LED chip transfer method and transfer device

Abstract

The application discloses an LED chip transfer method and a transfer device. The LED chip transfer method comprises the following steps: providing an output substrate, the output substrate is provided with a plurality of LED chips, the distance between two adjacent LED chips in the same row in a first direction is a first preset distance, and the distance between two adjacent LED chips in the same column in a second direction is a second preset distance. The LED chips are transferred from the output substrate to a first transfer substrate, the distance between two adjacent LED chips in the same row in the first direction is a third preset distance. The LED chips are transferred from the first transfer substrate to a second transfer substrate, the distance between two adjacent LED chips in the same column in the second direction is a fourth preset distance. The LED chips are transferred from the second transfer substrate to a target substrate, the distance between two adjacent LED chips in the same row in the first direction is the third preset distance, and the distance between two adjacent LED chips in the same column in the second direction is the fourth preset distance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to an LED chip transfer method and a transfer device. BACKGROUND

[0002] At present, in the field of semiconductor technology, Mini LED (Mini Light-Emitting Diode) technology and Micro LED (Micro Light-Emitting Diode) technology are new generation display technologies, which have the advantages of self-luminous, small size, energy saving, etc., and have a good application prospect. In order to manufacture a light-emitting diode display, it is necessary to transfer tiny LED chips from an original substrate to a receiving substrate to arrange into an array. Since the spacing of the LED chips on the wafer is inconsistent with that on the target substrate, the spacing of the LED chips needs to be adjusted during the transfer process, involving the problem of accurate transfer of a large number of tiny LED chips. SUMMARY

[0003] Embodiments of the present application provide an LED chip transfer method and a transfer device, which are used to improve the transfer precision of LED chips.

[0004] Embodiments of the present application provide an LED chip transfer method, which comprises the following steps:

[0005] An output substrate is provided, and a plurality of array-arranged LED chips are arranged on the output substrate. In a first direction, there is a first preset distance between two adjacent LED chips in the same row, and in a second direction, there is a second preset distance between two adjacent LED chips in the same column, wherein the first direction and the second direction intersect.

[0006] The LED chips are transferred from the output substrate to a first transfer substrate, and in the first direction, there is a third preset distance between two adjacent LED chips in the same row, wherein the first preset distance and the third preset distance are different.

[0007] The LED chips are transferred from the first transfer substrate to a second transfer substrate, and in the second direction, there is a fourth preset distance between two adjacent LED chips in the same column, wherein the fourth preset distance and the second preset distance are different.

[0008] transferring the LED chip from the second transfer substrate to a target substrate, the target substrate comprising a driving substrate and a connecting pad arranged on the driving substrate, the LED chip being arranged on the connecting pad, wherein two LED chips located in the same row are arranged with the third preset distance in the first direction, and two LED chips located in the same column are arranged with the fourth preset distance in the second direction.

[0009] Optionally, in some embodiments provided in the present application, the first transfer substrate comprises a suction jig, a suction module and a suction pipe, the suction jig has a plurality of suction holes, the suction module has a plurality of suction gaps and a plurality of suction grooves corresponding to the suction gaps, the suction holes are communicated with the suction gaps, the suction grooves are located on the side of the suction module away from the suction holes, the suction pipe is arranged on the side of the suction jig away from the suction module, and the suction pipe is connected with and corresponds to the suction holes; the step of transferring the LED chip from the output substrate to the first transfer substrate comprises:

[0010] aligning the side of the output substrate provided with the LED chip with the suction grooves;

[0011] controlling the suction jig to generate negative pressure in the suction holes, so that the LED chip is adsorbed into the suction grooves;

[0012] forming a magnetic film layer on the side of the LED chip away from the suction grooves.

[0013] Optionally, in some embodiments provided in the present application, the second transfer substrate comprises a magnetic member, a substrate, an adhesive layer and a magnetic shielding layer, the substrate is arranged on the magnetic member, the adhesive layer is arranged between the magnetic member and the substrate, the magnetic shielding layer is arranged on the side of the substrate away from the magnetic member, the magnetic shielding layer has a plurality of recesses, and the step of transferring the LED chip from the first transfer substrate to the second transfer substrate comprises:

[0014] aligning the side of the first transfer substrate provided with the magnetic film layer with the recesses, and generating normal pressure in the suction holes;

[0015] under the magnetic action, the LED chip is magnetically adsorbed into the recesses.

[0016] Optionally, in some embodiments provided in the present application, the step of transferring the LED chip from the second transfer substrate to a target substrate comprises:

[0017] aligning the side of the second transfer substrate provided with the LED chip with the connecting pad;

[0018] removing the magnetic member so that the LED chip is transferred to the connection pad.

[0019] Optionally, in some embodiments provided in the present application, after the step of removing the magnetic member so that the LED chip is transferred to the connection pad, the method further comprises:

[0020] removing the magnetic film layer on the side of the LED chip away from the connection pad.

[0021] Optionally, in some embodiments provided in the present application, the output substrate comprises an adhesive layer, and the step of providing an output substrate provided with a plurality of arrayed LED chips comprises:

[0022] disposing the LED chip on the adhesive layer.

[0023] Optionally, in some embodiments provided in the present application, the step of transferring the LED chip from the output substrate to the first transfer substrate comprises:

[0024] aligning the output substrate provided with the LED chip to the first transfer substrate;

[0025] irradiating the adhesive layer with ultraviolet light or heating the adhesive layer so that the LED chip is transferred from the output substrate to the first transfer substrate.

[0026] Optionally, in some embodiments provided in the present application, the material of the magnetic shielding layer comprises a mixture of polyetherimide, epoxy resin and nickel, or the material of the magnetic shielding layer comprises a mixture of polyetherimide, epoxy resin and carbon nanotubes.

[0027] Correspondingly, the embodiments of the present application also provide a transfer device for transferring the LED chip by the above-mentioned LED chip transfer method.

[0028] Optionally, in some embodiments provided in the present application, the transfer device comprises:

[0029] a first transfer substrate for receiving the LED chip on the output substrate, the first transfer substrate comprising a suction jig, a suction module and a suction pipe, the suction jig having a plurality of suction holes, the suction module having a plurality of suction slits and a suction groove corresponding to each suction slit, the suction holes being in communication with the suction slits, the suction groove being located on the side of the suction module away from the suction holes, the suction pipe being arranged on the side of the suction jig away from the suction module, and the suction pipe being connected to and corresponding to the suction holes;

[0030] A second transfer substrate for receiving the LED chips on the first transfer substrate, the second transfer substrate comprising a magnetic member, a substrate, a magnetic shielding layer, the substrate disposed on the magnetic member, the magnetic shielding layer disposed on a side of the substrate away from the magnetic member, the magnetic shielding layer having a plurality of recesses, the LED chips disposed within the recesses.

[0031] The embodiment of the present application provides an LED chip transfer method and a transfer device, the LED chip transfer method comprises the following steps: providing an output substrate, a plurality of LED chips are arranged on the output substrate, the first preset distance is arranged between two adjacent LED chips in the same row in the first direction, and the second preset distance is arranged between two adjacent LED chips in the same column in the second direction. The LED chips are transferred from the output substrate to the first transfer substrate, the third preset distance is arranged between two adjacent LED chips in the same row in the first direction. The LED chips are transferred from the first transfer substrate to the second transfer substrate, the fourth preset distance is arranged between two adjacent LED chips in the same column in the second direction. The LED chips are transferred from the second transfer substrate to the target substrate, the third preset distance is arranged between two adjacent LED chips in the same row in the first direction, and the fourth preset distance is arranged between two adjacent LED chips in the same column in the second direction. In order to improve the transfer precision of the LED chips, the embodiment of the present application provides an LED chip transfer method, and the stretching of the LED chips is realized in the transfer process, that is, when the LED chips are transferred from the output substrate to the first transfer substrate, the distance between two adjacent LED chips in the row direction changes from the first preset distance to the third preset distance, and when the LED chips are transferred from the first transfer substrate to the second transfer substrate, the distance between two adjacent LED chips in the column direction changes from the second preset distance to the fourth preset distance, that is, the distance between the LED chips in the row direction and the column direction is adjusted in the transfer process of the LED chips, so that the LED chips adjacent in the row direction and the column direction on the second transfer substrate are matched with the target substrate, the transfer precision of the LED chips is improved, the transfer efficiency is improved, and the transfer difficulty is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0033] Figure 1 The step flow chart of the LED chip transfer method provided by the embodiment of the present application is shown in the figure.

[0034] Figure 2A schematic diagram of step B001 of the LED chip transfer method provided by the embodiment of the present application;

[0035] Figure 3 A layout of the LED chip on the output substrate provided by the embodiment of the present application;

[0036] Figure 4 A schematic diagram of step B002 of the LED chip transfer method provided by the embodiment of the present application;

[0037] Figure 5 A layout of the LED chip on the first transfer substrate provided by the embodiment of the present application;

[0038] Figure 6 A schematic diagram of step B003 of the LED chip transfer method provided by the embodiment of the present application;

[0039] Figure 7 A layout of the LED chip on the second transfer substrate provided by the embodiment of the present application;

[0040] Figure 8 A schematic diagram of step B004 of the LED chip transfer method provided by the embodiment of the present application;

[0041] Figure 9 A structural schematic diagram of the transfer device provided by the embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings, wherein the same component symbols represent the same components, and the following description is based on the shown specific embodiments of the present application, which should not be regarded as limiting other specific embodiments of the present application which are not described in detail herein. The word "embodiment" used in the present specification means example, illustration or exemplification.

[0043] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0044] The present application provides a LED chip transfer method and a transfer device. The following will be described in detail. It should be noted that the description order of the following embodiments is not limited as the preferred order of the embodiments.

[0045] The LED chip transfer method provided by the present application will be described in detail below through specific embodiments.

[0046] Please refer to Figures 1 to 7 The present application provides a LED chip transfer method, which comprises the following steps:

[0047] Step B001: providing an output substrate 10, the output substrate 10 is provided with a plurality of array arranged LED chips 20, along the first direction X, the first preset distance L1 is arranged between the adjacent two LED chips 20 in the same row, along the second direction Y, the second preset distance L2 is arranged between the adjacent two LED chips 20 in the same column, wherein the first direction X and the second direction Y intersect. Please combine Figure 2 And Figure 3 .

[0048] Step B002: transferring the LED chip 20 from the output substrate 10 to the first transfer substrate 30, along the first direction X, the third preset distance L3 is arranged between the adjacent two LED chips 20 in the same row, the first preset distance L1 and the third preset distance L3 are different. Please combine Figure 4 And Figure 5 .

[0049] Step B003: transferring the LED chips 20 from the first transfer substrate 30 to the second transfer substrate 40, wherein, along the second direction Y, the fourth preset distance L4 is between two adjacent LED chips 20 in the same column, and the fourth preset distance L4 is different from the second preset distance L2. Please refer to Figure 6 and Figure 7 .

[0050] Step B004: transferring the LED chips 20 from the second transfer substrate 40 to the target substrate 50, the target substrate 50 includes a driving substrate 501 and a connection pad 502 arranged on the driving substrate 501, and the LED chips 20 are arranged on the connection pad 502, wherein, along the first direction X, the third preset distance L3 is between two adjacent LED chips 20 in the same row, and along the second direction Y, the fourth preset distance L4 is between two adjacent LED chips 20 in the same column. Please refer to Figure 8 .

[0051] In order to improve the transfer accuracy of the LED chips 20, the present application provides a transfer method of the LED chips 20, which realizes the stretching of the LED chips 20 during the transfer process, that is, when the LED chips 20 are transferred from the output substrate 10 to the first transfer substrate 30, the distance between two adjacent LED chips 20 in the row direction changes from the first preset distance L1 to the third preset distance L3, and when the LED chips 20 are transferred from the first transfer substrate 30 to the second transfer substrate 40, the distance between two adjacent LED chips 20 in the column direction changes from the second preset distance L2 to the fourth preset distance L4, that is, the distance between the LED chips 20 in the row direction and the column direction is adjusted during the transfer process of the LED chips 20, so that the LED chips 20 adjacent in the row direction and the column direction on the second transfer substrate 40 are matched with the target substrate 50, the transfer accuracy of the LED chips 20 is improved, the transfer efficiency is improved, and the transfer difficulty is reduced.

[0052] It should be understood that the distance between the two adjacent LED chips 20 in the first direction X or the second direction Y in the present application refers to the distance between the centers of the two LED chips. The row direction in the present application refers to the first direction X, and the column direction refers to the second direction Y.

[0053] It should be noted that the LED chips 20 in the present application include but are not limited to OLED, Mini LED and Micro LED used in display technology.

[0054] It should be understood that the first direction X and the second direction Y in the present application have an included angle, and the value of the included angle of the first direction X and the second direction Y is 0 degree to 180 degree. The present application takes the included angle of the first direction X and the second direction Y as 90 degrees as an example, but is not limited thereto.

[0055] In some embodiments, the first preset distance L1 is less than the third preset distance L3, and optionally, the third preset distance L3 can be an integer multiple of the first preset distance L1. The second preset distance L2 is less than the fourth preset distance L4, and optionally, the fourth preset distance L4 can be an integer multiple of the second preset distance L2. Optionally, the first preset distance L1 is equal to the second preset distance L2, and the third preset distance L3 is equal to the fourth preset distance L4.

[0056] Please continue to refer to Figure 2 and Figure 3 As an implementation of the embodiment, the output substrate 10 includes an adhesive layer, and the step B001 includes disposing the LED chip 20 on the adhesive layer.

[0057] The adhesive layer has adhesion, and the adhesive layer is used to transfer the LED chip 20 from the sapphire substrate to the adhesive layer by using the adhesion of the adhesive layer. It should be noted that the spacing of the adjacent LED chips 20 in the row direction and the column direction is unchanged in this process.

[0058] The material of the adhesive layer can be polydimethylsiloxane (PDMS), photosensitive glue (UV glue film), or adhesive tape (glue). When the adhesive layer is irradiated by ultraviolet light (UV) or is subjected to a heating process, the material of the adhesive layer changes in quality and loses adhesion.

[0059] It should be noted that in some embodiments, the output substrate 10 is the adhesive layer, or the output substrate 10 includes a substrate and an adhesive layer disposed on the substrate.

[0060] In this step, the LED chip 20 is adhered to the adhesive layer by using the adhesion of the adhesive layer, thereby realizing the transfer of the LED chip 20.

[0061] Please continue to refer to Figure 4 and Figure 5 As an implementation of the embodiment, the first transfer substrate 30 includes a suction jig 301, a suction module 302, and a suction pipe 303. The suction jig 301 has a plurality of suction holes AP, the suction module 302 has a plurality of suction slits AS and a suction groove AH corresponding to each suction slit AS, and the suction hole AP is in communication with the suction slit AS. The suction groove AH is located on the side of the suction module 302 away from the suction hole AP. The suction pipe 303 is arranged on the side of the suction jig 301 away from the suction module 302, and the suction pipe 303 is in communication with and corresponds to each suction hole AP. Among them, along the first direction X, the two adjacent suction grooves AH in the same row have a third preset distance L3.

[0062] In some embodiments, the adsorption module 302 can be formed by one-time molding, and the material is not limited to PMMA (Polymethyl Methacrylate), PC (Polyimide), and the like. The adsorption module 302 is precisely attached to the adsorption jig 301 by an adhesive. The adsorption gap AS is formed on the adsorption module 302 by laser drilling and the like.

[0063] The adsorption hole AP includes a first adsorption hole AP1 and a second adsorption hole AP2 in communication. The first adsorption hole AP1 is connected to the adsorption tube 303. One end of the second adsorption hole AP2 is connected to the first adsorption hole AP1, and the other end is connected to the adsorption gap AS. The aperture of the first adsorption hole AP1 is smaller than the aperture of the second adsorption hole AP2. Since the second adsorption hole AP2 has a larger aperture, the adsorption force between the adsorption jig 301 and the adsorption module 302 is increased.

[0064] In the embodiments provided in the present application, step B002 includes:

[0065] The side of the output substrate 10 provided with the LED chip 20 is aligned with the adsorption groove AH. The adsorption jig 301 is controlled so that the adsorption hole AP generates negative pressure, so that the LED chip 20 is adsorbed into the adsorption groove AH.

[0066] Specifically, the side of the output substrate 10 provided with the LED chip 20 is aligned with the adsorption groove AH. The control unit is turned on so that the adsorption hole AP generates negative pressure. Since the adsorption hole AP, the adsorption gap AS, and the adsorption groove AH are in communication, under the negative pressure state, the LED chip 20 is transferred from the output substrate 10 to the adsorption groove AH of the first transfer substrate 30.

[0067] In the LED chip 20 transfer method provided in the embodiments of the present application, the adsorption groove AH is formed on the first transfer substrate 30, so that the third preset distance L3 is provided between the two adsorption grooves AH adjacent in the row direction. When the adsorption hole AP generates negative pressure, the LED chip 20 is adsorbed from the output substrate 10 to the first transfer substrate 30. The first preset distance L1 between the adjacent LED chips 20 in the row direction is adjusted to the third preset distance L3, so as to match the distance of the connection pad 502 of the target substrate 50 in the row direction, and the second preset distance L2 is maintained between the adjacent LED chips 20 in the column direction.

[0068] In some embodiments, the control unit can be a vacuum pump for extracting the pressure in the adsorption jig 301.

[0069] In some embodiments, step B002 can further include: irradiating the adhesive layer with ultraviolet light or heating the adhesive layer, so that the LED chip 20 is transferred from the output substrate 10 to the first transfer substrate 30, at the same time, and the adsorption port AP generates negative pressure, and the LED chip 20 is adsorbed into the adsorption groove AH. In this step, the LED chip 20 is adsorbed by vacuum pressure at the same time, and the LED chip 20 and the adhesive layer are separated by ultraviolet light irradiation or heating, thereby improving the transfer efficiency of the LED chip 20.

[0070] Subsequently, a magnetic film layer MF is formed on the side of the LED chip 20 away from the adsorption groove AH.

[0071] Specifically, the magnetic film layer MF is formed on the side of the LED chip 20 away from the adsorption groove AH by inkjet printing. The material of the magnetic film layer MF includes but is not limited to metal organic complex, for example, the material of the magnetic film layer MF can be Poly-BIPO (Poly(1,4-bis(2,2,6,6-tetramethyl-4-piperidyl-1-oxyl)-butadiin, poly(1,4-bis(2,2,6,6-tetramethyl-4-piperidyl-1-oxyl)-butadiene).

[0072] Please continue to combine Figure 6 and Figure 7 In an embodiment disclosed in the embodiment, the second transfer substrate 40 includes a magnetic member 401, an adhesive layer 402, a substrate 403, a magnetic shielding layer 404, the substrate 403 is arranged on the magnetic member 401, the adhesive layer 402 is arranged between the magnetic member 401 and the substrate 403, and the magnetic shielding layer 404 is arranged on the side of the substrate 403 away from the magnetic member 401. The magnetic shielding layer 404 has a plurality of recesses HP, and the distance between two LED chips 20 located in the same row along the first direction X is a third preset distance L3, and the distance between two LED chips 20 located in the same column along the second direction Y is a fourth preset distance L4.

[0073] In some embodiments, the thickness of the magnetic shielding layer 404 is less than the thickness of the LED chip 20, and optionally, the thickness of the LED chip 20 is greater than 2 times the thickness of the magnetic shielding layer 404.

[0074] In some embodiments, step B003 includes:

[0075] The side of the first transfer substrate 30 provided with the magnetic film layer MF is aligned with the recess HP, and the adsorption port AP generates normal pressure, and under the magnetic action, the LED chip 20 is magnetically adsorbed into the recess HP.

[0076] Specifically, the side of the first transfer substrate 30 provided with the magnetic layer is aligned with the recessed part HP, and then the control unit is closed, the adsorption hole AP is adjusted to the normal pressure state, so that the LED chip 20 is separated from the first transfer substrate 30, and under the magnetic action, the LED chip 20 is magnetically adsorbed into the recessed part HP of the second transfer substrate 40.

[0077] In this step, since the second transfer substrate 40 includes the magnetic member 401 and the magnetic shielding layer 404, the LED chip 20 with the magnetic film layer MF can be magnetically adsorbed onto the second transfer substrate 40, and due to the presence of the magnetic shielding layer 404, the LED chip 20 can only be arranged in the recessed part HP, and the LED chips 20 adjacent in the column direction are adjusted to the fourth preset distance L4 from the second preset distance L2, so as to adjust the distance of the LED chips 20 in the column direction, so that the LED chips 20 on the second transfer substrate 40 are matched with the distance of the connection pads 502 on the target substrate 50 in the row direction and the column direction.

[0078] In some embodiments, the material of the magnetic shielding layer 404 includes a mixture of polyetherimide, epoxy resin and nickel, or the material of the magnetic shielding layer 404 includes a mixture of polyetherimide, epoxy resin and carbon nanotubes.

[0079] Please continue to refer to Figure 8 In an implementation manner of the embodiment, step B004 includes:

[0080] Aligning the side of the second transfer substrate 40 with the LED chip 20 with the connection pad 502; removing the magnetic member 401, so that the LED chip 20 is transferred to the connection pad 502.

[0081] Specifically, first, the side of the second transfer substrate 40 with the LED chip 20 is aligned with the connection pad 502; then, the second transfer substrate 40 is close to the target substrate 50, so that the LED chip 20 and the connection pad 502 are in contact; then, the magnetic member 401 is removed, and due to the loss of the interaction between the magnetic member 401 and the magnetic film layer MF, the LED chip 20 is separated from the second transfer substrate 40 and transferred to the target substrate 50.

[0082] In the present application, the target substrate 50 further includes a conductive connection part 503, which is arranged on the side of the connection pad 502 away from the driving substrate 501, and the conductive connection part 503 is used to conduct the LED chip 20 and the driving substrate 501.

[0083] In some embodiments, the material of the conductive connection part 503 can be selected from one or more of anisotropic conductive adhesive (ACA), anisotropic conductive adhesive, metal solder, tin paste, flux, liquid metal, etc., but is not limited thereto.

[0084] In some embodiments, step B004 further comprises: removing the magnetic film layer MF away from the side of the LED chip 20 distal to the connecting pad 502.

[0085] Specifically, the magnetic film layer MF is dissolved by using an organic solvent, thereby completing the transfer process of the LED chip 20.

[0086] Correspondingly, please refer to Figure 9 The embodiments of the present application also provide a transfer device 100 for transferring the LED chip 20 by using the above chip transfer method. Please refer to Figure 5 and Figure 7 .

[0087] Specifically, the transfer device 100 comprises:

[0088] a first transfer substrate 30 for receiving the LED chip 20 on the output substrate 10.

[0089] The first transfer substrate 30 comprises a suction jig 301, a suction module 302 and a suction tube 303. The suction jig 301 has a plurality of suction holes AP. The suction module 302 has a plurality of suction gaps AS and a plurality of suction grooves AH corresponding to the suction gaps AS. The suction holes AP are in communication with the suction gaps AS. The suction grooves AH are located on the side of the suction module 302 distal to the suction holes AP. The suction tube 303 is arranged on the side of the suction jig 301 distal to the suction module 302, and is connected to and corresponds to the suction holes AP. Along the first direction X, the adjacent two suction grooves AH have a third preset distance L3. Along the second direction Y, the adjacent two suction grooves AH have a second preset distance L2.

[0090] a second transfer substrate 40 for receiving the LED chip 20 on the first transfer substrate 30.

[0091] Specifically, the second transfer substrate 40 comprises a magnetic member 401, an adhesive layer 402, a substrate 403, a magnetic shielding layer 404, the substrate 403 is arranged on the magnetic member 401, the adhesive layer 402 is arranged between the substrate and the magnetic member, the magnetic shielding layer 404 is arranged on the side of the substrate 403 distal to the magnetic member 401, the magnetic shielding layer 404 has a plurality of recessed portions HP, and the LED chip 20 is arranged in the recessed portion HP. Along the first direction X, the adjacent two recessed portions HP have a third preset distance L3. Along the second direction Y, the adjacent two recessed portions HP have a fourth preset distance L4.

[0092] In summary, although the application has been disclosed as above with preferred embodiments, the above preferred embodiments are not intended to limit the application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the application, and therefore the protection scope of the application is defined by the scope of the claims.

Claims

1. A method of LED chip transfer, the method comprising: The LED chip transfer method comprises the following steps: An output substrate is provided, and a plurality of LED chips are arranged in an array on the output substrate. In a first direction, a first preset distance is provided between two adjacent LED chips in the same row. In a second direction, a second preset distance is provided between two adjacent LED chips in the same column. The first direction and the second direction intersect. The LED chips are transferred from the output substrate to adsorption grooves in a first transfer substrate by negative pressure adsorption. In the first direction, a third preset distance is provided between two adjacent adsorption grooves, so that the third preset distance is provided between two adjacent LED chips in the same row. The first preset distance and the third preset distance are different. The LED chips are transferred from the first transfer substrate to recesses in a second transfer substrate by magnetic adsorption. In the second direction, a fourth preset distance is provided between two adjacent recesses, so that the fourth preset distance is provided between two adjacent LED chips in the same column. The fourth preset distance and the second preset distance are different. The LED chips are transferred from the second transfer substrate to a target substrate. The target substrate comprises a driving substrate and a connection pad arranged on the driving substrate. The LED chips are arranged on the connection pad. In the first direction, the third preset distance is provided between two adjacent LED chips in the same row. In the second direction, the fourth preset distance is provided between two adjacent LED chips in the same column.

2. The LED chip transfer method according to claim 1, wherein The first transfer substrate comprises an adsorption jig, an adsorption module, and an adsorption pipe. The adsorption jig has a plurality of adsorption holes. The adsorption module has a plurality of adsorption gaps and adsorption grooves corresponding to the adsorption gaps. The adsorption holes are in communication with the adsorption gaps. The adsorption grooves are located on a side of the adsorption module away from the adsorption holes. The adsorption pipe is arranged on a side of the adsorption jig away from the adsorption module. The adsorption pipe is connected to and corresponds to the adsorption holes. The step of transferring the LED chips from the output substrate to the first transfer substrate comprises the following steps: One side of the output substrate with the LED chips is aligned with the adsorption grooves. The adsorption holes are controlled to generate negative pressure, so that the LED chips are adsorbed into the adsorption grooves. A magnetic film layer is formed on a side of the LED chips away from the adsorption grooves.

3. The LED chip transfer method according to claim 2, wherein The second transfer substrate comprises a magnetic member, a substrate, an adhesive layer, and a magnetic shielding layer. The substrate is arranged on the magnetic member. The adhesive layer is arranged between the magnetic member and the substrate. The magnetic shielding layer is arranged on a side of the substrate away from the magnetic member. The magnetic shielding layer has a plurality of recesses. The step of transferring the LED chips from the first transfer substrate to the second transfer substrate comprises the following steps: One side of the first transfer substrate with the magnetic film layer is aligned with the recesses, and the adsorption holes are controlled to generate normal pressure. Under the magnetic effect, the LED chip is magnetically adsorbed into the recess.

4. The LED chip transfer method according to claim 3, wherein The step of transferring the LED chip from the second transfer substrate to a target substrate comprises: aligning the side of the second transfer substrate provided with the LED chip to the connecting pads; removing the magnetic member so that the LED chip is transferred onto the connecting pads.

5. The LED chip transfer method according to claim 4, wherein After the step of removing the magnetic member so that the LED chip is transferred onto the connecting pads, the method further comprises: removing the magnetic film layer away from the side of the LED chip far from the connecting pads.

6. The LED chip transfer method of claim 1, wherein, The output substrate comprises an adhesive layer, and the step of providing an output substrate provided with a plurality of arrayed LED chips comprises: arranging the LED chips on the adhesive layer.

7. The LED chip transfer method of claim 6, wherein, The step of transferring the LED chip from the output substrate to a first transfer substrate comprises: aligning the side of the output substrate provided with the LED chip to the first transfer substrate; irradiating the adhesive layer with ultraviolet light or heating the adhesive layer so that the LED chip is transferred from the output substrate to the first transfer substrate.

8. The LED chip transfer method of claim 3, wherein, The material of the magnetic shielding layer comprises a mixture of polyetherimide, epoxy resin and nickel, or the material of the magnetic shielding layer comprises a mixture of polyetherimide, epoxy resin and carbon nanotubes.

9. A transfer device characterized by, The transfer device is used for transferring the LED chip in the chip transfer method according to any one of claims 1 to 8.

10. The transfer device of claim 9, wherein, The transfer device comprises: a first transfer substrate for receiving the LED chip on an output substrate, the first transfer substrate comprising a suction jig, a suction module and a suction pipe, the suction jig having a plurality of suction holes, the suction module having a plurality of suction slits and a suction groove corresponding to each suction slit, the suction holes being in communication with the suction slits, the suction groove being located on the side of the suction module far from the suction holes, the suction pipe being arranged on the side of the suction jig far from the suction module, and the suction pipe being connected to and corresponding to each suction hole; a second transfer substrate for receiving the LED chip on the first transfer substrate, the second transfer substrate comprising a magnetic member, a substrate and a magnetic shielding layer, the substrate being arranged on the magnetic member, the magnetic shielding layer being arranged on the side of the substrate far from the magnetic member, the magnetic shielding layer having a plurality of recesses, and the LED chip being arranged in the recess.

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