A heat exchange system and heat exchange method for semiconductor production

Abstract

The present invention relates to the technical field of semiconductor production, and in particular to a heat exchange system for semiconductor production, which includes a coolant system that provides circulating liquid for the heat exchange system, a deionized circuit system that provides deionized circulating liquid for the heat exchange system, a plant service water system, and a liquid storage system that serves as a system liquid storage device. The inlet and outlet ends of the coolant system are connected to the liquid storage system to form a circulating loop for the circulating liquid; a heat exchange method for a heat exchange system for semiconductor production includes the following processes: A separate circulating loop for the circulating liquid in the water tank is realized by a vertical multi-stage centrifugal pump, and the circulating liquid sequentially enters the load device, the integrated liquid return device, and the plate heat exchanger device and then enters the water tank. The present invention solves the problems of too short heat exchange time, large system size, and relatively low integration degree of the heat exchange system, thereby improving the sufficiency of heat exchange and the utilization rate of the plant service water system.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to a heat exchange system and a heat exchange method for semiconductor production. Background Art

[0002] In the production process of semiconductor wafers, extremely high requirements are placed on temperature. To meet the production requirements, a heat exchanger for temperature control is equipped. A heat exchanger is a water cooling device that can provide chilled water with constant temperature, constant flow, and constant pressure. Its working principle is to inject a certain volume of circulating liquid into the box inside the device, and use the plant water output by the cooling tower device inside the factory to control the temperature of the circulating liquid. After the chilled liquid takes away the heat generated in the production process and its temperature rises, it exchanges heat with the plant water, and the circulating liquid with reduced temperature then flows back to the water tank to achieve the cooling effect.

[0003] In the current technology, the circulating liquid system uses a water pump to transport the circulating liquid in the water tank to the inside of the heat exchanger for heat exchange with the plant water, and then outputs it to the load component. The circulating liquid takes away the temperature generated in the process and returns to the water tank. The heat exchange time of the entire system is short, the heat exchange is insufficient, and the utilization rate of the plant water system is greatly reduced. At the same time, there are many return liquid pipelines in the entire system, the assembly is cumbersome, and there are many failure points such as liquid leakage, which is not conducive to the safe operation of the equipment and the entire system. Summary of the Invention

[0004] (I) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the prior art, the present invention provides a heat exchange system and a heat exchange method for semiconductor production, which solve the problems in the current technology, especially the too short heat exchange time, the huge system, and the relatively low integration degree of the large-flow heat exchange system.

[0006] (II) Technical Solutions

[0007] To solve the above technical problems, the present invention provides the following technical solutions: A heat exchange system for semiconductor production includes a chilled liquid system that provides circulating liquid for the heat exchange system, a deionized circuit system that provides deionized circulating liquid for the heat exchange system, a plant water system, and a liquid storage system that serves as a system liquid storage device. The inlet and outlet ends of the chilled liquid system are connected to the liquid storage system to form a circulating loop of the circulating liquid. The deionized circuit system is connected between the chilled liquid system and the liquid storage system, and the plant water system is connected to the chilled liquid system;

[0008] The chilled liquid system includes a vertical multistage centrifugal pump, a pressure sensor, a first temperature sensor, a load device, a return liquid circuit, an integrated return liquid device, and a plate heat exchanger that are sequentially connected in order from the liquid outlet end of the liquid storage system and connected to its liquid inlet end;

[0009] The liquid return circuit is set to four paths. The liquid return circuit is arranged between the load device and the integrated liquid return device. The liquid return circuit includes a filter, a stop valve, and a flowmeter that are sequentially connected by pipes from right to left.

[0010] Further, the integrated liquid return device includes four welding joints provided on its liquid inlet side, and also includes a connection joint provided on the liquid outlet side of the integrated liquid return device.

[0011] Further, the integrated liquid return device is communicated with the four liquid return circuits respectively through the four welding joints in cooperation with pipes, and the integrated liquid return device is communicated with the plate heat exchanger through the connection joint in cooperation with pipes.

[0012] Further, the liquid inlet end of the plate heat exchanger is provided with a welding interface for connecting with the pipe at the liquid outlet end of the integrated liquid return device.

[0013] Further, the deionized water circuit system includes a first electromagnetic proportional valve and a deionized water device. The first electromagnetic proportional valve is connected to the liquid inlet end of the load device through a pipe, the first electromagnetic proportional valve is connected to the deionized water device through a pipe, and the liquid outlet end of the deionized water device is connected to the liquid storage system to form a circulation circuit of the deionized circulating liquid.

[0014] Further, the liquid storage system includes a water tank as a carrier, and a second temperature sensor and a resistance measuring device are arranged in the water tank.

[0015] Further, the factory service water system includes a second electromagnetic proportional valve, and the second electromagnetic proportional valve is installed between the liquid inlet pipe of the factory service water system and the liquid inlet of the plate heat exchanger.

[0016] The present invention also provides another technical solution, a heat exchange method for a heat exchange system for semiconductor production, including the following processes:

[0017] An independent circulation circuit of the circulating liquid in the water tank is realized through a vertical multi-stage centrifugal pump. The circulating liquid sequentially enters the load device, the integrated liquid return device, and the plate heat exchanger and then enters the water tank;

[0018] The temperature of the circulating liquid rises after passing through the load device. After the four liquid return circuits pass through the integrated liquid return device and the plate heat exchanger, the circulating liquid with temperature exchange returns to the water tank;

[0019] The first temperature sensor detects the temperature value of the circulating liquid, and compares this value with the system set temperature through a microcomputer processing system. The microcomputer processing system adjusts the opening degree of the second electromagnetic proportional valve according to the comparison result;

[0020] The resistance measuring device in the liquid storage system feeds back a value, and compares this value with the system preset value through a microcomputer processing system. The microcomputer processing system adjusts the opening degree of the first electromagnetic proportional valve according to the comparison result.

[0021] (III) Beneficial Effects

[0022] The present invention provides a heat exchange system and a heat exchange method for semiconductor production, having the following beneficial effects:

[0023] 1. In the present invention, by adopting a coolant system as the circulation loop of the circulating liquid and cooperating with the deionized water loop system, the facility water system, and the liquid storage system, the circulating liquid entering the system passes through the plate heat exchanger. The liquid storage system provides a larger space and time for heat exchange, and at the same time solves the problems of too short heat exchange time, large system size, and low integration degree of the heat exchange system, thereby improving the sufficiency of heat exchange and the utilization rate of the facility water system.

[0024] 2. In the present invention, the heat generated by the load device is carried away by the circulating liquid in the coolant system. After passing through the plate heat exchanger, the temperature is reduced to meet the process requirements and finally returns to the liquid storage system. The liquid storage system, as an energy storage device, provides a larger space and time for heat exchange and greatly utilizes the energy of the facility water.

[0025] 3. In the present invention, after the circulating liquid passes through the load device, the temperature rises. After passing through the integrated liquid return device and the plate heat exchanger, the circulating liquid after temperature exchange returns to the water tank. After the circulating liquid in the liquid storage system passes through the plate heat exchanger, it undergoes sufficient temperature exchange in the liquid storage system and finally reaches the set temperature, meeting the usage requirements, providing a sufficient heat exchange process, maximizing the utilization of the cold energy of the facility water, and reducing energy loss.

[0026] 4. In the present invention, by welding four-way welding joints at the liquid inlet of the integrated liquid return device, the flowmeter is connected to the welding joints by threading, and the liquid outlet of the integrated liquid return device is welded to the liquid inlet of the plate heat exchanger through a pipeline, integrating the multi-way liquid return, reducing the pipeline connection of the system, not only reducing the workload of assembling the stainless steel bellows, but also saving a large amount of installation space and reducing the energy loss of pipeline connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0028] Figure 1 is the schematic diagram of the heat exchange system of the present invention;

[0029] Figure 2 is the structural schematic diagram of the liquid inlet end of the integrated liquid return device of the present invention;

[0030] Figure 3 This is a schematic diagram of the connection between the integrated liquid return device and the plate heat exchanger device of the present invention.

[0031] In the figure: 200, the coolant system; 110, the vertical multi-stage centrifugal pump; 120, the pressure sensor; 130, the first temperature sensor; 210, the load device; 220, the liquid return circuit; 221, the filter; 222, the stop valve; 223, the flow meter; 230, the integrated liquid return device; 231, the welded joint; 232, the connecting joint; 240, the plate heat exchanger device; 241, the welded interface; 300, the deionized water circuit system; 310, the first electromagnetic proportional valve; 320, the deionization device; 400, the plant service water system; 410, the second electromagnetic proportional valve; 500, the liquid storage system; 510, the second temperature sensor; 520, the resistance measuring device. Specific embodiments

[0032] The following will detail the implementation manners of the present application in conjunction with the accompanying drawings and embodiments, so as to fully understand how the present application uses technical means to solve technical problems and achieve the realization process of technical effects and implement accordingly.

[0033] Figures 1-3 This is an embodiment of the present invention: A heat exchange system and a heat exchange method for semiconductor production, including a coolant system 200 that provides circulating liquid for the heat exchange system, a deionized water circuit system 300 that provides deionized circulating liquid for the heat exchange system, a plant service water system 400, and a liquid storage system 500 as the system liquid storage device. The inlet and outlet ends of the coolant system 200 are connected to the liquid storage system 500 to form a circulating loop of the circulating liquid. The deionized water circuit system 300 is connected between the coolant system 200 and the liquid storage system 500. The plant service water system 400 is connected to the coolant system 200. By using the coolant system 200 as the circulating loop of the circulating liquid and cooperating with the deionized water circuit system 300, the plant service water system 400, and the liquid storage system 500, the circulating liquid entering the system passes through the plate heat exchanger device. The liquid storage system provides a larger space and time for heat exchange, and at the same time solves the problems of too short heat exchange time, large system size, and low integration degree of the heat exchange system, thereby improving the sufficiency of heat exchange and the utilization rate of the plant service water system;

[0034] The coolant system 200 includes a vertical multistage centrifugal pump 110, a pressure sensor 120, a first temperature sensor 130, a load device 210, a return liquid circuit 220, an integrated return liquid device 230, and a plate heat exchanger 240 that are sequentially connected in order from the liquid outlet end of the liquid storage system 500 and connected to its liquid inlet end. The heat generated by the load device 210 is taken away by the circulating liquid in the coolant system 200. After passing through the plate heat exchanger 240, the temperature is reduced to meet the process requirements and finally returns to the liquid storage system. The liquid storage system, as an energy storage device, provides a larger space and time for heat exchange, making great use of the energy of the plant service water;

[0035] The return liquid circuit 220 is set to four paths. The return liquid circuit 220 is arranged between the load device 210 and the integrated return liquid device 230. The return liquid circuit 220 includes a filter 221, a globe valve 222, and a flowmeter 223 that are sequentially connected by pipes from right to left. After the circulating liquid passes through the load device 210, the temperature rises. The four return liquid circuits 220 pass through the integrated return liquid device 230, pass through the plate heat exchanger 240, and the circulating liquid that has undergone temperature exchange returns to the liquid storage system 500. After the circulating liquid of the liquid storage system 500 passes through the heat exchanger 240, sufficient temperature exchange is carried out in the liquid storage system 500, and finally it is consistent with the set temperature, meeting the usage requirements, providing a sufficient heat exchange process, maximizing the use of the cold energy of the plant service water, and reducing energy loss.

[0036] After the circulating liquid passes through the load device, the temperature rises. After the four return liquid circuits pass through the integrated return liquid device and the plate heat exchanger, the circulating liquid that has undergone temperature exchange returns to the water tank. After the circulating liquid of the liquid storage system passes through the plate heat exchanger, sufficient temperature exchange is carried out in the liquid storage system and finally it is consistent with the set temperature, meeting the usage requirements, providing a sufficient heat exchange process, maximizing the use of the cold energy of the plant service water, and reducing energy loss.

[0037] The deionized circuit system 300 includes a first electromagnetic proportional valve 310 and a deionization device 320. The first electromagnetic proportional valve 310 is connected to the liquid inlet end of the load device 210 through a pipe. The first electromagnetic proportional valve 310 is connected to the deionization device 320 through a pipe. The liquid outlet end of the deionization device 320 is connected to the liquid storage system 500 to form a circulating circuit for the deionized circulating liquid.

[0038] The liquid storage system 500 includes a water tank as a carrier, and a second temperature sensor 510 and a resistance measuring device 520 are arranged in the water tank.

[0039] The facility water system 400 includes a second electromagnetic proportional valve 410. The second electromagnetic proportional valve 410 is installed between the liquid inlet pipeline of the facility water system 400 and the liquid inlet of the plate heat exchanger 240. The facility water system 400 provides cooling water for system temperature control. The microcomputer system controls the opening degree of the second electromagnetic proportional valve 410 to control the facility water flow rate, thereby achieving the control of the refrigerating capacity of the system.

[0040] The integrated liquid return device 230 includes four welding joints 231 provided on its liquid inlet side, and also includes a connection joint 232 provided on the liquid outlet side of the integrated liquid return device 230. The integrated liquid return device 230 is respectively communicated with four liquid return circuits 220 through the four welding joints 231 in cooperation with pipelines. The integrated liquid return device 230 is communicated with the plate heat exchanger 240 through the connection joint 232 in cooperation with a pipeline. A welding interface 241 for connecting with the pipeline at the liquid outlet end of the integrated liquid return device 230 is provided at the liquid inlet end of the plate heat exchanger 240. The liquid inlet of the integrated liquid return device 230 is welded with four welding joints 231. The flowmeter 223 is connected to the welding joint 232 by thread. The liquid outlet of the integrated liquid return device 230 is welded to the liquid inlet of the plate heat exchanger 240 through a pipeline, that is, the welding interface 241, which reduces the workload of assembling the stainless steel bellows, saves a large amount of installation space at the same time, and reduces the energy loss of pipeline connection.

[0041] The present invention also provides another embodiment, a heat exchange method for a heat exchange system used in semiconductor production, including the following processes:

[0042] An independent circulation loop of the circulating liquid in the water tank is realized by a vertical multi-stage centrifugal pump. The circulating liquid sequentially enters the load device, the integrated liquid return device and the plate heat exchanger and then enters the water tank;

[0043] The temperature of the circulating liquid rises after passing through the load device. After the four liquid return circuits pass through the integrated liquid return device and the plate heat exchanger, the circulating liquid after temperature exchange returns to the water tank. The circulating liquid of the liquid storage system, after passing through the heat exchange device, undergoes sufficient temperature exchange in the liquid storage system and finally reaches the set temperature, meeting the usage requirements, providing a sufficient heat exchange process, maximizing the utilization of the cold quantity of the facility water, and reducing the energy loss;

[0044] The first temperature sensor detects the temperature value of the circulating liquid, and compares this value with the system set temperature through the microcomputer processing system. The microcomputer processing system adjusts the opening degree of the second electromagnetic proportional valve according to the comparison result;

[0045] If the temperature value is higher than the set value, the microcomputer processing system will issue an instruction to adjust and increase the opening degree of the second electromagnetic proportional valve in the facility water system, thereby increasing the flow rate of the facility water, increasing the refrigerating capacity of the system, and adjusting the outlet liquid temperature to meet the system set temperature;

[0046] If the detected temperature value is lower than the set temperature, the microcomputer processing system will issue an instruction to adjust and reduce the opening degree of the second electromagnetic proportional valve in the plant service water system, thereby reducing the flow rate of the plant service water, reducing the refrigeration capacity of the system, and lowering the liquid outlet temperature to meet the set value.

[0047] The resistance measuring device in the liquid storage system feeds back a value, and this value is compared with the preset value of the system through the microcomputer processing system. The microcomputer processing system adjusts the opening degree of the first electromagnetic proportional valve according to the comparison result;

[0048] If the feedback value is less than the system set value, the microcomputer processing system issues an instruction to adjust the first electromagnetic proportional valve to open, thereby starting the deionized circuit system to work;

[0049] If the feedback value meets the system set requirements, the microcomputer processing system issues an instruction to close the first electromagnetic proportional valve, thereby adjusting the working speed of the deionized circuit system.

[0050] By adopting a refrigerant liquid system as the circulation loop of the circulating liquid and cooperating with the mutual cooperation of the deionized circuit system, the plant service water system, and the liquid storage system, the circulating liquid entering the system passes through the plate heat exchanger. The liquid storage system provides a larger space and time for heat exchange, and at the same time solves the problems of too short heat exchange time, large system size, and low integration degree of the heat exchange system, thereby improving the sufficiency of heat exchange and the utilization rate of the plant service water system.

[0051] The heat generated by the load device is taken away by the circulating liquid in the refrigerant liquid system. After passing through the plate heat exchanger, it is reduced to the temperature that meets the process requirements and finally returns to the liquid storage system. The liquid storage system, as an energy storage device, provides a larger space and time for heat exchange and greatly utilizes the energy of the plant service water.

[0052] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "including", "comprising" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0053] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat exchange system for semiconductor production, comprising a coolant system (200) that provides circulating liquid for the heat exchange system, a deionized water circuit system (300) that provides deionized circulating liquid for the heat exchange system, a facility water system (400), and a liquid storage system (500) serving as a system liquid storage device, characterized in that: The inlet and outlet ends of the coolant system (200) are connected to the liquid storage system (500) to form a circulation loop for the circulating liquid. The deionized water circuit system (300) is connected between the coolant system (200) and the liquid storage system (500), and the plant service water system (400) is connected to the coolant system (200). The coolant system (200) includes a vertical multi-stage centrifugal pump (110), a pressure sensor (120), a first temperature sensor (130), a load device (210), a return liquid circuit (220), an integrated return liquid device (230), and a plate heat exchanger device (240) that are sequentially connected in order from the outlet end of the liquid storage system (500) and connected to its inlet end. The return liquid circuit (220) is set to four paths. The return liquid circuit (220) is arranged between the load device (210) and the integrated return liquid device (230). The return liquid circuit (220) includes a filter (221), a globe valve (222), and a flow meter (223) that are connected in sequence through pipes from right to left. The integrated return liquid device (230) includes four welded joints (231) provided on its inlet side, and also includes a connection joint (232) provided on the outlet side of the integrated return liquid device (230). The integrated return liquid device (230) is communicated with the four return liquid circuits (220) respectively through the four welded joints (231) and pipes. The integrated return liquid device (230) is communicated with the plate heat exchanger device (240) through the connection joint (232) and pipes. The inlet end of the plate heat exchanger device (240) is provided with a welded interface (241) for connecting with the pipe at the outlet end of the integrated return liquid device (230).

2. The heat exchange system for semiconductor production according to claim 1, wherein: The deionized water circuit system (300) includes a first electromagnetic proportional valve (310) and a deionization device (320). The first electromagnetic proportional valve (310) is connected to the inlet end of the load device (210) through a pipe. The first electromagnetic proportional valve (310) is connected to the deionization device (320) through a pipe. The outlet end of the deionization device (320) is connected to the liquid storage system (500) to form a circulation loop for the deionized circulating liquid.

3. The heat exchange system for semiconductor production according to claim 2, characterized in that: The liquid storage system (500) includes a water tank as a carrier, and a second temperature sensor (510) and a resistance measuring device (520) are arranged in the water tank.

4. The heat exchange system for semiconductor production according to claim 3, wherein: The plant service water system (400) includes a second electromagnetic proportional valve (410). The second electromagnetic proportional valve (410) is installed between the inlet pipe of the plant service water system (400) and the inlet of the plate heat exchanger device (240).

5. The heat exchange method of a heat exchange system for semiconductor production according to claim 4, characterized in that, It includes the following processes: The circulating liquid in the water tank is circulated through an independent loop by the vertical multi-stage centrifugal pump. The circulating liquid enters the load device, the integrated return liquid device, and the plate heat exchanger device in sequence and then enters the water tank. The temperature of the circulating liquid rises after passing through the load device. After the four return liquid circuits pass through the integrated return liquid device and the plate heat exchanger device, the circulating liquid with temperature exchange returns to the water tank. The first temperature sensor detects the temperature value of the circulating liquid, and compares the temperature value with the system set temperature through the microcomputer processing system. The microcomputer processing system adjusts the opening degree of the second electromagnetic proportional valve according to the comparison result. The resistance value measuring device in the liquid storage system feeds back the resistance value, and the microcomputer processing system compares the resistance value with the preset value of the system. The microcomputer processing system adjusts the opening degree of the first electromagnetic proportional valve according to the comparison result.

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