Testing Method, Device and Operation Method for the Performance of IC Card Carrier Tape Encapsulation

Abstract

The present invention relates to a test method, device and operation method for the encapsulation performance of an IC card carrier tape, belonging to the technical field of IC card carrier tape encapsulation. The test method includes: using UV curable glue as the liquid medium and the IC card carrier tape as the solid medium to test the interfacial performance between the two, so as to obtain the wettability and diffusibility of the UV curable glue on the surface of the IC card carrier tape, analyze whether there are differences on the surface of the IC card carrier tape, and thus predict whether the encapsulation height is consistent after the IC card carrier tape is pasted with chips and the gold wires / alloy wires are welded; the test device includes a sample stage, a collection system, an injection unit and a light source; the wettability between the IC card carrier tape and the UV curable glue is tested before the IC card carrier tape is pasted with chips and the gold wires / alloy wires are welded, and classified according to the test results, so as to guide and adjust the encapsulation parameters of the IC card carrier tape, thereby reducing the product scrapping caused by the difference in the encapsulation performance between batches of the IC card carrier tape, improving the production efficiency and product yield, and reducing the cost.

Description

Technical Field

[0001] The present invention relates to a testing method, device and operation method for the encapsulation performance of an IC card carrier tape, and belongs to the technical field of IC card carrier tape encapsulation. Background Art

[0002] With the development of integrated circuits and the improvement of people's living standards, the application of smart cards has become more and more extensive, and it has been widely used in fields such as telecommunications, banking, social security, and logistics. In the production and processing of IC cards, the encapsulation of the IC card carrier tape is an important link. The most core part of the IC card is the part of the IC card carrier tape with a chip. The encapsulation of the part of the IC card carrier tape with a chip attached needs to weld the chip and the IC card carrier tape with gold wire / alloy wire, and then encapsulate it with UV curable glue, as Figure 1 shown. Therefore, there are certain control ranges and requirements for the encapsulation height of the IC card carrier tape. If the encapsulation height changes and varies greatly due to the interfacial performance between batches or the wettability difference with the UV curable glue of the IC card carrier tape with a chip, it will cause obvious protrusions or depressions on the back of the encapsulated IC card with a chip. Then, when the IC card carrier tape with a chip is embedded into the IC card base with a fixed milling groove height, the IC cards with unqualified encapsulation height will have defects such as chip fracture and delamination between the chip and the card base during use, resulting in scrapping.

[0003] Currently, the inspection method for the encapsulation performance and height of the IC card carrier tape is that after the IC card carrier tape is pasted with a chip, welded with gold wire / alloy wire, and encapsulated with UV curable glue, a micrometer is used to manually measure or a thickness gauge is used to automatically measure the encapsulation height of the IC card carrier tape. Using this detection method, since the measurement is carried out after the carrier tape and the chip are bonded and welded with the gold wire / alloy wire, if the encapsulation height exceeds the standard range, only the abnormal products can be intercepted and scrapped, resulting in losses of materials such as carrier tapes, chips, and gold wires, affecting the product yield and production efficiency, and increasing costs.

[0004] In order to avoid the scrapping caused by the abnormal encapsulation height found after the height measurement after UV curable encapsulation, and thus the material loss, it is necessary to invent a method for testing the encapsulation performance of the IC card carrier tape before the processes such as pasting the chip on the IC card carrier tape. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a testing method, device and operation method for the encapsulation performance of an IC card carrier tape, which can test the encapsulation performance of the IC card carrier tape before the processes such as pasting the chip on the IC card carrier tape.

[0006] The test method for the encapsulation performance of the IC card carrier tape of the present invention includes: using a UV curable glue as a liquid medium and an IC card carrier tape as a solid medium to test the interfacial performance between the two, thereby obtaining the wettability and diffusibility of the UV curable glue on the surface of the IC card carrier tape, analyzing whether there are differences on the surface of the IC card carrier tape, and thus predicting whether the encapsulation height is consistent after the IC card carrier tape is pasted with chips and the gold wires / alloy wires are welded.

[0007] Before the IC card carrier tape is pasted with chips and the gold wires / alloy wires are welded, the wettability between the IC card carrier tape and the UV curable glue can be tested, and classified according to the test results, so as to guide and adjust the encapsulation parameters of the IC card carrier tape, thereby reducing the product scrapping caused by the difference in the encapsulation performance between batches of the IC card carrier tape, improving the production efficiency and product yield, and reducing the cost.

[0008] Preferably, the wettability and diffusibility of the UV curable glue on the surface of the IC card carrier tape are determined by testing the diffusion angle of the UV curable glue on the surface of the IC card carrier tape.

[0009] Preferably, it specifically includes the following steps:

[0010] Step S1: Testing the diffusion angle of the UV curable glue on the surface of the IC card carrier tape;

[0011] Step S2: Judging the encapsulation performance of the IC card carrier tape according to the diffusion angle;

[0012] Step S3: Classifying the IC card carrier tapes according to the difference in the encapsulation performance of the IC card carrier tapes;

[0013] Step S4: Matching the encapsulation conditions of the UV curable glue according to the detection and classification results.

[0014] Preferably, the step S1 includes the following steps:

[0015] Step S11: Preparation: Cutting the IC card carrier tape into IC card carrier tape samples;

[0016] Step S12: Sampling: Dropping the UV curable glue onto the IC card carrier tape sample, and sampling the infiltration image of the UV curable glue and the surface of the IC card carrier tape sample within a specified time;

[0017] Step S13: Measurement: Measuring the diffusion angle of the collected image.

[0018] Preferably, the temperature in the measurement is 20 - 70 °C; the single drop volume of the UV curable glue is 1 - 10 μL; the acquisition time is 5 - 50 s.

[0019] Preferably, the measurement method is specifically as follows:

[0020] Tangents are made to the left and right sides of the semi-circular droplet, and the angles ∠L and ∠R between the tangents and the horizontal contact surfaces of the IC card carrier tape sample and the semi-circular droplet are measured. Then, the average value ∠Ave of the angles on the left and right sides is calculated, which is the diffusion angle between the IC card carrier tape sample and the UV curable glue: ∠Ave = 1 / 2(∠L + ∠R).

[0021] Preferably, the classification method for classifying the IC card carrier tape is as follows: when the diffusion angle is 10 - 20°, it is classified as Class A; when the diffusion angle is 20 - 30°, it is classified as Class B; when the diffusion angle is 30 - 40°, it is classified as Class C.

[0022] Preferably, for the classification method of the IC card carrier tape, the parameters for encapsulating the IC card carrier tape with UV curable glue are as follows:

[0023] For Class A IC card carrier tape, the encapsulation temperature is 40 - 60°C, and the glue volume is 6 - 12 μL;

[0024] For Class B IC card carrier tape, the encapsulation temperature is 50 - 70°C, and the glue volume is 8 - 14 μL;

[0025] For Class C IC card carrier tape, the encapsulation temperature is 60 - 80°C, and the glue volume is 10 - 16 μL.

[0026] The test device for the encapsulation performance of the IC card carrier tape described in the present invention includes a sample stage, a collection system, an injection unit, and a light source. The sample stage: is used to fix the cut IC card carrier tape sample;

[0027] The collection system: is used to sample the infiltration image of the UV curable glue and the surface of the IC card carrier tape within a specified time;

[0028] The injection unit: is used to drop the UV curable glue droplet onto the IC card carrier tape sample;

[0029] The light source: is used to ensure that the collection system can clearly collect the image.

[0030] It is possible to sample the infiltration image of the UV curable glue and the surface of the IC card carrier tape within a specified time, so as to test the wettability between the IC card carrier tape and the UV curable glue, and guide and adjust the encapsulation of the IC card carrier tape according to the test results, thereby reducing the product scrap caused by the difference in encapsulation performance between batches of the IC card carrier tape, improving production efficiency and product yield, and reducing costs.

[0031] The operation method of the device for the encapsulation performance of the IC card carrier tape described in the present invention includes the following steps:

[0032] Step 1: Cut the IC card carrier tape and fix it to the sample stage;

[0033] Step 2: Turn on the light source to ensure that the collection system can clearly collect the image;

[0034] Step 3: Add the UV curable glue into the injection unit and drain the air bubbles at the bottom.

[0035] Step 4: Control the injection unit to drop the UV curable glue onto the IC card carrier tape sample, and the acquisition system samples the infiltration image of the UV curable glue and the surface of the IC card carrier tape within the specified time.

[0036] Step 5: Measure the diffusion angle of the acquired image.

[0037] The infiltration image of the UV curable glue and the surface of the IC card carrier tape can be sampled within the specified time, so as to test the wettability of the IC card carrier tape and the UV curable glue, and guide and adjust the IC card carrier tape packaging according to the test results, thereby reducing the product scrap caused by the packaging performance difference between batches of the IC card carrier tape, improving the production efficiency and product yield, and reducing the cost.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] The test method for the packaging performance of the IC card carrier tape described in the present invention can test the wettability of the IC card carrier tape and the UV curable glue before the IC card carrier tape is chip-mounted and wire-bonded / solder-bonded, and classify according to the test results, guide and adjust the IC card carrier tape packaging parameters, thereby reducing the product scrap caused by the packaging performance difference between batches of the IC card carrier tape, improving the production efficiency and product yield, and reducing the cost.

[0040] The test device for the packaging performance of the IC card carrier tape described in the present invention can sample the infiltration image of the UV curable glue and the surface of the IC card carrier tape within the specified time, so as to test the wettability of the IC card carrier tape and the UV curable glue, and guide and adjust the IC card carrier tape packaging according to the test results, thereby reducing the product scrap caused by the packaging performance difference between batches of the IC card carrier tape, improving the production efficiency and product yield, and reducing the cost.

[0041] The operation method of the device for the packaging performance of the IC card carrier tape described in the present invention can sample the infiltration image of the UV curable glue and the surface of the IC card carrier tape within the specified time, so as to test the wettability of the IC card carrier tape and the UV curable glue, and guide and adjust the IC card carrier tape packaging according to the test results, thereby reducing the product scrap caused by the packaging performance difference between batches of the IC card carrier tape, improving the production efficiency and product yield, and reducing the cost. Description of the Drawings

[0042] Figure 1 is a flowchart of the packaging of an IC card carrier tape described in the present invention;

[0043] Figure 2 It is a schematic structural diagram of a test device for the encapsulation performance of an IC card carrier tape according to the present invention;

[0044] Figure 3 It is a schematic diagram of the infiltration of a UV curable adhesive and the surface of an IC card carrier tape according to the present invention.

[0045] Among them: 1. Sample stage; 2. Acquisition system; 3. Injection unit; 4. Light source. Specific embodiments

[0046] To make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0047] The present invention provides a method for testing the encapsulation performance of an IC card carrier tape, which can detect the surface performance of the carrier tape for IC cards before attaching the chip, test its wettability with the UV curable adhesive, determine the encapsulation performance of the IC card carrier tape, control and process according to the detection results, identify the encapsulation performance differences between batches of IC card carrier tapes, avoid encapsulation differences caused by reasons such as surface performance differences of IC card carrier tapes after attaching the chip and welding gold wires / alloy wires and then encapsulating with the UV curable adhesive, reduce the material and cost losses caused by product scrapping, and improve production efficiency. And this method can achieve rapid batch detection.

[0048] It is achieved through the following technical solutions:

[0049] For the chip encapsulation of the IC card carrier tape, a UV curable glue is used. If this UV curable glue is used as the liquid medium and the IC card carrier tape is used as the solid medium, the interfacial performance between the two can be tested, so as to obtain the wettability and diffusibility of the UV curable glue on the surface of the IC card carrier tape, and analyze whether there are differences on the surface of the IC card carrier tape, so as to predict whether the encapsulation height is consistent after attaching the chip and welding the gold wire / alloy wire to the IC card carrier tape.

[0050] Testing the diffusion angle of the solid-liquid interface between the IC card carrier tape and the UV curable adhesive is a relatively intuitive method to characterize the wettability between the two, and the test results of the diffusion angle are closely related to factors such as diffusion time and ambient temperature. Therefore, this method also needs to set appropriate test temperature and diffusion time, so as to accurately characterize the diffusion performance of the UV curable encapsulation glue on the surface of the IC card carrier tape. That is to say, the wettability and diffusibility of the UV curable glue on the surface of the IC card carrier tape are determined by testing the diffusion angle of the UV curable glue on the surface of the IC card carrier tape.

[0051] This method also includes classifying the IC card packaging carrier tapes during use according to the measurement results of the diffusion angle of the glue for IC card carrier chip packaging, and determining the appropriate IC card packaging temperature and glue usage amount based on the measurement results, so as to reduce the product scrap caused by the excessive packaging size.

[0052] A test method for the packaging performance of IC card carrier tapes specifically includes the following steps:

[0053] Step S1: Testing the diffusion angle of the UV curable glue on the surface of the IC card carrier tape;

[0054] Step S2: Judging the packaging performance of the IC card carrier tape according to the diffusion angle;

[0055] Step S3: Classifying the IC card carrier tapes according to the differences in the packaging performance of the IC card carrier tapes;

[0056] Step S4: Matching the packaging conditions of the UV curable glue according to the detection and classification results.

[0057] The said step S1 includes the following steps:

[0058] Step S11: Preparation: Cutting the IC card carrier tape into IC card carrier tape samples;

[0059] Step S12: Sampling: Dropping the UV curable glue onto the IC card carrier tape sample and sampling the infiltration image of the UV curable glue and the surface of the IC card carrier tape sample within the specified time;

[0060] Step S13: Measurement: Measuring the diffusion angle of the collected image.

[0061] The measurement method for the diffusion angle on the surface of the above-mentioned IC card carrier tape involves the following specific detection parameters:

[0062] The temperature set on the sample stage: 20 - 70 °C; The single drop volume of the UV curable glue is 1 - 10 μL; The time for the acquisition system to collect the sample is 5 - 50 s.

[0063] As Figure 3 shown, for the measurement method of the diffusion angle on the surface of the above-mentioned IC card carrier tape, the following diffusion angle measurement method is adopted for the collected image:

[0064] Making tangents to the left and right sides of the semi-circular drop, measuring the angles ∠L and ∠R between the tangents and the horizontal contact surface of the IC card carrier tape and the semi-circular drop, and then averaging the angles on the left and right sides to obtain ∠Ave, which is the diffusion angle between the IC card carrier tape and the UV curable glue: ∠Ave = 1 / 2(∠L + ∠R).

[0065] Based on the measurement results of the diffusion angle on the surface of the above-mentioned IC card carrier tape, the classification method for the IC card carrier tape is as follows:

[0066] When the diffusion angle is 10 - 20°, it is classified as type A; when the diffusion angle is 20 - 30°, it is classified as type B; when the diffusion angle is 30 - 40°, it is classified as type C.

[0067] According to the above classification method of the IC card carrier tape, the parameters for encapsulating the IC card carrier tape with UV curable adhesive are as follows:

[0068] For type A IC card carrier tape, the encapsulation temperature is 40 - 60 °C, and the glue volume is 6 - 12 μL;

[0069] For type B IC card carrier tape, the encapsulation temperature is 50 - 70 °C, and the glue volume is 8 - 14 μL;

[0070] For type C IC card carrier tape, the encapsulation temperature is 60 - 80 °C, and the glue volume is 10 - 16 μL.

[0071] As Figure 2 shown, the present invention also provides a test device for the encapsulation performance of an IC card carrier tape, including a sample stage 1, a collection system 2, an injection unit 3, and a light source 4.

[0072] Sample stage 1: Used to fix the cut IC card carrier tape sample;

[0073] Collection system 2: Used to sample the infiltration image of the UV curable adhesive on the surface of the IC card carrier tape within a specified time.

[0074] Injection unit 3: Used to drop the UV curable glue droplets onto the IC card carrier tape sample.

[0075] Light source 4: Used to ensure that the collection system 2 can clearly collect the image.

[0076] The present invention also provides an operation method for the device for the encapsulation performance of an IC card carrier tape, including the following steps:

[0077] Step 1: Cut the IC card carrier tape and fix it on the sample stage 1;

[0078] Step 2: Turn on the light source 4 to ensure that the collection system 2 can clearly collect the image;

[0079] Step 3: Add the UV curable glue into the injection unit 3 and drain the air bubbles at the bottom;

[0080] Step 4: Control the injection unit 3 to drop the UV curable glue droplets onto the IC card carrier tape sample, and within a specified time, the collection system 2 samples the infiltration image of the UV curable glue on the surface of the IC card carrier tape;

[0081] Step 5: Measure the diffusion angle of the collected image.

[0082] Example

[0083] The detection method for the encapsulation performance of the IC card carrier tape is carried out by the following steps for detection, classification, and encapsulation:

[0084] The first step: Use DELO4670 type UV curable adhesive as the encapsulation adhesive and test its diffusion angle on the surface of the IC card carrier tape;

[0085] The second step: Determine the encapsulation performance of the IC card carrier tape according to the test results of the diffusion angle;

[0086] The third step: Classify the IC card carrier tapes according to the differences in the encapsulation performance of the IC card carrier tapes;

[0087] The fourth step: Match the appropriate UV curable adhesive encapsulation conditions according to the detection and classification results.

[0088] The diffusion angle detection uses a test device for the encapsulation performance of the IC card carrier tape to measure the diffusion angle of DELO4670 type UV curable adhesive on the surface of the IC card carrier tape, including the following steps:

[0089] Step 1: Cut the IC card carrier tape to a size of 1.5mm * 7mm, fix it on the sample stage 1, and set the temperature of the sample stage to 40 °C;

[0090] Step 2: Turn on the light source 4 and adjust it to an appropriate brightness to ensure that the acquisition system 2 can clearly acquire the required images;

[0091] Step 3: Add DELO4670 type UV curable glue into the injection unit 3 with a capacity of 1 ml and drain the air bubbles at the bottom;

[0092] Step 4: Control the amount of liquid dropped each time by the injection unit 3 to be 5 μL, that is, drop 5 μL of DELO4670 type UV curable adhesive onto the IC card carrier tape sample each time. Set the sampling speed of the acquisition system 2 to 10000 ms / frame and the total number of samples to 3 frames.

[0093] Step 5: Measure the diffusion angle of the image of the third frame collected.

[0094] Classify the materials according to the measurement results, and then select the appropriate encapsulation parameters for a certain category, as shown in the following table:

[0095] Batch number ∠L ∠R ∠Ave Diffusion angle classification 1 25.478 25.445 25.462 B 2 32.891 32.256 32.574 C 3 19.935 19.983 19.959 A 4 30.885 30.987 30.936 C 5 23.991 24.091 24.041 B 6 17.550 17.609 17.580 A 7 23.643 23.958 23.794 B

[0096] Table 1

[0097] Classify according to the diffusion angle, select the UV curable adhesive encapsulation parameters of the IC card carrier tape, and detect the product rejection rate caused by unqualified encapsulation height finally. The results are shown in the following table:

[0098]

[0099]

[0100] Table 2

[0101] Comparative example

[0102] After the IC card carrier tape that did not adopt this encapsulation test method was encapsulated with UV curable glue, the product rejection rate caused by the unqualified encapsulation height was detected, and the results are shown in the following table:

[0103] Total number of packages / each Number of non-conforming height / each Scrap rate / ppm 93542 83 887

[0104] Table 3

[0105] The above-mentioned embodiments only describe the preferred embodiments of the present invention, rather than being restrictive. Therefore, the present invention is not limited to the embodiments described in the specific embodiments. Any other embodiments obtained by those skilled in the art according to the technical solution of the present invention also belong to the scope protected by the present invention.

Claims

1. A test method for the encapsulation performance of an IC card carrier tape, characterized in that, Including: Using UV curable glue as the liquid medium and IC card carrier tape as the solid medium, testing the interfacial performance between the two, thereby obtaining the wettability and diffusibility of the UV curable glue on the surface of the IC card carrier tape, analyzing whether there are differences on the surface of the IC card carrier tape, and thus predicting whether the encapsulation height is consistent after attaching chips, welding gold wires or alloy wires to the IC card carrier tape; The wettability and diffusibility of the UV curable glue on the surface of the IC card carrier tape are determined by testing the diffusion angle of the UV curable glue on the surface of the IC card carrier tape.

2. The test method for the encapsulation performance of the IC card carrier tape according to claim 1, wherein Specifically, it includes the following steps: Step S1: Testing the diffusion angle of the UV curable glue on the surface of the IC card carrier tape; Step S2: Judging the encapsulation performance of the IC card carrier tape according to the diffusion angle; Step S3: Classifying the IC card carrier tapes according to the differences in the encapsulation performance of the IC card carrier tapes; Step S4: Matching the encapsulation conditions of the UV curable glue according to the detection and classification results.

3. The test method for the encapsulation performance of the IC card carrier tape according to claim 2, characterized in that, The step S1 includes the following steps: Step S11: Preparation: Cutting the IC card carrier tape into IC card carrier tape samples; Step S12: Sampling: Dropping the UV curable glue onto the IC card carrier tape sample, and sampling the infiltration image of the UV curable glue and the surface of the IC card carrier tape sample within a specified time; Step S13: Measurement: Measuring the diffusion angle of the collected image.

4. The test method for the encapsulation performance of an IC card carrier tape according to claim 3, wherein The temperature in the measurement: 20 - 70 °C; The single drop volume of the UV curable glue is 1 - 10 μL; The collection time is 5 - 50 s.

5. The test method for the encapsulation performance of an IC card carrier tape according to claim 3, characterized in that, The specific measurement method is as follows: Making tangents to the left and right sides of the semi-circular drop, measuring the angles ∠L and ∠R between the tangents and the IC card carrier tape sample and the horizontal contact surface of the semi-circular drop, and then taking the average value ∠Ave of the angles on the left and right sides, which is the diffusion angle between the IC card carrier tape sample and the UV curable glue: ∠Ave = 1 / 2(∠L + ∠R).

6. The test method for the encapsulation performance of an IC card carrier tape according to claim 2, characterized in that, The classification method for classifying the IC card carrier tapes is as follows: When the diffusion angle is 10 - 20 °, it is classified as class A; When the diffusion angle is 20 - 30 °, it is classified as class B; When the diffusion angle is 30 - 40 °, it is classified as class C.

7. The test method for the encapsulation performance of the IC card carrier tape according to claim 6, characterized in that, For the classification method of the IC card carrier tapes, the parameters for encapsulating the IC card carrier tapes with UV curable glue are as follows: For class A IC card carrier tapes, the encapsulation temperature is 40 - 60 °C, and the glue volume is 6 - 12 μL; For class B IC card carrier tapes, the encapsulation temperature is 50 - 70 °C, and the glue volume is 8 - 14 μL; For class C IC card carrier tapes, the encapsulation temperature is 60 - 80 °C, and the glue volume is 10 - 16 μL.

8. An apparatus for a test method of the encapsulation performance of an IC card carrier tape according to any one of claims 1-7, characterized in that, Including a sample stage (1), a collection system (2), an injection unit (3) and a light source (4), Sample stage (1): Used to fix the cut IC card carrier tape sample; Collection system (2): Used to sample the infiltration image of the UV curable glue and the surface of the IC card carrier tape within a specified time; Injection unit (3): Used to drop the UV curable glue onto the IC card carrier tape sample; Light source (4): Used to ensure that the collection system (2) clearly collects the image.

9. A method for operating a device for the encapsulation performance of an IC card carrier tape according to claim 8, characterized in that, Including the following steps: Step 1: Fix the cut IC card carrier tape to the sample stage (1); Step 2: Turn on the light source (4) to ensure that the collection system (2) clearly collects the image; Step 3: Add the UV curable glue into the injection unit (3) and drain the air bubbles at the bottom; Step 4: Control the injection unit (3) to drop the UV curable glue onto the IC card carrier tape sample, and the acquisition system (2) samples the infiltration image of the UV curable glue and the surface of the IC card carrier tape within the specified time; Step 5: Measure the diffusion angle of the acquired image.

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