Cutting line positioning method and its application, cutting device and its application

Abstract

The present invention relates to the field of wire cutting, and provides a cutting wire positioning method and its application, a cutting device and its application. Among them, the cutting wire positioning method includes: confirming the position of the material based on a first distance sensor, and determining the position of the first cutting wire at the first end based on a second distance sensor; determining the position of the last cutting wire at the second end based on a third distance sensor. To solve the defect that the cutting wire network cannot be accurately and efficiently detected and positioned in the prior art, the cutting wire positioning method provided by the present invention determines the axial position of the material through the first distance sensor to obtain a first distance value, and corrects the position of the first cutting wire through the second distance sensor; corrects the position of the last cutting wire through the third distance sensor, and then positions the cutting wire. The method is simple. Compared with the method of manual positioning and detection, it reduces the labor cost, improves the positioning and detection efficiency, and improves the yield rate.

Description

Technical Field

[0001] The present invention relates to the field of wire cutting technology, and in particular to a cutting wire positioning method and application thereof, a cutting device and application thereof. Background Art

[0002] At present, electroplated diamond wire is mainly used for cutting solar monocrystalline silicon wafers and polycrystalline silicon wafers. With the continuous upgrading of technology, the demand for ultra-thin silicon wafers is increasing. Currently, the cutting demand for ultra-thin silicon wafers is met by reducing the slot pitch or choosing ultra-fine diamond wire cutting.

[0003] In the process of cutting ultra-thin silicon wafers, the wire mesh slope and thick wafer thickness are usually measured by the naked eye using a square ruler to meet the process requirements. The wire mesh slope is difficult to confirm, there is no unified measurement standard, and wire marks and wire breakage occur. Secondly, during the execution process, since the wire diameter of the steel wire is between 50 and 70μm, there is a big difference between people in the naked eye recognition, resulting in inaccurate measurement and abnormal yield loss.

[0004] How to efficiently and accurately detect and locate the position of the cutting wire network to reduce personnel costs and improve detection accuracy and efficiency is an important issue that needs to be urgently solved in the industry. Summary of the invention

[0005] The present invention provides a cutting line positioning method and application thereof, a cutting device and application thereof, so as to solve the defect in the prior art that it is impossible to accurately and efficiently detect and position the cutting network cable, and realize the position positioning and detection of the cutting line based on the detection distance results of the first distance sensor, the second distance sensor and the third distance sensor.

[0006] The present invention provides a cutting line positioning method, comprising:

[0007] Obtaining a length of a material, and determining a cutting thickness at a first end of the material and a cutting thickness at a second end of the material;

[0008] Confirming the position of the first end of the material based on a first distance sensor to obtain a first distance value;

[0009] Based on the first distance value of the first distance sensor and the cutting thickness of the first end, determining the position of a second distance sensor along the width direction of the material, the second distance sensor being used to detect the position of the first cutting line close to the first end;

[0010] Based on the first distance value of the first distance sensor, the material length and the cutting thickness of the second end of the material, the position of a third distance sensor along the material width direction is determined, and the third distance sensor is used to detect the position of the last cutting line close to the second end.

[0011] According to the cutting line positioning method provided by the present invention, the step of determining the position of the second distance sensor based on the first distance value of the first distance sensor and the cutting thickness at the first end includes:

[0012] The position of the second distance sensor from the mounting surface of the first distance sensor is the sum of the first distance value and the cutting thickness at the first end.

[0013] According to the cutting line positioning method provided by the present invention, the step of determining the position of the third distance sensor based on the first distance value of the first distance sensor, the length of the material, and the cutting thickness at the second end of the material includes:

[0014] The position of the second distance sensor from the mounting surface of the first distance sensor is the sum of the first distance value and the length of the material minus the cutting thickness at the second end.

[0015] According to the cutting line positioning method provided by the present invention, it further includes a sensor group for determining the slope of the first cutting line on each cutting roller based on the sensor group.

[0016] According to the cutting line positioning method provided by the present invention, the step of determining the position of the first cutting line on each cutting roller based on the sensor group includes:

[0017] The sensor group measures the third distance value of the first cutting line on the first cutting roller;

[0018] The sensor group determines the fourth distance value of the first cutting line on the second cutting roller, and the fourth distance value is equal to the sum of the third distance value and a first preset value;

[0019] The sensor group confirms the fifth distance value of the first cutting line on the third cutting roller, and the fifth distance value is equal to the sum of the third distance value and a second preset value.

[0020] The present invention also provides a cutting device, including:

[0021] Cutting lines, which are arranged at equal intervals along the length direction of the material;

[0022] A first distance sensor, which is arranged on one side of the first cutting line along the length direction of the material, and the first distance sensor is used to detect the distance of the first end of the material;

[0023] A second distance sensor, which is arranged along the width direction of the material, and the second distance sensor is used to detect the position of the first cutting line;

[0024] A third distance sensor, which is arranged on the same side as the second distance sensor, and is used to detect the position of the last cutting line.

[0025] The cutting device provided by the present invention further includes a first cutting roller, a second cutting roller and a third cutting roller. The axes of the first cutting roller, the second cutting roller and the third cutting roller are parallel and are consistent with the length direction of the material.

[0026] In the height direction, the first cutting roller and the third cutting roller are arranged above the second cutting roller. In the width direction, the second cutting roller is arranged between the first cutting roller and the third cutting roller.

[0027] The cutting device provided by the present invention further includes a sensor group, which includes a fourth distance sensor, a fifth distance sensor and a sixth distance sensor. The fourth distance sensor, the fifth distance sensor and the sixth distance sensor are all arranged on the side where the first distance sensor is located.

[0028] The fourth distance sensor is arranged along the axis direction of the first cutting roller to detect the position of the first cutting line on the first cutting roller.

[0029] The fifth distance sensor is arranged along the axis direction of the second cutting roller to detect the position of the first cutting line on the second cutting roller.

[0030] The sixth distance sensor is arranged along the axis direction of the third cutting roller to detect the position of the first cutting line on the third cutting roller.

[0031] The present invention provides a cutting line positioning method for semiconductor wafer cutting, and the semiconductor wafer is one of silicon, silicon carbide, germanium and sapphire.

[0032] The present invention provides a cutting device for semiconductor wafer cutting, and the semiconductor wafer is one of silicon, silicon carbide, germanium and sapphire. The cutting line positioning method provided by the present invention determines the axial position of the material through the first distance sensor to obtain a first distance value, determines the position of the second distance sensor based on the first distance value and the cutting thickness at the first end, and corrects the position of the first cutting line through the second distance sensor; determines the position of the third distance sensor based on the first distance value, the length of the material and the cutting thickness of the second section, and corrects the position of the last cutting line through the third distance sensor, thereby positioning the cutting line. The method is simple. Compared with the method of manual positioning and detection, it reduces the labor cost, improves the positioning and detection efficiency, and improves the yield.

[0033] Furthermore, in the application of the cutting line positioning method provided by the present invention, due to having the above-mentioned cutting line positioning method, it also has various advantages as described above; in the cutting device provided by the present invention and its application, the cutting line positioning method can be realized, so it also has various advantages as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0035] Figure 1 is one of the flow diagrams of the cutting line positioning method provided by the present invention;

[0036] Figure 2 is another flow diagram of the cutting line positioning method provided by the present invention;

[0037] Figure 3 is the top view of the cutting device provided by the present invention;

[0038] Figure 4 is the right view of the cutting device provided by the present invention;

[0039] Figure 5 is the front view of the cutting device provided by the present invention.

[0040] Reference Numerals:

[0041] 100: First distance sensor; 101: Second distance sensor; 102: Third distance sensor; 103: Fourth distance sensor; 104: Fifth distance sensor; 105: Sixth distance sensor; 110: Material; 201: First cutting roller; 202: Second cutting roller; 203: Third cutting roller; 211: First cutting line; 212: Last cutting line. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] To make the objectives, technical solutions, and advantages of the present invention clearer, the following will clearly and completely describe the technical solutions in the present invention with reference to the accompanying drawings in the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments in the present invention belong to the scope of protection of the present invention.

[0043] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the embodiments of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0044] In the description of the embodiments of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific situations.

[0045] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0046] The following Figures 1 to 5 describes the embodiments of the present invention. It should be understood that the following is only a schematic embodiment of the present invention and does not constitute a limitation on the present invention.

[0047] As Figure 1 shown, the present invention provides a method for positioning a cutting line, including:

[0048] S1: Obtain the length of the material 110, and determine the cutting thickness at the first end and the cutting thickness at the second end of the material 110; wherein, the material 110 is a bar stock, generally a quadrangular prism, and of course it can also be a multi-prism or a cylinder. The material 110 has two ends, namely the first end and the second end. When the material 110 is cut, a certain cutting thickness at the first end and the second end will be discarded. The cutting thicknesses at the first end and the second end may be equal or unequal, and are determined in advance based on the situation of the material 110. For example, the cutting thickness at the first end is D1, the cutting thickness at the second end is D2, the total length of the material 110 is D, and the effective cutting length of the material 110 is D0 = D - D1 - D2.

[0049] S2: Based on the first distance sensor 100, confirm the position of the first end of the material 110 and obtain the first distance value L1; for example, the material 110 continuously approaches the first distance sensor 100 along the axial direction of the material 110. After the material 110 is placed at a suitable position directly above the cutting device, the axial distance between the first end of the material 110 and the first distance sensor 100 is measured by the first distance sensor 100, that is, the first distance value L1. Among them, the first end is close to the first distance sensor 100, and the second end is far from the first distance sensor 100.

[0050] S3: Based on the first distance value of the first distance sensor 100 and the cutting thickness at the first end, determine the position of the second distance sensor 101 along the width direction of the material 110. The second distance sensor 101 is used to detect the position of the first cutting line 211 close to the first end; specifically, a plurality of cutting lines are arranged at equal intervals from the first end to the second end of the material 110. The first cutting line close to the first end of the material 110 is the first cutting line 211, and the last cutting line close to the second end is the last cutting line 212.

[0051] The second distance sensor 101 is arranged on one side parallel to the axis of the material 110. The lateral position of the second distance sensor 101 is determined by the first distance value and the cutting thickness at the first end. That is to say, the second distance sensor 101 should detect the first cutting line 211 at the second distance value. If the first cutting line 211 is not detected, an alarm prompt is given, and the distance and direction that need to be adjusted can also be output. The operator needs to adjust the position of the material 110 so that the first cutting line 211 matches the position of the cutting thickness at the first end of the material 110 and is detected by the second distance sensor 101. Based on the length of different materials 110, the first distance value of the first distance sensor 100, and the cutting thickness at the first end, the position of the second distance sensor 101 is different, and the lateral position of the second distance sensor 101 can be adjusted. If the second distance sensor 101 detects the first cutting line 211, it means that the position of the first cutting line 211 and the material 110 is correct, and the next step is carried out.

[0052] S4: Based on the first distance value of the first distance sensor 100, the length of the material 110, and the cutting thickness at the second end of the material 110, determine the position of the third distance sensor 102 in the width direction of the material 110. The third distance sensor 102 is used to detect the position of the last cutting line 212 near the second end. Among them, the third distance sensor 102 is arranged on one side parallel to the axis of the material 110. The third distance sensor 102 and the second distance sensor 101 are on the same side of the cutting device. The lateral position of the third distance sensor 102 is determined by the first distance value, the length of the material 110, and the cutting thickness at the second end. That is to say, the third distance sensor 102 should detect the last cutting line 212 at the third distance value. If the last cutting line 212 is not detected, an alarm prompt is given, and the distance and direction that need to be adjusted can also be output. The operator needs to adjust the position of the last cutting line 212 until the third distance sensor 102 detects the last cutting line 212, indicating that the positions of all cutting lines are correct.

[0053] Through the above steps S1 to S4, the positions of the material 110, the first cutting line 211, and the last cutting line 212 are accurately positioned, reducing the errors caused by manual positioning, improving the yield of the material 110 cutting, and the detection method is simple.

[0054] Further, in an embodiment of the present invention, for determining the position of the second distance sensor 101 based on the first distance value of the first distance sensor 100 and the cutting thickness at the first end in step S3, it specifically includes:

[0055] The sum of the first distance value and the cutting thickness at the first end is the position of the second distance sensor 101 from the installation surface of the first distance sensor 100. That is, the second distance value M1 of the second distance sensor 101 is equal to the first distance value L1 + the cutting thickness D1 at the first end, that is, M1 = L1 + D1. The first distance sensor 100 is arranged along the axis direction of the material 110 and has a certain distance from the first end of the material 110. The second distance sensor 101 is arranged along the width direction of the material 110. The second distance sensor 101 moves laterally based on the magnitude of the second distance value M1. The second distance value is the distance value from the first distance sensor 100 to the first cutting line 211 along the axis direction of the material 110.

[0056] For example, the cutting line has a certain slope, and the distance from the point where the first cutting line 211 contacts the side of the material 110 near the second distance sensor 101 to the first end should be equal to the cutting thickness D1 at the first end.

[0057] In addition, in another embodiment of the present invention, for step S4, determining the position of the third distance sensor 102 based on the first distance value of the first distance sensor 100, the length of the material 110, and the cutting thickness of the second end of the material 110 specifically includes:

[0058] The sum of the first distance value and the length of the material 110 minus the cutting thickness of the second end is the position of the second distance sensor 101 from the mounting surface of the first distance sensor 100. That is, the third distance value M2 of the third distance sensor 102 is equal to the first distance value L1 + the length D of the material 110 - the cutting thickness D2 of the second end, that is, M2 = L1 + D - D2. That is to say, both the second distance sensor 101 and the third distance sensor are moved and positioned with the first distance sensor 100 as the reference.

[0059] For example, the cutting line has a certain slope, and the distance from the point where the last cutting line 212 contacts the side of the material 110 away from the third distance sensor 102 to the second end should be equal to the cutting thickness D2 of the second end.

[0060] In addition, in an alternative embodiment of the present invention, it further includes step S5: determining the slope of the first cutting line 211 on each cutting roller based on the sensor group. That is to say, the slopes on each cutting roller of the cutting device are the same. By confirming the slope of the first cutting line 211 on each cutting roller, all other cutting lines are adjusted based on the slope of the first cutting line 211. Of course, the sensor group can be one or more sensors measuring separately or simultaneously.

[0061] Specifically, as Figure 2 shown, determining the position of the first cutting line 211 on each cutting roller based on the sensor group in step S5 includes the following steps S51 to S53:

[0062] S51: The sensor group measures the third distance value L2 of the first cutting line 211 on the first cutting roller 201; wherein, the sensor group can be on the same side as the first distance sensor 100, and the axis of the first cutting roller 201 is parallel to the axis of the material 110. Of course, the axes of the second cutting roller 202 and the third cutting roller 203 are also parallel to the axis of the material 110.

[0063] S52: The sensor group determines the fourth distance value of the first cutting line 211 on the second cutting roller 202, and the fourth distance value L3 is equal to the sum of the third distance value L2 and the first preset value; wherein, the first preset value can be the slot pitch. For example, a plurality of slots are equidistantly arranged on the first cutting roller 201, the second cutting roller 202, and the third cutting roller 203, and the cutting line is placed in the slot. The first preset value can be one slot pitch.

[0064] That is to say, when the first cutting line 211 is on the first cutting roller 201, it is placed in the first groove on the side of the first cutting roller 201 close to the sensor group. The third distance value L2 is equal to the distance between the sensor group and the first cutting line 211 in the first groove. When the first cutting line 211 is on the second cutting roller 202, it is placed in the second groove on the side of the second cutting roller 202 close to the sensor group. The fourth distance value L3 is equal to the sum of the third distance value L2 and a groove pitch. The sensor group can detect whether there is a first cutting line 211 at the position of the fourth distance value L3 based on the setting of the first preset value to determine whether the position of the first cutting line 211 on the second cutting roller 202 is correct.

[0065] S53: The sensor group confirms the fifth distance value L4 of the first cutting line 211 on the third cutting roller 203. The fifth distance value is equal to the sum of the third distance value L2 and the second preset value. Among them, the second preset value is greater than the first preset value. For example, the first preset value is a groove pitch, and the second preset value is three groove pitches. The fifth distance value L4 is equal to the sum of the third distance value L2 and three groove pitches, thereby determining the slope of the first cutting line 211. The sensor group can detect whether there is a first cutting line 211 at the position of the fifth distance value based on the setting of the second preset value to determine whether the position of the first cutting line 211 on the third cutting roller 203 is correct.

[0066] For example, the sensor group includes a fourth distance sensor 103, a fifth distance sensor 104, and a sixth distance sensor 105. That is to say, S51: The fourth distance sensor 103 measures the third distance value of the first cutting line 211 of the first cutting roller 201; S52: The fifth distance sensor 104 determines the fourth distance value of the first cutting line 211 of the second cutting roller 202. The fourth distance value is equal to the sum of the third distance value and the first preset value; S53: The sixth distance sensor 105 confirms the fifth distance value of the first cutting line 211 of the third cutting roller 203. The fifth distance value is equal to the sum of the third distance value and the second preset value.

[0067] The fourth distance sensor 103, the fifth distance sensor 104, and the sixth distance sensor 105 are located on the same side of the cutting device and on the same reference plane. The sides of the first cutting roller 201, the second cutting roller 202, and the third cutting roller 203 close to the sensor group are aligned on the same reference plane. After the fourth distance sensor 103 obtains the third distance value, the fifth distance sensor 104 and the sixth distance sensor 105 can work simultaneously. When any distance sensor does not detect the first cutting line 211 within the corresponding distance, an alarm prompt is given, and the adjusted distance can be output.

[0068] Such as Figures 3 to 5As shown in the figure, a cutting device includes: a cutting wire, a first distance sensor 100, a second distance sensor 101, and a third distance sensor 102. The cutting wires are arranged at equal intervals along the length direction of the material 110. The first distance sensor 100 is arranged on one side of the first cutting wire 211 along the length direction of the material 110, and the first distance sensor 100 is used to detect the distance of the first end of the material 110. The second distance sensor 101 is arranged along the width direction of the material 110, and the second distance sensor 101 is used to detect the position of the first cutting wire 211. The third distance sensor 102 is arranged on the same side as the second distance sensor 101, and the third distance sensor 102 is used to detect the position of the last cutting wire 212. The positioning method of the above steps S1 to S4 is realized by the first distance sensor 100, the second distance sensor 101, and the third distance sensor 102.

[0069] In other words, the cutting wires are arranged along the axis direction of the material 110 to cut the material 110 with equal thickness. A first distance sensor 100 is arranged on the side opposite to the first end of the material 110, and the first distance sensor 100 detects the relative distance from the first end. For example, the preset value of the distance between the first end and the first distance sensor 100 can be set as D3. When the first end of the material 110 moves towards the first distance sensor 100 and the first distance sensor 100 detects a distance of D3, the material 110 stops moving, and the initial position positioning of the material 110 is completed.

[0070] The second distance sensor 101 and the third distance sensor 102 are placed on the same side of the material 110, and the reference plane where the second distance sensor 101 and the third distance sensor 102 are located is parallel to the axis of the material 110. The second distance sensor 101 and the third distance sensor 102 can move along the axis direction of the material 110. The second distance sensor 101 obtains the distance between the first cutting wire 211 and the first distance sensor 100, that is, the first distance value. The second distance sensor 101 detects the presence or absence of the first cutting wire 211 with the first distance value as the standard to judge whether the position of the first cutting wire 211 is correct. The third distance sensor 102 obtains the distance between the last cutting wire 212 and the first distance sensor 100, that is, the second distance value. The third distance sensor 102 detects the presence or absence of the last cutting wire 212 with the second distance value as the standard to judge whether the position of the last cutting wire 212 is correct.

[0071] Specifically, in some embodiments of the present invention, the cutting device further includes a first cutting roller 201, a second cutting roller 202, and a third cutting roller 203. The axes of the first cutting roller 201, the second cutting roller 202, and the third cutting roller 203 are parallel and consistent with the length direction of the material 110.

[0072] In the height direction, the first cutting roller 201 and the third cutting roller 203 are placed above the second cutting roller 202. In the width direction, the second cutting roller 202 is placed between the first cutting roller 201 and the third cutting roller 203. In other words, the first cutting roller 201, the second cutting roller 202, and the third cutting roller 203 are distributed in a triangular shape. The material 110 is placed above the first cutting roller 201 and the third cutting roller 203, and the material 110 is cut through the cutting line between the first cutting roller 201 and the third cutting roller 203.

[0073] As Figure 3 and Figure 4 shown, in some other embodiments of the present invention, the cutting device further includes a sensor group. The sensor group includes a fourth distance sensor 103, a fifth distance sensor 104, and a sixth distance sensor 105. The fourth distance sensor 103, the fifth distance sensor 104, and the sixth distance sensor 105 are all placed on the same side where the first distance sensor 100 is located. The fourth distance sensor 103 is arranged along the axis direction of the first cutting roller 201 to detect the position of the first cutting line 211 on the first cutting roller 201. The fifth distance sensor 104 is arranged along the axis direction of the second cutting roller 202 to detect the position of the first cutting line 211 on the second cutting roller 202. The sixth distance sensor 105 is arranged along the axis direction of the third cutting roller 203 to detect the position of the first cutting line 211 on the third cutting roller 203. The positioning method of steps S51 to S53 is completed by the fourth distance sensor 103, the fifth distance sensor 104, and the sixth distance sensor 105.

[0074] Among them, the fourth distance sensor 103, the fifth distance sensor 104, and the sixth distance sensor 105 are on the same reference plane.

[0075] The present invention provides a cutting line positioning method for semiconductor wafer cutting. The semiconductor wafer is one of silicon, silicon carbide, germanium, and sapphire.

[0076] The present invention provides a cutting device for semiconductor wafer cutting. The semiconductor wafer is one of silicon, silicon carbide, germanium, and sapphire.

[0077] The present invention also provides a controller, including a processor and a memory. The memory is used to store a computer program, and the processor is used to call and run the computer program from the memory, so that the computing node executes the method of the above embodiments.

[0078] The present invention also provides a computer-readable medium. The computer-readable medium stores program codes. When the computer program codes run on a computer, the computer executes the method of the above embodiments.

[0079] The cutting line positioning method provided by the present invention determines the axial position of the material 110 through the first distance sensor 100 to obtain a first distance value, determines the position of the second distance sensor 101 based on the first distance value and the cutting thickness at the first end, and corrects the position of the first cutting line 211 through the second distance sensor 101; determines the position of the third distance sensor 102 based on the first distance value, the length of the material 110, and the cutting thickness of the second section, and corrects the position of the last cutting line 212 through the third distance sensor 102, thereby positioning the cutting line. The method is simple. Compared with the method of manual positioning and detection, it reduces labor costs, improves the positioning and detection efficiency, and increases the yield rate.

[0080] Further, in the application of the cutting line positioning method provided by the present invention, due to having the above-mentioned cutting line positioning method, it also has various advantages as described above; the cutting device provided by the present invention and its application can implement the cutting line positioning method, so it also has various advantages as described above.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A method for positioning a cutting line, characterized in that, Including: Obtaining the length of the material, and determining the cutting thickness of the first end of the material and the cutting thickness of the second end of the material; Based on the first distance sensor, confirming the position of the first end of the material and obtaining a first distance value; Based on the first distance value of the first distance sensor and the cutting thickness of the first end, determining the position of the second distance sensor along the width direction of the material, where the second distance sensor is used to detect the position of the first cutting line close to the first end; Based on the first distance value of the first distance sensor, the length of the material, and the cutting thickness of the second end of the material, determining the position of the third distance sensor along the width direction of the material, where the third distance sensor is used to detect the position of the last cutting line close to the second end; Further including a first cutting roller, a second cutting roller, and a third cutting roller, the axes of the first cutting roller, the second cutting roller, and the third cutting roller are parallel and consistent with the length direction of the material; Further including a sensor group, and determining the slope of the first cutting line on each cutting roller based on the sensor group; The step of determining the position of the first cutting line on each cutting roller based on the sensor group includes: The sensor group measures a third distance value of the first cutting line on the first cutting roller; The sensor group determines a fourth distance value of the first cutting line on the second cutting roller, and the fourth distance value is equal to the sum of the third distance value and a first preset value; The sensor group confirms a fifth distance value of the first cutting line on the third cutting roller, and the fifth distance value is equal to the sum of the third distance value and a second preset value; Wherein, the second preset value is greater than the first preset value.

2. The cutting line positioning method according to claim 1, wherein The step of determining the position of the second distance sensor based on the first distance value of the first distance sensor and the cutting thickness of the first end includes: The position of the second distance sensor from the installation surface of the first distance sensor is the sum of the first distance value and the cutting thickness of the first end.

3. The cutting line positioning method according to claim 1, characterized in that The step of determining the position of the third distance sensor based on the first distance value of the first distance sensor, the length of the material, and the cutting thickness of the second end of the material includes: The position of the second distance sensor from the installation surface of the first distance sensor is the sum of the first distance value and the length of the material minus the cutting thickness of the second end.

4. A cutting device, characterized in that, Including: Cutting lines, which are arranged at equal intervals along the length direction of the material; A first distance sensor, which is arranged along the length direction of the material on one side of the first cutting line, and the first distance sensor is used to detect the distance of the first end of the material; A second distance sensor, which is arranged along the width direction of the material, and the second distance sensor is used to detect the position of the first cutting line; A third distance sensor, which is arranged on the same side as the second distance sensor, and the third distance sensor is used to detect the position of the last cutting line; It further includes a first cutting roller, a second cutting roller, and a third cutting roller, and the axes of the first cutting roller, the second cutting roller, and the third cutting roller are parallel and consistent with the length direction of the material. It further includes a sensor group, and based on the sensor group, the slope of the first cutting line on each cutting roller is determined. The step of determining the position of the first cutting line on each cutting roller based on the sensor group includes: The sensor group measures the third distance value of the first cutting line on the first cutting roller. The sensor group determines the fourth distance value of the first cutting line on the second cutting roller, and the fourth distance value is equal to the sum of the third distance value and a first preset value. The sensor group confirms the fifth distance value of the first cutting line on the third cutting roller, and the fifth distance value is equal to the sum of the third distance value and a second preset value. Wherein, the second preset value is greater than the first preset value.

5. The cutting device according to claim 4, wherein In the height direction, the first cutting roller and the third cutting roller are disposed above the second cutting roller, and in the width direction, the second cutting roller is disposed between the first cutting roller and the third cutting roller.

6. The cutting device according to claim 5, wherein, It further includes a sensor group, and the sensor group includes a fourth distance sensor, a fifth distance sensor, and a sixth distance sensor, and the fourth distance sensor, the fifth distance sensor, and the sixth distance sensor are all disposed on the same side where the first distance sensor is located. The fourth distance sensor is disposed along the axis direction of the first cutting roller for detecting the position of the first cutting line on the first cutting roller. The fifth distance sensor is disposed along the axis direction of the second cutting roller for detecting the position of the first cutting line on the second cutting roller. The sixth distance sensor is disposed along the axis direction of the third cutting roller for detecting the position of the first cutting line on the third cutting roller.

7. The dicing device according to any one of claims 4 to 6, for dicing a semiconductor wafer, characterized in that, The semiconductor wafer is one of silicon, silicon carbide, germanium, and sapphire.

8. A method for cutting a semiconductor wafer, comprising using the cutting line positioning method according to any one of claims 1 to 3, characterized in that, The semiconductor wafer is one of silicon, silicon carbide, germanium, and sapphire.

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