A patch device production method, apparatus and system

Abstract

This invention discloses a method, apparatus, and system for manufacturing surface mount technology (SMT) equipment, belonging to the field of SMT equipment manufacturing. First, a digital capability model (DMV) for the equipment is determined based on historical orders. Then, it is determined whether the order production in the daily production plan matches the DMV. If they match, production is directly carried out according to the DMV. Based on historical orders, the feeder positions for each material and the module positions for each product can be determined. Then, the positions of the modules for the most frequently used products are determined, and the feeder positions are fixed. In this way, the equipment and materials corresponding to the DMV are bound together. During production, the fixed feeders do not need to be readjusted; only the positions of other feeders need to be adjusted. This reduces the number of feeders that need manual adjustment, saves time spent adjusting feeder positions, and improves production changeover efficiency.

Description

Technical Field

[0001] This invention relates to the field of surface mount technology (SMT) equipment manufacturing, and more particularly to a method, apparatus, and system for manufacturing SMT equipment. Background Technology

[0002] The production process of home appliance control boards mainly consists of three parts: surface mount technology (SMT), self-insertion, and assembly. The main task of the SMT process is to automatically assemble small electronic components, such as resistors, onto a PCB board using multiple module machines on a production line (the number of modules can be adjusted). Each workshop completes this process through multiple production steps, each with its own specific function, and all steps are interconnected and indispensable.

[0003] For a long time, the front-end surface mount technology (SMT) production process has been a bottleneck, because the instability of the SMT process makes it impossible to guarantee the production of subsequent processes. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the present invention provides a method, apparatus and system for manufacturing surface mount technology (SMT) equipment, so as to solve the problem that the production of subsequent processes cannot be guaranteed due to the instability of the SMT process.

[0005] The technical solution adopted by this invention to solve its technical problem is:

[0006] In a first aspect, a method for manufacturing a surface mount device is provided, comprising the following steps:

[0007] The equipment digital capability model is determined based on historical orders. The equipment and materials corresponding to the equipment digital capability model are bound together to locate the modules and fix the feeders.

[0008] Determine whether the order production plan in the daily production schedule for the arrowhead assembly line matches the digital capability model of the equipment.

[0009] If a match is found, production will proceed according to the device's digital capability model.

[0010] Furthermore, it also includes:

[0011] If there is a mismatch, update the device's digital capability model;

[0012] Production is based on the updated equipment digital capability model.

[0013] Furthermore, it also includes:

[0014] Obtain EPR pre-scheduled orders;

[0015] Determine whether the EPR pre-scheduled order matches the equipment digital capability model;

[0016] If there is a mismatch, the workshop line will be reorganized, and the equipment digital capability model will be updated after the ERP pre-scheduled orders form a daily plan for the production line.

[0017] Furthermore, the EPR pre-scheduling order includes the product type, product manufacturing process, and product structure to be produced; the step of determining whether the EPR pre-scheduling order matches the equipment digital capability model includes:

[0018] Based on whether the digital capability model of the equipment meets the requirements of the product type, product manufacturing process, and product structure for pre-production;

[0019] If the conditions are met, it is determined that the EPR pre-scheduled order matches the equipment digital capability model; if the conditions are not met, it is determined that the EPR pre-scheduled order does not match the equipment digital capability model.

[0020] Furthermore, the reorganization of the workshop production line includes any one or a combination of the following methods:

[0021] Feida station;

[0022] Module positioning;

[0023] Equipment restructuring;

[0024] Line recombination.

[0025] Furthermore, the step of determining the equipment digital capability model based on historical orders includes:

[0026] Determine the number of modules and feeders required for each historical order;

[0027] Obtain the module utilization rate of the number of modules for each production line; and determine the module positioning rate based on the maximum module utilization rate;

[0028] Obtain the material utilization rate of all materials required for all historical orders, and determine the stationing rate of feeders based on the utilization rate of different materials;

[0029] By determining the positioning rate of different module quantities and the stationing rate of the corresponding feeder quantities, the equipment and materials are bound together to obtain the equipment digital capability model.

[0030] Furthermore, the determination of whether the order production in the daily production plan matches the equipment digital capability model includes:

[0031] Based on the process type of the orders in the daily plan for sorting and setting up production lines, sorting and setting up production lines are carried out according to the process type;

[0032] After determining the number of production bottlenecks in the digital capability model of the equipment and the order production volume in the daily plan of the arrowhead sorting and production line;

[0033] The production time is determined based on the number of production bottlenecks and the order production volume.

[0034] Determine whether the delivery deadline is met based on the production time;

[0035] If the requirements are not met, the arrowhead alignment will be redone.

[0036] Furthermore, the determination of the number of production bottlenecks in the equipment digital capability model after the arrowhead division and line setting includes:

[0037] Obtain the production parameters of the equipment associated with the digital capability model of the equipment; the production parameters include the number of prints per hour of the printing press, the number of boards that pass through reflow soldering per hour, the number of PCB boards inspected per hour by AOI inspection, and the chip mounting efficiency;

[0038] The minimum value among the following four factors is taken as the production bottleneck quantity: the number of prints per hour by the printing press, the number of boards that pass through reflow soldering per hour, the number of PCBs inspected per hour by AOI inspection, and the chip placement efficiency.

[0039] Furthermore, it also includes:

[0040] Obtain the similarity of products with the same arrowhead after the arrowheads are sorted and aligned;

[0041] The order production sequence is adjusted based on the similarity and a preset fixed coefficient.

[0042] Secondly, a chip mounting equipment manufacturing apparatus is provided, comprising:

[0043] The model building module is used to determine the equipment digital capability model based on historical orders, and the equipment and materials corresponding to the equipment digital capability model are bound together.

[0044] The matching and judgment module is used to determine whether the order production in the daily plan for segmentation and setting of production lines matches the digital capability model of the equipment.

[0045] The product manufacturing module is used to produce according to the digital capability model of the equipment if a match is found.

[0046] Thirdly, a chip mounting equipment production system is provided, comprising:

[0047] processor;

[0048] Memory used to store the processor's executable instructions;

[0049] The processor is configured to perform the method described in any one of the technical solutions provided in the first aspect.

[0050] Beneficial effects:

[0051] This invention provides a method, apparatus, and system for manufacturing surface mount technology (SMT) equipment. First, a digital capability model (DMV) for the equipment is determined based on historical orders. Then, it is determined whether the daily production plan for the assembly line matches the DMV. If they match, production is directly carried out according to the DMV. Based on historical orders, the feeder positions for each type of material and the module positions for each product can be determined. Then, the positions of the modules for the most frequently used products are determined, and the feeder positions are fixed. In this way, the equipment and materials corresponding to the DMV are bound together. During production, the fixed feeders do not need to be readjusted; only the positions of other feeders need to be adjusted. This reduces the number of feeders that need manual adjustment, saves time spent adjusting feeder positions, and improves production changeover efficiency. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 This is a flowchart of a chip mounting equipment manufacturing method provided in an embodiment of the present invention;

[0054] Figure 2 This is a flowchart of a specific chip mounting equipment manufacturing method provided in an embodiment of the present invention;

[0055] Figure 3 This is a schematic diagram of a chip bonding equipment production device provided in an embodiment of the present invention. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of the present invention will be described in detail below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0057] The first embodiment, referred to Figure 1 This invention provides a method for manufacturing a surface mount device, comprising the following steps:

[0058] S11: Determine the equipment digital capability model based on historical orders. The corresponding equipment and materials in the equipment digital capability model are bound to the module for positioning and the feeder for stationing.

[0059] S12: Determine whether the order production plan in the daily plan for arrowhead setting matches the equipment digital capacity model;

[0060] S13: If matched, production will proceed according to the equipment's digital capability model.

[0061] The surface mount equipment production method provided in this invention first determines the equipment's digital capability model based on historical orders, and then determines whether the order production in the daily plan for part numbering matches the equipment's digital capability model; if they match, production is directly carried out according to the equipment's digital capability model. Based on historical orders, the feeder positions for each type of material and the module positions for each product can be determined; then, the positions of the modules for the most frequently used products are determined, and the feeder positions are fixed. In this way, the equipment and materials corresponding to the equipment's digital capability model are bound together. During production, the fixed feeders do not need to be readjusted; only the positions of other feeders need to be adjusted, reducing the number of feeders that need manual adjustment and saving time spent adjusting feeder positions, thus improving production changeover efficiency.

[0062] It should be noted that a production line may have multiple modules, each module may have multiple feeders, and each feeder can only carry one type of material. The instability in the surface mount technology (SMT) process stems from the complex production model, reliance on manual experience, and insufficient information technology, primarily resulting in the following problems:

[0063] 1. Long equipment changeover time: When changing production orders, the controller models between orders are different, so the material codes on the feeders of the modules need to be changed. The frequency of feeder material switching depends heavily on the work experience of the employees. Experienced employees can quickly locate the position where the feeder needs to be switched. Due to the difference in experience among different material handlers, the frequency of material switching on different production lines varies greatly, which ultimately limits the overall output of the chip assembly line and has a great deal of uncertainty.

[0064] 2. Mismatch between order plan and equipment capacity: Equipment modules were not installed after sufficient analysis and verification, resulting in a surplus of modules on the production line. This causes a mismatch between product production and equipment, wasting time during production by handling the surplus modules. This wasted time increases with a large order volume, reducing overall capacity. Furthermore, different production lines have varying parameters such as reflow soldering configurations, AOI configurations, and process flows for surface mount equipment. Some orders are not placed on the most suitable equipment, preventing full capacity utilization.

[0065] 3. Repetitive work leads to labor waste: Equipment material switching only meets the production needs of the current chip placement line and does not consider the subsequent planned needs. There may be a situation where a certain material is needed in the current production order batch, but needs to be replaced when switching to the next order batch. After production is completed and the next order batch is switched, the material code needs to be changed back. There will be the problem of replacing the same material multiple times, resulting in wasted actions.

[0066] 4. Inconsistent placement of general materials: Due to frequent product changes, some materials may be general materials for the current shift, meaning they are used in many orders. Frequent switching of general materials on the feeder not only results in wasted effort but also in significant waste of production capacity.

[0067] In a second embodiment, the present invention provides a specific method for manufacturing a surface mount device, such as... Figure 2 As shown:

[0068] This invention primarily focuses on the digital analysis of the SMT (Surface Mount Technology) assembly process, collecting information to achieve more efficient production. By calculating and determining the common materials for each SMT assembly line, the frequent switching of employees to the same materials can be significantly reduced, thereby minimizing employee changes and time, and greatly improving production efficiency. Through the collection of equipment information and analysis of production orders, orders can be assigned to specific modules, arranging suitable module production lines for order production. The process is as follows:

[0069] By analyzing historical orders, the required material quantity and usage frequency of each order can be determined, and these frequencies can be sorted. By analyzing the material information of all orders, the required number of modules and feeders for each order can be determined. Next, the utilization rate of modules on each production line can be calculated, such as the percentage of orders using 4 modules versus 6 modules. The distribution of utilization rates for different module quantities over a specific time period can be analyzed, allowing for the determination of the maximum required number of modules. This determination indirectly determines the number of feeders needed. By analyzing the materials required for each order, the utilization rate of different materials can be determined. Then, the fixed positions of the materials on the feeders over a specific time period can be determined, sorted by usage frequency, and a threshold is used to limit the fixed position rate of the feeders from high to low. By determining the positioning rate of different module quantities and the corresponding fixed position rate of the feeder quantity, the equipment and material binding function can be implemented.

[0070] By collecting data on equipment capacity, the number of PCBs printed per hour by the printer, the number of boards reflowed per hour by the reflow soldering machine, the number of PCBs inspected per hour by the AOI inspection machine, and the placement efficiency, the minimum value of the equipment can be obtained by calculating F(x)min = {printer printing quantity / h, reflow soldering quantity / h, AOI inspection quantity / h, placement quantity / h}. This allows us to determine the bottleneck number of the equipment, i.e., the minimum number of PCBs that can be produced per hour. This data is used to prepare data for the next stage. Simultaneously, the equipment's process type, whether it is red glue / solder paste, is collected as a basis for line allocation based on the order's process type during the sorting and assignment process. Collecting the equipment's priority board count and corresponding process type parameters (AS, SA, SAS, etc.) can also help determine which line an order should be assigned to based on the order quantity and its process flow during the sorting and assignment process.

[0071] In the second phase, the first step is to establish production lines for each arrowhead, prioritizing fulfilling the daily production schedule. If an order fails to meet its delivery deadline, the production line must be re-established. Orders that do not meet their delivery deadlines will be either moved to an earlier production line or reassigned to another line. After ensuring the delivery deadline is met, the availability of materials, PCB board versions, and picking procedures are verified. By identifying bottlenecks in equipment production, the order's process type, relevant UPH (upper usage times), and the similarity of corresponding arrowhead products, the production sequence is determined. Deviations from the existing schedule are addressed, feedback is provided, and the daily plan is adjusted accordingly. This process of re-establishing the daily production line for arrowheads is then repeated.

[0072] In the next step, during the equipment stationing iteration, the matching degree between the order and the equipment is determined. If the order and the equipment match, no changes are needed. The quantity of materials in the order is counted. If the calculated result does not match the number of modules and feeders in the equipment, the quantity of modules needs to be modified accordingly, the number of feeder stations needs to be changed simultaneously, and the digital capability model of the corresponding production line equipment needs to be updated simultaneously.

[0073] After updating the digital capability model of the equipment, the product type, production process, and structure are determined during the ERP pre-order scheduling process. These factors are then matched with the equipment. If a match is found, the ERP pre-order scheduling process is completed. If a mismatch occurs, the quantity of modules and feeders needs to be adjusted, requiring equipment reorganization, replacement of modules and feeders, and reorganization of the production line. Ultimately, a decision on predictive equipment reorganization is made.

[0074] Fixed position analysis of order materials

[0075] By collecting pre-production order information from the EPR system (pre-production orders correspond to future production plans, such as for new products), information on SMT production orders can be obtained. Based on the controller code information of the order, the BOM detailed code can be obtained through the BAAN6 system. Then, the service process calculates the sum of the codes, sorts them by frequency of use from high to low, and determines the commonly used material codes as the basis for fixed station positions.

[0076] Digital modeling function for equipment capability parameters

[0077] The equipment configuration is sorted out, and the equipment capabilities are quantified digitally through modeling. Data matching is performed between capability values ​​and order requirements, including equipment model, number of modules, associated equipment (reflow soldering configuration, AOI configuration), process type, process flow, number of points, number of boards, and equipment status. The data is stored in the server database for easy storage and retrieval.

[0078] Equipment module positioning function development

[0079] Based on order scheduling information, and simultaneously collecting equipment module information, we bind product differentiation features and use software algorithms to provide module positioning solutions that maximize production efficiency and optimize station configuration.

[0080] The following example illustrates this: A certain surface mount equipment needs to produce four types of products, A, B, C, and D, on a certain date. There are a total of 10 materials for these four product types, as shown in Table 1.

[0081]

[0082]

[0083] Table 1

[0084] 1) First, determine the equipment module positioning (i.e., the location and quantity. For example, if each module contains 4 feeders, then 3 modules are needed to satisfy 4*3=12>10) and the module ratio (120%~150%).

[0085] 2) The next step is to determine the feeder station location for the equipment module. As shown in the diagram above, materials a, b, and c are common to all products, so their feeder positions are fixed. If the equipment digital capability model has already fixed materials a, b, and c, the model will not be updated; otherwise, it will be updated. Materials e, f, and d are common to three of the product types (75%), so their feeder positions are relatively fixed, fixed according to the product type ratio. Materials gh and gh are common to two product types (50%), so their feeder positions are relatively flexible. Materials ij and ij are materials specific to a single product (25%), so their feeder positions are flexible and not fixed. All four cases are compared with the equipment digital capability model. If the results differ, the material positions on the module and feeder are adjusted, and the new equipment digital capability model is updated. The fixing coefficient varies depending on the product and its differences.

[0086] The fixed coefficient for commercial air conditioning products is 0.85. The fixed coefficient for residential air conditioning products is 0.7.

[0087] PS: Product similarity: Comparison of BOM details between products.

[0088] When the similarity of products with the same arrowhead after segmentation and alignment is greater than a fixed coefficient, it indicates that the equipment's digital capability model meets the production requirements of that product. Production of that product will be prioritized to avoid readjusting module positioning and feeder stationing. This reduces the number of manual adjustments and improves the production efficiency of the chip mounter.

[0089] The production method provided in this invention collects a large amount of equipment data, including all production order information and equipment information for each production line. Through software algorithms, it calculates in real-time the production mode of intelligent stationing for orders and equipment. By analyzing the orders for each shift, a third-party interface obtains the BOM details corresponding to all controller codes in real-time, acquiring all material codes. Based on the frequency of material codes (i.e., those with higher frequency are produced first to avoid changing feeder positions), the method prioritizes the positioning of the material corresponding to the current feeder. Positioning common materials reduces the frequency of material changes by employees, thereby reducing changeover time, shortening line changeover time, and improving production efficiency.

[0090] By designing this new SMT production model and fixing the common materials for the current shift on the feeder, material changeover time during order switching can be shortened, thus improving production efficiency. Secondly, it automatically generates the corresponding information for each module's materials in the SMT assembly production program, reducing employee data entry time and errors, while also improving production efficiency. Furthermore, all data is stored on the server, allowing for timely viewing and export of data for later traceability.

[0091] In a third embodiment, the present invention provides a chip mounting equipment production apparatus, such as... Figure 3 As shown, it includes:

[0092] The model building module 31 is used to determine the equipment digital capability model based on historical orders. The equipment and materials corresponding to the equipment digital capability model are bound together to locate the modules and position the feeders. Specifically, it determines the number of modules and feeders required for each historical order; obtains the module utilization rate of the number of modules for each production line; and determines the module positioning rate based on the maximum module utilization rate; obtains the material utilization rate of the materials required for all historical orders, and determines the feeder positioning rate based on the utilization rate of different materials; and obtains the equipment digital capability model by binding the equipment and materials together by determining the positioning rate of different module quantities and the positioning rate of the corresponding feeder quantities.

[0093] The matching and judgment module 32 is used to determine whether the order production plan in the daily plan for segmentation and line setting matches the equipment digital capability model. Specifically, it performs segmentation and line setting based on the process type of the orders in the daily plan for segmentation and line setting; it determines the number of production bottlenecks in the equipment digital capability model after segmentation and line setting, as well as the order production volume in the daily plan for segmentation and line setting; it obtains the production time based on the number of production bottlenecks and the order production volume; it determines whether the delivery date is met based on the production time; if not, it performs segmentation and line setting again.

[0094] Product production module 33 is used to produce according to the equipment's digital capability model if a match is found. In addition, product production module 33 obtains the similarity of products with the same arrowhead after the arrowhead is sorted and set up; and adjusts the order production sequence according to the similarity and a preset fixed coefficient.

[0095] It also includes a model update and reorganization module 34, used to update the equipment digital capability model if there is a mismatch, so that the product production module 33 can produce according to the updated equipment digital capability model. It also acquires EPR pre-scheduled orders; determines whether the EPR pre-scheduled orders match the equipment digital capability model; if they do not match, the model update and reorganization module 44 reorganizes the workshop line according to the EPR pre-scheduled orders, and updates the equipment digital capability model after the ERP pre-scheduled orders form a daily production plan. That is, this embodiment of the invention not only updates the equipment digital capability model according to existing products, but also reorganizes the workshop line according to future new products, and updates the equipment digital capability model after the ERP pre-scheduled orders form a daily production plan. This facilitates the direct use of the reorganized and updated equipment digital capability model for production when arranging production for new products. It is convenient and quick, requires no reconfiguration, and greatly improves production efficiency.

[0096] Specifically, the EPR pre-scheduling order includes the product type, product manufacturing process, and product structure of the pre-production order. Determining whether the EPR pre-scheduling order matches the equipment digital capability model includes: checking whether the equipment digital capability model meets the pre-production product type, product manufacturing process, and product structure; if it does, then the EPR pre-scheduling order matches the equipment digital capability model; if it does not, then the EPR pre-scheduling order does not match the equipment digital capability model. Based on the EPR pre-scheduling order, the workshop production line is reorganized, including any one or a combination of the following methods:

[0097] Feeder station positioning; module positioning; equipment reconfiguration; production line reconfiguration.

[0098] The surface mount equipment production apparatus provided in this embodiment of the invention includes a model building module that determines the equipment digital capability model based on historical orders, binding the corresponding equipment and materials in the equipment digital capability model; a matching judgment module that determines whether the order production in the daily plan for segmentation and line setting matches the equipment digital capability model; and a product production module that, if matched, performs production according to the equipment digital capability model. A model update and reorganization module updates or reorganizes the equipment digital capability model. The production apparatus provided in this embodiment of the invention determines the equipment digital capability model based on historical orders, and then determines whether the order production in the daily plan for segmentation and line setting matches the equipment digital capability model; if matched, production is directly performed according to the equipment digital capability model. Based on historical orders, the feeder positions for each type of material and the module positions for each product during production can be determined; then, the positions of the modules for the most frequently used products are determined, and the feeder positions are fixed. In this way, the equipment and materials corresponding to the equipment digital capability model are bound together. During production, the fixed feeders do not need to be readjusted; only the positions of other feeders need to be adjusted, reducing the number of feeders that need manual adjustment, saving time in adjusting feeder positions, and improving production changeover efficiency.

[0099] Fourth embodiment: The present invention provides a chip mounting equipment production system, comprising:

[0100] processor;

[0101] Memory used to store processor-executable instructions;

[0102] The processor is configured to perform the patch manufacturing method provided in the first or second embodiment.

[0103] The surface mount equipment production system provided in this invention stores executable instructions for the processor in a memory. When the processor executes these instructions, it can determine the equipment digital capability model based on historical orders, and then determine whether the order production in the daily production plan matches the equipment digital capability model. If they match, production is directly carried out according to the equipment digital capability model. Based on historical orders, the feeder positions for each type of material and the module positions for each product can be determined. Then, the positions of the modules for the products with the highest usage rate are determined, and the feeder positions are fixed. In this way, the equipment and materials corresponding to the equipment digital capability model are bound together. During production, the fixed feeders do not need to be readjusted; only the positions of other feeders need to be adjusted. This reduces the number of feeders that need to be manually adjusted, saves time in adjusting equipment feeder positions, and improves production changeover efficiency.

[0104] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0105] It should be noted that in the description of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means at least two.

[0106] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the function involved, as will be understood by those skilled in the art to which embodiments of this application pertain.

[0107] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0108] Those skilled in the art will understand that all or part of the steps of the methods described in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it includes one or a combination of the steps of the method embodiments.

[0109] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0110] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.

[0111] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0112] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A method for manufacturing a surface mount device, characterized in that, Includes the following steps: The equipment digital capability model is determined based on historical orders. The equipment and materials corresponding to this model are then bound together to locate modules and position feeders. This process includes: determining the number of modules and feeders required for each historical order; obtaining the module utilization rate for each production line; determining the module positioning rate based on the maximum module utilization rate; obtaining the material utilization rate for all materials required for all historical orders; and determining the feeder positioning rate based on the utilization rates of different materials. By determining the positioning rates for different module quantities and the corresponding feeder positioning rates, the equipment and materials are bound together to obtain the equipment digital capability model. Determine whether the order production plan in the daily production schedule for the arrowhead assembly line matches the digital capability model of the equipment. If a match is found, production will proceed according to the device's digital capability model.

2. The method according to claim 1, characterized in that, Also includes: If there is a mismatch, update the device's digital capability model; Production is based on the updated equipment digital capability model.

3. The method according to claim 1, characterized in that, Also includes: Obtain EPR pre-scheduled orders; Determine whether the EPR pre-scheduled order matches the equipment digital capability model; If there is a mismatch, the workshop line will be reorganized, and the equipment digital capability model will be updated after the ERP pre-scheduled orders form a daily plan for the production line.

4. The method according to claim 3, characterized in that: The EPR pre-scheduling order includes the product type, product manufacturing process, and product structure to be produced; determining whether the EPR pre-scheduling order matches the equipment digital capability model includes: Based on whether the digital capability model of the equipment meets the requirements of the product type, product manufacturing process, and product structure for pre-production; If the conditions are met, it is determined that the EPR pre-scheduled order matches the equipment digital capability model; if the conditions are not met, it is determined that the EPR pre-scheduled order does not match the equipment digital capability model.

5. The method according to claim 3, characterized in that: The reorganization of the workshop production line includes any one or a combination of the following methods: Feida fixed station; Module positioning; Equipment restructuring; Line recombination.

6. The method according to claim 1, characterized in that: The determination of whether the order production in the daily production plan matches the equipment digital capability model includes: Based on the process type of the orders in the daily plan for sorting and setting up production lines, sorting and setting up production lines are carried out according to the process type; After determining the number of production bottlenecks in the digital capability model of the equipment and the order production volume in the daily plan of the arrowhead sorting and production line; The production time is determined based on the number of production bottlenecks and the order production volume. Determine whether the delivery deadline is met based on the production time; If the requirements are not met, the arrowhead alignment will be redone.

7. The method according to claim 6, characterized in that: The number of production bottlenecks in the equipment digital capability model after determining the arrowhead layout includes: Obtain the production parameters of the equipment associated with the digital capability model of the equipment; the production parameters include the number of prints per hour of the printing press, the number of boards that pass through reflow soldering per hour, the number of PCB boards inspected per hour by AOI inspection, and the chip mounting efficiency; The minimum value among the following four factors is taken as the production bottleneck quantity: the number of prints per hour by the printing press, the number of boards that pass through reflow soldering per hour, the number of PCBs inspected per hour by AOI inspection, and the chip placement efficiency.

8. The method according to claim 6, characterized in that, Also includes: Obtain the similarity of products with the same arrowhead after the arrowheads are sorted and aligned; The order production sequence is adjusted based on the similarity and a preset fixed coefficient.

9. A chip mounting equipment production apparatus, characterized in that, include: The model building module is used to determine the equipment digital capability model based on historical orders, and the equipment and materials corresponding to the equipment digital capability model are bound together. Specifically, it is used to determine the number of modules and feeders required for each historical order; and to obtain the module utilization rate for each production line. The positioning rate of the module is determined based on the maximum module utilization rate; the material utilization rate of all historical orders is obtained, and the stationing rate of the feeder is determined based on the utilization rate of different materials. By determining the positioning rate of different module quantities and the stationing rate of the corresponding feeder quantities, the equipment and materials are bound together to obtain the equipment digital capability model; The matching and judgment module is used to determine whether the order production in the daily plan for segmentation and setting of production lines matches the digital capability model of the equipment. The product manufacturing module is used to produce according to the digital capability model of the equipment if a match is found.

10. A surface mount equipment production system, characterized in that, include: processor; Memory used to store the processor's executable instructions; The processor is configured to perform the method according to any one of claims 1-8.

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