Elastic component, heat dissipation device, electronic equipment, circuit module and assembly method thereof

Abstract

The present application relates to the field of communication technology, and discloses a non-detachable elastic component, a heat dissipation device, an electronic device, a circuit module and an assembly method thereof. Among them, after the connection component and the fastening component in the non-detachable elastic component are installed, the nail body, the elastic element and the anti-detachment component in the connection component can form an anti-detachment spacing for preventing the second component from detaching from the first component. Secondly, the nail body and the fastening component in the connection component can also form a fixed spacing for fixing the second component to the third component. Finally, the nail body, the elastic element and the fastening component in the connection component can also form an elastic spacing for elastically combining the first component to the second component, that is, elastically combining the first component to the third component. While realizing the above three functions, the non-detachable elastic component minimizes the number of holes on the circuit board for installing the above-mentioned connector, improves the effective utilization rate of the board surface, and enhances the flexibility of high-density single board layout.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a non-detachable elastic component, a heat dissipation device, an electronic device, a circuit module and an assembly method thereof. Background Art

[0002] With the advent of the big data era, data transmission rates continue to increase, the computing and processing capabilities of electronic devices continue to improve, and the corresponding chip power consumption increases rapidly, making the heat consumption of the chip higher and higher. In order to ensure the contact effect between the pins or solder balls in the chip packaging structure and the circuit board to improve the reliability of signal transmission, the current commonly used solution is to add a metal bracket around the chip on the circuit board, and use the bracket to strengthen the strength of the circuit board in the area where the chip packaging structure is located, and limit the deformation of the circuit board during the temperature change of the chip packaging structure to a certain range, thereby ensuring the contact effect between the pins or solder balls in the chip packaging structure and the circuit board to improve the reliability of signal transmission. However, adding a bracket to the circuit module makes the installation process of the circuit module cumbersome. Summary of the invention

[0003] The purpose of the present application is to provide a non-detachable elastic component, a heat dissipation device, an electronic device, a circuit module and an assembly method thereof. The non-detachable elastic component includes a connecting component and a fastening component, and the connecting component can prevent the bracket from being detached from the radiator. The connecting component cooperates with the fastening component to fix the bracket to the circuit board and elastically abut the radiator against the bracket, that is, elastically abut the radiator against the packaging structure on the circuit board. The above-mentioned non-detachable elastic component can realize the above-mentioned three functions without increasing the number of mounting holes on the circuit board, thereby improving the effective utilization rate of the circuit board surface and enhancing the flexibility of high-density single-board layout.

[0004] The first aspect of the present application provides a non-loose elastic component, specifically, the non-loose elastic component includes a connecting component and a fastening component: wherein the connecting component includes a nail body, an elastic element and an anti-slip component, the nail body includes a connecting head, a large-diameter connecting rod and a small-diameter connecting rod connected in sequence; the elastic element is sleeved on the large-diameter connecting rod and abuts against the connecting head, the anti-slip component is installed on the small-diameter connecting rod, and the fastening component is installed on the fastening end of the connecting component opposite to the connecting head; an anti-slip spacing is formed between the elastic element and the anti-slip component, which can limit the second component from falling off relative to the first component; a fixed spacing is formed between the fastening component and the large-diameter connecting rod, which can fix the second component and the third component; an elastic spacing is formed between the fastening component and the elastic element, which can elastically combine the first component relative to the second component.

[0005] That is, in the embodiment of the present application, after the connecting parts (including nail bodies, elastic elements and anti-slip components) and fastening parts in the non-loose elastic component are installed, firstly, the nail body, elastic element and anti-slip components in the connecting parts can form an anti-slip distance for preventing the second component from being detached from the first component. Secondly, the nail body and fastening parts in the connecting parts can form a fixed distance for fixing the second component to the third component. Finally, the nail body, elastic element and fastening parts in the connecting parts can form an elastic distance for elastically combining the first component to the second component, that is, elastically combining the first component to the third component.

[0006] Among them, the first component can be a heat sink in the circuit module, the second component can be a bracket in the circuit module, and the third component can be a circuit board in the circuit module, and a packaging structure is installed on the circuit board. In the circuit module, the heat sink is elastically combined with the circuit board to dissipate heat from the packaging structure on the circuit board.

[0007] Anti-detachment means that the bracket cannot be detached from the radiator. For example, the bracket is elastically combined with the radiator through a non-detachable elastic component. For another example, the bracket and the radiator are connected in series on the non-detachable component, and the bracket and the radiator can slide along the non-detachable elastic component. The connecting component refers to the component used to connect the bracket to the radiator when the radiator is delivered to realize the integrated delivery of the bracket and the radiator. At the same time, the connecting component can also cooperate with the fastening component to realize the fixed connection between the bracket and the circuit board and the elastic combination of the radiator and the circuit board. The fastening component refers to the structure that cooperates with the connecting component on the radiator to fix the bracket to the circuit board and elastically combine the radiator to the bracket after the radiator is delivered. The fastening end refers to the structure on the connecting component for installing the fastening component. For example, the fastening end can be the end of the connecting component opposite to the connecting head, and the fastening end can also be the end of the small-diameter connecting rod of the nail body opposite to the connecting head. Among them, the end opposite to the connecting head refers to the end of the small diameter connecting rod (connecting component) farther away from the connecting head, and the end opposite to the connecting head is the end of the small diameter connecting rod (connecting component) closer to the connecting head.

[0008] For example, the nail body includes a connector, a large-diameter connecting rod, and a small-diameter connecting rod, which are connected in sequence and have outer diameters that decrease in sequence and extend in the same direction. The connector is formed with an annular connector end face at one end connected to the large-diameter connecting rod. The large-diameter connecting rod is formed with an annular large-diameter end face at one end connected to the small-diameter connecting rod. The elastic element is a spiral rotation structure, and the elastic element includes a first elastic end and a second elastic end. The anti-slip component is a nut, and the anti-slip component is formed with an internal mounting thread that matches the mounting end of the nail body, and an anti-slip end face for limiting the bracket from falling off relative to the radiator.

[0009] When the nail body, elastic element and anti-slip component in the connecting part are assembled, the elastic element is sleeved on the large-diameter connecting rod in the nail body, and the first elastic end of the elastic element can be used to abut against the end face of the connecting head of the connecting head, and the second elastic end of the elastic element can be used to abut against the radiator. The anti-slip end face of the anti-slip component faces the large-diameter end face of the large-diameter connecting rod in the nail body. The anti-slip distance is the distance between the anti-slip end face and the second elastic end of the elastic element after the loose elastic component is installed on the radiator and the bracket.

[0010] When the fastening component is mounted on the fastening end of the connecting component, the fixed spacing is the spacing between the fastening end face in the fastening component and the large diameter end face of the large diameter connecting rod after the non-detachable elastic component mounts the heat sink and the bracket on the circuit board. The elastic spacing is the spacing between the fastening end face in the fastening component and the second elastic end of the elastic element after the non-detachable elastic component mounts the heat sink and the bracket on the circuit board.

[0011] The fastening component and the fastening end of the connecting component may be installed by threaded connection, or by pressure riveting or expansion riveting.

[0012] After the installation of the above-mentioned elastic components, the connecting components (including nail bodies, elastic elements and anti-detachment components) and the fastening components in the elastic components, firstly, an anti-detachment spacing for preventing the bracket from being separated from the radiator can be formed, secondly, a fixed spacing for fixing the bracket to the circuit board can be formed, and finally, an elastic spacing for elastically combining the radiator to the bracket, that is, elastically combining the radiator to the circuit board can be formed. That is, by connecting the radiator, the bracket and the circuit board through a group of the above-mentioned elastic components, the bracket can be restricted from being separated from the radiator, the bracket can be fixedly connected to the circuit board, and the radiator can be elastically combined with the bracket. Under the condition of realizing the above-mentioned three functions, the number of connectors is reduced as much as possible, that is, the number of holes on the circuit board for installing the above-mentioned connectors is reduced as much as possible, the installation space occupied on the circuit board surface is reduced, the effective utilization rate of the circuit board surface is improved, and the flexibility of high-density single board layout is improved.

[0013] In a possible implementation of the first aspect above, in the non-loose elastic component, the anti-slip component includes a nut, which is threadedly connected to the end of the small-diameter connecting rod opposite to the connecting head, and the nut adjusts the anti-slip spacing by adjusting the length of the threaded connection with the small-diameter connecting rod.

[0014] That is, in the embodiment of the present application, in the above-mentioned elastic assembly that cannot be loosened, the end of the small-diameter connecting rod opposite to the connecting head is a mounting end for connecting the anti-slip component, and the mounting end has an external mounting thread. The anti-slip component in the connecting component is a nut, and the nut has an internal mounting thread that matches the external mounting thread on the mounting end of the small-diameter connecting rod. The external mounting thread on the small-diameter connecting rod is screwed with the internal mounting thread on the anti-slip component to achieve a threaded connection between the small-diameter connecting rod and the anti-slip component.

[0015] The above-mentioned non-loose elastic component sets the anti-slip component as a nut, and sets the connection between the anti-slip component and the small-diameter connecting rod as a threaded connection. While ensuring the connection strength between the anti-slip component and the nail body, the anti-slip spacing can also be flexibly adjusted to avoid the radiator and the bracket being too small in size or the anti-slip spacing being too large, which causes the radiator to mechanically hit the bracket during transportation, thereby further optimizing the performance of the non-loose elastic component.

[0016] In a possible implementation of the first aspect above, in the non-detachable elastic component, the fastening end includes an end of a small-diameter connecting rod opposite to the connecting head and a nut, and an external thread is arranged on the outer periphery of the nut, and the fastening component is threadedly engaged with the external thread through its internal thread to be installed with the fastening end thread.

[0017] That is, in the embodiment of the present application, the fastening component has a fastening internal thread, and the fastening end of the connecting component includes an end opposite to the connecting head of the small-diameter connecting rod and a nut mounted on the small-diameter connecting rod, and the outer periphery of the nut is provided with a fastening external thread adapted to the fastening internal thread on the fastening component. The fastening external thread on the nut is screwed with the fastening internal thread of the fastening component to achieve a threaded connection between the nut and the fastening component, and then to achieve a threaded connection between the small-diameter connecting rod and the fastening component, that is, to achieve a threaded connection between the nail body and the fastening component, and finally to achieve a threaded connection between the connecting component and the small-diameter connecting rod.

[0018] The above-mentioned non-loose elastic component, by setting the connection mode between the connecting part and the fastening part to a threaded connection, can adjust the heat source on the circuit board by adjusting the length of the threaded connection between the connecting part and the fastening part or the position of the threaded connection between the connecting part and the fastening part to avoid mechanical impact of the radiator on the bracket during transportation due to small sizes of the radiator and the bracket and too large elastic spacing, further optimize the performance of the non-loose elastic component and reduce the difficulty of installation of the non-loose elastic component.

[0019] In a possible implementation of the first aspect above, in the non-detachable elastic component, the fastening end includes an end of a small-diameter connecting rod opposite to the connecting head and a nut, and the fastening component is installed on the fastening end by press riveting or expansion riveting.

[0020] The above-mentioned non-removable elastic component, by setting the connection method between the connecting component and the fastening component to compression riveting or expansion riveting, can avoid the situation where the bracket is loosened from the circuit board due to accidental touching of the fastening component or the connecting component after the non-removable elastic component is assembled on the heat sink, the bracket and the circuit board, thereby causing the heat sink to be unable to be tightly and elastically combined with the surface of the packaging structure on the circuit board, affecting the heat dissipation effect of the heat sink on the packaging structure.

[0021] In a possible implementation of the first aspect above, in the non-loose elastic component, the anti-slip component includes a limiting plate, which is clamped on the small-diameter connecting rod. The limiting plate adjusts the anti-slip distance by adjusting the clamping position with the small-diameter connecting rod.

[0022] The above-mentioned non-loose elastic component sets the anti-slip component as a limiting plate. By setting the connection method between the connecting component and the fastening component to a snap-on connection, the processing difficulty of the installation end of the connecting component is reduced, and the installation difficulty of the anti-slip component is reduced, thereby improving the installation efficiency of the non-loose elastic.

[0023] In a possible implementation of the first aspect above, in the non-detachable elastic component, the fastening end includes an end portion of a small-diameter connecting rod opposite to the connecting head, and an external thread is arranged on the outer periphery of the end portion, and the fastening component is threadedly engaged with the external thread through its internal thread to be installed with the fastening end thread.

[0024] The above-mentioned elastic component that cannot be disengaged, by setting the connection mode between the connecting component and the fastening component as a threaded connection, can adjust the length of the threaded connection between the connecting component and the fastening component or the position of the threaded connection between the connecting component and the fastening component to adjust the heat source of the radiator on the circuit board to avoid the mechanical impact of the radiator on the bracket during transportation caused by the radiator and the bracket being too small or the anti-detachment spacing being too large, further optimize the performance of the elastic component that cannot be disengaged, and reduce the difficulty of installing the elastic component that cannot be disengaged. At the same time, the fastening end is a part of the small-diameter connecting rod, so as to avoid affecting the linkage of other components in the connecting component when adjusting the fastening effect between the connecting component and the fastening component, thereby reducing the difficulty of debugging the elastic component that cannot be disengaged.

[0025] The second aspect of the present application provides a heat dissipation device, which includes a heat sink, a bracket and any one of the non-loose elastic components of the first aspect, wherein the heat sink serves as a first component, the heat sink is provided with a first through hole, the aperture of the first through hole is smaller than the spiral outer diameter of the elastic element; the bracket serves as a second component, the bracket is provided with a second through hole, the aperture of the second through hole is smaller than the diameter of the large diameter connecting rod and the outer diameter of the anti-slip component; the connecting head is located on one side of the heat sink, the large diameter connecting rod passes through the first through hole, the elastic element is sleeved on the large diameter connecting rod between the connecting head and the heat sink, the small diameter connecting rod passes through the second through hole, and the anti-slip component is installed on the end of the small diameter connecting rod passing through the second through hole; the elastic element and the anti-slip component can limit the bracket from falling off relative to the heat sink; when the connecting component passes through the third component and is installed on the fastening component to install the heat sink and the bracket on the third component, the large diameter connecting rod and the fastening component press the bracket and the third component; the elastic element elastically combines the heat sink to the bracket through elastic deformation.

[0026] That is, in the embodiment of the present application, the connector diameter of the connector is larger than the spiral outer diameter of the elastic element. The aperture of the first through hole of the first through hole in the radiator is smaller than the spiral outer diameter of the elastic element, and the aperture of the first through hole of the first through hole is larger than the major diameter of the large-diameter connecting rod. The aperture of the second through hole of the second through hole in the bracket is smaller than the major diameter of the large-diameter connecting rod and the anti-slip outer diameter of the anti-slip component, and the aperture of the second through hole of the second through hole is larger than the minor diameter of the small-diameter connecting rod. For example, the small-diameter connecting rod is threadedly connected to the bracket.

[0027] In the heat dissipation device, the connector is located at one side of the heat sink, the large-diameter connector rod penetrates the first through hole of the heat sink, the elastic element is sleeved on the large-diameter connector rod between the connector and the heat sink, the small-diameter connector rod passes through the second through hole of the bracket, and the anti-slip component is installed at the end of the small-diameter connector rod passing through the second through hole (that is, the installation end of the nail body). The nail body, the elastic element and the anti-slip component cooperate to limit the bracket from falling off relative to the heat sink.

[0028] The heat sink described above, by means of a non-detachable elastic component, limits the bracket from being separated from the radiator, thereby realizing the overall material supply of the heat sink, and at the same time, the non-detachable elastic component can also realize the fixed connection between the bracket and the circuit board, as well as the elastic combination of the radiator and the bracket. When the heat sink described above realizes the above three functions, the number of connectors required is relatively small, which simplifies the difficulty of assembling the heat sink and installing the heat sink on the circuit board. At the same time, the heat sink described above also reduces the number of holes on the circuit board for installing the heat sink described above, reduces the installation space occupied on the circuit board surface, thereby improving the effective utilization rate of the circuit board surface, enhancing the flexibility of high-density single board layout, and improving assembly efficiency.

[0029] In a possible implementation of the second aspect above, in the heat dissipation device, the number of the captive elastic components is 4, and the 4 captive elastic components are arrayed and distributed in the area where the bracket is located.

[0030] The above-mentioned heat dissipation device, by reasonably setting the number of non-releasable elastic components and reasonably arranging the distribution positions of the non-releasable elastic components, can save manufacturing costs and improve assembly efficiency while also improving the stability of the heat dissipation device structure, thereby improving the stability of the entire circuit module structure.

[0031] The third aspect of the present application provides a circuit module, which includes any one of the heat dissipation devices in the second aspect, a circuit board and a packaging structure installed on the circuit board; wherein the circuit board serves as a third component, and a third through hole corresponding to the first through hole and the second through hole is opened on the circuit board; the connecting component is installed on the fastening component through the third through hole, the large-diameter connecting rod and the fastening component press the bracket and the circuit board, and the elastic element elastically combines the heat sink and the bracket through elastic deformation.

[0032] That is, in the embodiment of the present application, the aperture of the third through hole of the third through hole on the circuit board is larger than the anti-slip outer diameter of the anti-slip component, and the aperture of the third through hole of the third through hole is smaller than the fastening outer diameter of the fastening component. The heat sink is used to dissipate heat from the packaging structure on the circuit board, the packaging structure is provided with a heat-conducting surface, and the heat sink is provided with a heat-absorbing surface adapted to the heat-conducting surface. The circuit board is located on the side of the bracket facing away from the heat sink, the packaging structure installed on the circuit board faces the heat sink, and the heat-conducting surface of the packaging structure passes through the hollow portion of the bracket and abuts against the heat-absorbing surface of the boss of the heat sink.

[0033] In other embodiments of the present application, a countersunk hole is provided on the side of the bracket facing away from the heat sink, the countersunk hole is coaxially arranged with the second through hole on the bracket, and the aperture of the countersunk hole is larger than the anti-slip outer diameter of the anti-slip component. It is understandable that the aperture of the third through hole of the third through hole in the circuit board and the anti-slip component are not specifically limited.

[0034] The above circuit module can effectively control the increase in the number of connectors when realizing the three states of anti-dropping, fixed connection and elastic connection, simplifying the installation difficulty of the circuit module, improving the assembly speed of the circuit module, and improving economic benefits. At the same time, the above circuit module also reduces the number of holes on the circuit board for installing the above heat dissipation device, reduces the installation space occupied on the circuit board surface, improves the effective utilization rate of the circuit board surface, and enhances the flexibility of high-density single board layout.

[0035] In a possible implementation of the third aspect, the circuit module further comprises a fireproof board, which is arranged on a side of the circuit board away from the packaging structure, and the fastening component is arranged on the fireproof board. The fireproof board can be used to prevent the packaging structure on the circuit board from overheating and causing a fire, and also provides an installation basis for the fastening component.

[0036] A fourth aspect of the present application provides an electronic device, which includes any circuit module in the third aspect.

[0037] The electronic device reduces the number of holes on the circuit board for installing the heat dissipation device, reduces the installation space occupied on the circuit board surface, improves the effective utilization of the circuit board surface, enhances the flexibility of high-density single-board layout, and improves the assembly speed of the circuit module.

[0038] The fifth aspect of the present application provides an assembly method for a circuit module, which is used to assemble any one of the circuit modules in the third aspect, and the assembly method includes: sleeve an elastic element on a large diameter connecting rod; pass the end of the small diameter connecting rod opposite to the connecting head through the first through hole on the heat sink and the second through hole on the bracket in sequence; install an anti-slip component on the end of the small diameter connecting rod opposite to the connecting head to limit the bracket from falling off relative to the heat sink; pass the fastening end of the connecting component through the third through hole on the circuit board; install the fastening end on the fastening component to press the bracket and the circuit board through the large diameter connecting rod and the fastening component, and elastically combine the heat sink to the bracket through the elastic deformation of the elastic element. It can be understood that the assembly method of the circuit module can be to first assemble the heat sink according to the above method, and then install the heat sink on the circuit board.

[0039] The assembly method of the circuit module can first combine the radiator and the bracket through the non-detachable elastic component to realize the integrated material of the radiator and the bracket, and then install the heat dissipation device on the circuit board through the non-detachable elastic component, thereby reducing the steps of on-site installation of the circuit module and reducing the difficulty of on-site installation of the circuit module. Secondly, the structure of the non-detachable elastic component itself reduces the number of connectors in the circuit module, further improving the installation efficiency of the circuit module. Finally, the radiator is first installed on the bracket, and then the bracket is installed on the circuit board, which can effectively avoid the heat dissipation scratching the surface of the packaging structure during the alignment of the radiator and the bracket, thereby improving the yield rate of the circuit module. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG. 1( a ) is a bottom view of a ball grid array package;

[0041] FIG1( b ) is a side view of the connection between the ball grid array package and the circuit board;

[0042] Figure 2 This is an exploded view of the circuit module of this application;

[0043] FIG3( a ) is a schematic top view of a circuit module in another technical solution, wherein a heat sink is not shown;

[0044] FIG3( b ) is a schematic top view of the circuit module 2 of the present application, wherein the heat sink is not shown;

[0045] Figure 4 The heat sink 20 in the embodiment 1 of the present application is Figure 2 Sectional view of the AA section;

[0046] Figure 5 The bracket 30 in the embodiment 1 of the present application is along Figure 2 Sectional view of the AA section;

[0047] Figure 6 The circuit board 40 and the packaging structure 50 in the embodiment 1 of the present application are arranged along Figure 2 Sectional view of the AA section;

[0048] Figure 7 The elastic component 10 in the embodiment 1 of the present application is Figure 2 Sectional view of the AA section;

[0049] FIG8( a ) is a side view of the nail body 100 in Embodiment 1 of the present application;

[0050] FIG8( b ) is a side view of the elastic element 200 in Example 1 of the present application;

[0051] FIG8(c) is a diagram of the anti-slip component 300 in Example 1 of the present application. Figure 2 Sectional view of the AA section;

[0052] FIG8(d) is a diagram of the fastening member 12 along the Figure 2 Sectional view of the AA section;

[0053] Fig. 9 The heat dissipation device 1 in the embodiment 1 of the present application is Figure 2 Sectional view of the AA section;

[0054] Fig.10 This is a flow chart of the method for assembling the heat dissipation device 1 in Example 1 of the present application;

[0055] Fig.11 The circuit module 2 in the embodiment 1 of the present application is Figure 2 Sectional view of the AA section;

[0056] FIG. 12( a ) is a schematic top view of the circuit module 2 of the present application, wherein the heat sink is not shown;

[0057] FIG12( b ) is a top view of a scattered circuit module in another technical solution, wherein the heat sink is not shown;

[0058] Fig.13 This is a flow chart of the method for assembling the circuit module 2 in Example 1 of the present application;

[0059] Fig.14 The elastic component 10' in the second embodiment of the present application is Figure 2 Sectional view of the AA section;

[0060] Fig.15 The heat dissipation device 1' in Example 2 of the present application is Figure 2 Sectional view of the AA section;

[0061] Fig.16 The circuit module 2' in the embodiment 2 of the present application is Figure 2 Section view of section AA in the figure.

[0062] Among them, in the reference numerals,

[0063] Other technologies

[0064] 20- Radiator;

[0065] 30-Bracket;

[0066] 40-circuit board;

[0067] 50-package structure; 51-signal pin; 52-solder ball;

[0068] 60-Bracket screws (lock the bracket to the circuit board);

[0069] 70-positioning pin;

[0070] 80-heat sink screws (locks the heat sink to the circuit board);

[0071] Example 1

[0072] 1- Heat dissipation device;

[0073] 10- loose elastic component; S 防脱 - Anti-slip spacing; S 固定 -Fixed spacing; S 弹性 - Elastic spacing;

[0074] 11- Connecting parts;

[0075] 100-nail body; l a - nail body axial direction; l r - radial direction of nail body; 101- mounting end;

[0076] 110-connector; 110a-connector end face; D 1 -Connector diameter;

[0077] 120-large diameter connecting rod; 120a-large diameter end face; D 2 -Large diameter;

[0078] 130-small diameter connecting rod; D 3 - small diameter;

[0079] 200-elastic element; 201-first elastic end; 202-second elastic end; D 4 - outer diameter of the spiral;

[0080] 300-anti-slip component; 300a-installation internal thread; 300b-anti-slip end face; 300c-fastening external thread; D 5 - Anti-slip outer diameter;

[0081] 12-fastening component; 12a-fastening internal thread; 12b-fastening end face; D 6 - Fastening outer diameter;

[0082] 20- radiator; 20a- heat absorbing surface;

[0083] 21-substrate; 21a-first substrate surface; 21b-second substrate surface;

[0084] 22-fins;

[0085] 23- boss;

[0086] 24-first through hole; d 1 - the aperture of the first through hole;

[0087] 25- air duct;

[0088] 30-Bracket;

[0089] 31-frame structure; 31a-first bracket surface; 31b-second bracket surface;

[0090] 32- hollow part;

[0091] 33- second through hole; d 2 - the aperture of the second through hole;

[0092] 40-circuit board; 40a-first circuit board surface; 40b-second circuit board surface;

[0093] 41- third through hole; d 3 - the aperture of the third through hole;

[0094] 50-packaging structure; 50a-heat conducting surface;

[0095] 90-fireproof board;

[0096] 2-Circuit module;

[0097] Example 2

[0098] 1'-heat dissipation device;

[0099] 10'-loose elastic component; S 防脱 '- Anti-slip spacing;

[0100] 11'-connecting part;

[0101] 300'-anti-slip component; 300b'-anti-slip end surface; D 5 '-anti-slip outer diameter;

[0102] 2'-Circuit module. DETAILED DESCRIPTION

[0103] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0104] As described above, the bracket currently used to prevent the circuit board from warping and deformation requires additional mounting holes to be opened on the circuit board, resulting in a larger mounting area on the circuit board surface for mounting the heat sink and the bracket, and a smaller actual effective use area of ​​the circuit board surface.

[0105] In order to solve the above problems and to improve the actual effective utilization rate of the circuit board surface, the present application provides a circuit module. The circuit module includes a non-loose elastic component, a heat sink, a bracket, a circuit board, and a packaging structure installed on the circuit board. The packaging structure is a carrier for accommodating and encapsulating a number of semiconductor elements or integrated circuits, and its material can be any one of metal, plastic, glass and ceramic. Specifically, after etching the semiconductor component core or integrated circuit on the wafer and cutting the wafer into independent grains, the packaging structure assembles or pots several grains into one to form a packaging structure. The packaging structure can protect the grains from impact and scratches, while providing the grains with pins or contacts connected to the external circuit, and can also take away the heat generated when the grains are working to reduce the temperature of the grains in the working state.

[0106] As shown in FIG. 1(a), the ball grid array package (BGA) in the package structure 50 can provide more signal pins 51 than other package structures because the entire bottom surface can be used as a signal pin 51, and has better high-speed performance, making the ball grid array package widely used in chips with more complex functions. However, the temperature of the chip in the ball grid array package increases during use, and the circuit board connected to the ball grid array package may warp and deform due to factors such as material, structure, shape and installation layout, as shown in FIG. 1(b), which leads to greater stress at the fusion point between the solder ball 52 on the ball grid array package and the solder pad of the circuit board 40, making the contact of the solder ball 52 unstable, thereby reducing the reliability of signal and transmission.

[0107] Figure 2This is an exploded view of the circuit module 2 of the present application after being turned upside down, wherein the packaging structure is not shown. Figure 2 It can be seen that the circuit module 2 includes a heat dissipation device 1 and a circuit board 40 , a packaging structure is installed on the board surface of the circuit board 40 , and the heat dissipation device 1 includes a non-releasable elastic component 10 , a heat sink 20 and a bracket 30 .

[0108] For the heat dissipation device 1, the connecting component 11 in the non-loose elastic component 10 passes through the first through hole (not marked) on the radiator 20 and the second through hole (not marked) on the bracket 30, and a connecting head (not shown) with an outer diameter larger than the aperture of the first through hole is formed on the side of the radiator 20 facing away from the bracket 30, and an anti-slip component (not marked) with an outer diameter larger than the aperture of the second through hole is formed on the side of the bracket 30 facing away from the radiator 20, so that the connecting component 11 cooperates with the anti-slip component through the connecting head to limit the bracket 30 from falling off relative to the radiator 20.

[0109] For the circuit module 2, the connecting component 11 in the non-removable elastic component 10 is installed on the fastening component 12 through the third through hole (not shown) on the circuit board 40, wherein the connecting component 11 is formed with one end surface (not shown) facing the fastening component 12, and the fastening component 12 is formed with another end surface (not shown) facing the connecting component 11. Figure 2 The end face of the fastening component 12 in the middle faces downwards), the non-detachable elastic component 10 cooperates with one end face and the other end face to press the bracket 30 and the circuit board 40, so as to achieve a fixed connection between the bracket 30 and the circuit board 40. At the same time, the connecting component 11 also includes an elastic element (not shown), and the non-detachable elastic component 10 is elastically deformed by the elastic element and cooperates with the fastening component 12 to elastically combine the heat sink 20 with the bracket 30. Since the bracket 30 and the circuit board 40 are fixedly connected at this time, the heat sink 20 is also elastically combined with the circuit board 40, and then the heat absorption surface 20a of the heat sink 20 elastically abuts against the heat conduction surface (not shown) of the packaging structure (not shown) installed on the circuit board 40.

[0110] FIG3(a) shows a schematic top view of a circuit module 2 in another technical solution (where the heat sink is not shown). As shown in FIG3(a), in addition to the heat sink, the bracket 30, the circuit board 40 and the packaging structure 50 installed on the circuit board 40, the circuit module 2 also includes a bracket screw 60 for installing the bracket 30 on the circuit board 40, a positioning pin 70 for determining the relative position of the bracket 30 and the circuit board 40 and the relative position of the heat sink and the bracket 30, and a heat sink screw 80 for installing the heat sink on the circuit board 40 or installing the heat sink on the bracket 30. According to FIG3(a), in order to achieve a stable connection between the heat sink, the bracket 30 and the circuit board 40, the circuit module 2 includes 4 bracket screws 60, 2 positioning pins 70 and 4 heat sink screws 80, that is, a total of 10 connection components are required to complete the installation of the heat sink, the bracket 30 and the circuit board 40 in the circuit module 2, that is, 10 screw holes need to be opened on the circuit board 40. In order to ensure the reliability of circuit module 2, a bright copper area (that is, a copper area that leaks out of the PCB metal layer) and a forbidden area (an area where components or PCB traces are prohibited) must be reserved around each screw hole, resulting in a larger area occupied by the screw holes, ultimately reducing the flexibility of high-density layout of the single board.

[0111] The technical solution in the present application is a schematic top view of the circuit module 2 shown in FIG3(b) (where the heat sink is not shown). The circuit module 2 in the technical solution of the present application includes four non-releasable elastic components 10, through which the bracket 30 and the circuit board 40 can be fixedly connected, and the heat sink and the bracket 30 can be elastically combined. The above-mentioned circuit module 2 realizes the above-mentioned three functions, and only needs to open four mounting holes on the heat sink, the bracket 30 and the circuit board 40, thereby reducing the number of connecting components, and thus reducing the installation space occupied on the board surface of the circuit board 40, thereby improving the effective utilization rate of the board surface of the circuit board 40, and thus improving the flexibility of high-density single board layout.

[0112] It is understandable that the above-mentioned elastic component 10 can be applied to the heat sink 20 (such as Figure 2 The installation of the non-detachable elastic component 10 and the bracket 30 can also be applied to other application scenarios. For example, the non-detachable elastic component 10 can also be applied to the installation of radiators on other heat source surfaces. The present application does not impose specific restrictions on the application scenarios of the non-detachable elastic component 10. For ease of understanding, the following will continue to take the installation scenario of the non-detachable elastic component 10 applied to the radiator 20 and the bracket 30 on the circuit board 40 as an example to explain in detail the specific structure, working principle and installation method of the non-detachable elastic component 10.

[0113] The following will describe in detail the non-detachable elastic component 10, the heat dissipation device 1, the circuit module 2, the assembly method of the circuit module 2 and the electronic device disclosed in the present application.

[0114] Example 1

[0115] according to Figure 2 As can be seen from FIG. 3 , the present application provides a circuit module 2, including a heat dissipation device 1 and a circuit board 40, on which a packaging structure 50 is installed. Furthermore, the heat dissipation device 1 includes a non-detachable elastic component 10, a heat sink 20 and a bracket 30. When the heat dissipation device 1 is not assembled on the circuit board 40, the non-detachable elastic component 10 can limit the bracket 30 from falling off relative to the heat sink 20, so as to realize the integrated material of the heat sink 20 and the bracket 30. When the heat dissipation device 1 is assembled on the circuit board 40, the non-detachable elastic component 10 can fix the bracket 30 and the circuit board 40, and can also elastically combine the heat sink 20 to the bracket 30, thereby realizing that the heat absorption surface 20a of the heat sink 20 elastically abuts against the heat conduction surface of the packaging structure 50.

[0116] Among them, the non-detachable elastic component 10 is a connection structure between the heat sink 20, the bracket 30 and the circuit board 40. Therefore, in order to clearly describe the structural characteristics and working principles of the non-detachable elastic component 10, this application needs to introduce the specific structure of the heat sink 20, the bracket 30 and the circuit board 40 (including the packaging structure 50 installed on the circuit board 40) in this embodiment in advance.

[0117] In some embodiments of the present application, the radiator 20 is an air-cooled radiator. Figure 4 The air-cooled heat sink 20 in Example 1 of the present application is along Figure 2 The sectional view of the AA section in the figure. Figure 4 The specific structure of the heat sink 20 is described in detail.

[0118] In some embodiments of the present application, Figure 4 As shown, the heat sink 20 is an air-cooled heat sink, and the heat sink 20 includes a substrate 21, fins 22, and a boss 23. The substrate 21 is formed with a first substrate surface 21a and a second substrate surface 21b that are opposite to each other and face oppositely. The substrate 21 is also provided with a first through hole 24, and the first through hole 24 connects the first substrate surface 21a and the second substrate surface 21b. For the convenience of subsequent description, the aperture of the first through hole 24 is recorded as d in this application. 1 As can be seen from the above, the captive elastic component 10 is installed in the first through hole 24 of the heat sink 20 .

[0119] The fins 22 are arranged in parallel on the first substrate surface 21a of the substrate 21. The substrate 21 and the fins 22 can be integrated by welding, machining, cutting, stamping or forging. An air duct 25 is formed between adjacent fins 22. During the heat dissipation process, the gas flows along the extension direction of the air duct 25 (such as Figure 2 The direction of the gas is d w ).For example, Figure 4 The flow direction of the gas is perpendicular to the paper surface and outward, or the flow direction of the gas is perpendicular to the paper surface and inward.

[0120] The boss 23 protrudes outward from the second substrate surface 21b of the substrate 21 in a direction away from the substrate 21. The side of the boss 23 facing away from the substrate 21 is the heat absorbing surface 20a. Furthermore, a heat conducting layer is coated on the heat absorbing surface 20a to improve the heat conduction efficiency of the heat absorbing surface 20a, thereby improving the heat dissipation effect of the heat sink 20.

[0121] Specifically, combined Figure 2 , Figure 3 and Figure 4 It can be seen that the boss 23 absorbs the heat generated by the packaging structure 50 from the heat conducting surface (not shown) of the packaging structure 50 through the heat absorbing surface 20a, and transfers the absorbed heat to the fins 22 through the substrate 21. The fins 22 dissipate the heat through the gas flowing in the air duct 25, thereby reducing the temperature of the packaging structure 50.

[0122] In order to improve the heat dissipation efficiency of the radiator 20 and reduce the difficulty of debugging the non-loose elastic component 10, in some embodiments of the present application, the first substrate surface 21a and the second substrate surface 21b of the substrate 21 are parallel to each other to achieve the consistency of thermal conductivity of the substrate 21, thereby achieving uniform heat dissipation of each point on the thermal conductive surface of the packaging structure 50 by the radiator 20, thereby optimizing the heat dissipation effect of the radiator 20.

[0123] In other alternative embodiments, the radiator 20 may also be a liquid-cooled plate radiator.

[0124] Figure 5 The bracket 30 in the embodiment 1 of the present application is along Figure 2 The sectional view of the AA section in the figure. Figure 5 The specific structure of the bracket 30 is described in detail.

[0125] Combination Figure 2 , Figure 4 and Figure 5It can be seen that in some embodiments of the present application, the bracket 30 is a frame structure 31, and a hollow portion 32 is formed in the frame structure 31. The hollow portion 32 is used for the boss 23 in the heat sink 20 to pass through. The frame structure 31 is formed with a first bracket surface 31a and a second bracket surface 31b that are oppositely positioned and facing oppositely. The frame structure 31 is also provided with a second through hole 33, and the second through hole 33 connects the first bracket surface 31a and the second bracket surface 31b. For the convenience of subsequent description, the aperture of the second through hole 33 is recorded as d in the present application. 2 As can be seen from the above, the captive elastic component 10 is installed in the second through hole 33 of the bracket 30 .

[0126] Specifically, combined Figure 2 , Figure 4 and Figure 5 It can be seen that when the radiator 20 is installed on the bracket 30, or the radiator 20 is installed on the bracket 30 and the circuit board 40, the first bracket surface 31a in the bracket 30 is used to abut against the second substrate surface 21b in the radiator 20 to achieve the fit between the bracket 30 and the radiator 20, and the boss 23 in the radiator 20 passes through the hollow portion 32 in the bracket 30.

[0127] It can be understood that the above-mentioned radiator 20 and bracket 30 are used as examples for explanation in the embodiments of the present application, which does not mean that the non-detachable elastic component 10 in the present application is only applicable to the above-mentioned radiator 20 and bracket 30, and the present application does not limit the specific structure of the radiator 20 and bracket 30.

[0128] Figure 6 The circuit board 40 and the packaging structure 50 in the embodiment 1 of the present application are arranged along Figure 2 The sectional view of the AA section in the figure. Figure 6 The specific structure of the circuit board 40 (including the packaging structure 50 mounted on the circuit board 40) is described in detail.

[0129] like Figure 6 As shown, the circuit board 40 is formed with a first circuit board surface 40a and a second circuit board surface 40b which are opposite to each other and face opposite to each other. The circuit board 40 is also provided with a third through hole 41, which connects the first circuit board surface 40a and the second circuit board surface 40b. The third through hole 41 is opposite to the first through hole 24 and the second through hole 33. For the convenience of subsequent description, the aperture of the third through hole 41 is recorded as d 3 . As can be seen from the above, the non-loose elastic component 10 is installed in the third through hole 41 of the circuit board 40. In addition, a packaging structure 50 is also installed on the circuit board 40, and the side of the packaging structure 50 facing away from the circuit board 40 is a heat conducting surface 50a. In order to achieve stable fitting between the heat sink 20 and the packaging structure 50, the third through holes 41 are evenly distributed around the packaging structure 50.

[0130] Specifically, combined Figure 2 , Figure 4 , Figure 5 and Figure 6 It can be seen that when the heat sink 20 is installed on the bracket 30 and the circuit board 40 , the boss 23 in the heat sink 20 passes through the hollow portion 32 in the bracket 30 , and the heat absorption surface 20 a on the boss 23 is in contact with the heat conduction surface 50 a of the packaging structure 50 .

[0131] The circuit module 2 controls the relative position of the first through hole 24 and the heat absorbing surface 20a, and controls the relative position of the third through hole 41 and the heat conducting surface 50a, so that when the elastic component 10 that does not loosen installs the heat sink 20 and the bracket 30 on the circuit board 40 (that is, when the axes of the first through hole 24, the second through hole 33 and the third through hole 41 coincide with each other), the heat absorbing surface 20a of the boss 23 in the heat sink 20 is aligned with the heat conducting surface 50a of the packaging structure 50, thereby reducing the area of ​​the heat absorbing surface 20a of the heat sink 20 as much as possible while ensuring the heat dissipation effect, thereby reducing the manufacturing cost of the heat sink 20.

[0132] After describing the heat sink 20, the bracket 30, and the circuit board 40 (including the packaging structure 50 installed on the circuit board 40), the present application will continue to describe the specific structure and working principle of the non-detachable elastic component 10 used to connect the heat sink 20, the bracket 30 and the circuit board 40 in combination with the specific structures of the heat sink 20, the bracket 30, and the circuit board 40 (including the packaging structure 50 installed on the circuit board 40) mentioned above.

[0133] Figure 7 The elastic component 10 in the embodiment 1 of the present application is along Figure 2 FIG8(a) is a side view of the nail body 100 in the connecting component 11 of the embodiment 1 of the present application. FIG8(b) is a side view of the elastic element 200 in the connecting component 11 of the embodiment 1 of the present application. FIG8(c) is a side view of the anti-slip component 300 in the connecting component 11 of the embodiment 1 of the present application along the Figure 2 FIG8(d) is a cross-sectional view of the fastening component 12 along the AA section in the embodiment 1 of the present application. Figure 2 The sectional view of the AA section in the figure. Figure 2 to Figure 8(d) The specific structure and working principle of the non-loose elastic component 10 are described in detail.

[0134] like Figure 7 As shown, in embodiment 1 of the present application, a non-removable elastic component 10 is provided, and the non-removable elastic component 10 includes a connecting component 11 and a fastening component 12. The connecting component 11 includes a nail body 100, an elastic element 200 and an anti-removal member 300.

[0135] Specifically, as shown in FIG8( a ), the nail body 100 includes a connector 110, a large-diameter connector rod 120, and a small-diameter connector rod 130. For the convenience of subsequent description, the outer diameter of the connector 110 is referred to as the connector diameter D in this application. 1 , the outer diameter of the large diameter connecting rod 120 is recorded as the large diameter D 2 , the outer diameter of the small-diameter connecting rod 130 is recorded as the small diameter D 3 At the same time, the axial direction of the large diameter connecting rod 120 (or the small diameter connecting rod 130) is defined as the axial direction of the nail body l a (As shown in Figure 8(a) a ), and the direction perpendicular to the nail body axis is defined as the nail body radial direction l r (As shown in Figure 8(a) r ).

[0136] 8 (a), the connector 110, the large diameter connecting rod 120 and the small diameter connecting rod 130 are all along the axial direction of the nail body l a The connector 110, the large diameter connecting rod 120 and the small diameter connecting rod 130 are connected in sequence. 1 Greater than the large diameter D of the large diameter connecting rod 120 2 , the large diameter D of the large diameter connecting rod 120 2 Greater than the small diameter D of the small diameter connecting rod 130 3 .

[0137] Further, as shown in FIG8( a ), the connector 110 is formed with an annular connector end face 110 a at one end connected to the large-diameter connector rod 120. The large-diameter connector rod 120 is formed with an annular large-diameter end face 120 a at one end connected to the small-diameter connector rod 130. The end of the small-diameter connector rod 130 opposite to the connector 110 (i.e., the end of the small-diameter connector rod 130 facing away from the large-diameter connector rod 120) is a mounting end 101 for mounting the anti-slip component 300.

[0138] As shown in FIG8(b), the elastic element 200 is a spiral rotation structure, and the elastic element 200 includes a first elastic end 201 and a second elastic end 202. At the same time, the outer dimension of the elastic element 200 (the outer diameter of the elastic element 200 after spiraling) is recorded as the spiral outer diameter D of the elastic element 200. 4 In the non-detachable elastic component 10 , the elastic element 200 is sleeved on the large diameter connecting rod 120 in the nail body 100 , and the first elastic end 201 of the elastic element 200 can abut against the connector end surface 110a of the connector 110 , and the second elastic end 202 of the elastic element 200 can be used to abut against the first substrate surface 21a of the heat sink 20 .

[0139] As shown in FIG8(c), the anti-slip member 300 is a nut, and the anti-slip member 300 is formed with an internal mounting thread 300a adapted to the mounting end of the nail body 100, and an anti-slip end surface 300b for limiting the bracket 30 from falling off relative to the heat sink 20. For the convenience of subsequent description, the outer diameter of the anti-slip member 300 is recorded as the anti-slip outer diameter D in this application. 5 The end of the anti-slip component 300 opposite to the connecting head 110 (i.e., the end of the anti-slip component 300 facing away from the large-diameter connecting rod 120) and the end of the small-diameter connecting rod 130 opposite to the connecting head 110 (i.e., the end of the small-diameter connecting rod 130 facing away from the large-diameter connecting rod 120) are fastening ends (not shown) for installation on the fastening component 12.

[0140] Specifically, when the anti-slip component 300 is installed on the nail body 100 by installing the internal thread 300a, the anti-slip end surface 300b faces the large diameter end surface 120a of the large diameter connecting rod 120 in the nail body 100. An anti-slip spacing S is formed between the elastic element 200 and the anti-slip component 300 to prevent the bracket 30 from falling off relative to the heat sink 20. 防脱 It is understandable that the anti-slip spacing S 防脱 After the elastic component 10 is installed on the heat sink 20 and the bracket 30 , the distance between the anti-loosening end surface 300 b and the second elastic end 202 of the elastic element 200 is reduced.

[0141] In some embodiments of the present application, as shown in FIG8(c), the anti-slip component 300 is further formed with a fastening external thread 300c adapted to the fastening component 12, and the anti-slip component 300 is threadedly connected to the fastening component 12 through the fastening external thread 300c. In order to ensure the connection strength between the nail body 100 and the anti-slip component 300 and the realization of various functions in the circuit module 2, the outer peripheral surface of the fastening component 12 is entirely provided with a fastening external thread 300c.

[0142] In other alternative embodiments, in order to reduce the difficulty of installing the anti-slip component 300 and the nail body 100, an installation portion is provided in an area of ​​the outer peripheral surface of the fastening component 12 that is closer to the anti-slip end face 300b, and a fastening external thread 300c is provided in an area of ​​the outer peripheral surface of the fastening component 12 that is farther away from the anti-slip end face 300b.

[0143] As shown in FIG8(d), the fastening component 12 is formed with a fastening internal thread 12a adapted to the fastening external thread 300c of the anti-slip member 300, and the connecting component 11 and the fastening component 12 are threadedly connected through the fastening external thread 300c and the fastening internal thread 12a. The non-loose elastic component 10 achieves a fixed connection between the bracket 30 and the circuit board 40 by adjusting the length of the threaded connection between the connecting component 11 and the fastening component 12. For the convenience of subsequent description, the outer diameter of the fastening component 12 is recorded as the fastening outer diameter D in this application. 6The fastening member 12 is also formed with a fastening end surface 12b.

[0144] Specifically, when the connecting component 11 is mounted on the fastening component 12, the fastening end surface 12b faces the large diameter end surface 120a. A fixed spacing S is formed between the fastening component 12 and the large diameter connecting rod 120 to fix the bracket 30 and the circuit board 40. 固定 It is understandable that the fixed spacing S 固定 After the heat sink 20 and the bracket 30 are mounted on the circuit board 40, the distance between the fastening end face 12b of the fastening component 12 and the large diameter end face 120a of the large diameter connecting rod 120 is set to prevent the elastic component 10 from being loosened. The fastening component 12 and the elastic element 200 form an elastic distance S that enables the heat sink 20 to be elastically coupled to the bracket 30. 弹性 It is understandable that the elastic spacing S 弹性 To prevent the elastic component 10 from being loosened, after the heat sink 20 and the bracket 30 are mounted on the circuit board 40 , a distance is set between the fastening end surface 12 b of the fastening component 12 and the second elastic end 202 of the elastic element 200 .

[0145] In other alternative embodiments, the connection method between the connecting component 11 and the fastening component 12 is pressure riveting or expansion riveting, and the anti-dropping spacing S 防脱 , fixed spacing S 固定 and elastic spacing S 弹性 The same as the above-mentioned implementation mode, this application will not elaborate on it.

[0146] The above describes in detail the structural features of each component in the non-detachable elastic component 10. The following will combine the structural features described above to describe the assembly method of the non-detachable elastic component 10 on the heat sink 20, the bracket 30 and the circuit board 40 through the heat dissipation device 1 and the circuit module 2, as well as the working principle of the non-detachable elastic component 10 cooperating with each component to achieve the three functions of non-detachability, fixation and elasticity.

[0147] First, based on the structural features of the captive elastic component 10, the heat sink 20 and the bracket 30, how the captive elastic component 10 in the heat sink 1 cooperates with the heat sink 20 and the bracket 30 to limit the bracket 30 from falling off relative to the heat sink 20 is described. Fig. 9 The heat dissipation device 1 in the embodiment 1 of the present application is along Figure 2 Section view of section AA in the figure.

[0148] like Fig. 9 As shown, the heat dissipation device 1 includes any one of the above-mentioned non-releasable elastic components 10, a heat sink 20 and a bracket 30. Figure 2 , Figures 4 to 9 It can be seen that the connector diameter D of the connector 110 is 1 Greater than the spiral outer diameter D of the elastic element 2004 The diameter d of the first through hole 24 in the heat sink 20 is 1 Smaller than the spiral outer diameter D of the elastic element 200 4 , the aperture d of the first through hole 24 1 Greater than the large diameter D of the large diameter connecting rod 120 2 The diameter d of the second through hole 33 in the bracket 30 is 2 Smaller than the large diameter D of the large diameter connecting rod 120 2 and the anti-detachment outer diameter D of the anti-detachment member 300 5 , the aperture d of the second through hole 33 2 Greater than the small diameter D of the small diameter connecting rod 130 3 For example, the small-diameter connecting rod 130 is threadedly connected to the bracket 30 .

[0149] The connector 110 is located on the side of the heat sink 20 where the first substrate surface 21a is formed, the large-diameter connecting rod 120 penetrates the first through hole 24 of the heat sink 20, the elastic element 200 is sleeved on the large-diameter connecting rod 120 between the connector 110 and the heat sink 20, the small-diameter connecting rod 130 passes through the second through hole 33 of the bracket 30, and the anti-slip component 300 is installed at the end of the small-diameter connecting rod 130 that passes through the second through hole 33 (that is, the mounting end 101 of the nail body 100 shown in FIG. 8(a)). The nail body 100, the elastic element 200 and the anti-slip component 300 cooperate to limit the bracket 30 from falling off relative to the heat sink 20.

[0150] After introducing the specific structure of the heat dissipation device 1 , the assembly method between the components of the heat dissipation device 1 will be described in detail below by taking the above heat dissipation device 1 as an example. Fig.10 A flow chart of a method for assembling a heat dissipation device 1 is shown.

[0151] The present application also provides an assembly method of the heat dissipation device 1, such as Fig.10 As shown, the assembly method of the heat dissipation device 1 includes:

[0152] S1001: Sleeve the elastic element 200 on the large diameter connecting rod 120. Specifically, the elastic element 200 is sleeved on the nail body 100 from the mounting end 101 of the small diameter connecting rod 130, and the first elastic end 201 of the elastic element 200 can abut against the connector end surface 110a of the connector 110.

[0153] S1002: Pass the end of the small-diameter connecting rod 130 opposite to the connecting head 110 (the mounting end 101 of the nail body 100 ) through the first through hole 24 on the heat sink 20 and the second through hole 33 on the bracket 30 in sequence.

[0154] S1003: Install the anti-dropout component 300 on the mounting end 101 of the nail body 100 passing through the second through hole 33, that is, install the anti-dropout component 300 on the end of the small-diameter connecting rod 130 opposite to the connecting head 110 to limit the bracket 30 from falling off relative to the radiator 20.

[0155] In some embodiments of the present application, the anti-slip component 300 is threadedly connected to the mounting end 101 of the nail body 100. In other alternative implementations, the anti-slip component 300 and the mounting end 101 of the nail body 100 can also be connected by other methods such as pressure riveting or expansion riveting, which is not limited in the embodiments of the present application.

[0156] Secondly, according to the structural features of the non-detachable elastic component 10, the heat sink 20, the bracket 30 and the circuit board 40 (including the packaging structure 50 installed on the circuit board 40), it is described how the non-detachable elastic component 10 in the circuit module 2 cooperates with the heat sink 20, the bracket 30 and the circuit board 40 (including the packaging structure 50 installed on the circuit board 40) to fix the bracket 30 to the circuit board 40 and elastically combine the heat sink 20 relative to the bracket 30. Fig.11 The circuit module 2 in the embodiment 1 of the present application is arranged along Figure 2 Section view of section AA in the figure.

[0157] like Fig.11 As shown, the present application also provides a circuit module 2, which includes any one of the above-mentioned heat dissipation devices 1, a circuit board 40, and a packaging structure 50 mounted on the circuit board 40. The heat dissipation device 1 includes a non-releasable elastic component 10, a heat sink 20, and a bracket 30.

[0158] Combination Figures 4 to 11 It can be seen that the aperture d of the third through hole 41 on the circuit board 40 is 3 Greater than the anti-detachment outer diameter D of the anti-detachment member 300 5 , the aperture d of the third through hole 41 3 Smaller than the fastening outer diameter D of the fastening component 12 6 .

[0159] Specifically, the heat sink 20 is used to dissipate heat for the package structure 50 on the circuit board 40. The package structure 50 is provided with a heat conducting surface 50a, and the heat sink 20 is provided with a heat absorbing surface 20a adapted to the heat conducting surface 50a. The circuit board 40 is located on the side of the bracket 30 facing away from the heat sink 20. The package structure 50 mounted on the circuit board 40 faces the heat sink 20, and the heat conducting surface 50a of the package structure 50 passes through the hollow portion 32 (such as Figure 2 ) abuts against the heat absorbing surface 20a of the boss 23 of the heat sink 20.

[0160] In other alternative implementations, a countersunk hole is formed on the side of the bracket 30 facing away from the radiator 20. The countersunk hole is coaxially arranged with the second through hole 33 on the bracket 30, and the hole diameter of the countersunk hole is larger than the anti-slip outer diameter D of the anti-slip member 300. 5 In this implementation, the aperture d of the third through hole 41 in the circuit board 40 is 3 The outer diameter D of the anti-detachment member 300 5 The size relationship is not specifically limited.

[0161] When the fastening end of the connecting component 11 passes through the third through hole 41 on the circuit board 40 and is installed on the fastening component 12 to install the heat sink 20 and the bracket 30 on the circuit board 40, the third through hole 41 on the circuit board 40 is opposite to the first through hole 24 and the second through hole 33. The fastening end includes the end of the small-diameter connecting rod 130 opposite to the connector 110 and the anti-slip component 300, and a fastening external thread 300c is provided on the outer periphery of the anti-slip component 300, and the fastening component 12 is screwed with the fastening external thread 300c through its fastening internal thread 12a to be threadedly installed with the fastening end. The first elastic end 201 of the elastic element 200 abuts against the connector end surface 110a of the connector 110, the second elastic end 202 of the elastic element 200 abuts against the first substrate surface 21a of the radiator 20, the heat absorption surface 20a of the radiator 20 elastically abuts against the heat conduction surface 50a of the packaging structure 50 on the circuit board 40 (that is, the second substrate surface 21b of the radiator 20 abuts against the first bracket surface 31a of the bracket 30), the second bracket surface 31b of the bracket 30 abuts against the first circuit board surface 40a of the circuit board 40, and the second circuit board surface 40b of the circuit board 40 abuts against the fastening end surface 12b of the fastening component 12.

[0162] The large diameter connecting rod 120 and the fastening component 12 press the bracket 30 and the circuit board 40 through the large diameter end surface 120a and the fastening end surface 12b to fix the bracket 30 and the circuit board 40. The elastic element 200 elastically combines the heat sink 20 with the bracket 30 through its own structural elastic deformation, thereby making the heat absorption surface 20a of the heat sink 20 elastically abut against the heat conduction surface 50a of the packaging structure 50.

[0163] In some embodiments of the present application, the number of the captive elastic components 10 is four, and the four captive elastic components 10 are arrayed at the four vertex corners of the bracket 30 .

[0164] It is understandable that the number of the non-detachable elastic components 10 of the present application is not specifically limited. In order to improve the stability of the structure of the heat sink 1, in some embodiments of the present application, the number of the non-detachable elastic components 10 can be an even number, and symmetrically distributed on both sides of the center line of the packaging structure 50. In other alternative embodiments, the number of the non-detachable elastic components 10 can be an odd number. It is understandable that the number of the non-detachable elastic components 10 is not specifically limited in the present application as long as it can stably connect the heat sink 20, the bracket 30 and the circuit board 40.

[0165] In some embodiments of the present application, Fig.11 As shown, the circuit module 2 further includes a fireproof board 90, which is disposed on the side of the circuit board 40 facing away from the packaging structure 50, and the fastening component 12 is disposed on the fireproof board 90. For example, the fastening component 12 is embedded in the fireproof board 90. The fireproof board 90 is used to prevent the packaging structure 50 on the circuit board 40 from being overheated and causing a fire.

[0166] The technical solution in the present application is a schematic top view of the circuit module 2 shown in FIG. 12( a ) (where the heat sink is not shown). The circuit module 2 in the technical solution of the present application includes four non-releasable elastic components 10, through which the bracket 30 and the circuit board 40 can be fixedly connected, and the heat sink and the bracket 30 can be elastically combined. In the above-mentioned circuit module 2, only four mounting holes need to be opened on the heat sink, the bracket 30 and the circuit board 40, so that the installation space occupied on the board surface of the circuit board 40 can be reduced, thereby improving the effective utilization rate of the board surface of the circuit board 40 and improving the installation efficiency of the circuit module.

[0167] FIG12(b) shows a schematic top view of a circuit module 2 in another technical solution (where the heat sink is not shown). As shown in FIG12(b), in addition to the heat sink, the bracket 30, the circuit board 40 and the packaging structure 50 mounted on the circuit board 40, the circuit module 2 also includes a bracket screw 60 for mounting the bracket 30 on the circuit board 40, a positioning pin 70 for determining the relative position of the bracket 30 and the circuit board 40 and the relative position of the heat sink and the bracket 30, and a heat sink screw 80 for mounting the heat sink on the circuit board 40 or mounting the heat sink on the bracket 30. As can be seen from FIG3, in order to achieve a stable connection between the heat sink, the bracket 30 and the circuit board 40, the circuit module 2 includes 4 bracket screws 60, 2 positioning pins 70 and 4 heat sink screws 80, that is, a total of 10 connection components are required to complete the installation of the heat sink, the bracket 30 and the circuit board 40 in the circuit module 2.

[0168] After describing the specific structure of the circuit module 2, the following will take the above-mentioned circuit module 2 as an example to explain in detail the assembly method of the non-loose elastic component 10, the heat sink 20, the bracket 30 and the circuit board 40 (including the packaging structure 50 installed on the circuit board 40) in the circuit module 2. Fig.13 A flow chart of a method for assembling a circuit module 2 is shown.

[0169] The present application also provides an assembly method of the circuit module 2, such as Fig.13 As shown, the assembly method of the circuit module 2 includes:

[0170] S1301: Step S1301 is the same as step S1001 and will not be described in detail here.

[0171] S1302: Step S1302 is the same as step S1002 and will not be described in detail here.

[0172] S1303: Step S1303 is the same as step S1003 and will not be described in detail here.

[0173] S1304 : Pass the connecting component 11 through the third through hole 41 on the circuit board 40 , so that the fastening end of the connecting component 11 protrudes out of the circuit board 40 .

[0174] S1305 : Install the fastening end to the fastening component 12 to press the bracket 30 and the circuit board 40 through the large-diameter connecting rod 120 and the fastening component 12 , and elastically combine the heat sink 20 to the bracket 30 through the elastic deformation of the elastic element 200 .

[0175] Specifically, the fastening end of the connecting component 11 is mounted on the fastening component 12, so that the large-diameter connecting rod 120 and the fastening component 12 are pressed against the bracket 30 and the circuit board 40 by adjusting the length of the threaded connection between the fastening component 12 and the anti-slip member 300 and the length of the threaded connection between the small-diameter connecting rod 130 and the anti-slip member 300, so that the bracket 30 is fixed to the circuit board 40. At the same time, by adjusting the length of the threaded connection between the small-diameter connecting rod 130 and the anti-slip member 300 and the length of the threaded connection between the small-diameter connecting rod 130 and the anti-slip member 300, the elastic deformation of the elastic element 200 can also be adjusted to elastically combine the heat sink 20 with the bracket 30.

[0176] In other replaceable embodiments, when the connection method between the connecting component 11 and the fastening component 12 is riveting, steps S1304 and S1305 in the assembly method of the above-mentioned circuit module 2 include: passing the connecting component 11 through the third through hole 41 on the circuit board 40 so that the fastening end of the connecting component 11 extends out of the circuit board 40; installing the fastening end of the connecting component 11 on the fastening component 12, so as to adjust the length of the threaded connection between the fastening component 12 and the anti-slip component 300, thereby fixing the bracket 30 to the circuit board 40, and making the heat sink 20 elastically combined with the bracket 30 under the action of elastic deformation.

[0177] Furthermore, the present application also provides an electronic device, comprising at least one set of the above-mentioned circuit modules 2.

[0178] Example 2

[0179] In the embodiment 1 of the present application, the elastic component 10 that cannot be loosened includes a connecting component 11 and a fastening component 12. The connecting component 11 includes a nail body 100, an elastic element 200 and an anti-slip component 300. The anti-slip component 300 is a nut, and the anti-slip component 300 is formed with an internal mounting thread 300a adapted to the mounting end 101 of the nail body 100, and an anti-slip end face 300b for limiting the bracket 30 from falling off relative to the radiator 20. The anti-slip component 300 is also formed with an external fastening thread 300c adapted to the fastening component 12, and the anti-slip component 300 is threadedly connected to the fastening component 12 through the external fastening thread 300c.

[0180] Fig.14 The elastic component 10' in the second embodiment of the present application is Figure 2 Section view of section AA in the figure. Fig.15 The heat dissipation device 1' in Example 2 of the present application is Figure 2 Section view of section AA in the figure. Fig.16 The circuit module 2' in the embodiment 2 of the present application is Figure 2 Section view of section AA in the figure.

[0181] The working principle of the embodiment 2 of the present application is the same as that of the embodiment 1 of the present application, except that: Fig.14 As shown, the anti-slip component 300' in the non-slip elastic component 10' is a limit plate. The limit plate is clamped on the small-diameter connecting rod 130, and the anti-slip spacing S 防脱 After the elastic component 10 is installed on the heat sink 20 and the bracket 30, the distance between the anti-slip end surface 300b' and the second elastic end 202 of the elastic element 200 is adjusted by adjusting the clamping position of the stopper with the small diameter connecting rod 130. 防脱 '.

[0182] In addition, in Example 2 of the present application, the fastening end of the connecting component 11' for mounting on the fastening component 12 is also changed compared to the fastening end in Example 1 of the present application. Specifically, the fastening end in Example 2 of the present application includes an end of the small-diameter connecting rod 130 opposite to the connector 110, and a fastening external thread (not shown) is provided at the end of the small-diameter connecting rod 130, and the fastening component 12 has a fastening internal thread, and the fastening internal thread of the fastening component 12 is screwed into the fastening external thread of the small-diameter connecting rod 130, so as to achieve threaded mounting of the fastening end of the connecting component 11' and the fastening component 12.

[0183] Embodiment 2 of the present application also provides a heat dissipation device 1', such as Fig.15 As shown, the structure of the heat dissipation device 1' is basically the same as the structure of the heat dissipation device 1 in Example 1 of the present application, and the difference lies in that the non-removable elastic component 10' adopted by the heat dissipation device 1' in Example 2 is the non-removable elastic component 10' provided by any implementation manner of Example 2 of the present application, and the specific structure of the heat dissipation device 1' in Example 2 of the present application is not described in detail.

[0184] Embodiment 2 of the present application further provides a circuit module 2', such as Fig.16 As shown, the structure of the circuit module 2' is basically the same as the structure of the circuit module 2 in Example 1 of the present application. The difference is that the heat dissipation device 1' adopted by the circuit module 2' in Example 2 is the heat dissipation device 1' provided by any implementation method of Example 2 of the present application, and the specific structure of the circuit module 2' in Example 2 of the present application is not described in detail.

[0185] Example 2 of the present application also provides an assembly method of a circuit module 2', which is basically the same as the assembly method of the circuit module 2 in Example 1 of the present application, except that, in the assembly method of the circuit module 2' in Example 2, the assembled circuit module 2' is a circuit module 2' provided by any implementation method of Example 2 of the present application, so that the installation method of the limit plate on the small-diameter connecting rod 130 and the installation method of the connecting component 11' on the fastening component 12 are changed.

[0186] Specifically, the installation method of the anti-slip component 300' in the circuit module 2' is that when the end of the small-diameter connecting rod 130 of the nail body 100 opposite to the connecting head 110 passes through the first through hole 24 on the heat sink 20 and the second through hole 33 on the bracket 30, the limit plate is clamped on the small-diameter connecting rod 130. The installation method of the fastening end of the connecting component 11' is to install the fastening end of the small-diameter connecting rod 130 in the nail body 100 opposite to the connecting head 110 as the fastening end to the fastening component 12. In addition, the other steps of the assembly method of the circuit module 2' in Example 2 of the present application are the same as the assembly method of the circuit module 2 in Example 1 of the present application, and are not repeated here.

[0187] Embodiment 2 of the present application also provides an electronic device, the structure of which is basically the same as that of the electronic device in Embodiment 1 of the present application, except that the circuit module 2' used in the electronic device in Embodiment 2 is a circuit module 2' provided by any implementation method of Embodiment 2 of the present application, and the specific structure of the electronic device in Embodiment 2 of the present application is not described in detail.

[0188] It should be noted that in this specification, similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further defined and explained in the subsequent figures. In the description of this application, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the figures, which is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood in specific situations. To make the purpose, technical solutions and advantages of this application clearer, the above further describes the implementation methods of this application in detail in conjunction with the accompanying drawings.

[0189] References to "some embodiments" or "embodiments" in the specification mean that the specific features, structures or characteristics described in conjunction with the embodiments are included in at least one exemplary implementation or technology according to the present disclosure. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily all refer to the same embodiment. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of introducing the application in conjunction with the implementation mode is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide an in-depth understanding of the present application, many specific details are included in the above description. The present application can also be implemented without using these details.

[0190] Additionally, the language used in this specification has been primarily selected for readability and instructional purposes and may not have been selected to delineate or limit the disclosed subject matter.Thus, this disclosure is intended to illustrate but not to limit the scope of the concepts discussed herein.

Claims

1. A non-detachable elastic component. It is characterized in that Including connecting parts and fastening parts: Wherein, the connecting component comprises a nail body, an elastic element and an anti-slipping member, the nail body comprises a connecting head, a large-diameter connecting rod and a small-diameter connecting rod connected in sequence; the elastic element is sleeved on the large-diameter connecting rod and abuts against the connecting head, the anti-slipping member is installed on the end of the small-diameter connecting rod away from the large-diameter connecting rod, and the fastening component is installed on the fastening end of the connecting component opposite to the connecting head; the fastening end comprises the end of the small-diameter connecting rod opposite to the connecting head and the anti-slipping member; An anti-slipping distance is formed between the elastic element and the anti-slipping member, which can limit the second member from falling off relative to the first member, and the anti-slipping member is not fixed to the second member; A fixed distance capable of fixing the second component and the third component is formed between the fastening component and the large-diameter connecting rod; An elastic distance is formed between the fastening component and the elastic element so as to enable the first component to be elastically coupled to the second component.

2. The non-detachable elastic component according to claim 1, It is characterized in that The anti-slip component includes a nut, which is threadedly connected to the end of the small-diameter connecting rod opposite to the connecting head. The nut adjusts the anti-slip spacing by adjusting the length of the threaded connection with the small-diameter connecting rod.

3. The non-detachable elastic component according to claim 2, It is characterized in that The fastening end includes an end of the small-diameter connecting rod opposite to the connecting head and the nut, and an external thread is arranged on the outer periphery of the nut. The fastening component is threadedly engaged with the external thread through its internal thread to be threadedly installed with the fastening end.

4. The non-detachable elastic component according to claim 2, It is characterized in that The fastening end includes an end portion of the small-diameter connecting rod opposite to the connecting head and the nut, and the fastening component is installed on the fastening end by press riveting or expansion riveting.

5. A heat dissipation device, It is characterized in that The invention comprises a heat sink, a bracket and a non-detachable elastic component as claimed in any one of claims 1 to 4, wherein: The heat sink serves as the first component, and the heat sink is provided with a first through hole, wherein the diameter of the first through hole is smaller than the spiral outer diameter of the elastic element; The bracket serves as the second component, and the bracket is provided with a second through hole, wherein the diameter of the second through hole is smaller than the diameter of the large-diameter connecting rod and the outer diameter of the anti-slip component; The connecting head is located at one side of the radiator, the large-diameter connecting rod passes through the first through hole, the elastic element is sleeved on the large-diameter connecting rod between the connecting head and the radiator, the small-diameter connecting rod passes through the second through hole, and the anti-slip component is installed on the end of the small-diameter connecting rod passing through the second through hole; the elastic element and the anti-slip component can prevent the bracket from falling off relative to the radiator; When the connecting component passes through the third component and is installed on the fastening component to install the radiator and the bracket on the third component, the large-diameter connecting rod and the fastening component press the bracket and the third component; the elastic element elastically combines the radiator to the bracket through elastic deformation.

6. The heat dissipation device according to claim 5, It is characterized in that The number of the non-detachable elastic components is 4, and the 4 non-detachable elastic components are arrayed and distributed in the area where the bracket is located.

7. A circuit module, It is characterized in that The heat dissipation device according to claim 5 or 6, a circuit board and a packaging structure mounted on the circuit board; Wherein, the circuit board serves as the third component, and a third through hole corresponding to the first through hole and the second through hole is formed on the circuit board; The connecting component is installed on the fastening component through the third through hole, the large-diameter connecting rod and the fastening component press the bracket and the circuit board, and the elastic element elastically combines the heat sink and the bracket through elastic deformation.

8. The circuit module according to claim 7, It is characterized in that The circuit module further comprises a fireproof board, which is arranged on a side of the circuit board away from the packaging structure, and the fastening component is arranged on the fireproof board.

9. An electronic device, It is characterized in that Comprising the circuit module described in claim 7 or 8.

10. A method for assembling a circuit module, It is characterized in that Used to assemble the circuit module according to claim 7 or 8, the assembling method comprising: Sleeve the elastic element on the large-diameter connecting rod; Passing the end of the small-diameter connecting rod opposite to the connecting head through the first through hole on the heat sink and the second through hole on the bracket in sequence; Installing the anti-dropping member on the end of the small-diameter connecting rod opposite to the connecting head to prevent the bracket from dropping relative to the radiator; Passing the fastening end of the connecting component through the third through hole on the circuit board; The fastening end is mounted on the fastening component to compress the bracket and the circuit board through the large-diameter connecting rod and the fastening component, and the heat sink is elastically combined with the bracket through the elastic deformation of the elastic element.

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