3D printing processing method, system, device and storage medium

Abstract

The application relates to a 3D printing processing method, system, device and storage medium. The 3D printing processing method comprises the following steps: obtaining a preset substrate section and a preset entity section of a sample to be printed; the preset substrate section comprises a plurality of first preset slice layers, the preset entity section comprises a plurality of second preset slice layers, and the preset entity section is adjacent to the preset substrate section; a first process parameter for solidifying the first preset slice layers is determined, and a second process parameter for solidifying the second preset slice layers is determined; the first preset slice layers are solidified according to the first process parameter to obtain first slice layers; the substrate section is obtained by accumulating the plurality of first slice layers; the second preset slice layers are solidified according to the second process parameter to obtain second slice layers; and the entity section is obtained by accumulating the plurality of second slice layers. The application can solve the technical problem that the solidified layers are not firmly bonded and are prone to breaking at the initial stage of sample model printing, and the finally printed sample is continuous and meets the accuracy requirement.

Description

Technical Field

[0001] This application relates to the field of 3D printing technology, and in particular to 3D printing processing methods, systems, devices and storage media. Background Technology

[0002] With the development of 3D printing technology, photopolymer 3D printing technology has received widespread attention and is being applied in fields such as dentistry. 3D printing is a technology that constructs objects by printing layer by layer based on digital model files. Among them, bottom projection-based 3D printing equipment can effectively improve printing accuracy by using projection exposure to solidify the photopolymer material across the entire cross-section of the object within the same exposure time.

[0003] Traditional 3D printing equipment prints directly from the input sample model, which leads to instability in the initial printing state of the sample model and poor adhesion between adjacent cured layers, making them prone to breakage. Summary of the Invention

[0004] Therefore, it is necessary to provide a 3D printing processing method, system, device, and storage medium to address the aforementioned technical problems.

[0005] In a first aspect, this application provides a 3D printing processing method, the method comprising:

[0006] Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment;

[0007] Determine the first process parameters for curing the first preset slice layer, and determine the second process parameters for curing the second preset slice layer;

[0008] A first preset slice layer is cured according to the first process parameters to obtain a first slice layer; multiple first slice layers are accumulated to obtain a substrate segment;

[0009] The second preset slice layer is cured according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment.

[0010] In one embodiment, before the first preset slice layer is cured according to the first process parameters to obtain the first slice layer, and multiple first slice layers are accumulated to obtain a substrate segment, the method further includes: performing image bias on the first preset slice layer so that the image outline of the first preset slice layer is reduced or increased by the same number of pixels without changing its shape.

[0011] In one embodiment, determining the first process parameters for curing the first preset slice layer includes: acquiring a first slice image and a first layer thickness of the first preset slice layer;

[0012] The first process parameters for curing the first preset slice layer are determined based on the first slice image and the first layer thickness.

[0013] In one embodiment, determining the second process parameters for curing the second preset slice layer includes:

[0014] Obtain the second slice image and the second layer thickness of the second preset slice layer;

[0015] The second process parameters for curing the second preset slice layer are determined based on the second slice image and the second layer thickness.

[0016] In one embodiment, obtaining the second slice image and the second layer thickness of the second preset slice layer includes:

[0017] Obtain the second area and second perimeter of the second slice image;

[0018] The second process parameters for curing the second preset slice layer are determined based on the second area, the second perimeter, and the second layer thickness; the second process parameters include the first peeling parameter and the second peeling parameter.

[0019] In one embodiment, curing second process parameters are determined based on a second area, a second perimeter, and a second layer thickness; the second process parameters include a first peeling parameter and a second peeling parameter, including:

[0020] Obtain the second ratio of the second area to the second perimeter;

[0021] Compare the second ratio with the preset threshold;

[0022] When the second ratio is greater than the preset threshold, the first stripping parameter is used;

[0023] When the second ratio is less than or equal to the preset threshold, the second stripping parameter is used.

[0024] Secondly, this application also provides a 3D printing processing system, the system comprising:

[0025] The acquisition module is used to acquire a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment;

[0026] The parameter determination module is used to determine the first process parameters for curing the first preset slice layer; and to determine the second process parameters for curing the second preset slice layer.

[0027] The first curing module is used to cure the first preset slice layer according to the first process parameters to obtain the first slice layer; multiple first slice layers are accumulated to obtain a substrate segment.

[0028] The second curing module is used to cure the second preset slice layer according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment.

[0029] In one embodiment, the system further includes:

[0030] The image offset module is used to offset the image of the first preset slice layer so that the image outline of the first preset slice layer is reduced or increased by the same number of pixels without changing its shape.

[0031] Thirdly, this application also provides a 3D printing apparatus, which includes:

[0032] Containers used to hold materials that are to be cured;

[0033] An energy radiation device is used to output energy to cure the material to be cured, thereby obtaining a corresponding cured layer.

[0034] The component platform is set in the direction of energy radiation corresponding to the energy radiation device, and is used to attach and support the formed solidified layer.

[0035] Drive mechanism, used to drive the component platform to move in a first direction; and

[0036] A control device is used to control the energy radiation device and the drive mechanism and to perform the following methods:

[0037] Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment;

[0038] Determine the first process parameters for curing the first preset slice layer, and determine the second process parameters for curing the second preset slice layer;

[0039] A first preset slice layer is cured according to the first process parameters to obtain a first slice layer; multiple first slice layers are accumulated to obtain a substrate segment;

[0040] The second preset slice layer is cured according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment.

[0041] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the following method:

[0042] Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment;

[0043] Determine the first process parameters for curing the first preset slice layer, and determine the second process parameters for curing the second preset slice layer;

[0044] A first preset slice layer is cured according to the first process parameters to obtain a first slice layer; multiple first slice layers are accumulated to obtain a substrate segment;

[0045] The second preset slice layer is cured according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment.

[0046] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the following methods:

[0047] Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment;

[0048] Determine the first process parameters for curing the first preset slice layer, and determine the second process parameters for curing the second preset slice layer;

[0049] A first preset slice layer is cured according to the first process parameters to obtain a first slice layer; multiple first slice layers are accumulated to obtain a substrate segment;

[0050] The second preset slice layer is cured according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment.

[0051] The aforementioned 3D printing processing method, system, equipment, and storage medium divide the sample to be printed into a preset substrate segment and a preset solid segment, and apply different process parameters to the preset substrate segment and the preset solid segment. This allows the first slice layer of the preset substrate segment to be printed according to the first process parameter during 3D printing. After multiple first slice layers are stacked to obtain the substrate segment, the preset solid segment is then printed according to the second process parameter. This solves the technical problem of poor adhesion between the cured layers and easy breakage in the early stage of sample model printing, and makes the final printed sample continuous and meet the accuracy requirements. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the 3D printing equipment structure in one embodiment;

[0053] Figure 2 This is a flowchart of a 3D printing processing method in one embodiment;

[0054] Figure 3 This is a schematic diagram comparing the thickness of the first slice layer with the height of the material to be cured in one embodiment;

[0055] Figure 4This is a schematic diagram of the image offset processing of the first preset slice layer in one embodiment;

[0056] Figure 5 This is a flowchart of a method for determining the first process parameter in one embodiment;

[0057] Figure 6 This is a flowchart of a method for determining a second process parameter in one embodiment;

[0058] Figure 7 This is a flowchart of a method using different stripping parameters in one embodiment;

[0059] Figure 8 This is a schematic diagram of a 3D printing processing system module in one embodiment. Detailed Implementation

[0060] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0061] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0064] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0065] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0066] Please see Figure 1 , Figure 1 A schematic diagram of a 3D printing device in one embodiment is shown. The 3D printing device includes a container 100 for holding the material to be cured, an energy radiation device 200 for outputting energy to cure the material and obtain a corresponding cured layer, a component platform 300 for attaching and supporting the formed cured layer, the component platform 300 being set with the energy radiation direction corresponding to the energy radiation device 200, a drive mechanism 400 for driving the component platform 300 to move in a first direction, and a control device 500 for performing the 3D printing process and controlling the drive mechanism 400 and the energy radiation device 200, wherein the first direction may be the Z-axis direction perpendicular to the liquid surface of the material to be cured.

[0067] Container 100, also known as a resin tank, is used to hold the material to be cured. A release film is provided at the bottom of container 100. This release film can be a low-deformation release film, characterized by low separation force. This reduces the peeling distance when the cured layer formed by the material separates from the release film, thereby improving efficiency. The material to be cured can be a liquid or a powder. Liquid materials include: light-curing resin liquids, or resin liquids mixed with ceramic powder, color additives, etc. Powder materials can be ceramic powder, color additive powder, etc. The material of container 100 includes, but is not limited to: glass, plastic, and resin.

[0068] In some embodiments, the 3D printing equipment uses bottom projection printing, and the energy radiation device 200 is positioned below the container 100. The energy radiation device 200 emits energy to solidify the material to be cured inside the container 100, thereby obtaining a layered cured layer. The type of radiation source for the energy radiation device 200 can be determined according to the type of material to be cured. For example, for materials to be cured by ultraviolet light irradiation, the radiation source can be a 406nm UV-LED light source or a 355nm UV-LED light source; for materials to be cured by visible light irradiation, the radiation source can be visible light, etc. The energy radiation device 200 can be controlled by electrical signals to control the energy level and the energy radiation time.

[0069] The component platform 300 is located above the container 100, aligned with the energy radiation direction of the energy radiation device 200, and is used to attach and support the formed cured layer. A preset printing reference surface inside the container 100 can be used as the starting position; for example, the preset printing reference surface can be the surface of the material to be cured at the bottom layer inside the container 100. The material to be cured inside the container 100 is cured by the energy radiation device 200, resulting in a cured layer on the side of the component platform 300 opposite to the bottom surface of the container. These layers are accumulated to obtain the final 3D model sample.

[0070] The drive mechanism 400 can be used to drive the component platform 300 to move along a first direction, which can be the direction of gravity, such as the Z-axis. In this case, the drive mechanism 400 can drive the component platform to rise or fall in the direction of gravity. The drive mechanism 400 can be driven by a motor.

[0071] The control device 500 is electrically connected to the energy radiation device 200 and the drive mechanism 400 simultaneously, so that the control device 500 can control the start and stop of the energy radiation device 200, the amount of irradiation energy and the irradiation time, etc., and can control the drive mechanism 400 to control the component platform 300, thereby realizing the raising or lowering of the component platform 300.

[0072] The control device 500 may be an electronic device containing a processor, such as a computer device, an embedded device, or an integrated circuit with a CPU.

[0073] In one embodiment, the control device 500 includes a processing unit, a storage unit, and multiple interface units. Each interface unit is connected to an independently packaged device in the 3D printing equipment, such as the energy radiation device 200 and the drive mechanism 400, and transmits data through the interface. The control device 500 may also include at least one of the following: a prompting device, a human-machine interaction device, etc. The interface type of the interface unit is determined according to the connected device, including but not limited to: a universal serial interface, a video interface, an industrial control interface, etc. For example, the interface unit includes: a USB interface, an HDMI interface, and an RS232 interface, wherein there are multiple USB interfaces and multiple RS232 interfaces, and the USB interface can connect to the human-machine interaction device, etc. The storage unit is used to store the files required for printing by the 3D printing equipment. The files include: program files and configuration files required for CPU operation, etc. The storage unit includes non-volatile memory and a system bus. Examples of non-volatile memory are solid-state drives or USB flash drives, etc. The system bus is used to connect the non-volatile memory and the CPU together, wherein the CPU can be integrated into the storage unit, or packaged separately from the storage unit and connected to the non-volatile memory through the system bus. The processing unit includes at least one of the following: a CPU or a chip with an integrated CPU, a programmable logic device (FPGA), and a multi-core processor. The processing unit also includes memory, registers, and other storage devices for temporary data storage.

[0074] In one embodiment, see Figure 2 , Figure 2 A flowchart illustrating the 3D printing processing method provided in this application is shown, including the following steps:

[0075] S210. Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment.

[0076] The sample to be printed can be an object of any shape, such as a tooth. After the digital model with the predetermined shape is imported into the 3D printing equipment, the 3D printing equipment processes it, dividing it into a connected substrate segment model and a solid segment model, that is, a preset substrate segment and a preset solid segment. At this time, the substrate segment model and the solid segment model are digital models and have not yet been cured and printed. In some embodiments, the digital model can be an STL (STereoLithography) format file, and the control device 500 can receive and process the STL file.

[0077] The substrate segment model includes multiple first preset slice layers, and the solid segment model includes multiple second preset slice layers. The first preset slice layers are obtained by dividing the substrate segment model into layers of varying thickness, which can be recognized by the 3D printing equipment and printed accordingly. Similarly, the second preset slice layers are obtained by dividing the solid segment model into layers of varying thickness, which can be recognized by the 3D printing equipment and printed accordingly. The thickness of the substrate segment model can be 1-3mm or adjusted adaptively according to the solid segment model, and can also be greater than 3mm.

[0078] S220. Determine the first process parameters for curing the first preset slice layer, and determine the second process parameters for curing the second preset slice layer.

[0079] After acquiring the data of the first preset slice layer of the substrate segment model, the first process parameters for the 3D printing equipment to print the first preset slice layer can be determined, enabling the 3D printing equipment to cure the material to be cured according to the first process parameters to obtain the first preset slice layer. The first process parameters may include the first exposure intensity emitted by the energy radiation device 200 to cure the material to be cured, and the peeling parameters for separating the first preset slice layer from the release film when the drive mechanism 400 drives the platform 300 to move in the first direction. The first exposure intensity may include exposure time and exposure energy, and the first exposure intensity is comprehensively controlled by adjusting the exposure energy emitted by the energy radiation device 200 and the exposure time for irradiating the material to be cured.

[0080] After acquiring the second preset slice layer data of the solid segment model, the second process parameters for the 3D printing equipment when printing the second preset slice layer can be determined. This allows the 3D printing equipment to cure the material to be cured according to the second process parameters, thereby obtaining the second preset slice layer. The second process parameters may include the second exposure intensity emitted by the energy radiation device 200 to cure the material to be cured, and the peeling parameters for separating the second preset slice layer from the release film when the drive mechanism 400 drives the platform 300 to move in the first direction. The second exposure intensity may include exposure time and exposure energy. The second exposure intensity is comprehensively controlled by adjusting the exposure energy emitted by the energy radiation device 200 and the exposure time for irradiating the material to be cured.

[0081] S230. The first preset slice layer is cured according to the first process parameters to obtain the first slice layer; multiple first slice layers are accumulated to obtain a substrate segment.

[0082] After determining the first process parameters for curing the first preset slice layer, the 3D printing equipment prints the corresponding first slice layer according to the first process parameters. After multiple printings, multiple first slice layers are accumulated to form a substrate segment. In some embodiments, the control device 500 controls the energy radiation device 200 and the drive mechanism 400 to cure the material to be cured in the container 100 layer by layer, so that the cured first slice layer is formed on the component platform 300, and multiple first slice layers are stacked to form a substrate segment. During printing, a release film can be used to constrain the liquid surface to ensure that the original dimensional accuracy is maintained during the printing process and to improve the surface quality.

[0083] S240. The second preset slice layer is cured according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment.

[0084] After obtaining the substrate segment, the 3D printing equipment prints the second preset slice layer on the substrate segment according to the determined second process parameters to obtain the corresponding second slice layer. After multiple printings, multiple second slice layers are accumulated to obtain a solid segment on the substrate segment and adjacent to the substrate segment.

[0085] In the above-mentioned 3D printing processing method, the sample to be printed is divided into a preset substrate segment and a preset solid segment, and different process parameters are used for the preset substrate segment and the preset solid segment. This allows the first slice layer of the preset substrate segment to be printed according to the first process parameter during 3D printing. After multiple first slice layers are stacked to obtain the substrate segment, the preset solid segment is printed according to the second process parameter. This solves the technical problem of poor adhesion between the cured layers and easy breakage in the early stage of sample model printing, and makes the final printed sample continuous and meet the accuracy requirements.

[0086] In some embodiments, the first process parameters used to cure the first preset slice layer include a first exposure intensity controlling the radiation emitted by the energy radiation device 200, and the second process parameters used to cure the second preset slice layer include a second exposure intensity controlling the radiation emitted by the energy radiation device 200. The second exposure intensity is greater than the first exposure intensity, wherein the first and second exposure intensities may include exposure energy and exposure time, etc. This setting makes the intensity when printing the substrate segment greater than the intensity when printing the sample. It can be understood that when the intensity of the printed substrate segment is higher, the thickness of the first slice layer after curing when printing the substrate segment is greater than the height of the material to be cured that was not leveled in time, achieving continuous curing. In this way, the substrate segment layers will be well bonded, solving the problem of delamination caused by weak bonding between layers.

[0087] Figure 3The illustration shows the dimensional offset between the first pre-biased slice layer 32 and the first pre-biased slice layer 31 obtained before curing in one embodiment. Since the first exposure intensity of the first pre-biased slice layer during curing is often large, such as high exposure energy or long exposure time, the dimensions of the corresponding first slice layer obtained during actual curing will be offset in the X and Y directions. That is, the first slice layer is larger or smaller than the size of the first pre-biased slice layer, for example, the size increases in both the X and Y directions at the same time. The X and Y directions refer to two mutually perpendicular directions on the plane where the slice layer is located.

[0088] Figure 4 A schematic diagram of image offsetting in one embodiment is shown. In some embodiments, image offsetting is performed on each first preset slice layer in the substrate segment, so that the image outline of the first preset slice layer is reduced or increased by the same number of pixels without changing its shape. This allows the corresponding first slice layer obtained after image offsetting and curing to maintain its original shape, thereby solving the problem of excessive size in the X and Y directions. For example, the first preset slice layer 31 before offsetting is simultaneously reduced proportionally in both the X and Y directions to obtain the first preset slice layer 41 after offsetting. After high exposure intensity, the size of the first slice layer 42 after offsetting increases, and the size of the first slice layer 42 after offsetting is controlled to be equal to the size of the first preset slice layer 31 before offsetting in both the X and Y directions. The reduction ratio can be confirmed by multiple pre-experiments based on the proportion of the first preset slice layer's size shifting under the first exposure intensity.

[0089] Please see Figure 5 In one embodiment, determining the first process parameters for curing the first preset slice layer includes:

[0090] S510. Obtain the first slice image and the first layer thickness of the first preset slice layer.

[0091] When performing 3D printing, the printing parameters need to be determined by combining the image and thickness of the model. For example, the curing pattern of the energy radiation device 200 needs to be determined based on the image, and the exposure intensity needs to be determined based on the thickness.

[0092] S520. Determine the first process parameters for curing the first preset slice layer based on the first slice image and the first layer thickness.

[0093] After acquiring the first slice image and the first layer thickness, the first process parameters of the 3D printing equipment when printing the first preset slice layer are determined. The first process parameters may include exposure intensity, peeling parameters, etc.

[0094] Please see Figure 6 In one embodiment, determining the second process parameters for curing the second preset slice layer includes:

[0095] S610. Obtain the second slice image and the second layer thickness of the second preset slice layer.

[0096] When performing 3D printing, it is necessary to combine the image and thickness in the model to determine the printing parameters. For example, it is necessary to determine the curing pattern of the energy radiation device 200 based on the image and the exposure intensity based on the thickness.

[0097] S620. Determine the second process parameters for curing the second preset slice layer based on the second slice image and the second layer thickness.

[0098] After acquiring the second slice image and the first layer thickness, the second process parameters of the 3D printing equipment when printing the second preset slice layer are determined. These second process parameters may include exposure intensity, peeling parameters, etc.

[0099] Please see Figure 7 In one embodiment, obtaining the second slice image and the second layer thickness of the second preset slice layer includes:

[0100] S710. Obtain the second area and the second perimeter of the second slice image.

[0101] The second slice image can be of any shape. The second area and the second perimeter of the second slice image are used to determine the second process parameters.

[0102] S720. Determine the second process parameters for curing the second preset slice layer based on the second area, the second perimeter, and the second layer thickness; the second process parameters include the first peeling parameter and the second peeling parameter.

[0103] The second process parameters may include a first stripping parameter and a second stripping parameter, wherein the first stripping parameter may be the same as or different from the second stripping parameter, and corresponding stripping parameters may be used for different second slice images.

[0104] In one embodiment, the second curing process parameters are determined based on the second area, the second perimeter, and the second layer thickness; the second process parameters include a first peeling parameter and a second peeling parameter, including:

[0105] Obtain a second ratio of the second area to the second perimeter; compare the second ratio with a preset threshold; when the second ratio is greater than the preset threshold, use the first stripping parameter; when the second ratio is less than or equal to the preset threshold, use the second stripping parameter.

[0106] The ratio of the second area to the second perimeter is compared with a preset threshold. When the ratio is greater than the preset threshold, the layer is determined to be a large-area layer, and the first peeling parameter is used when peeling off the layer after printing. When the ratio of a certain second preset slice layer is less than the threshold, the layer is determined to be a small-area layer, and the second peeling parameter is used when peeling off the layer after printing. The first peeling parameter takes longer than the second peeling parameter. This allows sufficient time for the material to be cured to level when peeling off large-area layers, while shortening the curing time and improving printing efficiency for small-area layers.

[0107] In traditional 3D printing, printing process parameters are often determined beforehand through experiments on experimental pieces, and then the same printing parameters are used for all subsequent models. Since the samples to be printed are often irregular, the area and length of each slice after layering vary. In photopolymer 3D printing, after curing a layer of a predetermined thickness, the cured layer needs to be lifted to create displacement, and the cured material needs to be leveled until the printing surface is saturated before the next layer is cured. This uniform printing parameter approach has drawbacks when dealing with irregular samples. For example, the lifting rate is fixed. If this lifting rate is suitable for small-area slices, it may lead to excessively fast lifting when printing large-area slices, causing the cured material to solidify before it has time to level, resulting in layer breaks. Conversely, if the lifting rate is suitable for large-area slices, when printing small-area slices, the cured material needs to wait for a period of time after leveling before the next layer can be cured, leading to decreased printing efficiency. Therefore, by classifying the second preset slices into large or small areas and using different peeling parameters, printing efficiency can be improved while maintaining printing accuracy.

[0108] In one embodiment, after obtaining adjacent preset substrate segments and preset solid segments of the sample to be printed, the first process parameters for curing the corresponding layer are determined according to each first preset slice layer of the preset substrate segment, and the second process parameters for curing the corresponding layer are determined according to each second preset slice layer of the preset solid segment, wherein the second area and the second perimeter of the second preset slice layer are obtained.

[0109] The preset substrate segment is printed according to the first process parameters. The area of ​​the preset substrate segment is often larger than that of the preset solid segment. When printing the preset substrate segment, the first exposure intensity is used. Correspondingly, if the exposure intensity is too high, the slice layer will shift during curing. Therefore, before printing, the first preset slice layer needs to be image offset so that the image of the first preset slice layer is reduced or increased by the same number of pixels so that the printed first slice layer can maintain its original shape. After multiple first slice layers are printed, they are accumulated to obtain the substrate segment.

[0110] After the substrate segment is printed, the second preset slice layer is cured using the second process parameters. First, the second ratio obtained by comparing the second area with the second perimeter is compared with a preset threshold. When the second ratio is greater than the preset threshold, the corresponding second slice layer is peeled off using the first peeling parameter. When the second ratio is less than or equal to the preset threshold, the corresponding second slice layer is peeled off using the second peeling parameter. After printing multiple layers of second slice layers, a solid segment is accumulated.

[0111] The above-mentioned 3D printing processing method divides the sample into a substrate segment and a solid segment, and prints the substrate segment and solid segment layer by layer according to different process parameters to obtain a sample with the substrate segment and solid segment adjacent to each other. This solves the technical problem of poor adhesion and easy breakage between adjacent slices obtained in the early stage of sample model printing, and makes the final printed sample continuous and meets the accuracy requirements.

[0112] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0113] In one embodiment, see Figure 8 A 3D printing processing system 80 is provided, the system comprising:

[0114] The acquisition module 81 acquires a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment;

[0115] The parameter determination module 82 is used to determine the first process parameters for curing the first preset slice layer and the second process parameters for curing the second preset slice layer.

[0116] The first curing module 83 is used to cure the first preset slice layer according to the first process parameters to obtain the first slice layer; multiple first slice layers are accumulated to obtain a substrate segment.

[0117] The second curing module 84 is used to cure the second preset slice layer according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment.

[0118] In one embodiment, the 3D printing processing system 80 further includes an image biasing module for biasing the first preset slice layer so that the image outline of the first preset slice layer is reduced or increased by the same number of pixels without changing its shape.

[0119] In one embodiment, a 3D printing apparatus is provided, comprising: a container for holding a material to be cured; an energy radiation device for outputting energy to cure the material to be cured, thereby obtaining a cured layer; a component platform configured to correspond to the energy radiation direction of the energy radiation device, for attaching to and supporting the formed cured layer; a drive mechanism for driving the component platform to move in a first direction; and a control device for controlling the energy radiation device and the drive mechanism and performing the following method:

[0120] Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, and the preset solid segment includes multiple second preset slice layers, with the preset solid segment adjacent to the preset substrate segment; determine first process parameters for curing the first preset slice layers, and determine second process parameters for curing the second preset slice layers; cure the first preset slice layers according to the first process parameters to obtain the first slice layer; accumulate multiple first slice layers to obtain the substrate segment; cure the second preset slice layers according to the second process parameters to obtain the second slice layer; accumulate multiple second slice layers to obtain the solid segment.

[0121] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program implementing the following methods when executed by a processor:

[0122] Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, and the preset solid segment includes multiple second preset slice layers, with the preset solid segment adjacent to the preset substrate segment; determine first process parameters for curing the first preset slice layers, and determine second process parameters for curing the second preset slice layers; cure the first preset slice layers according to the first process parameters to obtain the first slice layer; accumulate multiple first slice layers to obtain the substrate segment; cure the second preset slice layers according to the second process parameters to obtain the second slice layer; accumulate multiple second slice layers to obtain the solid segment.

[0123] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the following methods:

[0124] Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, and the preset solid segment includes multiple second preset slice layers, with the preset solid segment adjacent to the preset substrate segment; determine first process parameters for curing the first preset slice layers, and determine second process parameters for curing the second preset slice layers; cure the first preset slice layers according to the first process parameters to obtain the first slice layer; accumulate multiple first slice layers to obtain the substrate segment; cure the second preset slice layers according to the second process parameters to obtain the second slice layer; accumulate multiple second slice layers to obtain the solid segment.

[0125] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0126] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A 3D printing processing method, characterized in that, The method includes: Obtain a preset substrate segment and a preset solid segment of the sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment; Determine the first process parameters for curing the first preset slice layer, and determine the second process parameters for curing the second preset slice layer; the first process parameters include a first exposure intensity and a first peeling parameter, the second process parameters include a second exposure intensity and a second peeling parameter, and the second exposure intensity is greater than the first exposure intensity; The first preset slicing layer is cured according to the first process parameters to obtain a first slicing layer; multiple first slicing layers are accumulated to obtain a substrate segment; The second preset slice layer is cured according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment. Before the first preset slicing layer is cured according to the first process parameters to obtain the first slicing layer; and multiple first slicing layers are accumulated to obtain a substrate segment, the method further includes: The first preset slice layer is image-biased so that the image outline of the first preset slice layer is reduced or increased by the same number of pixels without changing its shape. This includes: simultaneously and proportionally reducing the first preset slice layer in the X and Y directions to obtain the biased first preset slice layer; increasing its size after high exposure intensity to obtain the biased first slice layer; and controlling the size of the biased first slice layer in the X and Y directions to be equal to the size of the first preset slice layer in the X and Y directions, respectively.

2. The method according to claim 1, characterized in that, The first exposure intensity includes exposure time and exposure energy.

3. The method according to claim 1, characterized in that, The first process parameters for determining the curing of the first preset slice layer include: Obtain the first slice image and the first layer thickness of the first preset slice layer; The first process parameters for curing the first preset slice layer are determined based on the first slice image and the first layer thickness.

4. The method according to claim 1, characterized in that, The second process parameters for determining the curing of the second preset slice layer include: Obtain the second slice image and the second layer thickness of the second preset slice layer; The second process parameters for curing the second preset slice layer are determined based on the second slice image and the second layer thickness.

5. The method according to claim 4, characterized in that, The step of obtaining the second slice image and the second layer thickness of the second preset slice layer includes: Obtain the second area and the second perimeter of the second slice image; The second process parameters for curing the second preset slice layer are determined based on the second area, the second perimeter, and the second layer thickness; the second process parameters include a first peeling parameter and a second peeling parameter.

6. The method according to claim 5, characterized in that, The second process parameters for curing are determined based on the second area, the second perimeter, and the second layer thickness; the second process parameters include a first peeling parameter and a second peeling parameter, including: Obtain the second ratio of the second area to the second perimeter; Compare the second ratio with a preset threshold; When the second ratio is greater than the preset threshold, the first stripping parameter is used; When the second ratio is less than or equal to the preset threshold, the second stripping parameter is used.

7. A 3D printing processing system, characterized in that, The system includes: An acquisition module is used to acquire a preset substrate segment and a preset solid segment of a sample to be printed; the preset substrate segment includes multiple first preset slice layers, the preset solid segment includes multiple second preset slice layers, and the preset solid segment is adjacent to the preset substrate segment; The parameter determination module is used to determine first process parameters for curing the first preset slice layer and to determine second process parameters for curing the second preset slice layer; the first process parameters include a first exposure intensity and a first peeling parameter, the second process parameters include a second exposure intensity and a second peeling parameter, and the second exposure intensity is greater than the first exposure intensity; A first curing module is used to cure the first preset slice layer according to the first process parameters to obtain a first slice layer; multiple first slice layers are accumulated to obtain a substrate segment. The second curing module is used to cure the second preset slice layer according to the second process parameters to obtain the second slice layer; multiple second slice layers are accumulated to obtain a solid segment. The system also includes: The image offset module is used to offset the first preset slice layer so that the image outline of the first preset slice layer is reduced or increased by the same number of pixels without changing its shape. This includes: simultaneously and proportionally reducing the first preset slice layer in the X and Y directions to obtain the offset first preset slice layer, increasing its size after high exposure intensity to obtain the offset first slice layer, and controlling the size of the offset first slice layer in the X and Y directions to be equal to the size of the first preset slice layer in the X and Y directions, respectively.

8. The system according to claim 7, characterized in that, The parameter determination module is further configured to acquire a first slice image and a first layer thickness of the first preset slice layer; and to determine first process parameters for curing the first preset slice layer based on the first slice image and the first layer thickness.

9. A 3D printing device, characterized in that, The device includes: Containers used to hold materials that are to be cured; An energy radiation device is used to output energy to cure the material to be cured, thereby obtaining a corresponding cured layer. The component platform is set in the direction of energy radiation of the energy radiation device and is used to attach and support the formed solidified layer. A drive mechanism is used to drive the component platform to move in a first direction; and A control device for controlling the energy radiation device and the drive mechanism and performing the method according to any one of claims 1-6.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

11. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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