Equipment and method for forming fine patterns with resist

Abstract

The present invention relates to an apparatus and method for forming fine resist patterns, which allows photocurable resist ink to be semi-cured so as to be sprayed onto a substrate in a gel state and form a fine resist pattern to form a boundary perpendicular to the separating ink, such that the edge portion of the formed fine resist pattern is formed to be nearly vertical, thus forming a sufficient thickness to form a metal pattern with good etching or electroplating effect. For this purpose, the resist fine pattern forming method of the present invention uses inkjet printing for printing ink along a path to form a resist fine pattern on a substrate having the same surface energy. The method includes a spraying step of simultaneously ejecting photocurable resist ink and separator forming ink at the front and rear sides of the path, spaced apart from each other, and applying light energy to the ejected photocurable resist ink. The light intensity is set relative to the light energy such that, since the photocurable resist ink is semi-cured and sprayed onto the substrate in a gel state, the ink forms a boundary perpendicular to the separator forming ink sprayed onto the substrate, and the photocurable resist ink diffusion is prevented. After both the photocurable resist ink and the separator forming ink have been completely sprayed, the photocurable resist ink is cured.

Description

Technical Field

[0001] The present invention relates to an apparatus and method for forming fine resist patterns, and more specifically, to an apparatus and method for forming fine resist patterns, the apparatus and method spraying photocurable resist ink in a semi-cured and gel state onto a substrate while forming a fine resist pattern to form a vertical boundary relative to the separating ink, thereby forming a nearly vertical edge of the fine resist pattern with sufficient thickness, and forming a metallic pattern with good etching or electroplating effect. Background Technology

[0002] In the early 2000s, a technique using inkjet technology to print etched resist patterns was being actively developed. This was an early stage in the development of printed electronics technology to develop printed circuit board manufacturing techniques using linewidths of 80μm to 150μm.

[0003] However, despite its many advantages, the technique of using inkjet printing to form etched or electroplated resist patterns has not yet been commercialized.

[0004] This is because, compared to screen printing, the most widely used technology in current printed circuit board manufacturing, the equipment and process are expensive and the productivity is low, and it is extremely difficult to achieve resist patterns with large thicknesses in printed circuit boards.

[0005] In particular, the edges of the etched or electroplated resist pattern printed by inkjet printing have a smaller contact angle of ink droplets due to ink diffusion. Therefore, since the edges along the width direction of the resist pattern are rounded, the edges along the width direction of the resist pattern, which serve as etching prevention portions, cannot effectively prevent the portions below them from being etched during the etching process, thus failing to obtain a metal pattern with good etching effect.

[0006] Similarly, the edges along the width of the resist pattern, which serve as the anti-plating portion, cannot effectively prevent the portion below it from being plated during the plating process, thus failing to obtain a metal pattern with good plating effect.

[0007] To address the aforementioned limitations, a method has been attempted to increase the contact angle of ink droplets by controlling the position of the ink to form a resist pattern. This method allows ink to accumulate only in specific areas by performing a hydrophobic treatment on the surface of the substrate, or by forming a stepped portion on the surface of the substrate to allow ink to accumulate downwards.

[0008] However, this method has the following drawbacks: the surface treatment of the substrate is either hydrophobic or hydrophilic, or the process of forming stepped portions incurs high manufacturing costs, and the cross-sectional edges of the pattern still have a curved shape. Therefore, this method may still not be able to obtain metal patterns with good etching effects.

[0009] (Related technology: Korean Patent Publication No. 2008-0037306, Publication Date: April 30, 2008) Summary of the Invention

[0010] Technical issues

[0011] The present invention provides an apparatus and method for forming a fine pattern of resist, wherein the apparatus and method spray a photocurable resist ink in a semi-cured and gel state onto a substrate, while forming a fine pattern of resist to form a vertical boundary relative to the separating ink, and forming a nearly vertical edge of the fine pattern of resist with sufficient thickness, thereby forming a metallic pattern with good etching or electroplating effect.

[0012] Solution

[0013] To achieve the aforementioned technical objective, the present invention provides a method for forming a fine resist pattern. This method forms the fine resist pattern on a substrate with the same surface energy using an inkjet printing method with ink printed along a path. The method includes the following steps: an ejection process in which light energy is applied to the ejected photocurable resist ink while simultaneously ejecting photocurable resist ink and spacer ink at the front and rear sides of the path, spaced apart from each other. Here, the intensity of the light energy is set such that the photocurable resist ink is ejected onto the substrate in a semi-cured and gelled state, forming a perpendicular boundary relative to the spacer ink ejected onto the substrate, while simultaneously preventing the photocurable resist ink from spreading, thereby curing the ink after all the photocurable resist ink and the spacer ink have been completely ejected.

[0014] In one embodiment, one of the photocurable resist ink and the separator forming ink may be discharged at the front side of the path, and the other may be discharged at the rear side of the path.

[0015] In one embodiment, the method may further include the step of additionally curing the photocurable resist ink after the spraying process.

[0016] In one embodiment, the spraying process may be performed at least twice to thicken the fine pattern of the resist.

[0017] In one embodiment, the photocurable resist ink can be discharged through a plurality of nozzles of a first discharge head arranged in a direction perpendicular to the path, and the separator forming ink can be discharged through a plurality of nozzles of a second discharge head arranged in a direction perpendicular to the path, and the plurality of nozzles of the first discharge head and the plurality of nozzles of the second discharge head can be arranged alternately based on the path.

[0018] In one embodiment, the plurality of nozzles of the first discharge head and the plurality of nozzles of the second discharge head may be arranged alternately, such that the outermost nozzle of the second discharge head is arranged inside the outermost nozzle of the first discharge head.

[0019] In one embodiment, the first discharge head and the second discharge head may have the same width covering the entire width of the substrate and are arranged in series along the front-back direction of the path.

[0020] In one embodiment, the separator-forming ink can be removed by cleaning with water.

[0021] In one embodiment, the method may further include the following steps after the spraying process: a cleaning process to remove the separating ink by cleaning with water; and an etching process to etch the substrate except for the area made of photocurable resist ink remaining after the cleaning process.

[0022] In one embodiment, the method may further include the following steps after the spraying process: a cleaning process to remove the separating ink by cleaning with water; a hydrophilic treatment process to perform hydrophilic treatment on the resist made from the photocurable resist ink remaining after the cleaning process; and an electroplating process to form an electroplating pattern on the substrate in areas other than the resist.

[0023] To achieve the aforementioned technical objective, the present invention provides an apparatus for forming a fine resist pattern. This apparatus forms the fine resist pattern on a substrate having the same surface energy using an inkjet printing method that prints ink along a path. The apparatus includes: a first ejector head configured to eject a first ink at a front side of the path; a second ejector head configured to eject a second ink simultaneously with the first ejector head at a rear side of the path; and a light irradiator configured to apply light energy to the ink ejected from at least one of the first and second ejector heads. Here, the first ink is one of a photocurable resist ink and a separator-forming ink, the second ink is the other, and the intensity of the light from the light irradiator is set such that the photocurable resist ink is sprayed onto the substrate in a semi-cured and gelled state, forming a perpendicular boundary relative to the separator-forming ink sprayed onto the substrate, while simultaneously preventing the photocurable resist ink from spreading, thereby curing after all of the photocurable resist ink and the separator-forming ink have been completely sprayed.

[0024] In one embodiment, the photocurable resist ink can be discharged through a plurality of nozzles of the first discharge head arranged in a direction perpendicular to the path, and the separator forming ink can be discharged through a plurality of nozzles of the second discharge head arranged in a direction perpendicular to the path, and the plurality of nozzles of the first discharge head and the plurality of nozzles of the second discharge head can be arranged alternately based on the path.

[0025] In one embodiment, the plurality of nozzles of the first discharge head and the plurality of nozzles of the second discharge head may be arranged alternately, such that the outermost nozzle of the second discharge head is arranged inside the outermost nozzle of the first discharge head.

[0026] In one embodiment, the first discharge head and the second discharge head may have the same width covering the entire width of the substrate and are arranged in series along the front-back direction of the path.

[0027] Beneficial effects

[0028] This invention allows the photocurable resist ink to be sprayed onto a substrate in a semi-cured and gel-like state, simultaneously forming a fine resist pattern with a perpendicular boundary relative to the separator forming ink, and creating nearly perpendicular edges of the fine resist pattern with sufficient thickness, thereby forming a metallic pattern with good etching or electroplating effects. Furthermore, due to the more uniform straightness achieved as a side effect of the separator formation, a linear pattern with good etching or electroplating effects can be uniformly formed, and lower losses can be achieved in high-frequency circuits, particularly 5G millimeter-wave communication.

[0029] The objectives of this invention are not limited to those described above, but those skilled in the art will clearly understand other objectives not described herein through the following description. Attached Figure Description

[0030] Figure 1 This is a view illustrating the spraying process of a method for forming a fine pattern of resist according to an embodiment of the present invention.

[0031] Figure 2 This is a flowchart illustrating the sequence of a method for forming a fine pattern of resist according to an embodiment of the present invention.

[0032] Figure 3 This is a flowchart illustrating the sequence of a method for forming a fine pattern of resist according to another embodiment of the present invention.

[0033] Figure 4 This is a flowchart illustrating the sequence of a method for forming a fine pattern of resist according to another embodiment of the present invention.

[0034] Figure 5 This is a schematic diagram illustrating an apparatus for forming fine patterns of resist according to an embodiment of the present invention.

[0035] Figure 6 This is a schematic diagram illustrating an apparatus for forming fine patterns of resist according to another embodiment of the present invention.

[0036] Figure 7 This is a schematic diagram illustrating an apparatus for forming fine patterns of resist according to another embodiment of the present invention.

[0037] Figure 8 This is a schematic diagram illustrating an apparatus for forming fine patterns of resist according to another embodiment of the present invention. Detailed Implementation

[0038] This invention can be implemented in various ways without departing from the technical concept or main features. Therefore, the embodiments of this invention are merely illustrative and should not be interpreted as restrictive.

[0039] It is understood that although this article uses terms such as “first” and “second” to describe various elements, these elements should not be limited by these terms.

[0040] These terms are used only to distinguish one component from other components. For example, without departing from the scope of the appended claims, a first element referred to as a first element in one embodiment may be referred to as a second element in another embodiment.

[0041] As used herein, the term “and / or” includes any and all combinations of one or more of the associated list items.

[0042] It should also be understood that when a component is referred to as being "connected to" or "joined to" another component, it can be directly connected to the other component, or there may be an intermediate component.

[0043] It should also be understood that when one element is referred to as being "directly connected" to another element, there are no intermediate elements.

[0044] In the following description, technical terms are used only to explain particular exemplary embodiments and are not intended to limit the invention. Singular terms may include plural forms unless otherwise specified.

[0045] The meaning of "including" or "comprises" is to specify the attributes, marks, steps, processes, elements, components or combinations thereof in the specification, but does not exclude other attributes, marks, steps, processes, elements, components or combinations thereof.

[0046] Unless the terms used in this disclosure are defined differently, they may be interpreted as having the meanings known to one of skill in the art.

[0047] Terms such as those that are generally used and already exist in dictionaries should be interpreted as having a meaning that matches the context in this field. In this description, unless explicitly defined, terms should not be ideally or excessively interpreted in a formal sense.

[0048] In the following description, embodiments disclosed herein are illustrated with reference to the accompanying drawings, and identical or corresponding parts are given the same reference numerals, and repeated descriptions thereof will be omitted.

[0049] Furthermore, in order to avoid unnecessarily obscuring the subject matter of the invention, detailed descriptions related to known functions or configurations will be excluded.

[0050] According to an embodiment of the present invention, a method for forming a fine resist pattern (hereinafter referred to as a fine resist pattern forming method) forms a fine pattern along an inkjet printing path of a substrate on which the fine pattern is formed, and in particular, forms a fine resist pattern on a substrate having the same surface energy by using inkjet printing with ink printed along the path.

[0051] A method for forming a fine resist pattern according to an embodiment of the present invention includes a spraying process. For example... Figure 1 As shown, the spraying process simultaneously ejects photocurable resist ink and ink for forming separator walls (hereinafter referred to as separator forming ink) at the front and rear sides of the path, respectively, to separate them from each other, and applies light energy to the ejected photocurable resist ink.

[0052] Photocurable resist inks can be made from inks that are cured by light, while separator-forming inks can be made from inks that can be removed by cleaning with water.

[0053] Specifically, such as Figure 1 As illustrated, the jetting process simultaneously performs all of the following steps: ejecting photocurable resist ink through a first ejector 100 located at the front of the print path; ejecting separator forming ink through a second ejector 200 located at the rear of the print path; and applying light energy to the ejected photocurable resist ink through a light irradiator 300.

[0054] Here, the plurality of nozzles n1 of the first discharge head 100 and the plurality of nozzles n2 of the second discharge head 200 are arranged alternately based on the path, and in particular, are arranged alternately with a difference of up to half the resolution spacing to be printed.

[0055] Specifically, during the spraying process, the intensity of the light energy is set so that the photocurable resist ink is sprayed onto the substrate in a semi-cured and gel state, forming a vertical boundary with respect to the partition ink sprayed onto the substrate, while simultaneously preventing the photocurable resist ink from spreading, and after all the photocurable ink and volatile ink have been completely sprayed, the photocurable ink is completely cured.

[0056] In addition, since the ink is sprayed to form a partition to prevent the photocurable ink from spreading before the photocurable resist ink is sprayed onto the substrate and fully diffused, the area where the photocurable resist ink is sprayed is reduced.

[0057] In other words, since the light energy applied to the discharged photocurable resist ink is set as described above, before the photocurable resist ink in a semi-cured and gel state, rather than a fully cured state, is sprayed onto the substrate and diffuses, a separating ink can be sprayed between the photocurable resist inks to prevent the photocurable resist ink from completely diffusing, and a boundary between the two inks can be formed vertically.

[0058] As described above, since a separating ink is sprayed between the photocurable photoresist inks before the photocurable photoresist inks are fully diffused onto the substrate, a vertical boundary is formed between the gel-like photocurable photoresist inks and the separating inks (see reference). Figure 2 (a) and the gel-like photocurable resist ink can have a large thickness on both sides along its width direction.

[0059] For example, when only photocurable resist ink is sprayed to form a fine resist pattern, as the photocurable resist ink is sprayed onto the substrate and then gradually diffuses, the thickness on both sides of the pattern made of the photocurable resist ink in the width direction gradually decreases, and the pattern can have a shape that is easy to etch.

[0060] On the other hand, such as Figure 2 As illustrated in (a), when a fine resist pattern is formed by the method of the present invention, either side of the pattern made of photocurable resist ink can have a large, almost vertical thickness in the width direction, and the pattern can be effectively prevented from being etched.

[0061] In addition, by preventing the sprayed photocurable resist ink in a gel state from completely spreading, the width of the fine resist pattern can be further refined.

[0062] Although a method for discharging photocurable resist ink via a first discharge head 100 located at the front of the print path and for discharging separator forming ink via a second discharge head 200 located at the rear of the print path is described by way of example, the method of discharging separator forming ink via a first discharge head 100 located at the front of the print path and for discharging photocurable resist ink via a second discharge head 200 located at the rear of the print path is not excluded.

[0063] In other words, one of the photocurable resist ink and the separator ink can be discharged at the front of the path, and the other can be discharged at the back of the path.

[0064] As described above, it is possible to execute the corresponding Figure 2 The spraying process of (a) involves applying light energy to the ejected photocurable resist ink, simultaneously ejecting photocurable resist ink and separating ink at the front and rear sides of the path, respectively, spaced apart from each other, and then proceeding sequentially. Figure 2 The processes illustrated in (b), (c), (d) and (e).

[0065] Specifically, such as Figure 2 As illustrated in (b), an additional curing process for the photocurable resist ink can be performed after the spraying process.

[0066] Here, additional curing of the photocurable resist ink can be performed by a separate photocuring device (UV curing device), and because the separator forming ink is not affected by the photocuring device (UV curing device), the separator forming ink is not additionally cured.

[0067] Through the above curing process, further strong resist fine patterns can be formed by additionally curing the photocurable resist ink.

[0068] Alternatively, the thickness of the resist fine pattern can be increased by repeating the spraying process at least twice before or after the curing process.

[0069] In other words, after the spraying process has been repeated at least twice, the curing process can be performed, and one of the spraying and curing processes can be performed two or more times.

[0070] Through the above process, a fine resist pattern with the desired thickness can be formed.

[0071] After the curing process, a cleaning process is performed to clean with water and remove the separating ink, as well as an etching process to etch the areas of the substrate other than the resist made of photocurable resist ink.

[0072] Specifically, such as Figure 2 As illustrated, (a) a spraying process and (b) a curing process can be performed, followed by (c) a cleaning process and (d) an etching process. When the fine resist pattern is removed after the above processes, a pattern such as... can be formed on the substrate. Figure 2 The fine pattern illustrated by (e).

[0073] After the etching process, a desired conductive pattern can be formed, which can then be removed by a stripping process. The stripping solution is typically an alkaline solution that does not affect the etched or electroplated pattern. Depending on the stripping result, the fine resist pattern is removed either as a film or by melting in the alkaline solution. The composition of the stripping solution varies depending on the resist composition. After removing the resist, a cleaning process removes the stripping solution, followed by a drying process. Ultrasonic waves can be applied simultaneously to improve the performance of both stripping and cleaning.

[0074] Another embodiment of the present invention may further include the following processes after the curing process: a cleaning process of cleaning and removing the separating ink with water; a hydrophilic treatment process of performing hydrophilic treatment on the resist made from the photocurable resist ink remaining after the cleaning process; and an electroplating process of forming an electroplating pattern on the area of ​​the substrate other than the resist.

[0075] Specifically, such as Figure 3 As shown, (a) the spraying process and (b) the curing process can be performed, followed by (c) the cleaning process, (d) the hydrophilic treatment process, and (e) the electroplating process in sequence. When the fine resist pattern is removed after the above processes, a pattern such as... can be formed on the substrate. Figure 3 The fine pattern illustrated in (f).

[0076] in addition, Figure 4The pattern of the multilayer printed circuit board substrate illustrated herein can be formed by applying the above-described spraying process, curing process, cleaning process, hydrophilic treatment process and electroplating process.

[0077] Specifically, the pattern of a multilayer printed circuit board substrate can be processed through the following steps: by performing, for example... Figure 4 The spraying, curing, and cleaning processes illustrated in (a) on the top and bottom surfaces of a multilayer printed circuit board substrate, and as such Figure 4 The process is illustrated in (b) by performing a hydrophilic treatment and an electroplating process, as shown in the example. Figure 4 The process is illustrated in (c), by removing the fine pattern of the resist as shown. Figure 4 The process is illustrated in (d), and then performed by flash etching as shown. Figure 4 The example in (e) is used for processing.

[0078] An apparatus (hereinafter referred to as a resist fine pattern forming apparatus) for forming a resist fine pattern for performing the above-described resist fine pattern forming method according to an embodiment of the present invention is disclosed.

[0079] According to an embodiment of the present invention, a resist fine pattern forming apparatus forms a resist fine pattern on a substrate having the same surface energy by using inkjet printing to print ink along a path.

[0080] like Figure 1 and Figure 5 As illustrated, the resist fine pattern forming apparatus includes a first discharge head 100 for discharging a first ink at the front side of the path, a second discharge head 200 disposed at the rear side of the path for simultaneously discharging a second ink, and a light irradiator 300 for applying light energy to the ink discharged from at least one of the first discharge head 100 and the second discharge head 200.

[0081] The first ink is one of the photocurable resist ink and the separator ink, and the second ink is the other.

[0082] In other words, when the first ink is a photocurable resist ink, the second ink is a separator forming ink, and when the first ink is a separator forming ink, the second ink is a photocurable resist ink.

[0083] In addition, the intensity of the light from the light irradiator 300 is set such that the photocurable resist ink is sprayed onto the substrate in a semi-cured and gel state, forming a vertical boundary relative to the separator forming ink sprayed onto the substrate, while simultaneously preventing the photocurable resist ink from spreading, so that it is completely cured after all the photocurable resist ink and separator forming ink have been completely sprayed.

[0084] Figures 5 to 8This is a schematic diagram illustrating a resist fine pattern forming apparatus according to an embodiment of the present invention. Hereinafter, each of four types of resist fine pattern forming apparatus will be described.

[0085] In four types of resist fine pattern forming equipment, the arrangement of the head, the position and number of the light irradiators will vary depending on whether the printing method is unidirectional or bidirectional and whether the same type of ink or different types of ink are applied to the first ink and the second ink.

[0086] First, it has a unidirectional printing method and uses different types of ink. Figure 5 The first embodiment of the resist fine pattern forming apparatus includes: a first discharge head for discharging photocurable resist ink cured by an ultraviolet (UV) curing method, wherein the photocurable resist ink traveling after being discharged is directly gelled by a light irradiator; and a second discharge head for discharging solvent or water-based separating ink between patterns made of the photocurable resist ink to form temporary separating walls.

[0087] Specifically, the resist fine pattern forming apparatus according to the first embodiment includes a first discharge head, a second discharge head, and a light irradiator. The apparatus forms a resist fine pattern on a substrate having the same surface energy by using an inkjet printing method that ejects ink along a printing path.

[0088] like Figure 5 As illustrated, the resist fine pattern forming apparatus includes a substrate moving device for moving a substrate to form a resist fine pattern thereon, a first discharge head for discharging a first ink at the front side of the substrate's moving path, a light irradiator disposed directly behind the first discharge head, and a second discharge head disposed at the rear side of the substrate's moving path for discharging a second ink.

[0089] In this embodiment, the case in which the first ink is a photocurable resist ink and the second ink is a separator forming ink will be described as an example.

[0090] The first row of heads, the light irradiator, and the second row of heads are directly adjacent to each other in sequence.

[0091] Specifically, the intensity of the light energy of the light irradiator is set such that the gel-like photocurable resist ink discharged from the first discharge head travels and is sprayed onto the substrate to form a vertical boundary relative to the separator forming ink discharged from the second discharge head and sprayed onto the substrate, while simultaneously preventing the photocurable resist ink from spreading, so that it is cured after all the photocurable resist ink and separator forming ink have been completely sprayed.

[0092] Specifically, before the photocurable resist ink discharged from the first discharge head is sprayed onto the substrate and fully cured, separation forming ink is discharged from the second discharge head. Therefore, by spraying separation forming ink to prevent the photocurable resist ink from spreading before it is sprayed onto the substrate and fully diffused, the area where the photocurable resist ink is sprayed can be reduced, and an edge can be formed perpendicularly along the width direction of the photocurable resist ink.

[0093] In addition, either the first discharge head or the second discharge head has sufficient length to cover the entire width of the substrate to form a pattern over the entire area of ​​the substrate by performing a printing process on the substrate.

[0094] Here, the first and second discharge heads have the same length and are arranged in series along the front-to-back direction of the path.

[0095] Specifically, such as Figure 1 As shown, the first ejector head 100 may include a plurality of nozzles n1 arranged in a direction perpendicular to the path, and ejects photocurable resist ink droplets with a volume of 2 picoliters (pL) or less onto the substrate. Alternatively, the first ejector head 100 may eject photocurable resist ink droplets with a volume of 0.6 picoliters or less, depending on the inkjet ejection atmosphere (helium atmosphere). The second ejector head 200 may include a plurality of nozzles n2 arranged in a direction perpendicular to the path, and ejects segmented ink droplets with a volume of 2 picoliters or less onto the substrate. Alternatively, the second ejector head 200 may eject segmented ink droplets with a volume of 0.6 picoliters or less, depending on the inkjet ejection atmosphere (helium atmosphere). Here, the plurality of nozzles n1 of the first ejector head 100 and the plurality of nozzles n2 of the second ejector head 200 are arranged alternately based on the path, and in particular, are arranged alternately with a difference of half the resolution spacing to be printed. Here, the outermost nozzle n2 of the second discharge head 200 is arranged inside the outermost nozzle n1 of the first discharge head 100 (from which photocurable ink is discharged), so that the photocurable resist ink is discharged to the four edges of the substrate, thereby preventing the separation forming ink discharged from the second discharge head 200 from flowing to the outside of the substrate.

[0096] Here, the discharge area of ​​the photocurable resist ink may include multiple linear regions spaced apart from each other, and the separation of the discharge areas forming the ink may include linear regions between the discharge areas of the photocurable resist ink.

[0097] like Figure 1 As illustrated, the substrate moving device performs linear movement of the substrate along segment Y1 (upward movement in the figure).

[0098] In addition to the first discharge head 100, the second discharge head 200, and the light irradiator 300, the ink droplet precision measuring camera and the substrate height measuring device are mounted on the vertically moving Z segment to move together, and the Z segment moves linearly along the X segment.

[0099] The vertical movement of the Z segment and the movement of the Z segment along the X segment can be performed by a drive unit such as a linear motor and a linear guide.

[0100] As described above, the first discharge head 100, the second discharge head 200, and the light irradiator 300 are assembled into the Z segment and moved together by a drive unit.

[0101] Segment Y2 is arranged near and parallel to segment Y1, and a droplet precision measurement substrate for measuring the accuracy of ink droplets discharged from either the first discharge head or the second discharge head is arranged on segment Y2.

[0102] In addition, head maintenance devices for maintaining the first and second discharge heads are arranged on section Y2.

[0103] In addition, an ink droplet sphere formation height measuring camera, used to measure the sphere formation height of ink droplets discharged from either the first discharge head or the second discharge head, is arranged on segment Y2.

[0104] All components of the droplet precision measurement substrate, head maintenance device, and droplet sphere forming height measurement camera are integrated into a single unit for linear movement along the Y2 segment.

[0105] In addition, to improve the speed and convenience of the drying process of the substrate moving along the Y1 segment, a near-infrared drying module (or pulsed ultraviolet curing module) can be installed at the rear of the Y1 segment and the printing process of separating ink is performed quickly and multiple times.

[0106] The near-infrared drying module can be installed in a box-shaped light shield with a door on one side and moved linearly along the Y3 segment arranged in the light shield.

[0107] The inkjet printing device described above can be installed in a sealed space with a helium atmosphere, and can perform the processes of discharging photocurable resist ink from the first discharge head and discharging separator-forming ink from the second discharge head under a helium atmosphere.

[0108] In order to eject photocurable resist ink in the form of small-sized droplets and to eject separated ink in the form of small-sized droplets, the inkjet printer is installed in a sealed space with a helium atmosphere.

[0109] Specifically, due to the density of helium (0.1785 kg / m³), 3 It is approximately the density of air (1.2 kg / m³).3 Helium has a molecular weight of 15%, which can increase the terminal velocity of ink droplets. More specifically, due to the low molecular weight of helium, a helium atmosphere can reduce air (gas) resistance to maintain sufficient ejection velocity and sufficient travel distance to eject ink droplets with a volume of 0.6 picoliters or less.

[0110] Next, based on the unidirectional printing method and the use of the same type of ink... Figure 6 The second embodiment of the resist fine pattern forming apparatus includes a first discharge head for discharging photocurable resist ink cured by ultraviolet curing method, a second discharge head for discharging water-soluble separating ink between patterns made of photocurable resist ink, and a light irradiator for gelling both inks.

[0111] Specifically, the first row head, the second row head, and the light irradiator are directly adjacent to each other in sequence.

[0112] The light irradiator irradiates the ink discharged from the first discharge head and the second discharge head with light, so that all the ink discharged from the first discharge head and the second discharge head is gelled.

[0113] Next, based on the bidirectional printing method and the use of different types of ink... Figure 7 The resist fine pattern forming apparatus of the third embodiment includes a first discharge head, a first light irradiator, a second discharge head, a second light irradiator, and a third discharge head arranged in series in sequence.

[0114] Either the first discharge head or the third discharge head discharges a photocurable resist ink that is cured by ultraviolet light. The second discharge head discharges a solvent- or water-based separated ink. A first light irradiator, arranged adjacent to the first discharge head, irradiates the ink discharged from the first discharge head with light, while a second light irradiator, arranged adjacent to the third discharge head, irradiates the ink discharged from the third discharge head with light.

[0115] Operate the first discharge head, the first light irradiator adjacent to the first discharge head, and the second discharge head for forward printing (in) Figure 7 The middle substrate moves upward), and the third discharge head, the second light irradiator adjacent to the third discharge head, and the second discharge head are operated to perform reverse printing (in Figure 7 (The middle substrate moves downwards).

[0116] Next, based on the bidirectional printing method and using the same type of ink... Figure 8 The resist fine pattern forming apparatus of the fourth embodiment includes a first light irradiator, a first discharge head, a second discharge head and a second light irradiator arranged in series in sequence.

[0117] The first discharge head discharges photocurable resist ink cured by ultraviolet curing, and the second discharge head discharges water-soluble separator ink between patterns made of photocurable resist ink.

[0118] Operate the first discharge head 100, the second discharge head, and the second light irradiator for forward printing. Figure 8 The middle substrate moves upward), and the second discharge head, the first discharge head, and the first light irradiator are operated to perform reverse printing. Figure 8 (The middle substrate moves downwards).

[0119] Although embodiments of the invention have been described, it should be understood that the invention should not be limited to these embodiments, but those skilled in the art can make various changes and modifications within the spirit and scope of the appended invention.

Claims

1. A method for forming a fine resist pattern, the method comprising the steps of: During the spraying process, while simultaneously ejecting photocurable resist ink and separator ink at the front and rear sides of the path to separate them from each other, light energy is applied to the ejected photocurable resist ink, wherein... The intensity of the light energy is set such that the photocurable resist ink is semi-cured and deposited on the substrate in a gel state, forming a perpendicular boundary relative to the separator ink deposited on the substrate, while simultaneously preventing the photocurable resist ink from diffusing. This allows the photocurable resist ink to be fully cured after all the photocurable resist ink and separator ink have been completely deposited. By using light energy set to the specified intensity, the edge portions of the resist fine pattern are formed into a vertical shape, thereby allowing for an increase in pattern thickness and a reduction in the spacing between adjacent resist fine patterns.

2. The method according to claim 1, wherein, One of the photocurable resist ink and the separator forming ink is discharged at the front side of the path, and the other is discharged at the rear side of the path.

3. The method according to claim 1, further comprising the step of additionally curing the photocurable resist ink after the spraying process.

4. The method according to claim 1, wherein, The spraying process is performed at least twice to thicken the fine pattern of the resist.

5. The method according to claim 1, wherein, The photocurable resist ink is discharged through multiple nozzles of a first discharge head arranged in a direction perpendicular to the path. The separated ink is discharged through multiple nozzles of a second discharge head arranged in a direction perpendicular to the path, and The plurality of nozzles of the first discharge head and the plurality of nozzles of the second discharge head are arranged alternately based on the path.

6. The method according to claim 5, wherein, The plurality of nozzles of the first discharge head and the plurality of nozzles of the second discharge head are arranged alternately, such that the outermost nozzle of the second discharge head is arranged inside the outermost nozzle of the first discharge head.

7. The method according to claim 5, wherein, The first discharge head and the second discharge head have the same width covering the entire width of the substrate and are arranged in series along the front-back direction of the path.

8. The method according to claim 1, wherein, The ink formed by the separator can be removed by cleaning with water.

9. The method according to claim 1, further comprising the following steps after the spraying process: The cleaning process involves removing the ink formed by the separators by cleaning with water; and The etching process etches the area of ​​the substrate except for the resist made from the photocurable resist ink remaining after the cleaning process.

10. The method according to claim 1, further comprising the following steps after the spraying process: The cleaning process involves removing the ink formed by the separators by cleaning with water; The hydrophilic treatment process involves performing a hydrophilic treatment on the photocurable resist ink that remains after the cleaning process; as well as The electroplating process forms an electroplated pattern on the substrate in areas other than the resist.

11. An apparatus for forming a fine resist pattern, the apparatus forming the fine resist pattern on a substrate by using an inkjet printing method that prints ink along a path, the apparatus comprising: A first discharge head is configured to discharge first ink at the front side of the path; A second discharge head is configured to discharge a second ink at the rear side of the path simultaneously with the first discharge head; as well as A light irradiator configured to apply light energy to ink emitted from at least one of the first discharge head and the second discharge head. The first ink is one of a photocurable resist ink and a separator-forming ink, and the second ink is the other. The intensity of the light from the light irradiator is set such that the photocurable resist ink is semi-cured and deposited on the substrate in a gel state, forming a perpendicular boundary relative to the separator ink deposited on the substrate, while simultaneously preventing the photocurable resist ink from diffusing, thereby allowing the photocurable resist ink to be fully cured after all the photocurable resist ink and the separator ink have been completely deposited. By using light energy set to the specified intensity, the edge portions of the resist fine pattern are formed into a vertical shape, thereby allowing for an increase in pattern thickness and a reduction in the spacing between adjacent resist fine patterns.

12. The device according to claim 11, wherein, The photocurable resist ink is discharged through multiple nozzles of the first discharge head arranged in a direction perpendicular to the path. The separated ink is discharged through a plurality of nozzles of the second discharge head arranged in a direction perpendicular to the path, and The plurality of nozzles of the first discharge head and the plurality of nozzles of the second discharge head are arranged alternately based on the path.

13. The device according to claim 12, wherein, The plurality of nozzles of the first discharge head and the plurality of nozzles of the second discharge head are arranged alternately, such that the outermost nozzle of the second discharge head is arranged inside the outermost nozzle of the first discharge head.

14. The device according to claim 12, wherein, The first discharge head and the second discharge head have the same width covering the entire width of the substrate and are arranged in series along the front-back direction of the path.

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