Refrigeration unit

Abstract

The present invention provides a refrigeration device, including a semiconductor refrigeration plate and a heat exchange component, the heat exchange component including a heat exchanger, a first fixed electrode, a second fixed electrode, a first brush and a second brush, the heat exchanger is rotatably arranged below the semiconductor refrigeration plate, the heat exchanger is fixed to the semiconductor refrigeration plate, the heat exchanger has a rotating shaft, and an installation space is defined in the rotating shaft, the first fixed electrode and the second fixed electrode extend in the installation space, the first fixed electrode and the second fixed electrode are connected to an external power supply, one side of the first brush is fixedly connected to the inner wall of the installation space, and the other side is rotatably connected to the first fixed electrode, one side of the second brush is fixedly connected to the inner wall of the installation space, and the other side is rotatably connected to the second fixed electrode, the first brush and the second brush respectively pass through the installation space through wires to power the semiconductor refrigeration plate, which can avoid wire entanglement and improve the aesthetics and safety of the power connection line.

Description

Technical Field

[0001] The present invention relates to the field of refrigeration, and in particular to a refrigeration device. Background Art

[0002] Semiconductor coolers are widely used in various refrigeration systems. Their operating principle is based on the Peltier effect. When DC current is applied, one end becomes the cold side and the other becomes the hot side. The hot side must dissipate heat promptly to ensure proper operation. Currently, fixed heat sinks are the primary method of dissipating heat from the hot side of semiconductor coolers. However, these heat sinks are inefficient and can easily lead to overheating and damage to the semiconductor cooler. Summary of the Invention

[0003] An object of the present invention is to overcome at least one drawback in the prior art and provide a refrigeration device.

[0004] A further object of the present invention is to enable the heat generated by the heating surface to be absorbed in a timely manner, thereby ensuring the reliability of the semiconductor refrigeration plate.

[0005] Another further object of the present invention is to supply power to the semiconductor refrigeration plate fixed on the rotatable heat exchanger so that the power supply circuit is beautiful and safe.

[0006] Yet a further object of the present invention is to firmly fix the first brush and the second brush to the inner wall of the installation space.

[0007] In particular, the present invention provides a refrigeration device for cooling a liquid contained in a target container, comprising: a semiconductor refrigeration plate having a cooling surface facing upward and a heating surface facing away from the cooling surface; and a heat exchange assembly, comprising: a heat exchanger rotatably arranged below the semiconductor refrigeration plate, the heat exchanger being fixed to the semiconductor refrigeration plate, the heat exchanger having a rotating shaft and a plurality of heat sinks formed on the circumference of the rotating shaft, and a downwardly open installation space being defined in the rotating shaft; a first fixed electrode extending into the installation space; a second fixed electrode extending into the installation space, the second fixed electrode surrounding the first fixed electrode, the first fixed electrode, the second fixed electrode and the rotating shaft being coaxially arranged, and the first fixed electrode and the second fixed electrode being connected to an external power supply; a first brush, one side of which is fixedly connected to the inner wall of the installation space and the other side of which is rotatably connected to the first fixed electrode; and a second brush, one side of which is fixedly connected to the inner wall of the installation space and the other side of which is rotatably connected to the second fixed electrode, and the first brush and the second brush respectively pass through the installation space through wires to power the semiconductor refrigeration plate.

[0008] Optionally, a first mounting post and a second mounting post protrude from the inner wall of the installation space, and a clip is formed on the outer side of the first mounting post and the second mounting post; the first brush and the second brush are respectively recessed inward toward one side of the inner wall of the installation space to form a first mounting groove and a second mounting groove, and a clip hole is formed in the first mounting groove and the second mounting groove, and the first mounting post and the second mounting post extend into the first mounting groove and the second mounting groove respectively, and the clip and the clip hole are matched to fix the first brush and the second brush to the inner wall of the installation space.

[0009] Optionally, the first mounting column and the second mounting column are formed with a third mounting slot and a fourth mounting slot respectively open toward the first mounting slot and the second mounting slot; and the heat exchange assembly further includes:

[0010] Two springs are respectively arranged in the third mounting slot and the fourth mounting slot, and are configured to be compressed when the first mounting post and the second mounting post are respectively extended into the first mounting slot and the second mounting slot, so as to provide elastic pre-tightening force for the first brush and the second brush toward the first fixed electrode and the second fixed electrode respectively.

[0011] Optionally, the first fixed electrode protrudes from the second fixed electrode; and the first brush is located between the peripheral wall of the installation space and the peripheral wall of the first fixed electrode; the second brush is located between the peripheral wall of the installation space and the peripheral wall of the second fixed electrode.

[0012] Optionally, the first brush is located between a top wall of the installation space and a top wall of the first fixed electrode.

[0013] Optionally, the refrigeration device further includes: a base, which defines a heat exchange cavity for accommodating the heat exchange component, the rotating shaft is arranged along the height direction of the heat exchange cavity, and the first fixed electrode and the second fixed electrode are both fixed on the bottom wall of the heat exchange cavity.

[0014] Optionally, the bottom wall of the heat exchange chamber is further formed with a first fixed ring and a second fixed ring surrounding the outside of the first fixed ring; the first fixed electrode is fixedly arranged in the first fixed ring, and the second fixed electrode is fixedly arranged between the first fixed ring and the second fixed ring.

[0015] Optionally, a wiring groove is further provided on the bottom wall of the heat exchange chamber so that the first fixed electrode and the second fixed electrode can be connected to an external power supply via a wire.

[0016] Optionally, a through hole is provided on the top of the base, and the semiconductor refrigeration plate is exposed at the through hole; and the refrigeration device also includes: an inner cylinder, located above the semiconductor refrigeration plate, having a cooling cavity for fixing the target container, the bottom of the inner cylinder can be removably inserted into the through hole, and at least part of its bottom surface is in contact with the refrigeration surface, so that the cold generated by the semiconductor refrigeration plate is transferred to the inner cylinder; an outer cylinder, which is sleeved on the outside of the inner cylinder, and a connecting hole is provided on the bottom surface of the outer cylinder to expose at least part of the bottom surface of the inner cylinder. When the bottom of the inner cylinder is extended into the through hole, the semiconductor refrigeration plate is passed through the connecting hole so that the refrigeration surface is in contact with at least part of the bottom surface of the inner cylinder.

[0017] Optionally, the contour of the connecting hole matches the shape of the semiconductor refrigeration chip, so that when the semiconductor refrigeration chip is inserted into the connecting hole, the outer cylinder and the inner cylinder rotate together with the semiconductor refrigeration chip.

[0018] In the refrigeration device of the present invention, since the heat exchanger is fixed to the semiconductor refrigeration plate and the heat exchanger is rotatable, the multiple heat sinks can rotate with the heat exchanger, thereby improving the convective heat transfer coefficient between the multiple heat sinks and the air, further optimizing the heat exchange, and allowing the heat generated by the heating surface to be absorbed in a timely manner, thereby ensuring the reliability of the semiconductor refrigeration plate.

[0019] Furthermore, in the refrigeration device of the present invention, since the first fixed electrode extends into the installation space, the second fixed electrode extends into the installation space, the second fixed electrode surrounds the first fixed electrode, the first fixed electrode, the second fixed electrode and the rotating shaft are coaxially arranged, and the first fixed electrode and the second fixed electrode are connected to an external power supply, one side of the first brush is fixedly connected to the inner wall of the installation space, and the other side of the first brush is rotatably connected to the first fixed electrode, one side of the second brush is fixedly connected to the inner wall of the installation space, and the other side of the second brush is rotatably connected to the second fixed electrode, when the rotating shaft rotates, the first brush and the second brush can respectively rotate around the first fixed electrode and the second fixed electrode with the rotating shaft, and always maintain an electrically connected state with the first fixed electrode and the second fixed electrode, and make the first brush and the second brush relatively stationary with the rotating shaft, so that the wires connected to the first brush and the second brush can not only be electrically connected to the first fixed electrode and the second fixed electrode, but also can remain relatively stationary with the rotating shaft, so that they can avoid entanglement when passing through the installation space to power the semiconductor refrigeration plate, thereby improving the aesthetics and safety of the power connection line.

[0020] Furthermore, in the refrigeration device of the present invention, a first mounting post and a second mounting post protrude from the inner wall of the mounting space, a clip is formed on the outer side of the first mounting post and the second mounting post, the first brush and the second brush form a first mounting groove and a second mounting groove, a clip hole is formed in the first mounting groove and the second mounting groove, the first mounting post and the second mounting post extend into the first mounting groove and the second mounting groove respectively, and the clip and the clip hole are matched to fix the first brush and the second brush to the inner wall of the mounting space.

[0021] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0023] Figure 1 is a schematic diagram of a refrigeration device according to an embodiment of the present invention;

[0024] Figure 2 is an exploded view of a refrigeration device according to one embodiment of the present invention;

[0025] Figure 3 is a longitudinal cross-sectional view of a refrigeration device according to one embodiment of the present invention;

[0026] Figure 4 is a schematic diagram of a heat exchanger in a refrigeration device according to an embodiment of the present invention;

[0027] Figure 5 yes Figure 3 Enlarged view of part A in the middle;

[0028] Figure 6 is a bottom view of a heat exchanger in a refrigeration device according to one embodiment of the present invention;

[0029] Figure 7 is a schematic diagram of a first brush or a second brush in a refrigeration device according to an embodiment of the present invention;

[0030] Figure 8 is a longitudinal cross-sectional view of a refrigeration device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0031] Please attend Figures 1 to 3 , Figure 1 is a schematic diagram of a refrigeration device 1 according to an embodiment of the present invention, Figure 2is an exploded view of a refrigeration device 1 according to an embodiment of the present invention, Figure 3 FIG2 is a longitudinal cross-sectional view of a refrigeration device 1 according to an embodiment of the present invention. The present invention provides a refrigeration device 1 for cooling a liquid (e.g., a beverage) contained in a target container 10. The refrigeration device 1 may include a base 100, a semiconductor cooling sheet 200, an inner cylinder 300, and an outer cylinder 400.

[0032] A heat exchange chamber 110 is defined within the base 100, and a through hole 120 is formed at the top of the base 100. A semiconductor cooling plate 200 is exposed at the through hole 120. The semiconductor cooling plate 200 has a cooling surface facing upward and a heating surface facing away from the cooling surface. An inner cylinder 300 is disposed above the semiconductor cooling plate 200. The interior of the inner cylinder 300 defines a cooling chamber 310 for securing the target container 10. The bottom of the inner cylinder 300 removably extends into the through hole 120, with at least a portion of its bottom surface contacting the cooling surface, so that the cooling energy generated by the semiconductor cooling plate 200 is transferred to the inner cylinder 300. The outer cylinder 400 is sleeved on the outside of the inner cylinder 300. The outer cylinder 400 can be made of thermal insulation material (such as thermal insulation plastic, etc.) to prevent the coldness of the inner cylinder 300 from dissipating, and a connecting hole 410 is opened on the bottom surface of the outer cylinder 400 to expose at least part of the bottom surface of the inner cylinder 300. When the bottom of the inner cylinder 300 extends into the through hole 120, the semiconductor refrigeration plate 200 is passed through the connecting hole 410 so that the cooling surface contacts at least part of the bottom surface of the inner cylinder 300.

[0033] The semiconductor cooling chip 200 is a cooling module based on the Peltier effect. When DC current is applied, one surface of the cooling chip functions as a heating surface, while the other functions as a cooling surface. In this embodiment, the direction of the DC current can be controlled to position the cooling surface upward and the heating surface downward.

[0034] The inner cylinder 300 can be made of a material with good thermal conductivity (such as metal). The cooling chamber 310 of the inner cylinder 300 can be fixed to the target container 10 through an interference fit or an overfit. During use, multiple inner cylinders 300 of different diameters can be configured to accommodate target containers 10 of varying diameters. Alternatively, the target container 10 can be used as a common container, allowing the liquid to be directly poured into the target container 10 without having to replace the target container 10, which is simple and convenient.

[0035] See Figures 2 to 4 , Figure 4Schematic diagram of a heat exchanger in a refrigeration device according to one embodiment of the present invention. In some embodiments, the refrigeration device 1 may further include a heat exchange assembly disposed within the heat exchange cavity 110 of the base 100. The heat exchange assembly may include a heat exchanger 500 rotatably disposed below and secured to the semiconductor cooling fin 200. The heat exchanger 500 includes a rotating shaft 520 and a plurality of heat sinks 530 formed around the rotating shaft 520. The rotating shaft 520 is disposed along the height of the heat exchange cavity 110 and defines a downwardly open installation space 522 therein.

[0036] Specifically, the heat exchanger 500 may also include an upper turntable 510, which is formed at the top of the rotating shaft 520. The semiconductor refrigeration plate 200 can be fixed at the center of the upper turntable 510 so that the heat generated by the heating surface is transferred to the rotating shaft 520 through the upper turntable 510, and then transferred to the multiple heat sinks 530. The multiple heat sinks 530 increase the heat exchange area of ​​the heat exchanger 500 and improve the heat exchange efficiency.

[0037] In particular, the contour of the connecting hole 410 at the bottom of the outer cylinder 400 can match the shape of the semiconductor refrigeration plate 200. In some specific embodiments, the contour of the connecting hole 410 and the semiconductor refrigeration plate 200 are both square (square or rectangular) or other shapes.

[0038] Because the semiconductor cooling chip 200 is fixed to the upper turntable 510, and the upper turntable 510 is formed on the rotating shaft 520, and the rotating shaft 520 can rotate within the heat exchange chamber 110, the semiconductor cooling chip 200 can rotate together with the rotating shaft 520. When the bottom of the inner cylinder 300 extends into the through hole 120, the semiconductor cooling chip 200 is inserted into the connecting hole 410 of the outer cylinder 400. The connecting hole 410 is shaped to match the semiconductor cooling chip 200. In this way, the semiconductor cooling chip 200 can drive the inner cylinder 300 and the outer cylinder 400 to rotate simultaneously, while the target container 10 is fixedly arranged in the cooling chamber 310 of the inner cylinder 300, thus driving the target container 10 to rotate. In this way, when the target container 10 rotates, the liquid contained in the target container 10 can exchange heat with the target container 10 through thermal convection, thereby optimizing heat transfer.

[0039] In addition, since the rotating shaft 520 can rotate in the heat exchange chamber 110, the multiple heat sinks 530 can rotate with the rotating shaft 520, thereby improving the convective heat transfer coefficient between the multiple heat sinks 530 and the air, further optimizing the heat exchange, and allowing the heat generated by the heating surface to be absorbed in a timely manner, thereby ensuring the reliability of the semiconductor refrigeration plate 200.

[0040] As described in the background technology section, currently, fixed heat sinks are primarily used to assist in heat dissipation from the hot surface of semiconductor cooling fins 200. However, such heat sinks are inefficient and can easily overheat and damage semiconductor cooling fins 200. To overcome these shortcomings of the prior art, this embodiment employs a rotatable heat exchanger 500 disposed beneath the semiconductor cooling fins 200 to assist in heat dissipation, thereby improving heat exchange efficiency and preventing overheating and damage.

[0041] Furthermore, the heat exchanger 500 can also include a lower turntable 540 and a driving mechanism. The lower turntable 540 is horizontally formed at the bottom end of the rotating shaft 520. The driving mechanism includes a motor 550, mutually meshing gears 560, a rack 570 and a motor cover 580. The motor 550 is installed on the base 100, the gear 560 is installed on the motor 550, and the rack 570 is formed on the periphery of the lower turntable 540 to drive the rotating shaft 520 to rotate. The motor cover 580 is buckled on the top of the motor 550 to protect the motor 550, and the motor 550 is fixed to the base 100 by fasteners.

[0042] See Figure 2 、 Figure 3 and Figure 5 , Figure 5 yes Figure 3 The heat exchange assembly may further include a first fixed electrode 610 , a second fixed electrode 620 , a first brush 630 , and a second brush 640 .

[0043] The first fixed electrode 610 extends into the installation space 522, the second fixed electrode 620 extends into the installation space 522, the second fixed electrode 620 surrounds the first fixed electrode 610, the first fixed electrode 610, the second fixed electrode 620 and the rotating shaft 520 are coaxially arranged, and the first fixed electrode 610 and the second fixed electrode 620 are connected to an external power supply, one side of the first brush 630 is fixedly connected to the inner wall of the installation space 522, and the other side of the first brush 630 is rotatably connected to the first fixed electrode 610, one side of the second brush 640 is fixedly connected to the inner wall of the installation space 522, and the other side of the second brush 640 is rotatably connected to the second fixed electrode 620, and the first brush 630 and the second brush 640 respectively pass through the installation space 522 through wires to power the semiconductor refrigeration plate 200.

[0044] The first fixed electrode 610 and the second fixed electrode 620 are fixed relative to the rotation axis 520. The second fixed electrode 620 can be hollow, and the first fixed electrode 610 is disposed inside the second fixed electrode 620. Because the first fixed electrode 610, the second fixed electrode 620, and the rotation axis 520 are coaxially disposed, the first fixed electrode 610 and the second fixed electrode 620 are also located on the rotation axis 520 line of the rotation axis 520. In other words, the rotation axis 520 can rotate around the first fixed electrode 610 and the second fixed electrode 620.

[0045] The first fixed electrode 610 and the second fixed electrode 620 can be made of a highly conductive material such as metal or graphite. One of the first fixed electrode 610 and the second fixed electrode 620 can be connected to the positive terminal of an external power source, while the other can be connected to the negative terminal of the external power source. The first brush 630 and the second brush 640 can also be made of a conductive material (such as graphite).

[0046] Since the connection relationship between the first fixed electrode 610 and the first brush 630 and the second fixed electrode 620 and the second brush 640 is similar, the working principle thereof will be described below by taking the first fixed electrode 610 and the first brush 630 as an example.

[0047] One side of the first brush 630 is fixedly connected to the inner wall of the installation space 522, and the other side of the first brush 630 is rotatably connected to the first fixed electrode 610, so that the first brush 630 can be electrically connected to the first fixed electrode 610. When the rotating shaft 520 rotates, the first brush 630 can rotate around the first fixed electrode 610 with the rotating shaft 520 and always maintain an electrically connected state with the first fixed electrode 610. Moreover, since the first brush 630 is fixedly connected to the inner wall of the installation space 522, the first brush 630 and the rotating shaft 520 are relatively stationary. In this way, the wire connected to the first brush 630 can not only be electrically connected to the first fixed electrode 610, but also remain relatively stationary with the rotating shaft 520, so that it can avoid entanglement when passing through the installation space 522 to power the semiconductor refrigeration plate 200, thereby improving the aesthetics and safety of the power connection line.

[0048] See Figure 6 and Figure 7 , Figure 6 1 is a bottom view of a heat exchanger in a refrigeration device according to an embodiment of the present invention. Figure 7Schematic diagram of a first brush in a refrigeration device according to one embodiment of the present invention. In some embodiments, a first mounting post 524 and a second mounting post 526 protrude from the inner wall of the mounting space 522. A buckle 524b is formed on the outer side of each of the first and second mounting posts 524, 526. The first and second brushes 630, 640 are recessed inward toward the inner wall of the mounting space 522 to form a first mounting groove 632 and a second mounting groove 642, respectively. Each of the first and second mounting grooves 632, 642 has a snap-fit ​​hole 632a formed therein. The first and second mounting posts 524, 526 extend into the first and second mounting grooves 632, 642, respectively, and the buckle 524b engages with the snap-fit ​​hole 632a to secure the first and second brushes 630, 640 to the inner wall of the mounting space 522.

[0049] In this embodiment, the number of clips 524b on the first mounting column 524 can be one or more, and the number of clips 524b on the second mounting column 526 can be one or more, and the snap-in holes 632a of the first mounting groove 632 and the second mounting groove 642 respectively match the number of clips 524b of the first mounting column 524 and the number of clips 524b of the second mounting column 526.

[0050] During installation, the first mounting slot 632 of the first brush 630 can be aligned with the first mounting post 524, and the first mounting post 524 can be extended into the first mounting slot 632. The buckle 524b and the snap-fit ​​hole 632a can be matched to fix the first brush 630 to the inner wall of the installation space 522. The second brush 640 has a similar structure to the first brush 630 and will not be described in detail here.

[0051] See Figure 2 、 Figure 3 and Figure 5 Furthermore, the first mounting column 524 and the second mounting column 526 are formed with a third mounting groove 524a and a fourth mounting groove 526a respectively open toward the first mounting groove 632 and the second mounting groove 642. The heat exchange assembly may also include two springs 650, which are respectively arranged in the third mounting groove 524a and the fourth mounting groove 526a, and are configured to be compressed when the first mounting column 524 and the second mounting column 526 are respectively extended into the first mounting groove 632 and the second mounting groove 642, so as to provide the first brush 630 and the second brush 640 with an elastic pre-tightening force toward the first fixed electrode 610 and the second fixed electrode 620 respectively.

[0052] Since the first mounting post 524 and the second mounting post 526 are respectively formed directly on the inner wall of the mounting space 522, when the first mounting post 524 and the second mounting post 526 are respectively extended into the first mounting groove 632 and the second mounting groove 642, the two springs 650 are respectively compressed, generating elastic pre-tightening forces for the first brush 630 and the second brush 640 toward the first fixed electrode 610 and the second fixed electrode 620, respectively, to ensure that the first brush 630 and the second brush 640 maintain good connectivity with the first fixed electrode 610 and the second fixed electrode 620, respectively, and to make the buckle 524b and the snap-on hole 632a fit more firmly.

[0053] See Figure 3 and Figure 5 In some embodiments, the first brush 630 may also be located between the top wall of the mounting space 522 and the top wall of the first fixed electrode 610. That is, the first mounting post 524 may be formed in the center of the top wall of the mounting space 522 and extend downward. One side of the first brush 630 may be fixedly connected to the top wall of the mounting space 522 via the first mounting post 524, and one side of the first brush 630 may be rotatably connected to the top of the first fixed electrode 610.

[0054] See Figure 8 , Figure 8 FIG2 is a longitudinal cross-sectional view of a refrigeration device according to another embodiment of the present invention. In other embodiments, the first fixed electrode 610 may be configured to protrude from the second fixed electrode 620, the first brush 630 may be located between the peripheral wall of the installation space 522 and the peripheral wall of the first fixed electrode 610, and the second brush 640 may be located between the peripheral wall of the installation space 522 and the peripheral wall of the second fixed electrode 620.

[0055] In this embodiment, the first mounting post 524 can be formed on a sidewall of the mounting space 522. One side of the first brush 630 can be fixedly connected to the sidewall of the mounting space 522 via the first mounting post 524. One side of the first brush 630 can be rotatably connected to the peripheral wall of the first fixed electrode 610 protruding from the second fixed electrode 620, so that the first brush 630 is positioned between the peripheral wall of the mounting space 522 and the peripheral wall of the first fixed electrode 610. The second brush 640 has a similar connection relationship to the first brush 630 and is not further described here.

[0056] In some embodiments, the first fixed electrode 610 and the second fixed electrode 620 are both fixed on the bottom wall of the heat exchange chamber 110. Since the heat exchange chamber 110 is formed inside the base 100, the first fixed electrode 610 and the second fixed electrode 620 are both fixed on the bottom wall of the base 100, and the first fixed electrode 610 can be fixed by fasteners.

[0057] See Figure 2 、 Figure 3 and Figure 5 Furthermore, the bottom wall of the heat exchange chamber 110 is also formed with a first fixing ring 130 and a second fixing ring 140 surrounding the outside of the first fixing ring 130. The first fixed electrode 610 is fixedly arranged in the first fixing ring 130, and the second fixed electrode 620 is fixedly arranged between the first fixing ring 130 and the second fixing ring 140. The second fixed electrode 620 can be fixed to the second fixing ring 140 by fasteners.

[0058] Since the first fixed electrode 610 is fixedly arranged in the first fixed ring 130, and the second fixed electrode 620 is fixedly arranged between the first fixed ring 130 and the second fixed ring 140, that is, the first fixed ring 130 is arranged between the first fixed electrode 610 and the second fixed electrode 620, the first fixed ring 130 can be made of an insulating material (or the base 100 as a whole can be made of an insulating material), which can prevent the first fixed electrode 610 and the second fixed electrode 620 from short-circuiting and causing a malfunction.

[0059] See Figure 2 Furthermore, a wiring groove 150 is provided on the bottom wall of the heat exchange chamber 110. The wires connected to the positive and negative poles of the external power supply can be passed through the wiring groove 150 and connected to the first fixed electrode 610 and the second fixed electrode 620 respectively, so that the first fixed electrode 610 and the second fixed electrode 620 are connected to the external power supply through the wires.

[0060] See Figure 2 and Figure 3 In some embodiments, a mounting opening 160 is provided on the side wall of the base 100, and the refrigeration device 1 may further include a fan mounting frame 710 and a heat exchange fan 720. The fan mounting frame 710 is arranged at the mounting opening 160, and the heat exchange fan 720 is arranged at the fan mounting frame 710, and the air suction port of the heat exchange fan 720 is directed toward the circumference of the rotating shaft 520, and is configured to promote the formation of a heat exchange airflow that exchanges heat with the multiple heat sinks 530 and is discharged from the mounting opening 160.

[0061] Because the mounting opening 160 is located on the side wall of the base 100, the rotating shaft 520 extends along the height direction of the base 100, and multiple heat sinks 530 are formed around the rotating shaft 520, the air intake of the heat exchange fan 720 can be directly opposite the circumference of the rotating shaft 520, accelerating heat exchange between the air in the heat exchange chamber 110 and the multiple heat sinks 530. Because the multiple heat sinks 530 rotate with the rotating shaft 520, each heat sink 530 can accelerate heat dissipation when it rotates directly opposite the heat exchange fan 720. The heat exchange fan 720 can be an axial flow fan, which has advantages such as high air volume and low noise, and is suitable for the operating environment of the refrigeration device 1.

[0062] In the refrigeration device 1 of the present invention, the first fixed electrode 610 extends into the installation space 522, the second fixed electrode 620 extends into the installation space 522, the second fixed electrode 620 surrounds the first fixed electrode 610, the first fixed electrode 610, the second fixed electrode 620 and the rotating shaft 520 are coaxially arranged, and the first fixed electrode 610 and the second fixed electrode 620 are connected to an external power supply, one side of the first brush 630 is fixedly connected to the inner wall of the installation space 522, and the other side of the first brush 630 is rotatably connected to the first fixed electrode 610, one side of the second brush 640 is fixedly connected to the inner wall of the installation space 522, and the other side of the second brush 640 is rotatably connected to the second fixed electrode 6 20. When the rotating shaft 520 rotates, the first brush 630 and the second brush 640 can rotate around the first fixed electrode 610 and the second fixed electrode 620 respectively along with the rotating shaft 520, and always maintain an electrically connected state with the first fixed electrode 610 and the second fixed electrode 620, and make the first brush 630 and the second brush 640 relatively stationary with the rotating shaft 520. In this way, the wires connected to the first brush 630 and the second brush 640 can not only be electrically connected with the first fixed electrode 610 and the second fixed electrode 620, but also can remain relatively stationary with the rotating shaft 520, so that they can avoid entanglement when passing through the installation space 522 to power the semiconductor refrigeration plate 200, thereby improving the aesthetics and safety of the power connection line.

[0063] Furthermore, in the refrigeration device 1 of the present invention, a first mounting column 524 and a second mounting column 526 protrude from the inner wall of the mounting space 522, and a clip 524b is formed on the outer side of the first mounting column 524 and the second mounting column 526. The first brush 630 and the second brush 640 form a first mounting groove 632 and a second mounting groove 642, and a clip hole 632a is formed in the first mounting groove 632 and the second mounting groove 642. The first mounting column 524 and the second mounting column 526 extend into the first mounting groove 632 and the second mounting groove 642 respectively, and the clip 524b and the clip hole 632a are matched to fix the first brush 630 and the second brush 640 to the inner wall of the mounting space 522.

[0064] At this point, those skilled in the art will recognize that, although a number of exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A refrigeration device for cooling a liquid contained in a target container, comprising: A semiconductor refrigeration chip having a cooling surface facing upward and a heating surface facing away from the cooling surface; An inner cylinder, located above the semiconductor refrigeration plate, having a cooling cavity therein for fixing the target container; and A heat exchange assembly comprising: A heat exchanger is rotatably disposed below the semiconductor refrigeration plate, the heat exchanger being fixed to the semiconductor refrigeration plate, the heat exchanger comprising a rotating shaft and a plurality of heat sinks formed on a circumferential surface of the rotating shaft, and a downwardly open installation space is defined within the rotating shaft; a first fixed electrode extending into the installation space; a second fixed electrode extending into the installation space, the second fixed electrode surrounding the first fixed electrode, the first fixed electrode, the second fixed electrode and the rotating shaft being coaxially arranged, and the first fixed electrode and the second fixed electrode being connected to an external power source; a first brush, one side of which is fixedly connected to the inner wall of the installation space, and the other side of which is rotatably connected to the first fixed electrode; and The second brush has one side fixedly connected to the inner wall of the installation space and the other side rotatably connected to the second fixed electrode, and the first brush and the second brush respectively pass through the installation space through wires to power the semiconductor refrigeration plate.

2. The refrigeration device according to claim 1, wherein A first mounting post and a second mounting post are protruded from the inner wall of the mounting space, and buckles are formed on the outer sides of the first mounting post and the second mounting post; The first brush and the second brush are respectively recessed inward toward one side of the inner wall of the installation space to form a first installation groove and a second installation groove, and a clamping hole is formed in the first installation groove and the second installation groove. The first installation column and the second installation column extend into the first installation groove and the second installation groove respectively, and the buckle and the clamping hole are matched to fix the first brush and the second brush to the inner wall of the installation space.

3. The refrigeration device according to claim 2, wherein The first mounting post and the second mounting post are formed with a third mounting slot and a fourth mounting slot respectively open toward the first mounting slot and the second mounting slot; and the heat exchange assembly further includes: Two springs are respectively arranged in the third mounting slot and the fourth mounting slot, and are configured to be compressed when the first mounting post and the second mounting post are respectively extended into the first mounting slot and the second mounting slot, so as to provide an elastic preload force for the first brush and the second brush toward the first fixed electrode and the second fixed electrode respectively.

4. The refrigeration device according to claim 1, wherein The first fixed electrode protrudes from the second fixed electrode; and The first brush is located between the peripheral wall of the installation space and the peripheral wall of the first fixed electrode; The second brush is located between a peripheral wall of the installation space and a peripheral wall of the second fixed electrode.

5. The refrigeration device according to claim 1, wherein The first brush is located between a top wall of the installation space and a top wall of the first fixed electrode.

6. The refrigeration device according to claim 1, further comprising: The base defines a heat exchange cavity for accommodating the heat exchange component, the rotating shaft is arranged along the height direction of the heat exchange cavity, and the first fixed electrode and the second fixed electrode are both fixed on the bottom wall of the heat exchange cavity.

7. The refrigeration device according to claim 6, wherein The bottom wall of the heat exchange chamber is further formed with a first fixing ring and a second fixing ring surrounding the outside of the first fixing ring; The first fixed electrode is fixedly disposed in the first fixed ring, and the second fixed electrode is fixedly disposed between the first fixed ring and the second fixed ring.

8. The refrigeration device according to claim 6, wherein A wiring groove is also provided on the bottom wall of the heat exchange chamber so that the first fixed electrode and the second fixed electrode can be connected to the external power supply via wires.

9. The refrigeration device according to claim 6, wherein A through hole is also formed on the top of the base, and the semiconductor cooling plate is exposed at the through hole; and The bottom of the inner cylinder is detachably inserted into the through hole, and at least a portion of its bottom surface is in contact with the refrigeration surface, so that the cooling energy generated by the semiconductor refrigeration plate is transferred to the inner cylinder; The refrigeration device further comprises: The outer cylinder is sleeved on the outside of the inner cylinder, and a connecting hole is opened on the bottom surface of the outer cylinder to expose at least part of the bottom surface of the inner cylinder. When the bottom of the inner cylinder extends into the through hole, the semiconductor refrigeration plate is passed through the connecting hole so that the refrigeration surface contacts at least part of the bottom surface of the inner cylinder.

10. The refrigeration device according to claim 9, wherein The contour of the connecting hole matches the shape of the semiconductor refrigeration chip, so that when the semiconductor refrigeration chip is inserted into the connecting hole, the outer cylinder and the inner cylinder rotate together with the semiconductor refrigeration chip.

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