A semiconductor material dewaxing device and process thereof

Abstract

The present invention discloses a semiconductor material dewaxing device and a process thereof, wherein the device comprises a water tank, wherein a loading platform and a unloading platform are respectively arranged on both sides of the water tank, wherein a substrate carrier is arranged on the loading platform, wherein a workpiece is sleeved on the substrate carrier, wherein a processing substrate is arranged on the upper end of the workpiece and the processing substrate is sleeved with the substrate carrier, wherein a manipulator base is arranged at the rear end of the water tank, wherein a manipulator is arranged on the manipulator base, wherein a mechanical claw is arranged at the output end of the manipulator, and a hot water spray head is arranged on one side of the mechanical claw. Compared with the prior art, the advantages of the present invention are: improving the dewaxing qualified rate and solving the problems of scratches and edge collapse.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor dewaxing, and in particular to a semiconductor material dewaxing device and a process thereof. Background Art

[0002] Most of the dewaxing processes are traditional manual operations. The processed substrate is first placed on an electric heating plate. After the wax on the substrate is melted, the semiconductor workpiece is separated from the processed substrate. Since the bottom of the workpiece fits tightly to the fixture, the viscosity of the paraffin wax is high after melting, making separation difficult.

[0003] There are generally two operating methods.

[0004] 1. Operators usually push the semiconductor product away from the fixture to make the edge of the product stick out, and lift the edge by hand to separate the workpiece and the substrate. This operation is simple and easy to operate, but the probability of scratching the joint surface of the workpiece is high. This method can be used for rough processing.

[0005] 2. Manual pulling is not easy to cause scratches. The operator needs to be very careful. Hold the workpiece with one hand, lift it up a gap, and then blow compressed air into the joint surface of the workpiece and the processing substrate. This operation requires a high level of skill from the operator and is also time-consuming and laborious. After processing, a thin layer of burrs will be left on the bottom of the workpiece. The materials are all brittle materials. Although you are very careful, it will still cause edge collapse, that is, gaps, if you are not careful.

[0006] Disadvantages: The dewaxing qualification rate of semiconductor products in the existing technology is low, the operation is difficult, and the dewaxing is time-consuming and labor-intensive. Summary of the invention

[0007] The technical problem to be solved by the present invention is to overcome the above technical defects and provide a semiconductor material dewaxing device and process thereof.

[0008] In order to solve the above technical problems, the technical solution provided by the present invention is: a semiconductor material dewaxing device, including a water tank, with a loading platform and an unloading platform respectively provided on both sides of the water tank, a substrate carrier is provided on the loading platform, a workpiece is sleeved on the substrate carrier, a processing substrate is provided on the upper end of the workpiece, and the processing substrate and the substrate carrier are sleeved together, a manipulator base is provided at the rear end of the water tank, a manipulator is provided on the manipulator base, a manipulator is provided on the manipulator, a mechanical claw is provided on the manipulator, and a hot water spray head is provided on the mechanical claw.

[0009] Preferably, an ultrasonic vibrator is provided at the bottom of the water tank, an aeration pipe is provided in the water tank, and aeration holes are provided on the aeration pipe.

[0010] Preferably, a heater, a liquid level meter and a temperature sensor are provided in the water tank. The heater is used to heat the water in the water tank. The liquid level meter can monitor the water level in the water tank in real time. The temperature sensor can monitor the water temperature in the water tank in real time.

[0011] Preferably, a water inlet and an overflow port are provided at the upper end of the inner wall of the water tank.

[0012] Preferably, a plurality of rubber rollers are installed on the substrate carrier, the plurality of rubber rollers are distributed in a circumference, and the upper end surfaces of the plurality of rubber rollers are all supporting inclined surfaces.

[0013] Preferably, the substrate carrier comprises a bottom plate, a supporting rubber roller is arranged on the bottom plate, a guide rod is arranged on the supporting rubber roller, a guide sleeve is arranged in the middle of the processing substrate and the guide sleeve is sleeved on the guide rod.

[0014] Preferably, the robot is a six-axis robot.

[0015] Preferably, the mechanical claw comprises a wide finger cylinder, the output ends on both sides of the wide finger cylinder are respectively provided with clamping plates, and a clamping opening for clamping the upper end of the substrate carrier is formed between the two clamping plates.

[0016] A semiconductor material dewaxing process, specifically comprising the following steps:

[0017] Step 1: The operator turns over the processed substrate, with the workpiece facing downward, and places it on the substrate carrier on the loading table;

[0018] Step 2: The robot first sprays hot water through a hot water spray head to remove the residual cutting liquid on the processing substrate;

[0019] Step 3: Pour clean water into the water tank through the water inlet in advance, start the heater to heat the inside of the water tank, then control the mechanical claw on the robot to grab the guide rod on the substrate carrier, and place the substrate carrier into the water tank. Cleaning powder can be added to the water tank;

[0020] Step 4: Soak in hot water for a period of time. After the wax melts, use the gravity of the workpiece to separate the workpiece from the processed substrate. During this period, the substrate carrier is shaken up and down several times by the robot, and gas is introduced into the aeration pipe to make the water tank bubble. An ultrasonic vibrator is used in the water tank.

[0021] Step 5: After the shedding is completed, the mechanical claw on the robot takes out the substrate carrier and places it on the unloading table. The hot water spray head on the robot sprays with hot water to remove the foam and residual wax;

[0022] Step 6: Control the mechanical claws on the robot to clamp the processed substrate and remove the processed substrate for continued use of the production line;

[0023] Step 7. Finally, the processed semiconductor workpiece is taken out manually or by a robot, and the substrate carrier placed on the unloading table is sent to the loading table for continued use through an assembly line or an AGV car.

[0024] The advantages of the present invention compared with the prior art are:

[0025] This application solves the problems of scratches and broken edges caused by traditional dewaxing techniques, ensures that the wax melts evenly in water, and the workpiece receives even stress during dewaxing. Full automation completely replaces manual labor, saving time and effort, with a high dewaxing pass rate and no damage to semiconductor workpieces. It achieves fully automatic and safe dewaxing, improves the yield rate, and improves efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of a semiconductor material dewaxing device of the present invention.

[0027] Figure 2 It is a schematic diagram of the matching structure of a processing substrate and a workpiece in a semiconductor material dewaxing device of the present invention.

[0028] Figure 3 It is a structural schematic diagram of a substrate carrier in a semiconductor material dewaxing device of the present invention.

[0029] As shown in the figure: 1. water tank, 2. loading table, 3. unloading table, 4. substrate carrier, 5. workpiece, 6. processing substrate, 7. robot base, 8. robot, 9. robot claw, 901, wide finger cylinder, 902, clamping plate, 10. hot water sprinkler head, 11. ultrasonic vibrator, 12. aeration pipe, 13. heater, 14. liquid level meter, 15. temperature sensor, 16. water inlet, 17. overflow port, 18. rubber roller, 19. bottom plate, 20. guide rod, 21. guide sleeve. DETAILED DESCRIPTION

[0030] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0031] The specific implementation of the present invention is further described below in conjunction with the accompanying drawings, wherein the same components are represented by the same reference numerals.

[0032] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0033] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0034] A semiconductor material dewaxing device comprises a water tank 1, with a loading platform 2 and an unloading platform 3 respectively provided on both sides of the water tank 1, a substrate carrier 4 is provided on the loading platform 2, a workpiece 5 is sleeved on the substrate carrier 4, a processing substrate 6 is provided on the upper end of the workpiece 5, and the processing substrate 6 is sleeved and matched with the substrate carrier 4, a manipulator base 7 is provided at the rear end of the water tank 1, a manipulator 8 is provided on the manipulator base 7, a manipulator 8 is provided on the manipulator 8, a mechanical claw 9 is provided on the manipulator 8, and a hot water spray head 10 is provided on the mechanical claw 9.

[0035] In one embodiment, an ultrasonic vibrator 11 is disposed at the bottom of the water tank 1 , an aeration pipe 12 is disposed in the water tank 1 , and aeration holes are disposed on the aeration pipe 12 .

[0036] In one embodiment, a heater 13, a liquid level meter 14 and a temperature sensor 15 are provided in the water tank 1. The heater 13 is used to heat the water in the water tank 1. The liquid level meter 14 can monitor the water level in the water tank 1 in real time. The temperature sensor 15 can monitor the water temperature in the water tank 1 in real time.

[0037] In one embodiment, a water inlet 16 and an overflow port 17 are provided at the upper end of the inner wall of the water tank 1 , wherein clean water can be poured into the water tank 1 through the water inlet 16 , and the overflow port 17 can prevent the water level in the water tank 1 from being too high.

[0038] In one embodiment, a plurality of rubber rollers 18 are installed on the substrate carrier 4, and the plurality of rubber rollers 18 are distributed in a circle, and the upper end surfaces of the plurality of rubber rollers 18 are all supporting inclined surfaces, wherein the rubber rollers are made of polyurethane, silicone or other high temperature resistant materials, and have a smooth and soft surface, which will not cause damage to the semiconductor workpiece.

[0039] In one embodiment, in order to achieve mutual cooperation between the processing substrate 6 and the substrate carrier 4, the substrate carrier 4 includes a bottom plate 19, a supporting rubber roller 18 is provided on the bottom plate 19, a guide rod 20 is provided on the supporting rubber roller 18, and a guide sleeve 21 is provided in the middle of the processing substrate 6 and the guide sleeve 21 is sleeved on the guide rod 20.

[0040] In one embodiment, the robot 8 is a six-axis robot.

[0041] In one embodiment, the mechanical claw 9 includes a wide finger cylinder 901 , and output ends on both sides of the wide finger cylinder 901 are respectively provided with clamping plates 902 , and a clamping port for clamping the upper end of the substrate carrier 4 is formed between the two clamping plates 902 .

[0042] A semiconductor material dewaxing process, specifically comprising the following steps:

[0043] Step 1: The operator turns over the processed substrate 6 with the workpiece 5 facing downward and places it on the substrate carrier 4 on the loading platform 2;

[0044] Step 2: The robot 8 first sprays hot water through the hot water spray head 10 to remove the residual cutting liquid on the processing substrate 6 during processing;

[0045] Step 3: Pour clean water into the water tank 1 through the water inlet 16 in advance, and start the heater 13 to heat the inside of the water tank 1, then control the mechanical claw 9 on the robot 8 to grab the guide rod 20 on the substrate carrier 4, and place the substrate carrier 4 into the water tank 1. Cleaning powder can be added to the water tank 1;

[0046] Step 4: Soak in hot water for a period of time. After the wax melts, use the gravity of the workpiece 5 to separate the workpiece 5 from the processing substrate 6. During this period, the substrate carrier 4 is shaken up and down several times by the robot 8, and gas is introduced into the aeration pipe 12 to make the water tank 1 bubble. The ultrasonic vibrator 11 is used in the water tank 1;

[0047] Step 5: After the shedding is completed, the mechanical claw 9 on the robot 8 takes out the substrate carrier 4 and places it on the unloading table 3. The hot water spray head 10 on the robot 8 sprays with hot water to remove the foam and residual wax;

[0048] Step 6: Control the mechanical claw 9 on the robot 8 to clamp the processed substrate 6 and remove the processed substrate for continued use in the production line;

[0049] Step 7: Finally, the processed semiconductor workpiece 5 is taken out manually or by a robot 8, and the substrate carrier 4 placed on the unloading table 3 is sent to the loading table for further use through an assembly line or an AGV vehicle.

[0050] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A semiconductor material dewaxing device, comprising a water tank (1), characterized in that: A loading platform (2) and a unloading platform (3) are respectively provided on both sides of the water tank (1); a substrate carrier (4) is provided on the loading platform (2); a workpiece (5) is sleeved on the substrate carrier (4); a processing substrate (6) is provided on the upper end of the workpiece (5); and the processing substrate (6) is sleeved and matched with the substrate carrier (4); a manipulator base (7) is provided at the rear end of the water tank (1); a manipulator (8) is provided on the manipulator base (7); a manipulator (8) is provided on the manipulator (8); a mechanical claw (9) is provided on the mechanical claw (9); and a hot water spray head (10) is provided on the mechanical claw (9); A plurality of rubber rollers (18) are mounted on the substrate carrier (4), the plurality of rubber rollers (18) are distributed in a circumferential manner, and the upper end surfaces of the plurality of rubber rollers (18) are all supporting inclined surfaces. The substrate carrier (4) comprises a bottom plate (19), the bottom plate (19) is provided with supporting rubber rollers (18), the supporting rubber rollers (18) are provided with guide rods (20), and a guide sleeve (21) is provided in the middle of the processing substrate (6), and the guide sleeve (21) is sleeved on the guide rod (20).

2. A semiconductor material dewaxing device according to claim 1, characterized in that: An ultrasonic vibrator (11) is provided at the bottom of the water tank (1), an aeration pipe (12) is provided in the water tank (1), and aeration holes are provided on the aeration pipe (12).

3. A semiconductor material dewaxing device according to claim 2, characterized in that: The water tank (1) is provided with a heater (13), a liquid level meter (14) and a temperature sensor (15); the heater (13) is used to heat the water in the water tank (1); the liquid level meter (14) can monitor the water level in the water tank (1) in real time; and the temperature sensor (15) can monitor the water temperature in the water tank (1) in real time.

4. A semiconductor material dewaxing device according to claim 3, characterized in that: The upper end of the inner wall of the water tank (1) is provided with a water inlet (16) and an overflow outlet (17).

5. A semiconductor material dewaxing device according to claim 1, characterized in that: The manipulator (8) is a six-axis manipulator.

6. A semiconductor material dewaxing device according to claim 1, characterized in that: The mechanical claw (9) comprises a wide finger cylinder (901), and output ends on both sides of the wide finger cylinder (901) are respectively provided with clamping plates (902), and a clamping opening for clamping the upper end of the substrate carrier (4) is formed between the two clamping plates (902).

7. A process for a semiconductor material dewaxing device according to any one of claims 1 to 6, characterized in that: The specific steps include: Step 1: An operator turns over the processed substrate (6) with the workpiece (5) facing downward and places it on the substrate carrier (4) on the loading platform (2); Step 2: The robot (8) first sprays hot water through a hot water spray head (10) to remove the residual cutting liquid on the processing substrate (6); Step 3: Fill the water tank (1) with clean water through the water inlet (16) in advance, start the heater (13) to heat the inside of the water tank (1), and then control the mechanical claw (9) on the robot (8) to grasp the guide rod (20) on the substrate carrier (4), and place the substrate carrier (4) into the water tank (1). Cleaning powder can be added to the water tank (1); Step 4: Soak in hot water for a period of time, and after the wax melts, use the gravity of the workpiece (5) to separate the workpiece (5) and the processing substrate (6). During this period, the substrate carrier (4) is shaken up and down several times by a robot (8), and gas is introduced into the aeration pipe (12) to make the water tank (1) bubble, and an ultrasonic vibrator (11) is used in the water tank (1); Step 5: After the shedding is completed, the mechanical claw (9) on the robot (8) takes out the substrate carrier (4) and places it on the unloading table (3), and the hot water spray head (10) on the robot (8) sprays with hot water to remove foam and residual wax; Step 6: Control the mechanical claw (9) on the robot (8) to clamp the processed substrate (6), remove the processed substrate, and allow the production line to continue using it; Step 7: Finally, the processed semiconductor workpiece (5) is taken out manually or by a robot (8), and the substrate carrier (4) placed on the unloading platform (3) is sent to the loading platform through an assembly line or an AGV vehicle for continued use.

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