Cooling systems and electronic equipment

Abstract

The present application provides a heat dissipation system and electronic device. The heat dissipation system may include a power module, an evaporator, and a condenser. The power module includes a thermally conductive substrate and a power device, with the power device secured to a first surface of the thermally conductive substrate. The evaporator has an evaporation chamber filled with a refrigerant. At least one sidewall of the evaporator is provided with a window, and the thermally conductive substrate is embedded in the window. At least a portion of the surface of the thermally conductive substrate is immersed in the refrigerant, with the first surface located outside the evaporation chamber. Heat generated by the power device is transferred from the thermally conductive substrate to the refrigerant, causing it to vaporize. The condenser is connected to the evaporation chamber, allowing the vaporized refrigerant to enter the condenser; the refrigerant, condensed to a liquid state by the condenser, can flow back into the evaporation chamber. The phase change heat of the refrigerant removes the heat generated by the power device and reduces the thermal resistance from the power module to the air, thereby improving the heat dissipation capacity of the power module and thereby enhancing the performance of electronic devices using the heat dissipation system.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation system and electronic equipment. Background Art

[0002] With the advancement of electronic technology, high-power semiconductor devices are increasingly used in the power electronics industry. As their computing power continues to increase, their power consumption has also increased significantly. Consequently, they generate increasing amounts of heat and heat flux, posing significant challenges to their heat dissipation.

[0003] Currently, electronic devices are moving towards miniaturization and integration, leaving little space for heat dissipation components. However, without effective heat dissipation measures for high-power semiconductor devices, their operating environments will be restricted, limiting their performance. Therefore, the heat dissipation capabilities of high-power semiconductor devices at high power densities need to be improved urgently. Summary of the Invention

[0004] The present application provides a heat dissipation system and an electronic device to improve the heat dissipation capability of a power module, thereby improving the product performance of the electronic device using the heat dissipation system.

[0005] In a first aspect, the present application provides a heat dissipation system, which includes a power module, an evaporator and a condenser. The power module may include a heat-conducting substrate and a power device, the heat-conducting substrate having a first surface, the power device being fixed to the first surface, and the power device being in heat-conducting contact with the first surface. It is worth mentioning that one or more power devices may be provided on each heat-conducting substrate, which is not limited in the present application. In addition, the evaporator has an evaporation chamber, which is filled with a refrigerant. The power module is provided in the evaporator. Specifically, at least one side wall of the evaporator may be provided with a window, the heat-conducting substrate is embedded in the evaporator through the window, and at least part of the surface of the heat-conducting substrate is immersed in the refrigerant. The heat generated by the power device can be conducted from the first surface to the heat-conducting substrate, and then from the heat-conducting substrate to the refrigerant, and the refrigerant can be vaporized into steam by the heat. The condenser is connected to the evaporation chamber, and the vaporized refrigerant can enter the condenser.

[0006] Using the heat dissipation system provided by the present application, when the power module is operating, heat can be conducted from the power device to the first surface of the heat-conducting substrate, and then to the liquid refrigerant in the evaporation chamber of the evaporator. The liquid refrigerant is vaporized by heat to form steam, which enters the condenser and condenses into liquid before flowing back to the evaporation chamber. It can be understood that during the above-mentioned refrigerant phase change process, a large amount of heat generated by the power device can be taken away, thereby achieving heat dissipation of the power device. In addition, the use of refrigerant phase change heat transfer can effectively reduce the thermal resistance from the power module to the air, thereby effectively improving the heat dissipation capacity of the power module.

[0007] In one possible implementation of the present application, after the refrigerant is condensed into a liquid state in the condenser, it can flow back to the evaporation chamber by gravity. In this way, without the need for a pump or other power device, the refrigerant condensed into a liquid state in the condenser can flow back to the evaporation chamber under the action of gravity, thereby achieving efficient circulation of the refrigerant between the evaporator and condenser.

[0008] In this application, the placement of the heat dissipation system is not limited, and it can be placed according to the specific application scenario. For example, the heat dissipation system can be placed along the direction of gravity. The direction of gravity can be defined by the top to bottom direction when the device to which the heat dissipation system is applied is placed in a customary manner in the field under normal use. For example, when the heat dissipation system is used in a photovoltaic inverter, the direction of gravity can be understood as the top to bottom direction of the photovoltaic inverter under normal use. In this case, the heat dissipation system is placed along the top to bottom direction of the photovoltaic inverter.

[0009] Furthermore, when the heat dissipation system is placed along the direction of gravity, the condenser can be located above the evaporator. Based on this, when placing the thermally conductive substrate, in one possible implementation, the thickness of the thermally conductive substrate can be perpendicular to the direction of gravity. In this case, the thermally conductive substrate can be embedded in a window opened on a side wall of the evaporator parallel to the direction of gravity.

[0010] Since the first surface of the thermally conductive substrate can be used to arrange power devices, in a possible implementation of the present application, the thickness direction of the thermally conductive substrate can also be made perpendicular to the first surface. In this case, the first surface is parallel to the direction of gravity.

[0011] When the evaporator and the condenser are specifically connected, the two can be connected through a pipe. In one possible implementation of the present application, the evaporator and the condenser can be connected through at least one liquid circulation pipe and at least one gas circulation pipe. For example, the evaporator and the condenser can be connected through one liquid circulation pipe and one gas circulation pipe, or the evaporator and the condenser can be connected through one liquid circulation pipe and two gas circulation pipes. In this way, the gas circulation path and the liquid circulation path of the refrigerant circulating between the evaporator and the condenser can be distinguished, thereby improving the efficiency of the refrigerant circulating between the evaporator and the condenser.

[0012] In this application, the thermally conductive substrate further comprises a second surface, which is disposed opposite the first surface and at least partially immersed in the refrigerant. Heat generated by the power device is transferred from the first surface of the thermally conductive substrate to the second surface, where it is then directly transferred to the refrigerant, achieving efficient heat exchange between the thermally conductive substrate and the refrigerant.

[0013] In one possible implementation of the present application, at least a portion of the surface of the thermally conductive substrate immersed in the refrigerant may include a second surface and at least a portion of the outer side surface of the thermally conductive substrate, wherein the outer side surface of the thermally conductive substrate may be located between the first surface and the second surface. This increases the contact area between the thermally conductive substrate and the refrigerant, thereby improving the heat exchange efficiency between the thermally conductive substrate and the refrigerant.

[0014] To improve the heat dissipation efficiency of the power module, in one possible implementation of the present application, the thermally conductive substrate may also be provided with a heat dissipation enhancement structure. Specifically, this heat dissipation enhancement structure is disposed in the heat dissipation enhancement region of the second surface. This heat dissipation enhancement structure can be used to increase the area of the thermally conductive substrate submerged in the refrigerant. This allows at least a portion of the power module's projection on the second surface, along the thickness of the thermally conductive substrate, to be located within the heat dissipation enhancement region. This allows the heat generated by the power module to be efficiently exchanged with the refrigerant, thereby improving the heat dissipation performance of the power module.

[0015] In this application, the specific setting form of the heat dissipation enhancement structure is not limited. It can be exemplarily a groove or protrusion located on the second surface, or a fin or capillary structure, etc., so as to achieve the purpose of increasing the area of the heat-conducting substrate immersed in the refrigerant.

[0016] In a possible implementation of the present application, the projection of the power device on the thermally conductive substrate may fall within the contour range of the first surface, thereby effectively increasing the contact area between the power device and the thermally conductive substrate, thereby facilitating improving the heat exchange efficiency between the two.

[0017] In one possible implementation of the present application, the outer side of the heat-conducting substrate is sealed to the inner side wall of the window to prevent leakage of the refrigerant. In addition, in order to ensure a reliable connection between the heat-conducting substrate and the evaporator, the heat-conducting substrate and the evaporator can be connected by welding or bonding.

[0018] In one possible implementation of the present application, the inner sidewall of the window of the evaporator may be arranged in a stepped shape, wherein the inner sidewall of the window may include a first sub-inner sidewall, a second sub-inner sidewall, and a connecting wall connecting the first sub-inner sidewall and the second sub-inner sidewall. The opening area formed by the circumferential surrounding of the first sub-inner sidewall is larger than the opening area formed by the circumferential surrounding of the second sub-inner sidewall. In addition, the thermally conductive substrate is located within the opening formed by the circumferential surrounding of the first sub-inner sidewall, and a portion of the second surface overlaps the connecting wall. This facilitates the installation of the thermally conductive substrate and the evaporator and improves the tightness of the fit between the two.

[0019] In addition, the second surface of the heat-conducting substrate may further include at least one protrusion, which may extend into the evaporation chamber through an opening circumferentially formed by the second sub-inner wall, so that the at least one protrusion is immersed in the refrigerant in the evaporation chamber, so that the area of the heat-conducting substrate immersed in the refrigerant is larger, which is beneficial to improving the heat exchange efficiency between the heat-conducting substrate and the refrigerant.

[0020] In this application, to ensure a tight seal between the thermally conductive substrate and the window, the outer surface of the thermally conductive substrate can be sealed to the first sub-inner sidewall. Alternatively, the portion of the thermally conductive substrate that overlaps the connecting wall can be sealed to the second surface and the connecting wall. In a specific implementation, a sealing ring can be provided between the outer surface of the thermally conductive substrate and the inner sidewall of the window. This sealing ring can be fitted over the thermally conductive substrate, and the inner sidewall of the window can squeeze the sealing ring, so that the sealing ring fills the gap between the thermally conductive substrate and the window.

[0021] In addition, in the present application, the specific arrangement of the thermally conductive substrate is not limited. For example, the first surface of the thermally conductive substrate can have a first angle with the direction of gravity. The first angle can be greater than or equal to 0° and less than or equal to 180°. It can be adjusted according to the arrangement space of the heat dissipation system, thereby making the arrangement of the heat dissipation system more flexible.

[0022] In a possible implementation of the present application, each evaporator may be connected to at least two power modules, which is conducive to realizing an integrated design of the heat dissipation system.

[0023] In a second aspect, this application also provides a power device. This electronic device may include a chassis and the heat dissipation system of the first aspect. The evaporator may be located inside or outside the chassis, and the condenser is located outside the chassis. This application does not specify the specific type of power device; it may be, but is not limited to, photovoltaic power generation equipment such as a photovoltaic inverter. This electronic device has a strong heat dissipation capability, thereby improving the product performance and thus enhancing the product competitiveness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic structural diagram of a heat dissipation system provided in an embodiment of the present application;

[0025] Figure 2 A schematic diagram of the structure of a power module provided in an embodiment of the present application;

[0026] Figure 3a A cross-sectional view of the connection position between a power module and an evaporator provided in an embodiment of the present application;

[0027] Figure 3b A schematic diagram of a connection method between a power module and an evaporator provided in an embodiment of the present application;

[0028] Figures 4a to 4g Schematic diagrams of the structures of several second surfaces provided in the embodiments of the present application;

[0029] Figure 5a A schematic diagram of the connection relationship of a heat dissipation system provided in an embodiment of the present application;

[0030] Figure 5b A schematic diagram of the connection relationship of another heat dissipation system provided in an embodiment of the present application;

[0031] Figure 5c A schematic diagram of the connection relationship structure of another heat dissipation system provided in an embodiment of the present application;

[0032] Figure 6 A schematic structural diagram of a power device provided in an embodiment of the present application.

[0033] Reference numerals:

[0034] 1-power module; 101-power device; 102-thermal conductive substrate; 1021-first surface; 1022-second surface;

[0035] 10221- protrusion; 10222- heat dissipation enhancement area; 1023- outer side surface; 1024- fin; 1025- capillary structure;

[0036] 2-evaporator; 201-evaporation chamber; 202-window; 2021-first sub-inner wall; 2022-second sub-inner wall;

[0037] 2023-connecting wall; 3-condenser; 4-liquid circulation pipe; 5-gas circulation pipe; 6-chassis. DETAILED DESCRIPTION

[0038] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise. References to "one embodiment" or "specific embodiment" described in this specification mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0039] To facilitate understanding of the heat dissipation system and electronic device provided in the embodiments of the present application, the following first introduces its application scenarios. The heat dissipation system provided in the present application can be used in, but is not limited to, electronic devices such as photovoltaic inverters. With the development of electronic technology, the demand for heat dissipation of high-power semiconductor devices in electronic devices is becoming more and more obvious. For example, in photovoltaic inverters, the heat flux density of insulated gate bipolar transistors (IGBTs) is getting higher and higher. Good heat dissipation measures will help improve its maximum current output capability, thereby improving the performance of the photovoltaic inverter and enhancing the competitiveness of the product.

[0040] In order to improve the power density of high-power semiconductor devices, there is currently extensive research on heat dissipation enhancement of high-power semiconductor devices. From the perspective of heat dissipation methods, there are mainly air cooling, natural cooling and liquid cooling, and the specific choice is based on the actual application scenario. For example, photovoltaic inverters are mainly used in outdoor scenarios, and air cooling is its most important form of heat dissipation. For air-cooled heat dissipation, high-power semiconductor devices are generally attached to the surface of the air-cooled radiator through thermal grease for heat dissipation. At present, the research on heat dissipation enhancement of air-cooled heat dissipation mainly focuses on adding heat pipe radiators or vacuum chamber heat sink technology (vapor chamber, VC) radiators on the basis of ordinary aluminum air-cooled radiators, but further evolution has also encountered bottlenecks. In addition, from the distribution of thermal resistance of the heat dissipation link, the thermal resistance of the thermal grease layer accounts for 20%, and there is currently no good alternative solution to reduce thermal resistance.

[0041] Based on this, the present application provides a heat dissipation system and electronic equipment. By directly contacting the heat dissipation surface of the power module with the refrigerant, the heat dissipation chain is removed from the silicone grease layer. At the same time, efficient phase change heat transfer is used to reduce the thermal resistance from the module to the air, thereby improving the heat dissipation capacity of the power module. This is conducive to improving the product performance and competitiveness of electronic equipment using this heat dissipation system. To make the objectives, technical solutions, and advantages of this application more clear, this application will be further described in detail below with reference to the accompanying drawings.

[0042] Reference Figure 1 , Figure 1 This is a schematic diagram of a heat dissipation system provided in an embodiment of the present application. In this application, the heat dissipation system may include a power module 1, an evaporator 2, and a condenser 3. The power module 1 is fixed to the evaporator 2, and the evaporator 2 is connected to the condenser 3. In addition, each evaporator 2 may be provided with multiple power modules 1, for example, Figure 1 In the heat dissipation system shown, six power modules 1 are provided on one evaporator 2 , and the one evaporator 2 is connected to one condenser 3 , which is beneficial to the integrated design of the heat dissipation system.

[0043] When setting up the power module 1, please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of a power module 1 provided in an embodiment of the present application. The power module 1 includes a power device 101 and a thermally conductive substrate 102. The power device 101 may be, but is not limited to, a chip or a database controller (DBC). The power device 101 may be disposed on a first surface 1021 of the thermally conductive substrate 102, and the power device 101 is in thermal contact with the first surface 1021 of the thermally conductive substrate 102. In addition, the number of power devices 101 disposed on each thermally conductive substrate 102 may be one or more, which may be configured according to the specific application scenario of the power module 1.

[0044] In this application, the material of the thermally conductive substrate 102 is not limited. It can be exemplarily a metal with good thermal conductivity such as copper or aluminum. In some possible embodiments, the material of the thermally conductive substrate 102 may also be a non-metal with good thermal conductivity.

[0045] It can be understood that in the present application, the projection of the power device 101 on the thermally conductive substrate 102 can be made to fall completely within the contour range of the first surface 1021, thereby effectively increasing the contact area between the power device 101 and the first surface 1021, which is beneficial to improving the heat exchange efficiency between the power device 101 and the thermally conductive substrate 102, and thus improving the heat dissipation performance of the power module 1.

[0046] Reference Figure 3a , Figure 3aA cross-sectional view of the connection position of a power module 1 and an evaporator 2 provided in an embodiment of the present application. In the present application, the evaporator 2 has an evaporation chamber 201, and the evaporation chamber 201 is filled with a refrigerant. The refrigerant is a vapor-liquid two-phase refrigerant, that is, when the temperature is less than or equal to the first temperature threshold, the refrigerant is in a liquid state; and when the temperature is higher than the first temperature threshold, the refrigerant boils and changes into a vapor. The specific type of refrigerant is not limited in the present application, and an exemplary one thereof may be tetrafluoroethane (1,1,1,2-tetrafluoroethane) or the like. It is understandable that the first temperature threshold is affected by the type of refrigerant, and it may be, for example, 20°C or 25°C.

[0047] You can continue to refer to Figure 3a In order to fix the power module 1 to the evaporator 2, a window 202 can be opened on at least one side wall of the evaporator 2, and the thermal conductive substrate 102 of the power module 1 can be embedded in the window 202 so that at least part of the surface of the thermal conductive substrate 102 is immersed in the refrigerant in the evaporation chamber 201.

[0048] In the present application, the thermally conductive substrate 102 may further include a second surface 1022, which is disposed opposite to the first surface 1021. Therefore, at least the surface of the thermally conductive substrate 102 immersed in the refrigerant may include at least a portion of the second surface 1022, and at least a portion of the second surface 1022 is immersed in the refrigerant.

[0049] In one possible embodiment of the present application, refer to Figure 3b , Figure 3b A schematic diagram of a connection method between a power module and an evaporator provided in an embodiment of the present application. Figure 3b In the embodiment, at least the surface of the thermally conductive substrate 102 immersed in the refrigerant may include the entire second surface 1022 and at least a portion of the outer side surface 1023 of the thermally conductive substrate 102, wherein the outer side surface 1023 of the thermally conductive substrate 102 may be located between the first surface 1021 and the second surface 1022. In this way, the contact area between the thermally conductive substrate 102 and the refrigerant can be increased, thereby improving the heat exchange efficiency between the thermally conductive substrate 102 and the refrigerant.

[0050] In the present application, the heat-conducting substrate 102 and the evaporator 2 can be fixedly connected, and the fixing method can be but not limited to welding or bonding. Figure 3a In order to facilitate the connection between the heat-conducting substrate 102 and the evaporator 2, the inner wall of the window 202 can be set into a step shape. In this case, the inner wall of the window can include a first sub-inner wall 2021, a second sub-inner wall 2022, and a connecting wall 2023 connecting the first sub-inner wall 2021 and the second sub-inner wall 2022. Figure 3aIt can be seen that the opening area formed by the circumferential surrounding of the first sub-inner sidewall 2021 is larger than the opening area formed by the circumferential surrounding of the second sub-inner sidewall 2022 .

[0051] Furthermore, when securing the power module 1 to the evaporator 2, the thermally conductive substrate 102 can be positioned within the opening circumferentially formed by the first sub-inner sidewall 2021, with a portion of the second surface 1022 overlapping the connecting wall 2023. Consequently, the outer side surface 1023 of the thermally conductive substrate 102 can be sealedly connected to the first sub-inner sidewall 2021; alternatively, the portion of the second surface 1022 of the thermally conductive substrate 102 overlapping the connecting wall 2023 can be sealedly connected to the connecting wall 2023; alternatively, both the outer side surface 1023 of the thermally conductive substrate 102 and the first sub-inner sidewall 2021, and the portion of the second surface 1022 of the thermally conductive substrate 102 overlapping the connecting wall 2023 can be sealedly connected to the connecting wall 2023 simultaneously. The connection methods include, but are not limited to, welding or bonding. This improves the sealing and stability of the connection between the power module 1 and the evaporator 2.

[0052] In a possible embodiment of the present application, the second surface 1022 may include at least one protrusion 10221, which may extend into the evaporation chamber 201 through an opening circumferentially formed by the second sub-inner wall 2022, so that the at least one protrusion 10221 is immersed in the refrigerant, so that the area of the thermal conductive substrate 102 immersed in the refrigerant is larger, which is beneficial to improving the heat exchange efficiency between the thermal conductive substrate 102 and the refrigerant.

[0053] In this application, in order to ensure the seal between the thermally conductive substrate 102 and the window 202, a sealing ring ( Figure 3a (not shown in the figure), the sealing ring can be made of, but is not limited to, rubber. Specifically, the sealing ring can be positioned between the outer side surface 1023 of the thermally conductive substrate 102 and the inner sidewall 202 of the window 202. The sealing ring can be sleeved onto the thermally conductive substrate 102 so that when the thermally conductive substrate 102 is inserted into the window 202, the sealing ring is squeezed by the inner sidewall 202 of the window 202, thereby filling the gap between the two and achieving a sealing effect.

[0054] In addition, in order to improve the efficiency of heat transfer from the power device 101 to the refrigerant, a heat dissipation enhancement structure can be provided on the heat conductive substrate 102. The heat dissipation enhancement structure can be provided on the second surface 1022 of the heat conductive substrate 102. Figure 4a , Figure 4aThis is a schematic structural diagram of a second surface 1022 of a thermally conductive substrate 102 provided in an embodiment of the present application. The heat dissipation enhancement structure may be a fin 1024 formed on the second surface 1022. The fin 1024 may serve to increase the area of the thermally conductive substrate 102 immersed in the refrigerant. In the present application, the fin 1024 may be a raised structure formed on the second surface 1022, which may be integrally formed with the second surface 1022; alternatively, the fin 1024 may be an independently formed structure and may be fixed to the second surface 1022 by welding or other possible means. The fin 1024 may be disposed in a heat dissipation enhancement region 10222 of the second surface 1022. In addition, along the thickness direction of the thermally conductive substrate 102, at least a portion of the projection of the power device 101 on the second surface 1022 may be located within the heat dissipation enhancement region 10222. Since the second surface 1022 is in direct contact with the refrigerant in the evaporation chamber 201, by providing fins 1024 on the second surface 1022, the area of the thermal conductive substrate 102 immersed in the refrigerant can be effectively increased, thereby improving the heat exchange efficiency between the power device 101 and the refrigerant, thereby facilitating improving the heat dissipation performance of the power module 1.

[0055] In this application, the fins 1024 may be arranged in parallel in a plurality of ways. Figure 4a In the embodiment shown, the plurality of fins 1024 are arranged obliquely. Figure 4a In addition to the configuration shown in the example, other possible configurations can also be used. For example, refer to Figures 4b to 4d , Figures 4b to 4d Several possible configurations of the fins 1024 are shown, for example, Figure 4b and Figure 4c In the embodiment, the fins 1024 may be arranged in parallel in a plurality of ways, and the plurality of fins 1024 may be arranged parallel to one side of the second surface 1022; Figure 4d In the illustrated embodiment, the fins 1024 are arranged in multiple rows in parallel, each row includes a plurality of fins 1024, and the multiple rows of fins 1024 are arranged obliquely.

[0056] In addition, in this application, the heat dissipation enhancement structure can be set as Figures 4a to 4d In addition to the fins 1024 shown, other possible structures can also be provided. For example, Figures 4e to 4g , Figures 4e to 4g Schematic diagrams of the structures of several other second surfaces 1022 provided in the embodiments of the present application, wherein: Figure 4g A schematic diagram of the three-dimensional structure of the second surface 1022 is shown. Figures 4e to 4gIn the embodiment, the heat dissipation enhancement structure can be a capillary structure 1025. The capillary structure 1025 can be, but is not limited to, a metal mesh structure or a metal powder sintered structure, which has an adsorption effect on liquid. The capillary structure 1025 can also be provided in the heat dissipation enhancement region 10222 of the second surface 1022, thereby effectively increasing the area of the thermally conductive substrate 102 immersed in the refrigerant.

[0057] It is worth mentioning that the shape of the thermally conductive substrate 102 is not specifically limited in this application, and it can be Figures 4a to 4f The class rectangle shown in Figure 4g In some other possible embodiments of the present application, the heat dissipation enhancement structure may also be a groove or a protrusion located on the second surface 1022, as long as it can increase the area of the heat conductive substrate 102 immersed in the refrigerant.

[0058] When connecting the evaporator 2 and the condenser 3, refer to Figure 5a , Figure 5a This is a schematic diagram of the connection relationship of a heat dissipation system provided in an embodiment of the present application. The evaporation chamber 201 of the evaporator 2 can be connected to the condenser 3. In specific implementations, the evaporation chamber 201 and the condenser 3 can be connected by, but are not limited to, a pipe. The pipe can be a flexible tube to facilitate the connection between the evaporator 2 and the condenser 3. In some possible application scenarios, such as when the space for setting up the heat dissipation system is large, the evaporator 2 and the condenser 3 can also be connected by a rigid tube.

[0059] With the heat dissipation system provided in this application, when the power module 1 is operating, heat can be conducted from the power device 101 to the heat-conducting substrate 102. Since at least the surface of the heat-conducting substrate 102 is in direct contact with the refrigerant in the evaporation chamber 201 of the evaporator 2, the liquid refrigerant is heated and vaporized to form steam. This steam enters the condenser 3 and condenses into liquid, which can then flow back into the evaporation chamber 201. Figure 5a The solid line with an arrow indicates the flow direction of the gaseous refrigerant, while the dashed line with an arrow indicates the flow direction of the liquid refrigerant. It will be appreciated that during the aforementioned refrigerant phase change process, a significant amount of heat generated by the power device 101 can be removed, thereby dissipating heat from the power device 101. Furthermore, utilizing the refrigerant's phase change heat transfer can effectively reduce the thermal resistance from the power module 1 to the air, thereby effectively improving the heat dissipation capability of the power module 1.

[0060] Since the refrigerant circulates between the evaporator 2 and the condenser 3 and undergoes a transition from liquid to gas and from gas to liquid, in order to distinguish the gas flow path from the liquid flow path, the evaporator 2 and the condenser 3 can be connected through at least one liquid flow pipe 4 and at least one gas flow pipe 5. Figure 5a In the figure, a dotted line represents a liquid flow pipe 4 connecting the evaporator 2 and the condenser 3, and a solid line represents a gas flow pipe 5 connecting the evaporator 2 and the condenser 3. This allows the refrigerant, which has formed into vapor, to enter the condenser 3 through at least one gas flow pipe 5, and allows the liquid refrigerant, which has been condensed by the condenser 3, to flow back to the evaporation chamber 201 through at least one liquid flow pipe 4, thereby achieving efficient circulation of the refrigerant between the evaporator 2 and the condenser 3. In some possible embodiments of the present application, the evaporator 2 and the condenser 3 can also be connected by a single pipe, thereby simplifying the structure of the heat dissipation system.

[0061] In the present application, the refrigerant condensed into liquid by the condenser 3 can be returned to the evaporation chamber 201 by gravity. Based on this, when arranging the condenser 3 and the evaporator 2, the condenser 3 and the evaporator 2 can be arranged along the direction of gravity. For example, the condenser 3 can be located above the evaporator 2 in the direction of gravity. The arrangement of the condenser 3 and the evaporator 2 along the direction of gravity can be arranged in a straight line, or the two can be staggered along the direction of gravity. In this way, the refrigerant in the evaporation chamber 201 can be vaporized and enter the condenser 3 without the need for a pump or other power equipment to drive it, and the refrigerant condensed into liquid by the condenser 3 can be returned to the evaporation chamber 201 under the action of gravity, thereby realizing efficient circulation of the refrigerant between the evaporator 2 and the condenser 3.

[0062] When the heat dissipation system is placed along the direction of gravity, the direction of gravity can be defined as the top-to-bottom direction of the device in which the heat dissipation system is installed during normal use, according to customary placement in the field. For example, when the heat dissipation system is used in a photovoltaic inverter, the direction of gravity can be understood as the top-to-bottom direction of the photovoltaic inverter during normal use. In this case, the heat dissipation system is placed along the top-to-bottom direction of the photovoltaic inverter.

[0063] In addition, the evaporator 2 and the condenser 3 can be arranged in any direction, which can be adjusted according to the specific application scenario. There is no specific limitation in this application, as long as the liquid refrigerant condensed by the condenser 3 can flow back to the evaporation chamber 201. For example, Figure 5a In the embodiment shown, the condenser 3 and the evaporator 2 are arranged along a straight line in the direction of gravity, and the condenser 3 and the evaporator 2 are arranged in parallel; for example, in Figure 5bIn the embodiment shown, the condenser 3 and the evaporator 2 are arranged along a straight line in the direction of gravity, and the condenser 3 and the evaporator 2 are arranged vertically; for example, in Figure 5c In the illustrated embodiment, the condenser 3 and the evaporator 2 are arranged alternately in the direction of gravity, and both the condenser 3 and the evaporator 2 are arranged at an incline.

[0064] In addition, the first surface 1021 of the thermally conductive substrate 102 of the power module 1 may have a first angle with the direction of gravity, and the first angle may be greater than or equal to 0° and less than or equal to 180°. Figure 5a In the embodiment shown, the heat-conducting substrate 102 of the power module 1 can be embedded in the evaporator 2 by the side wall of the evaporator 2 parallel to the direction of gravity. In this case, the first angle can be 0°, which can be understood as the first surface 1021 being parallel to the direction of gravity. In this case, the thickness direction of the heat-conducting substrate 102 can be perpendicular to the first surface 1021. For example, in Figure 5b In the embodiment shown, the heat-conducting substrate 102 of the power module 1 is embedded in the evaporator 2 from the side wall of the evaporator 2 facing away from the condenser 3. In this case, the first angle can be 90°. Figure 5c In the illustrated embodiment, the heat-conducting substrate 102 of the power module 1 is embedded in the evaporator 2 via an inclined side wall of the evaporator 2 , and the first angle may be 45°.

[0065] The heat dissipation system provided in this application can be applied to various possible power devices. This application does not limit the specific type of power devices. For example, it can be photovoltaic power generation equipment such as photovoltaic inverters. Figure 6 , Figure 6 This is a schematic diagram of the structure of a possible power device provided in an embodiment of the present application. In addition to a heat dissipation system, the power device may also include a chassis 6. The evaporator 2 may be located inside or outside the chassis 6, and the condenser 3 is located outside the chassis 6. This electronic device has a strong heat dissipation capability, thereby improving the product performance and competitiveness of the electronic device.

[0066] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation system, characterized in that: It includes power module, evaporator and condenser, including: The power module includes a heat-conducting substrate and a power device, wherein the heat-conducting substrate has a first surface, and the power device is fixed to the first surface; The evaporator has an evaporation chamber filled with a refrigerant; at least one side wall of the evaporator is provided with a window, the heat-conducting substrate is embedded in the window, and at least a portion of the surface of the heat-conducting substrate is immersed in the refrigerant, and the first surface is located outside the evaporation chamber; The condenser is in communication with the evaporation chamber. The heat generated by the power device is transferred to the evaporation chamber via the heat-conducting substrate. The refrigerant in the evaporation chamber is vaporized by the heat and enters the condenser. After being condensed into liquid by the condenser, it flows back to the evaporation chamber. The heat-conducting substrate has a second surface, the second surface and the first surface are arranged opposite to each other, and at least a portion of the second surface is immersed in the refrigerant.

2. The heat dissipation system according to claim 1, wherein: The refrigerant is condensed into liquid in the condenser and then flows back to the evaporation chamber by gravity.

3. The heat dissipation system according to claim 1 or 2, characterized in that: When the heat dissipation system is placed along the direction of gravity, the condenser is located above the evaporator.

4. The heat dissipation system according to claim 1 or 2, characterized in that: The evaporator is connected to the condenser via at least one liquid flow pipe and at least one gas flow pipe.

5. The heat dissipation system according to claim 1, wherein: The at least partial surface includes the second surface and at least a portion of the outer side surface of the thermally conductive substrate.

6. The heat dissipation system according to claim 1, wherein: The second surface is provided with a heat dissipation enhancement structure, and the heat dissipation enhancement structure is located in the heat dissipation enhancement area of the second surface, and is used to increase the area of the heat conductive substrate immersed in the refrigerant; Along the thickness direction of the thermally conductive substrate, at least a portion of the projection of the power device on the second surface is located within the heat dissipation enhanced region.

7. The heat dissipation system according to claim 6, wherein: The heat dissipation enhancement structure is a groove or a protrusion located on the second surface, or the heat dissipation enhancement structure is a fin or a capillary structure provided on the second surface.

8. The heat dissipation system according to claim 1, wherein: The outer side surface of the heat-conducting substrate is sealed to the inner side wall of the window.

9. The heat dissipation system according to any one of claims 5 to 8, wherein: The inner side wall of the window is stepped, and the inner side wall includes a first sub-inner side wall, a second sub-inner side wall, and a connecting wall connecting the first sub-inner side wall and the second sub-inner side wall. The opening area formed by the circumference of the first sub-inner side wall is larger than the opening area formed by the circumference of the second sub-inner side wall. The thermal conductive substrate is located in the opening formed by the circumference of the first sub-inner side wall, and part of the second surface overlaps the connecting wall.

10. The heat dissipation system according to claim 9, wherein: The second surface further includes at least one protrusion, which extends into the evaporation chamber through an opening circumferentially formed by the second sub-inner sidewall.

11. The heat dissipation system according to claim 9, wherein: The outer side surface of the heat-conducting substrate is sealed to the first sub-inner side wall; or A portion of the second surface of the heat-conducting substrate overlapping the connecting wall is sealedly connected to the connecting wall.

12. The heat dissipation system according to claim 11, wherein: A sealing ring is provided between the outer side surface of the heat-conducting substrate and the inner side wall of the window. The sealing ring is sleeved on the heat-conducting substrate, and the inner side wall squeezes the sealing ring.

13. The heat dissipation system according to claim 1 or 2, characterized in that: The first surface has a first angle with the direction of gravity, and the first angle is greater than or equal to 0° and less than or equal to 180°.

14. A power device, characterized in that: The heat dissipation system comprises a chassis and the heat dissipation system according to any one of claims 1 to 13, wherein the evaporator is located inside or outside the chassis, and the condenser is located outside the chassis.

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