Display module and display device

Abstract

The present application provides a display module and a display device. The display module includes a display panel, a circuit board, and a wiring board. The display panel has a plurality of first bonding terminals, and the plurality of first bonding terminals are arranged along a first direction. The circuit board has a plurality of second bonding terminals, at least two of the second bonding terminals are arranged along the first direction, and at least two of the second bonding terminals are arranged along a second direction, and the first direction intersects the second direction. The wiring board includes a plurality of connection lines, and the connection lines electrically connect the first bonding terminals and the second bonding terminals. In the display module and the display device provided by the embodiments of the present application, the size of the circuit board along the first direction can be less than or equal to the size of the display panel along the first direction, reserving sufficient space for the bonding connection of the circuit board, which is beneficial to reducing the size of the display module along the first direction.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display module and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) display panels have the advantages of simple structure, fast response speed, active light emission, low power consumption, etc., and have been widely used in the display fields of electronic devices such as mobile phones, tablet computers, and televisions.

[0003] A display panel is usually electrically connected to a circuit board through a circuit board. The circuit board transmits a control signal to the display panel through the circuit board, or the circuit board receives an electrical signal from the display panel through the circuit board. In related technologies, the size of the circuit board is larger than that of the display panel. During the process of bonding and connecting the circuit board and the display panel, there is a problem of insufficient bonding space for the circuit board. Thus, it is not conducive to reducing the size of the display module. Summary of the Invention

[0004] This application provides a display module and a display device to solve the problem of insufficient bonding space for the circuit board, which is conducive to reducing the size of the display module.

[0005] In a first aspect, the display module provided in an embodiment of this application includes a display panel, a circuit board, and a circuit board; the display panel has a plurality of first bonding terminals, and the plurality of first bonding terminals are arranged along a first direction; the circuit board has a plurality of second bonding terminals, at least two of the second bonding terminals are arranged along the first direction, at least two of the second bonding terminals are arranged along a second direction, and the first direction intersects the second direction; the circuit board includes a plurality of connection lines, and the connection lines electrically connect the first bonding terminals and the second bonding terminals.

[0006] In some embodiments, the plurality of second bonding terminals are arranged in multiple rows along the first direction, and adjacent rows of second bonding terminals are spaced apart along the second direction.

[0007] In some embodiments, there is a first gap between two adjacent second bonding terminals in the same row, and at least a part of the orthographic projection of at least some of the second bonding terminals in one row along the second direction falls into the first gap between adjacent rows of second bonding terminals.

[0008] In some embodiments, the connection lines include first connection lines and second connection lines. The first connection lines and the second connection lines electrically connect adjacent rows of second bonding terminals along the second direction, and the orthographic projections of the first connection lines and the second connection lines along the second direction are alternately arranged along the first direction.

[0009] In some embodiments, the circuit board includes a first wiring layer and a second wiring layer arranged in a stacked manner. The first connection line is disposed on the first wiring layer, and the second connection line is disposed on the second wiring layer.

[0010] In some embodiments, the first wiring layer is located on the side of the second wiring layer closer to the circuit board. The first wiring layer has a first via hole, and the second connection line passes through the first via hole.

[0011] In some embodiments, a plurality of second bonding terminals are arranged in the same layer.

[0012] In some embodiments, the circuit board includes a first sub-layer and a second sub-layer arranged in a stacked manner along a second direction. The circuit board is disposed on the side of the second sub-layer facing away from the first sub-layer. The second sub-layer is provided with a second via hole. One of the adjacent two rows of second bonding terminals is disposed on the first sub-layer and exposed through the second via hole, and the other row is disposed on the second sub-layer.

[0013] In some embodiments, the circuit board includes a first connection terminal and a second connection terminal connected to a plurality of connection lines. The first connection terminal is connected to the second bonding terminal located on the first sub-layer, and the second connection terminal is connected to the second bonding terminal located on the second sub-layer. Along the second direction, the absolute value of the difference between the distance between the first connection terminal and the second bonding terminal on the first sub-layer and the distance between the second connection terminal and the second bonding terminal on the second sub-layer is less than or equal to 50 μm.

[0014] In some embodiments, the distance between the first connection terminal and the second bonding terminal on the first sub-layer is equal to the distance between the second connection terminal and the second bonding terminal on the second sub-layer.

[0015] In some embodiments, the display panel includes a substrate layer and a functional layer arranged in a stacked manner. The first bonding terminal is formed on the functional layer.

[0016] In some embodiments, the functional layer includes a touch electrode, and the touch electrode is electrically connected to the first bonding terminal.

[0017] In some embodiments, the functional layer includes a display unit, and the display unit is electrically connected to the first bonding terminal.

[0018] In a second aspect, an embodiment of the present application provides a display device, including the display module provided in any one of the above embodiments.

[0019] The display module and the display device provided by the embodiments of the present application are provided with second bonding terminals that include both a part arranged along a first direction and a part arranged along a second direction, which can save the space occupied by the second bonding terminals along the first direction, so that the size of the circuit board along the first direction can be less than or equal to the size of the display panel along the first direction, leaving enough space for the bonding connection of the circuit board, which is beneficial to reducing the size of the display module along the first direction. Brief Description of the Drawings

[0020] The features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the accompanying drawings. In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale.

[0021] Figure 1 A top view schematic diagram of a display module provided by an embodiment of the present application;

[0022] Figure 2 is Figure 1 A cross-sectional schematic diagram taken along A-A;

[0023] Figure 3 A top view schematic diagram of another display module provided by an embodiment of the present application;

[0024] Figure 4 is Figure 3 A cross-sectional structural schematic diagram taken along B-B with some structures omitted;

[0025] Figure 5 is Figure 3 A cross-sectional structural schematic diagram taken along B-B;

[0026] Figure 6 is Figure 1 A cross-sectional schematic diagram taken along C-C.

[0027] In the drawings, the drawings are not necessarily drawn to scale.

[0028] Description of Reference Numerals:

[0029] 100, display module;

[0030] 110, display panel; 111, first bonding terminal; 112, substrate layer; 113, functional layer;

[0031] 120, circuit board; 121, second bonding terminal; 121a, first gap; 122, first sub-layer; 123, second sub-layer; 123a, second via;

[0032] 130, wiring board; 131, connection line; 1311, first connection line; 1312, second connection line; 132, first wiring layer; 132a, first via; 133, second wiring layer; 134, first connection terminal; 135, second connection terminal;

[0033] 140, anisotropic conductive adhesive;

[0034] X, first direction; Y, second direction. Detailed Description of the Embodiments

[0035] Aspects and exemplary embodiments of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely provided to provide a better understanding of the present application by showing examples of the present application. In the drawings and the following description, at least some of the well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the present application; and, for clarity, the dimensions of some structures may be exaggerated. In addition, the features, structures, or characteristics described hereinafter may be combined in any suitable manner in one or more embodiments.

[0036] In addition, for the sake of understanding and easy description, the dimensions and thicknesses of each configuration shown in the figures are arbitrarily shown, but the concept of the present application is not limited thereto. In the figures, the thicknesses of layers, films, panels, regions, etc. are enlarged for clarity. In the figures, the thicknesses of some layers and regions are enlarged for better understanding and easy description.

[0037] It can be understood that when an element such as a layer, a film, a region, or a substrate is described as "on" another element, the element can be directly on the other element, or there may also be an intermediate element. In contrast, when an element is described as "directly on" another element, there is no intermediate element. In addition, throughout the specification, the phrase "on" a target element means positioned above or below the target element, and does not necessarily mean positioned "at the upper side" based on the direction of gravity.

[0038] In addition, unless expressly stated to the contrary, the word "comprising" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0039] On electronic devices such as mobile phones and tablet computers, structures such as light-emitting elements on the display panel usually need to be connected to a circuit board to control the normal operation of the light-emitting elements, or to transfer the electrical signals of structures such as light-emitting elements to the circuit board so that the circuit board controls the operation of related components. The circuit board can be a driving circuit board. As the number of related functions such as touch control and display integrated on the display panel increases, the number of lines that need to be connected to the circuit board on the display panel increases, and the number of bonding terminals on the circuit board and the display panel also increases.

[0040] In the related art, the number of first bonding terminals on the display panel is the same as that of second bonding terminals on the circuit board. However, due to the limitation of the manufacturing process of the bonding terminals, the pitch of the second bonding terminals on the circuit board is greater than that of the first bonding terminals on the display panel. The second bonding terminals on the circuit board and the first bonding terminals on the display panel are usually arranged in the same direction. Thus, it is easy to cause the size of the circuit board in the arrangement direction of the second bonding terminals to be greater than the size of the display panel. During the bonding connection process of the circuit board and the display panel, there is a problem of insufficient bonding space on the circuit board, which is not conducive to reducing the size of the display module.

[0041] In view of this, embodiments of the present application provide a display module and a display device. The embodiments of the display module and the display device will be described below with reference to the accompanying drawings.

[0042] Embodiments of the present application provide a display module, which may be an Organic Light Emitting Diode (OLED) display module.

[0043] As Figure 1 shown, the display module 100 provided by the embodiments of the present application includes a display panel 110, a circuit board 120, and a wiring board 130. The display panel 110 has a plurality of first bonding terminals 111, and the plurality of first bonding terminals 111 are arranged along a first direction X. The circuit board 120 has a plurality of second bonding terminals 121, at least two second bonding terminals 121 are arranged along the first direction X, and at least two second bonding terminals 121 are arranged along a second direction Y, and the first direction X intersects with the second direction Y. The wiring board 130 includes a plurality of connection lines 131, and the connection lines 131 electrically connect the first bonding terminals 111 and the second bonding terminals 121.

[0044] The display panel 110 may have a light-emitting element and a driving circuit for driving the light-emitting element, such as a thin-film transistor. The first bonding terminal 111 may be connected to the driving circuit of the light-emitting element of the display panel 110. Thus, a driving signal can be provided to the driving circuit of the light-emitting element through the circuit board 120 to drive the corresponding light-emitting element to emit light. The display panel 110 may further have a touch layer, and the touch layer includes a plurality of touch electrodes to implement the touch function of the display panel 110. The first bonding terminal 111 may be connected to the touch electrode to send an electrical signal to the touch electrode or receive an electrical signal emitted by the touch electrode, facilitating the realization of a normal touch function.

[0045] A plurality of first bonding terminals 111 are arranged along a first direction X. The plurality of first bonding terminals 111 can be arranged at intervals along the first direction X, or the plurality of first bonding terminals 111 can be adjacent to each other and insulated along the first direction X. The first direction X can be the length direction of the display panel 110. Of course, the first direction X can also be the width direction of the display panel 110. The first bonding terminals 111 can be arranged only along the first direction X, or the first bonding terminals 111 are arranged both along the first direction X and along a second direction Y.

[0046] At least two second bonding terminals 121 are arranged along the first direction X, and at least two second bonding terminals 121 are arranged along the second direction Y. Then, at least some of the plurality of second bonding terminals 121 can be arranged in a matrix form along both the first direction X and the second direction Y, or a part of the plurality of second bonding terminals 121 can be arranged in a matrix form along the first direction X and the second direction Y, and the remaining part can be arranged only along the first direction X, or only along the second direction Y. Of course, the remaining part can also be arranged irregularly.

[0047] The second direction Y intersects with the first direction X, and the included angle between the second direction Y and the first direction X can be a right angle or an acute angle. Exemplarily, the second direction Y can be perpendicular to the first direction X.

[0048] The first direction X can be a direction parallel to the display surface of the display panel 110, then the second direction Y is a direction parallel to the display surface, or the second direction Y can also be a direction intersecting the display surface. Exemplarily, the second direction Y can be perpendicular to the display surface. Of course, the second direction Y can also include both a direction parallel to the display surface and a direction intersecting the display surface.

[0049] In an embodiment where the second direction Y is parallel to the display surface, the first direction X and the second direction Y can be located in the same plane. Correspondingly, the plurality of second bonding terminals 121 are arranged on the same layer of the circuit board 120. In an embodiment where the second direction Y intersects with the display surface, the second direction Y and the first direction X are not located in the same plane. Correspondingly, the plurality of second bonding terminals 121 are located on different layers of the circuit board 120 along the second direction Y. In an embodiment where the second direction Y includes both a direction parallel to the display surface and a direction intersecting the display surface, the plurality of second bonding terminals 121 on the circuit board 120 can be located on different layers along a direction perpendicular to the display surface, and in the direction parallel to the display surface, they are arranged both along the first direction X and along a direction intersecting the first direction X.

[0050] A plurality of first bonding terminals 111 can be arranged at equal intervals along the first direction X, or can be arranged at unequal intervals along the first direction X according to actual needs. Similarly, a plurality of second bonding terminals 121 can be arranged at equal intervals along the first direction X and the second direction Y, or can be arranged at unequal intervals along the second direction Y and the first direction X respectively. Exemplarily, in an embodiment where the second direction Y is perpendicular to the first direction X and parallel to the display surface, a plurality of second bonding terminals 121 can be arranged in an array along the first direction X and the second direction Y, or can be arranged irregularly along the first direction X and the second direction Y respectively, and can be specifically selected according to actual needs.

[0051] The circuit board 130 includes a plurality of connection lines 131. One end of each connection line 131 is electrically connected to the first bonding terminal 111, and the other end is electrically connected to the second bonding terminal 121. The circuit board 130 may further include connection terminals, and the connection terminals are connected to the connection lines 131. The connection terminals can be electrically connected to the first bonding terminal 111 or the second bonding terminal 121 through structures such as conductive adhesives such as anisotropic conductive film (ACF).

[0052] In the display module 100 provided by the embodiment of the present application, setting a plurality of second bonding terminals 121 to include both a part arranged along the first direction X and a part arranged along the second direction Y can save the space occupied by the second bonding terminals 121 along the first direction X, so that the size of the circuit board 120 along the first direction X can be less than or equal to the size of the display panel 110 along the first direction X, reserving sufficient space for the bonding connection of the circuit board 120, which is beneficial to reducing the size of the display module 100 along the first direction X.

[0053] In some embodiments, a plurality of second bonding terminals 121 are arranged in multiple rows along the first direction X, and adjacent rows of second bonding terminals 121 are spaced apart along the second direction Y.

[0054] Each row of second bonding terminals 121 is spaced apart along the first direction X, and adjacent rows of second bonding terminals 121 are spaced apart along the second direction Y. A plurality of second bonding terminals 121 can be arranged in two rows, or in three rows or more rows, and can be set according to actual needs.

[0055] Two adjacent rows of second bonding terminals 121 along the second direction Y can be arranged opposite to each other, or two adjacent second bonding terminals 121 along the second direction Y can be arranged staggered along the second direction Y, that is, the gap between the second bonding terminals 121 in one row along the second direction Y corresponds to the gap between the second bonding terminals 121 in the adjacent row.

[0056] A circuit board 130 can be connected to a row of second bonding terminals 121, or a circuit board 130 can be connected to multiple rows of bonding terminals simultaneously.

[0057] Arranging the second bonding terminals 121 in multiple rows along the first direction X is conducive to a more regular arrangement of the second bonding terminals 121, facilitating the connection to the circuit board 130.

[0058] In some embodiments, there is a first gap 121a between two adjacent second bonding terminals 121 in the same row, and at least part of the positive projection of at least some of the second bonding terminals 121 in one row along the second direction Y falls into the first gap 121a between the second bonding terminals 121 in an adjacent row.

[0059] Along the first direction X, the size of the first gap 121a can be greater than, less than, or equal to the size of the second bonding terminal 121. The positive projection of a row of second bonding terminals 121 along the second direction Y entirely falls into the first gap 121a between the second bonding terminals 121 in an adjacent row, or part of the positive projection of a row of second bonding terminals 121 along the second direction Y falls into the first gap 121a between the second bonding terminals 121 in an adjacent row. It can be set that at least part of the positive projection of a part of the second bonding terminals 121 in one row falls into the first gap 121 between the second bonding terminals 121 in an adjacent row, or it can also be set that at least part of the positive projection of all the second bonding terminals 121 in one row falls into the first gap 121 between the second bonding terminals 121 in an adjacent row. Therefore, setting at least part of the positive projection of at least some of the second bonding terminals 121 in one row to fall into the first gap 121a between the second bonding terminals 121 in an adjacent row means arranging two adjacent rows of second bonding terminals 121 in a staggered manner along the first direction X.

[0060] With such an arrangement, when the connection lines 131 on the circuit board 130 are arranged, multiple connection lines 131 respectively connected to two adjacent rows of second bonding terminals 121 can be arranged alternately along the first direction X to reduce the risk of short - circuit during the preparation of adjacent connection lines 131.

[0061] In some embodiments, the connection line 131 includes a first connection line 1311 and a second connection line 1312. The first connection line 1311 and the second connection line 1312 are respectively electrically connected to two adjacent rows of second bonding terminals 121 along the second direction Y, and the positive projections of the first connection line 1311 and the second connection line 1312 along the second direction Y are arranged alternately along the first direction X.

[0062] The first connection line 1311 and the second connection line 1312 are respectively connected to two adjacent rows of second bonding terminals 121 along the second direction Y. The positive projections of the first connection line 1311 and the second connection line 1312 along the second direction Y are arranged alternately along the first direction X. Then, there is a second connection line 1312 between the positive projections of two adjacent first connection lines 1311 along the second direction Y, and there is a first connection line 1311 between the positive projections of two adjacent second connection lines 1312 along the second direction Y.

[0063] In this way, along the first direction X, the first connection line 1311 and the second connection line 1312 are arranged alternately, which is beneficial to reducing the risk of adhesion and short circuit between two adjacent connection lines 131 during the preparation of the connection line 131.

[0064] The first connection line 1311 and the second connection line 1312 can be arranged on the same layer, or the first connection line 1311 and the second connection line 1312 can be respectively arranged on different film layers of the circuit board 130.

[0065] Such as Figure 1 and Figure 2 shown, in some embodiments, the circuit board 130 includes a first wiring layer 132 and a second wiring layer 133 which are stacked. The first connection line 1311 is arranged on the first wiring layer 132, and the second connection line 1312 is arranged on the second wiring layer 133.

[0066] The first wiring layer 132 and the second wiring layer 133 can be stacked along a direction perpendicular to the display surface of the display panel 110, that is, stacked along the stacking direction of each film layer of the display panel 110.

[0067] It can be understood that arranging the first connection line 1311 and the second connection line 1312 on the first wiring layer 132 and the second wiring layer 133 respectively, that is, arranging the first connection line 1311 and the second connection line 1312 on different layers. In this way, it is beneficial to further increase the distance between the first connection line 1311 and the second connection line 1312, and further reduce the risk of adhesion and short circuit between adjacent connection lines 131 during the preparation of the circuit board 130.

[0068] Continue to refer to Figure 1 and Figure 2 In some embodiments, the first wiring layer 132 is located on the side of the second wiring layer 133 close to the circuit board 120. The first wiring layer 132 has a first via 132a, and the second connection line 1312 passes through the first via 132a.

[0069] It can be understood that the connection line 131 on the circuit board 130 is connected to the second bonding terminal 121 through the connection terminal, and the connection terminal on the circuit board 130 is electrically connected to the second bonding terminal 121 through the anisotropic conductive adhesive 140. The more consistent the thickness of the anisotropic conductive adhesives connecting different connection terminals and the second bonding terminal 121, the more reliable the connection between the circuit board 130 and the circuit board 120.

[0070] In an embodiment where two adjacent rows of the second bonding terminals 121 in the second direction Y are arranged on the same layer, the connection terminals on the circuit board 130 are also arranged on the same layer to achieve the consistency of the anisotropic conductive thickness between different connection terminals and the second bonding terminal 121. The connection terminals on the circuit board 130 can be arranged on the side of the circuit board 130 close to the circuit board 120. Since the first connection line 1311 and the second connection line 1312 are not arranged on the same layer, and the first wiring layer 132 is located on the side of the second wiring layer 133 close to the circuit board 120, the second connection line 1312 can pass through the first via 132a on the first wiring layer 132 to achieve electrical connection with the connection terminal.

[0071] Therefore, setting the first wiring layer 132 with vias and arranging the second connection line 1312 to pass through the first via 132a is conducive to the same-layer arrangement of the connection terminals on the circuit board 130, facilitates the preparation of the connection terminals on the circuit board 130, and is conducive to improving the reliability of the electrical connection between the connection terminals on the circuit board 130 and the second bonding terminals 121 on the circuit board 120.

[0072] As Figure 1 shown, in some embodiments, multiple second bonding terminals 121 are arranged on the same layer.

[0073] In this way, the second direction Y can be parallel to the display surface of the display panel 110. Arranging multiple second bonding terminals 121 on the same layer facilitates the preparation of the second bonding terminals 121 and is conducive to simplifying the manufacturing process of the circuit board 120. In addition, since the second bonding terminals 121 are arranged on the same layer, the second bonding terminals 121 do not occupy more space along the direction perpendicular to the stacking direction, which is conducive to reducing the size of the circuit board 120 along the layer direction.

[0074] As Figure 3 and Figure 4 shown, in some embodiments, the circuit board 120 includes a first sub-layer 122 and a second sub-layer 123 stacked in the second direction Y. The circuit board 130 is arranged on the side of the second sub-layer 123 facing away from the first sub-layer 122. The second sub-layer 123 is provided with a second via 123a. One row of two adjacent rows of the second bonding terminals 121 is arranged on the first sub-layer 122 and exposed through the second via 123a, and the other row is arranged on the second sub-layer 123.

[0075] In this embodiment, two adjacent rows of second bonding terminals 121 along the second direction Y are respectively located in the first sub-layer 122 and the second sub-layer 123 along the second direction Y. The circuit board 130 is disposed on the side of the second sub-layer 123 facing away from the first sub-layer 122. Then, the circuit board 130 is connected to the circuit board 120 from the side of the second sub-layer 123 facing away from the first sub-layer 122. The first sub-layer 122 is located on the side of the second sub-layer 123 facing away from the circuit board 130. Thus, in order to realize the electrical connection between the second bonding terminals 121 of the first sub-layer 122 and the connection terminals on the circuit board 130, at least part of the positions corresponding to the second bonding terminals 121 on the second sub-layer 123 and the first sub-layer 122 are provided with second vias 123a to realize the electrical connection between the second bonding terminals 121 of the first sub-layer 122 and the circuit board 130.

[0076] Thus, while reducing the size of the circuit board 120 along the first direction X, the space along the second direction Y within the display module 100 can also be utilized to reasonably arrange the second bonding terminals 121, reducing the space occupied by the circuit board 130 along the third direction, where the third direction can be perpendicular to the first direction X and the second direction Y respectively.

[0077] In the embodiment where the second bonding terminals 121 in different rows along the second direction Y are respectively located in different layers, the connection terminals on the circuit board 130 that are respectively connected to the second bonding terminals 121 on the first sub-layer 122 and the second sub-layer 123 can be arranged on the same layer. Of course, it is also possible to arrange the connection terminals on the circuit board 130 that are respectively connected to the second bonding terminals 121 on the first sub-layer 122 and the second sub-layer 123 on different layers, so that the distances between the second bonding terminals 121 of the first sub-layer 122 and the second bonding terminals 121 of the second sub-layer 123 and the connection terminals on the circuit board 130 are equal.

[0078] As Figure 3 and Figure 5 shown, in some embodiments, the circuit board 130 includes a first connection terminal 134 and a second connection terminal 135 connected to a plurality of connection lines 131. The first connection terminal 134 is connected to the second bonding terminal 121 located in the first sub-layer 122, and the second connection terminal 135 is connected to the second bonding terminal 121 located in the second sub-layer 123. Along the second direction Y, the absolute value of the difference between the distance between the first connection terminal 134 and the second bonding terminal 121 of the first sub-layer 122 and the distance between the second connection terminal 135 and the second bonding terminal 121 of the second sub-layer 123 is less than or equal to 50 μm.

[0079] The first connection terminal 134 and the second connection terminal 135 are electrically connected to the second bonding terminals 121 located in the first sub-layer 122 and the second sub-layer 123 respectively. Since there is a height difference in the second bonding terminals 121 located in the first sub-layer 122 and the second sub-layer 123 along the second direction Y, the first connection terminal 134 and the second connection terminal 135 are connected to the second bonding terminals 121 through anisotropic conductive adhesive 140 respectively. The smaller the dimensional difference of the anisotropic conductive adhesive 140 connected to the first connection terminal 134 and the second connection terminal 135 along the second direction Y, the more beneficial it is to improve the connection reliability between the circuit board 130 and the circuit board 120. h1 is the distance between the second bonding terminal 121 in the first sub-layer 122 and the first connection terminal 134 along the second direction Y, and h2 is the distance between the second bonding terminal 121 in the second sub-layer 123 and the second connection terminal 135 along the second direction Y, that is Figure 5 the smaller the absolute value of the difference between h1 and h2 in Figure 5 , the more beneficial it is to improve the height consistency of the anisotropic conductive adhesive 140 connected to the first connection terminal 134 and the second connection terminal 135 along the second direction Y, and the more beneficial it is to improve the connection reliability between the circuit board 130 and the circuit board 120.

[0080] Along the second direction Y, the absolute value of the difference between the distance between the first connection terminal 134 and the second bonding terminal 121 in the first sub-layer 122 and the distance between the second connection terminal 135 and the second bonding terminal 121 in the second sub-layer 123 is the absolute value of the difference between h1 and h2.

[0081] Optionally, along the second direction Y, the absolute value of the difference between the distance between the first connection terminal 134 and the second bonding terminal 121 in the first sub-layer 122 and the distance between the second connection terminal 135 and the second bonding terminal 121 in the second sub-layer 123 can be any value not greater than 50μm, such as 0, 10μm, 20μm, 30μm, 40μm or 50μm.

[0082] To satisfy the above relationship, the first connection terminal 134 and the second connection terminal 135 can be arranged on different layers along the second direction Y, and the distance between the first connection terminal 134 and the second connection terminal 135 along the second direction Y is preferably as consistent as possible with the distance between the first sub-layer 122 and the second sub-layer 123 along the second direction Y, or the absolute value of the difference between the distance between the first connection terminal 134 and the second connection terminal 135 along the second direction Y and the distance between the second bonding terminals 121 located in the first sub-layer 122 and the second sub-layer 123 along the second direction Y is less than or equal to 50μm.

[0083] Exemplarily, in an embodiment where the first connection line 1311 and the second connection line 1312 are respectively disposed on the first wiring layer 132 and the second wiring layer 133, the first connection line 1311 can be disposed on the first wiring layer 132, the second connection line 1312 can be disposed on the second wiring layer 133, and the first connection line 1311 is set to connect to the first connection terminal 134, and the second connection line 1312 is set to connect to the second connection terminal 135.

[0084] In the display module 100 provided by the embodiment of the present application, by setting the absolute value of the difference between the distance between the first connection terminal 134 and the second bonding terminal 121 of the first sub-layer 122 and the distance between the second connection terminal 135 and the second bonding terminal 121 of the second sub-layer 123 along the second direction Y to be less than or equal to 50 μm, it is beneficial to reduce the difference in the size of the anisotropic conductive adhesive 140 connected to the first connection terminal 134 and the second connection terminal 135 along the second direction Y, and further beneficial to improve the reliability of the connection between the circuit board 130 and the circuit board 120.

[0085] In some embodiments, the distance between the first connection terminal 134 and the second bonding terminal 121 of the first sub-layer 122 is equal to the distance between the second connection terminal 135 and the second bonding terminal 121 of the second sub-layer 123.

[0086] As shown in FIG. 5, the distance between the first connection terminal 134 and the second bonding terminal 121 of the first sub-layer 122 is equal to the distance between the second connection terminal 135 and the second bonding terminal 121 of the second sub-layer 123, that is, h1 = h2. In this way, the sizes of the anisotropic conductive adhesives 140 connected to the first connection terminal 134 and the second connection terminal 135 along the second direction Y are the same, which is further beneficial to improving the reliability of the connection between the circuit board 130 and the circuit board 120.

[0087] It can be understood that in order to achieve h1 = h2, the distance between the first connection terminal 134 and the second connection terminal 135 along the second direction Y can be set to be equal to the distance between the second bonding terminals 121 located on the first sub-layer 122 and the second sub-layer 123 respectively.

[0088] As Figure 1 and Figure 6 shown, in some embodiments, the display panel 110 includes a stacked substrate layer 112 and a functional layer 113, and the first bonding terminal 111 is formed on the functional layer 113.

[0089] Exemplarily, the first direction X, the second direction Y, and the third direction Z can be set to be perpendicular to each other in pairs.

[0090] The substrate layer 112 can be made of glass. In some embodiments, the substrate layer 112 can also be made of polyimide (PI) material or a material containing PI, so that the substrate layer 112 can be bent.

[0091] The functional layer 113 can be a film layer that realizes the display function of the display panel 110, or the functional layer 113 can be a film layer that realizes the touch function of the display panel 110. Of course, the functional layer 113 can include both a film layer that realizes the display function and a film layer that realizes the touch function.

[0092] The substrate layer 112 and the functional layer 113 can be stacked along the second direction Y. Since the second bonding terminals 121 are arranged along the first direction X and the second direction Y, the space occupied by the circuit board 120 along the third direction can be reduced, which is beneficial to reducing the thickness of the circuit board 120 and the display film group along the third direction.

[0093] In some embodiments, the functional layer 113 includes touch electrodes, and the touch electrodes are electrically connected to the first bonding terminals 111.

[0094] The touch electrodes can be self-capacitive, or the touch electrodes are mutual-capacitive. The touch electrodes include touch driving electrodes and touch sensing electrodes. The touch driving electrodes and the touch sensing electrodes can be arranged on the same layer, or they are located on different layers and are insulated from each other.

[0095] The functional layer 113 is provided with touch electrodes, and the touch electrodes are electrically connected to the first bonding terminals 111 to realize the electrical connection between the touch electrodes and the circuit board 120, which is convenient for the touch electrodes to send electrical signals to the circuit board 120 or the touch electrodes to receive electrical signals from the circuit board 120, so as to realize the normal touch function of the display panel 110.

[0096] In some embodiments, the functional layer 113 includes a display unit, and the display unit is electrically connected to the first bonding terminals 111.

[0097] The display unit includes a plurality of sub-pixels, and the plurality of sub-pixels can be respectively used for emitting red light, green light, and blue light. The driving circuits of the respective sub-pixels are electrically connected to the first bonding terminals 111 and are electrically connected to the circuit board 120 through the first bonding terminals 111, so that the circuit board 120 provides electrical energy and electrical signals for the respective sub-pixels, or the respective sub-pixels transmit electrical signals to the circuit board 120 to realize the normal display function of the display panel 110.

[0098] The display device provided according to the embodiments of the present application includes the display module 100 provided in any of the above embodiments.

[0099] Since the display device provided by the embodiment of the present application includes the display module provided by any of the above embodiments, it has the same technical effects and will not be elaborated herein.

[0100] Although the present application has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display module, characterized in that, Comprising: A display panel having a plurality of first bonding terminals, with the plurality of first bonding terminals arranged along a first direction; A circuit board having a plurality of second bonding terminals, with at least two of the second bonding terminals arranged along the first direction and at least two of the second bonding terminals arranged along a second direction, the first direction intersecting the second direction; A circuit board including a plurality of connection lines, the connection lines electrically connecting the first bonding terminals and the second bonding terminals; The circuit board includes a first sub-layer and a second sub-layer stacked along the second direction, the circuit board is disposed on a side of the second sub-layer facing away from the first sub-layer, the second sub-layer is provided with a second via hole, and one row of the adjacent two rows of the second bonding terminals is disposed on the first sub-layer and exposed by the second via hole, and the other row is disposed on the second sub-layer; The circuit board includes a first connection terminal and a second connection terminal connected to the plurality of connection lines, the first connection terminal is connected to the second bonding terminal located on the first sub-layer, and the second connection terminal is connected to the second bonding terminal located on the second sub-layer; Along the second direction, the absolute value of the difference between the distance between the first connection terminal and the second bonding terminal on the first sub-layer and the distance between the second connection terminal and the second bonding terminal on the second sub-layer is less than or equal to 50 μm.

2. The display module according to claim 1, characterized in that, The plurality of second bonding terminals are arranged in multiple rows along the first direction, and adjacent two rows of the second bonding terminals are spaced apart along the second direction.

3. The display module according to claim 2, characterized in that, There is a first gap between two adjacent second bonding terminals in the same row, and at least a part of the positive projection of at least a part of one row of the second bonding terminals along the second direction falls into the first gap between the adjacent other row of the second bonding terminals.

4. The display module according to claim 2, characterized in that, The connection lines include a first connection line and a second connection line, the first connection line and the second connection line are respectively electrically connected to two adjacent rows of the second bonding terminals along the second direction, and the positive projections of the first connection line and the second connection line along the second direction are alternately arranged along the first direction.

5. The display module according to claim 4, characterized in that, The circuit board includes a first trace layer and a second trace layer stacked, the first connection line is disposed on the first trace layer, and the second connection line is disposed on the second trace layer.

6. The display module according to claim 5, characterized in that, The first trace layer is located on a side of the second trace layer close to the circuit board, the first trace layer has a first via hole, and the second connection line passes through the first via hole.

7. The display module according to claim 2, characterized in that, The plurality of second bonding terminals are disposed on the same layer.

8. The display module according to claim 1, characterized in that, The distance between the first connection terminal and the second bonding terminal on the first sub-layer is equal to the distance between the second connection terminal and the second bonding terminal on the second sub-layer.

9. The display module according to claim 1, characterized in that, The display panel includes a substrate layer and a functional layer stacked, and the first bonding terminals are formed on the functional layer.

10. The display module according to claim 9, characterized in that, The functional layer includes touch electrodes, and the touch electrodes are electrically connected to the first bonding terminals; And / or, the functional layer includes display units, and the display units are electrically connected to the first bonding terminals.

11. A display device, characterized in that, Comprising the display panel according to any one of claims 1 to 10.

Images