A chuck with multi-angle adjustability for wafer regeneration

Abstract

The present invention relates to the field of wafer technology, specifically a multi-angle adjustable chuck for wafer regeneration, a base, and also includes a limit mechanism, a shift mechanism, a flip adjustment mechanism and an adjustment support mechanism. The limit mechanism is fixedly installed on the top of the base, and the limit mechanism includes an operating table. The present invention is provided with a shift mechanism, a lifting mechanism and an adjustment support mechanism. After the wafer is clamped and fixed, the wafer needs to be lifted, and the servo motor is turned on to drive the threaded rod to rotate through a first rotating block, thereby driving the slide to move forward along the threaded rod. The movement of the slide drives a first electric lifting sleeve to move inward, and the position of the first electric lifting sleeve can be adjusted and moved more conveniently, making the device control more precise and the operation faster and more convenient, thereby squeezing the first fixing ring and the second fixing ring, and the first fixing ring and the second fixing ring are hinged by a pin shaft.

Description

Technical Field

[0001] The invention relates to the technical field of wafers, in particular to a multi-angle adjustable chuck for wafer regeneration. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystal silicon. Silicon ingots are ground, polished, and sliced into silicon wafers, or wafers. The main processing methods for wafers are sheet processing and batch processing, which involves processing one or more wafers simultaneously. As semiconductor feature sizes continue to shrink and processing and measurement equipment become more advanced, new data characteristics have emerged in wafer processing. The wafer regeneration process requires various mechanical manipulations and requires wafer clamping and fixation.

[0003] In the prior art, there are the following problems:

[0004] (1) The existing chuck is usually unable to adjust the angle of the wafer more conveniently during use. The angle and position of the wafer cannot be adjusted according to the needs of use during the clamping process, and its use has certain limitations;

[0005] (2) The existing chuck is usually not able to load the wafer more conveniently when in use. When in use, the staff is required to load the wafer, and it is impossible to position the wafer more accurately, which can easily cause damage to the wafer and affect subsequent use. Summary of the Invention

[0006] The object of the present invention is to provide a multi-angle adjustable chuck for wafer regeneration to solve the problems raised in the above background technology.

[0007] The technical solution of the present invention is: a multi-angle adjustable chuck for wafer regeneration, comprising a base, and also comprising a limiting mechanism, a shifting mechanism, a flipping adjustment mechanism and an adjusting support mechanism, wherein the limiting mechanism is fixedly mounted on the top of the base, the limiting mechanism comprises an operating table, a loading mechanism is fixedly mounted on the top of the operating table, a supporting anti-slip mechanism is fixedly mounted on the top of the loading mechanism, the shifting mechanism is fixedly mounted on one side of the top of the operating table, the flipping adjustment mechanism is fixedly mounted on the top of the base, a lifting mechanism is fixedly mounted on the inside of the flipping adjustment mechanism, and the lifting mechanism comprises two hinges respectively fixedly mounted on the inside of the flipping adjustment mechanism, a first fixing ring fixedly mounted on one side of a hinge, two pins respectively fixedly mounted on both sides of the first fixing ring and a second fixing ring hinged to one side of the first fixing ring through the two pins, a rotating clamping mechanism is provided on the inside of the second fixing ring, and the adjusting support mechanism is provided on the inside of the flipping adjustment mechanism.

[0008] Preferably, the limiting mechanism includes a card slot, a card block and an operating table, the card slot is opened on the top of the base, the card block is installed on the inner side of the card slot, and the operating table is fixedly installed on the top of the card block.

[0009] Preferably, the loading mechanism includes a mounting plate, a screw slide, a first connecting block and a first electric push rod, the mounting plate is fixedly mounted on the top of the operating table, the screw slide is fixedly mounted on the top of the mounting plate, the first connecting block is fixedly mounted on the top of the sliding block of the screw slide, and the first electric push rod is fixedly mounted on the top of the first connecting block.

[0010] Preferably, the support anti-slip mechanism includes a telescopic sleeve, a telescopic rod, an anti-slip pad, a plurality of fixed blocks respectively fixedly mounted inside the telescopic sleeve, a plurality of movable blocks respectively fixedly mounted on both sides of the top of the telescopic rod, and a plurality of movable hooks respectively cooperated with and mounted on the inner sides of the plurality of movable blocks, a telescopic spring is connected between each of the fixed blocks and the telescopic rod, the telescopic sleeve is fixedly mounted on the telescopic end of the first electric push rod, the telescopic rod is cooperated with and mounted on the inner side of the telescopic sleeve, and the anti-slip pad is fixedly mounted on one side of the plurality of movable hooks.

[0011] Preferably, the shift mechanism includes a mounting groove, a servo motor, a threaded rod, a first rotating block and a slide. The mounting groove is opened on one side of the top of the base, the servo motor is fixedly installed on the outside of the mounting groove, the threaded rod is fixedly connected to the output end of the servo motor, the first rotating block is fixedly installed at one end of the threaded rod, and the slide is cooperatively installed on the outside of the threaded rod.

[0012] Preferably, the flip adjustment mechanism includes two first electric lifting rods respectively fixedly mounted on both sides of the top of the base, two support plates respectively fixedly mounted on the telescopic ends of the two first electric lifting rods, and two electric turntables respectively fixedly mounted on one side of the two support plates, one of the first electric lifting rods being fixedly mounted on the top of the slide.

[0013] Preferably, the rotating clamping mechanism includes two mounting blocks respectively fixedly mounted on both sides of the inner wall of the second fixing ring, two second rotating blocks respectively fixedly mounted on one side of the two mounting blocks, two second connecting blocks respectively fixedly mounted on one side of the two second rotating blocks, two second electric push rods respectively fixedly mounted on one side of the two second connecting blocks and two clamping blocks respectively fixedly mounted on the telescopic ends of the two second electric push rods.

[0014] Preferably, the adjustment support mechanism includes two mounting sleeves respectively fixedly mounted on the inner sides of the two support plates, a plurality of hydraulic rods respectively fixedly mounted inside the two mounting sleeves, two extension plates respectively cooperatively mounted on the inner sides of the two mounting sleeves, two second electric lifting sleeve rods respectively fixedly mounted on the tops of the two extension plates, and two push plates respectively fixedly mounted on the telescopic ends of the two second electric lifting sleeve rods.

[0015] The present invention provides a multi-angle adjustable chuck for wafer regeneration through improvement, which has the following improvements and advantages compared with the prior art:

[0016] First, the present invention is provided with a shift mechanism, a lifting mechanism and an adjustment support mechanism. After the wafer is clamped and fixed, the wafer needs to be lifted. The servo motor is turned on to make the servo motor drive the threaded rod to rotate through the first rotating block, thereby driving the slide to move forward along the threaded rod. The movement of the slide drives a first electric lifting sleeve to move inward, which can more conveniently adjust the position of the first electric lifting sleeve, making the device control more precise and the operation faster and more convenient, thereby squeezing the first fixing ring and the second fixing ring. The first fixing ring and the second fixing ring are hinged by a pin shaft. During the squeezing process, the first electric push rod is opened to drive the anti-slip pad to lift the wafer. During the wafer lifting process, the hinge of the first fixing ring and the second fixing ring is driven to move upward. At the same time, the first fixing ring and the second fixing ring drive the hinge on one side to rotate, so that the first fixing ring and the second fixing ring The second rotary block is rotated by the second electric lifting rod to rotate the second electric lifting rod, so that the wafer is kept at a suitable inclination according to the use requirements. At the same time, the setting of the two push plates can not only adjust the angle of the wafer, but also keep the wafer stable during processing, and prevent the mechanical equipment from exerting pressure on the wafer, resulting in damage to the wafer, which affects the subsequent use.

[0017] Secondly, the present invention is provided with a loading mechanism and a supporting anti-skid mechanism, and the anti-skid pad is pushed so that the anti-skid pad drives the movable hook at the bottom to move downward so that both sides of the movable hook contact with the movable block, and the two sides of the movable hook are folded inward until they pass the movable block, and the movable hook rebounds, so that the movable block is fixedly connected to the movable hook, so that the anti-skid pad is fixedly installed on the top of the telescopic rod, and the wafer is placed on the top of the anti-skid pad, and the screw slide is opened so that the sliding block of the screw slide drives the wafer to move inward until the wafer moves to below the center position of the first fixed ring and the second fixed ring, and then the first electric push rod is opened so that the first electric push rod drives the wafer to move upward , so that the wafer moves to the inner side of the first fixing ring and the second fixing ring, and then the second electric push rod is turned on to drive the clamping block to move inward to clamp the wafer. The arrangement of the screw slide, the first connecting block and the first electric push rod can more conveniently load the wafer without manual prevention by the staff, which can prevent it from being more accurate and reduce the contact with the wafer. The arrangement of the anti-slip pad can more conveniently prevent the wafer from slipping, and keep the wafer stable during the movement to prevent the wafer from falling and affecting the loading effect. At the same time, the arrangement of the telescopic spring can have a buffering and shock-absorbing effect on the wafer, making it more stable to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further explained below in conjunction with the accompanying drawings and Examples:

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 It is a schematic structural diagram of the feeding mechanism of the present invention;

[0021] Figure 3 It is a schematic structural diagram of the shifting mechanism, the flipping adjustment mechanism and the lifting mechanism of the present invention;

[0022] Figure 4 It is a schematic structural diagram of the adjustment support mechanism of the present invention;

[0023] Figure 5 The present invention Figure 2 A in the middle is an enlarged structural diagram;

[0024] Figure 6 The present invention Figure 1 The enlarged structural diagram at C in the middle;

[0025] Figure 7 The present invention Figure 3 Enlarged structural diagram at point B in the middle.

[0026] Explanation of reference numerals: 1. base; 2. limiting mechanism; 21. clamping slot; 22. clamping block; 23. operating table; 3. feeding mechanism; 31. mounting plate; 32. screw slide; 33. first connecting block; 34. first electric push rod; 4. supporting anti-slip mechanism; 41. telescopic sleeve; 42. fixed block; 43. telescopic spring; 44. telescopic rod; 45. movable block; 46. movable hook; 47. anti-slip pad; 5. shifting mechanism; 51. mounting slot; 52. servo motor; 53. threaded rod; 54. first rotating block; 55. Slide; 6. Flip adjustment mechanism; 61. First electric lifting sleeve; 62. Support plate; 63. Electric turntable; 7. Lifting mechanism; 71. Hinge; 72. First fixed ring; 73. Pin; 74. Second fixed ring; 8. Rotary clamping mechanism; 81. Mounting block; 82. Second rotating block; 83. Second connecting block; 84. Second electric push rod; 85. Clamping block; 9. Adjusting support mechanism; 91. Mounting sleeve; 92. Hydraulic rod; 93. Extension plate; 94. Second electric lifting sleeve; 95. Push plate. DETAILED DESCRIPTION

[0027] The present invention is described in detail below, clearly and completely describing the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0028] The present invention provides a multi-angle adjustable chuck for wafer regeneration through improvement. The technical solution of the present invention is:

[0029] Example 1:

[0030] like Figures 1-4 As shown, a multi-angle adjustable chuck for wafer regeneration includes a base 1, a limiting mechanism 2, a shifting mechanism 5, a flipping adjustment mechanism 6 and an adjusting support mechanism 9. The limiting mechanism 2 is fixedly mounted on the top of the base 1, the limiting mechanism 2 includes an operating table 23, a loading mechanism 3 is fixedly mounted on the top of the operating table 23, a supporting anti-slip mechanism 4 is fixedly mounted on the top of the loading mechanism 3, the shifting mechanism 5 is fixedly mounted on one side of the top of the operating table 23, the flipping adjustment mechanism 6 is fixedly mounted on the top of the base 1, and a lifting mechanism 7 is fixedly mounted on the inside of the flipping adjustment mechanism 6. The lifting mechanism 7 includes two hinges 71 respectively fixedly mounted on the inside of the flipping adjustment mechanism 6, a first fixing ring 72 fixedly mounted on one side of a hinge 71, two pins 73 respectively fixedly mounted on both sides of the first fixing ring 72 and a second fixing ring 74 hinged to one side of the first fixing ring 72 through the two pins 73, a rotating clamping mechanism 8 is provided on the inside of the second fixing ring 74, and the adjusting support mechanism 9 is provided on the inside of the flipping adjustment mechanism 6.

[0031] The above specific implementation plan: the first fixing ring 72 and the second fixing ring 74 are squeezed, and the first fixing ring 72 and the second fixing ring 74 are hinged by the pin shaft 73. During the squeezing process, the first electric push rod 34 is opened so that the first electric push rod 34 drives the anti-slip pad 47 to lift the wafer. During the wafer lifting process, the hinges of the first fixing ring 72 and the second fixing ring 74 are driven to move upward. At the same time, the first fixing ring 72 and the second fixing ring 74 drive the hinge 71 on one side to rotate, so that the first fixing ring 72 and the second fixing ring 74 form a certain angle, which can more conveniently support the wafer and make the wafer higher than the horizontal line of the first fixing ring 72 and the second fixing ring 74, so as to facilitate better subsequent processing of the edge of the wafer, the processing contact surface is wider, and the use is more convenient.

[0032] Specifically, the limiting mechanism 2 includes a card slot 21, a card block 22 and an operating table 23. The card slot 21 is opened at the top of the base 1, the card block 22 is installed in cooperation with the card slot 21, and the operating table 23 is fixedly installed on the top of the card block 22. By providing the card slot 21, the card block 22 and the operating table 23, it is easier to install and fix the entire device, preventing the device from colliding with other external objects and causing the device to shake, affecting subsequent use.

[0033] Specifically, the loading mechanism 3 includes a mounting plate 31, a screw slide 32, a first connecting block 33 and a first electric push rod 34. The mounting plate 31 is fixedly mounted on the top of the operating table 23, the screw slide 32 is fixedly mounted on the top of the mounting plate 31, the first connecting block 33 is fixedly mounted on the top of the sliding block of the screw slide 32, and the first electric push rod 34 is fixedly mounted on the top of the first connecting block 33. By providing the mounting plate 31, the screw slide 32, the first connecting block 33 and the first electric push rod 34, the wafer can be loaded more conveniently without manual prevention by the staff, which is more accurate and reduces the contact with the wafer.

[0034] The anti-skid pad 47 is fixed on one side of the plurality of movable hooks 46 and the anti-skid pad 47 is fixed on the other side of the plurality of movable hooks 46.

[0035] Specifically, the shift mechanism 5 includes a mounting groove 51, a servo motor 52, a threaded rod 53, a first rotating block 54 and a slide 55. The mounting groove 51 is opened on one side of the top of the base 1, the servo motor 52 is fixedly mounted on the outside of the mounting groove 51, the threaded rod 53 is fixedly connected to the output end of the servo motor 52, the first rotating block 54 is fixedly mounted on one end of the threaded rod 53, and the slide 55 is cooperatively mounted on the outside of the threaded rod 53. By providing the mounting groove 51, the servo motor 52, the threaded rod 53, the first rotating block 54 and the slide 55, the position of the first electric lifting sleeve 61 can be adjusted and moved more conveniently, making the device control more precise and the operation faster and more convenient.

[0036] Specifically, the flip adjustment mechanism 6 includes two first electric lifting rods 61 respectively fixedly installed on both sides of the top of the base 1, two support plates 62 respectively fixedly installed on the telescopic ends of the two first electric lifting rods 61 and two electric turntables 63 respectively fixedly installed on one side of the two support plates 62. One of the first electric lifting rods 61 is fixedly installed on the top of the slide 55. By providing the first electric lifting rod 61, the support plate 62 and the electric turntable 63, the front and back sides of the wafer can be flipped more conveniently according to the needs of use, so as to facilitate processing of the other side.

[0037] Specifically, the rotating clamping mechanism 8 includes two mounting blocks 81 respectively fixedly mounted on both sides of the inner wall of the second fixing ring 74, two second rotating blocks 82 respectively fixedly mounted on one side of the two mounting blocks 81, two second connecting blocks 83 respectively fixedly mounted on one side of the two second rotating blocks 82, two second electric push rods 84 respectively fixedly mounted on one side of the two second connecting blocks 83, and two clamping blocks 85 respectively fixedly mounted on the telescopic ends of the two second electric push rods 84.

[0038] Specifically, the adjustment support mechanism 9 includes two mounting sleeves 91 respectively fixedly mounted on the inner sides of the two support plates 62, a plurality of hydraulic rods 92 respectively fixedly mounted inside the two mounting sleeves 91, two extension plates 93 respectively cooperated with and mounted on the inner sides of the two mounting sleeves 91, two second electric lifting sleeves 94 respectively fixedly mounted on the tops of the two extension plates 93 and two push plates 95 respectively fixedly mounted on the telescopic ends of the two second electric lifting sleeves 94. By providing the mounting sleeves 91, hydraulic rods 92, extension plates 93, second electric lifting sleeves 94 and push plates 95, not only can the angle of the wafer be adjusted, but also the wafer processing can be kept stable during the process, preventing mechanical equipment from exerting pressure on the wafer, causing damage to the wafer and affecting subsequent use.

[0039] Working principle: First, turn on the external power supply, push the anti-skid pad 47 so that the anti-skid pad 47 drives the movable hook 46 at the bottom to move downward so that both sides of the movable hook 46 contact the movable block 45, and continue to push so that both sides of the movable hook 46 fold inward until they pass the movable block 45, and the movable hook 46 rebounds, so that the movable block 45 is fixedly connected with the movable hook 46, so that the anti-skid pad 47 is fixedly installed on the top of the telescopic rod 44, and the wafer is placed on the top of the anti-skid pad 47, and then the wafer is placed on the top of the anti-skid pad 47, and the screw slide 32 is opened so that the sliding block of the screw slide 32 drives the wafer to move inward until the wafer moves to below the center position of the first fixing ring 72 and the second fixing ring 74, and then the first electric push rod 34 is opened so that the first electric push rod 34 drives The wafer moves upward, so that the wafer moves to the inside of the first fixing ring 72 and the second fixing ring 74, and then the second electric push rod 84 is opened to drive the clamping block 85 to move inward to clamp the wafer, and then the servo motor 52 is turned on to drive the threaded rod 53 to rotate through the first rotating block 54, thereby driving the slide 55 to move forward along the threaded rod 53, and the movement of the slide 55 drives a first electric lifting sleeve rod 61 to move inward, and then during the squeezing process, the first electric push rod 34 is opened to drive the anti-slip pad 47 to lift the wafer, and during the wafer lifting process, the hinged joints of the first fixing ring 72 and the second fixing ring 74 are driven to move upward, and at the same time, the first fixing ring 72 and the second fixing ring are The first and second fixed rings 72 and 74 are rotated by the hinge 71, so that the first and second fixed rings 72 and 74 form a certain angle, which can more conveniently support the wafer. Then, the hydraulic rod 92 is opened to drive the extension plate 93 to extend forward, so that the extension plate 93 drives the push plate 95 to move under the wafer. Then the second electric lifting sleeve 94 is opened to drive the push plate 95 to move upward so that the top of the push plate 95 contacts the bottom of the wafer. When the heights of the two push plates 95 are consistent, the wafer is parallel to the operating table 23. When there is a height difference between the two push plates 95, the wafer drives the second rotating block 82 to rotate, so that the wafer maintains a suitable inclination according to the needs of use. Finally, when one side of the wafer is processed, the wafer is placed The wafer is restored to a parallel state, and the electric turntable 63 is turned on so that the electric turntable 63 drives the first fixed ring 72 and the second fixed ring 74 to rotate, thereby driving the wafer to flip and process the other side. The model of the screw slide 32 is: PKH40, the model of the first electric push rod 34 is: YS-NZ100-12A, the model of the servo motor 52 is: YE2-132S-4, the model of the first electric lifting sleeve 61 is: XYDHA24-800, the model of the electric turntable 63 is: DG60-5, the model of the second electric push rod 84 is: YS-NZ100-12A, the model of the hydraulic rod 92 is: CDM2B25, and the model of the second electric lifting sleeve 94 is: XYDHA24-800.

[0040] The above description is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-angle adjustable chuck for wafer regeneration, comprising a base (1), characterized in that: The invention also includes a limiting mechanism (2), a shifting mechanism (5), a flipping adjustment mechanism (6) and an adjustment support mechanism (9), wherein the limiting mechanism (2) is fixedly mounted on the top of the base (1), the limiting mechanism (2) includes an operating table (23), a feeding mechanism (3) is fixedly mounted on the top of the operating table (23), a supporting anti-slip mechanism (4) is fixedly mounted on the top of the feeding mechanism (3), the shifting mechanism (5) is fixedly mounted on one side of the top of the operating table (23), the flipping adjustment mechanism (6) is fixedly mounted on the top of the base (1), and the flipping adjustment mechanism (6) is fixedly mounted on the top of the base (1). A lifting mechanism (7) is fixedly installed on the side, and the lifting mechanism (7) includes two hinges (71) respectively fixedly installed on the inner side of the flip adjustment mechanism (6), a first fixing ring (72) fixedly installed on one side of a hinge (71), two pins (73) respectively fixedly installed on both sides of the first fixing ring (72), and a second fixing ring (74) hinged to one side of the first fixing ring (72) through the two pins (73), a rotating clamping mechanism (8) is provided on the inner side of the second fixing ring (74), and the adjustment support mechanism (9) is provided on the inner side of the flip adjustment mechanism (6).

2. The multi-angle adjustable chuck for wafer regeneration according to claim 1, characterized in that: The limiting mechanism (2) comprises a card slot (21), a card block (22) and an operating table (23); the card slot (21) is provided on the top of the base (1); the card block (22) is mounted on the inner side of the card slot (21); and the operating table (23) is fixedly mounted on the top of the card block (22).

3. The multi-angle adjustable chuck for wafer regeneration according to claim 2, characterized in that: The feeding mechanism (3) comprises a mounting plate (31), a screw slide (32), a first connecting block (33) and a first electric push rod (34), wherein the mounting plate (31) is fixedly mounted on the top of the operating table (23), the screw slide (32) is fixedly mounted on the top of the mounting plate (31), the first connecting block (33) is fixedly mounted on the top of the sliding block of the screw slide (32), and the first electric push rod (34) is fixedly mounted on the top of the first connecting block (33).

4. The multi-angle adjustable chuck for wafer regeneration according to claim 3, characterized in that: The supporting anti-skid mechanism (4) comprises a telescopic sleeve (41), a telescopic rod (44), an anti-skid pad (47), a plurality of fixed blocks (42) respectively fixedly mounted inside the telescopic sleeve (41), a plurality of movable blocks (45) respectively fixedly mounted on both sides of the top of the telescopic rod (44), and a plurality of movable hooks (46) respectively mounted on the inner sides of the plurality of movable blocks (45). A telescopic spring (43) is connected between each of the fixed blocks (42) and the telescopic rod (44). The telescopic sleeve (41) is fixedly mounted on the telescopic end of the first electric push rod (34), the telescopic rod (44) is mounted on the inner side of the telescopic sleeve (41), and the anti-skid pad (47) is fixedly mounted on one side of the plurality of movable hooks (46).

5. The multi-angle adjustable chuck for wafer regeneration according to claim 1, characterized in that: The shift mechanism (5) comprises a mounting groove (51), a servo motor (52), a threaded rod (53), a first rotating block (54) and a slide (55), wherein the mounting groove (51) is provided on one side of the top of the base (1), the servo motor (52) is fixedly mounted on the outside of the mounting groove (51), the threaded rod (53) is fixedly connected to the output end of the servo motor (52), the first rotating block (54) is fixedly mounted on one end of the threaded rod (53), and the slide (55) is cooperatively mounted on the outside of the threaded rod (53).

6. The multi-angle adjustable chuck for wafer regeneration according to claim 1, characterized in that: The flip adjustment mechanism (6) comprises two first electric lifting rods (61) respectively fixedly mounted on both sides of the top of the base (1), two support plates (62) respectively fixedly mounted on the telescopic ends of the two first electric lifting rods (61), and two electric turntables (63) respectively fixedly mounted on one side of the two support plates (62), wherein one of the first electric lifting rods (61) is fixedly mounted on the top of the slide (55).

7. The multi-angle adjustable chuck for wafer regeneration according to claim 1, characterized in that: The rotary clamping mechanism (8) comprises two mounting blocks (81) respectively fixedly mounted on both sides of the inner wall of the second fixing ring (74), two second rotating blocks (82) respectively fixedly mounted on one side of the two mounting blocks (81), two second connecting blocks (83) respectively fixedly mounted on one side of the two second rotating blocks (82), two second electric push rods (84) respectively fixedly mounted on one side of the two second connecting blocks (83), and two clamping blocks (85) respectively fixedly mounted on the telescopic ends of the two second electric push rods (84).

8. The multi-angle adjustable chuck for wafer regeneration according to claim 6, characterized in that: The adjusting support mechanism (9) comprises two mounting sleeves (91) respectively fixedly mounted on the inner sides of the two support plates (62), a plurality of hydraulic rods (92) respectively fixedly mounted inside the two mounting sleeves (91), two extension plates (93) respectively mounted in cooperation with the inner sides of the two mounting sleeves (91), two second electric lifting sleeve rods (94) respectively fixedly mounted on the tops of the two extension plates (93), and two push plates (95) respectively fixedly mounted on the telescopic ends of the two second electric lifting sleeve rods (94).

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