A method and system for identifying LED BIN information

Abstract

The present application belongs to the field of electronics and intelligence, and particularly relates to a LED BIN information identification method and system. The identification method comprises: input signal sampling by a micro control unit to match the input signal with LED BIN information; wherein when the input signal matches the LED BIN information successfully, the LED BIN is pasted with a pasting circuit; the micro control unit drives the LED drive circuit to output corresponding grade current to the pasting circuit according to the input signal to control the LED BIN to work. The present application can be applied to mass production of LED BIN, and does not need to additionally configure the information of LED BIN, reduces the production process, improves the production efficiency, and judges the current LED BIN information by sampling the ADC signal or DI signal by the micro control unit, and outputs the current current value corresponding to the LED BIN, so as to realize the identification of LED BIN information and improve the production efficiency.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of electronics and intelligent technology, and particularly relates to an LED BIN information identification method and system. BACKGROUND

[0002] At present, the types of LEDs in the tail lamp products of automobiles are more and more, and the lighting effect requirements are more and more.

[0003] The BIN of the LED is different, and after generally adopting MCU software writing, the LED BIN information is configured separately once, and is written into the MCU or an external storage chip, so that the production procedure is complicated, and there is a possibility of configuration error due to human factors.

[0004] Therefore, it is urgent to develop a new LED BIN information identification method and system to solve the above problems. SUMMARY

[0005] The application aims to provide an LED BIN information identification method and system.

[0006] In order to solve the above technical problems, the application provides an LED BIN information identification method, which comprises: sampling an input signal by a micro control unit, so that the input signal is matched with LED BIN information; wherein when the input signal is successfully matched with the LED BIN information, the LED BIN is pasted with a patch circuit; the micro control unit drives the LED driving circuit to output a corresponding level of current to the patch circuit according to the input signal, so as to control the LED BIN to work.

[0007] Further, the method of sampling the input signal by the micro control unit so that the input signal is matched with the LED BIN information comprises: the micro control unit samples an ADC signal through an ADC circuit, or the micro control unit samples a DI signal through a DI circuit.

[0008] Further, the ADC circuit comprises: a first resistor and a second resistor connected in series; the micro control unit is connected between the first resistor and the second resistor; the resistance values of the first resistor and the second resistor are configured to form a corresponding ADC signal input into the micro control unit; and the micro control unit matches the digital quantity range in the ADC signal with the LED BIN information.

[0009] Further, the DI circuit comprises: a pull-up resistor; the pull-up resistor is connected to the micro control unit; the pull-up resistor inputs a high-level signal to the micro control unit; and the micro control unit matches the high-level signal with the LED BIN information.

[0010] Further, the DI circuit comprises a pull-down resistor; the pull-down resistor is connected to the micro control unit; the pull-down resistor inputs a low-level signal to the micro control unit; the micro control unit matches the low-level signal with the LED BIN information.

[0011] In another aspect, the application provides an identification system of LED BIN information, which comprises a micro control unit, a signal input module electrically connected to the micro control unit, an LED driving module and a patch module; wherein the micro control unit samples an input signal through the signal input module, so that the input signal is matched with the LED BIN information; when the input signal is successfully matched with the LED BIN information, the LED BIN is patched with the patch module; the micro control unit drives the LED driving module to output a current of a corresponding level to the patch module according to the input signal, so as to control the LED BIN to work.

[0012] Further, the signal input module comprises at least one ADC circuit; the ADC circuit comprises a first resistor and a second resistor connected in series; the micro control unit is connected between the first resistor and the second resistor; the resistance values of the first resistor and the second resistor are configured to form an ADC signal input to the micro control unit; the micro control unit matches the digital range in the ADC signal with the LED BIN information.

[0013] Further, the signal input module further comprises at least one DI circuit; the micro control unit samples a DI signal through the DI circuit.

[0014] Further, the DI circuit comprises a pull-up resistor or a pull-down resistor; the pull-up resistor is connected to the micro control unit, or the pull-down resistor is connected to the micro control unit; the pull-up resistor inputs a high-level signal to the micro control unit, and the micro control unit matches the high-level signal with the LED BIN information, or the pull-down resistor inputs a low-level signal to the micro control unit, and the micro control unit matches the low-level signal with the LED BIN information.

[0015] Further, the LED driving module comprises at least one LED driving circuit; the patch module comprises at least one LED patch circuit; when the input signal is successfully matched with the LED BIN information, the LED BIN is patched with the patch circuit; the micro control unit drives the LED driving circuit to output a current of a corresponding level to the patch circuit according to the input signal, so as to control the LED BIN to work.

[0016] The beneficial effects of the present application are that the present application can be applied to the LED BIN production while not needing to additionally configure the LED BIN information, reducing the production process, improving the production efficiency, and the micro control unit judges the current LED BIN information by sampling the ADC signal or the DI signal, and outputs the current LED BIN corresponding current value, thereby realizing the recognition of the LED BIN information and improving the production efficiency.

[0017] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the present application.

[0018] In order to make the above-mentioned objectives, characteristics and advantages of the present application more apparent, the following preferred embodiments are specifically described with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0020] Fig. 1 is a flow chart of the LED BIN information recognition method of the present application;

[0021] Fig. 2 is a circuit diagram of an optional embodiment of the LED BIN information recognition system of the present application;

[0022] Fig. 3 is a circuit diagram of another optional embodiment of the LED BIN information recognition system of the present application;

[0023] Fig. 4 is a circuit diagram of still another optional embodiment of the LED BIN information recognition system of the present application.

[0024] In the drawings:

[0025] R1, first resistor; R2, second resistor; R5, pull-up resistor; R6, pull-down resistor. DETAILED DESCRIPTION

[0026] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0027] Embodiment 1

[0028] In this embodiment, as shown in the figure, the present embodiment provides a method for identifying LED BIN information, which comprises: sampling an input signal by a micro control unit, so that the input signal matches the LED BIN information; wherein when the input signal matches the LED BIN information successfully, the LED BIN is pasted with the pasting circuit; the micro control unit drives the LED driving circuit to output a current of a corresponding level to the pasting circuit according to the input signal, so as to control the LED BIN to work. Figs. 1 to 4

[0029] In this embodiment, the present embodiment can be applied to the mass production of LED BIN, without the need for additional configuration of the information of LED BIN, reducing the production process and improving the production efficiency. Meanwhile, the micro control unit judges the current LED BIN information by sampling the ADC signal or the DI signal, and outputs the current current value corresponding to the LED BIN, so as to realize the identification of the LED BIN information and improve the production efficiency.

[0030] In this embodiment, the micro control unit, the LED driving circuit and the pasting circuit are all powered by a power supply system.

[0031] In this embodiment, the micro control unit drives the LED driving circuit to output a current to the pasting circuit, which is determined according to the input signal.

[0032] In this embodiment, the method for sampling the input signal by the micro control unit so that the input signal matches the LED BIN information comprises: the micro control unit samples the ADC signal through the ADC circuit, or the micro control unit samples the DI signal through the DI circuit.

[0033] In this embodiment, the micro control unit samples the ADC signal through the ADC circuit, which is suitable for a large number of types of LED BIN. The micro control unit samples the DI signal through the DI circuit, which is suitable for the case that each type of LED BIN is not more than two.

[0034] ​In the embodiment, the ADC circuit comprises: a first resistor R1 and a second resistor R2 connected in series; a micro control unit connected between the first resistor R1 and the second resistor R2; the resistance values of the first resistor R1 and the second resistor R2 are configured to form a corresponding ADC signal input to the micro control unit; the micro control unit matches the digital quantity range in the ADC signal with the LED BIN information.

[0035] In the embodiment, the LED BIN exceeds two kinds of cases: the resistance values of the first resistor R1 and the second resistor R2 are configured, and then the micro control unit is used for ADC sampling processing to identify different digital quantity ranges, and different ranges correspond to different LED BIN information; the LED BIN information and the hardware information of the resistance values of the first resistor R1 and the second resistor R2 are matched with the corresponding micro control unit burning file and are downloaded to production, and the production process matches the LED BIN information and the resistance values of the first resistor R1 and the second resistor R2 according to the input, sets to enter the automatic generation process, and realizes the matching process in the patch process.

[0036] In the embodiment, the DI circuit comprises: a pull-up resistor R5; the pull-up resistor R5 is connected to the micro control unit; the pull-up resistor R5 inputs a high level signal to the micro control unit; and the micro control unit matches the high level signal with the LED BIN information.

[0037] In the embodiment, the DI circuit comprises: a pull-down resistor R6; the pull-down resistor R6 is connected to the micro control unit; the pull-down resistor R6 inputs a low level signal to the micro control unit; and the micro control unit matches the low level signal with the LED BIN information.

[0038] In the embodiment, the LED BIN does not exceed two kinds of cases: one of the pull-up resistor R5 or the pull-down resistor R6 is welded, the level signal of the DI pin of the micro control unit is pulled up or pulled down, and two different LED BIN information are corresponded; the LED BIN information and the hardware information of the pull-up resistor R5 or the pull-down resistor R6 are matched with the corresponding micro control unit burning file and are downloaded to production, the production process matches the LED BIN information and the welding condition of the pull-up resistor R5 or the pull-down resistor R6 (the DI input of the corresponding micro control unit is high level or low level) according to the input, sets to enter the automatic generation process, and realizes the matching process in the patch process.

[0039] Embodiment 2

[0040] The embodiment is based on the embodiment 1, and provides an LED BIN information identification system, which comprises a micro control unit, a signal input module electrically connected with the micro control unit, an LED driving module and a patch module; the micro control unit samples an input signal through the signal input module, so that the input signal is matched with LED BIN information; when the input signal is successfully matched with the LED BIN information, the LED BIN is patched with the patch module; the micro control unit drives the LED driving module to output a current of a corresponding grade to the patch module according to the input signal, so as to control the LED BIN to work.

[0041] In the embodiment, the signal input module comprises at least one ADC circuit; the ADC circuit comprises a first resistor R1 and a second resistor R2 connected in series; the micro control unit is connected between the first resistor R1 and the second resistor R2; the resistance values of the first resistor R1 and the second resistor R2 are configured to form an ADC signal input to the micro control unit; the micro control unit matches the digital range in the ADC signal with the LED BIN information.

[0042] In the embodiment, the signal input module further comprises at least one DI circuit; the micro control unit samples a DI signal through the DI circuit.

[0043] In the embodiment, the DI circuit comprises a pull-up resistor R5 or a pull-down resistor R6; the pull-up resistor R5 is connected with the micro control unit, or the pull-down resistor R6 is connected with the micro control unit; the pull-up resistor R5 inputs a high-level signal to the micro control unit, and the micro control unit matches the high-level signal with the LED BIN information, or the pull-down resistor R6 inputs a low-level signal to the micro control unit, and the micro control unit matches the low-level signal with the LED BIN information.

[0044] In the embodiment, the LED driving module comprises at least one LED driving circuit; the patch module comprises at least one LED patch circuit; when the input signal is successfully matched with the LED BIN information, the LED BIN is patched with the patch circuit; the micro control unit drives the LED driving circuit to output a current of a corresponding grade to the patch circuit according to the input signal, so as to control the LED BIN to work.

[0045] In conclusion, the application can be applied to the LED BIN batch production, without additional configuration of LED BIN information, reducing the production process, improving the production efficiency, and the micro control unit judges the current LED BIN information by sampling the ADC signal or DI signal, and outputs the current LED BIN corresponding current value, so as to realize the identification of the LED BIN information, and improve the production efficiency.

[0046] The various devices (components without specific structure) selected in the application are all general standard components or components known to those skilled in the art, and their structures and principles can be known by the skilled person through technical manuals or through conventional experimental methods.

[0047] In the description of the embodiments of the application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0048] In the description of the application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0049] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. The device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the shown or discussed mutual elements can be indirect coupling or communication connection through some communication interface, device or unit, which can be electrical, mechanical or other forms.

[0050] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0051] In addition, each functional unit in each embodiment of the application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit.

[0052] Based on the above ideal embodiments according to the application, through the above description, relevant personnel can make various changes and modifications without deviating from the technical idea of the application. The technical scope of the application is not limited to the contents of the specification, and the technical scope must be determined according to the scope of claims.

Claims

1. A method for identifying LED BIN information, characterized in that, The method comprises the following steps: sampling the input signal by the micro control unit, so that the input signal matches the LED BIN information; when the input signal matches the LED BIN information successfully, the LED BIN is pasted with the pasting circuit; the micro control unit drives the LED driving circuit to output the corresponding level of current to the pasting circuit according to the input signal, so as to control the LED BIN to work.

2. The method for identifying the LED BIN information according to claim 1, wherein the method for sampling the input signal by the micro control unit, so that the input signal matches the LED BIN information comprises: the micro control unit samples the ADC signal through the ADC circuit, or the micro control unit samples the DI signal through the DI circuit.

3. The method for identifying the LED BIN information according to claim 2, wherein the ADC circuit comprises: a first resistor and a second resistor connected in series; the micro control unit is connected between the first resistor and the second resistor; the resistance values of the first resistor and the second resistor are configured to form the corresponding ADC signal input to the micro control unit; the micro control unit matches the LED BIN information through the digital quantity range in the ADC signal.

4. The method for identifying the LED BIN information according to claim 2, wherein the DI circuit comprises: a pull-up resistor; the pull-up resistor is connected to the micro control unit; the pull-up resistor inputs the high-level signal to the micro control unit; the micro control unit matches the LED BIN information through the high-level signal.

5. The method for identifying the LED BIN information according to claim 2, wherein the DI circuit comprises: a pull-down resistor; the pull-down resistor is connected to the micro control unit; the pull-down resistor inputs the low-level signal to the micro control unit; the micro control unit matches the LED BIN information through the low-level signal. The system comprises: a micro control unit, a signal input module electrically connected to the micro control unit, an LED driving module and a pasting module; wherein the micro control unit samples the input signal through the signal input module, so that the input signal matches the LED BIN information; 6. An LED BIN information identification system, comprising: when the input signal matches the LED BIN information successfully, the LED BIN is pasted with the pasting module; the micro control unit drives the LED driving module to output the corresponding level of current to the pasting module according to the input signal, so as to control the LED BIN to work.

7. The system for identifying the LED BIN information according to claim 6, wherein the signal input module comprises: at least one ADC circuit; the ADC circuit comprises: a first resistor and a second resistor connected in series; the micro control unit is connected between the first resistor and the second resistor; the resistance values of the first resistor and the second resistor are configured to form the corresponding ADC signal input to the micro control unit; the micro control unit matches the LED BIN information through the digital quantity range in the ADC signal.

8. The system for identifying the LED BIN information according to claim 6, wherein ​ ​ ​ ​ ​ The signal input module further comprises at least one DI circuit; The micro control unit samples the DI signal through the DI circuit. 9.The LED BIN information identification system of claim 8, wherein, The DI circuit comprises a pull-up resistor or a pull-down resistor; The pull-up resistor is connected to the micro control unit, or The pull-down resistor is connected to the micro control unit; The pull-up resistor inputs a high level signal to the micro control unit, and the micro control unit matches the LED BIN information through the high level signal, or The pull-down resistor inputs a low level signal to the micro control unit, and the micro control unit matches the LED BIN information through the low level signal. 10.The LED BIN information identification system of claim 6, wherein, The LED driving module comprises at least one LED driving circuit; The patch module comprises at least one LED patch circuit; When the input signal matches the LED BIN information successfully, the LED BIN is patched to the patch circuit; The micro control unit drives the LED driving circuit to output corresponding level current to the patch circuit according to the input signal, so as to control the LED BIN to work.

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