A method and system for realizing multi-mode and multi-position detection of wafer

Abstract

The present invention discloses a method and system for realizing multi-mode and multi-position combined measurement of wafers, including: S1, using a line scanning imaging detection system based on scanning operation to perform line scanning imaging detection at a measurement position on the same wafer and using a planar array imaging detection system based on stepping motion to perform planar array imaging detection at another parallel measurement position; S2, making the operating platform repeatedly operate in a periodic manner in the form of acceleration-uniform speed-deceleration-stationary, and in the uniform speed motion section, the line scanning imaging detection system works; in the stationary motion section, the planar array imaging detection system works; S3, in one or more reciprocating motions of the operating platform, the line scanning imaging detection system traverses all the wafer to-be-measured areas on the scanning path, and at the same time, the planar array imaging detection system traverses all the wafer to-be-measured areas on the stepping path. The present invention uses a hybrid detection motion control method to meet the joint measurement requirements of the new process for multi-modal detection / measurement of equipment.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection process equipment, and in particular to a method and system for wafer multi-mode and multi-position detection. Background Art

[0002] The development of semiconductors and materials science has led to increasingly unique requirements for material property characterization and defect detection, presenting new requirements for high precision, specialization, and multi-parameter correlation.

[0003] More and more new materials and new processes require multi-mode detection / measurement on the equipment to achieve process monitoring of the samples to be tested and device yield detection.

[0004] Traditional semiconductor wafer inspection equipment is independent, with one machine basically completing the measurement or inspection of a process flow or device inspection for one physical parameter to be inspected or one type of defect object.

[0005] Existing equipment either uses scanning mode or stepper mode. Scanning mode is continuous imaging during the uniform linear motion of the moving stage, while stepper mode is imaging or optical measurement when the wafer is stationary. Currently, the two cannot be used in combination in wafer inspection, and their respective measurement advantages cannot be brought into play. Summary of the invention

[0006] The object of the present invention is to provide a method and system for realizing multi-mode and multi-position detection of wafers, which uses a hybrid detection motion control method to meet the joint measurement requirements of new processes for multi-modal detection / measurement on equipment.

[0007] To this end, the present invention provides, on one hand, a method for realizing multi-mode and multi-position combined measurement of wafers, comprising: S1, using a line scanning imaging detection system based on scanning operation to perform line scanning imaging detection at a measurement position on the same wafer, and using an area array imaging detection system based on stepping motion to perform area array imaging detection at another parallel measurement position; S2, allowing the operating platform to repeatedly operate in a periodic manner in the form of acceleration-uniform speed-deceleration-stationary, in which the line scanning imaging detection system works and collects data in the uniform speed motion section, and does not collect data in other time periods; in the stationary motion section, the area array imaging detection system works and collects data, and does not collect data in other time periods; S3, in one or more reciprocating motions of the moving platform, the line scanning imaging detection system traverses all wafer areas to be measured on the scanning path, and at the same time, the area array imaging detection system traverses all wafer areas to be measured on the stepping path; S4, executing the above step S3 once after the moving platform is translated for a certain distance in the vertical direction of the reciprocating motion, until all wafer positions have undergone line scanning imaging detection and area array imaging detection in sequence.

[0008] According to another aspect of the present invention, a system for realizing multi-mode and multi-position detection of wafers is provided, comprising a motion stage for carrying chips, and also comprising: a line scanning imaging detection system based on scanning operation arranged at a measurement position of the wafer, and an area array imaging detection system based on stepping motion arranged at another parallel measurement position of the same wafer, wherein the motion stage repeatedly operates in a periodic manner of acceleration-uniform speed-deceleration-stationary, wherein in the uniform speed motion section, the line scanning imaging detection system operates and collects data, and does not collect data in other time periods; in the stationary motion section, the area array imaging detection system operates and collects data, and does not collect data in other time periods; No data is collected during the time period, wherein, when the moving platform reciprocates once or multiple times, the line scanning imaging detection system traverses all the wafer areas to be tested on the scanning path, and at the same time, the area array imaging detection system traverses all the wafer areas to be tested on the stepping path, wherein, after the moving platform is translated for a distance in the vertical direction of the reciprocating motion, the area of ​​the wafer that has been detected on the stepping path is moved to the scanning path for line scanning imaging detection, or the area of ​​the wafer that has been detected on the segmented scanning path is moved to the stepping path for area array imaging detection, thereby realizing multi-position and multi-mode detection of the wafer.

[0009] The present invention proposes a new method to meet the advanced requirements of detection and measurement, that is, a method of using hybrid detection motion control to achieve multi-mode and multi-position measurement of wafer garden detection, which programmatically combines the scanning scanning mode and the stepper-type detection method. This detection method has the following technical advantages / effects:

[0010] 1. It has the advantages of matching two sports modes;

[0011] 2. Improve measurement speed;

[0012] 3. Reduce the overall equipment use cost;

[0013] 4. Meet the new requirements of joint measurement of multi-mode detection / measurement now and in the future.

[0014] In addition to the above-described purposes, features and advantages, the present invention has other purposes, features and advantages. The present invention will be further described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0016] Figure 1is a flow chart of a method for realizing multi-mode and multi-position detection of wafers according to the present invention;

[0017] Figure 2 is a schematic diagram of a detection system according to Embodiment 1 of the present invention;

[0018] Figure 3 is a schematic diagram of a detection area corresponding to the detection system of the first embodiment of the present invention;

[0019] Figure 4 It is the timing relationship of the measurement process of the detection system of the present invention when not in motion;

[0020] Figure 5 is a schematic diagram of a detection system according to a second embodiment of the present invention;

[0021] Figure 6 It is a schematic diagram of the detection area corresponding to the detection system of the second embodiment of the present invention. DETAILED DESCRIPTION

[0022] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] Traditional "stand-alone" semiconductor wafer inspection equipment is basically a machine that completes a process flow or device inspection to measure or inspect a physical parameter to be inspected or a type of defect object. The equipment either uses scanning mode (scanning) or stepper mode (stepper).

[0024] The present invention proposes a method for realizing multi-mode and multi-position detection of a wafer by using hybrid detection motion control, which is a detection method combining scanning mode (scanning) and stepper mode (stepper) in a programmed manner.

[0025] Figure 1 is a flow chart of a method for realizing multi-mode and multi-position detection of wafers according to the present invention, such as Figure 1 As shown, the method includes steps S1-S4.

[0026] S1. Perform line scanning imaging detection at a measurement position on the same wafer using a line scanning imaging detection system based on scanning operation and perform area array imaging detection at another parallel measurement position using an area array imaging detection system based on stepping motion.

[0027] S2. The operating platform is made to repeatedly operate in the form of acceleration-uniform speed-deceleration-stationary. In the uniform speed motion segment, the line scanning imaging detection system works to collect data, and does not collect data in other time periods; in the stationary motion segment, the area array imaging detection system works to collect data, and does not collect data in other time periods.

[0028] S3. When the moving table reciprocates once or multiple times, the line scanning imaging detection system traverses all the wafer areas to be tested on the segmented scanning path, and at the same time, the area array imaging detection system traverses all the wafer areas to be tested on the stepping path.

[0029] S4, move the moving table in the vertical direction of the reciprocating motion, so that the area of ​​the wafer that has been detected on the stepping path is moved to the segmented scanning path, or the area of ​​the wafer that has been detected on the segmented scanning path is moved to the stepping path, and repeat the above step S3 to realize multi-position and multi-mode detection of the wafer.

[0030] By repeatedly executing the above step S4, multi-position and multi-mode detection of the entire wafer area can be achieved.

[0031] The following takes the orthogonal XY motion system as an example and combines the motion mode to explain the illumination and detection process of the detection method.

[0032] Embodiment 1

[0033] Figure 2 is a schematic diagram of the detection system. Figure 3 It is a distribution diagram of the detection area. Figure 4 The timing relationship of the measurement process of the detection system when it is not in motion is shown.

[0034] Combined with reference Figures 1 to 3 The detection system includes both a line scanning imaging detection system based on scanning motion with detector 1 as the core, and an area array imaging detection system based on stepping motion with detector 2 as the core.

[0035] The motion table moves in the form of "acceleration - constant speed - deceleration - stationary - acceleration...", and the motion mode is divided into two parts:

[0036] In the uniform motion section, imaging and measurement based on the scanning mode are realized to complete the detection and measurement of the uniform scanning area. In the acceleration and deceleration area motion period, the scanning detector 1 does not collect data.

[0037] When the moving stage is stationary, imaging and measurement based on the stepper mode can be realized at another measurement position different from the scanning measurement area. At a stationary measurement position, different lighting and imaging modes can be switched to complete multi-modal optical detection and measurement at the same point in sequence without interfering with each other.

[0038] After completing the imaging and measurement of the static array, the moving platform starts the next scanning movement and measurement.

[0039] On the segmented scanning path corresponding to detector 1, the uniform motion segment corresponds to the uniform scanning imaging area, the accelerated motion segment corresponds to the acceleration area, the decelerated motion segment corresponds to the deceleration area, and the uniform scanning imaging area N and the uniform scanning imaging area N+1 are separated by the acceleration area and the deceleration area. On the stepping path corresponding to detector 2, the stationary segment corresponds to the array imaging area.

[0040] The overall motion adopted by this detection method is segmented scanning + stepping. The relative position of the uniform scanning imaging area and the area array imaging area is determined by the structure of the measurement system and the coordinated optimization of the measurement speed.

[0041] In a single motion form, taking an orthogonal XY motion system as an example, preferably, the interval between two detection areas is N times the imaging length, N ≥ 1. The motion stage needs to reciprocate N times, N ≥ 1 to traverse the entire wafer area to be tested.

[0042] Embodiment 2

[0043] Combined with reference Figure 5 and Figure 6 The difference between this embodiment and the first embodiment is that two sets of line scanning imaging detection systems and two sets of area array imaging detection systems are integrated into the entire system, which are detectors 1 and 3 based on scanning motion imaging detection, and detectors 2 and 4 based on stepping motion area array imaging detection, and the two are arranged alternately.

[0044] The measurement modules of these two types of systems can be completely identical within the same category to achieve an overall improvement in measurement speed; or they can have different physical lighting and imaging modes to achieve multi-modal combined measurement.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for realizing multi-mode and multi-position detection of wafers, characterized in that: The following steps are involved: S1. Performing line scanning imaging detection using a line scanning imaging detection system based on scanning operation at a measurement position on the same wafer and performing area array imaging detection using an area array imaging detection system based on stepping motion at another parallel measurement position; S2, the operating platform is made to repeatedly operate in the form of acceleration-uniform speed-deceleration-stationary, in which the line scanning imaging detection system works to collect data in the uniform speed motion section, and does not collect data in other time periods; in the stationary motion section, the area array imaging detection system works to collect data, and does not collect data in other time periods; S3, when the moving stage reciprocates once or multiple times, the line scanning imaging detection system traverses all the wafer to-be-tested areas on the segmented scanning path, and at the same time, the area array imaging detection system traverses all the wafer to-be-tested areas on the stepping path; as well as S4, move the moving table in the vertical direction of the reciprocating motion, move the area of ​​the wafer that has been detected on the stepping path to the segmented scanning path, or move the area of ​​the wafer that has been detected on the segmented scanning path to the stepping path, repeat the above step S3 to achieve multi-position and multi-mode detection of the wafer.

2. The method for realizing multi-mode and multi-position detection of wafer according to claim 1, characterized in that: In the scanning path or stepping path, the interval between two adjacent detection areas is N times the imaging length, N ≥ 1, and the moving stage reciprocates N times to traverse the entire wafer test area on the scanning path and the stepping path.

3. The method for realizing multi-mode and multi-position detection of wafer according to claim 1, characterized in that: The imaging widths of two adjacent detection paths are the same, the interval between two adjacent detection paths is equal to M times the imaging width, M≥0, and the detection path is selected from a scanning path or a stepping path.

4. The method for realizing multi-mode and multi-position detection of wafer according to claim 1, characterized in that: One or more line scan imaging detection systems and one or more area array imaging detection systems are arranged at different measurement positions on the same wafer, wherein one group of line scan imaging detection systems works and collects data in a uniform motion segment; and one group of area array imaging detection systems works and collects data in a stationary motion segment.

5. The method for realizing multi-mode and multi-position detection of wafer according to claim 1, characterized in that: In similar detection systems, each system uses different physical lighting and imaging modes to achieve multi-modal combined measurement.

6. A system for realizing multi-mode and multi-position detection of wafers, comprising a moving stage for carrying chips, characterized in that: Also includes: A line scan imaging detection system based on scanning operation is set at a measurement position of the wafer, and an area array imaging detection system based on stepping motion is set at another parallel measurement position of the same wafer. The motion platform repeatedly operates in a cycle of acceleration-uniform speed-deceleration-stationary. In the uniform speed motion segment, the line scanning imaging detection system works to collect data, and does not collect data in other time periods; in the stationary motion segment, the area array imaging detection system works to collect data, and does not collect data in other time periods. Wherein, when the moving stage reciprocates once or multiple times, the line scanning imaging detection system traverses all the wafer to be tested areas on the scanning path, and at the same time, the area array imaging detection system traverses all the wafer to be tested areas on the stepping path. Among them, after the moving table is translated for a distance in the vertical direction of the reciprocating motion, the area of ​​the wafer that has been detected on the stepping path is moved to the scanning path for line scanning imaging detection, or the area of ​​the wafer that has been detected on the segmented scanning path is moved to the stepping path for area array imaging detection, thereby realizing multi-position and multi-mode detection of the wafer.

7. The system for realizing multi-mode and multi-position detection of wafer according to claim 6, characterized in that: In the scanning path or stepping path, the interval between two adjacent detection areas is N times the imaging length, N ≥ 1, and the moving stage reciprocates N times to traverse the entire wafer test area on the scanning path and the stepping path.

8. The system for realizing multi-mode and multi-position detection of wafer according to claim 6, characterized in that: The imaging widths of two adjacent detection paths are the same, the interval between two adjacent detection paths is equal to M times the imaging width, M≥0, and the detection path is selected from a scanning path or a stepping path.

9. The system for realizing multi-mode and multi-position detection of wafer according to claim 6, characterized in that: One or more line scan imaging detection systems and one or more area array imaging detection systems are arranged at different measurement positions on the same wafer, wherein one group of line scan imaging detection systems works and collects data in a uniform motion segment, and one group of area array imaging detection systems works and collects data in a stationary motion segment.

10. The system for realizing multi-mode and multi-position detection of wafer according to claim 6, characterized in that: In similar detection systems, each system uses different physical lighting and imaging modes to achieve multi-modal combined measurement.

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