A communication device for opto-mechanical-electrical engineering equipment based on high stability

Abstract

The application belongs to the technical field of communication equipment, and particularly relates to a communication equipment based on high-stability opto-mechanical-electrical engineering equipment, which comprises a communication module, a recess is formed on one side of the front face of the communication module, a main communication socket strip and a branch communication socket strip are fixedly installed at both ends of one side of the recess respectively, a wire fixing mechanism is fixedly connected to the other side of the recess, a cavity is formed in the inside of an upper clamping plate, a penetrating hole is formed at both ends of the bottom of the cavity, lead screws are rotatably connected to both sides of the inner cavity of a lower clamping plate, sleeves are threadedly connected to the surfaces of the lead screws, a top rod is fixedly connected to the lower clamping plate through the penetrating slot, a heat dissipation mechanism is embedded on one side of the communication module, a heat dissipation fan, heat dissipation fins, a semiconductor refrigeration sheet and a heat-conducting aluminum sheet are fixedly connected in the inner cavity of a mounting cylinder from top to bottom in sequence, and a temperature control switch is fixedly installed on one side of the bottom of the heat-conducting aluminum sheet; the application is favorable for preventing the cable from being pulled off by external force and affecting the stability of the communication of the opto-mechanical-electrical engineering equipment.

Description

Technical Field

[0001] This invention relates to the field of communication equipment technology, specifically a communication device based on highly stable opto-mechatronics engineering equipment. Background Technology

[0002] Opto-mechatronics (OME) engineering equipment is a high-tech product that integrates optics, mechanics, microelectronics, automatic control and communication technologies. It has a wealth of functions and high added value. Looking at modern instruments and equipment today, many OME technologies have been integrated into them and play an important role. Therefore, OME technology will be the mainstay of the ever-changing technological updates.

[0003] Opto-mechatronics engineering equipment mainly uses PLC communication modules to achieve communication between various devices and sensors. A current Chinese invention, CN211791549U, discloses a signal controller communication module, comprising a module body. A digital tube, a communication controller mainboard module, a push-button switch, and a signal antenna are fixedly connected to the upper outer surface of the module body. The digital tube is located on one side of the communication controller mainboard module, the signal antenna is located at the front end of the communication controller mainboard module, and the push-button switch is located on one side of the signal antenna. A power strip is fixedly connected to one side of the module body, facilitating better signal control, enabling remote wireless communication, making control more convenient and easier to use. It also facilitates better device positioning, reduces the risk of loosening, has a certain vibration reduction effect, increases anti-static performance, and brings better application prospects.

[0004] In the application of opto-mechatronics engineering equipment communication, this communication module mainly achieves communication between various devices through the cooperation of power strips and cables. After the cable is inserted into the power strip of the communication module, if the cable is pulled by an external force, it will cause the cable to detach from the power strip, interrupting the communication between devices and thus affecting the stability of opto-mechatronics engineering equipment communication. In addition, the communication module generates heat during operation, and if heat dissipation is not carried out in time, it will also affect the lifespan of the electronic components inside the module. Therefore, to address the above problems, a communication device for opto-mechatronics engineering equipment based on high stability is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a communication device for opto-mechatronics engineering equipment based on high stability, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a communication device for high-stability opto-mechatronics engineering equipment, comprising a communication module. A groove is formed on one side of the front of the communication module. A main communication connector and a secondary communication connector are fixedly installed at both ends of one side of the groove. A wire-fixing mechanism is fixedly connected to the other side of the groove. The wire-fixing mechanism includes an upper clamping plate and a lower clamping plate. A cavity is formed inside the upper clamping plate. Through holes are formed at both ends of the bottom of the cavity. Lead screws are rotatably connected to both sides of the inner cavity of the lower clamping plate. A sleeve is threaded onto the surface of the lead screw. A top rod is fixedly connected to both sides of the sleeve. The bottom of the top rod passes through the through hole and is fixedly connected to the lower clamping plate. A heat dissipation mechanism is embedded on one side of the communication module. The heat dissipation mechanism includes an mounting cylinder, a cooling fan, a semiconductor cooling chip, and a temperature control switch. A cooling fan, heat dissipation fins, a semiconductor cooling chip, and a thermally conductive aluminum sheet are fixedly connected sequentially from top to bottom inside the mounting cylinder. A temperature control switch is fixedly installed on one side of the bottom of the thermally conductive aluminum sheet.

[0007] Furthermore, a synchronous pulley is sleeved on the top of the lead screw, and the two synchronous pulleys are connected by a synchronous belt drive. One end of the lead screw away from the lower clamping plate passes through the upper clamping plate and is fixedly connected to a knob.

[0008] Furthermore, three first arc-shaped grooves are provided at one end of the upper clamping plate and the lower clamping plate on opposite sides, and two second arc-shaped grooves are provided at the other end of the upper clamping plate and the lower clamping plate on opposite sides.

[0009] Furthermore, the top and bottom of the semiconductor refrigeration chip are bonded to the bottom of the heat dissipation fins and the top of the semiconductor refrigeration chip respectively using thermally conductive silicone.

[0010] Furthermore, a filter screen is snapped onto one end of the mounting cylinder near the cooling fan, and the bottom end of the thermally conductive aluminum sheet is located inside the communication module.

[0011] Furthermore, both the cooling fan and the semiconductor cooling chip are electrically connected to an external power supply via a temperature control switch.

[0012] The advantages of this invention are:

[0013] 1. The present invention places the cable into the inner cavity of the second arc-shaped groove and the first arc-shaped groove, and then the rotation of the lead screw drives the sleeve to move upward. The upward movement of the sleeve causes the upper clamping plate to gradually move closer to the lower clamping plate to clamp and fix the cable, thereby preventing the cable from being pulled off by external force and affecting the stability of the communication of opto-mechatronic engineering equipment.

[0014] 2. This invention controls the operation of the cooling fan and the thermoelectric cooler by using a temperature control switch. The heat-conducting aluminum sheet conducts the heat from the communication module to the cooling end of the thermoelectric cooler for heat exchange, thereby reducing the temperature inside the communication module and preventing excessive heat inside the communication module from affecting its service life. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a three-dimensional structural schematic diagram of the wire-fixing mechanism of the present invention;

[0018] Figure 3 This is a cross-sectional view of the wire fixing mechanism of the present invention;

[0019] Figure 4 This is a side view of the present invention;

[0020] Figure 5 This is a cross-sectional view of the heat dissipation mechanism of the present invention.

[0021] In the diagram: 1. Communication module; 2. Groove; 3. Main communication connector; 4. Sub-communication connector; 5. Wire fixing mechanism; 6. Upper clamping plate; 7. Lower clamping plate; 8. Through hole; 9. Lead screw; 10. Sleeve; 11. Top rod; 12. Knob; 13. Synchronous pulley; 14. Synchronous belt; 15. First arc groove; 16. Second arc groove; 17. Heat dissipation mechanism; 18. Cavity; 19. Mounting cylinder; 20. Cooling fan; 21. Heat dissipation fins; 22. Semiconductor cooling chip; 23. Thermally conductive aluminum sheet; 24. Temperature control switch; 25. Filter. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] This invention provides a technical solution: a communication device for high-stability opto-mechatronics engineering equipment, such as... Figure 1-5As shown, the device includes a communication module 1. A groove 2 is formed on one side of the front of the communication module 1. A main communication connector 3 and a secondary communication connector 4 are fixedly installed at both ends of one side of the groove 2, respectively. A wire-fixing mechanism 5 is fixedly connected to the other side of the groove 2. The wire-fixing mechanism 5 includes an upper clamping plate 6 and a lower clamping plate 7. A cavity 18 is formed inside the upper clamping plate 6. Through holes 8 are formed at both ends of the bottom of the cavity 18. Lead screws 9 are rotatably connected to both sides of the inner cavity of the lower clamping plate 7. A sleeve 10 is threadedly connected to the surface of the lead screw 9. Both sides of the communication module 1 are fixedly connected with top rods 11. The bottom of the top rods 11 passes through the insertion hole 8 and is fixedly connected to the lower clamping plate 7. A heat dissipation mechanism 17 is embedded on one side of the communication module 1. The heat dissipation mechanism 17 includes a mounting cylinder 19, a cooling fan 20, a semiconductor cooling chip 22 and a temperature control switch 24. The inner cavity of the mounting cylinder 19 is fixedly connected from top to bottom to a cooling fan 20, a heat dissipation fin 21, a semiconductor cooling chip 22 and a thermally conductive aluminum sheet 23. A temperature control switch 24 is fixedly installed on one side of the bottom of the thermally conductive aluminum sheet 23.

[0024] like Figure 3 As shown, a synchronous pulley 13 is sleeved on the top of the lead screw 9, and the two synchronous pulleys 13 are connected by a synchronous belt 14. One end of the lead screw 9 away from the lower clamping plate 7 passes through the upper clamping plate 6 and is fixedly connected to a knob 12. The rotation of the knob 12 drives the rotation of one of the lead screws 9. The two lead screws 9 are connected by a synchronous pulley 13 and a synchronous belt 14, thereby realizing the synchronous rotation of the two lead screws 9.

[0025] like Figure 2 and Figure 3 As shown, three first arc-shaped grooves 15 are provided at one end of the upper clamping plate 6 and the lower clamping plate 7 on opposite sides, and two second arc-shaped grooves 16 are provided at the other end of the upper clamping plate 6 and the lower clamping plate 7 on opposite sides. The main cable and the branch cable in the opto-mechatronics engineering equipment are passed through the second arc-shaped grooves 16 and the first arc-shaped grooves 15 respectively and then connected to the main communication plug 3 and the branch communication plug 4. The cables are clamped by the second arc-shaped grooves 16 and the first arc-shaped grooves 15.

[0026] like Figure 5 As shown, the top and bottom of the thermoelectric cooler 22 are bonded to the bottom of the heat sink fins 21 and the top of the thermoelectric cooler 22 respectively by thermally conductive silicone. The thermally conductive aluminum sheet 23 conducts the heat of the communication module 1 to the cooling end of the thermoelectric cooler 22 for heat exchange, reducing the temperature inside the communication module 1 and preventing excessive heat inside the communication module 1 from affecting its service life. The heat from the heating end of the thermoelectric cooler 22 is conducted to the heat sink fins 21, and then the cooling fan 20 performs air cooling to improve the heat dissipation efficiency.

[0027] like Figure 5As shown, a filter screen 25 is attached to one end of the mounting cylinder 19 near the cooling fan 20. The bottom end of the thermally conductive aluminum sheet 23 is located in the inner cavity of the communication module 1. The filter screen 25 is used to filter impurities in the air. The thermally conductive aluminum sheet 23 conducts the heat of the communication module 1 to the cooling end of the semiconductor cooling chip 22 for heat exchange.

[0028] like Figure 5 As shown, the cooling fan 20 and the thermoelectric cooler 22 are both electrically connected to an external power supply through a temperature control switch 24. When the communication module 1 is working and the temperature inside the communication module 1 reaches the temperature set by the temperature control switch 24, the temperature control switch 24 controls the operation of the cooling fan 20 and the thermoelectric cooler 22.

[0029] The working principle of this invention is as follows: First, the main cable and the branch cable in the opto-mechatronics engineering equipment are passed through the second arc-shaped groove 16 and the first arc-shaped groove 15 respectively, and then connected to the main communication socket 3 and the branch communication socket 4. Then, the knob 12 is rotated, which drives one of the lead screws 9 to rotate. The two lead screws 9 are connected by a synchronous pulley 13 and a synchronous belt 14, thereby realizing the synchronous rotation of the two lead screws 9. The rotation of the lead screw 9 drives the sleeve 10 to move upward. The upward movement of the sleeve 10 causes the upper clamping plate 6 to gradually move closer to the lower clamping plate 7 to clamp and fix the cable, thereby preventing the cable from being pulled off by external force. This affects the stability of communication in opto-mechatronics engineering equipment. When the communication module 1 operates and the temperature inside the communication module 1 reaches the temperature set by the temperature control switch 24, the temperature control switch 24 controls the operation of the cooling fan 20 and the thermoelectric cooler 22. The heat-conducting aluminum sheet 23 conducts the heat from the communication module 1 to the cooling end of the thermoelectric cooler 22 for heat exchange, reducing the temperature inside the communication module 1 and preventing excessive heat inside the communication module 1 from affecting its service life. The heat from the heating end of the thermoelectric cooler 22 is conducted to the heat dissipation fins 21, and then the cooling fan 20 performs air cooling to improve the efficiency of heat dissipation.

[0030] The advantages of this invention are:

[0031] 1. The present invention places the cable into the inner cavity of the second arc-shaped groove and the first arc-shaped groove, and then the rotation of the lead screw drives the sleeve to move upward. The upward movement of the sleeve causes the upper clamping plate to gradually move closer to the lower clamping plate to clamp and fix the cable, thereby preventing the cable from being pulled off by external force and affecting the stability of the communication of opto-mechatronic engineering equipment.

[0032] 2. This invention controls the operation of the cooling fan and the thermoelectric cooler by using a temperature control switch. The heat-conducting aluminum sheet conducts the heat from the communication module to the cooling end of the thermoelectric cooler for heat exchange, thereby reducing the temperature inside the communication module and preventing excessive heat inside the communication module from affecting its service life.

[0033] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A communication device for optomechanical engineering equipment based on high stability, characterized by: The utility model relates to a communication module, which comprises a communication module (1), a recess (2) is formed on one side of the front face of the communication module (1), a main communication socket (3) and a branch communication socket (4) are fixedly installed at both ends of one side of the recess (2), a wire fixing mechanism (5) is fixedly connected to the other side of the recess (2), the wire fixing mechanism (5) comprises an upper clamping plate (6) and a lower clamping plate (7), a cavity (18) is formed in the inner part of the upper clamping plate (6), a through hole (8) is formed at both ends of the bottom of the cavity (18), a screw rod (9) is rotatably connected to both sides of the inner cavity of the lower clamping plate (7), a sleeve (10) is screw-connected to the surface of the screw rod (9), a top rod (11) is fixedly connected to both sides of the sleeve (10), the bottom of the top rod (11) is fixedly connected to the lower clamping plate (7) through the through hole (8), and a heat dissipation mechanism (17) is embedded on one side of the communication module (1). The heat dissipation mechanism (17) comprises an installation cylinder (19), a heat dissipation fan (20), a semiconductor refrigeration sheet (22) and a temperature control switch (24), the inner cavity of the installation cylinder (19) is sequentially fixedly connected from top to bottom with the heat dissipation fan (20), heat dissipation fins (21), the semiconductor refrigeration sheet (22) and a heat-conducting aluminum sheet (23), the top of the screw rod (9) is sleeved with a synchronous wheel (13), two synchronous wheels (13) are drivingly connected through a synchronous belt (14), one end of the screw rod (9) away from the lower clamping plate (7) is fixedly connected with a rotating knob (12) through the upper clamping plate (6), first arc-shaped grooves (15) are formed at one end of opposite sides of the upper clamping plate (6) and the lower clamping plate (7), second arc-shaped grooves (16) are formed at the other end of opposite sides of the upper clamping plate (6) and the lower clamping plate (7), and the top and the bottom of the semiconductor refrigeration sheet (22) are respectively bonded to the bottom of the heat dissipation fin (21) and the top of the heat-conducting aluminum sheet (23) through heat-conducting silica gel. During operation, the rotation of the rotating knob (12) drives the rotation of one screw rod (9) connected thereto, the rotating screw rod (9) drives the synchronous rotation of the other screw rod (9) through the synchronous wheel (13) and the synchronous belt (14), and the rotation of the screw rod (9) drives the upward movement of the sleeve (10), which makes the upper clamping plate (6) gradually approach the lower clamping plate (7) to clamp and fix the cable.

2. A communication device for opto-mechanical-electrical engineering equipment based on high stability according to claim 1, characterized in that: A filter screen (25) is clamped to one end of the installation cylinder (19) close to the heat dissipation fan (20).

3. A communication device for opto-mechanical-electrical engineering equipment based on high stability according to claim 2, characterized in that: The bottom end of the heat-conducting aluminum sheet (23) is located in the inner cavity of the communication module (1).

4. The communication device for optomechatronics based on high stability according to claim 3, characterized in that: A temperature control switch (24) is fixedly installed on one side of the bottom of the heat-conducting aluminum sheet (23).

5. A communication device for opto-mechanical-electrical engineering equipment based on high stability according to claim 4, characterized in that: The heat dissipation fan (20) and the semiconductor refrigeration sheet (22) are electrically connected to an external power supply through the temperature control switch (24).

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