processing device

Abstract

The present application provides a processing device that can easily produce a map of a wafer. The control unit of the processing device includes: an X-axis direction positioning section that detects a straight line region corresponding to a first division predetermined line from a cross region of the first division predetermined line and a second division predetermined line, obtains an angle with the X-axis direction, and positions the straight line region corresponding to the first division predetermined line in the X-axis direction; a first division predetermined line interval setting section that detects a straight line region corresponding to a next first division predetermined line and sets an interval of the first division predetermined line; a second division predetermined line interval setting section that detects two straight line regions corresponding to the second division predetermined line that are adjacent to each other and sets an interval of the second division predetermined line; and a device image producing section that produces and stores one device image surrounded by a pair of the first division predetermined lines and a pair of the second division predetermined lines.

Description

Technical Field

[0001] This invention relates to a processing apparatus capable of fabricating patterns on wafers. Background Technology

[0002] A wafer with multiple devices such as ICs and LSIs formed on its front side by multiple intersecting pre-defined dividing lines is divided into individual device chips by a cutting device and a laser processing device. The resulting device chips are used in electronic devices such as mobile phones and personal computers.

[0003] The cutting apparatus includes: a rotatable chuck stage for holding a wafer; a cutting unit with a cutting tool for cutting the wafer held by the chuck stage; an X-axis feed mechanism for feeding the chuck stage and the cutting unit relative to each other in the X-axis direction; a Y-axis feed mechanism for indexing the chuck stage and the cutting unit relative to each other in the Y-axis direction; an operation unit for operating the X-axis feed mechanism and the Y-axis feed mechanism; an imaging unit for imaging the wafer held by the chuck stage to detect the area to be cut; a display unit for displaying the area captured by the imaging unit; and a control unit.

[0004] In the cutting apparatus, the pre-defined dividing line to be cut can be detected by the imaging unit, and the cutting tool can be positioned at the pre-defined dividing line to cut the wafer, thereby cutting the wafer into individual device chips with high precision (see, for example, Patent Document 1).

[0005] In addition, the laser processing apparatus can also detect the predetermined dividing line to be laser processed by the imaging unit, position the laser beam concentrator at the predetermined dividing line and irradiate the wafer with laser beam, and divide the wafer into individual device chips with high precision (see, for example, Patent Document 2).

[0006] Patent Document 1: Japanese Patent Application Publication No. 5-315444

[0007] Patent Document 2: Japanese Patent Application Publication No. 2004-322168

[0008] After the wafer has been processed by a cutting or laser processing device, the following process is performed: the processing grooves formed on the wafer by cutting or laser processing are photographed by an imaging unit to confirm the processing status. At this time, in order to selectively photograph areas on the predetermined dicing line where there are no TEGs (Test Element Groups) formed by metal films and areas on the predetermined dicing line where there are TEGs, wafer image information is required.

[0009] When creating a chip pattern, the operator manually links multiple images captured by the imaging unit to create the chip pattern information and store it in the storage unit. However, this process is time-consuming and tedious. Summary of the Invention

[0010] Therefore, the object of the present invention is to provide a processing apparatus capable of fabricating patterns on wafers.

[0011] According to the present invention, a processing apparatus is provided for fabricating a wafer pattern, the wafer being divided into multiple devices by a plurality of first predetermined dividing lines extending along a first direction and a plurality of second predetermined dividing lines extending along a second direction perpendicular to the first direction, and test element groups being formed on the first and second predetermined dividing lines, wherein the processing apparatus comprises: a rotatable chuck stage for holding the wafer; a processing unit for processing the wafer held by the chuck stage; and an X-axis feed mechanism for feeding the chuck stage and the processing unit along the X-axis. The system includes: an upward relative feed mechanism; a Y-axis feed mechanism for indexing the chuck table and the processing unit relative to each other in the Y-axis direction; an operation unit for operating the X-axis feed mechanism and the Y-axis feed mechanism; an imaging unit for imaging the wafer held by the chuck table to detect the area to be processed; a display unit for displaying the area captured by the imaging unit; and a control unit comprising: an X-axis direction positioning unit that, based on the first pre-division image obtained by the imaging unit from the wafer held by the chuck table... The system includes a first segmentation pre-line and a second segmentation pre-line intersection area detection unit. The first segmentation pre-line intersection area is then detected, and the angle with the X-axis direction is calculated. The chuck stage is rotated to position the straight area corresponding to the first segmentation pre-line in the X-axis direction. A first segmentation pre-line interval setting unit activates the Y-axis feed mechanism to detect the straight area corresponding to the next first segmentation pre-line and sets the interval of the first segmentation pre-line. A second segmentation pre-line interval setting unit activates the X-axis feed mechanism to detect two adjacent straight areas corresponding to the second segmentation pre-line and sets the interval of the second segmentation pre-line. A device image creation unit creates and stores a device image surrounded by a pair of adjacent first and second segmentation pre-lines. A crosshair image extraction unit acquires multiple device images while moving the area captured by the imaging unit in the X-axis and Y-axis directions. The acquired multiple device images are linked by phase correlation to extract and store a crosshair image containing multiple devices and test element groups. A pattern creation unit connects multiple crosshair images by phase correlation to create a pattern of the wafer.

[0012] Preferably, the image-making unit moves the area captured by the imaging unit in the X-axis and Y-axis directions while acquiring multiple crosshair images, and connects the acquired multiple crosshair images by phase correlation to create a chip image.

[0013] According to the present invention, the pattern of the wafer can be easily fabricated. Attached Figure Description

[0014] Figure 1 This is a perspective view of the processing apparatus according to an embodiment of the present invention.

[0015] Figure 2 It shows through Figure 1 The image shown is a 3D view of the imaging unit capturing images of the chip.

[0016] Figure 3 It is shown Figure 1 The diagram shows the structure of the control unit.

[0017] Figure 4 (a) is a schematic diagram showing an image obtained by taking a picture of the intersection area of ​​the first and second pre-defined dividing lines when the first pre-defined dividing line of the wafer forms an angle θ with the X-axis direction. Figure 4 (b) shows from Figure 4 The image shown in (a) is a schematic diagram of the state in which the chuck table has been rotated by an angle θ.

[0018] Figure 5 This is a schematic diagram showing the state of setting the interval of the first predetermined dividing line.

[0019] Figure 6 This is a schematic diagram showing the state of setting the interval of the second predetermined dividing line.

[0020] Figure 7 This is a schematic diagram of the device image.

[0021] Figure 8 It is a schematic diagram of an image obtained by linking multiple device images.

[0022] Figure 9 This is a schematic diagram of a crosshair image.

[0023] Figure 10 This is a schematic diagram of a chip.

[0024] Label Explanation

[0025] 2: Processing device; 10: Imaging unit; 12: Display unit; 14: Control unit; 22: X-axis positioning unit; 24: First segmentation predetermined line interval setting unit; 26: Second segmentation predetermined line interval setting unit; 28: Device image production unit; 30: Crosshair image extraction unit; 32: Image production unit; 34: TEG; 52: Crosshair image; 54: Image; W: Wafer; L1: First segmentation predetermined line; L2: Second segmentation predetermined line; D: Device. Detailed Implementation

[0026] Hereinafter, the processing apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0027] exist Figure 1 The processing apparatus, generally indicated by reference numeral 2, includes: a rotatable chuck stage 4 that holds a wafer W; a processing unit 6 that processes the wafer W held by the chuck stage 4; an X-axis feed mechanism (not shown) that feeds the chuck stage 4 and the processing unit 6 relative to each other in the X-axis direction; a Y-axis feed mechanism (not shown) that indexes the chuck stage 4 and the processing unit 6 relative to each other in the Y-axis direction; an operation unit 8 that operates the X-axis feed mechanism and the Y-axis feed mechanism; an imaging unit 10 that captures images of the wafer W held by the chuck stage 4 to detect the area to be processed; a display unit 12 that displays the area captured by the imaging unit 10; and a control unit 14 that controls the operation of the processing apparatus 2.

[0028] In addition, the X-axis direction is Figure 1 The direction indicated by the middle arrow X is the Y-axis direction. Figure 1 The direction indicated by the middle arrow Y is perpendicular to the X-axis. Furthermore, the XY plane defined by the X-axis and Y-axis is essentially horizontal.

[0029] The wafer W processed by processing apparatus 2 is in the shape of a disc and can be formed from a suitable semiconductor material such as silicon. Figure 2 As shown, multiple predetermined dividing lines, serving as straight-line regions, are provided on the front surface Wa of the wafer W. These predetermined dividing lines are arranged in a grid pattern. The grid-like predetermined dividing lines include: multiple first predetermined dividing lines L1 extending along a first direction; and second predetermined dividing lines L2 extending along a second direction perpendicular to the first direction. Furthermore, the front surface Wa of the wafer W is divided into multiple rectangular regions by the first and second predetermined dividing lines L1 and L2, and devices D such as ICs and LSIs are formed in these rectangular regions. Additionally, by referring to... Figure 8 It is understood that multiple TEG 34 are respectively arranged in a prescribed periodic pattern on the first predetermined dividing line L1 (L1a, L1b, L1c) and the second predetermined dividing line L2 (L2a, L2b, L2c).

[0030] In addition, such as Figure 2 As shown, the back surface Wb of the wafer W is attached to the scribe line T, and the periphery of the scribe line T is fixed to the annular frame F. That is, the wafer W is supported by the annular frame F by means of the scribe line T.

[0031] like Figure 1 As shown, a porous, circular suction chuck 16 connected to a suction member (not shown) is disposed at the upper end of the chuck stage 4. The suction member generates an attractive force on the suction chuck 16 to attract and hold the wafer W placed on its upper surface. Furthermore, multiple clamps 18 for fixing the annular frame F are arranged at circumferential intervals around the periphery of the chuck stage 4. This chuck stage 4 is fed in the X-axis direction by the aforementioned X-axis feed mechanism and rotates around the vertical axis by a motor (not shown) powered by the chuck stage.

[0032] The processing apparatus 2 in this embodiment is a cutting apparatus, which is an example of the processing apparatus of the present invention. The processing unit 6 is configured as a cutting unit for performing cutting processing on the wafer W. The processing unit (cutting unit) 6 includes an annular cutting tool 20 for cutting the wafer W held by the chuck stage 4. The cutting tool 20 is arranged along the X-axis direction and is configured to be able to rotate about the Y-axis direction.

[0033] The X-axis feed mechanism includes: a ball screw connected to the chuck table 4 and extending along the X-axis direction; and an electric motor that rotates the ball screw. In the X-axis feed mechanism, the rotational motion of the electric motor is converted into linear motion by the ball screw and transmitted to the chuck table 4, thereby feeding the chuck table 4 relative to the machining unit 6 in the X-axis direction.

[0034] The Y-axis feed mechanism includes: a ball screw connected to the machining unit 6 and extending along the Y-axis; and an electric motor that rotates the ball screw. Furthermore, the Y-axis feed mechanism converts the rotational motion of the electric motor into linear motion via the ball screw and transmits it to the machining unit 6, enabling the machining unit 6 to perform indexing feed relative to the chuck table 4 in the Y-axis direction.

[0035] The operation unit 8 has an input device (e.g., a keyboard, a touch panel) for inputting the operating conditions of the X-axis feed mechanism, Y-axis feed mechanism, etc. The operating conditions input from the operation unit 8 are sent to the control unit 14, which controls the operation of the X-axis feed mechanism, Y-axis feed mechanism, etc.

[0036] The imaging unit 10 is positioned above the track of the chuck table 4. The imaging unit 10 is connected to the processing unit 6, and together with the processing unit 6, performs indexing feed relative to the chuck table 4 in the Y-axis direction via a Y-axis feed mechanism. Furthermore, the imaging unit 10 can change the magnification used to image the wafer W held on the chuck table 4.

[0037] On the display unit 12, in addition to the image captured by the imaging unit 10, such as Figure 4 As shown, the X-axis Lx in the X-axis direction and the Y-axis Ly in the Y-axis direction are also displayed. The X-axis Lx is displayed along the horizontal direction from the center of the vertical direction of the display unit 12. The Y-axis Ly is displayed along the vertical direction from the center of the horizontal direction of the display unit 12.

[0038] Although not shown, the control unit 14, which is composed of a computer, includes: a central processing unit (CPU) that performs calculations according to a control program; a read-only memory (ROM) that stores the control program, etc.; and a read-write random access memory (RAM) that stores the calculation results, etc.

[0039] like Figure 3 As shown, the control unit 14 includes: an X-axis direction positioning unit 22, a first segmentation predetermined line interval setting unit 24, a second segmentation predetermined line interval setting unit 26, a device image creation unit 28, a crosshair image extraction unit 30, and an image creation unit 32.

[0040] The X-axis positioning unit 22 detects a straight line region corresponding to the first pre-division line L1 from the intersection area of ​​the first pre-division line L1 and the second pre-division line L2 obtained by the imaging unit 10 from the wafer W held by the chuck stage 4. It then calculates the angle between the detected straight line region and the X-axis direction and rotates the chuck stage 4 according to the calculated angle. In this way, the X-axis positioning unit 22 positions the straight line region corresponding to the first pre-division line L1 in the X-axis direction. Furthermore, the X-axis positioning unit 22 detects the straight line region using known techniques such as the Hough transform.

[0041] The first segmentation predetermined line interval setting unit 24, while capturing the chip W through the imaging unit 10, causes the Y-axis feed mechanism to operate, detects the straight line region corresponding to the next first segmentation predetermined line L1, and calculates and sets the interval of the first segmentation predetermined line L1.

[0042] The second segmentation predetermined line interval setting unit 26, while capturing images of the wafer W through the imaging unit 10, operates the X-axis feed mechanism to detect two adjacent straight line regions corresponding to the second segmentation predetermined line L2, and calculates and sets the interval of the second segmentation predetermined line L2. Furthermore, in the first and second segmentation predetermined line interval setting units 24 and 26, the straight line regions are also detected using methods such as Hough transform, similar to the X-axis direction positioning unit 22.

[0043] The device image creation unit 28 uses the imaging unit 10 to capture an image of a region containing a device D surrounded by a pair of adjacent first pre-division lines L1 and a pair of adjacent second pre-division lines L2, and creates and stores a device image (see reference). Figure 7 The device image referred to herein includes a pair of first predefined dividing lines L1 and a pair of second predefined dividing lines L2 existing around each device D. That is, the device image includes TEG 34 existing around the device D.

[0044] The crosshair image extraction unit 30 moves the area captured by the imaging unit 10 in the X-axis and Y-axis directions via the X-axis feed mechanism and the Y-axis feed mechanism, while the imaging unit 10 captures images of the wafer W to acquire multiple device images. Furthermore, the crosshair image extraction unit 30 links the acquired multiple device images using phase correlation (see reference). Figure 8 Extract and store crosshair images 52 containing multiple devices D and TEG 34 (refer to...). Figure 9 Furthermore, phase correlation is a well-known image processing technique, therefore it will not be described in this specification.

[0045] The image processing unit 32 moves the area captured by the imaging unit 10 in the X-axis and Y-axis directions via the X-axis and Y-axis feed mechanisms, respectively, while the imaging unit 10 captures images of the wafer W to acquire multiple crosshair images 52. Furthermore, the image processing unit 32 connects the acquired multiple crosshair images 52 using phase correlation to create Figure 54 of the wafer W (see reference). Figure 10 Additionally, in Figure 10 The images of the devices and the TEG have been omitted.

[0046] like Figure 1 As shown, the processing apparatus 2 further includes: a lifting and lowering cassette 40, which holds a cassette 38 for storing multiple wafers W; a transfer mechanism 44, which pulls out the wafers W before processing from the cassette 38 and moves them to a temporary placement stage 42, and moves the processed wafers W positioned on the temporary placement stage 42 into the cassette 38; a first transfer mechanism 46, which transfers the wafers W before processing from the cassette 38 to the temporary placement stage 42 to the chuck worktable 4; a cleaning unit 48, which cleans the processed wafers W; and a second transfer mechanism 50, which transfers the processed wafers W from the chuck worktable 4 to the cleaning unit 48.

[0047] Next, the method for fabricating the wafer W using the processing apparatus 2 described above will be explained.

[0048] The operator first holds the wafer W with the front side (Wa) bearing the first and second predetermined dividing lines L1 and L2 facing upwards using the chuck stage 4, and then secures the annular frame F using multiple clamps 18. Next, the operator operates the operation unit 8 to activate the X-axis feed mechanism, moving the wafer W held by the chuck stage 4 to below the imaging unit 10. Then, the operator operates the operation unit 8 to capture an image of the intersection area of ​​the first and second predetermined dividing lines L1 and L2 using the imaging unit 10.

[0049] Therefore, the image captured by the imaging unit 10 is transmitted from the imaging unit 10 to the control unit 14. Next, the X-axis positioning unit 22 of the control unit 14 detects a straight line region corresponding to the first pre-defined segmentation line L1 in the image transmitted from the imaging unit 10. Furthermore, the X-axis positioning unit 22 calculates the angle θ between the detected first pre-defined segmentation line L1 and the X-axis direction (refer to...). Figure 4 (a)). Furthermore, when the calculated angle θ is not 0°, the X-axis positioning unit 22 rotates the chuck table 4 according to the angle θ, as shown in (a). Figure 4 As shown in (b), the straight line region corresponding to the first predefined dividing line L1 is positioned in the X-axis direction.

[0050] When the straight area corresponding to the first dividing predetermined line L1 is positioned in the X-axis direction, control based on the first dividing predetermined line interval setting unit 24 of the control unit 14 is executed.

[0051] Specifically, the first pre-defined dividing line interval setting unit 24 activates the Y-axis feed mechanism and the imaging unit 10, moving the imaging unit 10 in the Y-axis direction while simultaneously capturing images of the wafer W held by the chuck stage 4. Thus, as... Figure 5 As shown, the first segmentation predetermined line interval setting unit 24 detects a straight line region corresponding to the next first segmentation predetermined line L1, which is adjacent to the first segmentation predetermined line L1 detected first by the X-axis direction positioning unit 22.

[0052] exist Figure 5 In the first division predetermined line L1 detected by the X-axis direction positioning unit 22 is outside the display area of ​​the display unit 12, so it is shown as a double-dotted line (imaginary line). On the other hand, the first division predetermined line L1 detected next by the first division predetermined line spacing setting unit 24 is within the display area of ​​the display unit 12, so it is shown as a solid line.

[0053] Next, the first segmentation predetermined line interval setting unit 24 calculates the interval (for example, 5mm) of the first segmentation predetermined line L1 based on the first detected first segmentation predetermined line L1 and the next detected first segmentation predetermined line L1, and sets the calculated interval as the interval of the first segmentation predetermined line L1.

[0054] When the interval of the first pre-defined dividing line L1 is set, control based on the second pre-defined dividing line interval setting unit 26 is executed. The second pre-defined dividing line interval setting unit 26 operates the X-axis feed mechanism and the imaging unit 10, moving the chuck stage 4 in the X-axis direction while the imaging unit 10 images the wafer W. Furthermore, as... Figure 6 As shown, the second dividing predetermined line interval setting unit 26 detects two adjacent straight line regions corresponding to the second dividing predetermined line L2, and calculates the interval of the second dividing predetermined line L2 (for example, 5mm), and sets the calculated interval as the interval of the second dividing predetermined line L2.

[0055] After setting the interval of the second pre-defined dividing lines L2, control based on the device image creation unit 28 is executed. The device image creation unit 28 causes the imaging unit 10 to operate together with the X-axis feed mechanism and the Y-axis feed mechanism, adjusts the positional relationship between the wafer W and the imaging unit 10, and captures an image of the area containing a device D surrounded by an adjacent pair of first pre-defined dividing lines L1 and an adjacent pair of second pre-defined dividing lines L2. (Refer to...) Figure 7 It is understood that, in this case, the imaging area of ​​the imaging unit 10 includes the device D and the TEG 34 present around the device D. Furthermore, based on the image captured by the imaging unit 10, the device image creation unit 28 creates and stores an image (device image) of the device D including the TEG 34 present around the device D.

[0056] When creating device images, control is performed based on the crosshair image extraction unit 30. The crosshair image extraction unit 30 first operates the Y-axis feed mechanism and the imaging unit 10, and acquires multiple device images while moving the area captured by the imaging unit 10 in the Y-axis direction.

[0057] In detail, the crosshair image extraction unit 30 uses, for example, the device D (hereinafter referred to as "reference device D") captured during the control of the device image creation unit 28 as a reference, and moves the imaging unit 10 in the Y-axis direction at intervals of the first predetermined dividing line L1 via the Y-axis feed mechanism. This positions the imaging area of ​​the imaging unit 10 in the Y-axis direction to the next device D located next to the reference device D. The imaging area at this time includes the TEG 34 surrounding the next device D. Next, the crosshair image extraction unit 30 captures the area containing the next device D and the surrounding TEG 34 via the imaging unit 10, obtaining a device image related to the next device D.

[0058] Furthermore, the crosshair image extraction unit 30 moves the imaging unit 10 at intervals along the first predetermined dividing lines L1 via the Y-axis feed mechanism, and sequentially captures images of devices D arranged in the same column as the reference device D in the Y-axis direction, thereby acquiring multiple device images. The crosshair image extraction unit 30 then compares the acquired device images with the device images of the reference device D to determine if they are identical. This control is performed until a device image identical to the device image containing the reference device D is acquired. Thus, the periodic pattern of the TEG 34 between multiple first predetermined dividing lines L1 can be detected.

[0059] As described above, TEG 34 is configured in a prescribed periodic pattern on the first and second predefined dividing lines L1 and L2, but the configuration of TEG 34 contained in the device image is not common to all device images.

[0060] For example, Figure 8 As shown, the configuration pattern of TEG 34 on the first predetermined dividing line L1a is different from the configuration pattern of TEG 34 on the adjacent first predetermined dividing line L1b. Furthermore, the configuration pattern of TEG 34 on the second predetermined dividing line L2a is different from the configuration pattern of TEG 34 on the adjacent second predetermined dividing line L2b. Thus, although the TEG 34 are configured in a prescribed periodic pattern, not all TEG 34 are configured at the same interval.

[0061] In this embodiment, for example when will Figure 8 When the device indicated by reference numeral D1 is used as a reference device, the configuration of the TEG 34 of the device image containing the two devices D2 below the reference device D1 is the same as the configuration of the TEG 34 of the device image containing the reference device D1. That is, in this embodiment, the configuration of the TEG 34 on the first pre-division line L1a is the same as the configuration of the TEG 34 on the adjacent second first pre-division line L1c.

[0062] After acquiring a device image identical to the device image containing the reference device D1, the crosshair image extraction unit 30 activates the X-axis feed mechanism and the imaging unit 10 to acquire multiple device images while moving the area captured by the imaging unit 10 in the X-axis direction.

[0063] In detail, the crosshair image extraction unit 30, for example, uses device D2 as a reference and moves the chuck stage 4 in the X-axis direction at intervals along the second predetermined dividing line L2 via the X-axis feed mechanism. As a result, the imaging area of ​​the imaging unit 10 is positioned in the X-axis direction at the next device D located next to device D2. This imaging area includes the TEG 34 surrounding the next device D. Next, the crosshair image extraction unit 30 captures an image of the area containing the next device D and the surrounding TEG 34 via the imaging unit 10, obtaining a device image related to the next device D.

[0064] Furthermore, the crosshair image extraction unit 30 moves the chuck stage 4 at intervals along the second predetermined dividing lines L2 via the X-axis feed mechanism, while sequentially capturing images of devices D arranged in the same column as device D2 via the imaging unit 10 in the X-axis direction, acquiring multiple device images. Additionally, the crosshair image extraction unit 30 compares the acquired device images with the device image of device D2 to determine if they are identical. This control is performed until a device image identical to the device image containing device D2 is acquired. Thus, the periodic pattern of TEG 34 between multiple second predetermined dividing lines L2 can be detected.

[0065] In this embodiment, Figure 8 The configuration of TEG 34 for the device image containing the two devices D3 from the left of device D2 is the same as the configuration of TEG 34 for the device image containing device D2. That is, in this embodiment, the configuration of TEG 34 on the second pre-division line L2a is the same as the configuration of TEG 34 on the adjacent second pre-division line L2c.

[0066] In addition, in this embodiment, the device D arranged in the Y-axis direction is photographed first, and then the device D arranged in the X-axis direction is photographed. However, it is also possible to do the opposite, and after photographing the device D arranged in the X-axis direction, the device D arranged in the Y-axis direction is photographed.

[0067] After acquiring a device image identical to the device image containing device D2, the crosshair image extraction unit 30 concatenates the acquired multiple device images using phase correlation to extract the image. Figure 9 The image 52 shown contains multiple devices D and TEG 34. The crosshair image 52 is an image showing an element (hereinafter referred to as "unit crosshair") of the periodic pattern on the front side Wa of the wafer W.

[0068] In this embodiment, as described above, the TEG 34 configurations on the first pre-division lines L1a and L1c are identical, and the TEG 34 configurations on the second pre-division lines L2a and L2c are identical. Therefore, as Figure 9As shown, a crosshair image 52 is extracted, which consists of two first pre-defined segmentation lines L1a and L1b, two second pre-defined segmentation lines L2a and L2b, and four devices D.

[0069] Figure 9 The crosshair image 52 shown is obtained by connecting four device images through phase correlation, but the number of devices D contained in the crosshair image is not limited to four. Any number of devices D can be included in the crosshair image according to the periodic pattern of TEG 34.

[0070] After the crosshair image 52 is extracted by the crosshair image extraction unit 30, control based on the image creation unit 32 is executed. The image creation unit 32 first positions the imaging area of ​​the imaging unit 10 at an arbitrary unit crosshair (for example, a unit crosshair including the reference device D1). Then, while moving the imaging area of ​​the imaging unit 10 in the X-axis direction according to the width of the unit crosshair in the X-axis direction, the image creation unit 32 sequentially captures the unit crosshairs arranged in the X-axis direction, thereby acquiring multiple crosshair images 52.

[0071] If the imaging area of ​​the imaging unit 10 reaches the periphery of the wafer W, the imaging area of ​​the imaging unit 10 is moved in the Y-axis direction by the width of the unit crosshair in the Y-axis direction. Then, while moving the imaging area of ​​the imaging unit 10 in the X-axis direction by the width of the unit crosshair in the X-axis direction, the unit crosshairs arranged in the X-axis direction are photographed sequentially to obtain multiple crosshair images 52. The above process is repeated to obtain images (crosshair images 52) of all the unit crosshairs on the wafer W.

[0072] Alternatively, the imaging area of ​​the imaging unit 10 can be moved in the Y-axis direction while the unit crosshairs are sequentially photographed. If the imaging area of ​​the imaging unit 10 reaches the periphery of the chip W, the imaging area of ​​the imaging unit 10 can be moved in the X-axis direction.

[0073] Furthermore, the image creation unit 32 connects all the acquired crosshair images 52 through phase correlation, thereby creating image 54 of the chip W (see reference). Figure 10 In this embodiment, the pattern making unit 32 moves the area captured by the imaging unit 10 in the X-axis direction and the Y-axis direction while acquiring multiple crosshair images 52, and connects the acquired multiple crosshair images 52 by phase correlation to create a pattern 54 of the wafer W.

[0074] Alternatively, the image production unit 32 can copy the crosshair image 52 extracted by the crosshair image extraction unit 30, thereby obtaining multiple crosshair images 52. Then, the multiple crosshair images 52 obtained are connected into a square image by phase correlation. The square image obtained by connection is cut into a circle corresponding to the diameter of the wafer W, thereby producing the image 54 of the wafer W.

[0075] As described above, in the processing apparatus 2, control is performed based on the image of the intersection area of ​​the first pre-division line L1 and the second pre-division line L2 to create the image 54 of the wafer W. Therefore, it is not necessary for the operator to link multiple images captured by the imaging unit 10 to create the image information of the wafer W and store it in the storage unit, thereby eliminating the tedious problem.

[0076] Furthermore, in this embodiment, an example of a cutting device that performs cutting processing on wafer W has been described, but the processing device of the present invention can be configured to perform processing on wafer W as long as it performs processing on wafer W. For example, it can also be configured as a laser processing device that performs laser processing on wafer W.

Claims

1. A processing apparatus for fabricating a wafer pattern, the wafer being divided into multiple devices by a plurality of first predetermined dividing lines extending along a first direction and a plurality of second predetermined dividing lines extending along a second direction perpendicular to the first direction, and test element groups being formed on the first predetermined dividing lines and the second predetermined dividing lines, wherein, The processing device has the following features: A chuck stage that can rotate to hold the wafer; The processing unit processes the wafer held in the chuck stage; The X-axis feed mechanism feeds the chuck table and the machining unit relative to each other in the X-axis direction. The Y-axis feed mechanism indexes and feeds the chuck table and the machining unit relative to each other in the Y-axis direction. An operating unit for operating the X-axis feed mechanism and the Y-axis feed mechanism; The imaging unit captures images of the wafer held on the chuck stage to detect the area to be processed. A display unit that displays the area captured by the imaging unit; and Control unit The control unit includes: The X-axis positioning unit detects the straight area corresponding to the first dividing predetermined line from the intersection area of ​​the first dividing predetermined line and the second dividing predetermined line obtained by the imaging unit to the wafer held by the chuck stage, and calculates the angle with the X-axis direction. The chuck stage is then rotated to position the straight area corresponding to the first dividing predetermined line in the X-axis direction. The first division predetermined line interval setting unit causes the Y-axis feed mechanism to operate and detect the straight line area corresponding to the next first division predetermined line, and sets the interval of the first division predetermined line. The second pre-division line interval setting unit causes the X-axis feed mechanism to operate and detect two adjacent straight line regions corresponding to the second pre-division line, and sets the interval of the second pre-division line. The device image creation unit creates and stores a device image surrounded by a pair of adjacent first pre-defined dividing lines and a pair of adjacent second pre-defined dividing lines. The crosshair image extraction unit moves the area captured by the imaging unit in the X-axis and Y-axis directions to acquire multiple device images, connects the acquired multiple device images through phase correlation, and extracts and stores a crosshair image containing multiple devices and test element groups. as well as The image production department creates the image of the chip by connecting multiple crosshair images through phase correlation.

2. The processing apparatus according to claim 1, wherein, The image production unit moves the area captured by the imaging unit in the X-axis and Y-axis directions to acquire multiple crosshair images, and then connects the acquired multiple crosshair images through phase correlation to create a chip image.

Images