Component mounting system

Abstract

The component mounting system (100) of the present invention is a system in which a mounting machine (1) and an inspection device (5) are connected to a management device (6) for data communication. The mounting machine (1) includes a mounting analysis unit (46) for acquiring adsorption position offset data (D1) according to the component mounting action of the mounting head (251). The inspection device (5) includes an inspection analysis unit (533) for acquiring mounting position offset data (D31) corresponding to each of a plurality of target mounting positions. The management device (6) includes a mark generation unit (652) and a display unit (62). The mark generation unit (652) generates each adsorption offset mark (MA1) and each mounting offset mark (MA2) for visualizing the direction and size of the position offset based on each adsorption position offset data (D1) and each mounting position offset data (D31). The display unit (62) displays each adsorption offset mark (MA1) or each mounting offset mark (MA2) at each mark assignment position (MP) on a substrate graphic (GP).

Description

Technical Field

[0001] The present invention relates to a component mounting system including a mounting machine for producing a component mounting substrate on which components are mounted. Background Art

[0002] Conventionally, there is a component mounting system having a mounting machine that mounts electronic components (hereinafter referred to as "components") on a substrate such as a printed circuit board to produce a component mounting substrate. The mounting machine in this component mounting system has a mounting head that performs a component mounting operation of holding the component by suction with a nozzle and mounting the component on the substrate. The mounting head performs the component mounting operation corresponding to each of a plurality of target mounting positions pre-set on the substrate.

[0003] During the component mounting operation of the mounting head, there is sometimes a positional deviation between the actual suction position (actual suction position) where the component is sucked by the suction nozzle and the target suction position. Such a positional deviation of the suction position may cause the actual mounting position (actual mounting position) of the component on the substrate to be offset relative to the target mounting position. When the actual mounting position of the component on the substrate is offset, it will affect the quality of the component mounting substrate produced by the mounting machine.

[0004] Patent document 1 discloses a technique for an inspection device for inspecting a component mounting substrate. The inspection device inspects the positional deviation of the actual mounting position of a component on the component mounting substrate, and determines whether the positional deviation is good or not based on a determination reference value. In the technique disclosed in patent document 1, the setting of the determination reference value is optimized based on a histogram representing the distribution of the positional deviation obtained during the inspection of the inspection device.

[0005] In the technology disclosed in Patent Document 1, the distribution of positional deviation of the actual mounting position of the component on the component mounting substrate can be confirmed. However, the tendency of the mounting position deviation of the entire substrate or the tendency of the positional deviation of the actual suction position of the suction nozzle sucking the component, which may be the cause of the mounting position deviation, cannot be confirmed. Therefore, it is difficult to take appropriate countermeasures for eliminating the positional deviation of the actual mounting position of the component on the substrate.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Publication No. 2008-10666 Summary of the invention

[0009] The present invention has been made in view of the above-mentioned situation, and an object of the present invention is to provide a component mounting system capable of confirming a tendency of a suction position deviation or a mounting position deviation of the entire substrate.

[0010] The component mounting system according to one aspect of the present invention includes: a mounting machine that produces a component mounting substrate on which components are mounted; an inspection device that inspects the component mounting substrate; and a management device that is connected to the mounting machine and the inspection device in a data-communicative manner. In the component mounting system, the mounting machine includes: a mounting table that holds the substrate; a mounting head that has a suction nozzle that can adsorb and hold the component, and performs a component mounting action of mounting the component adsorbed and held by the suction nozzle onto the substrate on the mounting table corresponding to each of a plurality of target mounting positions set on the substrate; a mounting analysis unit that analyzes an adsorption position offset that indicates a position offset of an actual adsorption position of the component adsorbed by the suction nozzle relative to a target adsorption position, and obtains adsorption position offset data about the adsorption position offset according to the component mounting action performed by the mounting head; and a mounting output unit that outputs each of the adsorption position offset data for each of the component mounting actions. The inspection device includes: an inspection analysis unit that analyzes the mounting position offsets indicating the position offsets of the actual mounting positions of the components on the component mounting substrate obtained based on the component mounting action of the mounting head relative to each of the plurality of target mounting positions, and obtains mounting position offset data about the mounting position offsets; and an inspection output unit that outputs each of the mounting position offset data. The management device includes: a mark generation unit that generates each suction offset mark that visualizes the direction and size of each suction position offset indicated by each of the suction position offset data and each mounting offset mark that visualizes the direction and size of each mounting position offset indicated by each of the mounting position offset data; and a display unit that displays a substrate graphic corresponding to the substrate, and displays each of the suction offset marks or each of the mounting offset marks at each of the mark assignment positions corresponding to each of the plurality of target mounting positions on the substrate graphic.

[0011] The objects, features and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a diagram showing the overall configuration of a component mounting system according to one embodiment of the present invention.

[0013] Figure 2 This is a block diagram of a mounting machine included in a component mounting system.

[0014] Figure 3It is a plan view showing the structure of a mounting machine main body in the mounting machine.

[0015] Figure 4 This is an enlarged view showing a portion of the head unit of the mounting machine body.

[0016] Figure 5 This is a block diagram of an inspection device included in a component mounting system.

[0017] Figure 6 This is a block diagram of a management device included in a component mounting system.

[0018] Figure 7 This is a diagram showing a display screen of a display unit included in the management device, and is a diagram showing a display state when a first position deviation tendency display instruction is accepted by the operation unit.

[0019] Figure 8 It is a diagram showing another example of the suction offset mark and the mounting offset mark displayed on the display unit.

[0020] Fig. 9 This is a diagram showing a state in which a suction offset mark or a mounting offset mark on the display screen of the display unit is displayed in a different display form for each type of mounting machine.

[0021] Fig.10 This is a diagram showing a state in which a suction offset mark or a mounting offset mark on the display screen of the display unit is displayed in a different display form for each type of mounting stage.

[0022] Fig.11 This is a diagram showing a state in which a suction offset mark or a mounting offset mark on the display screen of the display unit is displayed in a different display form for each type of the mounting head.

[0023] Fig.12 This is a diagram showing a state in which a suction offset mark or a loading offset mark on the display screen of the display unit is displayed in a different display form for each type of suction nozzle.

[0024] Fig.13 1 is a diagram showing a display screen of a display unit, and is a diagram showing a display state when an inspection result display instruction is received by an operation unit.

[0025] Fig.14 2 is a diagram showing a display screen of the display unit, and is a diagram showing a display state when the second position deviation tendency display instruction is accepted by the operation unit.

[0026] Fig.15 2 is a diagram showing a display screen of the display unit, and is a diagram showing a display state when the third position deviation tendency display instruction is accepted by the operation unit. DETAILED DESCRIPTION

[0027] Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

[0028] Figure 1 1 is a diagram showing the overall configuration of a component mounting system 100 according to an embodiment of the present invention. The component mounting system 100 includes a component mounting line 100L in which a mounting machine 1 and an inspection device 5 are connected, and a management device 6 .

[0029] In the component mounting line 100L, the mounting machine 1 and the inspection device 5 are connected in a straight line and side by side along the conveying direction of the substrate PP such as the printed circuit board based on the connecting conveyor, and the inspection device 5 is arranged on the downstream side of the conveying direction relative to the mounting machine 1. The mounting machine 1 is a device that produces a component mounting substrate PPS on which electronic components (hereinafter referred to as "components") are mounted on the substrate PP. The number of mounting machines 1 constituting the component mounting line 100L is not particularly limited, and one mounting machine 1 may be configured, or two or more mounting machines 1 may be configured. The component mounting substrate PPS produced by the mounting machine 1 is transported to the inspection device 5. The inspection device 5 is a device that inspects the component mounting substrate PPS. The management device 6 is a device that can be connected to the mounting machine 1 and the inspection device 5 for data communication.

[0030] Reference Figures 2 to 4 The mounting machine 1 included in the component mounting system 100 will be described. Figure 2 is a block diagram of installation machine 1, Figure 3 1 is a top view showing the structure of the mounting machine main body 2 in the mounting machine 1. Figure 4 FIG. 2 is an enlarged view showing a portion of the head unit 25 of the mounting machine body 2. Figure 3 In the diagram, the directional relationship is expressed using XY orthogonal coordinates that are orthogonal to each other on a horizontal plane.

[0031] The mounting machine 1 includes a mounting machine body 2, a mounting control unit 4, a mounting communication unit 40, and a mounting storage unit 40M. The mounting machine body 2 constitutes a component mounting operation, etc., for mounting components on a substrate PP during production of a component mounting substrate PPS. The mounting communication unit 40 is an interface for data communication with the management device 6, and has a function as a mounting output unit that outputs various data and information to the management device 6. The mounting control unit 4 controls the component mounting operation, etc., of the mounting machine body 2 according to the substrate data D20 stored in the mounting storage unit 40M, and controls the data communication operation of the mounting communication unit 40.

[0032] Before the mounting machine body 2 mounts the component, a pattern of solder paste is printed on the substrate PP. That is, the mounting machine body 2 mounts the component on the substrate PP on which the pattern of solder paste is printed by the pattern forming device. The mounting machine body 2 includes a main frame 21, a substrate conveying unit 23, a component supply unit 24, and a head unit 25.

[0033] The main frame 21 is a structure in which the various parts constituting the mounting machine body 2 are arranged, and it is formed into a substantially rectangular shape when viewed from a direction (plumb direction) perpendicular to the X-axis direction and the Y-axis direction. The substrate conveying unit 23 is arranged on the main frame 21, and conveys the substrate PP along the X-axis direction. The substrate conveying unit 23 includes a carry-in unit 231, a plurality of mounting tables 232, and a carry-out unit 233, which are arranged in sequence from the upstream side to the downstream side in the conveying direction of the substrate PP. The carry-in unit 231 receives the substrate PP from the substrate conveying path of the device on the upstream side, and transfers the substrate PP to the mounting table 232. The carry-in unit 231 functions as a buffer conveyor that allows the substrate PP to stand by in a manner that can set a time difference between the reception and transfer of the substrate PP. Each mounting table 232 is composed of, for example, a pair of conveyors, which positions and holds the substrate PP at a specified working position (component mounting position where the component is mounted on the substrate PP). The substrate PP is mounted with components while being held on each mounting table 232. After the component mounting operation on the substrate PP on each mounting stage 232 is completed, the mounting stage 232 delivers the substrate PP to the unloading section 233. The unloading section 233 receives the substrate PP from the mounting stage 232 and delivers the substrate PP to the substrate conveying path of the device on the downstream side. The unloading section 233 functions as a buffer conveyor that allows the substrate PP to wait in a manner that allows a time difference to be set between the reception and delivery of the substrate PP.

[0034] The component supply unit 24 is arranged in each area of ​​both ends of the main frame 21 in the Y-axis direction across the substrate conveying unit 23. The component supply unit 24 is an area where a plurality of feeders 24F are assembled in an arranged state on the main frame 21, and the setting position of each feeder 24F is divided according to each component of the holding object held by the mounting head 251 of the head unit 25 described later. The feeder 24F is assembled to the component supply unit 24 so as to be freely loaded and unloaded. The feeder 24F is not particularly limited as long as it can hold a plurality of components and supply the held components to a specified component supply position set in the feeder, and it is, for example, a tape feeder. The tape feeder is a feeder that has a reel on which a component storage tape that stores components at specified intervals is wound, and supplies components by sending out the component storage tape from the reel.

[0035] The head unit 25 is held by the moving beam 27. A fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 driven to rotate by a Y-axis servo motor 263 are provided on the main frame 21. The moving beam 27 is arranged on the fixed rail 261, and a nut portion 271 provided on the moving beam 27 is screwed to the ball screw shaft 262. In addition, a guide 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servo motor 274 are provided on the moving beam 27. The head unit 25 is movably held by the guide 272, and a nut portion provided on the head unit 25 is screwed to the ball screw shaft 273. Moreover, based on the operation of the Y-axis servo motor 263, the moving beam 27 moves in the Y-axis direction, and based on the operation of the X-axis servo motor 274, the head unit 25 moves in the X-axis direction relative to the moving beam 27. That is, the head unit 25 can move in the Y-axis direction along with the movement of the moving beam 27, and can move in the X-axis direction along the moving beam 27. The head unit 25 can move between the component supply unit 24 and the substrate PP held on the mounting table 232. The head unit 25 performs a component mounting operation of mounting a component on the substrate PP by moving between the component supply unit 24 and the substrate PP.

[0036] like Figure 4 As shown, the head unit 25 has a plurality of loading heads 251. Each loading head 251 has a suction nozzle 2511 mounted at the far end (lower end). The suction nozzle 2511 is a suction nozzle capable of sucking and holding the component supplied by the feeder 24F. The suction nozzle 2511 can be connected to one of the negative pressure generating device, the positive pressure generating device and the atmosphere via an electric switching valve. In other words, by supplying negative pressure to the suction nozzle 2511, the component can be sucked and held by the suction nozzle 2511, and thereafter, by supplying positive pressure, the suction and holding of the component is released. Each loading head 251 corresponds to each of the plurality of target loading positions set on the substrate PP and performs a component loading action of loading the component sucked and held by the suction nozzle 2511 onto the substrate PP.

[0037] Each mounting head 251 can be raised and lowered in the Z-axis direction (plumb direction) relative to the skeleton of the head unit 25, and can rotate around the head axis extending along the Z-axis direction. Each mounting head 251 can be raised and lowered along the Z-axis direction between a suckable position of the component that can be sucked and held by the suction nozzle 2511 and a retreat position located on the upper side relative to the suckable position. That is, when the suction nozzle 2511 sucks and holds the component, each mounting head 251 descends from the retreat position to the suckable position, and sucks and holds the component at the suckable position. On the other hand, each mounting head 251 after sucking and holding the component rises from the suckable position to the retreat position. Moreover, each mounting head 251 can be raised and lowered along the Z-axis direction between the suckable position and the retreat position, and the suckable position is a position that allows the component sucked and held by the suction nozzle 2511 to be mounted on the predetermined target mounting position on the substrate PP.

[0038] like Figure 2 and Figure 3 As shown, the mounting machine body 2 further includes a mounting camera 3. The mounting camera 3 performs an imaging operation of imaging a subject and acquires an image. The mounting camera 3 includes a first imaging unit 31, a second imaging unit 32, and a third imaging unit 33.

[0039] The first photographing unit 31 is disposed between the component supply unit 24 and the substrate conveying unit 23 on the main frame 21, and is a camera having an imaging device such as a CMOS (Complementary metal-oxide-semiconductor) or a CCD (Charged-coupled device). When each mounting head 251 performs the component mounting action, the first photographing unit 31 photographs the component held by the suction nozzle 2511 of each mounting head 251 from the lower side while the head unit 25 moves from the component supply unit 24 to the substrate PP held by the mounting table 232, so as to obtain a first component recognition image. The first component recognition image obtained by the first photographing unit 31 is input to the installation control unit 4 described later, and is referred to when the installation analysis unit 46 analyzes the adsorption position offset.

[0040] The second imaging unit 32 is disposed in the head unit 25 and is a camera having an imaging device such as a CMOS or a CCD. When each mounting head 251 performs the component mounting operation, the second imaging unit 32 images various marks attached to the upper surface of the substrate PP held by the mounting table 232 from the upper side in order to recognize the marks. By recognizing the marks on the substrate PP by the second imaging unit 32, the positional deviation of the substrate PP relative to the origin coordinates is detected.

[0041] The third imaging unit 33 is disposed in the head unit 25 and is a camera having an imaging device such as a CMOS or a CCD. When each mounting head 251 performs the component mounting operation and immediately before mounting a component on the substrate PP, the third imaging unit 33 captures the component held by the suction nozzle 2511 from the side to obtain a second component recognition image. The second component recognition image obtained by the third imaging unit 33 is used to detect the drop of the component from the suction nozzle 2511 before mounting the component on the substrate PP.

[0042] The mounting storage unit 40M stores the substrate data D20 referred to by the mounting control unit 4. The substrate data D20 is data composed of a plurality of parameters, which are necessary for the mounting control unit 4 to control the component mounting operation of the mounting machine main body 2. As information of the plurality of parameters, the substrate data D20 includes mounting machine information D21, stage information D22, head information D23, nozzle information D24, feeder information D25, component information D26, target suction position information DAP, and target mounting position information DPP.

[0043] The mounting machine information D21 is information recording parameters for determining the type of the mounting machine 1. The table information D22 is information recording parameters for determining the type of the mounting table 232. In the table information D22, parameters such as the number of the mounting table 232 are recorded as parameters for determining the type of the mounting table 232. The header information D23 is information recording parameters for determining the type of the mounting head 251. In the header information D23, parameters such as the number of the mounting head 251 are recorded as parameters for determining the type of the mounting head 251. The nozzle information D24 is information recording parameters for determining the type of the nozzle 2511. In the nozzle information D24, parameters such as the type of the nozzle 2511 and the identifier of the nozzle 2511 are recorded as parameters for determining the type of the nozzle 2511. The feeder information D25 is information recording parameters for determining the type of the feeder 24F. In the feeder information D25, as parameters for specifying the type of the feeder 24F, parameters such as the type of the feeder 24F and the installation position of the feeder 24F in the component supply unit 24 are recorded. The component information D26 is information in which parameters for specifying the type of the component mounted on the substrate PP are recorded. In the component information D26, as parameters for specifying the type of the component, parameters such as the component name indicating the type of the component, the outer dimensions of the component in the X-axis direction and the Y-axis direction, and the thickness of the component are recorded.

[0044] The target suction position information DAP is information that records the target suction position (target suction position) when the suction nozzle 2511 suctions the component as a parameter. In the target suction position information DAP, the coordinates of the target suction position of the component relative to the suction nozzle 2511 in the X-axis direction and the Y-axis direction are recorded as parameters. Usually, the target suction position is set at the center position of the suctioned surface of the component. The target loading position information DPP is information that records the target loading position of the component set on the substrate PP as a parameter. In the target loading position information DPP, the coordinates of the target loading position on the substrate PP in the X-axis direction and the Y-axis direction are recorded as parameters.

[0045] The installation control unit 4 is composed of a CPU (Central Processing Unit), a ROM (Read Only Memory) storing a control program, and a RAM (Random Access Memory) used as a work area of ​​the CPU. The installation control unit 4 controls the operation of each component of the installation machine body 2 and the data communication operation of the installation communication unit 40 by executing the control program stored in the ROM by the CPU, and also performs various calculations. The installation control unit 4 controls the operation of each component of the installation machine body 2 according to the substrate data D20 stored in the installation storage unit 40M. Figure 2 As shown, the mounting control unit 4 includes a communication control unit 41 , a substrate transport control unit 42 , a component supply control unit 43 , a head control unit 44 , an imaging control unit 45 , and a mounting analysis unit 46 as main functional components.

[0046] The communication control unit 41 controls the data communication between the mounting machine 1 and the management device 6 by controlling the mounting communication unit 40. The mounting communication unit 40 controlled based on the communication control unit 41 outputs each suction position offset data D1 acquired by the mounting analysis unit 46 described later, and the associated information D2 to the management device 6. The details of the suction position offset data D1 will be described later, but it is data acquired by the mounting analysis unit 46 according to each component mounting action performed by the mounting head 251, and is data about the suction position offset, which indicates the position offset of the actual suction position (actual suction position) where the suction nozzle 2511 sucks the component relative to the target suction position indicated by the target suction position information DAP.

[0047] The associated information D2 is composed of information of multiple parameters respectively associated with each adsorption position offset data D1. The information of multiple parameters is information contained in the substrate data D20 stored in the mounting storage unit 40M. The information of the multiple parameters constituting the associated information D2 includes the mounting machine information D21, the table information D22, the head information D23, and the nozzle information D24 as part of the substrate data D20. When the mounting head 251 possessed by the mounting machine 1 performs one component mounting action, one mounting table 232 among the multiple mounting tables 232 is used, one mounting head 251 among the multiple mounting heads 251 is used, and one suction nozzle 2511 among the multiple suction nozzles 2511 is used. That is, in each component mounting action performed by the mounting head 251, the mounting machine 1, the mounting table 232, the mounting head 251, and the suction nozzle 2511 used are uniquely determined. Therefore, the suction position offset data D1 obtained by the installation analysis unit 46 according to each component mounting action performed by the mounting head 251 and the parameters of the mounting machine information D21, table information D22, head information D23 and nozzle information D24 recorded in the associated information D2 are associated with each other.

[0048] The substrate transport control unit 42 controls the transport action of the substrate PP by the substrate transport unit 23 including the mounting table 232 according to the stage information D22 of the substrate data D20. The component supply control unit 43 controls the component supply action of each of the plurality of feeders 24F arranged in the component supply unit 24 according to the component information D26 and the feeder information D25 of the substrate data D20. The head control unit 44 controls the mounting head 251 by controlling the head unit 25 according to the component information D26, the head information D23, the suction nozzle information D24, the target suction position information DAP, and the target mounting position information DPP of the substrate data D20. Thus, the head control unit 44 causes the mounting head 251 to perform the component mounting action of mounting the component held by the suction nozzle 2511 on the substrate PP corresponding to each of the plurality of target mounting positions set on the substrate PP. The imaging control unit 45 controls the imaging action performed by the first imaging unit 31, the second imaging unit 32, and the third imaging unit 33 constituting the mounting imaging unit 3.

[0049] The installation analysis unit 46 analyzes the suction position offset indicating the position offset of the actual suction position of the suction nozzle 2511 for suctioning the component relative to the target suction position indicated by the target suction position information DAP, based on the first component recognition image acquired by the first imaging unit 31. Furthermore, the installation analysis unit 46 acquires suction position offset data D1 regarding the suction position offset for each component loading action performed by the loading head 251. Each suction position offset data D1 for each component loading action acquired by the installation analysis unit 46 is output to the management device 6 via the installation communication unit 40 in a state associated with the associated information D2.

[0050] The component mounting substrate PPS produced by the mounting machine 1 is transported to the inspection device 5 by the substrate transport unit 23. The inspection device 5 is a device for inspecting the component mounting substrate PPS. Figure 5 The inspection device 5 includes an inspection communication unit 51, an inspection imaging unit 52, and an inspection control unit 53.

[0051] The inspection communication unit 51 is an interface for data communication with the management device 6, and has a function as an inspection output unit that outputs various data and information to the management device 6. The inspection communication unit 51 outputs various inspection result data D3 acquired by the inspection analysis unit 533 described later to the management device 6. The inspection result data D3 will be described in detail later, but it includes each mounting position shift data D31, bridge occurrence data D32, etc. Each mounting position shift data D31 is data about the mounting position shift indicating the position shift of the actual mounting position (actual mounting position) of the component on the component mounting substrate PPS relative to the target mounting position indicated by the target mounting position information DPP. Like each suction position shift data D1 output from the mounting communication unit 40, each mounting position shift data D31 is associated with the associated information D2. The bridge occurrence data D32 is data indicating the occurrence of a short circuit phenomenon, that is, a bridge, between the lead terminals of a lead component having a plurality of lead terminals among the components mounted on the component mounting substrate PPS.

[0052] The inspection imaging unit 52 is a camera including an imaging device such as CMOS or CCD, etc. The inspection imaging unit 52 acquires an inspection image by imaging the component mounting substrate PPS conveyed from the mounting machine 1 from above.

[0053] The inspection control unit 53 is composed of a CPU, a ROM storing a control program, a RAM used as a work area of ​​the CPU, etc. The inspection control unit 53 controls the inspection communication unit 51 and the inspection imaging unit 52 by executing the control program stored in the ROM by the CPU, and performs various calculation processes. As the main functional components, the inspection control unit 53 includes a communication control unit 531, an imaging control unit 532, and an inspection analysis unit 533.

[0054] The communication control unit 531 controls the data communication between the inspection device 5 and the management device 6 by controlling the inspection communication unit 51. The imaging control unit 532 controls the imaging operation of the inspection imaging unit 52.

[0055] The inspection and analysis unit 533 analyzes various inspection items including the occurrence of mounting position shift and bridge for the components mounted at the actual mounting position on the component mounting substrate PPS based on the inspection image acquired by the inspection imaging unit 52. In addition, the inspection and analysis unit 533 acquires various inspection result data D3 indicating the analysis results of the various inspection items. For example, the inspection and analysis unit 533 analyzes the mounting position shift indicating the position shift of the actual mounting position of the components on the component mounting substrate PPS relative to each of the plurality of target mounting positions indicated by the target mounting position information DPP. In this case, the inspection and analysis unit 533 acquires mounting position shift data D31 regarding the mounting position shift for each of the plurality of target mounting positions set on the substrate PP. In addition, the inspection and analysis unit 533 analyzes the occurrence of bridge, which is a short circuit phenomenon between lead terminals, for the lead components mounted on the component mounting substrate PPS based on the inspection image. In this case, when it is determined that bridge has occurred, the inspection and analysis unit 533 acquires bridge occurrence data D32 indicating the occurrence of the bridge. The inspection result data D3 including the mounting position shift data D31 and the bridge occurrence data D32 acquired by the inspection analysis unit 533 is output to the management device 6 via the inspection communication unit 51 .

[0056] The management device 6 is connected to the mounting machine 1 and the inspection device 5 so as to be data communicable, and is constituted by, for example, a microcomputer. Each suction position deviation data D1 and the associated information D2 outputted from the mounting communication unit 40 of the mounting machine 1, and the inspection result data D3 including each mounting position deviation data D31 and the bridge occurrence data D32 outputted from the inspection communication unit 51 of the inspection device 5 are inputted to the management device 6. The management device 6 is a device for confirming the tendency of the suction position deviation based on each suction position deviation data D1 and the tendency of the mounting position deviation based on each mounting position deviation data D31. The confirmation of the tendency of each position deviation using the management device 6 is performed by an operator.

[0057] For the configuration of the management device 6, refer to Figure 6The management device 6 includes a management communication unit 61, a display unit 62, an operation unit 63, a storage unit 64, and a management control unit 65. The management control unit 65 includes a communication control unit 651, a mark generation unit 652, and a display control unit 653 as a functional structure.

[0058] The management communication unit 61 is an interface for data communication with the mounting machine 1 and the inspection device 5, and is input with each suction position offset data D1 and the associated information D2 from the mounting machine 1, and is input with the inspection result data D3 including each mounting position offset data D31 from the inspection device 5. The data communication between the mounting machine 1 and the inspection device 5 and the management device 6 by the management communication unit 61 is controlled by the communication control unit 651.

[0059] The storage unit 64 accumulates and stores the data and information input to the management device 6 via the management communication unit 61 , and associates each suction position deviation data D1 and the inspection result data D31 including each mounting position deviation data D31 with each of the information of a plurality of parameters constituting the association information D2 .

[0060] The display unit 62 is composed of, for example, a liquid crystal display, etc. The display unit 62 displays information for confirming the tendency of the suction position deviation based on each suction position deviation data D1 and information for confirming the tendency of the mounting position deviation based on each mounting position deviation data D31. The display operation of the display unit 62 is controlled by the display control unit 653.

[0061] The operation unit 63 is composed of a keyboard, a mouse, a touch screen, etc., and is a part that accepts input operations regarding the input of various commands performed by the operator. The operation unit 63 accepts input operations of various commands including the first position shift tendency display command C1, the inspection result display command C2, the second position shift tendency display command C3, and the third position shift tendency display command C4. The first position shift tendency display command C1 is a command for causing the display unit 62 to display the tendency of the suction position shift or the mounting position shift corresponding to the production of one component mounting substrate PPS in the mounting machine 1. The inspection result display command C2 is a command for causing the display unit 62 to display various inspection result data D3. The second position shift tendency display command C3 is a command for causing the display unit 62 to display the overall tendency of the suction position shift or the mounting position shift corresponding to the production of multiple component mounting substrates PPS using the same substrate PP in the mounting machine 1. The third position deviation tendency display command C4 is a command for causing the display unit 62 to display the overall tendency of suction position deviation or mounting position deviation corresponding to the production of multiple types of component mounting substrates PPS when producing multiple types of component mounting substrates PPS using different types of substrates PP in the mounting machine 1.

[0062] The mark generation unit 652 generates various marks corresponding to the commands received by the operation unit 63 and used for display on the display unit 62 based on the various data stored in the storage unit 64. For example, the mark generation unit 652 generates marks that visualize the tendency of the suction position deviation based on each suction position deviation data D1, and generates marks that visualize the tendency of the mounting position deviation based on each mounting position deviation data D31. In addition, the mark generation unit 652 generates marks that visualize various inspection result data D3.

[0063] Figure 7 1 is a diagram showing a display screen DS1 of the display unit 62 , and is a diagram showing a display state when an input operation of the first position deviation tendency display command C1 is accepted by the operation unit 63 . Figure 8 This is a diagram showing another example of the adsorption offset mark MA1 and the loading offset mark MA2 displayed on the display unit 62. When the operation unit 63 receives the input operation of the first position offset tendency display instruction C1, the mark generating unit 652 generates each adsorption offset mark MA1 that visualizes the direction and size of each adsorption position offset indicated by each adsorption position offset data D1 and each loading offset mark MA2 that visualizes the direction and size of each loading position offset indicated by each loading position offset data D31.

[0064] The shape of each adsorption offset mark MA1 is not particularly limited as long as it is a mark that visualizes the direction and size of each adsorption position offset. Similarly, the shape of each loading offset mark MA2 is not particularly limited as long as it is a mark that visualizes the direction and size of each loading position offset. Figure 7 As shown, each adsorption offset mark MA1 and each loading offset mark MA2 can be represented by an arrow. In this case, the direction of the adsorption position offset and the loading position offset is represented by the direction of the arrow, and the magnitude of the adsorption position offset and the loading position offset is represented by the length of the arrow. In addition, the length of the arrow increases as the adsorption position offset and the loading position offset increase. In addition, Figure 8 In the example shown, each adsorption offset mark MA1 and each loading offset mark MA2 can be represented by a line group drawn inward in a double or triple manner as a plurality of lines represented by a circle or an ellipse. In this case, the direction of the adsorption position offset and the loading position offset is represented by the position of the most densely packed portion of the plurality of lines constituting the line group relative to the center of the mark, and the size of the adsorption position offset and the loading position offset is represented by the overall extension of the line group (the overall size of the marks MA1 and MA2). In addition, as the adsorption position offset and the loading position offset increase, the overall extension of the line group increases, and the adsorption offset mark MA1 and the loading offset mark MA2 become larger.

[0065] After the mark generation unit 652 generates each suction offset mark MA1 and each loading offset mark MA2, the display control unit 653 causes the display screen DS1 of the display unit 62 to display the substrate pattern GP corresponding to the substrate PP. Figure 7 As shown, the display control unit 653 can control the display unit 62 in such a manner that the component pattern PA corresponding to the component is displayed on the substrate pattern GP. Furthermore, the display control unit 653 controls the display unit 62 in such a manner that each suction offset mark MA1 or each loading offset mark MA2 is displayed on the substrate pattern GP at each mark providing position MP corresponding to each of the plurality of target loading positions set on the substrate PP.

[0066] Each suction offset mark MA1 and each loading offset mark MA2 are marks for visualizing the direction and size of the position offset. Therefore, the operator can easily confirm the tendency of the loading position offset of the entire substrate PP or the tendency of the suction position offset that may become the cause of the loading position offset based on the marks MA1 and MA2 displayed on the display unit 62.

[0067] As described above, each adsorption position offset data D1 and each mounting position offset data D31 are associated with each of the plurality of parameters recorded in the mounting machine information D21, the table information D22, the head information D23, and the nozzle information D24 constituting the associated information D2. Each adsorption offset mark MA1 is a mark for visualizing the tendency of each adsorption position offset shown by each adsorption position offset data D1, and each mounting offset mark MA2 is a mark for visualizing the tendency of each mounting position offset shown by each mounting position offset data D31. Therefore, each adsorption offset mark MA1 and each mounting offset mark MA2 become marks associated with the information of the plurality of parameters constituting the associated information D2.

[0068] like Figures 9 to 12 As shown, the display control unit 653 can control the display unit 62 in the following manner, focusing on the specific parameter selected from the multiple parameters constituting the associated information D2: each adsorption offset mark MA1 or each loading offset mark MA2 is displayed on the substrate graphic GP in a different display form according to the category of the specific parameter corresponding to each mark. The selection of the specific parameter is performed by the input operation performed by the operator on the operation unit 63. The multiple parameters constituting the associated information D2 are parameters associated with each adsorption position offset data D1 and each loading position offset data D31, and therefore, they may become the cause of the adsorption position offset and the loading position offset. Therefore, by confirming each adsorption offset mark MA1 or each loading offset mark MA2 with a different display form for each category of the specific parameter, the operator can easily confirm the tendency of the loading position offset and the tendency of the adsorption position offset according to the category of the specific parameter while paying attention to the category of the specific parameter that becomes the cause of the position offset.

[0069] exist Fig. 9 , there is shown a display example of the display unit 62 when the parameter for specifying the type of the mounting machine 1 recorded in the mounting machine information D21 constituting the associated information D2 is selected as a specific parameter. In this case, in the display screen DS1 of the display unit 62, each suction offset mark MA1 or each mounting offset mark MA2 is displayed on the substrate graphic GP in a display form different for each type of the mounting machine 1. For example, the display control unit 653 controls the display unit 62 so that the display color of the suction offset mark MA1 or the mounting offset mark MA2 corresponding to the type M1 as the type of the mounting machine 1 is different from the display color of the suction offset mark MA1 or the mounting offset mark MA2 corresponding to the type M2 as the type of the mounting machine 1.

[0070] exist Fig.10 , there is shown a display example of the display unit 62 when the parameter for specifying the type of the mounting stage 232 recorded in the stage information D22 constituting the associated information D2 is selected as a specific parameter. In this case, in the display screen DS1 of the display unit 62, each adsorption offset mark MA1 or each mounting offset mark MA2 is displayed on the substrate graphic GP in a display form different for each type of the mounting stage 232. For example, the display control unit 653 controls the display unit 62 so that the display color of the adsorption offset mark MA1 or the mounting offset mark MA2 corresponding to the type S1 as the type of the mounting stage 232 is different from the display color of the adsorption offset mark MA1 or the mounting offset mark MA2 corresponding to the type S2 as the type of the mounting stage 232.

[0071] exist Fig.11 , there is shown a display example of the display unit 62 when the parameter for determining the type of the mounting head 251 recorded in the head information D23 constituting the associated information D2 is selected as a specific parameter. In this case, in the display screen DS1 of the display unit 62, each suction offset mark MA1 or each mounting offset mark MA2 is displayed on the substrate graphic GP in a display form different for each type of the mounting head 251. For example, the display control unit 653 controls the display unit 62 so that the display color of the suction offset mark MA1 or the mounting offset mark MA2 corresponding to the type H1 as the type of the mounting head 251 is different from the display color of the suction offset mark MA1 or the mounting offset mark MA2 corresponding to the type H2 as the type of the mounting head 251.

[0072] exist Fig.12, there is shown a display example of the display unit 62 when the parameter for determining the category of the suction nozzle 2511 recorded in the suction nozzle information D24 constituting the associated information D2 is selected as a specific parameter. In this case, in the display screen DS1 of the display unit 62, each suction offset mark MA1 or each loading offset mark MA2 is displayed on the substrate graphic GP in a display form that is different according to the category of the suction nozzle 2511. For example, the display control unit 653 controls the display unit 62 so that the display color of the suction offset mark MA1 or the loading offset mark MA2 corresponding to the category N1 as the category of the suction nozzle 2511 is different from the display color of the suction offset mark MA1 or the loading offset mark MA2 corresponding to the category N2 as the category of the suction nozzle 2511.

[0073] Sometimes, the frequency of occurrence of suction position offset and mounting position offset varies depending on the type of the mounting machine 1. In addition, the degree of inclination of the mounting table 232 and the like will affect the mounting position offset. In addition, the action characteristics of the suction nozzle 2511 and the mounting head 251 and the like will affect the suction position offset and the mounting position offset. That is, based on the respective types of the mounting machine 1, the mounting table 232, the mounting head 251 and the suction nozzle 2511, it is possible that the suction position offset or the mounting position offset may be caused. By displaying each suction offset mark MA1 or each mounting offset mark MA2 on the display unit 62 in such a display form that is different according to the type of the mounting machine 1, the mounting table 232, the mounting head 251 and the suction nozzle 2511, the operator can easily confirm the tendency of the mounting position offset and the tendency of the suction position offset. By confirming such a position offset tendency, the operator can take appropriate measures to eliminate the defects of the suction position offset and the mounting position offset. For example, as a countermeasure to solve the problem of suction position deviation and mounting position deviation, the operator performs an operation of adjusting the operation of the suction nozzle 2511 and the mounting head 251 .

[0074] Fig.13 6 is a diagram showing a display screen DS2 of the display unit 62, and is a diagram showing a display state when the input operation of the inspection result display instruction C2 is accepted by the operation unit 63. When the input operation of the inspection result display instruction C2 is accepted by the operation unit 63, the mark generation unit 652 generates the first inspection result mark MI1, the second inspection result mark MI2, etc., which visualize the various inspection result data D3 acquired by the inspection analysis unit 533. The first inspection result mark MI1 is a mark for visualizing the mounting position deviation data D31 included in the inspection result data D3, and is represented by, for example, a circular graphic of a specific color. The second inspection result mark MI2 is a mark for visualizing the bridge occurrence data D32 included in the inspection result data D3, and is represented by, for example, a circular graphic that is larger than the first inspection result mark MI1 and has a different color.

[0075] After the mark generation unit 652 generates the first inspection result mark MI1, the second inspection result mark MI2, etc., the display control unit 653 controls the display unit 62 so that the first inspection result mark MI1, the second inspection result mark MI2, etc. are displayed at the respective mark assignment positions MP on the substrate pattern GP. The operator can easily confirm the inspection results of various inspection items based on the respective inspection result marks such as the first inspection result mark MI1, the second inspection result mark MI2, etc. displayed on the display unit 62.

[0076] Fig.14 1 is a diagram showing a display screen DS3 of the display unit 62, and is a diagram showing a display state when the input operation of the second position shift tendency display instruction C3 is accepted by the operation unit 63. When the input operation of the second position shift tendency display instruction C3 is accepted by the operation unit 63, the mark generation unit 652 generates a plurality of groups of adsorption shift marks MA1 according to the production quantity of the component mounting substrate PPS using a plurality of substrates PP of the same type. Moreover, the mark generation unit 652 generates a plurality of three-dimensional adsorption shift marks MS1 composed of a three-dimensional graphic display based on the plurality of groups of adsorption shift marks MA1, and the three-dimensional graphic display visualizes the frequency of the adsorption position shift as a three-dimensional height in addition to the direction and size of the adsorption position shift. In addition, the mark generation unit 652 generates a plurality of groups of mounting shift marks MA2 according to the production quantity of the component mounting substrate PPS using a plurality of substrates PP of the same type. Furthermore, the mark generating unit 652 generates three-dimensional mounting offset marks MS2 composed of three-dimensional graphic displays that visualize the direction and magnitude of the mounting position offset and the frequency of the mounting position offset as three-dimensional height based on the plurality of sets of mounting offset marks MA2.

[0077] exist Fig.14 In the example shown, the tag generation unit 652 generates the above-mentioned Figure 8 The marks represented by the line groups composed of the combination of the multiple lines shown are used as multiple groups of suction offset marks MA1 and loading offset marks MA2, and based on the above marks, three-dimensional suction offset marks MS1 and three-dimensional loading offset marks MS2 represented by three-dimensional graphics are generated. In this case, the direction of the suction position offset and loading position offset of the same type of multiple substrates PP as a whole is represented by the position of the most dense part of the multiple lines constituting the line group relative to the center of the mark, the size of the suction position offset and the loading position offset is represented by the size of the plane of the three-dimensional suction offset mark MS1 and the three-dimensional loading offset mark MS2, and the frequency of the suction position offset and the loading position offset is represented by the height of the three-dimensional suction offset mark MS1 and the three-dimensional loading offset mark MS2.

[0078] After the mark generation unit 652 generates each three-dimensional adsorption offset mark MS1 and each three-dimensional mounting offset mark MS2, the display control unit 653 causes the display screen DS3 of the display unit 62 to display the substrate graphic GP as a three-dimensional graphic corresponding to the substrate PP. Furthermore, the display control unit 653 controls the display unit 62 so that each three-dimensional adsorption offset mark MS1 or each three-dimensional mounting offset mark MS2 is displayed at each mark providing position MP on the substrate graphic GP.

[0079] Each three-dimensional suction displacement mark MS1 and each three-dimensional mounting displacement mark MS2 visualizes the direction and size of each position displacement as well as the frequency of position displacement. Therefore, when producing a plurality of component mounting substrates PPS of the same type, the operator can easily confirm the tendency of mounting position displacement or suction position displacement of the same plurality of substrates PP as a whole based on each three-dimensional suction displacement mark MS1 or each three-dimensional mounting displacement mark MS2 displayed on the display unit 62.

[0080] Fig.15 1 is a diagram showing a display screen DS4 of the display unit 62, and is a diagram showing a display state when the input operation of the third position deviation tendency display command C4 is accepted by the operation unit 63. When the input operation of the third position deviation tendency display command C4 is accepted by the operation unit 63, the mark generating unit 652 generates each suction deviation mark MA1 and each mounting deviation mark MA2 for each production unit of a plurality of component mounting substrates PPS using different types of substrates PP.

[0081] After the mark generation unit 652 generates each suction offset mark MA1 and each loading offset mark MA2 of each production unit of the plurality of component mounting substrates PPS, the display control unit 653 causes the display screen DS4 of the display unit 62 to display the stage graphics GS corresponding to the mounting stages 232 that respectively hold the different types of substrates PP. Furthermore, the display control unit 653 controls the display unit 62 to display each suction offset mark MA1 or each loading offset mark MA2 of each production unit of the plurality of component mounting substrates PPS at each stage mark providing position MSP corresponding to each of the plurality of target mounting positions set on each of the different types of substrates PP on the stage graphics GS.

[0082] The operator can easily check the tendency of the mounting position deviation or the tendency of the suction position deviation corresponding to the mounting stage 232 used when producing a plurality of component mounting substrates PPS, based on each suction deviation mark MA1 or each mounting deviation mark MA2 displayed on the display unit 62. The operator can grasp the degree of inclination of the mounting stage 232 by checking each suction deviation mark MA1 or each mounting deviation mark MA2 on the stage graphic GS. Thus, the operator can adjust the degree of inclination of the mounting stage 232 as a countermeasure to eliminate the defect of the mounting position deviation.

[0083] The above-mentioned specific implementation manner mainly includes the invention with the following technical solutions.

[0084] The component mounting system according to one aspect of the present invention includes: a mounting machine that produces a component mounting substrate on which components are mounted; an inspection device that inspects the component mounting substrate; and a management device that is connected to the mounting machine and the inspection device in a data-communicative manner. In the component mounting system, the mounting machine includes: a mounting table that holds the substrate; a mounting head that has a suction nozzle that can adsorb and hold the component, and performs a component mounting action of mounting the component adsorbed and held by the suction nozzle onto the substrate on the mounting table corresponding to each of a plurality of target mounting positions set on the substrate; a mounting analysis unit that analyzes an adsorption position offset that indicates a position offset of an actual adsorption position of the component adsorbed by the suction nozzle relative to a target adsorption position, and obtains adsorption position offset data about the adsorption position offset according to the component mounting action performed by the mounting head; and a mounting output unit that outputs each of the adsorption position offset data for each of the component mounting actions. The inspection device includes: an inspection analysis unit that analyzes the mounting position offsets indicating the position offsets of the actual mounting positions of the components on the component mounting substrate obtained based on the component mounting action of the mounting head relative to each of the plurality of target mounting positions, and obtains mounting position offset data about the mounting position offsets; and an inspection output unit that outputs each of the mounting position offset data. The management device includes: a mark generation unit that generates each suction offset mark that visualizes the direction and size of each suction position offset indicated by each of the suction position offset data and each mounting offset mark that visualizes the direction and size of each of the mounting position offset indicated by each of the mounting position offset data; and a display unit that displays a substrate graphic corresponding to the substrate, and displays each of the suction offset marks or each of the mounting offset marks at each of the mark assignment positions corresponding to each of the plurality of target mounting positions on the substrate graphic.

[0085] According to the component mounting system, the mounting machine and the inspection device are connected to the management device in data communication. In the mounting machine, the mounting analysis unit obtains adsorption position offset data about the adsorption position offset of the component adsorbed by the suction nozzle according to the component mounting action performed by the mounting head. Each adsorption position offset data is output from the mounting output unit to the management device. In the inspection device, the inspection analysis unit obtains the mounting position offset data about the mounting position offset of the component on the component mounting substrate corresponding to each of the multiple target mounting positions set on the substrate. Each mounting position offset data is output from the inspection output unit to the management device. In the management device, the mark generation unit generates each adsorption offset mark that visualizes the direction and size of each adsorption position offset shown by each adsorption position offset data and each mounting offset mark that visualizes the direction and size of each mounting position offset shown by each mounting position offset data. Moreover, the display unit of the management device displays each adsorption offset mark or each mounting offset mark at each mark assignment position corresponding to each of the multiple target mounting positions on the substrate graphic corresponding to the substrate.

[0086] Each suction offset mark and each loading offset mark are marks that visualize the direction and size of the position offset. Therefore, the operator can easily confirm the tendency of the loading position offset of the entire substrate or the tendency of the suction position offset that may be the cause of the loading position offset based on each mark displayed on the display unit. By confirming such a position offset tendency, the operator can take appropriate measures to eliminate the defects of the suction position offset and the loading position offset.

[0087] In the above-mentioned component mounting system, the mounting output unit may be configured to output association information composed of information of a plurality of parameters, wherein the plurality of parameters are respectively associated with each of the adsorption position offset data and each of the mounting position offset data. Furthermore, the display unit focuses on a specific parameter selected from the plurality of parameters and displays each of the adsorption offset marks or each of the mounting offset marks on the substrate pattern in a display form different according to the type of the specific parameter corresponding to each mark.

[0088] In this scheme, the display unit focuses on a specific parameter selected from a plurality of parameters constituting the associated information, and displays each adsorption shift mark or each loading shift mark in a display form different from the type of the specific parameter corresponding to each mark. The plurality of parameters constituting the associated information are parameters associated with each adsorption position shift data and each loading position shift data, and thus may be the cause of the adsorption position shift and the loading position shift. Therefore, the operator can easily confirm the tendency of the loading position shift and the tendency of the adsorption position shift according to the type of the specific parameter while looking at the type of the specific parameter that is the cause of the position shift.

[0089] In the above-mentioned component mounting system, the information of the multiple parameters may include mounting machine information recording parameters for determining the type of the mounting machine, table information recording parameters for determining the type of the mounting table, head information recording parameters for determining the type of the mounting head, and nozzle information recording parameters for determining the type of the nozzle.

[0090] Sometimes, the following situation occurs: the frequency of occurrence of adsorption position offset and loading position offset varies according to the type of mounting machine. In addition, the degree of inclination of the mounting table and the like will affect the loading position offset. In addition, the motion characteristics of the suction nozzle and the loading head and the like will affect the adsorption position offset and the loading position offset. That is, based on the respective types of the mounting machine, the mounting table, the loading head and the suction nozzle, it may become the cause of the adsorption position offset or the loading position offset. By displaying each adsorption offset mark or each loading offset mark on the display unit in such a display form that varies according to the type of the mounting machine, the mounting table, the loading head and the suction nozzle, the operator can easily confirm the tendency of the loading position offset and the tendency of the adsorption position offset.

[0091] In the above-mentioned component mounting system, the management device may further include: an operation unit for accepting input operations of various instructions. Furthermore, the inspection and analysis unit analyzes the component mounted at the actual mounting position on the component mounting substrate with respect to various inspection items including the mounting position offset to obtain various inspection result data including the mounting position offset data, and when the operation unit accepts input operations of display instructions for displaying the various inspection result data, the mark generation unit generates inspection result marks for visualizing the various inspection result data, and the display unit displays the inspection result marks at the positions assigned to the marks on the substrate graphic.

[0092] In this scheme, when the operation unit receives an input operation of a display instruction for instructing the display of various inspection result data, the display unit displays an inspection result mark for visualizing the inspection result data at each mark-added position on the substrate graphic. The operator can easily confirm the inspection results of various inspection items based on each inspection result mark displayed on the display unit.

[0093] In the above-mentioned component mounting system, the management device may further include: an operation unit for accepting input operations of various commands. Furthermore, when the mounting machine produces a plurality of component mounting substrates using the same substrate, and when the operation unit accepts input operations of a command for displaying the suction position offset or the tendency of the mounting position offset corresponding to the production of the plurality of component mounting substrates, the mark generation unit generates a plurality of sets of suction offset marks according to the production quantity of the component mounting substrates, and then generates three-dimensional suction offset marks composed of three-dimensional graphic displays based on the plurality of sets of suction offset marks, the three-dimensional graphic displays not only visualize the direction and size of the suction position offset but also visualize the frequency of the suction position offset as a three-dimensional height, and the mark generation unit generates a plurality of sets of mounting offset marks according to the production quantity of the component mounting substrate, and then generates three-dimensional mounting offset marks composed of three-dimensional graphic displays based on the plurality of sets of mounting offset marks, the three-dimensional graphic displays not only visualize the direction and size of the mounting position offset but also visualize the frequency of the mounting position offset as a three-dimensional height. The display unit displays the three-dimensional adsorption displacement marks or the three-dimensional mounting displacement marks at the mark providing positions on the substrate pattern.

[0094] In this scheme, when the operation unit receives an input operation of a display instruction to display the tendency of the suction position shift or the mounting position shift corresponding to the production of multiple component mounting substrates of the same type, the display unit displays each three-dimensional suction shift mark or each three-dimensional mounting shift mark on each mark-assigned position on the substrate graphic. Each three-dimensional suction shift mark and each three-dimensional mounting shift mark not only visualizes the direction and size of each position shift but also visualizes the frequency of position shift. Therefore, the operator can easily confirm the tendency of the mounting position shift or the tendency of the suction position shift of the entire multiple substrates of the same type when producing multiple component mounting substrates of the same type based on each three-dimensional suction shift mark or each three-dimensional mounting shift mark displayed on the display unit.

[0095] In the above-mentioned component mounting system, the management device may further include: an operation unit that receives input operations of various instructions. Furthermore, when the mounting machine performs production of a plurality of component mounting substrates using different types of substrates, and when the operation unit receives input operations of a command to display the suction position offset or the tendency of the mounting position offset corresponding to the production of the plurality of component mounting substrates, the mark generation unit generates the suction offset marks and the mounting offset marks according to the production units of the plurality of component mounting substrates. The display unit displays stage graphics corresponding to the mounting stages that respectively hold the different types of substrates, and displays the suction offset marks or the mounting offset marks of each production unit at the stage mark assignment positions on the stage graphics that respectively correspond to the plurality of target mounting positions set on each of the different types of substrates.

[0096] In this embodiment, when the operation unit receives an input operation of a display command for displaying the tendency of suction position deviation or mounting position deviation corresponding to the production of a plurality of component mounting substrates, the display unit displays each suction deviation mark or each mounting deviation mark for each production unit of the plurality of component mounting substrates at each stage mark assignment position on the stage graphic corresponding to the mounting stage for holding the different types of substrates. The operator can easily confirm the tendency of mounting position deviation or suction position deviation corresponding to the mounting stage used when producing a plurality of component mounting substrates based on each suction deviation mark or each mounting deviation mark displayed on the display unit.

[0097] As described above, according to the present invention, it is possible to provide a component mounting system capable of checking the tendency of the suction position deviation or the mounting position deviation of the entire substrate.

[0098] Explanation of symbols

[0099] 1 Install the machine

[0100] 2 Install the machine body

[0101] 23 Board transport section

[0102] 232 Carrying platform

[0103] 25 Head Unit

[0104] 251 Head

[0105] 2511 Nozzle

[0106] 4 Install the control unit

[0107] 40 Install the communication unit (install the output unit)

[0108] 46 Installation Analysis Department

[0109] 5 Inspection device

[0110] 51 Check the communication unit (check the output unit)

[0111] 53 Inspection and Control Department

[0112] 533 Inspection and Analysis Department

[0113] 6 Management Device

[0114] 61 Management Communications Department

[0115] 62 Display

[0116] 63 Operation Department

[0117] 64 Storage

[0118] 65 Management Control Department

[0119] 651 Communication Control Department

[0120] 652 Mark Generation Department

[0121] 653 Display Control Unit

[0122] 100 Component Mounting System

[0123] D1 Adsorption position offset data

[0124] D2 Related Information

[0125] D21 Installation Machine Information

[0126] D22 station information

[0127] D23 Header Information

[0128] D24 nozzle information

[0129] D3 Inspection result data

[0130] D31 carries position offset data

[0131] D32 bridge generation data

[0132] GP Board Graphics

[0133] GS Graphics

[0134] MA1 Snap Offset Marker

[0135] MA2 with offset markers

[0136] MI1 First test result mark

[0137] MI2 Second test result mark

[0138] MS1 stereo-adsorption shift labeling

[0139] MS2 Stereo Mounted Offset Marker

Claims

1. A component mounting system, characterized in that include: Mounting machines that produce component mounting substrates on which components are mounted; An inspection device for inspecting the component mounting substrate; as well as, A management device is connected to the installation machine and the inspection device for data communication; wherein, The installation machine comprises: A mounting table for holding the substrate; a loading head having a nozzle capable of sucking and holding the component, and performing a component loading operation of loading the component sucked and held by the nozzle onto the substrate on the loading stage corresponding to each of a plurality of target loading positions set on the substrate; An installation analysis unit analyzes a suction position offset indicating a position offset of an actual suction position of the component sucked by the suction nozzle relative to a target suction position, and obtains suction position offset data regarding the suction position offset according to the component loading action performed by the loading head; and An output unit is provided to output each of the suction position deviation data for each of the component mounting actions, The inspection device comprises: an inspection and analysis unit that analyzes mounting position shifts indicating position shifts of actual mounting positions of the component on the component mounting substrate relative to each of the plurality of target mounting positions, obtained based on the component mounting action of the mounting head, and acquires mounting position shift data regarding the mounting position shifts; and The inspection output unit outputs the above-mentioned mounting position deviation data, The management device comprises: a mark generating unit for generating each adsorption offset mark for visualizing the direction and magnitude of each adsorption position offset indicated by each adsorption position offset data and each mounting offset mark for visualizing the direction and magnitude of each mounting position offset indicated by each mounting position offset data; and a display unit that displays a substrate pattern corresponding to the substrate, and displays the adsorption offset marks or the mounting offset marks at mark-giving positions corresponding to the plurality of target mounting positions on the substrate pattern, The mounting output unit outputs association information composed of information of a plurality of parameters, wherein the plurality of parameters are respectively associated with each of the suction position offset data and each of the mounting position offset data. The display unit focuses on a specific parameter selected from the plurality of parameters and displays the suction offset marks or the mounting offset marks on the substrate pattern in a display form that differs according to the type of the specific parameter corresponding to each mark.

2. The component mounting system according to claim 1, characterized in that: The information of the multiple parameters includes installation machine information recording parameters for determining the type of the installation machine, table information recording parameters for determining the type of the mounting table, head information recording parameters for determining the type of the mounting head, and nozzle information recording parameters for determining the type of the nozzle.

3. A component mounting system, characterized in that include: Mounting machines that produce component mounting substrates on which components are mounted; An inspection device for inspecting the component mounting substrate; as well as, A management device is connected to the installation machine and the inspection device for data communication; wherein, The installation machine comprises: A mounting table for holding the substrate; a loading head having a nozzle capable of sucking and holding the component, and performing a component loading operation of loading the component sucked and held by the nozzle onto the substrate on the loading stage corresponding to each of a plurality of target loading positions set on the substrate; An installation analysis unit analyzes a suction position offset indicating a position offset of an actual suction position of the component sucked by the suction nozzle relative to a target suction position, and obtains suction position offset data regarding the suction position offset according to the component loading action performed by the loading head; and An output unit is provided to output each of the suction position deviation data for each of the component mounting actions, The inspection device comprises: an inspection and analysis unit that analyzes mounting position shifts indicating position shifts of actual mounting positions of the component on the component mounting substrate relative to each of the plurality of target mounting positions, obtained based on the component mounting action of the mounting head, and acquires mounting position shift data regarding the mounting position shifts; and The inspection output unit outputs the above-mentioned mounting position deviation data, The management device comprises: a mark generating unit for generating each adsorption offset mark for visualizing the direction and magnitude of each adsorption position offset indicated by each adsorption position offset data and each mounting offset mark for visualizing the direction and magnitude of each mounting position offset indicated by each mounting position offset data; a display unit that displays a substrate pattern corresponding to the substrate, and displays the adsorption offset marks or the mounting offset marks at mark-giving positions corresponding to the plurality of target mounting positions on the substrate pattern; and The operation unit accepts input operations of various instructions. The inspection and analysis unit analyzes the component mounted at the actual mounting position on the component mounting substrate with respect to various inspection items including the mounting position shift to obtain various inspection result data including the mounting position shift data. When the operation unit receives an input operation of a display instruction to display the various inspection result data, The mark generating unit generates an inspection result mark for visualizing the various inspection result data. The display unit displays the inspection result mark at each mark-assigning position on the substrate pattern.

4. A component mounting system, characterized in that include: Mounting machines that produce component mounting substrates on which components are mounted; An inspection device for inspecting the component mounting substrate; as well as, A management device is connected to the installation machine and the inspection device for data communication; wherein, The installation machine comprises: A mounting table for holding the substrate; a loading head having a nozzle capable of sucking and holding the component, and performing a component loading operation of loading the component sucked and held by the nozzle onto the substrate on the loading stage corresponding to each of a plurality of target loading positions set on the substrate; An installation analysis unit analyzes a suction position offset indicating a position offset of an actual suction position of the component sucked by the suction nozzle relative to a target suction position, and obtains suction position offset data regarding the suction position offset according to the component loading action performed by the loading head; and An output unit is provided to output each of the suction position deviation data for each of the component mounting actions, The inspection device comprises: an inspection and analysis unit that analyzes mounting position shifts indicating position shifts of actual mounting positions of the component on the component mounting substrate relative to each of the plurality of target mounting positions, obtained based on the component mounting action of the mounting head, and acquires mounting position shift data regarding the mounting position shifts; and The inspection output unit outputs the above-mentioned mounting position deviation data, The management device comprises: a mark generating unit for generating each adsorption offset mark for visualizing the direction and magnitude of each adsorption position offset indicated by each adsorption position offset data and each mounting offset mark for visualizing the direction and magnitude of each mounting position offset indicated by each mounting position offset data; a display unit that displays a substrate pattern corresponding to the substrate, and displays the adsorption offset marks or the mounting offset marks at mark-giving positions corresponding to the plurality of target mounting positions on the substrate pattern; and The operation unit accepts input operations of various instructions. When the mounting machine produces a plurality of the component mounting substrates using the same type of the substrate, and when the operating unit receives an input operation of a display instruction for displaying the tendency of the adsorption position deviation or the mounting position deviation corresponding to the production of the plurality of component mounting substrates, After generating a plurality of groups of the adsorption offset marks according to the production quantity of the component mounting substrate, the mark generating unit generates three-dimensional adsorption offset marks composed of a three-dimensional graphic display based on the plurality of groups of the adsorption offset marks. The three-dimensional graphic display not only visualizes the direction and size of the adsorption position offset but also visualizes the frequency of the adsorption position offset as a three-dimensional height, and, After generating a plurality of sets of the mounting offset marks according to the production quantity of the component mounting substrate, the mark generating unit generates three-dimensional mounting offset marks composed of three-dimensional graphic displays based on the plurality of sets of the mounting offset marks. The three-dimensional graphic displays visualize the frequency of the mounting position offset as a three-dimensional height in addition to visualizing the direction and size of the mounting position offset. The display unit displays the three-dimensional adsorption displacement marks or the three-dimensional mounting displacement marks at the mark providing positions on the substrate pattern.

5. A component mounting system, characterized in that include: Mounting machines that produce component mounting substrates on which components are mounted; An inspection device for inspecting the component mounting substrate; as well as, A management device is connected to the installation machine and the inspection device for data communication; wherein, The installation machine comprises: A mounting table for holding the substrate; a loading head having a nozzle capable of sucking and holding the component, and performing a component loading operation of loading the component sucked and held by the nozzle onto the substrate on the loading stage corresponding to each of a plurality of target loading positions set on the substrate; An installation analysis unit analyzes a suction position offset indicating a position offset of an actual suction position of the component sucked by the suction nozzle relative to a target suction position, and obtains suction position offset data regarding the suction position offset according to the component loading action performed by the loading head; and An output unit is provided to output each of the suction position deviation data for each of the component mounting actions, The inspection device comprises: an inspection and analysis unit that analyzes mounting position shifts indicating position shifts of actual mounting positions of the component on the component mounting substrate relative to each of the plurality of target mounting positions, obtained based on the component mounting action of the mounting head, and acquires mounting position shift data regarding the mounting position shifts; and The inspection output unit outputs the above-mentioned mounting position deviation data, The management device comprises: a mark generating unit for generating each adsorption offset mark for visualizing the direction and magnitude of each adsorption position offset indicated by each adsorption position offset data and each mounting offset mark for visualizing the direction and magnitude of each mounting position offset indicated by each mounting position offset data; a display unit that displays a substrate pattern corresponding to the substrate, and displays the adsorption offset marks or the mounting offset marks at mark-giving positions corresponding to the plurality of target mounting positions on the substrate pattern; and The operation unit accepts input operations of various instructions. When the mounting machine produces a plurality of component mounting substrates using different types of substrates, and when the operating unit receives an input operation of a display instruction for displaying the tendency of the adsorption position deviation or the mounting position deviation corresponding to the production of the plurality of component mounting substrates, The mark generating unit generates the suction displacement marks and the mounting displacement marks for each production unit of the plurality of component mounting substrates, The display unit displays a stage graphic corresponding to the mounting stages for respectively holding the different types of substrates, and displays the adsorption offset marks or the mounting offset marks of each of the production units at the respective stage mark assignment positions on the stage graphic corresponding to the multiple target mounting positions set on each of the different types of substrates.

Images