A photoelectric sensor packaging structure and packaging method thereof

Abstract

The present invention belongs to the field of sensor packaging technology, and in particular, is a photoelectric sensor packaging structure and a packaging method thereof, wherein the photoelectric sensor packaging structure includes a substrate, a photoelectric sensor chip, an annular bracket and a crushing structure, wherein the annular bracket surrounds the outer position of the substrate, an upper cover is bonded to the bracket, and a packaging cavity with an annular spacer cavity is formed between the annular bracket, the upper cover and the substrate, and a brittle connection structure is arranged in the annular spacer cavity. The present invention isolates the internal and external environments of the packaging structure by adding a brittle connection structure to form a highly sealed packaging structure, and the crushing structure is designed to crush the brittle connection structure. When the packaging structure needs to be disassembled, there is no need to disassemble the packaging component, and the substrate carrying the chip can be separated from the package by simply twisting the crushing structure, thereby meeting the high-sealing packaging requirements and solving the problem of the difficulty in disassembling the existing glue-fixed photoelectric sensor packaging structure.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor packaging, and in particular to a photoelectric sensor packaging structure and a packaging method thereof. Background Art

[0002] There are many ways to package photoelectric sensors, including mechanical fixing, adhesive fixing, welding fixing, etc. Among them, mechanical fixing and adhesive fixing are the two most commonly used packaging methods for photoelectric sensors. Mechanical fixing is mainly based on the performance and use requirements of photoelectric sensors, designing a certain container (tube shell) and corresponding fasteners to assemble and fix the components into a whole. The main difference between adhesive fixing and mechanical fixing is that the fixing between the transmission parts is done with various adhesives (glue). The advantage of using adhesive to fix the components to package photoelectric sensors is that it is easy, flexible, fast, and widely applicable, especially suitable for the test stage of photoelectric sensors.

[0003] The existing photoelectric sensor structure using adhesive fixation is generally composed of a substrate carrying a sensor chip and a package. The package is composed of an annular bracket and an upper cover. The upper cover is arranged on the annular bracket, and the annular bracket is bonded to the substrate by adhesive. A closed packaging cavity is formed between the substrate, the annular bracket and the upper cover, and the sensor chip is packaged in the package. When it is necessary to test, maintain or repair the internal components of the packaging structure, the packaging structure needs to be disassembled, but the components packaged with adhesives are generally difficult to disassemble and reassemble, so photoelectric sensors packaged with adhesives are generally unable to be disassembled. For example, it is difficult to disassemble the package after epoxy glue is cured. This problem has not been well solved so far. There is an urgent need for an adhesive fixed photoelectric sensor packaging structure that can be widely used while ensuring the sealing of the package, and can simply and quickly complete the disassembly and assembly of the photoelectric sensor package.

[0004] Therefore, we propose a photoelectric sensor packaging structure and a packaging method thereof to solve the above problems. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the present invention provides a photoelectric sensor packaging structure and a packaging method thereof, which solves the problem that the existing photoelectric sensor structure fixed by adhesive cannot simply and quickly complete the disassembly and assembly and reassembly of the photoelectric sensor package while ensuring the sealing of the package.

[0007] (II) Technical solution

[0008] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0009] A photoelectric sensor packaging structure, the photoelectric sensor packaging structure comprising:

[0010] substrate;

[0011] A photoelectric sensor chip, wherein the photoelectric sensor chip is bonded to the substrate and electrically connected to the circuit on the substrate through a wire;

[0012] An annular bracket, the annular bracket surrounds the outer position of the substrate, an upper cover is bonded to the annular bracket, a packaging cavity with an annular spacer cavity is formed between the annular bracket, the upper cover and the substrate, a brittle connection structure is arranged in the annular spacer cavity, the annular bracket and the substrate are connected by the brittle connection structure, and the photoelectric sensor chip is enclosed in the packaging cavity;

[0013] A crushing structure, wherein the crushing structure is composed of a bottom plate and an annular crushing part installed on the outer edge of the bottom plate, wherein the inner side wall of the annular crushing part is threadedly connected to the outer wall of the base plate, and the annular crushing part is used to crush the brittle connection structure, and a secondary assembly glue pouring structure is provided inside the annular crushing part, and the secondary assembly glue pouring structure is used to cooperate with the glue pouring equipment to pour glue inside the annular spacer cavity when the brittle connection structure is crushed by the crushing structure and the photoelectric sensor chip is repackaged, so as to cut off the connection between the packaging cavity and the external environment;

[0014] An annular gap is provided at the bottom of the annular spacing cavity corresponding to the annular bracket and the base plate, the upper part of the annular crushing part is pre-placed inside the annular gap, and a screwing gap is provided between the bottom plate and the base plate. A stabilizing threaded ring plate is threadedly connected to the outer wall of the lower part of the annular crushing part, the upper surface of the stabilizing threaded ring plate is fitted on the lower surface of the annular bracket, and the stabilizing threaded ring plate is fixed to the bottom of the annular bracket by bolts.

[0015] Furthermore, the brittle connection structure is made of glass material or ceramic material.

[0016] Furthermore, the brittle connection structure is connected to the annular bracket and the base plate respectively by gluing, the bottom of the brittle connection structure is provided with an annular crushing notch groove with an inverted "V"-shaped cross-section, and the top of the annular crushing part is provided with an annular crushing head adapted to the annular crushing notch groove.

[0017] Furthermore, a screwing hexagonal groove is provided at the bottom of the bottom plate.

[0018] Furthermore, the secondary assembly glue pouring structure includes a glue pouring port arranged at the bottom of the annular crushing part, the glue pouring port is provided with a dust plug, the interior of the annular crushing part is provided with a glue pouring channel connected with the glue pouring port, the top of the annular crushing part is provided with an annular glue distribution channel, the glue pouring channel extends vertically upward and is connected with the annular glue distribution channel, the interior of the annular crushing part has a plurality of transverse glue pouring channels extending laterally on the left and right sides corresponding to the annular glue distribution channel, and when the upper surface of the bottom plate is in contact with the lower surface of the base plate, the transverse glue pouring channels are connected with the annular spacing cavity.

[0019] A packaging method for a photoelectric sensor packaging structure comprises the following steps:

[0020] S1. One-time packaging:

[0021] S11, providing a substrate, a photoelectric sensor chip, a ring bracket, a crushing structure, an upper cover, a brittle connection structure and a stable threaded ring plate, bonding the photoelectric sensor chip to the substrate, and connecting the photoelectric sensor chip to the pad on the substrate through a wire, so that the photoelectric sensor chip circuit is connected to the substrate circuit;

[0022] S12, placing the annular bracket outside the substrate, applying glue to the inner and outer edges of the brittle connection structure and the inner and outer walls of the annular spacer cavity in advance, and bonding the substrate and the annular bracket together through the brittle connection structure;

[0023] S13, fixing the upper cover on the annular bracket to form a closed packaging cavity between the annular bracket, the upper cover and the substrate;

[0024] S14, threading the stabilizing threaded ring plate onto the outer wall of the annular crushing part of the crushing structure so that the bottom of the stabilizing threaded ring plate is flush with the bottom of the annular crushing part;

[0025] S15. Align the annular gap between the base plate and the annular bracket with the annular crushing part, use an inner hexagonal wrench to align with the screwing hexagonal slot at the bottom of the base plate, and screw the annular crushing part into the annular gap, so that the annular crushing head at the top of the annular crushing part is abutted into the inverted "V"-shaped annular crushing notch groove at the bottom of the brittle connection structure. At this time, the upper surface of the stable threaded ring plate is in contact with the lower surface of the annular bracket, and then the stable threaded ring plate is fixed to the bottom of the annular bracket by bolts;

[0026] S2. Disassembly and secondary reassembly packaging:

[0027] S21, first remove the bolts and disassemble the stabilizing threaded ring plate from the annular crushing part. At this time, the crushing structure is in a state where it can continue to be screwed in;

[0028] S22. Use the hexagonal wrench to continue screwing the bottom plate, and use the annular crushing head to apply pressure to the brittle connection structure from the annular crushing notch to break the brittle connection structure;

[0029] S23, reversely twisting the crushing structure to separate the substrate carrying the photoelectric sensor chip, which is threadedly connected to the crushing structure, from the packaging cavity;

[0030] S24, maintaining the connection state between the active crushing structure and the substrate after the current disassembly, after completing the inspection and maintenance, re-inserting the photoelectric sensor chip into the packaging cavity, maintaining the active crushing structure in a stable state, screwing the stable threaded ring plate onto the outer wall of the annular crushing part, so that the upper surface of the stable threaded ring plate fits with the lower surface of the annular bracket, and then fixing the stable threaded ring plate to the bottom of the annular bracket by bolts;

[0031] S25. Remove the dust plug and pour glue from the glue pouring port into the glue pouring channel inside the annular crushing part. The adhesive enters the annular glue distribution channel through the glue pouring channel, and is sent into the annular spacing cavity through the annular glue distribution channel and the transverse glue pouring channel. The adhesive fills the gap between the substrate, the annular crushing part and the annular bracket. After the glue is solidified, the packaging cavity is completely sealed to complete the secondary reorganization of the photoelectric sensor seal.

[0032] (III) Beneficial effects

[0033] Compared with the prior art, the present invention provides a photoelectric sensor packaging structure and a packaging method thereof, which have the following beneficial effects:

[0034] 1. The present invention sets a packaging cavity for packaging a photoelectric sensor chip between a ring bracket, a substrate and an upper cover, separates the internal and external environments of the packaging structure by adding a brittle connection structure, and forms a highly sealed packaging structure. A crushing structure is designed to crush the brittle connection structure. When the packaging structure needs to be disassembled, there is no need to disassemble the packaging component. The crushing structure can be simply twisted to separate the substrate carrying the chip from the package. While meeting the requirements of high-sealing packaging, the problem of difficult disassembly of the existing glue-fixed photoelectric sensor packaging structure is solved.

[0035] 2. The present invention is designed with a crushing structure having a secondary assembly glue-filling structure. When the photoelectric sensor is reassembled and packaged, it can cooperate with the annular spacing cavity formed between the substrate and the annular bracket, and use the glue-filling method to glue the substrate, the annular bracket and the crushing structure together, thereby realizing secondary assembly with high sealing and rapid packaging.

[0036] 3. The present invention, by threading a stable threaded ring plate on the outer wall of the crushing structure and fixing the stable threaded ring plate to the bottom of the annular bracket by bolts, can avoid the damage of the brittle connection structure caused by accidentally touching the crushing structure during use, and on the other hand, ensure the stability and strength of the packaging structure, and the packaging structure as a whole is stable and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0038] Figure 2 This is a schematic diagram of the connection structure between the substrate and the annular bracket in the present invention;

[0039] Figure 3 It is a structural schematic diagram of the crushing structure in the present invention;

[0040] Figure 4 It is a structural schematic diagram of the secondary assembly glue-filling structure in the present invention;

[0041] Figure 5 It is a schematic structural diagram of the brittle connection structure in the present invention.

[0042] In the figure: 1. substrate; 2. photoelectric sensor chip; 3. annular bracket; 4. crushing structure; 401. bottom plate; 4011. screwing hexagonal groove; 402. annular crushing part; 4021. secondary assembly glue filling structure; 40211. glue filling port; 40212. dust plug; 40213. glue filling channel; 40214. annular glue distribution channel; 40215. horizontal glue filling channel; 4022. annular crushing head; 5. wire; 6. upper cover; 7. annular spacer cavity; 8. packaging cavity; 9. brittle connection structure; 901. annular crushing cutout groove; 10. annular gap; 11. screwing gap; 12. stabilizing threaded ring plate; 13. bolt. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Example

[0045] like Figure 1-5 As shown, an embodiment of the present invention provides a photoelectric sensor packaging structure, the main structure of which includes a substrate 1, a photoelectric sensor chip 2, a ring bracket 3 and a crushing structure 4.

[0046] The photoelectric sensor chip 2 is bonded to the substrate 1, and the photoelectric sensor chip 2 is electrically connected to the circuit on the substrate 1 through the wire 5;

[0047] An annular bracket 3 is provided, the annular bracket 3 surrounds the outer position of the substrate 1, an upper cover 6 is bonded to the annular bracket 3, a packaging cavity 8 with an annular spacer cavity 7 is formed between the annular bracket 3, the upper cover 6 and the substrate 1, a brittle connection structure 9 is provided in the annular spacer cavity 7, the annular bracket 3 and the substrate 1 are connected by the brittle connection structure 9, and the photoelectric sensor chip 2 is enclosed in the packaging cavity 8; the brittle connection structure 9 is provided to connect the substrate 1 and the annular bracket 3, and the characteristics of the brittle connection structure 9 are utilized, so that when the packaging structure needs to be disassembled, only the brittle connection structure 9 needs to be broken to separate the substrate 1 and the photoelectric sensor chip 2 from the initial packaging structure.

[0048] Specifically, the brittle connection structure 9 is connected to the annular bracket 3 and the substrate 1 respectively by gluing, and the bottom of the brittle connection structure 9 is provided with an annular crushing notch 901 with an inverted "V"-shaped section; the present invention designs a brittle connection structure 9 with an annular crushing notch 901 with an inverted "V"-shaped section, and the annular crushing notch 901 is provided to facilitate the cooperation with the crushing structure 4 to crush the brittle connection structure 9, and manually twisting the brittle connection structure 9 applies upward pressure to the annular crushing notch 901, so that the brittle connection structure 9 breaks at the annular crushing notch 901, so as to achieve a rapid crushing effect, and when the brittle connection structure 9 is not broken, the packaging cavity 8 can always maintain high sealing, and while meeting the sealing requirements of the packaging structure, solves the problem that the existing adhesive packaging structure is inconvenient to disassemble and reassemble;

[0049] The crushing structure 4 is composed of a bottom plate 401 and an annular crushing part 402 installed on the outer edge of the bottom plate 401 . The inner wall of the annular crushing part 402 is threadedly connected to the outer wall of the base plate 1 . The annular crushing part 402 is used to crush the brittle connection structure 9 .

[0050] like Figure 1 and Figure 5As shown, specifically, the brittle connection structure 9 is connected to the annular bracket 3 and the base plate 1 respectively by gluing, the bottom of the brittle connection structure 9 is provided with an annular crushing notch 901 with an inverted "V"-shaped section, and the top of the annular crushing part 402 is provided with an annular crushing head 4022 adapted to the annular crushing notch 901; in order to increase the pressure of the annular crushing head 4022, when the annular crushing head 4022 is specifically designed, the section cone angle of the annular crushing head 4022 should be smaller than the section cone angle of the annular crushing notch 901, and the crushing brittleness is improved by reducing the force area and increasing the pressure. Efficiency of the connecting structure 9; on the other hand of the present invention, the distance between the bottom of the annular crushing notch 901 and the upper surface of the brittle connecting structure 9 should not be too large, otherwise the brittle connecting structure 9 will have too strong compressive resistance, but it should not be too small, otherwise the brittle connecting structure 9 will have too poor compressive resistance and will be easily damaged in actual applications. Therefore, the distance between the bottom of the annular crushing notch 901 and the upper surface of the brittle connecting structure 9 should be moderate, and the distance between the bottom of the annular crushing notch 901 and the upper surface of the brittle connecting structure 9 can be one third of the overall thickness of the brittle connecting structure 9.

[0051] In practical applications, in order to protect the photoelectric sensor from electromagnetic interference, an electromagnetic shielding layer is provided on the outer surface of the annular bracket 3 and the upper cover 6. The electromagnetic shielding layer can shield the electromagnetic waves of peripheral devices, thereby improving the electromagnetic shielding of the photoelectric sensor packaging structure.

[0052] A secondary assembly glue pouring structure 4021 is provided inside the annular crushing part 402. The secondary assembly glue pouring structure 4021 is used to cooperate with the glue pouring equipment to pour glue into the annular spacing cavity 7 when the brittle connection structure 9 is crushed by the crushing structure 4 and the photoelectric sensor chip 2 is repackaged, so as to separate the packaging cavity 8 from the external environment. The setting of the secondary assembly glue pouring structure 4021 is convenient for quickly cutting off the gap when the packaging structure is reassembled for the second time, so as to completely seal the packaging cavity 8 and ensure the sealing requirements of the packaging structure.

[0053] like Figure 1 and Figure 2As shown, an annular gap 10 is provided at the bottom of the annular spacing cavity 7 between the annular bracket 3 and the substrate 1, the upper part of the annular crushing part 402 is pre-placed in the annular gap 10, a screwing gap 11 is provided between the bottom plate 401 and the substrate 1, and a stable threaded ring plate 12 is threadedly connected to the outer wall of the lower part of the annular crushing part 402. When the brittle connection structure 9 is crushed, the pressure applied to the brittle connection structure 9 is gradually increased by screwing the crushing structure 4 and using the annular crushing part 402, so that the screwing gap 11 is gradually reduced, and finally the upper surface of the stable threaded ring plate 12 is connected to the annular bracket 3. The lower surface fits together, the brittle connection structure 9 is broken, and the substrate 1 is detached; the upper surface of the stable threaded ring plate 12 fits together with the lower surface of the annular bracket 3, and the stable threaded ring plate 12 is fixed to the bottom of the annular bracket 3 by bolts 13; the setting of the stable threaded ring plate 12 can not only improve the stability of the annular crushing part 402 pre-set inside the annular gap 10, and avoid accidental touching of the crushing structure 4 during use to cause damage to the brittle connection structure 9, but on the other hand, the setting of the stable threaded ring plate 12 indirectly enhances the connection strength between the substrate 1 and the annular bracket 3, thereby improving the stability of the packaging structure as a whole.

[0054] In some embodiments, the brittle connection structure 9 is made of glass material or ceramic material. Glass material or ceramic material is a brittle material. The compressive strength of both is much greater than the tensile strength. The ultimate strain value at the time of destruction is extremely small, and it is easy to cooperate with the crushing structure 4 to complete the crushing action.

[0055] like Figure 3 As shown, in some embodiments, a screwing hexagonal slot 4011 is provided at the bottom of the bottom plate 401 . The setting of the screwing hexagonal slot 4011 facilitates the assembly of the crushing structure 4 onto the outer edge of the base plate 1 with a hexagonal wrench.

[0056] like Figure 4As shown, in some embodiments, the secondary assembly glue pouring structure 4021 includes a glue pouring port 40211 arranged at the bottom of the annular crushing part 402, and a dust plug 40212 is arranged on the glue pouring port 40211. The arrangement of the dust plug 40212 can prevent impurities from entering the secondary assembly glue pouring structure 4021 when it is used after the primary packaging; the interior of the annular crushing part 402 is provided with a glue pouring channel 40213 connected to the glue pouring port 40211, and the top of the annular crushing part 402 is provided with an annular glue channel 40214, the glue pouring channel 40213 extends vertically upward and is connected to the annular glue channel 40214, and the interior of the annular crushing part 402 is provided with a glue pouring channel 40213. A plurality of transverse glue pouring channels 40215 extend laterally on the left and right sides corresponding to the annular glue distribution channel 40214. When the upper surface of the bottom plate 401 is in contact with the lower surface of the substrate 1, the transverse glue pouring channels 40215 are connected with the annular spacing cavity 7. When pouring glue, remove the dust plug 40212, and pour glue from the glue pouring port 40211 into the glue pouring channel 40213 inside the annular crushing part 402. The adhesive enters the annular glue distribution channel 40214 through the glue pouring channel 40213, and finally, the adhesive is sent into the annular spacing cavity 7 through the annular glue distribution channel 40214 and the transverse glue pouring channels 40215, thereby separating the packaging cavity 8 from the annular gap 10.

[0057] The present invention also provides a packaging method for a photoelectric sensor packaging structure, comprising the following steps:

[0058] S1. One-time packaging:

[0059] S11, providing a substrate 1, a photoelectric sensor chip 2, a ring bracket 3, a crushing structure 4, an upper cover 6, a brittle connection structure 9 and a stable threaded ring plate 12, bonding the photoelectric sensor chip 2 to the substrate 1, and connecting the photoelectric sensor chip 2 to the pad on the substrate 1 through a wire 5, so that the circuit of the photoelectric sensor chip 2 is connected to the circuit of the substrate 1;

[0060] S12, placing the annular bracket 3 outside the substrate 1, applying glue to the inner and outer edges of the brittle connection structure 9 and the inner and outer walls of the annular spacer cavity 7 in advance, and bonding the substrate 1 and the annular bracket 3 together through the brittle connection structure 9;

[0061] S13, fixing the upper cover 6 on the annular bracket 3, so that a closed packaging cavity 8 is formed between the annular bracket 3, the upper cover 6 and the substrate 1;

[0062] S14, threading the stabilizing threaded ring plate 12 onto the outer wall of the annular crushing portion 402 of the crushing structure 4, so that the bottom of the stabilizing threaded ring plate 12 is flush with the bottom of the annular crushing portion 402;

[0063] S15, align the annular gap 10 between the base plate 1 and the annular bracket 3 with the annular crushing part 402, use an inner hexagonal wrench to align the screwing hexagonal groove 4011 at the bottom of the bottom plate 401 and screw it, screw the annular crushing part 402 into the annular gap 10, make the annular crushing head 4022 at the top of the annular crushing part 402 abut against the inverted "V"-shaped annular crushing notch 901 at the bottom of the brittle connection structure 9, at this time, the upper surface of the stabilizing threaded ring plate 12 is in contact with the lower surface of the annular bracket 3, and then the stabilizing threaded ring plate 12 is fixed to the bottom of the annular bracket 3 by bolts 13;

[0064] S2. Disassembly and secondary reassembly packaging:

[0065] S21, first take out the bolt 13, and remove the stabilizing threaded ring plate 12 from the annular crushing part 402, at which time the crushing structure 4 is in a state where it can continue to be screwed in;

[0066] S22, using the hexagonal wrench, continue to screw the bottom plate 401, and use the annular crushing head 4022 to apply pressure to the brittle connection structure 9 from the annular crushing notch 901 to destroy it, so that the brittle connection structure 9 breaks and breaks;

[0067] S23, reversely twisting the crushing structure 4 to separate the substrate 1 carrying the photoelectric sensor chip 2 which is threadedly connected to the crushing structure 4 from the packaging cavity 8;

[0068] S24, maintaining the connection state between the active crushing structure 4 and the substrate 1 after the current disassembly, after completing the inspection and maintenance, the photoelectric sensor chip 2 is put back into the packaging cavity 8, maintaining the active crushing structure 4 in a stable state, screwing the stable threaded ring plate 12 onto the outer wall of the annular crushing part 402, so that the upper surface of the stable threaded ring plate 12 is in contact with the lower surface of the annular bracket 3, and then fixing the stable threaded ring plate 12 to the bottom of the annular bracket 3 by bolts 13;

[0069] S25. Remove the dust plug 40212, and pour glue from the glue filling port 40211 into the glue filling channel 40213 inside the annular crushing part 402. The adhesive enters the annular glue distribution channel 40214 through the glue filling channel 40213, and is sent into the annular spacing cavity 7 through the annular glue distribution channel 40214 and the transverse glue filling channel 40215. The adhesive fills the gap between the substrate 1, the annular crushing part 402 and the annular bracket 3. After the glue is solidified, the packaging cavity 8 is completely sealed to complete the secondary reorganization of the photoelectric sensor seal.

[0070] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A photoelectric sensor packaging structure, Features: The photoelectric sensor packaging structure comprises: base(1); A photoelectric sensor chip (2), wherein the photoelectric sensor chip (2) is bonded to the substrate (1), and the photoelectric sensor chip (2) is electrically connected to a circuit on the substrate (1) via a wire (5); An annular support (3), the annular support (3) surrounds the outer periphery of the substrate (1), an upper cover (6) is bonded to the annular support (3), a packaging cavity (8) having an annular spacer cavity (7) is formed between the annular support (3), the upper cover (6) and the substrate (1), a brittle connection structure (9) is provided in the annular spacer cavity (7), the annular support (3) and the substrate (1) are connected via the brittle connection structure (9), and the photoelectric sensor chip (2) is enclosed in the packaging cavity (8); A crushing structure (4), wherein the crushing structure (4) is composed of a bottom plate (401) and an annular crushing portion (402) mounted on the outer edge of the bottom plate (401), wherein the inner side wall of the annular crushing portion (402) is threadedly connected to the outer wall of the substrate (1), and the annular crushing portion (402) is used to crush the brittle connection structure (9). A secondary assembly glue pouring structure (4021) is provided inside the annular crushing portion (402). The secondary assembly glue pouring structure (4021) is used to pour glue into the inside of the annular spacer cavity (7) in cooperation with a glue pouring device when the brittle connection structure (9) is crushed by the crushing structure (4) and the photoelectric sensor chip (2) is repackaged, thereby isolating the packaging cavity (8) from the external environment; An annular gap (10) is provided at the bottom of the annular spacing cavity (7) corresponding to the annular bracket (3) and the base plate (1); the upper part of the annular crushing part (402) is pre-placed inside the annular gap (10); a screwing gap (11) is provided between the bottom plate (401) and the base plate (1); a stabilizing threaded ring plate (12) is threadedly connected to the outer wall of the lower part of the annular crushing part (402); the upper surface of the stabilizing threaded ring plate (12) is in contact with the lower surface of the annular bracket (3); and the stabilizing threaded ring plate (12) is fixed to the bottom of the annular bracket (3) by bolts (13).

2. The photoelectric sensor packaging structure according to claim 1, Features: The brittle connection structure (9) is made of glass material or ceramic material.

3. The photoelectric sensor packaging structure according to claim 1, Features: The brittle connection structure (9) is connected to the annular support (3) and the base plate (1) respectively by gluing, the bottom of the brittle connection structure (9) is provided with an annular crushing notch groove (901) with an inverted "V"-shaped cross section, and the top of the annular crushing part (402) is provided with an annular crushing head (4022) adapted to the annular crushing notch groove (901).

4. The photoelectric sensor packaging structure according to claim 1, Features: The bottom of the bottom plate (401) is provided with a screwing hexagonal slot (4011).

5. The photoelectric sensor packaging structure according to claim 1, Features: The secondary assembly glue injection structure (4021) comprises a glue injection port (40211) arranged at the bottom of the annular crushing part (402), a dust plug (40212) is provided on the glue injection port (40211), a glue injection channel (40213) connected to the glue injection port (40211) is provided inside the annular crushing part (402), an annular glue channel (40214) is provided inside the top of the annular crushing part (402), the glue injection channel (40213) extends vertically upward and is connected to the annular glue channel (40214), a plurality of transverse glue injection channels (40215) extend transversely on the left and right sides of the annular glue channel (40214) inside the annular crushing part (402), and when the upper surface of the bottom plate (401) is in contact with the lower surface of the base plate (1), the transverse glue injection channel (40215) is connected to the annular spacing cavity (7).

6. A packaging method for a photoelectric sensor packaging structure according to any one of claims 1 to 5, Features: The following steps are involved: S1. One-time packaging: S11, providing a substrate (1), a photoelectric sensor chip (2), a ring bracket (3), a crushing structure (4), an upper cover (6), a brittle connection structure (9) and a stabilizing threaded ring plate (12), bonding the photoelectric sensor chip (2) to the substrate (1), and connecting the photoelectric sensor chip (2) to the pad on the substrate (1) through a wire (5), so that the circuit of the photoelectric sensor chip (2) is connected to the circuit of the substrate (1); S12, placing the annular support (3) outside the substrate (1), applying glue to the inner and outer edges of the brittle connection structure (9) and the inner and outer walls of the annular spacer cavity (7) in advance, and bonding the substrate (1) and the annular support (3) together through the brittle connection structure (9); S13, fixing the upper cover (6) on the annular support (3) so that a closed packaging cavity (8) is formed between the annular support (3), the upper cover (6) and the substrate (1); S14, threading the stabilizing threaded ring plate (12) onto the outer wall of the annular crushing portion (402) of the crushing structure (4), so that the bottom of the stabilizing threaded ring plate (12) is flush with the bottom of the annular crushing portion (402); S15, align the annular gap (10) between the base plate (1) and the annular bracket (3) with the annular crushing part (402) up and down, use an inner hexagonal wrench to align with the screwing hexagonal groove (4011) at the bottom of the base plate (401) and screw it, screw the annular crushing part (402) into the annular gap (10), make the annular crushing head (4022) at the top of the annular crushing part (402) abut against the inverted "V"-shaped annular crushing notch groove (901) at the bottom of the brittle connection structure (9), at this time, the upper surface of the stabilizing threaded ring plate (12) is in contact with the lower surface of the annular bracket (3), and then fix the stabilizing threaded ring plate (12) to the bottom of the annular bracket (3) by bolts (13); S2. Disassembly and secondary reassembly packaging: S21, firstly, take out the bolts (13), and disassemble the stabilizing threaded ring plate (12) from the annular crushing part (402), at which time the crushing structure (4) is in a state where it can continue to be screwed in; S22, using the hexagonal wrench, continue to screw the bottom plate (401), and use the annular crushing head (4022) to apply pressure to the brittle connection structure (9) from the annular crushing notch (901) to destroy it, so that the brittle connection structure (9) breaks and breaks; S23, twisting the crushing structure (4) in the reverse direction to separate the substrate (1) carrying the photoelectric sensor chip (2) which is threadedly connected to the crushing structure (4) from the packaging cavity (8); S24, maintaining the connection state between the active crushing structure (4) and the substrate (1) after the current disassembly, after completing the inspection and maintenance, the photoelectric sensor chip (2) is re-entered into the packaging cavity (8), the active crushing structure (4) is maintained in a stable state, and the stable threaded ring plate (12) is screwed onto the outer wall of the annular crushing part (402), so that the upper surface of the stable threaded ring plate (12) is in contact with the lower surface of the annular bracket (3), and then the stable threaded ring plate (12) is fixed to the bottom of the annular bracket (3) by bolts (13); S25, remove the dust plug (40212), and pour glue from the glue pouring port (40211) into the glue pouring channel (40213) inside the annular crushing part (402). The adhesive enters the annular glue distribution channel (40214) through the glue pouring channel (40213), and is sent into the annular spacing cavity (7) through the annular glue distribution channel (40214) and the transverse glue pouring channel (40215). The adhesive fills the gap between the substrate (1), the annular crushing part (402) and the annular bracket (3). After the glue is solidified, the packaging cavity (8) is completely sealed, and the secondary reorganization photoelectric sensor is sealed.

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