Packaging structure, method of manufacturing a packaging structure, and electronic device

Abstract

The present disclosure provides a packaging structure, a packaging structure manufacturing method and an electronic device, and relates to the technical field of semiconductors. The packaging structure comprises a lead frame, a chip and a plastic package. The lead frame comprises a pin and a base island. The pin comprises a first segment and a second segment which are insulated from each other. The chip is arranged on the base island. The chip is electrically connected to the base island and the first segment, and the base island is electrically connected to the second segment. The plastic package covers the lead frame and the chip. The plastic package is provided with a groove on the side close to the base island. The groove is located between the base island and the pin. In this way, the bonding force between the packaging structure and the circuit board can be improved, and the pin can be prevented from delaminating or breaking.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular, to a packaging structure, a packaging structure manufacturing method and an electronic device. BACKGROUND

[0002] The existing Quad Flat No-lead Package (QFN) product is not easy to see the pin or the connecting end when welding, and it is not possible to confirm whether the QFN product is successfully welded to the circuit board, and the reliability is low. After some reliability tests, the pins at the welding position of the QFN product and the circuit board are prone to delamination or fracture, resulting in product failure. SUMMARY

[0003] The purpose of the present application includes, for example, providing a packaging structure, a packaging structure manufacturing method and an electronic device, which can improve the bonding force of the QFN packaging structure and the circuit board, and enhance the reliability of the connection.

[0004] Embodiments of the present application can be implemented as follows:

[0005] In a first aspect, the present application provides a packaging structure, comprising:

[0006] a lead frame, the lead frame comprising a pin and a base island, the pin comprising a first segment and a second segment insulated from each other;

[0007] a chip, the chip being arranged on the base island; the chip being electrically connected to the base island and the first segment respectively, and the base island and the second segment being electrically connected;

[0008] a plastic package, the plastic package covering the lead frame and the chip, the plastic package being provided with a groove on a side close to the base island, the groove being located between the base island and the pin.

[0009] In an optional embodiment, the pin further comprises an insulating glue, the insulating glue being arranged between the first segment and the second segment and being used to connect the first segment and the second segment.

[0010] In an optional embodiment, the first segment is away from the base island relative to the second segment.

[0011] In an optional embodiment, the chip and the first segment are electrically connected by a first line arc, and the second segment and the base island are electrically connected by a second line arc; the second line arc is grounded, and the highest point of the second line arc is higher than the side surface of the chip away from the base island.

[0012] Alternatively, the highest point of the second line arc is lower than or equal to the side surface of the chip away from the base island.

[0013] In an optional embodiment, the second line arc is at least partially disposed in the groove.

[0014] In an optional embodiment, the distance between the lowest point of the second line arc and the bottom surface of the base island is less than or equal to the thickness of the base island.

[0015] In an optional embodiment, the second line arc has one or more peaks and one or more valleys; the plane in which the first line arc lies intersects the plane in which the second line arc lies, and the first line arc passes through a peak or a valley;

[0016] Alternatively, the plane in which the first line arc lies is parallel to the plane in which the second line arc lies, the first line arc is located between two second line arcs, and the highest point of the second line arc is higher than the highest point of the first line arc.

[0017] In an optional embodiment, the base island is made of a conductive material.

[0018] In a second aspect, the present application provides a packaging structure manufacturing method, comprising:

[0019] providing a lead frame; wherein the lead frame comprises a pin and a base island;

[0020] mounting a chip on the base island;

[0021] drawing a first line arc between the chip and the pin, and drawing a second line arc between the base island and the pin;

[0022] forming a plastic package outside the chip and the lead frame;

[0023] opening a groove on the side of the plastic package close to the base island to expose the second line arc.

[0024] In an optional embodiment, the method further comprises:

[0025] after the step of forming a plastic package outside the chip and the lead frame, cutting the pin to form an independent first segment and a second segment; wherein a cutting groove is formed between the first segment and the second segment;

[0026] filling the cutting groove with insulating glue.

[0027] In an optional embodiment, the method further comprises:

[0028] filling the groove with conductive glue.

[0029] In a third aspect, the present application provides an electronic device, comprising a circuit board and the packaging structure according to any one of the preceding embodiments, wherein the circuit board is provided with a first pad and a second pad, and the first pad is electrically connected with the first segment.

[0030] At least one of the second segment and the base island is electrically connected with the second pad; and / or, the second segment and the base island are electrically connected with the second pad by a second arc, and the second arc is at least partially exposed from the groove, and the second arc in the groove is electrically connected with the second pad.

[0031] The beneficial effects of the embodiments of the present application include, for example:

[0032] The packaging structure provided by the embodiments of the present application has the groove on the plastic package between the base island and the pin, and the groove can be filled with solder during welding, thereby increasing the contact area with the solder and improving the reliability of welding. At the same time, it is beneficial to increase the bonding force between the circuit board and the plastic package. Secondly, the pin comprises a first segment and a second segment, and the first segment and the second segment are respectively welded with the circuit board, thereby improving the bonding force between the pin and the circuit board. The packaging structure can improve the bonding force between the lead frame and the circuit board, the connection is more reliable, and the product failure problem caused by delamination or fracture between the pin and the circuit board in the prior art is effectively prevented.

[0033] The packaging structure provided by the embodiments of the present application has the groove on the plastic package between the base island and the pin, and the groove can be filled with solder during welding, thereby increasing the contact area with the solder and improving the reliability of welding. At the same time, it is beneficial to increase the bonding force between the circuit board and the plastic package. Secondly, the pin comprises a first segment and a second segment, and the first segment and the second segment are respectively welded with the circuit board, thereby improving the bonding force between the pin and the circuit board. The packaging structure can improve the bonding force between the lead frame and the circuit board, the connection is more reliable, and the product failure problem caused by delamination or fracture between the pin and the circuit board in the prior art is effectively prevented.

[0034] The electronic device provided by the embodiments of the present application comprises the packaging structure and the circuit board, which is beneficial to improve the connection reliability, the product quality is good, and the qualified rate is high. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0036] Figure 1 The application scenario diagram of the packaging structure provided by the embodiments of the present application;

[0037] Figure 2 The first structure diagram of the packaging structure provided by the embodiments of the present application;

[0038] Figure 3 Structure diagram of another view of the first structure of the packaging structure provided by the embodiment of the present application;

[0039] Figure 4 Structure diagram of the second structure of the packaging structure provided by the embodiment of the present application;

[0040] Figure 5 Structure diagram of one layout structure of the first line arc and the second line arc of the packaging structure provided by the embodiment of the present application;

[0041] Figure 6 Manufacturing method of the packaging structure provided by the embodiment of the present application Figure 1 ;

[0042] Figure 7 Manufacturing method of the packaging structure provided by the embodiment of the present application Figure 2 .

[0043] Figure: 100 - packaging structure; 110 - lead frame; 120 - pin; 121 - first segment; 123 - second segment; 125 - cutting groove; 127 - insulating glue; 130 - base island; 131 - frame; 140 - chip; 141 - first line arc; 143 - second line arc; 145 - third line arc; 150 - plastic package; 151 - groove; 160 - protective film; 161 - adhesive; 200 - circuit board; 210 - first solder pad; 220 - second solder pad; 230 - conductive glue. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0045] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0046] It should be noted that: similar labels and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0047] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, or the orientation or position relationship when the product of the present application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application.

[0048] In addition, if the terms "first", "second" and the like appear, they are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0049] It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.

[0050] First embodiment

[0051] Please refer to Figures 1 to 3 The present application provides a packaging structure 100 suitable for QFN structure, which is used for connecting with a circuit board 200.

[0052] The packaging structure 100 includes a lead frame 110, a chip 140 and a plastic package 150. The lead frame 110 includes a pin 120 and a base island 130, and the pin 120 includes a first segment 121 and a second segment 123 which are insulated from each other. The chip 140 is arranged on the base island 130, and the chip 140 is electrically connected with the base island 130 and the first segment 121 respectively, and the base island 130 and the second segment 123 are electrically connected. The plastic package 150 covers the lead frame 110 and the chip 140, and the plastic package 150 is provided with a groove 151 on the side close to the base island 130, and the groove 151 is located between the base island 130 and the pin 120. When the packaging structure 100 is connected with the circuit board 200, it can be welded or bonded by conductive adhesive 230, etc., and the groove 151 can be filled with solder, which increases the contact area between the packaging structure 100 and the solder, improves the reliability and weldability of the welding. At the same time, it is beneficial to increase the bonding force between the circuit board 200 and the plastic package 150. Secondly, the pin 120 includes the first segment 121 and the second segment 123, and the first segment 121 and the second segment 123 are welded with the circuit board 200 respectively, which improves the bonding force between the pin 120 and the circuit board 200. The packaging structure 100 can improve the bonding force between the lead frame 110 and the circuit board 200, the connection is more reliable, and effectively prevents the product failure problem caused by delamination or fracture between the pin and the circuit board in the prior art.

[0053] Optionally, the lead frame 110 further includes a frame 131, and the frame 131 is arranged on the outer periphery of the base island 130, and the pin 120 is arranged on the frame 131. The base island 130 is connected with the frame 131. The base island 130 and the pin 120 are in a hollow structure.

[0054] The pin 120 further comprises an insulating glue 127, which is arranged between the first segment 121 and the second segment 123 and is used to connect the first segment 121 and the second segment 123. The insulating glue 127 makes the first segment 121 and the second segment 123 electrically insulated, avoiding short circuit between the first segment 121 and the second segment 123. Optionally, the first segment 121 is away from the base island 130 relative to the second segment 123, that is, the second segment 123 is closer to the base island 130, so as to facilitate wire bonding connection of the second segment 123 and the base island 130. Of course, it is not limited to this, the first segment 121 can also be arranged close to the base island 130 relative to the second segment 123. Alternatively, the first segment 121 and the second segment 123 are arranged side by side, and the distances of the two to the base island 130 are substantially equal.

[0055] In the embodiment, the thermal expansion coefficient of the insulating glue 127 is smaller than the thermal expansion coefficient of the overall structure after plastic packaging, and the insulating glue 127 deforms preferentially to the overall structure after plastic packaging, so as to reduce the warping of the packaging structure 100 and play a stress buffering effect. It can be easily understood that in the subsequent process of cutting the outer side of the pin 120 along the cutting path to form a single product, some structural stress will be generated due to cutting and pulling. By pre-filling the insulating glue 127 in the pin 120, the stress can be absorbed, thereby relieving the warping of the structure. And the warping of the packaging structure 100 can avoid the phenomenon of edge burr of the outer side of the pin 120 when cutting along the cutting path, thereby avoiding the problem of metal electrical bridging caused by burr between the pins 120.

[0056] The chip 140 can be a positive chip 140 or a flip chip 140. In the embodiment, the chip 140 is a positive chip 140. The chip 140 is electrically connected to the first segment 121 by a first wire arc 141, and the second segment 123 is electrically connected to the base island 130 by a second wire arc 143. Optionally, the first wire arc 141 is a functional wire arc, and the second wire arc 143 is grounded, and the highest point of the second wire arc 143 is higher than the surface of the side of the chip 140 away from the base island 130. Since the number of pins 120 is multiple, the pins 120 are arranged around the outer periphery of the base island 130. In this way, the number of second wire arcs 143 can also be multiple, and the second wire arcs 143 are arranged around the chip 140. The second wire arc 143 forms a cage structure around the outer periphery of the chip 140, which plays an electromagnetic shielding role for the chip 140. At the same time, the second wire arc 143 has a heat dissipation and buffering effect.

[0057] It is understandable that the first arc 141 and the second arc 143, with their buffering effect, can also be reflected in the subsequent process of cutting the outer side of the pin 120 along the cutting path to form a single product, reducing tensile stress during the cutting process, reducing burrs on the cutting edge, and improving cutting quality and efficiency. Of course, they also play a buffering role in the cutting process of separating the pin 120 into the first segment 121 and the second segment 123, improving cutting quality and efficiency. Furthermore, the second arc 143 has a grounding shielding function. Located between the base island 130 and the pin 120, it can also shield the noise between the base island 130 and the pin 120 in the lead frame 110, providing electromagnetic shielding and electrostatic discharge. Existing lead frames cannot be designed with a circuit layer, thus failing to achieve the blocking and isolation of electromagnetic waves between the base island and the pin.

[0058] Combination Figure 4 Of course, in other embodiments, the highest point of the second arc 143 may also be lower than or equal to the surface of the chip 140 away from the base island 130. This can also serve as a buffer and heat dissipation function.

[0059] In this embodiment, the base island 130 is provided with an electrical connection terminal, which is electrically connected to the second segment 123 via a second arc 143. The grounding pad on the chip 140 is electrically connected to the electrical connection terminal via a third arc 145. Of course, the base island 130 can also be made of a conductive material. In this way, the entire base island 130 can be used as a conductor, becoming a connection terminal.

[0060] Optionally, the second arc 143 is at least partially located within the groove 151. In this way, the second arc 143 within the groove 151 can serve as a grounding point. When connected to the circuit board 200, the increased number of grounding points ensures a more reliable electrical connection. Even if one or more grounding points fail, other grounding points can still maintain the grounding connection. Furthermore, the increased number and larger grounding area of ​​the grounding points reduce the alignment accuracy requirements when connecting to the package structure 100. Even with a certain range of offset, the reliability of the electrical connection can be guaranteed, making operation more convenient and simpler.

[0061] Combination Figure 2Optionally, the depth of the groove 151 is less than the thickness (i.e. the height) of the base island 130. The distance H between the lowest point of the second linear arc 143 and the bottom surface of the base island 130 is less than or equal to the thickness D of the base island 130. In the embodiment, the distance H between the lowest point of the second linear arc 143 and the bottom surface of the base island 130 is less than half of the thickness D of the base island 130. It can be understood that the distance between the second linear arc 143 and the bottom surface of the base island 130 can prevent the second linear arc 143 from touching the circuit board 200 during the mounting of the circuit board 200, thereby protecting the second linear arc 143. At the same time, the distance prevents the second linear arc 143 from protruding out of the groove 151 and causing a gap between the lead frame 110 and the circuit board 200, which is not conducive to the electrical connection of the pins 120. The distance between the second linear arc 143 and the bottom surface of the base island 130 cannot be too large, otherwise the connection reliability of the second linear arc 143 and the circuit board 200 will be reduced, and the capillary effect on the solder and the like cannot be fully exerted.

[0062] Optionally, the second linear arc 143 is a multi-segment arc. The second linear arc 143 has one or more peaks and one or more valleys. In the embodiment, the arc with two peaks and one valley is taken as an example for illustration, and of course, in the optional mode, it can also be a single-peak and single-valley shape, or a three-peak and two-valley shape, etc., which is not limited here. It can be understood that the use of a double-peak or multi-peak linear arc makes the shielding linear arc more dense, and the electromagnetic shielding effect is better, which can prevent more electromagnetic waves from passing through, and can also reduce the electromagnetic interference caused by the signal of the lead frame 110 itself. At the same time, the heat around the chip 140 is dissipated from the bottom of the lead frame 110, which greatly improves the heat dissipation effect. And improves the impact resistance to the plastic sealing mold flow, and the structure is more reliable.

[0063] In combination Figure 3 , the plane where the first linear arc 141 is located and the plane where the second linear arc 143 is located are parallel, the first linear arc 141 is located between the two second linear arcs 143, and the highest point of the second linear arc 143 is higher than the highest point of the first linear arc 141. The second linear arc 143 can also shield the first linear arc 141 from electromagnetic interference. It can reduce the electromagnetic interference caused by the signal of the lead frame 110 itself. Alternatively, the plane where the first linear arc 141 is located and the plane where the second linear arc 143 is located are in the same plane, and the first linear arc 141 is higher than the second linear arc 143, which is not limited here.

[0064] Optionally, in combination Figure 5The plane where the first linear arc 141 is located and the plane where the second linear arc 143 is located intersect, and the first linear arc 141 passes through the wave crest or the wave trough. In this way, the second linear arc 143 can also play an electromagnetic shielding role on the electromagnetic waves between the plurality of first linear arcs 141, and the electrostatic discharge between the first linear arcs 141 can also be realized. In addition, the second linear arc 143 has a certain angle with the mold flow direction, that is, is not parallel to the mold flow direction, so as to facilitate relieving the impact caused by the mold flow of plastic packaging, the buffering effect is better, the electrical connection is more stable, and the reliability is high. Figure 5 Only part of the first linear arc 141 and the second linear arc 143 are shown, and not all are shown.

[0065] Second embodiment

[0066] Combined Figures 6 to 7 The packaging structure 100 manufacturing method provided by the embodiment of the present application comprises the following steps.

[0067] A lead frame 110 is provided; the lead frame 110 comprises a frame 131, a pin 120 and a base island 130; the pin 120 and the base island 130 are connected with the frame 131 respectively, and the base island 130 and the pin 120 are in a hollow structure. A protective film 160 is attached to the back of the frame 131, for protecting the frame 131 and the pin 120 from being deformed, and facilitating relieving the warping in the packaging process.

[0068] A chip 140 is attached to the base island 130. The chip 140 can be fixed to the base island 130 by using an adhesive 161. For example, the adhesive 161 is silver paste or non-conductive adhesive film, which is not limited here. The adhesive 161 plays a role of adhesion and fixation as well as buffering and heat dissipation. Optionally, the base island 130 is made of conductive material.

[0069] A first linear arc 141 is made between the chip 140 and the pin 120, and a second linear arc 143 is made between the base island 130 and the pin 120. Optionally, the pin 120 comprises a first segment 121 away from the base island 130 and a second segment 123 close to the base island 130. The functional pad of the chip 140 is connected with the first segment 121 of the pin 120 by the first linear arc 141, the base island 130 and the second segment 123 of the pin 120 are connected by the second linear arc 143, and the ground pad of the chip 140 and the base island 130 are connected by a third linear arc 145. The second linear arc 143 and the third linear arc 145 are grounded. The shape and path of the second linear arc 143 can be flexibly adjusted according to actual conditions, and the height relationship and position layout of the first linear arc 141 and the second linear arc 143 can be flexibly set according to actual needs.

[0070] In the embodiment, the second wire arc 143 is a multi-segment wire arc, having two wave crests and one wave trough. The wire bonding operation is as follows: the first segment of wire bonding starts from the second segment 123, and the wire is bonded upward, with the highest point being higher than the side surface of the chip 140 away from the base island 130, and then the wire is bonded downward, with the lowest point being less than half the thickness of the base island 130 away from the bottom surface of the base island 130 (the back surface of the lead frame 110), and the lowest point does not exceed the bottom surface of the base island 130. The second segment of wire bonding starts from the lowest point, and the wire is bonded upward, with the highest point being higher than the side surface of the chip 140 away from the base island 130, and then the wire is bonded downward, with the end of the wire arc being connected to the base island 130. It can be understood that the lowest point of the second wire arc 143 does not exceed the bottom surface of the base island 130, which can protect the second wire arc 143 from being touched by the circuit board 200 in the subsequent mounting or board mounting process.

[0071] A plastic package 150 is formed outside the chip 140 and the lead frame 110 to protect the chip 140, the lead frame 110 and the wire bonding structure. After the plastic package, the protective film 160 on the back surface of the frame 131 is removed.

[0072] Optionally, after the step of forming the plastic package 150 outside the chip 140 and the lead frame 110, the pin 120 is cut to form independent first segments 121 and second segments 123; wherein the cutting groove 125 is formed between the first segments 121 and the second segments 123; and the insulating glue 127 is filled in the cutting groove 125. The filling of the insulating glue 127 can play the role of insulation isolation, heat dissipation and buffering.

[0073] A groove 151 is formed on the side of the plastic package 150 close to the base island 130 to expose part of the second wire arc 143. Optionally, the groove 151 can be formed by laser slotting. The position of the groove 151 corresponds to the lowest point of the second wire arc 143 to expose the lowest point of the second wire arc 143. The second wire arc 143 in the groove 151 can be used as a grounding point. It can be easily understood that the formation of the groove 151 on the plastic package 150 is also beneficial to release the structural stress and relieve warping.

[0074] Finally, the whole board structure is separated, such as laser cutting or cutter cutting, to form a single encapsulation structure 100. The encapsulation structure 100 is completed.

[0075] In combination Figure 1The embodiment of the present application also provides an electronic device, comprising the circuit board 200 and the packaging structure 100 according to any one of the preceding embodiments, wherein the circuit board 200 is provided with a first pad 210 and a second pad 220, the first pad 210 is electrically connected with the first segment 121, at least one of the second segment 123 and the base island 130 is electrically connected with the second pad 220, and / or the second segment 123 and the base island 130 are electrically connected by the second line arc 143, the second line arc 143 is at least partially exposed from the groove 151, and the second line arc 143 in the groove 151 is electrically connected with the second pad 220.

[0076] Optionally, the method for mounting the packaging structure 100 on the circuit board 200 is as follows:

[0077] The packaging structure 100 is attached to the circuit board 200, the first segment 121 is electrically connected with the first pad 210, and the second segment 123 is electrically connected with the second pad 220. The electrical connection can be achieved by using the solder paste or the conductive glue 230. Since the second line arc 143 is exposed from the groove 151, the exposed second line arc 143 can be used as a grounding point. The second pad 220 can be electrically connected with the second line arc 143 in the groove 151, achieving the grounding effect. The second line arc 143 in the groove 151 can also improve the capillary action of the solder paste or the conductive glue 230, the solder paste covers the second line arc 143 and fills the groove 151, thereby improving the welding strength of the pin 120 and the circuit board 200 and achieving the wettable side climbing effect. This method can avoid the problems such as damage of the pin 120 caused by the design of the groove or the hole on the pin 120 in the traditional process.

[0078] In the embodiment, the grounding welding point in the packaging structure 100 is added, at least one of the second segment 123, the second line arc 143 and the base island 130 is electrically connected with the second pad 220, achieving the grounding effect, thereby reducing the attachment precision of the packaging structure 100 on the circuit board 200, expanding the attachment range, and making the operation more convenient, simple and reliable.

[0079] Of course, the solder paste or the conductive glue 230 can be pre-set in the groove 151, or the dispensing or printing method can be used to achieve the electrical connection between the second line arc 143 and the circuit board 200.

[0080] The parts not mentioned in the embodiment are similar to those described in the first embodiment, and will not be described here.

[0081] In summary, the beneficial effects of the embodiment of the present application include:

[0082] The packaging structure 100 provided by the embodiment of the present application has the groove 151 on the plastic package 150 between the base island 130 and the pin 120, and the groove 151 can be filled with solder when the packaging structure 100 is pasted on the circuit board 200, so that the contact area with the solder is increased and the reliability of welding is improved. Meanwhile, the bonding force between the circuit board 200 and the plastic package 150 is increased. Secondly, the pin 120 includes the first segment 121 and the second segment 123, and the first segment 121 and the second segment 123 are welded with the circuit board 200 respectively, so that the bonding force between the pin 120 and the circuit board 200 is improved. The packaging structure 100 can improve the bonding force between the lead frame 110 and the circuit board 200, and the connection is more reliable, so that the product failure problem caused by the delamination or fracture between the pin 120 and the circuit board 200 in the prior art is effectively prevented. In addition, the packaging structure 100 has the electromagnetic shielding effect, the structure warping is alleviated, and the heat dissipation performance is improved.

[0083] The packaging structure 100 provided by the embodiment of the present application has the groove 151 on the plastic package 150 between the base island 130 and the pin 120, and the groove 151 can be filled with solder when the packaging structure 100 is pasted on the circuit board 200, so that the contact area with the solder is increased and the reliability of welding is improved. Meanwhile, the bonding force between the circuit board 200 and the plastic package 150 is increased. Secondly, the pin 120 includes the first segment 121 and the second segment 123, and the first segment 121 and the second segment 123 are welded with the circuit board 200 respectively, so that the bonding force between the pin 120 and the circuit board 200 is improved. The packaging structure 100 can improve the bonding force between the lead frame 110 and the circuit board 200, and the connection is more reliable, so that the product failure problem caused by the delamination or fracture between the pin 120 and the circuit board 200 in the prior art is effectively prevented. In addition, the packaging structure 100 has the electromagnetic shielding effect, the structure warping is alleviated, and the heat dissipation performance is improved.

[0084] The electronic device provided by the embodiment of the present application includes the packaging structure 100 and the circuit board 200, so that the connection reliability is improved, the product quality is good, and the qualified rate is high.

[0085] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical range disclosed by the present application can be easily thought by those skilled in the art, and should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A packaging structure, characterized in that, include: A lead frame, the lead frame including pins and a base island, the pins including a first segment and a second segment that are insulated from each other; A chip is disposed on the base island; the chip is electrically connected to the base island and the first segment, and the base island and the second segment are electrically connected. A molding compound covering the lead frame and the chip, the molding compound having a groove on the side near the base island, the groove being located between the base island and the pin; The pin also includes an insulating colloid, which is disposed between the first segment and the second segment and is used to connect the first segment and the second segment; The chip is connected to the first segment by a first wire arc electrical connection, and the second segment is connected to the base island by a second wire arc electrical connection; The second arc is grounded, and the highest point of the second arc is higher than the side surface of the chip away from the base island; or, the highest point of the second arc is lower than or equal to the side surface of the chip away from the base island. The groove exposes a portion of the second arc, and the second arc is at least partially located within the groove.

2. The packaging structure according to claim 1, characterized in that, The first segment is farther away from the base island relative to the second segment.

3. The packaging structure according to claim 1, characterized in that, The distance between the lowest point of the second arc and the bottom surface of the base island is less than or equal to the thickness of the base island.

4. The packaging structure according to claim 1, characterized in that, The second arc has one or more crests and one or more troughs; the plane containing the first arc intersects the plane containing the second arc, and the first arc passes through a crest or a trough; Alternatively, the plane containing the first arc is parallel to the plane containing the second arc, the first arc is located between the two second arcs, and the highest point of the second arc is higher than the highest point of the first arc.

5. The packaging structure according to any one of claims 1 to 4, characterized in that, The base island is made of conductive material.

6. A method for fabricating a packaging structure, characterized in that, The method for fabricating the encapsulation structure as described in any one of claims 1 to 5 includes: A lead frame is provided; wherein the lead frame includes pins and a base island; Chips are mounted on the base island; A first arc line is formed between the chip and the pin, and a second arc line is formed between the base island and the pin; A molding compound is formed on the outside of the chip and the lead frame; A groove is formed on the side of the molding body near the base island to expose the second arc.

7. The method for fabricating the packaging structure according to claim 6, characterized in that, The method further includes: After the step of forming a molding compound on the outside of the chip and the lead frame, the pins are cut to form separate first segments and second segments; wherein a cutting groove is formed between the first segment and the second segment; The cutting groove is filled with insulating colloid.

8. The method for fabricating the packaging structure according to claim 6, characterized in that, The method further includes: The groove is filled with conductive adhesive.

9. An electronic device, characterized in that, Includes a circuit board and a packaging structure as described in any one of claims 1 to 5, wherein the circuit board has a first pad and a second pad, wherein the first pad is electrically connected to the first segment; At least one of the second segment and the base island is electrically connected to the second pad; the second segment and the base island are electrically connected by a second arc, the second arc being at least partially exposed in the groove, and solder paste or conductive adhesive is disposed in the groove to achieve electrical connection between the second arc in the groove and the second pad.

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