Display Panel

Abstract

A display panel, the display panel having a display area and a bending area located on one side of the display area, including a substrate substrate, the substrate substrate including a first flexible substrate and a second flexible substrate in a stack; the display area including a driving circuit layer, the driving circuit layer is arranged on a side of the second flexible substrate away from the first flexible substrate, and includes at least one first wiring, the bending area includes at least one second wiring, the at least one second wiring is electrically connected to the at least one first wiring; the at least one second wiring is arranged between the first flexible substrate and the second flexible substrate. The display panel has high reliability and can realize a narrow frame and large screen design.

Description

Technical Field

[0001] An embodiment of the present disclosure relates to a display panel. Background Art

[0002] With the continuous advancement of display technology and manufacturing technology and people's growing experience needs, display panels are gradually developing towards large-screen and full-screen. In the preparation process of the display panel, a bending area can be set on one side of the display area of ​​the display substrate, and the non-display part around the display area can be bent to the non-display side of the display substrate through the bending of the bending area, so as to reduce the area of ​​the non-display part on the display side, increase the screen-to-body ratio, and improve the visual experience effect, thereby realizing large-screen and full-screen display panels. Summary of the invention

[0003] At least one embodiment of the present disclosure provides a display panel, which has a display area and a bending area located on one side of the display area, and includes a base substrate, wherein the base substrate includes a first flexible substrate and a second flexible substrate in a stacked layer; the display area includes a driving circuit layer, the driving circuit layer is arranged on a side of the second flexible substrate away from the first flexible substrate, and includes at least one first routing line, the bending area includes at least one second routing line, and the at least one second routing line is electrically connected to the at least one first routing line; wherein the at least one second routing line is arranged between the first flexible substrate and the second flexible substrate.

[0004] For example, in the display panel provided by at least one embodiment of the present disclosure, when the bending zone is in a bent state, the at least one second wiring is located at a neutral layer position of the bending zone.

[0005] For example, in the display panel provided in at least one embodiment of the present disclosure, the base substrate also includes a buffer layer between the first flexible substrate and the second flexible substrate, the buffer layer has a first hollow portion at least partially located in the bending area, and the at least one second trace is arranged between the buffer layer and the second flexible substrate and extends through the first hollow portion.

[0006] For example, the display panel provided by at least one embodiment of the present disclosure also has a first peripheral area between the display area and the bending area, wherein the second flexible substrate has a via in the first peripheral area, and the at least one first routing line and the at least one second routing line are electrically connected through the via.

[0007] For example, the display panel provided by at least one embodiment of the present disclosure further has a second peripheral area located on a side of the bending area away from the display area, wherein the second wiring passes through the bending area and extends to the second peripheral area.

[0008] For example, in the display panel provided by at least one embodiment of the present disclosure, the driving circuit layer includes a thin film transistor and a storage capacitor, the thin film transistor includes a gate and a source-drain electrode, the storage capacitor includes a first capacitor electrode and a second capacitor electrode; the second capacitor electrode is arranged on a side of the first capacitor electrode away from the base substrate, and the source-drain electrode is arranged on a side of the second capacitor electrode away from the base substrate; the at least one first routing line is arranged on the same layer as the source-drain electrode.

[0009] For example, in the display panel provided by at least one embodiment of the present disclosure, the first peripheral area includes a first connecting electrode arranged in the same layer as the first capacitor electrode, and the at least one first routing line and the at least one second routing line are electrically connected through the via hole, including: the at least one first routing line is electrically connected to the first connecting electrode, and the first connecting electrode is electrically connected to the at least one second routing line through the via hole; or, the first peripheral area includes a second connecting electrode arranged in the same layer as the second capacitor electrode, and the at least one first routing line and the at least one second routing line are electrically connected through the via hole, including: the at least one first routing line is electrically connected to the second connecting electrode, and the second connecting electrode is electrically connected to the at least one second routing line through the via hole; or, the first peripheral area includes a first connecting electrode arranged in the same layer as the first capacitor electrode and a second connecting electrode arranged in the same layer as the second capacitor electrode, and the at least one first routing line and the at least one second routing line are electrically connected through the via hole, including: the at least one first routing line is electrically connected to the second connecting electrode, the second connecting electrode is electrically connected to the first connecting electrode, and the first connecting electrode is electrically connected to the at least one second routing line through the via hole.

[0010] For example, in the display panel provided by at least one embodiment of the present disclosure, in a direction perpendicular to the panel surface of the substrate, the thickness of the second flexible substrate is smaller than the thickness of the first flexible substrate.

[0011] For example, in the display panel provided in at least one embodiment of the present disclosure, the thickness of the second flexible substrate is 6 μm-10 μm, and the thickness of the first flexible substrate is 9 μm-11 μm.

[0012] For example, in the display panel provided by at least one embodiment of the present disclosure, the elastic modulus of the first flexible substrate and the second flexible substrate are the same, which is 6.5 GPa-10.5 GPa.

[0013] For example, in the display panel provided by at least one embodiment of the present disclosure, the material of the at least one second wiring includes one or more of titanium, aluminum, copper and molybdenum.

[0014] For example, the display panel provided by at least one embodiment of the present disclosure also includes a light-emitting device layer, an encapsulation layer, a first optically transparent adhesive layer and a polarizer, wherein the light-emitting device layer is located on a side of the driving circuit layer away from the base substrate, the encapsulation layer is located on a side of the light-emitting device layer away from the base substrate, and in the display area, the polarizer is bonded to the side of the encapsulation layer away from the base substrate through the first optically transparent adhesive layer, and the first optically transparent adhesive layer extends to the bending area; the first optically transparent adhesive layer includes polymethyl methacrylate.

[0015] For example, in the display panel provided by at least one embodiment of the present disclosure, in a direction perpendicular to the panel surface of the base substrate, the thickness of the first optically transparent adhesive layer is 27 μm-33 μm.

[0016] For example, the display panel provided by at least one embodiment of the present disclosure further includes a back film disposed on a side of the first flexible substrate away from the second flexible substrate, wherein the back film has a second hollow portion at least partially within the bending area.

[0017] For example, in the display panel provided by at least one embodiment of the present disclosure, in a direction parallel to the panel surface of the base substrate, the first optically transparent adhesive layer extends between an edge of the first hollow portion away from the display area and an edge of the second hollow portion away from the display area.

[0018] For example, in the display panel provided by at least one embodiment of the present disclosure, in at least part of the first peripheral area and the bending area, there is a spacing insulating layer between the first optically transparent glue and the second flexible substrate; the display area also includes: a planarization layer arranged on the side of the driving circuit layer away from the second flexible substrate; and a pixel defining layer arranged on the side of the planarization layer away from the second flexible substrate; wherein the light-emitting device layer includes a plurality of light-emitting devices, each of the plurality of light-emitting devices includes a first electrode, a light-emitting layer and a second electrode stacked in sequence in a direction away from the base substrate, the driving circuit layer includes a plurality of pixel driving circuits, the first electrode is electrically connected to one of the plurality of pixel driving circuits through a via in the planarization layer, the pixel defining layer is arranged on the side of the first electrode away from the base substrate, and includes a plurality of pixel openings, the plurality of pixel openings respectively expose the first electrodes of the plurality of light-emitting devices, and the light-emitting layers of the plurality of light-emitting devices are respectively arranged in the plurality of pixel openings; the spacing insulating layer is arranged in the same layer as at least one of the planarization layer and the pixel defining layer.

[0019] For example, in the display panel provided by at least one embodiment of the present disclosure, in at least a portion of the first peripheral area and the bending area, the first optically transparent adhesive directly contacts the second flexible substrate.

[0020] For example, the display panel provided by at least one embodiment of the present disclosure further comprises a second peripheral region located on a side of the bending region away from the display region, wherein the first optically transparent adhesive layer extends into the second peripheral region.

[0021] For example, in the display panel provided by at least one embodiment of the present disclosure, the first optically transparent adhesive layer is retracted by at least 0.2 mm relative to the edge of the base substrate.

[0022] For example, the display panel provided in at least one embodiment of the present disclosure further includes a second optically transparent adhesive layer and a cover plate, wherein the cover plate is bonded to the polarizer through the second optically transparent adhesive layer and covers the display area and at least a portion of the bending area.

[0023] For example, in the display panel provided by at least one embodiment of the present disclosure, the second optically transparent adhesive layer is retracted by at least 0.2 mm relative to the edge of the polarizer close to the bending area.

[0024] At least one embodiment of the present disclosure further provides a method for preparing a display panel, wherein the display panel has a display area and a bending area located on one side of the display area, the preparation method comprising: providing a base substrate, wherein the base substrate comprises a stacked first flexible substrate and a second flexible substrate; forming a driving circuit layer in the display area, wherein the driving circuit layer is formed on a side of the second flexible substrate away from the first substrate and comprises at least one first wiring; and forming at least one second wiring in the bending area, wherein the at least one second wiring is electrically connected to the at least one first wiring; wherein the at least one second wiring is formed between the first flexible substrate and the second flexible substrate.

[0025] For example, the preparation method provided in at least one embodiment of the present disclosure further includes: bonding the polarizer to the base substrate via a first optically transparent adhesive layer.

[0026] For example, the preparation method provided by at least one embodiment of the present disclosure further includes: bending the bending area, and then curing the first optically transparent adhesive layer.

[0027] For example, in the preparation method provided in at least one embodiment of the present disclosure, curing the first optically transparent adhesive layer includes: curing the first optically transparent adhesive layer by light curing; or spraying a catalyst on the surface of the first optically transparent adhesive layer to cure the first optically transparent adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure.

[0029] Figure 1 A schematic plan view of a display panel provided in at least one embodiment of the present disclosure;

[0030] Figure 2 for Figure 1 A schematic cross-sectional view of the display panel along line MM;

[0031] Figure 3 for Figure 1 A schematic cross-sectional view of the display panel along the PP line;

[0032] Figure 4 for Figure 2 A schematic cross-sectional view of a display panel after being bent in a bending area;

[0033] Figure 5 for Figure 1 A partial cross-sectional schematic diagram of a sub-pixel in a display area of ​​a display panel;

[0034] Figure 6 for Figure 1 Another cross-sectional schematic diagram of the display panel along the PP line;

[0035] Figure 7 for Figure 1 Another cross-sectional schematic diagram of the display panel along the PP line;

[0036] Figure 8 for Figure 1 Another cross-sectional schematic diagram of the display panel along line PP;

[0037] Fig. 9 A result diagram of a finite element analysis experiment of a display panel provided in at least one embodiment of the present disclosure;

[0038] Fig. 10A The stress-strain curves of OCA and MCL glue obtained through experiments according to at least one embodiment of the present disclosure;

[0039] Fig. 10B is a stress-strain curve of OCA obtained through experiments according to at least one embodiment of the present disclosure;

[0040] Fig.11 for Figure 1 Another cross-sectional schematic diagram of the display panel along line MM;

[0041] Fig.12 for Fig.11 A schematic cross-sectional view of a display panel after being bent in a bending area;

[0042] Fig.13 for Figure 1 Another cross-sectional schematic diagram of the display panel along line MM;

[0043] Fig.14 for Fig.13 A schematic cross-sectional view of the display panel after being bent in the bending area; and

[0044] Fig.15 A schematic cross-sectional view of a display panel during the preparation process provided in at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0046] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0047] In the design of realizing narrow frame and large screen of display panel by bending the frame of module product, there are multiple metal traces in the bending area located on the display area side of the display substrate. These metal traces extend through the bend of the bending area to electrically connect the driving circuit in the display area to the processing circuit located on the non-display side of the display substrate, such as data driving circuit, driving IC (such as timing controller), etc. In this design, multiple metal traces in the bending area need to be bent, so the bending performance (such as tensile performance, bendable radius, etc.) of the multiple metal traces is a key factor in achieving reliable bending.

[0048] In some implementations, the stress on the multiple metal traces during the bending process can be reduced by designing the shapes of the multiple metal traces in the bending area, such as by designing a zigzag shape or a hollow design. As the display products require narrower borders, the bending radius of the bending area will also be required to be smaller and smaller, which requires some other designs to further improve the bending performance of the multiple metal traces in the bending area to prevent the metal traces from breaking.

[0049] At least one embodiment of the present disclosure provides a display panel, which has a display area and a bending area located on one side of the display area, including a base substrate, the base substrate including a first flexible substrate and a second flexible substrate in a stack; the display area includes a driving circuit layer, the driving circuit layer is arranged on a side of the second flexible substrate away from the first flexible substrate, and includes at least one first routing line, the bending area includes at least one second routing line, the at least one second routing line is electrically connected to the at least one first routing line; and the at least one second routing line is arranged between the first flexible substrate and the second flexible substrate.

[0050] In the display panel provided in the embodiment of the present disclosure, after the bending zone is bent, at least one second wiring in the bending zone is close to or located at the neutral layer, thereby reducing or eliminating the stress on at least one second wiring, thereby reducing or eliminating the risk of at least one second wiring breaking, thereby improving the reliability and manufacturing yield of the display panel.

[0051] In a laminated structure, the neutral layer is a transition layer that is neither pulled nor compressed when the laminated structure is bent, so the stress on the neutral layer during the curling and bending of the laminated structure is almost equal to zero. For example, in a laminated structure, the specific position of the neutral layer can be affected by the elastic modulus, thickness, and lamination sequence of each layer in the laminated structure, so the specific position of the neutral layer can be adjusted by changing these factors.

[0052] The display panel and the manufacturing method thereof provided by the embodiments of the present disclosure are described in detail below through several specific examples.

[0053] At least one embodiment of the present disclosure provides a display panel. Figure 1 shows a schematic plan view of the display panel, Figure 2 Shows Figure 1 A schematic cross-sectional view of the display panel along line MM in FIG. Figure 3 Shows Figure 1 Schematic diagram of the cross-section of the display panel along the PP line.

[0054] like Figure 1-Figure 3As shown, the display panel has a display area A and a bending area B located on one side of the display area A, and includes a base substrate 10, the base substrate 10 includes a first flexible substrate 101 and a second flexible substrate 102 in a stacked manner; the display area A includes a driving circuit layer, and the driving circuit layer includes, for example, a thin film transistor and a storage capacitor, etc., which will be described in detail later. The driving circuit layer is arranged on a side of the second flexible substrate 102 away from the first substrate 101, and includes at least one first trace L1, such as Figure 3 As shown, the bending area B includes at least one second line 103 , which is electrically connected to at least one first line L1 . In the laminated structure of the substrate 10 , the at least one second line 103 is disposed between the first flexible substrate 101 and the second flexible substrate 102 .

[0055] For example, in some embodiments, the at least one first routing line L1 includes multiple first routing lines L1 , the at least one second routing line 103 includes multiple second routing lines 103 , and the multiple first routing lines L1 are electrically connected to the multiple second routing lines 103 in a one-to-one correspondence.

[0056] For example, when the bending area B is in a bent state, at least one second wiring 103 is close to or located at the neutral layer position of the bending area B, so that when the bending area B is in a bent state, the stress on at least one second wiring 103 is very small, for example, almost equal to zero, thereby preventing at least one second wiring 103 from breaking, thereby improving the reliability of the display panel. On the other hand, the first flexible substrate 101 and the second flexible substrate 102 have the function of blocking water and oxygen, which can protect the second wiring 103 and prevent the second wiring 103 from corrosion and other defects.

[0057] For example, in some embodiments, Figure 2 and Figure 3 As shown, the substrate 10 may further include a buffer layer between the first flexible substrate 101 and the second flexible substrate 102. For example, in some examples, the buffer layer may include a first buffer sublayer 104 and a second buffer sublayer 105. For example, the materials of the first buffer sublayer 104 and the second buffer sublayer 105 may include inorganic materials such as silicon oxide, silicon nitride, or silicon oxynitride. The materials of the first buffer sublayer 104 and the second buffer sublayer 105 may be the same or different. For example, in some examples, the material of the first buffer sublayer 104 is silicon oxide, and the material of the second buffer sublayer 105 is silicon nitride. The buffer layer may prevent impurities such as water and oxygen from penetrating from the first flexible substrate 101 into the functional structures thereon, thereby protecting the functional structures (e.g. Figure 2 and Figure 3 The second wiring 103 shown in FIG. 1 plays a protective role.

[0058] For example, Figure 2As shown, the buffer layer has a first hollow portion EB at least partially located in the bending area B, and at least one second routing line 103 is arranged between the buffer layer and the second flexible substrate 102 and extends through the first hollow portion EB. At this time, since the material of the buffer layer in the first hollow portion EB is removed, there is no buffer layer under the at least one second routing line 103 in the first hollow portion EB. For example, the portion of the buffer layer located in the bending area B is all the first hollow portion EB. For example, the range of the first hollow portion EB is larger than the range of the bending area B, that is, Figure 2 As shown in FIG. 1 , the width of the first hollow portion EB in the horizontal direction is greater than the width of the bending region B in the horizontal direction. For example, in some examples, Figure 3 As shown, the distance between the edge of the first hollow portion EB and the corresponding edge of the bending zone B is G, and the distance G can be, for example, 100 μm-150 μm, such as 120 μm or 130 μm, etc. Since the material flexibility of the buffer layer (such as the first buffer sublayer 104 and the second buffer sublayer 105) is poor, by providing a hollow portion in the buffer layer, the buffer layer can be prevented from breaking during the bending process, thereby preventing the second trace 103 from breaking, improving the flexibility of the bending zone B, and facilitating reliable bending of the bending zone B.

[0059] For example, Figure 1 and Figure 3 As shown, in some embodiments, the display panel further has a first peripheral area N1 between the display area A and the bending area B, the second flexible substrate 102 has a plurality of vias V1 in the first peripheral area N1, and at least one first wiring L1 and at least one second wiring 103 are electrically connected through a single or multiple vias V1. For example, a barrier layer 108 is provided on a side of the second flexible substrate 102 away from the first flexible substrate 101, the first wiring L1 is provided on a side of the barrier layer 108 away from the second flexible substrate 102, and the via V1 is located on a side of the barrier layer 108 close to the bending area B. For example, the barrier layer 108 may include materials such as silicon oxide, silicon nitride, or silicon oxynitride.

[0060] For example, Figure 1 As shown, in some embodiments, the display panel further has a second peripheral area N2 located on a side of the bending area B away from the display area A, and the second wiring 103 passes through the bending area B and extends to the second peripheral area N2.

[0061] For example, Figure 4 FIG. 4 shows a schematic diagram of a display panel after bending in the bending area B. Figure 4As shown, after the bending zone B is bent, the second peripheral zone N2 is located on the non-display side of the display panel. For example, the non-display side of the display panel may have a processing circuit, such as a data driving circuit, a driving IC (such as a timing controller), etc. Therefore, through the bending of the bending zone B, the first wiring L1 can pass through the first peripheral zone N1, the bending zone B and the second peripheral zone N2 in sequence through the second wiring 103 and be electrically connected to the processing circuit, so that the driving circuit in the display zone A can be controlled and operated by the processing circuit, thereby controlling the display operation, display status, etc. of the display panel.

[0062] For example, the display area A includes a pixel array, which includes a plurality of sub-pixels arranged in an array, each of which includes a light-emitting device and a pixel driving circuit located in a driving circuit layer. Figure 5 A partial cross-sectional schematic diagram of a sub-pixel is shown.

[0063] For example, Figure 5 As shown, the pixel driving circuit at least includes a thin film transistor T and a storage capacitor C, and the thin film transistor includes a gate 1022 and a source-drain electrode ( Figure 5 One of the numbers 1023 and 1024 is a source electrode, and the other is a drain electrode; 1023 is used as the source electrode and 1024 is used as the drain electrode for the following description, the storage capacitor C includes a first capacitor electrode 1031 and a second capacitor electrode 1032; the second capacitor electrode 1032 is arranged on a side of the first capacitor electrode 1031 away from the base substrate 10, and the source-drain electrode is arranged on a side of the second capacitor electrode 1032 away from the base substrate 10. For example, at least one first wiring L1 is arranged on the same layer as the source-drain electrode.

[0064] It should be noted that, in the embodiments of the present disclosure, “same-layer arrangement” means that two functional layers or structural layers are in the same layer and are formed of the same material in the hierarchical structure of the display substrate, that is, in the preparation process, the two functional layers or structural layers can be formed by the same material layer, and the required patterns and structures can be formed by the same composition process.

[0065] For example, in some examples, at least one first line L1 may be a data line electrically connected to the drain 1024, so as to provide a data signal for the pixel driving circuit. For example, in other examples, at least one first line L1 may also be a power line (for example, a power line VDD providing a high-level signal or a power line VSS providing a low-level signal) or a scan line or other lines, and the embodiments of the present disclosure do not limit the specific type of the at least one first line L1.

[0066] For example, Figure 5As shown, the thin film transistor T of the pixel driving circuit also includes structures such as an active layer 1021, a gate electrode 1022, a gate insulating layer 1014 (for example, including a first gate insulating layer 1014A and a second gate insulating layer 1014B) and an interlayer insulating layer 1015. The active layer 1021, the first gate insulating layer 1014A, the gate electrode 1022, the second gate insulating layer 1014B, the interlayer insulating layer 1015 and the source-drain electrodes (including the source electrode 1023 and the drain electrode 1024) are arranged in sequence in a direction away from the substrate 10.

[0067] For example, the pixel driving circuit can be formed into a 2T1C (two thin film transistors, one storage capacitor), a 6T1C (six thin film transistors, one storage capacitor) and the like structure, thereby including a plurality of thin film transistors having the following characteristics: Figure 5 The laminated structure shown is similar or identical to the structure shown, Figure 5 Only the thin film transistor directly connected to the light emitting device is shown, and the thin film transistor may be a driving thin film transistor or a light emitting control thin film transistor, etc.

[0068] In addition, it should be noted that Figure 5 The whole of the base substrate 10 is shown in FIG. 1 , but the specific laminated structure of the base substrate 10 is not shown. The specific structure can be referred to in FIG. Figure 2 .

[0069] For example, the display area A further includes a planarization layer 1016 disposed on a side of the driving circuit layer away from the second flexible substrate 102 and a pixel definition layer 1017 disposed on a side of the planarization layer 1016 away from the second flexible substrate 102. The display area A further includes a light-emitting device layer disposed on a side of the planarization layer 1016 away from the second flexible substrate 102, for example, the light-emitting device layer includes a plurality of light-emitting devices EM corresponding to a plurality of sub-pixels, each light-emitting device EM includes a first electrode 1041, a light-emitting layer 1042, and a second electrode 1043 sequentially stacked in a direction away from the base substrate 10, and the first electrode 1041 is electrically connected to the pixel driving circuit (for example, the source 1023 of the thin film transistor T) through a via hole in the planarization layer 1016. The pixel definition layer 1017 is disposed on a side of the first electrode 1041 away from the base substrate 10, and includes a plurality of pixel openings, the plurality of pixel openings respectively expose the first electrodes 1041 of the plurality of light-emitting devices EM, and the light-emitting layers 1042 of the plurality of light-emitting devices EM are respectively disposed in the plurality of pixel openings.

[0070] For example, the first capacitor plate 1031 is disposed in the same layer as the gate electrode 1022, and the second capacitor plate 1032 is disposed between the gate insulating layer 1014 and the interlayer insulating layer 1015. Figure 6 for Figure 1 Another cross-sectional schematic diagram of the display panel along the PP line in some examples. Figure 2 The example shown differs in that Figure 6 As shown, the first peripheral area N1 includes a first connection electrode C1 arranged in the same layer as the first capacitor electrode 1031. At this time, at least one first wiring L1 is electrically connected to the first connection electrode C1, for example, through a via V2, and the first connection electrode C1 is electrically connected to at least one second wiring 103, for example, through a via V3.

[0071] For example, a barrier layer may also be provided between the first connection electrode C1 and the second flexible substrate 102 , which is not shown in the figure.

[0072] or, Figure 7 for Figure 1 Another cross-sectional schematic diagram of the display panel along the PP line in FIG. Figure 2 and Figure 6 The example shown differs in that Figure 7 As shown, the first peripheral area N1 includes a second connection electrode C2 arranged in the same layer as the second capacitor electrode 1032. At this time, at least one first wiring L1 is electrically connected to the second connection electrode C2, for example through a via V4, and the second connection electrode C2 is electrically connected to at least one second wiring 103, for example through a via V5.

[0073] For example, a barrier layer may also be provided between the second connection electrode C2 and the second flexible substrate 102 , which is not shown in the figure.

[0074] or, Figure 8 for Figure 1 Another cross-sectional schematic diagram of the display panel along the PP line in FIG. 1 , in still other examples, Figure 2 , Figure 6 and Figure 7 The example shown differs in that Figure 8 As shown, the first peripheral area N1 includes a first connecting electrode C1 arranged on the same layer as the first capacitor electrode 1031 and a second connecting electrode C2 arranged on the same layer as the second capacitor electrode 1032. At this time, at least one first wiring L1 is electrically connected to the second connecting electrode C2, for example, through a via V6, and the second connecting electrode C2 is electrically connected to the first connecting electrode C1, for example, through a via V7, and the first connecting electrode C1 is electrically connected to at least one second wiring 103, for example, through a via V8.

[0075] For example, a barrier layer may also be provided between the first connection electrode C1 and the second flexible substrate 102 , which is not shown in the figure.

[0076] It should be noted that, for the sake of simplicity, Figure 2 as well as Figure 6-Figure 8The encapsulation layer EN, the first optically transparent adhesive layer 201, the polarizer 202, the second optically transparent adhesive layer 203, the cover plate 204 and other structures are not shown. The stacking relationship of these structures can be referred to other drawings and will not be repeated here.

[0077] Therefore, through the above-mentioned "step" electrical connection method, that is, the above-mentioned layer-by-layer electrical connection method, it is possible to avoid poor connection caused by direct connection between at least one first routing line L1 and at least one second routing line 103 due to excessive step difference (for example, the difference in distance between the two and the substrate 10 is too large), thereby ensuring the reliability of the electrical connection between at least one first routing line L1 and at least one second routing line 103.

[0078] For example, in some embodiments, in the laminated structure in the direction perpendicular to the board surface of the base substrate 10 (i.e., the vertical direction in the figure), the thickness of the second flexible substrate 102 is less than the thickness of the first flexible substrate 101, which is conducive to locating at least one second trace 103 at the neutral layer position of the bending area B. Since the elastic modulus of the first flexible substrate 101 and the second flexible substrate 102 in the base substrate 10 is much larger than the elastic modulus of other film layers on the base substrate 10, the thickness of the base substrate 10 has a greater influence on the neutral layer of the bending area; Figure 2 As shown, under the condition that the stacked structure and material of the display substrate remain unchanged, as the thickness of the base substrate 10 increases, the position of the neutral layer will gradually move away from the second spacing insulating sublayer 107, for example, from the second flexible substrate 102 to the second trace 103.

[0079] For example, in some embodiments, the thickness of the second flexible substrate 102 is 6 μm-10 μm, such as 6 μm, 7 μm, 8 μm or 9 μm, etc.; the thickness of the first flexible substrate 101 is 9 μm-11 μm, such as 10 μm, etc.

[0080] For example, in some embodiments, the elastic modulus of the first flexible substrate 101 and the second flexible substrate 102 is the same, which is 6.5 GPa-10.5 GPa, such as 7 GPa or 8 GPa, etc. For example, the material of the first flexible substrate 101 and the second flexible substrate 102 can be a flexible material such as polyimide (PI), and the embodiments of the present disclosure do not limit the specific materials of the first flexible substrate 101 and the second flexible substrate 102.

[0081] For example, in some embodiments, the material of the second wiring 103 includes one or more of titanium, aluminum, copper and molybdenum, for example, formed into a single-layer metal structure or a multi-layer metal structure, such as titanium / aluminum / titanium or molybdenum / aluminum / molybdenum and other multi-layer metal structures.

[0082] For example, Figure 2 and Figure 5As shown, the display panel also includes structures such as a spacer layer 1018, an encapsulation layer EN, a first optically transparent adhesive layer 201, and a polarizer 202. The spacer layer 1018 is located on the side of the pixel defining layer 1017 away from the substrate 10, and the encapsulation layer EN is located on the side of the light-emitting device layer away from the substrate 10. For example, the encapsulation layer EN can be a single-layer structure or a multi-layer structure. For example, an example of the encapsulation layer EN of the multi-layer structure can include a first inorganic encapsulation layer 1051, a first organic encapsulation layer 1052, and a second inorganic encapsulation layer 1053 stacked in sequence in a direction away from the substrate 10, so that the encapsulation layer EN can form a multi-layer encapsulation to protect the functional structure in the display panel. For example, these structures from the substrate 10 to the encapsulation layer EN (including the substrate 10 and the encapsulation layer EN) together form the display substrate 100.

[0083] For example, the materials of the gate electrode 1022, the first capacitor plate 1031 and the second capacitor plate 1032 include metals or alloy materials such as aluminum, titanium, cobalt, and copper. The active layer 1021 of the transistor can be made of materials such as polysilicon or metal oxide. The gate insulating layer 1014 (including the first gate insulating layer 1014A and the second gate insulating layer 1014B), the interlayer insulating layer 1015, and the first inorganic encapsulation layer 1051 and the second inorganic encapsulation layer 1053 of the encapsulation layer EN can be made of inorganic insulating materials such as silicon oxide, silicon nitride or silicon oxynitride. For example, the planarization layer 1016, the pixel defining layer 1017, the spacer layer 1018, and the first organic encapsulation layer 1052 of the encapsulation layer EN can be made of organic insulating materials such as polyimide and resin. The embodiments of the present disclosure do not limit the materials of each functional layer, and the materials of each functional layer are not limited to the above examples.

[0084] For example, in the display area A, the polarizer 202 is bonded to the side of the encapsulation layer EN away from the base substrate 10, that is, bonded to the display substrate 100, through the first optically transparent adhesive layer 201, and the first optically transparent adhesive layer 201 extends to the bending area B. For example, the first optically transparent adhesive layer 201 may include polymethyl methacrylate. In some embodiments, the first optically transparent adhesive layer 201 may also be referred to as OCA (Optically Clear Adhesive). Compared with the MCL adhesive (Metal Cover Layer, bending area protective adhesive) including acrylic resin used in the bending area B in conventional technology, the first optically transparent adhesive layer 201 including polymethyl methacrylate can have a smaller thickness. For example, under normal circumstances, the thickness of the MCL glue is about 90μm-120μm to meet its bonding requirements, which is much thicker than the display substrate 100 (usually with a thickness of about 30μm), so it will increase the frame of the display panel; and after the bending zone B is bent, the MCL glue will change the neutral layer position of the bending zone B after the bending, so that the second trace 103 is away from the neutral layer. In addition, the thickness uniformity of the MCL glue is poor, which can easily cause adverse phenomena such as poor bonding.

[0085] In at least one embodiment of the present disclosure, a first optically transparent adhesive layer 201 including polymethyl methacrylate is used in combination with a polarizer 202, and the first optically transparent adhesive layer 201 is extended to the bending zone B. Compared with the MCL adhesive used in the bending zone B in the conventional technology, the first optically transparent adhesive layer 201 can achieve bonding and protection functions at a relatively small thickness. For example, in some embodiments, in the direction perpendicular to the plate surface of the base substrate 10, the thickness of the first optically transparent adhesive layer is about 27μm-33μm, for example, 30μm. As a result, after bending in the bending zone B, the first optically transparent adhesive layer 201 can have a relatively small bending radius R, significantly reducing the frame of the display panel; and the thickness uniformity of the first optically transparent adhesive layer 201 is very good, and its thickness can be controlled within the range of ±10% of the designed thickness, which is easier to control than MCL adhesive; at the same time, the first optically transparent adhesive layer 201 basically does not affect the position of the neutral layer, ensuring that the second routing line 103 can be located at the position of the neutral layer after bending in the bending zone B, thereby ensuring the reliability of the bending in the bending zone B.

[0086] For example, in at least one embodiment, by Figure 1-Figure 5 The laminated structure of the bending area B of the display panel shown in the figure is subjected to a finite element analysis experiment. Fig. 9The result of the finite element analysis experiment is shown, and it can be concluded from the experimental result that the neutral layer is just at the position of the second line 103. The maximum strain value of the second line 103 is reduced by one order of magnitude compared with the conventional technology (for example, the second line is located on the side of the second flexible substrate away from the first flexible substrate). It can be seen that according to the above structure provided by the embodiment of the present disclosure, the bending radius R of the bending zone can be reduced to a very small value, for example, reaching less than 0.2 mm, which is much smaller than the bending radius of the bending zone in the conventional display panel.

[0087] For example, in some embodiments, Figure 2 and Figure 3 As shown, the display panel may further include a back film 301 disposed on a side of the first flexible substrate 101 away from the second flexible substrate 102. For example, the back film 301 has a second hollow portion 301A at least partially within the bending zone B. For example, in some examples, the range of the second hollow portion 301A is the same as the range of the bending zone B, that is, Figure 2 In the embodiment, the width of the second hollow portion 301A is the same as the width of the bending area B. For example, the material of the back film 301 may include polyethylene terephthalate (PET) or polyimide (PI).

[0088] For example, in some embodiments, Figure 2 As shown, in the direction parallel to the plate surface of the base substrate 10 (i.e., the horizontal direction in the figure), the first optically transparent adhesive layer 201 extends between the edge of the first hollow portion EB away from the display area A and the edge of the second hollow portion 301A away from the display area A, that is, Figure 2 In the horizontal direction, the right edge of the first optically transparent adhesive layer 201 is between the right edge of the first hollow portion EB and the right edge of the second hollow portion 301A. Thus, the first optically transparent adhesive layer 201 can protect the bending area B of the display substrate, and the first optically transparent adhesive layer 201 will bend as the bending area B bends.

[0089] For example, Fig. 10A The stress-strain curves of OCA and MCL glue are shown; Fig. 10B is the stress-strain curve of OCA. Fig. 10A and Fig. 10BAs shown, compared with MCL glue, OCA has a larger modulus difference, and OCA is much softer than MCL glue. During the bending process of the bending area B, the first optically transparent adhesive layer 201 (OCA) can be bent first and then cured. At this time, before light curing, for example, the neutral layer of the bending area B will not be significantly offset due to OCA, and its influence can be ignored; after the bending area B is bent and the first optically transparent adhesive layer 201 is light-cured, the position of the neutral layer will not be changed, but it has the effect of reinforcing and protecting the bending area B. The inherent property of OCA is relatively soft, and even if light curing (such as UV curing) is added, its modulus is still much smaller than MCL; in addition, since the OCA material itself is relatively soft, after completing the OCA attachment process, for conventional products, OCA usually does not require UV curing or secondary curing; the embodiment of the present disclosure adds the operation of curing after bending to make the glue harder and enhance the reliability of the product's bending area. After the OCA in the bending area B is cured, the surface adhesion of the bending area B can be further reduced to prevent foreign matter from adhering to the OCA surface in the bending area B, and the OCA can also achieve the effect of blocking water and oxygen.

[0090] For example, in some embodiments, Figure 2 As shown, in at least part of the first peripheral area N1 and the bending area B, there is a spacing insulating layer between the first optically transparent adhesive 201 and the second flexible substrate 102. For example, the spacing insulating layer is disposed in the same layer as at least one of the planarization layer 1016 and the pixel definition layer 1017. For example, in some examples, the spacing insulating layer includes a first spacing insulating sublayer 106 and a second spacing insulating sublayer 107, and the first spacing insulating sublayer 106 and the second spacing insulating sublayer 107 are disposed in the same layer as the planarization layer 1016 and the pixel definition layer 1017, respectively. Alternatively, in other examples, the spacing insulating layer may also have only one layer, in which case the spacing insulating layer may be disposed in the same layer as the planarization layer 1016 or the pixel definition layer 1017. Alternatively, in still other examples, the spacing insulating layer may also have more layers, for example, it also has an insulating sublayer 109, and these layers are disposed in the same layer in a one-to-one correspondence with some insulating layers in the display area A, and the embodiments of the present disclosure do not limit the specific form of the spacing insulating layer.

[0091] For example, in some embodiments, the display panel further has a second peripheral area N2 located on the side of the bending area B away from the display area A, and the first optically transparent adhesive layer 201 extends into the second peripheral area N2, so the first optically transparent adhesive layer 201 can also protect the structure of the display substrate 100 in the second peripheral area N2.

[0092] For example, in some embodiments, reference Figure 1At the positions of the left, right and upper frames of the display substrate, the first optically transparent adhesive layer 201 is retracted by 0-0.3 mm, for example, 0.2 mm-0.3 mm, relative to the left, right and upper edges of the base substrate 10 to prevent the first optically transparent adhesive layer 201 from overflowing outside the base substrate 10 during the preparation process. At the position of the lower frame of the display substrate, such as Figure 2 As shown, the first optically transparent adhesive layer 201 is retracted by a distance H1 relative to the edge of the base substrate 10. For example, for a large-sized display substrate, such as a display substrate for a tablet computer or a notebook computer, the distance H1 is at least 4 mm, for a medium-sized display substrate, such as a display substrate for a mobile phone, the distance H1 is at least 3 mm, and for a small-sized display substrate, such as a display substrate for a watch, the distance H1 is at least 2 mm. Figure 2 In the horizontal direction, the distance between the right edge of the first optically transparent adhesive layer 201 and the right edge of the base substrate 10 is at least 4 mm, 3 mm or 2 mm.

[0093] For example, the second peripheral region N2 has a binding region, the binding region has a plurality of gold fingers, and the distance between the first optically transparent adhesive layer 201 and the gold fingers is greater than 1 mm.

[0094] For example, in some embodiments, Figure 2 As shown, the display panel further includes a second optically transparent adhesive layer 203 and a cover plate 204. The cover plate 204 is bonded to the polarizer 202 through the second optically transparent adhesive layer 203 and covers the display area A and at least a portion of the bending area B. For example, the cover plate 204 is a transparent cover plate, such as a transparent glass cover plate, for protecting the display panel. For example, the second optically transparent adhesive layer 203 may include polymethyl methacrylate.

[0095] For example, in some embodiments, Figure 2 As shown, the second optically transparent adhesive layer 203 is retracted by a distance H2 relative to the edge of the polarizer 202 near the bending region B. For example, the distance H2 is at least 0.2 mm. Figure 2 In the horizontal direction, the distance between the right edge of the second optically transparent adhesive layer 203 and the right edge of the polarizer 202 is at least 0.2 mm to prevent the second optically transparent adhesive layer 203 from overflowing outside the substrate polarizer 202 during the preparation process.

[0096] For example, Figure 2 As shown, the display panel may further include a heat dissipation film (SCF) 302 disposed on the side of the back film 301 away from the first flexible substrate 101 and a spacer 303 disposed on the side of the heat dissipation film 302 away from the back film 301. For example, the heat dissipation film 302 may be made of copper foil or other materials, and the spacer 303 may be made of organic materials, such as optically transparent adhesive or the like. Figure 4As shown, after bending in the bending area B, the spacer 303 is spaced between the portions of the back film 301 on different sides of the second hollow area 301A to bond the portions of the back film 301 on different sides of the second hollow area 301A.

[0097] For example, in some other embodiments, Fig.11 Shows Figure 1 Another cross-sectional schematic diagram of the display panel along line MM.

[0098] like Fig.11 As shown, in at least a portion of the first peripheral area N1 and the bending area B, the first optically transparent adhesive 201 directly contacts the second flexible substrate 102, that is, the second flexible substrate 102 no longer has a spacing insulating layer. At this time, since the thickness of the spacing insulating layer is at least one order of magnitude smaller than the thickness of the first flexible substrate 101 and the second flexible substrate 102, and the elastic modulus of the spacing insulating layer is also much smaller than that of the first flexible substrate 101 and the second flexible substrate 102, the removal of the spacing insulating layer has little effect on the position of the neutral layer and can be ignored; at the same time, the removal of the spacing insulating layer can also reduce the thickness of the bending area B, so that after the bending area B is bent, the frame of the display panel can also be reduced, as shown in FIG. Fig.12 As shown, Fig.12 for Fig.11 Schematic diagram of a cross section of the display panel after being bent in the bending area.

[0099] For example, Figure 1 and Fig.11 As shown, in this embodiment, the display panel also has a second peripheral area N2 located on the side of the bending area B away from the display area A, and the first optically transparent adhesive layer 201 extends into the second peripheral area N2, so the first optically transparent adhesive layer 201 can also protect the structure of the display substrate 100 in the second peripheral area N2.

[0100] For example, in Fig.11 In the illustrated embodiment, reference is made to Figure 1 At the positions of the left, right and upper frames of the display substrate, the first optically transparent adhesive layer 201 is retracted by a distance of 0-0.3 mm, for example, 0.2 mm-0.3 mm, relative to the left, right and upper edges of the base substrate 10, so as to prevent the first optically transparent adhesive layer 201 from overflowing outside the base substrate 10 during the preparation process. At the position of the lower frame of the display substrate, the first optically transparent adhesive layer 201 is retracted by a certain distance relative to the edge of the base substrate 10. For example, for a large-sized display substrate, such as a display substrate for a tablet computer or a notebook computer, the retracted distance is at least 4 mm, for a medium-sized display substrate, such as a display substrate for a mobile phone, the retracted distance is at least 3 mm, and for a small-sized display substrate, such as a display substrate for a watch, the retracted distance is at least 2 mm. That is, at the lower frame of the display substrate, the first optically transparent adhesive layer 201 is retracted by a certain distance relative to the edge of the base substrate 10. Figure 2In the horizontal direction, the distance between the right edge of the first optically transparent adhesive layer 201 and the right edge of the base substrate 10 is at least 4 mm, 3 mm or 2 mm. For example, the second peripheral area N2 has a binding area, the binding area has a plurality of gold fingers, and the distance between the first optically transparent adhesive layer 201 and the gold fingers is greater than 1 mm.

[0101] The display panel further includes a second optically transparent adhesive layer 203 and a cover plate 204, wherein the cover plate 204 is bonded to the polarizer 202 via the second optically transparent adhesive layer 203 and covers the display area A and at least a portion of the bending area B. The second optically transparent adhesive layer 203 is indented at least 0.2 mm relative to the edge of the polarizer 202 near the bending area B.

[0102] for Fig.11 and Fig.12 The display panel shown in FIG. 1 and the other structures can refer to the above Figure 1-Figure 8 The described embodiments will not be described in detail here.

[0103] For example, in some other embodiments, Fig.13 Shows Figure 1 Another cross-sectional schematic diagram of the display panel along line MM in FIG. Fig.13 As shown, the edges of the second optically transparent adhesive layer 203 and the polarizer 202 (for example, the right edge shown in the figure) can also be flush. Since the polarizer 202 is retracted at least 0.2 mm relative to the edge of the first optically transparent adhesive layer 201, even if a small amount of the second optically transparent adhesive layer 203 overflows, it will not affect the bending of the bending zone B. For example, referring to Figure 1 At the positions of the left, right and upper frames of the display substrate, the first optically transparent adhesive layer 201 is retracted by a distance of 0-0.3 mm, for example, 0.2 mm-0.3 mm, relative to the left, right and upper edges of the base substrate 10, so as to prevent the first optically transparent adhesive layer 201 from overflowing outside the base substrate 10 during the preparation process. At the position of the lower frame of the display substrate, the first optically transparent adhesive layer 201 is retracted by a certain distance relative to the edge of the base substrate 10. For example, for a large-sized display substrate, such as a display substrate for a tablet computer or a notebook computer, the retracted distance is at least 4 mm, for a medium-sized display substrate, such as a display substrate for a mobile phone, the retracted distance is at least 3 mm, and for a small-sized display substrate, such as a display substrate for a watch, the retracted distance is at least 2 mm. That is, at the lower frame of the display substrate, the first optically transparent adhesive layer 201 is retracted by a certain distance relative to the edge of the base substrate 10. Figure 2 In the horizontal direction, the distance between the right edge of the first optically transparent adhesive layer 201 and the right edge of the base substrate 10 is at least 4 mm, 3 mm or 2 mm. For example, the second peripheral area N2 has a binding area, the binding area has a plurality of gold fingers, and the distance between the first optically transparent adhesive layer 201 and the gold fingers is greater than 1 mm. For example, Fig.14 Shows Fig.13Schematic diagram of the display panel after being bent in the bending area B.

[0104] for Fig.13 and Fig.14 The display panel shown in FIG. 1 and the other structures can refer to the above Figure 1-Figure 8 The described embodiments will not be described in detail here.

[0105] In the above-mentioned display panel provided in the embodiment of the present disclosure, at least one second wiring in the bending area is located between the first flexible substrate and the second flexible substrate. After the bending area is bent, at least one second wiring is close to or located at the neutral layer, thereby reducing or eliminating the stress on at least one second wiring, thereby reducing or eliminating the risk of at least one second wiring breaking, thereby improving the reliability and manufacturing yield of the display panel.

[0106] At least one embodiment of the present disclosure also provides a method for preparing a display panel, wherein the display panel has a display area and a bending area located on one side of the display area, and the preparation method includes: providing a base substrate, wherein the base substrate includes a stacked first flexible substrate and a second flexible substrate; forming a driving circuit layer in the display area, wherein the driving circuit layer is formed on a side of the second flexible substrate away from the first substrate and includes at least one first wiring; forming at least one second wiring in the bending area, wherein the at least one second wiring is electrically connected to the at least one first wiring; and the at least one second wiring is formed between the first flexible substrate and the second flexible substrate.

[0107] For example, in some embodiments, providing a substrate substrate includes: providing a first flexible substrate, and sequentially forming a buffer layer, at least one second trace, and a second flexible substrate on the first flexible substrate to form the substrate substrate.

[0108] Then, the method for preparing the display panel may further include: forming functional layers such as a driving circuit layer, a light emitting device layer, and a packaging layer in the display area of ​​the base substrate. The specific formation methods of these functional layers can refer to the relevant technology and will not be repeated here.

[0109] For example, the method for preparing a display panel further includes: bonding the polarizer to the base substrate through a first optically transparent adhesive layer, that is, the base substrate on which the functional layers such as the driving circuit layer, the light-emitting device layer, and the encapsulation layer are formed. For example, the first optically transparent adhesive can be first coated on the base substrate on which the functional layers such as the driving circuit layer, the light-emitting device layer, and the encapsulation layer are formed (for example, on the encapsulation layer) to form a first optically transparent adhesive layer. During the coating process, the first optically transparent adhesive can be kept retracted a certain distance relative to the edge of the base substrate (refer to the above embodiment for details) to avoid overflow of the first optically transparent adhesive, and then the polarizer is placed on the first optically transparent adhesive layer to bond the polarizer to the base substrate through the first optically transparent adhesive layer.

[0110] For example, the method for preparing the display panel further includes: bonding the cover plate to the polarizer through the second optically transparent adhesive layer. For example, the second optically transparent adhesive may be first coated on the polarizer to form the second optically transparent adhesive layer. During the coating process, the second optically transparent adhesive may be kept inward at least 0.2 mm relative to the edge of the polarizer, or the edge of the polarizer may be kept flush to avoid overflow of the second optically transparent adhesive, and then the cover plate is placed on the second optically transparent adhesive layer to bond the cover plate to the polarizer through the second optically transparent adhesive layer.

[0111] For example, in some embodiments, after the polarizer and cover plate are set, the method for preparing the display panel further includes: bending the bending area and then curing the first optically transparent adhesive layer. In conventional technology, the first optically transparent adhesive layer is first cured and then bent. At this time, the cured first optically transparent adhesive layer is relatively hard, so further bending will affect the position of the neutral layer in the bending area; on the contrary, the embodiment of the present disclosure adopts a preparation process in which the first optically transparent adhesive layer is first bent and then cured. At this time, the first optically transparent adhesive layer will basically not change the position of the neutral layer, and at the same time has a reinforcing and protective effect on the bending area B.

[0112] For example, in some embodiments, curing the first optically transparent adhesive layer includes: curing the first optically transparent adhesive layer by light curing; or spraying a catalyst on the surface of the first optically transparent adhesive layer to cure the first optically transparent adhesive layer.

[0113] For example, Fig.15 As shown, in some examples, the first optically transparent adhesive layer 201 may be cured by irradiating ultraviolet light or the like with the illumination device 40; or, a catalyst may be sprayed onto the surface of the first optically transparent adhesive layer 201 with the spray device 41, and the catalyst may destroy the molecular structure of the material of the first optically transparent adhesive layer 201 after contacting the surface of the first optically transparent adhesive layer 201, so that the first optically transparent adhesive layer 201 is hardened, thereby curing the first optically transparent adhesive layer 201. For example, the catalyst may be any catalyst that can achieve the above functions, and the embodiments of the present disclosure do not limit the specific type of the catalyst.

[0114] For example, the method for manufacturing a display panel may further include other manufacturing processes, which may refer to related technologies and will not be described in detail in the embodiments of the present disclosure.

[0115] There are a few points to note:

[0116] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0117] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0118] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0119] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A display panel having a display area and a bending area located on one side of the display area, comprising a base substrate, wherein: The substrate base comprises a first flexible substrate and a second flexible substrate in a stack; The display area includes a driving circuit layer, which is disposed on a side of the second flexible substrate away from the first flexible substrate and includes at least one first wiring. The bending area includes at least one second routing line, and the at least one second routing line is electrically connected to the at least one first routing line; Wherein, the at least one second trace is arranged between the first flexible substrate and the second flexible substrate; The substrate also includes a buffer layer between the first flexible substrate and the second flexible substrate, the buffer layer having a first hollow portion at least partially located in the bending area, the at least one second trace is disposed between the buffer layer and the second flexible substrate and extends through the first hollow portion, The display panel further includes a first optically transparent adhesive layer and a polarizer. In the display area, the polarizer is combined with the first optically transparent adhesive layer. The display panel further includes a back film disposed on a side of the first flexible substrate away from the second flexible substrate, wherein the back film has a second hollow portion at least partially within the bending area. In a direction parallel to the plate surface of the base substrate, the first optically transparent adhesive layer extends between an edge of the first hollow portion away from the display area and an edge of the second hollow portion away from the display area.

2. The display panel according to claim 1, wherein: When the bending zone is in a bent state, the at least one second routing line is located at a neutral layer position of the bending zone.

3. The display panel according to claim 1 or 2, further comprising a first peripheral area between the display area and the bending area, in, The second flexible substrate has a via hole in the first peripheral area, and the at least one first routing line and the at least one second routing line are electrically connected through the via hole.

4. The display panel according to claim 1 or 2, further comprising a second peripheral area located on a side of the bending area away from the display area, in, The second routing line passes through the bending area and extends to the second peripheral area.

5. The display panel according to claim 3, wherein: The driving circuit layer includes a thin film transistor and a storage capacitor, the thin film transistor includes a gate and a source-drain electrode, and the storage capacitor includes a first capacitor electrode and a second capacitor electrode; the second capacitor electrode is arranged on a side of the first capacitor electrode away from the substrate, and the source-drain electrode is arranged on a side of the second capacitor electrode away from the substrate; The at least one first wiring is arranged in the same layer as the source-drain electrode.

6. The display panel according to claim 5, wherein: The first peripheral region includes a first connection electrode disposed in the same layer as the first capacitor electrode, and the at least one first wiring and the at least one second wiring are electrically connected through the via hole, including: The at least one first wiring is electrically connected to the first connecting electrode, and the first connecting electrode is electrically connected to the at least one second wiring through the via hole; or, The first peripheral region includes a second connection electrode disposed in the same layer as the second capacitor electrode, and the at least one first wiring and the at least one second wiring are electrically connected through the via hole, including: The at least one first wiring is electrically connected to the second connection electrode, and the second connection electrode is electrically connected to the at least one second wiring through the via hole; or, The first peripheral region includes a first connection electrode disposed in the same layer as the first capacitor electrode and a second connection electrode disposed in the same layer as the second capacitor electrode, and the at least one first routing line and the at least one second routing line are electrically connected through the via hole, including: The at least one first wiring is electrically connected to the second connection electrode, the second connection electrode is electrically connected to the first connection electrode, and the first connection electrode is electrically connected to the at least one second wiring through the via hole.

7. The display panel according to claim 1 or 2, wherein: In a direction perpendicular to a surface of the substrate, a thickness of the second flexible substrate is smaller than a thickness of the first flexible substrate.

8. The display panel according to claim 7, wherein: The thickness of the second flexible substrate is 6 μm-10 μm, and the thickness of the first flexible substrate is 9 μm-11 μm.

9. The display panel according to claim 7, wherein: The elastic modulus of the first flexible substrate and the second flexible substrate is the same, which is 6.5 GPa-10.5 GPa.

10. The display panel according to claim 1 or 2, wherein: The material of the at least one second wiring includes one or more of titanium, aluminum, copper and molybdenum.

11. The display panel according to claim 3, further comprising a light emitting device layer and an encapsulation layer, wherein the light emitting device layer is located on a side of the driving circuit layer away from the base substrate, and the encapsulation layer is located on a side of the light emitting device layer away from the base substrate. In the display area, the polarizer is bonded to a side of the encapsulation layer away from the base substrate through the first optically transparent adhesive layer; The first optically transparent adhesive layer includes polymethyl methacrylate.

12. The display panel according to claim 11, wherein: In a direction perpendicular to the plate surface of the base substrate, the thickness of the first optically transparent adhesive layer is 27 μm-33 μm.

13. The display panel according to claim 11, wherein: In at least a portion of the first peripheral region and the bending region, a spacing insulating layer is provided between the first optically transparent adhesive and the second flexible substrate; The display area also includes: A planarization layer disposed on a side of the driving circuit layer away from the second flexible substrate; and A pixel defining layer disposed on a side of the planarization layer away from the second flexible substrate; The light-emitting device layer includes a plurality of light-emitting devices, each of the plurality of light-emitting devices includes a first electrode, a light-emitting layer, and a second electrode stacked in sequence in a direction away from the base substrate, the driving circuit layer includes a plurality of pixel driving circuits, the first electrode is electrically connected to one of the plurality of pixel driving circuits through a via hole in the planarization layer, the pixel defining layer is arranged on a side of the first electrode away from the base substrate, and includes a plurality of pixel openings, the plurality of pixel openings respectively expose the first electrodes of the plurality of light-emitting devices, and the light-emitting layers of the plurality of light-emitting devices are respectively arranged in the plurality of pixel openings; The spacer insulating layer is disposed on the same layer as at least one of the planarization layer and the pixel defining layer.

14. The display panel according to claim 11, wherein: In at least a portion of the first peripheral region and the bending region, the first optically transparent adhesive directly contacts the second flexible substrate.

15. The display panel according to claim 1, wherein: The first optically transparent adhesive layer is retracted at least 0.2 mm relative to an edge of the base substrate.

16. The display panel according to claim 15, further comprising a second optically transparent adhesive layer and a cover plate, in, The cover plate is bonded to the polarizer through the second optically transparent adhesive layer and covers the display area and at least a portion of the bending area.

17. The display panel according to claim 16, wherein: The second optically transparent adhesive layer is retracted at least 0.2 mm relative to an edge of the polarizer near the bending zone.

Images