Heat plate and electronic device

Abstract

The application belongs to the technical field of electronics, and discloses a vapor chamber and electronic equipment. The vapor chamber comprises a first cover plate, a second cover plate and a capillary structure. The first cover plate and the second cover plate are arranged in layers, and the capillary structure is arranged between the first cover plate and the second cover plate. At least one of the first cover plate and the second cover plate is provided with a recessed part, the recessed part is supported on the capillary structure, a containing cavity is formed between the first cover plate and the second cover plate, and the capillary structure is arranged in the containing cavity.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronics, and particularly relates to a vapor chamber and an electronic device. BACKGROUND

[0002] As a kind of efficient heat transfer device, the vapor chamber is widely used in electronic devices such as mobile phones and tablet computers. The vapor chamber generally includes a first cover plate, a second cover plate, a capillary structure and a working medium. The first cover plate, the capillary structure and the second cover plate are stacked, and a containing cavity with a vacuum environment is formed between the first cover plate and the second cover plate. The capillary structure and the working medium are arranged in the containing cavity.

[0003] In actual application, it is found that a support column needs to be arranged in the containing cavity of the existing vapor chamber to stably support the support column between the first cover plate and the second cover plate, so as to ensure the stability of the structure of the containing cavity. The capillary structure and the support column are usually formed on the second cover plate by etching. This processing method is complicated to operate, increases the thickness of the second cover plate, and is difficult to realize the unfolding and bending application of the vapor chamber in special application scenarios. SUMMARY

[0004] The present application aims to provide a vapor chamber and an electronic device, which at least solve the problem that the existing vapor chamber is complicated to manufacture and difficult to unfold and bend.

[0005] In order to solve the above technical problems, the present application is implemented as follows:

[0006] In a first aspect, the embodiments of the present application propose a vapor chamber, which includes a first cover plate, a second cover plate and a capillary structure. The first cover plate and the second cover plate are stacked, and the capillary structure is arranged between the first cover plate and the second cover plate.

[0007] At least one of the first cover plate and the second cover plate is provided with a recessed part, the recessed part is supported on the capillary structure, a containing cavity is formed between the first cover plate and the second cover plate, and the capillary structure is arranged in the containing cavity.

[0008] According to the vapor chamber proposed in the embodiments of the present application, the vapor chamber includes a bendable section and a non-bendable section, the bendable section and the non-bendable section are connected, and the bendable section can be bent along a bending line.

[0009] The part of the first cover plate located in the bendable section is provided with a plurality of recessed parts. The plurality of recessed parts are arranged along the direction of the bending line, and each recessed part extends along the extension direction of the bendable section to the non-bendable section.

[0010] According to an embodiment of the present application, a kind of heat plate is provided, the bendable section has flat state and bending state;In the case where the bendable section is in flat state, the recess depth of the recess is first depth;In the case where the bendable section is in bending state, the recess depth of the recess is second depth;

[0011] The first depth is greater than the second depth.

[0012] According to an embodiment of the present application, a kind of heat plate is provided, the recess is groove-shaped, and has slot end;Along the extension direction of the recess from the part close to the bending line of the recess to both ends of the recess, the slot width of the slot end gradually decreases.

[0013] According to an embodiment of the present application, a kind of heat plate is provided, the first cover plate and the second cover plate are located in the part of the bendable section and are provided with a plurality of recesses;

[0014] The recess on the first cover plate and the recess on the second cover plate are oppositely arranged, and the capillary structure is clamped between the recess on the first cover plate and the recess on the second cover plate.

[0015] According to an embodiment of the present application, a kind of heat plate is provided, in the bendable section, the recess between two adjacent recesses is provided with protruding part;

[0016] The protruding part extends along the extension direction of the recess;Along the thickness direction of the heat plate, the recess and the protruding part are arranged in opposite directions.

[0017] According to an embodiment of the present application, a kind of heat plate is provided, the first cover plate and the second cover plate are located in the part of the non-bending section and are provided with the recess, and the capillary structure is clamped between the recess on the first cover plate and the recess on the second cover plate.

[0018] According to an embodiment of the present application, a kind of heat plate is provided, the first cover plate and the second cover plate include working area and sealing area;

[0019] The sealing area is arranged along the circumferential direction of the working area, and the working area of the first cover plate and the working area of the second cover plate form the accommodating cavity, and the sealing area of the first cover plate and the sealing area of the second cover plate are connected;

[0020] On the side of the first cover plate away from the second cover plate, the working area and the sealing area of the first cover plate have height difference;And / or, on the side of the second cover plate away from the first cover plate, the working area and the sealing area of the second cover plate have height difference.

[0021] In a second aspect, an electronic device is provided, wherein the electronic device is installed with the vapor chamber as in any of the above.

[0022] According to the electronic device provided in the embodiments of the present application, the first support body, the hinge assembly, the second support body and the foldable screen are provided, and the vapor chamber includes the bendable section and the non-bendable sections, the non-bendable sections include the first non-bendable section and the second non-bendable section, and the first non-bendable section, the bendable section and the second non-bendable section are sequentially connected along the extension direction of the recess on the bendable section.

[0023] The first support body and the second support body are connected through the hinge assembly, the foldable screen is installed on the first support body and the second support body, the first non-bendable section is connected with the first support body, and the second non-bendable section is connected with the second support body.

[0024] In the embodiments of the present application, by providing the recess on the first cover plate and the second cover plate, the recess can be used to automatically form the accommodating cavity between the first cover plate and the second cover plate after the capillary structure is installed between the first cover plate and the second cover plate, and the capillary structure is supported by the recess, so that the assembled vapor chamber can meet the basic heat transfer performance.

[0025] Compared with the prior art, the vapor chamber provided in the present application has a simple structure and is easy to manufacture, the thickness of the first cover plate and the second cover plate can be reduced, and the application requirements of the vapor chamber in special application scenarios, such as unfolding and bending, can be met.

[0026] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter in the description of the application. BRIEF DESCRIPTION OF DRAWINGS

[0027] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the description of the embodiments, taken in conjunction with the following drawings in which:

[0028] Figure 1 is a structural schematic diagram of a vapor chamber according to an embodiment of the present application;

[0029] Figure 2 is a structural schematic diagram of a vapor chamber according to an embodiment of the present application in a flat state;

[0030] Figure 3 is a structural schematic diagram of a bendable section according to an embodiment of the present application along Figure 2 is a sectional view of the vapor chamber along line A-A in FIG. 4;

[0031] Figure 4 is a sectional view of the first non-bendable section along line B-B in FIG. 5; Figure 2A cross-sectional view of the B-B line;

[0032] Figure 5 is a structural schematic diagram of the vapor chamber in a 90° folded state according to an embodiment of the present application;

[0033] Figure 6 is a cross-sectional schematic diagram of the bendable section shown in Figure 5

[0034] Figure 7 is a structural schematic diagram of the vapor chamber in a 180° folded state according to an embodiment of the present application;

[0035] Figure 8 is a cross-sectional schematic diagram of the bendable section shown in Figure 7

[0036] Figure 9 is an exploded schematic diagram of the electronic device in an unfolded state according to an embodiment of the present application;

[0037] Figure 10 is an exploded schematic diagram of the electronic device in a folded state according to an embodiment of the present application.

[0038] Reference signs:

[0039] 1, vapor chamber; 2, first support body; 3, hinge assembly; 4, second support body; 5, folding screen; 6, back cover;

[0040] 11, first cover plate; 12, second cover plate; 13, capillary structure; 101, accommodating cavity; 111, bendable section; 112, first non-bendable section; 112, non-bendable section; 1121, first non-bendable section; 1122, second non-bendable section; 121, recessed part; 1210, notch end; 122, protruding part; 1001, working area; 1002, sealing area; 301, first hinge unit; 302, second hinge unit. DETAILED DESCRIPTION

[0041] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0042] ​​The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0043] In the description of the present application, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "inner", "outer", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0044] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0045] The following will be described in detail Figures 1 to 10 , through specific embodiments and application scenarios, the uniform heating plate and electronic equipment provided by the embodiments of the present application are described in detail.

[0046] As Figures 1 to 3 shown, the present application provides a uniform heating plate, which comprises: a first cover plate 11, a second cover plate 12 and a capillary structure 13; the first cover plate 11 and the second cover plate 12 are stacked, and the capillary structure 13 is arranged between the first cover plate 11 and the second cover plate 12.

[0047] Further, at least one of the first cover plate 11 and the second cover plate 12 is provided with a recess 121, the recess 121 is supported on the capillary structure 13, and a containing cavity 101 is formed between the first cover plate 11 and the second cover plate 12, so that the capillary structure 13 and the working medium can be arranged in the containing cavity 101.

[0048] It can be understood that the first cover plate 11 and the second cover plate 12 can be made of materials with good elasticity, bending resistance and sealing performance. For example, the materials of the first cover plate 11 and the second cover plate 12 can be metals such as stainless steel, copper, copper alloy, or high polymer materials and other composite materials prepared by rolling, sputtering, doping and the like.

[0049] The capillary structure 13 has good capillary force and can transport the working medium in the accommodation cavity 101 through capillary action. The capillary structure 13 includes but is not limited to copper mesh, copper powder, and groove capillary structure.

[0050] In actual application, the recess 121 can be formed on the first cover plate 11 and / or the second cover plate 12 by stamping, hot pressing and the like. The recess 121 can be concave or strip-shaped, and the projection of the recess 121 along the thickness direction of the vapor chamber 1 can be circular or regular polygonal, and the like, which is not limited.

[0051] Optionally, when the recess 121 is concave, the recess 121 can be designed as a hemisphere; when the recess 121 is strip-shaped, the recess 121 can be arranged to extend along a predetermined path, for example, the recess 121 can extend linearly, arcuately or as a broken line.

[0052] When the recess 121 is formed on the first cover plate 11, the recess 121 protrudes from the side of the first cover plate 11 facing the second cover plate 12; correspondingly, when the recess 121 is formed on the second cover plate 12, the recess 121 protrudes from the side of the second cover plate 12 facing the first cover plate 11.

[0053] In this way, when the first cover plate 11 is provided with the recess 121, the second cover plate 12 can be designed as a plane, and the capillary structure 13 is attached to the side of the second cover plate 12 facing the first cover plate 11, so that the recess 121 on the first cover plate 11 is supported on the side of the capillary structure 13 away from the second cover plate 12.

[0054] When the first cover plate 11 is provided with the recess 121, the second cover plate 12 can also be designed as a plane, and the capillary structure 13 is attached to the side of the first cover plate 11 facing the second cover plate 12, so that the recess 121 is supported on the side of the capillary structure 13 facing the first cover plate 11, and the side of the capillary structure 13 away from the first cover plate 11 is supported on the side of the second cover plate 12 facing the first cover plate 11.

[0055] In the case that the first cover plate 11 and the second cover plate 12 are both configured with the recesses 121, the capillary structure 13 can be attached to the side of the second cover plate 12 facing the first cover plate 11, so that the recesses 121 on the first cover plate 11 are supported on the side of the capillary structure 13 facing away from the second cover plate 12, and the recesses 121 on the second cover plate 12 are supported on the side of the capillary structure 13 facing away from the first cover plate 11.

[0056] Therefore, by setting the recesses 121 on the first cover plate 11 and the second cover plate 12, the structure characteristics of the recesses 121 can be utilized to automatically form the accommodation cavity 101 between the first cover plate 11 and the second cover plate 12 after the capillary structure 13 is installed between the first cover plate 11 and the second cover plate 12, and the recesses 121 can provide support for the capillary structure 13, thereby ensuring that the assembled vapor chamber has heat transfer performance.

[0057] Compared with the prior art, the vapor chamber 1 of the present application has a simple structure and is easy to manufacture, and can reduce the thickness of the first cover plate 11 and the second cover plate 12, thereby meeting the application requirements of unfolding and bending of the vapor chamber 1 in special application scenarios.

[0058] It should be pointed out here that the vapor chamber 1 of the present embodiment can be applied to electronic devices, for example, the vapor chamber 1 is arranged between the screen module and the middle frame assembly of the electronic device, and the vapor chamber 1 can conduct heat on the screen module to the middle frame assembly for heat dissipation through the middle frame assembly.

[0059] In some embodiments, as shown in Figures 1 to 3 the vapor chamber 1 of the present application includes a bendable section 111 and a non-bendable section 112; the bendable section 111 and the non-bendable section 112 are connected, and the bendable section 111 can be bent along a bending line K. The bending line K is schematically shown by a dashed line in Figure 1 .

[0060] The part of the first cover plate 11 located in the bendable section 111 is provided with a plurality of recesses 121; the plurality of recesses 121 are arranged along the direction of the bending line K, and each recess 121 extends along the extension direction of the bendable section 111 to the non-bendable section 112, so as to separate the accommodation cavity 101 into a plurality of unit cavities.

[0061] In actual application, since the direction corresponding to the bending line K of the bendable section 111 and the extension direction of the recesses 121 are perpendicular when the bendable section 111 is bent, based on the arrangement direction and the extension direction of the plurality of recesses 121, not only the support requirement of the capillary structure 13 can be met, but also the mechanical strength of the bendable section 111 can be enhanced, thereby ensuring that the bendable section 111 has good bending resistance.

[0062] In some embodiments, the plurality of recesses 121 are arranged on the portion of the first cover plate 11 located in the bendable section 111, and the portion of the second cover plate 12 located in the bendable section 111 is free of the plurality of recesses 121. In some other embodiments, the plurality of recesses 121 are arranged on both the portion of the first cover plate 11 located in the bendable section 111 and the portion of the second cover plate 12 located in the bendable section 111.

[0063] Meanwhile, based on the arrangement of the plurality of recesses 121, the plurality of recesses 121 divide the accommodation cavity 101 into a plurality of unit cavities, each of which is arranged between two adjacent recesses 121.

[0064] In some embodiments, the bendable section 111 has a flat state and a bent state. When the bendable section 111 is in the flat state, the recesses 121 have a first recess depth.

[0065] When the bendable section 111 is in the bent state, the recesses 121 have a second recess depth, so that the accommodation cavity 101 reaches a second volume. The first recess depth is greater than the second recess depth.

[0066] When the recesses 121 have the first recess depth, the accommodation cavity 101 reaches a first volume. When the recesses 121 have the second recess depth, the accommodation cavity 101 reaches a second volume, and the first volume is greater than the second volume.

[0067] It can be understood that, when the bendable section 111 is not subjected to external force, the bendable section 111 is in the flat state. At this time, the recesses 121 maintain a large recess depth, so that the accommodation cavity 101 reaches the first volume, thereby ensuring that the bendable section 111 has good heat transfer capacity.

[0068] However, as the bendable section 111 is subjected to bending action, the bendable section 111 gradually deforms. Since the bending direction of the bendable section 111 is perpendicular to the extension direction of the recesses 121, under the surface tension of the first cover plate 11 or the second cover plate 12 of the bendable section 111, the recesses 121 arranged on the first cover plate 11 or the second cover plate 12 gradually expand, the recess depth of the recesses 121 decreases from the first recess depth to the second recess depth, so that the volume of the accommodation cavity 101 decreases from the first volume to the second volume, resulting in a gradual decrease in the heat transfer capacity of the bendable section 111.

[0069] When the recess depth of the recess 121 is reduced to zero, one side surface of the capillary structure 13 and one side surface of the first cover plate 11 facing the second cover plate 12 are attached, and the other side surface of the capillary structure 13 and one side surface of the second cover plate 12 facing the first cover plate 11 are attached, at this time, the overall thickness of the bendable section 111 is reduced to a minimum value, and the bendable section 111 is difficult to maintain the normal heat transfer capacity of the existing vapor chamber 1.

[0070] As shown in Figure 2 and Figure 3 , when the bendable section 111 is in a flat state, the recess depth of the recess 121 is a first depth H1.

[0071] As shown in Figure 5 and Figure 6 , when the bendable section 111 is bent from the flat state to a 90° bent state, the recess depth of the recess 121 is a third depth H3.

[0072] As shown in Figure 7 and Figure 8 , when the bendable section 111 is bent from the 90° bent state to a 180° bent state, the recess depth of the recess 121 is a second depth H2. Among them, H1>H3>H2, and H2 is close to zero.

[0073] Conversely, in the process of switching the bendable section 111 from the 180° bent state to the flat state, the recess depth of the recess 121 gradually recovers from the second depth H2 to the first depth H1, and the bendable section 111 recovers the heat transfer capacity.

[0074] In some embodiments, as shown in Figure 1 , the recess 121 of the present application is in a groove shape and has a slot end 1210; along the extension direction of the recess 121 from the position close to the bending line K to both ends of the recess 121, the slot width of the slot end 1210 gradually decreases.

[0075] Here, based on the setting of the shape of the recess 121, the stress concentration of each part of the recess 121 can be reduced to a certain extent during the bending of the bendable section 111, and the stress of the bendable section cover plate is reduced, which reduces the bending difficulty of the bendable section 111 while ensuring the bending resistance of the bendable section 111.

[0076] Based on the above setting, when the bendable section 111 is in a flat state, the width of the position close to the bending line K of the bendable section 111 is smaller than the width of both ends of the bendable section 111 along the direction of the bending line K; when the bendable section 111 is in a 180° bent state, the width of the position close to the bending line K of the bendable section 111 is equal to or close to the width of both ends of the bendable section 111 along the direction of the bending line K.

[0077] In some embodiments, as shown in Figure 3 The first cover plate 11 and the second cover plate 12 of the embodiments of the present application are provided with a plurality of recesses 121 on the part of the bendable section 111.

[0078] The recesses 121 on the first cover plate 11 and the recesses 121 on the second cover plate 12 are oppositely arranged, and the capillary structure 13 is clamped between the recesses 121 on the first cover plate 11 and the recesses 121 on the second cover plate 12.

[0079] Among them, at least part of the recesses 121 on the first cover plate 11 and each recess 121 on the second cover plate 12 can be oppositely arranged one by one, or each recess 121 on the first cover plate 11 and each recess 121 on the second cover plate 12 can be oppositely arranged one by one.

[0080] Here, based on the one-to-one support formed by the recesses 121 between the first cover plate 11 and the second cover plate 12, the stability of the structure of the accommodation cavity 101 between the first cover plate 11 and the second cover plate 12 can be ensured, and when the bendable section 111 is in a flat state, the accommodation cavity 101 can reach a relatively large volume.

[0081] In some embodiments, as shown in Figure 3 In actual application scenarios, in order to further increase the design volume of the accommodation cavity 101, the embodiments of the present application are provided with a protrusion 122 between the two adjacent recesses 121 on the bendable section 111; the protrusion 122 extends along the extension direction of the recess 121; along the thickness direction of the vapor chamber 1, the recess 121 and the protrusion 122 are arranged in opposite directions.

[0082] It can be understood that when the first cover plate 11 is provided with recesses 121 and protrusions 122, the recesses 121 and the protrusions 122 are alternately arranged along the width direction of the first cover plate 11, the recesses 121 are arranged on the side of the first cover plate 11 facing the second cover plate 12, and the protrusions 122 are arranged on the side of the first cover plate 11 away from the second cover plate 12.

[0083] When the second cover plate 12 is provided with recesses 121 and protrusions 122, the recesses 121 and the protrusions 122 are alternately arranged along the direction of the bending line K, the recesses 121 are arranged on the side of the second cover plate 12 facing the first cover plate 11, and the protrusions 122 are arranged on the side of the second cover plate 12 away from the first cover plate 11.

[0084] Obviously, when the recesses 121 on the first cover plate 11 and the recesses 121 on the second cover plate 12 are arranged one by one, the protrusions 122 on the first cover plate 11 and the protrusions 122 on the second cover plate 12 are arranged one by one, so that the first cover plate 11 and the second cover plate 12 are both wavy.

[0085] In actual application, the first side of the first cover plate 11 (the second cover plate 12) can be punched to form a plurality of recesses 121, and then the second side of the first cover plate 11 (the second cover plate 12) is punched to form a plurality of protrusions 122, which is simple and convenient to operate.

[0086] In some embodiments, as shown in Figure 1 The first cover plate 11 and the second cover plate 12 of the embodiment of the application are both provided with recesses 121 at the part of the non-bending section 112, and the capillary structure 13 is clamped between the recesses 121 on the first cover plate 11 and the recesses 121 on the second cover plate 12.

[0087] Specifically, when the vapor chamber 1 is applied to a foldable electronic device, the non-bending section 112 includes a first non-bending section 1121 and a second non-bending section 1122; along the extension direction of the recesses 121 on the bendable section 111, the first non-bending section 1121, the bendable section 111 and the second non-bending section 1122 are connected in sequence, and the embodiment can be provided with oppositely arranged recesses 121 at the part of the first cover plate 11 and the second cover plate 12 located in the first non-bending section 1121, or can be provided with oppositely arranged recesses 121 at the part of the first cover plate 11 and the second cover plate 12 located in the second non-bending section 1122.

[0088] As shown in Figure 9 and Figure 10 The electronic device includes a first support body 2, a hinge assembly 3, a second support body 4 and a foldable screen 5. The first support body 2 and the second support body 4 are connected through the hinge assembly 3, the foldable screen 5 is installed on the first support body 2 and the second support body 4, the first non-bending section 1121 of the vapor chamber 1 is connected with the first support body 2, and the second non-bending section 1122 of the vapor chamber 1 is connected with the second support body 4.

[0089] Since the first support body 2 and the second support body 4 can be relatively rotated through the hinge assembly 3, when the angle of the first support body 2 and the second support body 4 changes, the included angle of the first non-bending section 1121 and the second non-bending section 1122 of the vapor chamber 1 will be adaptively changed.

[0090] Thus, in practical applications, when the electronic device is in a flat state, the bendable section 111 of the heat spreader 1 is in a flat state, and the first non-bendable section 1121, the bendable section 111, and the second non-bendable section 1122 can reach or approach a coplanar state; when the electronic device is in a folded state, the bendable section 111 of the heat spreader 1 is in a 180° bend state, and the first non-bendable section 1121 and the second non-bendable section 1122 of the heat spreader 1 are parallel.

[0091] Furthermore, in this embodiment, a plurality of recesses 121 can be provided on one side of the non-bending section 112 of the first cover plate 11 facing the second cover plate 12, and a plurality of recesses 121 can be provided on one side of the non-bending section 112 of the second cover plate 12 facing the first cover plate 11. The plurality of recesses 121 on the first cover plate 11 are arranged opposite to each other and are arranged in an array.

[0092] Meanwhile, each recess 121 shown in this embodiment can be either concave or strip-shaped, and there is no specific limitation on this.

[0093] In some embodiments, such as Figure 1 As shown, in this embodiment of the application, both the first cover plate 11 and the second cover plate 12 include a working area 1001 and a sealing area 1002. The sealing area 1002 extends circumferentially along the working area 1001. The working area 1001 of the first cover plate 11 and the working area 1001 of the second cover plate 12 form a receiving cavity 101. The sealing areas 1002 of the first cover plate 11 and the second cover plate 12 can be connected by welding, heat sealing, glue sealing, or other methods to ensure the sealing of the receiving cavity 101.

[0094] In some embodiments, in order to ensure the volume of the receiving cavity 101, a height difference may be provided between the working area 1001 and the sealing area 1002 of the first cover plate 11 on the side opposite to the second cover plate 12.

[0095] Optionally, in this embodiment, a groove can be constructed on one side of the working area 1001 of the first cover plate 11 facing the second cover plate 12, in the normal direction of the side of the first cover plate 11 facing away from the second cover plate 12, so that a height difference is formed between the working area 1001 and the sealing area 1002 of the first cover plate 11. In the above embodiment, the recessed portion 121 is provided in the working area 1001 of the first cover plate 11, and the recessed portion 121 is recessed on the side of the first cover plate 11 facing the second cover plate 12.

[0096] Thus, when the capillary structure 13 is sandwiched between the working area 1001 of the first cover plate 11 and the working area 1001 of the second cover plate 12, it can be ensured that the capillary structure 13 is located in the groove of the first cover plate 11 and the receiving cavity 101 formed by the second cover plate 12.

[0097] In some embodiments, in order to ensure the volume of the accommodating cavity 101, the second cover plate 12 can also be provided with a height difference between the working area 1001 and the sealing area 1002 on the side away from the first cover plate 11.

[0098] Alternatively, the second cover plate 12 can be provided with a groove on the working area 1001 of the second cover plate 12 towards the side of the first cover plate 11 in the normal direction of the side away from the first cover plate 11, so that the working area 1001 and the sealing area 1002 of the second cover plate 12 form a height difference. In the above embodiment, the recess 121 is provided on the working area 1001 of the second cover plate 12, and the recess 121 is recessed on the side of the second cover plate 12 towards the first cover plate 11.

[0099] In this way, when the capillary structure 13 is clamped between the working area 1001 of the first cover plate 11 and the working area 1001 of the second cover plate 12, the capillary structure 13 can be ensured to be located in the recess of the first cover plate 11 and the accommodating cavity 101 formed by the second cover plate 12.

[0100] Of course, according to the actual heat transfer requirement, while the first cover plate 11 is provided with a height difference between the working area 1001 and the sealing area 1002, the second cover plate 12 can also be provided with a height difference between the working area 1001 and the sealing area 1002, so as to set the capillary structure 13 of the corresponding specification in the accommodating cavity 101 between the first cover plate 11 and the second cover plate 12.

[0101] In a second aspect, the present application provides an electronic device, wherein the electronic device is provided with the vapor chamber 1 according to any one of the above embodiments.

[0102] Specifically, since the electronic device comprises the vapor chamber 1, and the specific structure of the vapor chamber 1 is as described in the above embodiments, the electronic device shown in the present embodiment comprises all the technical solutions of the above embodiments, and therefore at least has all the beneficial effects of all the technical solutions of the above embodiments, which will not be described here.

[0103] In the present application, the electronic device can be a mobile terminal, such as a smart phone, a tablet personal computer (Tablet Personal Computer), a laptop computer (Laptop Computer), a personal digital assistant (personal digital assistant, PDA), a mobile Internet device (Mobile Internet Device, MID) or a wearable device (Wearable Device), etc., and can also be other electronic devices, such as a digital camera, an electronic book, a navigator, etc.

[0104] In some embodiments, as shown in Figure 1 , Figure 9 and Figure 10 , the electronic device of the embodiments of the present application comprises a first support body 2, a hinge assembly 3, a second support body 4 and a folding screen 5. The heat plate comprises a bendable section 111 and a non-bendable section 112, the non-bendable section 112 comprising a first non-bendable section 1121 and a second non-bendable section 1122; along the extension direction of the recess 121 on the bendable section 111, the first non-bendable section 1121, the bendable section 111 and the second non-bendable section 1122 are sequentially connected.

[0105] The first support body 2 and the second support body 4 are connected through the hinge assembly 3, the folding screen 5 is installed on the first support body 2 and the second support body 4, the first non-bendable section 1121 of the heat plate 1 is connected with the first support body 2, and the second non-bendable section 1122 of the heat plate 1 is connected with the second support body 4.

[0106] Based on the above settings, the electronic device of the embodiments of the present application has the characteristics of being foldable and can be switched between flat and folded states. Among them, the first support body 2, the hinge assembly 3 and the second support body 4 can constitute the middle frame assembly of the electronic device, the heat plate 1 is clamped between the folding screen 5 and the middle frame assembly, and the back cover 6 of the electronic device can be provided on the side of the middle frame assembly away from the folding screen 5.

[0107] In actual application, the hinge assembly 3 comprises a first hinge unit 301 and a second hinge unit 302, the first hinge unit 301 and the second hinge unit 302 are arranged in a spaced manner, the heat plate 1 can be arranged between the first hinge unit 301 and the second hinge unit 302, and the first hinge unit 301, the heat plate 1 and the second hinge unit 302 are arranged along the direction of the rotation axis of the electronic device.

[0108] Further, the first mounting groove can be arranged on the first support body 2, the second mounting groove can be arranged on the second support body 4, the first non-bendable section 1121 of the heat plate 1 is installed in the first mounting groove, the second non-bendable section 1122 of the heat plate 1 is installed in the second mounting groove, and the bendable section 111 of the heat plate 1 is arranged between the first hinge unit 301 and the second hinge unit 302 along the direction of the rotation axis of the electronic device.

[0109] In this way, when the electronic device is in a flat state, since the first non-bendable section 1121, the bendable section 111 and the second non-bendable section 1122 on the heat plate 1 all have good heat transfer capacity, the heat plate 1 can conduct the heat on the folding screen 5 to any one of the first support body 2 and the second support body 4, or conduct the heat on the first support body 2 to the second support body 4, or conduct the heat on the second support body 4 to the first support body 2.

[0110] Correspondingly, when the electronic device is in the folded state, due to the limited heat transfer capacity of the bendable section 111 on the vapor chamber 1, the first non-bendable section 1121 and the second non-bendable section 1122 on the vapor chamber 1 can also work independently, conducting the heat on the folding screen 5 to the area on the middle frame assembly corresponding to the folding screen 5.

[0111] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0112] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A heat spreader, characterized in that, include: First cover plate, second cover plate, and capillary structure; The first cover plate and the second cover plate are stacked, and the capillary structure is sandwiched between the first cover plate and the second cover plate; The heat spreader includes a bendable section and a non-bendable section, which are connected. The bendable section is bent along a bend line. The first cover plate and the second cover plate are each provided with a plurality of recesses in the portion of the bendable section. The plurality of recesses are arranged along the direction of the bend line, and each recess extends along the extension direction from the bendable section to the non-bendable section. The recesses are supported on the capillary structure, and a receiving cavity is formed between the first cover plate and the second cover plate. The capillary structure is disposed in the receiving cavity. The bendable section has a flat state and a bent state; when the bendable section is in the flat state, the recessed depth of the recess is a first depth, and the receiving cavity reaches a first volume; when the bendable section is in the bent state, the recessed depth of the recess is a second depth, and the receiving cavity reaches a second volume; the first depth is greater than the second depth, and the first volume is greater than the second volume. The recessed portion on the first cover plate and the recessed portion on the second cover plate are arranged opposite to each other, and the capillary structure is sandwiched between the recessed portion on the first cover plate and the recessed portion on the second cover plate, forming a one-to-one relative support based on the recessed portion between the first cover plate and the second cover plate.

2. The heat spreader according to claim 1, characterized in that, The recessed portion is groove-shaped and has a groove opening end; along the extension direction of the recessed portion near the bending line to both ends of the recessed portion, the groove opening width of the groove opening end gradually decreases.

3. The heat spreader according to claim 1, characterized in that, In the bendable section, a protrusion is provided between two adjacent recesses; The protrusion extends along the extension direction of the recess; along the thickness direction of the heat spreader, the recess and the protrusion extend in opposite directions.

4. The heat spreader according to claim 1, characterized in that, The first cover plate and the second cover plate are both provided with the recessed portion in the non-bending section, and the capillary structure is sandwiched between the recessed portion on the first cover plate and the recessed portion on the second cover plate.

5. The heat spreader according to any one of claims 1 to 4, characterized in that, Both the first cover plate and the second cover plate include a working area and a sealing area; The sealing area extends circumferentially along the working area, and the working area of ​​the first cover plate and the working area of ​​the second cover plate form the receiving cavity. The sealing area of ​​the first cover plate and the sealing area of ​​the second cover plate are connected. On one side of the first cover plate away from the second cover plate, there is a height difference between the working area and the sealing area of ​​the first cover plate; and / or, on one side of the second cover plate away from the first cover plate, there is a height difference between the working area and the sealing area of ​​the second cover plate.

6. An electronic device, characterized in that, The electronic device is equipped with a heat spreader as described in any one of claims 1 to 5.

7. The electronic device according to claim 6, characterized in that, It includes a first support body, a hinge assembly, a second support body, and a folding screen; the heat spreader includes a bendable section and a non-bendable section, the non-bendable section including a first non-bendable section and a second non-bendable section; along the extending direction of the recess on the bendable section, the first non-bendable section, the bendable section, and the second non-bendable section are connected sequentially; The first support body and the second support body are connected by the hinge assembly. The foldable screen is mounted on the first support body and the second support body. The first non-bending section is connected to the first support body, and the second non-bending section is connected to the second support body.

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