Mounting fixtures, mounting equipment, mounting methods, and diaphragm sensors

Abstract

This invention discloses a mounting fixture, mounting equipment, mounting method, and diaphragm sensor, relating to the field of acoustic and electronic technology. The mounting fixture includes a first suction nozzle, a fixing member, and a ejector pin arranged sequentially. The fixing member is used to fix release paper; the ejector pin is used to pass through the release paper to at least partially detach a patch detachably attached to the release paper; the first suction nozzle is used to connect to a negative pressure generating device and to adsorb the at least partially detached patch. After passing through the release paper, the ejector pin of the mounting fixture can at least partially detach the patch detachably attached to the release paper, reducing the difficulty of removing the patch from the release paper and improving the overall efficiency of patch mounting; after adsorbing the at least partially detached patch, the first suction nozzle can be used to move the patch to a through-hole structure on a circuit board, preventing water, moisture, oil, or fumes from entering through the through-hole structure and reducing the probability of diaphragm sensor failure.

Description

Technical Field

[0001] This invention relates to the field of acoustic and electronic technology, and in particular to a mounting fixture, mounting equipment, mounting method, and diaphragm sensor. Background Technology

[0002] For diaphragm-type sensors such as ECM (Electret Capacitance Microphone), MEMS (Micro Electro Mechanical System) microphones, and ECM-type airflow sensors for smoke applications, the functionality typically involves components such as a PCB (Printed Circuit Board) with through-holes and a diaphragm working together. Diaphragm-type sensors have a higher probability of failure in environments containing water, moisture, oil, or fumes. Summary of the Invention

[0003] The main objective of this invention is to propose a mounting fixture designed to reduce the probability of failure of diaphragm sensors.

[0004] To achieve the above objectives, the present invention proposes a mounting fixture for mounting patches, wherein the patch comprises an outer layer and an adhesive layer stacked on top of each other, the outer layer being fixedly connected to the adhesive layer; the mounting fixture comprises a first suction nozzle, a fixing member, and a ejector pin arranged sequentially, the fixing member being used to fix release paper; the ejector pin being used to pass through the release paper to at least partially eject the patch detachably attached to the release paper; the first suction nozzle being used to connect to a negative pressure generating device, the first suction nozzle being used to absorb at least partially ejected patches.

[0005] Optionally, the fixing member includes a fixing plate with a first through hole for the release paper to cover it, and the fixing plate is fixedly connected to the release paper; the fixing plate includes a fixing ring and a connecting film, the connecting film covers the fixing ring and is fixedly connected to the fixing ring; the first through hole is disposed on the connecting film, and the connecting film is fixedly connected to the release paper.

[0006] Optionally, the end of the ejector pin used to pass through the release paper is configured as an arc-shaped surface, the diameter of the arc-shaped surface being greater than or equal to 0.01 mm and less than 0.02 mm; the ejector pin includes a connecting section and a conical section connected together, the diameter of the conical section gradually decreasing in the direction away from the connecting section; the arc-shaped surface is disposed on the end of the conical section opposite to the connecting section.

[0007] Optionally, the mounting fixture further includes a second suction nozzle, which is connected to a negative pressure generating device and is used to adsorb the side of the release paper away from the patch; the ejector pin is used to move relative to the second suction nozzle along its axial direction; the ejector pin is disposed inside the second suction nozzle, and the second suction nozzle is provided with a cover plate, the flat surface of which is used to abut against the side of the release paper away from the patch; the cover plate is provided with a second through hole for the ejector pin to pass through; the diameter of the second through hole is larger than the outer diameter of the ejector section of the ejector pin; and / or, the cover plate is further provided with a through structure that penetrates the cover plate along its thickness direction; the mounting fixture includes at least two ejector pins, which are positioned along a predetermined circumferential direction. The following configurations are provided: the cover plate has at least two second through holes arranged along the preset circumferential direction, and each second through hole is connected to a corresponding ejector pin; the through structure includes a third through hole and / or a connecting seam; the connecting seam communicates with the second through hole; the cover plate has at least two connecting seams, each connecting seam is connected to a corresponding second through hole; the connecting seam extends perpendicular to the circumferential direction; and / or, the first suction nozzle includes an adsorption tube segment, the inner side of the end plane of the adsorption tube segment is used to abut against the patch, the outer side of the end plane of the adsorption tube segment is provided with an annular plate, the annular plate extends circumferentially along the adsorption tube segment; the outer wall of the adsorption tube segment is provided with an avoidance notch, the avoidance notch extends to the end plane of the adsorption tube segment.

[0008] This application also proposes a mounting device, which includes the mounting fixture described above. The mounting device further includes a negative pressure generating device and a fixing seat, wherein the fixing seat is used for detachable connection with the fixing component.

[0009] Optionally, the mounting equipment further includes a movable arm fixedly connected to the first suction nozzle, the movable arm being used to move the patch to the fourth through hole on the cover circuit board; the mounting equipment further includes a lifting device fixedly connected to the ejector pin, the lifting device being used to move the ejector pin toward the release paper; the mounting equipment further includes a moving device, the moving device being used to move the lifting device so that the ejector pin passes through different positions on the release paper.

[0010] This application also proposes a mounting method, which includes the following steps: providing release paper and a patch, the patch including an outer layer and an adhesive layer stacked on top of each other, the outer layer being fixedly connected to the adhesive layer, and the adhesive layer being detachably connected to the release paper; passing a pin through the release paper to push at least a portion of the adhesive layer away from the release paper; picking up the patch through a first suction nozzle; and mounting the patch onto a fourth through hole on a cover circuit board.

[0011] Optionally, prior to the step of passing the ejector pin through the release paper to remove at least a portion of the adhesive layer from the release paper, the mounting method further includes: adsorbing the side of the release paper away from the patch using a second suction nozzle; the adhesive layer being configured as an adhesive ring; the step of passing the ejector pin through the release paper to remove at least a portion of the adhesive layer from the release paper includes: the distance from the position where the ejector pin abuts against the adhesive ring to the inner side of the adhesive ring being 40% to 60% of the width of the adhesive ring; the end of the ejector pin used to pass through the release paper being configured as an arc-shaped surface, the spherical diameter of the arc-shaped surface being greater than or equal to 0.01 mm and less than 0.02 mm; the thickness of the release paper being greater than or equal to 0.02 mm and less than 0.08 mm; and / or, the peel force of the release paper being set to 6 to 12 kgf.

[0012] Optionally, the adhesive layer is configured as an adhesive ring, with the outer side of the adhesive ring flush with the outer side of the outer layer; the first suction nozzle includes an adsorption tube segment, the diameter of the tube hole of the adsorption tube segment being larger than the inner diameter of the adhesive ring; the step of sucking up the patch through the first suction nozzle includes: ensuring that the distance from the wall surface of the tube hole of the adsorption tube segment to the inner side of the adhesive ring is 40% to 60% of the width of the adhesive ring. The outer layer is provided with a plurality of fifth through holes, the diameter of the fifth through holes being smaller than the diameter of the fourth through holes, and the air permeability of the outer layer is set to 500 to 900 L / m. 2 / s; The mounting method further includes: setting the absolute pressure of the negative pressure connected to the first suction nozzle to 40 to 80 kPa; the inner side of the end plane of the adsorption tube segment is used to abut against the patch, and an annular plate is provided on the outer side of the end plane of the adsorption tube segment, the annular plate extending circumferentially along the adsorption tube segment; the ratio of the distance from the annular plate to the end plane of the adsorption tube segment to the thickness of the patch is set to 0.4 to 0.6.

[0013] This application also proposes a diaphragm sensor, which includes a diaphragm and a circuit board. The circuit board has a fourth through hole that communicates with the diaphragm. The diaphragm sensor also includes a patch, which includes an outer layer and an adhesive layer stacked on top of each other. The outer layer is fixedly connected to the adhesive layer. The outer layer has a plurality of fifth through holes, the diameter of which is smaller than the diameter of the fourth through hole. The adhesive layer is configured as an adhesive ring, which is bonded to the circuit board. The outer layer covers the fourth through hole.

[0014] In the technical solution of the present invention, after the ejector pin of the mounting fixture passes through the release paper, it can at least partially push away the patch that is detachably connected to the release paper, reducing the difficulty of the patch leaving the release paper and improving the overall efficiency of patch mounting; after the first suction nozzle adsorbs the patch that has been pushed away at least partially, it can be used to move the patch to the through-hole structure on the circuit board, preventing water or water vapor, oil or fumes from entering through the through-hole structure and reducing the probability of diaphragm sensor failure. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram illustrating the use of an embodiment of the mounting fixture in this application.

[0017] Figure 2 This is a schematic diagram of an embodiment of the first suction nozzle in this application.

[0018] Figure 3 This is a schematic diagram illustrating the use of one embodiment of the fastener in this application.

[0019] Figure 4 This is a schematic diagram of one embodiment of the cover plate in this application.

[0020] Figure 5 This is a schematic diagram of another embodiment of the cover plate in this application.

[0021] Figure 6 This is a schematic diagram of an embodiment of the diaphragm sensor in this application.

[0022] Explanation of icon numbers:

[0023] label name label name 110 patch 111 outer layer 112 Adhesive layer 120 Release paper 210 First suction nozzle 211 Adsorption tube section 212 Ring plate 213 Avoiding gaps 220 Fasteners 221 retaining ring 222 Connecting membrane 223 First through hole 230 thimble 231 Connecting segment 232 Conical segment 240 Second suction nozzle 250 cover plate 251 Second through hole 252 Third through hole 253 seam 310 circuit board 311 Fourth through hole

[0024] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0026] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0027] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0028] This invention proposes a mounting fixture that can be used in the mounting equipment described below. The mounting equipment also includes components such as a negative pressure generating device, a fixed base, a movable arm, a lifting device, and a moving device for the movable lifting device.

[0029] Reference Figure 1 In one embodiment of the present invention, the mounting fixture is used to mount a patch 110, the patch 110 including an outer layer 111 and an adhesive layer 112 stacked together, the outer layer 111 and the adhesive layer 112 being fixedly connected; the mounting fixture includes tools for sequentially arranging (e.g., ... Figure 1 The first suction nozzle 210, the fixing member 220, and the ejector pin 230 are arranged sequentially from top to bottom as shown. The fixing member 220 is used to fix the release paper 120. The ejector pin 230 is used to pass through the release paper 120 to at least partially push away the patch 110 that is detachably connected to the release paper 120. The first suction nozzle 210 is used to connect to the negative pressure generating device and is used to absorb the patch 110 that has been at least partially pushed away.

[0030] After the ejector pin 230 of the mounting fixture passes through the release paper 120, it can at least partially push away the patch 110 that is detachably connected to the release paper 120, reducing the difficulty of the patch 110 leaving the release paper 120 and improving the overall efficiency of mounting the patch 110. After the first suction nozzle 210 picks up the patch 110 that has been pushed away at least partially, it can be used to move the patch 110 to the through-hole structure (such as the fourth through-hole 311) on the circuit board 310, preventing water or water vapor, oil or fumes from entering through the through-hole structure and reducing the probability of diaphragm sensor failure.

[0031] As an optional implementation method, refer to Figure 3 The fixing member 220 includes a fixing plate with a first through hole 223. The first through hole 223 is used for the release paper 120 to cover the fixing plate, and the fixing plate is used to fix and connect with the release paper 120. The first through hole 223 on the fixing plate can reduce the thickness that the ejector pin 230 needs to pass through, making the overall placement of the patch smoother.

[0032] Specifically, the fixing plate includes a fixing ring 221 and a connecting film 222. The connecting film 222 covers the fixing ring 221 and is fixedly connected to the fixing ring 221. A first through hole 223 is provided on the connecting film 222, which is used to fix the release paper 120. The connecting film 222 can be made of an adhesive material, or double-sided tape or glue can be applied to fix it to the fixing ring 221 and the release paper 120 through adhesion. It can be understood that the base paper layer of the release paper 120 is bonded to the adhesive connecting film 222, and the smoother side of the release paper 120 is bonded to the patch 110, making it easier to release the bond between the patch 100 and the release paper 120 (compared to the bond between the release paper 120 and the connecting film 222). In addition, the fixed connection between the connecting film 222 and the fixing ring 221 can also be achieved by snap-fit ​​connection, riveting, or other methods. By setting the fixing plate to include a fixing ring 221 and a connecting membrane 222, the connecting membrane 222 can improve the toughness of the fixing plate and prevent damage such as cracking of the fixing plate caused by the ejector pin 230 during the process of piercing the release paper 120.

[0033] As a further optional implementation, the end of the ejector pin 230 used to pass through the release paper 120 is configured with an arc-shaped surface, the diameter of the arc-shaped surface being greater than or equal to 0.01 mm and less than 0.02 mm, so that the ejector pin 230 can maintain a good ability to pierce the release paper 120, while also ensuring the durability of the end used to pass through the release paper.

[0034] As an optional implementation method, refer to Figure 1 The ejector pin 230 includes a connecting section 231 and a conical section 232 connected together. The diameter of the conical section 232 gradually decreases in the direction away from the connecting section 231, such as... Figure 1The cone-shaped section 232, or the gradually tapering section 231, is shown in a conical shape. The curved surface is located on the end of the cone section 232 facing away from the connecting section 231. The ejector pin 230 can maintain good piercing ability through the cone section 232 and good overall structural strength through the connecting section 231.

[0035] As an optional implementation method, refer to Figure 1 The mounting fixture also includes a second suction nozzle 240, which is connected to a negative pressure generating device and is used to pick up the side of the release paper 120 away from the patch 110; a pin 230 is used to move relative to the second suction nozzle 240 along its axial direction. (See reference...) Figure 1 In use, the second suction nozzle 240 first picks up the side of the release paper 120 away from the patch 110, and then the ejector pin 230 rises to pierce the release paper 120 and lift at least a portion of the adhesive layer 112, thereby lifting at least a portion of the entire patch 110. The second suction nozzle 240 can reduce the extent to which the release paper 120 is lifted by the ejector pin 230, which is more conducive to separating the patch 110 from the release paper 120.

[0036] As an optional implementation method, refer to Figure 1 The ejector pin 230 is disposed inside the second suction nozzle 240, and the second suction nozzle 240 is provided with a cover plate 250. The cover plate 250 can be integrally formed with the second suction nozzle 240 or detachably connected. The flat surface of the cover plate 250 is used to abut against the side of the release paper 120 away from the patch 110; the cover plate 250 is provided with a second through hole 251 for the ejector pin 230 to pass through; the flat surface of the cover plate 250 can support the release paper 120, prevent the release paper 120 from being over-absorbed by the second suction nozzle 240, and reduce the airflow direction that could cause the release paper 120 to be sucked up and broken.

[0037] Reference Figure 1 The diameter of the second through hole 251 is larger than the outer diameter of the ejector section of the ejector pin 230; and / or, the cover plate 250 is also provided with a through structure that penetrates the cover plate 250 along its thickness direction; the through structure includes a third through hole 252 (see reference). Figure 4 ) and / or seam 253 (refer to Figure 5 The diameter of the second through hole 251 is larger than the outer diameter of the ejector section of the ejector pin 230, and the cover plate 250 is also provided with a through structure, both of which enable the cover plate 250 to maintain a certain ability to adsorb the release paper 120 while allowing the ejector pin 230 to pass through.

[0038] The mounting fixture includes at least two ejector pins 230, which are arranged along a preset circumferential direction; the cover plate 250 is provided with at least two second through holes 251, which are arranged along a preset circumferential direction, as referenced to... Figure 4In the circumferential direction shown by the dotted line, the second through hole 251 is connected to the ejector pin 230 in a one-to-one correspondence; the ejector pins 230 are arranged along the preset circumferential direction, which can act more evenly on the annular adhesive layer 112, so that the adhesive layer 112 and the patch 110 can be lifted more smoothly, and the patch 110 can be more easily adsorbed by the first suction nozzle 210.

[0039] Reference Figure 5 The connecting seam 253 is connected to the second through hole 251; the cover plate 250 is provided with at least two connecting seams 253, and the connecting seams 253 are connected to the second through holes 251 one by one; the connecting seams 253 are extended perpendicular to the circumferential direction, so that the adsorption force of the second suction nozzle 240 on the release paper 120 is more uniform.

[0040] As an optional implementation method, refer to Figure 1 The first suction nozzle 210 includes an adsorption tube section 211. The inner side of the end plane of the adsorption tube section 211 is used to abut against the patch 110. The outer side of the end plane of the adsorption tube section 211 is provided with an annular plate 212. The annular plate 212 extends circumferentially along the adsorption tube section 211. The annular plate 212 enables the first suction nozzle 210 to have a stronger adsorption capacity when adsorbing the patch 110.

[0041] As an optional implementation method, refer to Figure 1 , Figure 2 The outer wall of the adsorption tube section 211 is provided with a clearance notch 213, which extends to the end plane of the adsorption tube section 211. The clearance notch 213 can avoid components on the product to be attached to the patch 110, so that the mounting fixture can be used for smaller products to be attached to the patch 110.

[0042] This application also proposes a mounting device, which includes the mounting fixture described above. The mounting device also includes a negative pressure generating device and a fixing seat, the fixing seat being detachably connected to the fixing member 220.

[0043] As a further optional implementation, the mounting equipment also includes a movable arm, which is fixedly connected to the first suction nozzle 210. The movable arm is used to move the patch 110 to the fourth through hole 311 on the cover circuit board 310. The mounting equipment also includes a lifting device, such as an electric push rod, a motor with a ball screw, a cylinder, etc. The lifting device is fixedly connected to the ejector pin 230 and is used to move the ejector pin 230 toward the release paper 120. The mounting equipment also includes a moving device, which is used to move the lifting device so that the ejector pin 230 passes through different positions of the release paper 120.

[0044] Since this mounting equipment adopts all the technical solutions of all the embodiments of the above mounting fixture, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0045] This application also proposes a mounting method, which includes the following steps:

[0046] Release paper 120 and patch 110 are provided. Patch 110 includes an outer layer 111 and an adhesive layer 112 that are stacked together. The outer layer 111 and the adhesive layer 112 are fixedly connected, and the adhesive layer 112 is detachably connected to the release paper 120.

[0047] The ejector pin 230 is passed through the release paper 120 to eject at least a portion of the adhesive layer 112 from the release paper 120;

[0048] The patch 110 is drawn in through the first suction nozzle 210;

[0049] The patch 110 is mounted onto the fourth through hole 311 on the cover circuit board 310.

[0050] The mounting method can be performed by the mounting fixture and mounting equipment described above. After the ejector pin 230 passes through the release paper 120, it can at least partially push away the patch 110 that is detachably connected to the release paper 120, reducing the difficulty of the patch 110 leaving the release paper 120 and improving the overall efficiency of mounting the patch 110. After the first suction nozzle 210 absorbs the patch 110 that has been pushed away at least partially, it can be used to move the patch 110 to the through-hole structure (such as the fourth through-hole 311) on the circuit board 310, preventing water or water vapor, oil or fumes from entering through the through-hole structure and reducing the probability of diaphragm sensor failure.

[0051] As a further optional implementation, before the step of passing the ejector pin 230 through the release paper 120 to eject at least a portion of the adhesive layer 112 from the release paper 120, the mounting method further includes: adsorbing the side of the release paper 120 away from the patch 110 by the second suction nozzle 240.

[0052] As a further optional implementation, the adhesive layer 112 is configured as an adhesive ring; the step of passing the ejector pin 230 through the release paper 120 to eject at least a portion of the adhesive layer 112 from the release paper 120 includes: the distance from the position of the ejector pin 230 abutting the adhesive ring to the inner side of the adhesive ring is 40% to 60% of the width of the adhesive ring, so that the adhesive ring can be flatly ejected, making it easier for the patch 110 to be adsorbed.

[0053] As a further optional implementation, the end of the ejector pin 230 that passes through the release liner 120 is configured with an arc-shaped surface, the diameter of which is greater than or equal to 0.01 mm and less than 0.02 mm; the thickness of the release liner 120 is greater than or equal to 0.02 mm and less than 0.08 mm; and / or, the peel force of the release liner 120 is set to 6 to 12 kgf. The thickness of the release liner 120 being greater than or equal to 0.02 mm and less than 0.08 mm, and the peel force of the release liner 120 being set to 6 to 12 kgf, ensures the overall strength of the release liner 120 and the firmness of the adhesion between the release liner 120 and the patch 110, while also making the overall patch application process smoother.

[0054] As a further optional implementation, the adhesive layer 112 is configured as an adhesive ring, with the outer side of the adhesive ring flush with the outer side of the outer layer 111; the first suction nozzle 210 includes an adsorption tube section 211, the diameter of the tube hole of the adsorption tube section 211 being larger than the inner diameter of the adhesive ring; the step of adsorbing the patch 110 through the first suction nozzle 210 includes: making the distance from the wall surface of the tube hole of the adsorption tube section 211 to the inner side of the adhesive ring account for 40% to 60% of the width of the adhesive ring, which can reduce the probability of deformation and twisting of the adsorbed patch 110.

[0055] As a further optional implementation, the outer layer 111 of the patch 110 is provided with a plurality of fifth through holes, the diameter of which is smaller than the diameter of the fourth through hole 311, and the air permeability of the outer layer 111 is set to 500 to 900 L / m. 2 / s, such as the outer layer 111 being made of non-woven fabric; the mounting method also includes: setting the absolute pressure of the negative pressure connected to the first suction nozzle 210 to 40 to 80 kPa, which can both ensure the adsorption force on the patch 110 and avoid tearing the patch 110.

[0056] As a further optional implementation, the inner side of the end plane of the adsorption tube segment 211 is used to abut against the patch 110, and an annular plate 212 is provided on the outer side of the end plane of the adsorption tube segment 211. The annular plate 212 extends circumferentially along the adsorption tube segment 211. The ratio of the distance from the annular plate 212 to the end plane of the adsorption tube segment 211 to the thickness of the patch 110 is set to 0.4 to 0.6, so that the first suction nozzle 210 can have a stronger adsorption capacity for the patch 110.

[0057] Since this mounting method adopts all the technical solutions of all the embodiments of the mounting fixtures and mounting equipment described above, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0058] Reference Figure 6This application also proposes a diaphragm sensor, which includes a diaphragm and a circuit board 310. The circuit board 310 has a fourth through hole 311, which communicates with the diaphragm. The diaphragm sensor also includes a patch 110, which includes an outer layer 111 and an adhesive layer 112 stacked together. The outer layer 111 and the adhesive layer 112 are fixedly connected. The outer layer 111 has a plurality of fifth through holes, the diameter of which is smaller than the diameter of the fourth through hole 311. The adhesive layer 112 is configured as an adhesive ring, which is bonded to the circuit board 310. The outer layer 111 covers the fourth through hole 311.

[0059] The outer layer 111 of the patch 110 covers the fourth through hole 311, which can prevent water or water vapor, oil or oil fumes from entering through the through hole structure and reduce the probability of diaphragm sensor failure.

[0060] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A mounting fixture, characterized in that, The mounting fixture is used to mount a patch for a diaphragm sensor. The diaphragm sensor includes a circuit board with a fourth through hole. The patch includes an outer layer and an adhesive layer stacked on top of each other. The outer layer is fixedly connected to the adhesive layer and covers the fourth through hole. The mounting fixture includes a first suction nozzle, a fixing member, and a ejector pin arranged in sequence. The fixing member is used to fix the release paper. The ejector pin is used to pass through the release paper to at least partially push away the patch that is detachably attached to the release paper. The first suction nozzle is used to connect to a negative pressure generating device and is used to pick up the patch that has been pushed away at least partially. The mounting fixture further includes a second suction nozzle, which is connected to a negative pressure generating device and is used to adsorb the side of the release paper away from the patch; the ejector pin is used to move relative to the second suction nozzle along the axial direction of the second suction nozzle, and the ejector pin can lift at least a portion of the adhesive layer. The ejector pin is disposed inside the second suction nozzle, and the second suction nozzle is provided with a cover plate. The flat surface of the cover plate is used to abut against the side of the release paper opposite to the patch. The cover plate is provided with a second through hole for the ejector pin to pass through. The mounting fixture includes at least two ejector pins arranged in a preset circumferential direction; the cover plate is provided with at least two second through holes arranged in the preset circumferential direction, and the second through holes are connected to the ejector pins one by one.

2. The mounting fixture as described in claim 1, characterized in that, The fastener includes a fixing plate, the fixing plate having a first through hole for the release paper to cover it, and the fixing plate being fixedly connected to the release paper. The fixing plate includes a fixing ring and a connecting film. The connecting film covers the fixing ring and is fixedly connected to the fixing ring. The first through hole is provided on the connecting film, and the connecting film is used to fix and connect with the release paper.

3. The mounting fixture as described in claim 1, characterized in that, The end of the ejector pin that passes through the release paper is configured with an arc-shaped surface, and the diameter of the arc-shaped surface is greater than or equal to 0.01 mm and less than 0.02 mm. The ejector pin includes a connecting section and a conical section connected together, the diameter of the conical section gradually decreasing in the direction away from the connecting section; the arc-shaped surface is disposed on the end of the conical section opposite to the connecting section.

4. The mounting fixture as described in claim 1, characterized in that, The diameter of the second through hole is larger than the outer diameter of the ejector section of the ejector pin; and / or, the cover plate is further provided with a through structure, which penetrates the cover plate along the thickness direction of the cover plate; The through structure includes a third through hole and / or a connecting seam; the connecting seam communicates with the second through hole; the cover plate is provided with at least two connecting seams, which are connected to the second through holes one by one; the connecting seams extend perpendicular to the circumferential direction. And / or, the first suction nozzle includes an adsorption tube segment, the inner side of the end plane of the adsorption tube segment is used to abut against the patch, and an annular plate is provided on the outer side of the end plane of the adsorption tube segment, the annular plate extending circumferentially along the adsorption tube segment. The outer wall of the adsorption tube section is provided with a clearance notch, which extends to the end plane of the adsorption tube section.

5. A mounting device, characterized in that, The mounting fixture includes any one of claims 1 to 4, and the mounting equipment further includes a negative pressure generating device and a fixing seat, wherein the fixing seat is used for detachable connection with the fixing member.

6. The mounting equipment as described in claim 5, characterized in that, The mounting equipment also includes a movable arm, which is fixedly connected to the first suction nozzle. The movable arm is used to move the patch to the fourth through hole on the cover circuit board. The mounting equipment also includes a lifting device, which is fixedly connected to the ejector pin and is used to move the ejector pin toward the release paper; The mounting equipment also includes a moving device for moving the lifting device so that the ejector pin passes through different positions of the release paper.

7. A mounting method, characterized in that, The application of the mounting fixture as described in any one of claims 1 to 4 includes the following steps: A release liner and a patch are provided, the patch comprising an outer layer and an adhesive layer stacked together, the outer layer being fixedly connected to the adhesive layer, and the adhesive layer being detachably connected to the release liner; The ejector pin is passed through the release paper to eject at least a portion of the adhesive layer from the release paper; The patch is drawn up through the first suction nozzle; The patch is attached to the fourth through hole on the cover circuit board.

8. The mounting method as described in claim 7, characterized in that, Prior to the step of passing the ejector pin through the release paper to eject at least a portion of the adhesive layer from the release paper, the mounting method further includes: adsorbing the side of the release paper away from the patch through a second suction nozzle; The adhesive layer is configured as an adhesive ring; the step of passing the ejector pin through the release paper to eject at least a portion of the adhesive layer away from the release paper includes: the distance from the position where the ejector pin abuts the adhesive ring to the inner side of the adhesive ring is 40% to 60% of the width of the adhesive ring; The end of the ejector pin that passes through the release paper is configured with an arc-shaped surface, the diameter of the arc-shaped surface being greater than or equal to 0.01 mm and less than 0.02 mm; the thickness of the release paper being greater than or equal to 0.02 mm and less than 0.08 mm; and / or, the peel force of the release paper is set to 6 to 12 kgf.

9. The mounting method as described in claim 7, characterized in that, The adhesive layer is configured as an adhesive ring, with the outer side of the adhesive ring flush with the outer side of the outer layer; the first suction nozzle includes an adsorption tube segment, the diameter of the tube hole of the adsorption tube segment being larger than the inner diameter of the adhesive ring; the step of sucking up the patch through the first suction nozzle includes: making the distance from the wall surface of the tube hole of the adsorption tube segment to the inner side of the adhesive ring 40% to 60% of the width of the adhesive ring; The outer layer has multiple fifth through holes, the diameter of which is smaller than the diameter of the fourth through hole, and the air permeability of the outer layer is set to 500 to 900 L / m. 2 / s; The mounting method further includes: setting the absolute pressure of the negative pressure connected to the first suction nozzle to 40 to 80 kPa; The inner side of the end plane of the adsorption tube segment is used to abut against the patch, and an annular plate is provided on the outer side of the end plane of the adsorption tube segment. The annular plate extends circumferentially along the adsorption tube segment. The ratio of the distance from the annular plate to the end plane of the adsorption tube segment to the thickness of the patch is set to 0.4 to 0.

6.

10. A diaphragm sensor, characterized in that, The diaphragm sensor, obtained by mounting fixtures as described in any one of claims 1 to 4, comprises a diaphragm and a circuit board. The circuit board has a fourth through hole communicating with the diaphragm. The diaphragm sensor further comprises a patch, which includes an outer layer and an adhesive layer stacked on top of each other. The outer layer is fixedly connected to the adhesive layer. The outer layer has a plurality of fifth through holes, the diameter of which is smaller than the diameter of the fourth through hole. The adhesive layer is configured as an adhesive ring, which is bonded to the circuit board. The outer layer covers the fourth through hole.

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