Chip carrier assembly, chip testing device and method

Abstract

The present application relates to a chip carrier assembly, a chip testing device and a method, wherein the chip carrier assembly is used to fix chips of different sizes, and includes a rotatable vertical rod, a horizontal beam, a first side wall and a second side wall, wherein the rotatable vertical rod is provided with a gear with gear teeth surrounding the rotatable vertical rod; a first through hole and a first slide groove are provided in the horizontal beam; the top of the first side wall is connected to the first connecting rod located in the first slide groove; the top of the second side wall is connected to the second connecting rod located in the first slide groove, and the side surface of the first connecting rod is provided with a plurality of linearly arranged first tooth grooves; the rotatable vertical rod is used to rotate in the first through hole, driving the gear to rotate, so that the gear teeth engage with the first tooth grooves, thereby driving the first side wall relatively close to or away from the second side wall. The chip carrier assembly in the present application can fix chips of different types, shapes and volumes, thereby improving chip testing efficiency while reducing the testing cost of multiple types of chips.

Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and in particular to a chip carrier component, a chip testing device and a chip testing method. Background Art

[0002] A bare chip and various types of frames or plastic molding compounds form a chip package. Chip packages come in many different types, generally categorized by the packaging material, the connection method between the chip package and the printed circuit board (PCB), and the package's appearance. Chip packages must be tested before shipment to ensure quality.

[0003] During the testing process of the chip package, its test pins need to be electrically connected to the test circuit. In order to facilitate the fixed connection between the test circuit and the chip package, it is necessary to provide a carrier device that meets the testing requirements of the chip package. The test circuit can provide test electrical signals to the chip package through the test pins of the chip package fixed to the carrier device to test the performance and reliability of the chip package.

[0004] However, different types of chip packages have different dimensions, and the dimensions of the test pins of the same type of chip packages may be different. If matching test carriers are provided for different chip packages, it will obviously cause waste of resources and be detrimental to reducing test costs. Summary of the Invention

[0005] Based on this, it is necessary to provide a chip carrier component, a chip testing device and a method to address the technical problems in the above background technology, so as to improve the chip testing efficiency while reducing the testing cost of multiple types of chips.

[0006] To achieve the above-mentioned and other purposes, the first aspect of the present application provides a chip carrier assembly for fixing chips of different sizes, including a rotatable vertical rod, a horizontal beam, a first side wall and a second side wall, the rotatable vertical rod is provided with a gear whose teeth surround the rotatable vertical rod; a first through hole and a first slide groove consistent with the extension direction of the horizontal beam are provided in the horizontal beam; the top of the first side wall is connected to the first connecting rod, and the first connecting rod is located in the first slide groove; the second side wall is spaced apart from the first side wall for fixing the chip between the two, the top of the second side wall is connected to the second connecting rod, the second connecting rod is spaced apart from the first connecting rod and is located in the first slide groove, and the side of the first connecting rod close to the second connecting rod is provided with a plurality of first teeth arranged in a linear manner; wherein the rotatable vertical rod is used to rotate in the first through hole, driving the gear to rotate, so that the teeth of the gear engage with the first teeth groove, so as to drive the first side wall relatively close to or away from the second side wall.

[0007] In the chip carrier assembly of the above embodiment, a gear having gear teeth surrounding the rotatable vertical rod is provided on the rotatable vertical rod, a first through-hole and a first slot are provided in the crossbeam in the same direction as the extension of the crossbeam; a top of a first sidewall is connected to a first connecting rod located in the first slot, and a top of a second sidewall spaced apart from the first sidewall is connected to a second connecting rod, the second connecting rod being spaced apart from the first connecting rod and located in the first slot; a side of the first connecting rod adjacent to the second connecting rod is provided with a plurality of first teeth arranged in a linear pattern; and utilizing the mechanical principle that when the gear rotates, the teeth of the gear engage with the teeth provided on the body and drive the body to move, the rotatable vertical rod passing through the first through-hole in the crossbeam is rotated, thereby driving the gear on the rotatable vertical rod to rotate, causing the teeth of the gear to engage with the first teeth on the first connecting rod, driving the first sidewall relatively closer to or farther from the second sidewall, thereby adjusting the distance between the first sidewall and the second sidewall and securing the chip therebetween. This meets the requirements for securing chips of different types, shapes, and sizes, thereby improving chip testing efficiency and reducing the cost of testing multiple types of chips.

[0008] In one embodiment, the second connecting rod is provided with a plurality of second tooth grooves arranged in a linear pattern on the side surface close to the first connecting rod; wherein the gear teeth are also used to engage with the second tooth grooves to drive the second side wall relatively close to or away from the first side wall. In this embodiment, by rotating a rotatable vertical rod that passes through the first through hole in the crossbeam, the gear on the rotatable vertical rod is driven to rotate, so that the gear teeth of the gear engage with the second tooth groove on the second connecting rod, driving the second side wall relatively close to or away from the first side wall, adjusting the distance between the first side wall and the second side wall, and fixing the chip located between the two. This meets the fixing requirements of chips of different types, shapes, and sizes, while improving chip testing efficiency and reducing the testing cost of multiple types of chips.

[0009] In one embodiment, the first tooth groove and the second tooth groove extend in the same direction; wherein the gear is further configured to rotate between the first tooth groove and the second tooth groove, so that the gear teeth engage with the first tooth groove and the second tooth groove simultaneously, thereby simultaneously driving the first side wall and the second side wall to move closer or farther apart. Since the rotation of the rotatable vertical rod extending through the first through hole in the crossbeam can simultaneously drive the movement of the first connecting rod and the second connecting rod, the efficiency of adjusting the distance between the first side wall and the second side wall is improved.

[0010] In one embodiment, a surface of the first side wall close to the second side wall is provided with an anti-slip material; a surface of the second side wall close to the first side wall is provided with an anti-slip material to increase the friction between the chip fixed between the first side wall and the second side wall and the first side wall and the second side wall, thereby improving the stability of chip fixation.

[0011] In one embodiment, the chip carrying assembly also includes a third side wall and a fourth side wall, the top of the third side wall is connected to the third connecting rod, and the third connecting rod passes through the crossbeam and the first through hole via a second slide groove provided on the crossbeam; the fourth side wall is spaced apart from the third side wall for fixing the chip between the two, the top of the fourth side wall is connected to the fourth connecting rod, and the fourth connecting rod is spaced apart from the third connecting rod and is located in the second slide groove, and the side of the third connecting rod close to the fourth connecting rod is provided with a plurality of third teeth arranged in a linear manner; wherein the rotatable vertical rod is used to rotate in the first through hole, driving the gear to rotate, so that the gear teeth of the gear engage with the third teeth groove, so as to drive the third side wall relatively close to or away from the fourth side wall.

[0012] In the chip carrier assembly in the above embodiment, the mechanical principle is utilized that when the gear rotates, the gear teeth engage with the tooth grooves provided on the main body and drive the movement of the main body. By rotating the rotatable vertical rod that passes through the first through hole in the beam, the gear on the rotatable vertical rod is driven to rotate, so that the gear teeth engage with the third tooth groove on the third connecting rod, driving the third side wall relatively close to or away from the fourth side wall, adjusting the distance between the third side wall and the fourth side wall, and fixing the chip located between the two, thereby meeting the fixing requirements of chips of different types, shapes and volumes, and reducing the testing cost of multiple types of chips while improving the chip testing efficiency.

[0013] In one embodiment, the side of the fourth connecting rod adjacent to the third connecting rod is provided with a plurality of fourth tooth grooves arranged in a linear pattern; wherein the gear teeth are further configured to engage with the fourth tooth grooves to drive the fourth side wall relatively closer to or away from the third side wall. In this embodiment, by rotating a rotatable vertical rod that passes through the first through hole in the crossbeam, the gear on the rotatable vertical rod is driven to rotate, so that the gear teeth of the gear engage with the fourth tooth groove on the fourth connecting rod, driving the fourth side wall relatively closer to or away from the third side wall, adjusting the distance between the third side wall and the fourth side wall, and fixing the chip located therebetween, thereby meeting the fixing requirements of chips of different types, shapes, and sizes, improving chip testing efficiency while reducing the testing cost of multiple types of chips.

[0014] In one embodiment, the fourth tooth groove extends in the same direction as the third tooth groove; wherein the gear is further configured to rotate between the third tooth groove and the fourth tooth groove, so that the gear teeth of the gear mesh with the third tooth groove and the fourth tooth groove simultaneously, thereby simultaneously driving the third side wall and the fourth side wall to move closer or farther apart. Since the rotation of the rotatable vertical rod passing through the first through hole in the crossbeam can simultaneously drive the movement of the third connecting rod and the fourth connecting rod, the efficiency of adjusting the distance between the third side wall and the fourth side wall is improved.

[0015] In one embodiment, the second slide groove is spaced apart from the first slide groove, so that the rotatable vertical rod passing through the first through hole in the beam can be rotated to drive the gear to move from the first slide groove to the second slide groove to adjust the distance between the third side wall and the fourth side wall.

[0016] In one embodiment, the extension direction of the second sliding groove is perpendicular to the extension direction of the first sliding groove, so as to improve the stability of chip fixation.

[0017] In one embodiment, the surface of the third side wall close to the fourth side wall is provided with an anti-slip material; the surface of the fourth side wall close to the third side wall is provided with an anti-slip material to increase the friction between the chip fixed between the third side wall and the fourth side wall and the third side wall and the fourth side wall, thereby improving the stability of chip fixation.

[0018] In one embodiment, the gear is arranged in the middle of the rotatable vertical rod; the bottom surface of the rotatable vertical rod is used to contact the top surface of the chip to fix the chip in a direction perpendicular to the top surface of the chip, thereby improving the stability of chip fixation.

[0019] In one embodiment, an elastic body is provided on the bottom surface of the rotatable vertical rod, and the elastic body is used to elastically contact the top surface of the chip, thereby improving the stability of the chip fixation and avoiding crushing the chip.

[0020] In one embodiment, a handle is provided on the top of the rotatable vertical rod, so that the rotatable vertical rod can be rotated by holding the handle.

[0021] Another aspect of the present application provides a chip testing device, comprising a support box and a chip carrier assembly as described in any of the embodiments of the present application; the support box is configured to support a test circuit board; the chip carrier assembly is configured to secure a chip to the upper surface of the test circuit board; wherein the test circuit board is configured to provide a test signal to the chip for testing the chip. The chip testing device of this embodiment can test chips of different types, shapes, and sizes without replacing the chip carrier assembly, thereby improving chip testing efficiency while reducing the cost of testing multiple chip types.

[0022] Another aspect of the present application provides a chip testing method, comprising:

[0023] Loading the chip into any chip carrier assembly described in any embodiment of the present application and securing it;

[0024] placing the connection terminals of the chip in contact with the upper surface of the test circuit board located in the support box, and rotating the rotatable vertical rod until its bottom surface contacts the top surface of the chip;

[0025] The test circuit board is controlled to provide a test signal to the chip to test the chip.

[0026] The chip testing method in the above embodiment can test chips of different types, shapes and volumes without replacing the chip carrier assembly, thereby improving chip testing efficiency while reducing the testing cost of multiple types of chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to better describe and illustrate the embodiments and / or examples of the applications disclosed herein, reference may be made to one or more of the accompanying drawings. The additional details or examples used to describe the accompanying drawings should not be considered to limit the scope of the disclosed applications, the presently described embodiments and / or examples, and any of the best modes currently understood for these applications.

[0028] Figure 1 This is a schematic structural diagram of a chip carrier assembly provided in one embodiment of the present application;

[0029] Figure 2 for Figure 1 A schematic structural diagram of a rotatable vertical rod in one embodiment is shown in FIG;

[0030] Figure 3 for Figure 1 Schematic diagram of a top view of the first side wall and the first connecting rod in one embodiment shown in FIG;

[0031] Figure 4a for Figure 1 Schematic diagram of a top view of the first side wall, the first connecting rod, the second side wall and the second connecting rod in another embodiment;

[0032] Figure 4b for Figure 1 A schematic front view of the first side wall and the first connecting rod in one embodiment is shown in FIG;

[0033] Figure 5 This is a schematic structural diagram of a chip carrier assembly provided in another embodiment of the present application;

[0034] Figure 6a for Figure 5 Schematic diagram of a top view of the third side wall and the third connecting rod in one embodiment shown in FIG;

[0035] Figure 6b for Figure 5 Schematic diagram of a top view of the third side wall, the third connecting rod, the fourth side wall and the fourth connecting rod in another embodiment;

[0036] Figure 6c for Figure 5 : a schematic diagram of a right side view of the third side wall and the third connecting rod in one embodiment;

[0037] Figure 6d for Figure 5 A schematic diagram of a front view of a crossbeam in one embodiment is shown in FIG.

[0038] Description of reference numerals:

[0039] 10. Rotatable vertical rod; 11. Gear; 12. Gear teeth; 20. Crossbeam; 21. First through hole; 31. First side wall; 32. Second side wall; 33. Third side wall; 34. Fourth side wall; 41. First connecting rod; 42. Second connecting rod; 43. Third connecting rod; 44. Fourth connecting rod; 411. First tooth groove; 421. Second tooth groove; 431. Third tooth groove; 441. Fourth tooth groove; 22. First slide groove; 23. Second slide groove. DETAILED DESCRIPTION

[0040] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0042] In the case of using “including,” “having,” and “comprising” described herein, another component may be added unless a clear limiting term such as “only,” “consisting of,” etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as having one number.

[0043] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0044] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein for convenience of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, then the elements or features described as "under the other elements" or "under it" or "below it" will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other orientations) and the spatial descriptors used herein are interpreted accordingly. The directional word "over" in this application is from the user's viewing perspective.

[0045] Please refer to Figure 1 、 Figure 2 and Figure 3 In one embodiment of the present application, a chip carrier assembly is provided for fixing chips of different sizes ( Figure 1 and Figure 2 The rotatable vertical rod 10, the horizontal beam 20, the first side wall 31 and the second side wall 32 are provided. The rotatable vertical rod 10 is provided with a gear 11 with gear teeth 12 surrounding the rotatable vertical rod 10; the horizontal beam 20 is provided with a first through hole 21 and a first sliding groove ( Figure 1 (not shown); the top of the first side wall 31 is connected to the first connecting rod 41, and the first connecting rod 41 is located in the first sliding groove; the second side wall 32 is spaced apart from the first side wall 31 for fixing the chip located therebetween, the top of the second side wall 32 is connected to the second connecting rod 42, and the second connecting rod 42 is spaced apart from the first connecting rod 41 and is located in the first sliding groove, and a plurality of linearly arranged first tooth grooves 411 are provided on the side of the first connecting rod 41 close to the second connecting rod 42; wherein the rotatable vertical rod 10 is used to rotate in the first through hole 21, driving the gear 11 to rotate, so that the gear teeth 12 of the gear 11 engage with the first tooth grooves 411, so as to drive the first side wall 31 relatively close to or away from the second side wall 32.

[0046] As an example, please refer to Figure 1 、 Figure 2 and Figure 3 By setting a gear 12 on the rotatable vertical rod 10 to surround the gear 11 of the rotatable vertical rod 10, a first through hole 21 and a first sliding groove (which is consistent with the extension direction of the beam 20) are set in the beam 20. Figure 1The top of the first side wall 31 is connected to the first connecting rod 41 located in the first sliding groove, and the top of the second side wall 32 spaced from the first side wall 31 is connected to the second connecting rod 42. The second connecting rod 42 is spaced relative to the first connecting rod 41 and is located in the first sliding groove. The side of the first connecting rod 41 close to the second connecting rod 42 is provided with a plurality of first tooth grooves 411 arranged in a linear manner. The gear 11 rotates by using the mechanical principle that the gear teeth 12 engage with the tooth grooves provided on the body and drive the body to move. The rotatable vertical rod 10 passing through the first through hole 21 in the crossbeam 20 drives the gear 11 on the rotatable vertical rod 10 to rotate, so that the gear teeth 12 of the gear 11 engage with the first tooth groove 411 on the first connecting rod 41, driving the first side wall 31 relatively close to or away from the second side wall 32, adjusting the distance between the first side wall 31 and the second side wall 32, fixing the chip located therebetween, meeting the fixing requirements of chips of different types, shapes and volumes, improving chip testing efficiency while reducing the testing cost of multiple types of chips.

[0047] As an example, please refer to Figure 1 、 Figure 2 and Figure 3 In one embodiment of the present application, the gear 11 is arranged in the middle of the rotatable vertical rod 10; the bottom surface of the rotatable vertical rod 10 is used to contact the top surface of the chip to fix the chip in a direction perpendicular to the top surface of the chip, thereby improving the stability of the chip fixation.

[0048] As an example, please refer to Figure 1 、 Figure 2 and Figure 3 In one embodiment of the present application, an elastic body (not shown) is provided on the bottom surface of the rotatable vertical rod 10. The elastic body is used to elastically contact the top surface of the chip, thereby improving the stability of the chip fixation and avoiding crushing the chip.

[0049] As an example, please refer to Figure 1 、 Figure 2 and Figure 3 In one embodiment of the present application, a handle is provided on the top of the rotatable vertical rod 10 to facilitate rotating the rotatable vertical rod 10 by holding the handle.

[0050] As an example, see Figure 4a and Figure 4bIn one embodiment of the present application, a plurality of second tooth grooves 421 arranged in a linear pattern are provided on the side of the second connecting rod 42 near the first connecting rod 41; wherein, the gear teeth 12 of the gear 11 are also used to engage with the second tooth grooves 421 to drive the second side wall 32 relatively close to or away from the first side wall 31. In this embodiment, by rotating the rotatable vertical rod 10 that passes through the first through hole 21 in the crossbeam 20, the gear 11 on the rotatable vertical rod 10 is driven to rotate, so that the gear teeth 12 of the gear 11 engage with the second tooth grooves 421 on the second connecting rod 42, driving the second side wall 32 relatively close to or away from the first side wall 31, adjusting the distance between the first side wall 31 and the second side wall 32, and fixing the chip located therebetween. This meets the fixing requirements of chips of different types, shapes, and sizes, while improving chip testing efficiency and reducing the testing cost of multiple types of chips.

[0051] As an example, please refer to Figure 4a and Figure 4b In one embodiment of the present application, the first tooth groove 411 and the second tooth groove 421 extend in the same direction. The gear 11 is further configured to rotate between the first tooth groove 411 and the second tooth groove 421, so that the gear teeth 12 of the gear 11 engage with both the first tooth groove 411 and the second tooth groove 421, thereby simultaneously moving the first side wall 31 and the second side wall 32 closer together or further apart. Since the rotation of the rotatable vertical rod 10, which extends through the first through hole 21 in the crossbeam 20, simultaneously drives the first connecting rod 41 and the second connecting rod 42 to move, the efficiency of adjusting the distance between the first side wall 31 and the second side wall 32 is improved.

[0052] As an example, please refer to Figure 4a and Figure 4b In one embodiment of the present application, the surface of the first side wall 31 close to the second side wall 32 is provided with an anti-slip material (not shown); the surface of the second side wall 32 close to the first side wall 31 is provided with an anti-slip material, and the anti-slip material may include anti-slip sand or rubber-plastic anti-slip fiber, etc., which is used to increase the friction between the chip fixed between the first side wall 31 and the second side wall 32 and the first side wall 31 and the second side wall 32, thereby improving the stability of chip fixation.

[0053] As an example, see Figure 5 and Figure 6a In one embodiment of the present application, the chip carrier assembly further includes a third sidewall 33 and a fourth sidewall 34. The top of the third sidewall 33 is connected to the third connecting rod 43. The third connecting rod 43 is connected to the third connecting rod 43 via a second sliding groove ( Figure 5The fourth side wall 34 is spaced apart from the third side wall 33 and is used to fix the chip located therebetween. The top of the fourth side wall 34 is connected to the fourth connecting rod 44. The fourth connecting rod 44 is spaced apart from the third connecting rod 43 and is located in the second slide groove. The side of the third connecting rod 43 close to the fourth connecting rod 44 is provided with a plurality of third tooth grooves 431 arranged in a linear manner. The rotatable vertical rod 10 is used to rotate in the first through hole 21, driving the gear 11 to rotate, so that the gear teeth 12 of the gear 11 engage with the third tooth grooves 431, so as to drive the third side wall 33 to be relatively close to or away from the fourth side wall 34.

[0054] As an example, please refer to Figure 5 and Figure 6a , utilizing the mechanical principle that when the gear 11 rotates, the gear teeth 12 engage with the tooth grooves provided on the main body and drive the movement of the main body. By rotating the rotatable vertical rod 10 that passes through the first through hole 21 in the crossbeam 20, the gear 11 on the rotatable vertical rod 10 is driven to rotate, so that the gear teeth 12 of the gear 11 engage with the third tooth groove 431 on the third connecting rod 43, driving the third side wall 33 relatively close to or away from the fourth side wall 34, adjusting the distance between the third side wall 33 and the fourth side wall 34, and fixing the chip located therebetween, meeting the fixing requirements of chips of different types, shapes and sizes, while improving chip testing efficiency and reducing the testing cost of multiple types of chips.

[0055] As an example, see Figure 5 、 Figure 6b and Figure 6c In one embodiment of the present application, a plurality of fourth tooth grooves 441 arranged in a linear pattern are provided on the side of the fourth connecting rod 44 near the third connecting rod 43; wherein the gear teeth 12 of the gear 11 are also used to engage with the fourth tooth grooves 441 to drive the fourth sidewall 34 relatively closer to or farther away from the third sidewall 33. In this embodiment, by rotating the rotatable vertical rod 10 that passes through the first through hole 21 in the crossbeam 20, the gear 11 on the rotatable vertical rod 10 is driven to rotate, so that the gear teeth 12 of the gear 11 engage with the fourth tooth grooves 441 on the fourth connecting rod 44, driving the fourth sidewall 34 relatively closer to or farther away from the third sidewall 33, adjusting the distance between the third sidewall 33 and the fourth sidewall 34, and fixing the chip located therebetween. This meets the fixing requirements of chips of different types, shapes, and sizes, improving chip testing efficiency while reducing the testing cost of multiple types of chips.

[0056] As an example, see Figure 5 、 Figure 6b and Figure 6cIn one embodiment of the present application, the fourth tooth groove 441 extends in the same direction as the third tooth groove 431. The gear 11 is further configured to rotate between the third tooth groove 431 and the fourth tooth groove 441, so that the gear teeth 12 of the gear 11 engage with both the third tooth groove 431 and the fourth tooth groove 441, thereby simultaneously moving the third side wall 33 and the fourth side wall 34 closer together or farther apart. Since the rotation of the rotatable vertical rod 10, which extends through the first through hole 21 in the crossbeam 20, simultaneously drives the third connecting rod 43 and the fourth connecting rod 44, the efficiency of adjusting the distance between the third side wall 33 and the fourth side wall 34 is improved.

[0057] As an example, see Figure 5 、 Figure 6b 、 Figure 6c and Figure 6d In one embodiment of the present application, the second slide groove 23 is spaced apart from the first slide groove 22, so that the rotatable vertical rod 10 that passes through the first through hole 21 in the beam 20 can be rotated to drive the gear 11 to move from the first slide groove 22 to the second slide groove 23 to adjust the distance between the third side wall 33 and the fourth side wall 34.

[0058] As an example, please refer to Figure 5 、 Figure 6a 、 Figure 6b 、 Figure 6c and Figure 6d In one embodiment of the present application, the extension direction of the second slide groove 23 is oblique to the extension direction of the first slide groove 22, for example, perpendicular, so as to improve the stability of chip fixation.

[0059] As an example, please refer to Figure 5 、 Figure 6a 、 Figure 6b 、 Figure 6c and Figure 6d In one embodiment of the present application, a non-slip material is provided on the surface of the third sidewall 33 near the fourth sidewall 34; and a non-slip material (not shown) is provided on the surface of the fourth sidewall 34 near the third sidewall 33. This increases friction between a chip secured between the third and fourth sidewalls 33, 34, and the third and fourth sidewalls 33, 34, thereby improving chip fixation stability. The non-slip material may include non-slip sand or rubber-plastic non-slip fiber.

[0060] In one embodiment of the present application, a chip testing device is provided, comprising a support box and a chip carrier assembly according to any embodiment of the present application; the support box is configured to support a test circuit board; the chip carrier assembly is configured to secure a chip to the upper surface of the test circuit board; and the test circuit board is configured to provide test signals to the chip for testing. The chip testing device of this embodiment can test chips of different types, shapes, and sizes without replacing the chip carrier assembly, thereby improving chip testing efficiency and reducing the cost of testing multiple chip types.

[0061] In one embodiment of the present application, a chip testing method is provided, comprising:

[0062] Loading the chip into any chip carrier assembly described in any embodiment of the present application and securing it;

[0063] placing the connection terminals of the chip in contact with the upper surface of the test circuit board located in the support box, and rotating the rotatable vertical rod until its bottom surface contacts the top surface of the chip;

[0064] The test circuit board is controlled to provide a test signal to the chip to test the chip.

[0065] The chip testing method in the above embodiment can test chips of different types, shapes and volumes without replacing the chip carrier assembly, thereby improving chip testing efficiency while reducing the testing cost of multiple types of chips.

[0066] For the specific definition of the chip testing method in the above embodiment, please refer to the definition of the chip carrier component above, which will not be repeated here.

[0067] Please note that the above embodiments are for illustrative purposes only and are not intended to limit the present application.

[0068] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0069] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A chip carrier assembly, characterized in that: Used to hold chips of different sizes, including: a rotatable vertical rod, on which a gear with gear teeth surrounding the rotatable vertical rod is provided; A crossbeam, in which a first through hole and a first sliding groove are provided in the same direction as the extension of the crossbeam; a first side wall, the top of which is connected to a first connecting rod, wherein the first connecting rod is located in the first sliding groove; a second side wall spaced apart from the first side wall and configured to secure a chip therebetween; a top portion of the second side wall being connected to a second connecting rod; the second connecting rod being spaced apart from the first connecting rod and positioned within the first sliding groove; a side of the first connecting rod adjacent to the second connecting rod being provided with a plurality of first tooth grooves arranged in a linear pattern; The rotatable vertical rod is used to rotate in the first through hole to drive the gear to rotate, so that the gear teeth of the gear engage with the first tooth groove, thereby driving the first side wall to move relatively closer to or away from the second side wall; The chip carrier assembly further includes: a third side wall, the top of which is connected to a third connecting rod, the third connecting rod passing through the crossbeam and the first through hole via a second chute provided on the crossbeam, the second chute being spaced apart from the first chute, and extending in a direction perpendicular to the direction of extension of the first chute; a fourth sidewall, spaced apart from the third sidewall, for fixing a chip located therebetween; a top of the fourth sidewall being connected to a fourth connecting rod, the fourth connecting rod being spaced apart from the third connecting rod and located within the second sliding groove; a side of the third connecting rod adjacent to the fourth connecting rod being provided with a plurality of third tooth grooves arranged in a linear pattern; The rotatable vertical rod is further configured to rotate in the first through hole, driving the gear to rotate so that the gear teeth engage with the third tooth grooves, thereby driving the third side wall to move relatively closer to or away from the fourth side wall.

2. The chip carrier assembly according to claim 1, characterized in that: The second connecting rod is provided with a plurality of second tooth grooves arranged in a linear shape on a side surface close to the first connecting rod; The gear teeth of the gear are further configured to engage with the second tooth groove to drive the second side wall to move relatively closer to or away from the first side wall.

3. The chip carrier assembly according to claim 2, characterized in that: The first tooth groove and the second tooth groove extend in the same direction; The gear is further configured to rotate between the first tooth groove and the second tooth groove, so that the gear teeth engage with the first tooth groove and the second tooth groove at the same time, thereby simultaneously driving the first side wall and the second side wall to move closer to or farther away from each other.

4. The chip carrier assembly according to any one of claims 1 to 3, characterized in that: The surface of the first side wall close to the second side wall is provided with an anti-slip material; A surface of the second side wall close to the first side wall is provided with an anti-slip material.

5. The chip carrier assembly according to claim 1, wherein: The side of the fourth connecting rod close to the third connecting rod is provided with a plurality of fourth tooth grooves arranged in a linear shape; The gear teeth of the gear are further configured to engage with the fourth tooth groove to drive the fourth side wall to move relatively closer to or away from the third side wall.

6. The chip carrier assembly according to claim 5, characterized in that: The fourth tooth groove has the same extension direction as the third tooth groove; The gear is further configured to rotate between the third tooth groove and the fourth tooth groove, so that the gear teeth engage with the third tooth groove and the fourth tooth groove at the same time, thereby simultaneously driving the third side wall and the fourth side wall to move closer to or farther away from each other.

7. The chip carrier assembly according to claim 6, characterized in that: The surface of the third side wall close to the fourth side wall is provided with an anti-slip material; A surface of the fourth side wall close to the third side wall is provided with an anti-slip material.

8. The chip carrier assembly according to any one of claims 1 to 3, characterized in that: The gear is arranged at the middle portion of the rotatable vertical rod; The bottom surface of the rotatable vertical rod is used to contact the top surface of the chip.

9. The chip carrier assembly according to claim 8, characterized in that: An elastic body is provided on the bottom surface of the rotatable vertical rod, and the elastic body is used for elastically contacting with the top surface of the chip.

10. The chip carrier assembly according to any one of claims 1 to 3, characterized in that: A handle is provided on the top of the rotatable vertical rod.

11. A chip testing device, characterized in that: include: A support box for carrying a test circuit board; as well as The chip carrier assembly according to any one of claims 1 to 10, used for fixing the chip on the upper surface of the test circuit board; The test circuit board is used to provide a test signal to the chip to test the chip.

12. A chip testing method, characterized in that: include: Loading the chip into the chip carrier assembly according to any one of claims 1 to 10 and fixing it; placing the connection terminals of the chip in contact with the upper surface of the test circuit board located in the support box, and rotating the rotatable vertical rod until its bottom surface contacts the top surface of the chip; The test circuit board is controlled to provide a test signal to the chip to test the chip.

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