulation unit discharge path 234, and the liquid level of the treatment liquid in the outer tank 212 decreases. For example, the control device 9 controls the temperature regulator 244 so that the temperature of the treatment liquid detected by the temperature sensor S2 is within the set temperature range. For example, the control device 9 controls the liquid supply unit 220 to supply at least one of NH4OH, H2O2, and DIW into the treatment tank 210 based on the concentration of the treatment liquid in the discharge container 231 detected by the concentration sensor S4. Then, the control device 9 terminates the treatment after the concentration and temperature of the treatment liquid in the treatment tank 210 reach the set concentration and set temperature.

[0096] As explained above, according to the embodiment, NH4OH, H2O2, and DIW are supplied to the treatment tank 210 at a flow rate ratio of chemical solution to replacement solution determined by the amount of residual liquid in the treatment tank 210. Therefore, immediately after supplying new treatment solution (NH4OH, H2O2, and DIW) to the treatment tank 210, the concentrations of NH4OH and H2O2 in the treatment tank 210 hardly decrease. Thus, the time required to adjust the chemical solution concentration and temperature to the set concentration and temperature while circulating the treatment solution in the treatment tank 210 is shortened. As a result, the time required for treatment solution replacement can be reduced.

[0097] [DIW Cleaning]

[0098] Next, an example of DIW cleaning performed using the substrate processing apparatus 1 will be described. However, DIW cleaning is not limited to the method described below. Here, DIW cleaning is also referred to as DIW rinsing.

[0099] First, the control device 9 opens the opening and closing valves 233 and 235 while the opening and closing valves 221c to 223c are closed (step ST101). As a result, the treatment liquid in the inner tank 211 is discharged into the drainage container 231 through the treatment tank drainage path 232, and the treatment liquid in the outer tank 212 is discharged into the drainage container 231 through the circulation path 241 and the circulation section drainage path 234.

[0100] Next, after closing the on / off valves 233 and 235, the control device 9 opens the on / off valve 223c and controls the flow controller 223d to supply DIW into the processing tank 210 (step ST102). Thus, a predetermined amount of DIW is stored in the processing tank 210.

[0101] Next, while continuing to supply DIW into the treatment tank 210, the control device 9 activates the circulation pump 243 (step ST103). As a result, the DIW in the treatment tank 210 flows in the circulation path 241, and the circulation path 241 and the equipment inserted in the circulation path 241 (filter 242, circulation pump 243, temperature regulator 244, etc.) are cleaned by the DIW.

[0102] Next, the control device 9 opens the on / off valves 233 and 235 (step ST104). As a result, the DIW in the treatment tank 210 and the circulation path 241 is discharged into the drain container 231.

[0103] Next, while continuing to supply DIW into the processing tank 210, the control device 9 closes the on / off valves 233 and 235 (step ST105). As a result, the processing tank 210 and the circulation path 241 are filled with DIW. After the processing tank 210 and the circulation path 241 are filled with a predetermined amount of DIW, the control device 9 closes the on / off valve 223c. This stops the supply of DIW to the processing tank 210.

[0104] As described above, the DIW cleaning is complete. Steps ST104 and ST105 can also be repeated during the DIW cleaning process.

[0105] [First Variation]

[0106] Reference Figure 6 and Figure 7 An example of the functional structure of the control device 9A in the first modified example will be described.

[0107] The control device 9A includes a parameter generation unit 902A, an action control unit 903A, a storage unit 904A, etc.

[0108] The parameter generation unit 902A generates adjustment parameters based on the residual liquid volume and general parameters stored in the storage unit 904A in the treatment tank 210 and the circulation path 241. Alternatively, the parameter generation unit 902A may be configured to generate adjustment parameters using, in addition to the residual liquid volume and general parameters, the concentration of the treatment liquid in the discharge container 231 detected by the concentration sensor S4. For example, when the residual liquid volume is 10L (… Figure 7 (a) and the volume of the DIW, determined by the usual parameters, is 80L. Figure 7In case (b)), the parameter generation unit 902A calculates the adjusted DIW volume (70L) by subtracting the residual liquid volume (10L) from the DIW volume (80L). Furthermore, the parameter generation unit 902A calculates the flow ratio of NH4OH, H2O2, and DIW based on the volumes of NH4OH (4L) and H2O2 (16L) determined by normal parameters, and the calculated adjusted DIW volume (70L). Thus, as... Figure 7 As shown in (c), it is possible to generate adjustment parameters for determining the flow ratio of NH4OH, H2O2 and DIW (NH4OH:H2O2:DIW = 1:4:17.5).

[0109] The motion control unit 903A may also have the same structure as the aforementioned motion control unit 903.

[0110] The storage unit 904A stores various information, including the residual liquid volume in the treatment tank 210 and the circulation path 241, and general parameters. The residual liquid volume in the treatment tank 210 and the circulation path 241 is pre-input by the user or others and stored in the storage unit 904A.

[0111] Reference Figure 8 As another example of the liquid replacement method in the implementation, the liquid replacement process of the control device 9A replacing the processing liquid in the processing tank 210 and the circulation path 241 by controlling each part of the processing module 2 will be described. Figure 8 The fluid replacement process shown is performed when the user or others have performed the fluid replacement operation.

[0112] In step ST21, the control device 9A determines whether the user or others have selected to perform concentration ratio adjustment. Step ST21 is the same as step ST11.

[0113] In step ST22, the control device 9A generates adjustment parameters based on the residual liquid volume stored in the storage unit 904A, in the processing tank 210, and in the circulation path 241, as well as normal parameters.

[0114] In step ST23, the control device 9A acquires the normal parameters stored in the storage unit 904A.

[0115] In step ST24, the control device 9A controls the liquid discharge section 230 to discharge the processing liquid stored in the processing tank 210 into the discharge container 231. Step ST24 is the same as step ST12.

[0116] In step ST25, the control device 9A controls the fluid supply unit 220 to supply new treatment fluid into the treatment tank 210 based on the adjustment parameters calculated in step ST22 or the normal parameters obtained in step ST23. Step ST25 is the same as step ST18.

[0117] In step ST26, the control device 9A controls the liquid supply unit 220, the liquid discharge unit 230, and the liquid circulation unit 240 to circulate the treatment liquid in the treatment tank 210 while adjusting the concentration and temperature of the treatment liquid to the set concentration and set temperature. Step ST26 is the same as step ST19.

[0118] As explained above, according to the first modification, NH4OH, H2O2, and DIW are supplied to the treatment tank 210 at a flow rate ratio of chemical solution to replacement solution determined by the amount of residual liquid in the treatment tank 210. Therefore, immediately after supplying new treatment solution (NH4OH, H2O2, and DIW) to the treatment tank 210, the concentrations of NH4OH and H2O2 in the treatment tank 210 hardly decrease. Thus, the time required to adjust the chemical solution concentration and temperature to the set concentration and temperature while circulating the treatment solution in the treatment tank 210 is shortened. As a result, the time required for treatment solution replacement can be reduced.

[0119] Furthermore, according to the first modification, the residual liquid volume is pre-stored in the storage section 904A, and the adjustment parameters are generated based on the residual liquid volume stored in the storage section 904A and normal parameters, thus it is a simple method. For example, the first modification is useful when the variation in the residual liquid volume is small.

[0120] [Second variation]

[0121] Reference Figure 9 and Figure 10 An example of the functional structure of the control device 9B in the second modification will be described.

[0122] The control device 9B includes an action control unit 903B, a storage unit 904B, etc.

[0123] The motion control unit 903B controls the liquid supply unit 220 to supply NH4OH, H2O2 and DIW into the treatment tank 210 based on the normal parameters or adjustment parameters stored in the storage unit 904B.

[0124] The storage unit 904B stores various information, including general parameters and adjustment parameters. For example, adjustment parameters are generated by the user or others before starting the liquid replacement process based on the residual liquid volume in the treatment tank 210 and the circulation path 241, and are pre-stored in the storage unit 904B. Figure 10 The typical parameters shown in (a) determine that NH4OH:H2O2:DIW = 1:4:18. Figure 10 The adjustment parameters shown in (b) determine that NH4OH:H2O2:DIW = 1:4:17.5.

[0125] Reference Figure 11 As another example of the liquid replacement method in the implementation, the liquid replacement process of the control device 9B replacing the processing liquid in the processing tank 210 and the circulation path 241 through each part of the processing module 2 will be described. Figure 11 The fluid replacement process shown is performed when the user or others have performed the fluid replacement operation.

[0126] In step ST31, the control device 9B determines whether the user or others have selected to perform concentration ratio adjustment. Step ST31 is the same as step ST11.

[0127] In step ST32, the control device 9B acquires the adjustment parameters stored in the storage unit 904B.

[0128] In step ST33, the control device 9B acquires the normal parameters stored in the storage unit 904B.

[0129] In step ST34, the control device 9B controls the liquid discharge section 230 to discharge the processing liquid stored in the processing tank 210 into the discharge container 231. Step ST34 is the same as step ST12.

[0130] In step ST35, the control device 9B controls the fluid supply unit 220 to supply new treatment fluid into the treatment tank 210 based on the adjustment parameters obtained in step ST32 or the normal parameters obtained in step ST33. Step ST35 is the same as step ST18.

[0131] In step ST36, the control device 9B controls the liquid supply unit 220, the liquid discharge unit 230, and the liquid circulation unit 240 to circulate the treatment liquid in the treatment tank 210 while adjusting the concentration and temperature of the treatment liquid to the set concentration and set temperature. Step ST36 is the same as step ST19.

[0132] As described above, according to the second variation, NH4OH, H2O2, and DIW are supplied to the treatment tank 210 at a flow rate ratio of chemical solution to replacement solution determined by the amount of residual liquid in the treatment tank 210. Therefore, immediately after supplying new treatment solution (NH4OH, H2O2, and DIW) to the treatment tank 210, the concentrations of NH4OH and H2O2 in the treatment tank 210 hardly decrease. Thus, the time required to adjust the chemical solution concentration and temperature to the set concentration and temperature while circulating the treatment solution in the treatment tank 210 is shortened. As a result, the time required for treatment solution replacement can be reduced.

[0133] Furthermore, according to the second modification, the adjustment parameters are pre-stored in the storage unit 904B, and the operation control unit 903B controls the liquid supply unit 220 to supply new treatment liquid to the treatment tank 210 based on the normal parameters or adjustment parameters stored in the storage unit 904B. Therefore, it is a simple method. For example, the second modification is useful when the variation in the residual liquid amount is small.

[0134] It should be considered that the embodiments described in this specification are illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, or modified in various ways without exceeding the scope and spirit of the invention (claims).

[0135] In the above embodiments, the connection between the drug supply unit and the replacement fluid supply unit and the treatment tank 210 is described, but the present invention is not limited thereto. For example, it may be configured such that the drug supply unit is connected to the treatment tank 210 and the replacement fluid supply unit is connected to the circulation path 241. Furthermore, it may be configured such that the drug supply unit is connected to the circulation path 241 and the replacement fluid supply unit is connected to the treatment tank 210.

[0136] In the above embodiment, the concentration sensor S4 was described to detect the concentration of the treatment liquid in the drain container 231 and the concentration of the treatment liquid in the treatment tank 210. However, the present invention is not limited to this. For example, it may be configured to provide two concentration sensors, one of which detects the concentration of the treatment liquid in the drain container 231 and the other of which detects the concentration of the treatment liquid in the treatment tank 210.

[0137] In the above embodiments, the case where the processing liquid used in the processing module is SC1 was described, but the present invention is not limited thereto. The processing liquid may also be a mixture generated by mixing the drug solution (first component) and the replacement liquid (second component), such as SC2 (HCl / H2O2 / H2O) or DHF (HF / H2O).

Claims

1. A substrate processing apparatus characterized by comprising: including: a processing tank that performs liquid processing on a substrate using a processing liquid containing a medicine liquid and a replacement liquid at a first mixing ratio; a circulation flow path that returns the processing liquid taken out from the processing tank to the processing tank; a liquid supply unit that individually supplies at least either of the medicine liquid and the replacement liquid to at least either of the processing tank and the circulation flow path; a discharge amount sensor that detects a discharge amount of the replacement liquid discharged from the processing tank and the circulation flow path; and a control device, the control device is configured to control the liquid supply unit so that the medicine liquid and the replacement liquid are supplied at a second mixing ratio in which a ratio of the replacement liquid to the medicine liquid is lower than the first mixing ratio after the processing tank and the circulation flow path are cleaned with the replacement liquid, the control device is configured to set the second mixing ratio in accordance with a residual liquid amount of the replacement liquid remaining in the processing tank and the circulation flow path after the processing tank and the circulation flow path are cleaned with the replacement liquid, the control device is configured to calculate the residual liquid amount based on the discharge amount detected by the discharge amount sensor.

2. The substrate processing apparatus according to claim 1, wherein: the residual liquid amount of the replacement liquid is a value input in advance.

3. The substrate processing apparatus according to claim 1 or 2, wherein: the control device is configured to control the liquid supply unit so that the medicine liquid and the replacement liquid are simultaneously supplied at a flow rate ratio corresponding to the second mixing ratio after the processing tank and the circulation flow path are cleaned with the replacement liquid.

4. The substrate processing apparatus according to claim 1 or 2, comprising: a processing liquid concentration sensor that detects a medicine liquid concentration of the processing liquid in the processing tank, the control device is configured to control the liquid supply unit to supply at least either of the medicine liquid and the replacement liquid so that the medicine liquid concentration of the processing liquid is within a set concentration range in a case where the medicine liquid concentration of the processing liquid detected by the processing liquid concentration sensor deviates from the set concentration range. including:

5. The substrate processing apparatus of claim 1 or 2, wherein a temperature adjuster that adjusts a temperature of the processing liquid in the processing tank; and a temperature sensor that detects the temperature of the processing liquid in the processing tank, the control device controls the temperature adjuster so that the temperature of the processing liquid is within a set temperature range in a case where the temperature of the processing liquid detected by the temperature sensor deviates from the set temperature range. including: a liquid discharge unit that discharges the processing liquid in the processing tank; and 6. The substrate processing apparatus of claim 1 or 2, wherein a liquid level sensor that detects a liquid level of the processing liquid in the processing tank, the control device is configured to control the liquid discharge unit to discharge the processing liquid in the processing tank in a case where a detection value of the liquid level sensor exceeds a threshold value.

7. The substrate processing apparatus according to claim 6, wherein: the liquid discharge unit includes a discharge liquid container that stores the processing liquid discharged from the processing tank, ​ ​ ​ The substrate processing apparatus includes a drain concentration sensor that detects a chemical concentration of the processing liquid in the drain tank, The control device is configured to control the liquid supply portion based on a detection value of the drain concentration sensor.

8. The substrate processing apparatus according to claim 6, wherein: The control device is configured to control the liquid supply portion and the liquid drain portion to perform the following processes: a process of replacing the processing liquid in the processing tank and the circulation flow path with the replacement liquid, a process of draining the replacement liquid from the processing tank and the circulation flow path, a process of supplying the chemical liquid and the replacement liquid at a second mixing ratio that is lower than the first mixing ratio with respect to the proportion of the replacement liquid after the replacement liquid is drained.

9. The substrate processing apparatus according to claim 1 or 2, wherein: The liquid supply portion includes a chemical liquid supply portion that supplies the chemical liquid and a replacement liquid supply portion that supplies the replacement liquid, The chemical liquid supply portion and the replacement liquid supply portion each include a liquid flow controller.

10. The substrate processing apparatus according to claim 1 or 2, wherein: The processing liquid is SC1, SC2, or DHF, The replacement liquid is deionized water.

11. The substrate processing apparatus according to claim 1 or 2, wherein: The processing tank is a tank in which liquid processing is performed on a plurality of substrates.

12. A liquid replacement method that replaces a processing liquid stored in a processing tank that is circulated through a circulation flow path, the liquid replacement method characterized by: The processing liquid includes a chemical liquid and a replacement liquid at a first mixing ratio, The liquid replacement method includes: a process of supplying the chemical liquid and the replacement liquid at a second mixing ratio that is lower than the first mixing ratio with respect to the proportion of the replacement liquid after the processing tank and the circulation flow path are cleaned with the replacement liquid, a process of setting the second mixing ratio in accordance with a residual liquid amount of the replacement liquid remaining in the processing tank and the circulation flow path after the processing tank and the circulation flow path are cleaned with the replacement liquid, and a process of calculating the residual liquid amount based on a drain amount of the replacement liquid drained from the processing tank and the circulation flow path. ​

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