IGBT overtemperature control method and device in cooking appliance and cooking appliance

Abstract

The present invention provides a method and device for overtemperature control of an IGBT in a cooking appliance, and the cooking appliance. The method comprises: obtaining the temperature of the IGBT in real time during the cooking appliance's heating process; determining, when the IGBT's temperature meets a preset overtemperature control condition, whether the IGBT's temperature falls within a temperature threshold range; and adjusting the cooking appliance's heating parameters according to a temperature control strategy that matches the temperature threshold range to achieve phased overtemperature control of the IGBT. The present invention effectively controls IGBT overtemperature and ensures normal operation of the heating function during the adjustment and control period, thus preventing IGBT overheating while maintaining a good cooking effect.

Description

Technical Field

[0001] The present invention relates to the technical field of household appliances, and in particular to an over-temperature control method and device for an IGBT in a cooking appliance, and the cooking appliance. Background Art

[0002] As a core component of electromagnetic heating cooking appliances, IGBTs (Integrated Gate Bipolar Transistors) play a vital role in their proper operation, such as in IGBT electromagnetic heating rice cookers. During operation, cooking appliances encounter numerous operating conditions, such as high ambient temperatures and unstable power grids. These conditions can cause the IGBT to overheat and initiate over-temperature protection, resulting in the appliance malfunctioning and ultimately failing to cook. This wastes resources and poses a significant risk of burnout and fire, posing a significant threat to property and personal safety. Therefore, effectively preventing IGBT overheating and ensuring the proper operation of the heating process to complete cooking is an urgent issue that needs to be addressed. Summary of the Invention

[0003] The present invention proposes an IGBT over-temperature control method, device and cooking appliance in a cooking appliance to solve the technical problem in the prior art that the cooking appliance cannot work normally due to the IGBT over-temperature protection, and ultimately cannot complete the task of cooking ingredients.

[0004] In one aspect of the present invention, a method for controlling overtemperature of an IGBT in a cooking appliance is provided, the method comprising:

[0005] During the heating process of the cooking appliance, the temperature of the IGBT is obtained in real time;

[0006] When the temperature of the IGBT meets a preset over-temperature control condition, determining a temperature threshold range to which the temperature of the IGBT belongs;

[0007] The heating parameters of the cooking appliance are adjusted according to a temperature control strategy that matches the temperature threshold range, so as to achieve staged over-temperature control of the IGBT.

[0008] Furthermore, the method further comprises:

[0009] When the temperature of the IGBT is greater than or equal to a preset first temperature threshold, determining that the temperature of the IGBT meets a preset over-temperature control condition;

[0010] When the temperature of the IGBT is greater than or equal to a preset first temperature threshold and less than a preset second temperature threshold, it is determined that the temperature of the IGBT belongs to the first temperature threshold range;

[0011] When the temperature of the IGBT is greater than or equal to a preset second temperature threshold, determining that the temperature of the IGBT belongs to the second temperature threshold range;

[0012] The first temperature threshold and the second temperature threshold are determined according to the over-temperature protection temperature set by the IGBT.

[0013] Furthermore, adjusting the heating parameters of the cooking appliance according to a temperature control strategy matching the temperature threshold range includes:

[0014] If the temperature of the IGBT falls within a first temperature threshold range, obtaining the temperatures of the top and bottom of the inner cavity of the cooking utensil;

[0015] Determining whether the temperature of the top of the inner cavity is greater than or equal to a preset third temperature threshold, and whether the temperature of the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold; the third temperature threshold is less than the fourth temperature threshold;

[0016] When the temperature of the IGBT falls within a first temperature threshold range, the temperature at the top of the inner cavity is greater than or equal to a preset third temperature threshold, and the temperature at the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold, a preset first calculation model is used to calculate a first target heating parameter of the cooking appliance, and a first-stage adjustment is performed based on the first target heating parameter.

[0017] Furthermore, the first target heating parameter includes: a first heating power and a first heating extension time;

[0018] The first calculation model is:

[0019] P1 = P0 * {1 - [(TG0 - TG1) / TG1]}, T01 = [1 - (P1 / P0)] * heating time set by the heating function of the cooking appliance;

[0020] Among them, P1 represents the first heating power, P0 represents the current heating power of the cooking appliance obtained in real time, TG0 represents the IGBT temperature obtained in real time, TG1 represents the preset first temperature threshold, and T01 represents the first heating extension time.

[0021] Furthermore, the method further comprises:

[0022] If the temperature of the IGBT falls within a second temperature threshold range, obtaining the temperatures of the top and bottom of the inner cavity of the cooking utensil;

[0023] Determining whether the temperature at the top of the inner cavity is greater than or equal to a preset third temperature threshold, and whether the temperature at the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold;

[0024] When the temperature of the IGBT falls within the second temperature threshold range, the temperature at the top of the inner cavity is greater than or equal to a preset third temperature threshold, and the temperature at the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold, heating is stopped and the step of obtaining the temperature of the IGBT in real time is continued.

[0025] Furthermore, the method further comprises:

[0026] When the temperature of the IGBT falls within the second temperature threshold range, and the temperature of the top of the inner cavity is lower than the preset third temperature threshold, and / or the temperature of the bottom of the inner cavity is lower than the preset fourth temperature threshold, a preset second calculation model is used to calculate the second target heating parameter of the cooking appliance, and a second stage adjustment is performed based on the second target heating parameter.

[0027] Furthermore, the second target heating parameter includes: a second heating power and a second heating extension time;

[0028] The second calculation model is:

[0029] P2 = P0 * {1 - [(TG0 - TG2) / TG2]}, T02 = [1 - (P2 / P0)] * heating time set by the heating function of the cooking appliance;

[0030] Among them, P2 represents the second heating power, P0 represents the current heating power of the cooking appliance obtained in real time, TG0 represents the IGBT temperature obtained in real time, TG2 represents the preset second temperature threshold, and T02 represents the second heating extension time.

[0031] Furthermore, the first temperature threshold TG1 = 0.65*Z, and the second temperature threshold TG2 = 0.85*Z, wherein Z is the temperature at which the IGBT reports over-temperature protection.

[0032] Another aspect of the present invention provides an over-temperature control device for an IGBT in a cooking appliance, the device comprising:

[0033] An acquisition module is used to obtain the temperature of the IGBT in real time during the heating process of the cooking appliance;

[0034] A judgment module, configured to judge whether the temperature of the IGBT belongs to a temperature threshold range when the temperature of the IGBT meets a preset over-temperature control condition;

[0035] A control module is used to adjust the heating parameters of the cooking appliance according to a temperature control strategy that matches the temperature threshold range, so as to achieve staged over-temperature control of the IGBT.

[0036] In addition, the present invention also proposes a cooking appliance, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the over-temperature control method for the IGBT in the cooking appliance as described above are implemented.

[0037] Embodiments of the present invention provide a method, device, and cooking appliance for overtemperature control of an IGBT in a cooking appliance. These methods acquire the IGBT's temperature in real time during the cooking appliance's heating process. When the IGBT's temperature meets a preset overtemperature control condition, the cooking appliance's heating parameters are adjusted according to a temperature control strategy that matches the temperature threshold range within which the IGBT's temperature falls, thereby achieving phased overtemperature control of the IGBT. This method effectively controls IGBT overtemperature and ensures normal heating operation during this adjustment and control period, preventing IGBT overheating while also ensuring optimal cooking results.

[0038] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. The drawings are only used to illustrate preferred implementation methods and are not considered to be limitations of the present invention.

[0040] Figure 1 This is a flow chart of an over-temperature control method for an IGBT in a cooking appliance according to an embodiment of the present invention;

[0041] Figure 2 This is a flow chart of a specific method for over-temperature control of an IGBT in a cooking appliance according to an embodiment of the present invention;

[0042] Figure 3 This is a structural diagram of an IGBT over-temperature control device in a cooking appliance according to an embodiment of the present invention. DETAILED DESCRIPTION

[0043] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention without creative work are within the scope of protection of the present invention.

[0044] A method for handling IGBT over-temperature anomalies proposed in an embodiment of the present invention monitors the temperature of the IGBT and establishes a multi-level control gradient; combines the temperature changes at the top and bottom of the inner cavity of the cooking appliance at different gradients to fully judge whether the temperature of the IGBT can support continued operation; makes a graded judgment on the over-temperature of the IGBT, and executes a preset temperature control strategy according to the level of over-temperature, so as to achieve effective control and adjustment of the temperature rise of the IGBT in stages; at the same time, it can also perform buffering processing when the IGBT is about to overheat, rather than simply controlling the electromagnetic heating cooking appliance to stop heating, so that the IGBT over-temperature anomaly has the possibility of self-recovery, thereby ensuring the normal operation of the heating function and further ensuring the cooking effect of the food.

[0045] Figure 1 FIG1 shows a flow chart of an over-temperature control method of an IGBT in a cooking appliance according to an embodiment of the present invention. Figure 1 As shown, the over-temperature control method of the IGBT in the cooking appliance proposed in the embodiment of the present invention includes the following steps:

[0046] S11. During the heating process of the cooking appliance, the temperature of the IGBT is obtained in real time.

[0047] S12: When the temperature of the IGBT meets a preset over-temperature control condition, determine whether the temperature of the IGBT belongs to a temperature threshold range.

[0048] In an embodiment of the present invention, when the temperature of the IGBT is greater than or equal to a preset first temperature threshold, it is determined that the temperature of the IGBT meets a preset temperature over-temperature control condition; when the temperature of the IGBT is greater than or equal to the preset first temperature threshold and less than a preset second temperature threshold, it is determined that the temperature of the IGBT belongs to the first temperature threshold range; when the temperature of the IGBT is greater than or equal to the preset second temperature threshold, it is determined that the temperature of the IGBT belongs to the second temperature threshold range; wherein, the first temperature threshold and the second temperature threshold are determined according to the over-temperature protection temperature set for the IGBT.

[0049] S13 . Adjust the heating parameters of the cooking appliance according to a temperature control strategy that matches the temperature threshold range, so as to achieve staged over-temperature control of the IGBT.

[0050] In an embodiment of the present invention, the heating parameters of the cooking appliance are adjusted according to a temperature control strategy that matches the temperature threshold range, including: if the temperature of the IGBT belongs to the first temperature threshold range, obtaining the temperatures of the top and bottom of the inner cavity of the cooking appliance; determining whether the temperature of the top of the inner cavity is greater than or equal to a preset third temperature threshold, and whether the temperature of the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold; the third temperature threshold is less than the fourth temperature threshold.

[0051] In an embodiment of the present invention, when the temperature of the IGBT falls within a first temperature threshold range, and the temperature at the top of the inner cavity is greater than or equal to a preset third temperature threshold, and the temperature at the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold, a preset first calculation model is used to calculate the first target heating parameter of the cooking appliance, and a first stage adjustment is performed based on the first target heating parameter.

[0052] Among them, the first target heating parameter includes: a first heating power and a first heating extension time; the first calculation model is: P1=P0*{1-[(TG0-TG1) / TG1]}, T01=[1-(P1 / P0)]*heating time set by the heating function of the cooking appliance; wherein P1 represents the first heating power, P0 represents the current heating power of the cooking appliance obtained in real time, TG0 represents the IGBT temperature obtained in real time, TG1 represents the preset first temperature threshold, and T01 represents the first heating extension time.

[0053] In an embodiment of the present invention, if the temperature of the IGBT falls within the second temperature threshold range, the temperatures of the top and bottom of the inner cavity of the cooking utensil are obtained; it is determined whether the temperature of the top of the inner cavity is greater than or equal to a preset third temperature threshold, and whether the temperature of the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold; the third temperature threshold is less than the fourth temperature threshold.

[0054] In an embodiment of the present invention, when the temperature of the IGBT falls within the second temperature threshold range, and the temperature at the top of the inner cavity is greater than or equal to a preset third temperature threshold, and the temperature at the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold, heating is stopped and the step of obtaining the temperature of the IGBT in real time is continued.

[0055] In an embodiment of the present invention, when the temperature of the IGBT falls within the second temperature threshold range, and the temperature of the top of the inner cavity is lower than the preset third temperature threshold, and / or the temperature of the bottom of the inner cavity is lower than the preset fourth temperature threshold, a preset second calculation model is used to calculate the second target heating parameter of the cooking appliance, and a second stage adjustment is performed based on the second target heating parameter.

[0056] Among them, the second target heating parameter includes: a second heating power and a second heating extension time; the second calculation model is: P2=P0*{1-[(TG0-TG2) / TG2]}, T02=[1-(P2 / P0)]*heating time set by the heating function of the cooking appliance; wherein P2 represents the second heating power, P0 represents the current heating power of the cooking appliance obtained in real time, TG0 represents the IGBT temperature obtained in real time, TG2 represents the preset second temperature threshold, and T02 represents the second heating extension time.

[0057] In an embodiment of the present invention, the preset first temperature threshold TG1 is set to 0.65*Z, and the preset second temperature threshold TG2 is set to 0.85*Z, where Z is the temperature at which the IGBT triggers over-temperature protection. It is understood that the temperature at which the IGBT triggers over-temperature protection can be set to 100°C in practical applications. The specific temperature thresholds for over-temperature protection can be set differently for different types of products as needed, and this is not specifically limited in the present invention. In this embodiment, the preset first temperature threshold TG1 is set to 65% of the over-temperature protection temperature threshold, and TG2 is set to 85% of the over-temperature protection temperature threshold, which can prevent the impact of residual heat on the temperature rise of the IGBT.

[0058] The over-temperature control method of the IGBT in the cooking appliance proposed in an embodiment of the present invention obtains the temperature of the IGBT in real time during the heating process of the cooking appliance; when the temperature of the IGBT meets the preset temperature over-temperature control condition, the heating parameters of the cooking appliance are adjusted according to a temperature control strategy that matches the temperature threshold range to which the temperature of the IGBT belongs, so as to achieve staged over-temperature control of the IGBT. The present invention can effectively control the over-temperature of the IGBT and ensure the normal operation of the heating function during the adjustment and control period, thereby avoiding over-temperature of the IGBT while ensuring the cooking effect of the food.

[0059] Figure 2 FIG. 1 is a flow chart showing a specific method for over-temperature control of an IGBT in a cooking appliance according to an embodiment of the present invention. Figure 2 As shown, in a specific embodiment, the temperature rise of the IGBT can be monitored by setting multiple temperature monitoring points, wherein: Figure 2 TG0 shown represents the temperature of the IGBT chip monitored in real time, TT0 represents the temperature of the top of the cooking utensil cavity monitored in real time, and TB0 represents the temperature of the bottom of the cooking utensil cavity monitored in real time. The setting of the temperature monitoring points can be freely set according to needs, and the present invention does not make specific limitations.

[0060] In an embodiment of the present invention, when the cooking appliance activates its heating function, it operates according to a predetermined program and records the current heating power P0 in real time. During the heating process, the cooking appliance obtains the IGBT temperature TG0 in real time, determines the relationship between TG0 and a preset first temperature threshold TG1, and determines whether the IGBT temperature satisfies a preset overtemperature control condition. Furthermore, determines the relationship between TG0 and a preset second temperature threshold TG2 to determine the temperature threshold range within which the IGBT temperature falls. When TG0 ≥ TG1, the IGBT temperature is determined to satisfy the preset overtemperature control condition. When TG1 ≤ TG0 < TG2, the IGBT temperature is determined to fall within the preset first temperature threshold range. When TG0 ≥ TG2, the IGBT temperature is determined to fall within the preset second temperature threshold range.

[0061] In this embodiment, when TG0 falls within a preset first temperature threshold range, the cooking appliance inner cavity top temperature TT0 and the inner cavity bottom temperature TB0 are detected. If TT0 ≥ TT1 and TB0 ≥ TB1 are detected, it can be considered that the cooking appliance inner cavity temperature is high at this time, and the IGBT will enter an overtemperature state during the subsequent heating process. At this time, the heating power is adjusted to be reduced to the first heating power P1. Due to the reduced heating power, in order to ensure that the heating function can provide sufficient heat to the food, the heating function is adjusted to continue the first heating time extension T01 minute to perform the first stage adjustment;

[0062] In this embodiment, when TG0 falls within the preset second temperature threshold range, the top temperature TT0 of the inner cavity of the cooking utensil and the bottom temperature TB0 of the inner cavity are detected. When it is detected that TT0≥TT1 and TB0≥TB1, it can be considered that the inner cavity temperature of the cooking utensil is high and the IGBT is already in an overtemperature state. Therefore, heating is stopped immediately and TG0 is continuously detected during this period; when it is detected that TT0≤TT1 and / or TB0≤TB1, it can be considered that the inner cavity temperature of the cooking utensil is not high and its heat dissipation is good. At this time, the heating power is adjusted to the second heating power P2. Due to the reduction in heating power, in order to ensure that the heating function can provide sufficient heat to the food, the heating function is adjusted to continue running the second heating extension time T02 minutes to perform the second stage adjustment.

[0063] Among them, the heating power P0 can be 1200W. In actual applications, different products have different heating power settings; the TT1 is the preset third temperature threshold, which can be set to 85°C, and the TB1 is the preset fourth temperature threshold, which can be set to 90°C. When TT0 ≥ 85°C and TB0 ≥ 90°C, it can be considered that the temperature of the cooking cavity is high, indicating that the food contained in the cooking cavity is close to boiling. At this time, the IGBT temperature rises most rapidly.

[0064] In this embodiment, the first heating power P1 and the first heating extension time T01 are calculated according to a preset first calculation model, including: P1 = P0*{1-[(TG0-TG1) / TG1]}, T01 = [1-

[0065] (P1 / P0)]*the heating time set by the heating function of the cooking appliance; for example, P0=1200W, TG0=100°C, TG1=65°C, the first heating power P1=1200*{1-[(100-65) / 65]}=552W; for example, the heating time of the cooking appliance's original heating function is 10 minutes, the current heating power of the cooking appliance obtained in real time P0=1000W, after the over-temperature adjustment is performed and the heating power drops to 800W, the first heating extension time T01 of the heating function is now T01=(1-(800 / 1000)*10=2 minutes.

[0066] In this embodiment, the second heating power P2 and the second heating extension time T02 are calculated according to a preset second calculation model, including: P2 = P0*{1-[(TG0-TG2) / TG2]}, T02 = [1-

[0067] (P2 / P0)]*The heating time set by the heating function of the cooking appliance; since the second calculation model only adjusts the first temperature threshold to the second temperature threshold for calculation relative to the first calculation model, the relevant calculation process is basically similar to that of the first calculation model, and the present invention will not be further illustrated here.

[0068] It is understandable that the adjustment of the heating power is calculated based on the difference between the IGBT temperature obtained in real time and the temperature threshold. The larger the difference, the more the adjusted power value is reduced.

[0069] The embodiment of the present invention obtains the temperature values monitored by multiple temperature monitoring points in real time, and adopts a preset temperature control strategy matching different temperature ranges to perform staged over-temperature control on the IGBT. Compared with the technical defect in the prior art that the cooking appliance stops heating after triggering the over-temperature protection, resulting in the cooking appliance being unable to complete the task of cooking the ingredients, the present invention can not only effectively control the over-temperature of the IGBT, but also ensure the normal operation of the heating function during the adjustment and control period to ensure the cooking effect of the ingredients; in addition, by setting multiple temperature monitoring points, it can also realize zoned monitoring of the temperature rise of the IGBT, improve the accuracy of the temperature monitoring and adjustment process, and thus achieve precise temperature control of the IGBT.

[0070] For simplicity of description, the method embodiments are described as a series of actions. However, those skilled in the art should be aware that the embodiments of the present invention are not limited by the order of the actions described, because certain steps can be performed in other orders or simultaneously according to the embodiments of the present invention. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0071] Figure 3 FIG. 1 shows a structural diagram of an IGBT over-temperature control device in a cooking appliance according to an embodiment of the present invention. Figure 3 As shown, the device includes a functional module for implementing the over-temperature control method of the IGBT in the cooking appliance as described in the above embodiment.

[0072] Specifically, it includes an acquisition module 201, a judgment module 202 and a control module 203, wherein:

[0073] The acquisition module 201 is used to obtain the temperature of the IGBT in real time during the heating process of the cooking appliance.

[0074] The judgment module 202 is configured to judge whether the temperature of the IGBT belongs to a temperature threshold range when the temperature of the IGBT meets a preset over-temperature control condition.

[0075] The control module 203 is configured to adjust the heating parameters of the cooking appliance according to a temperature control strategy that matches the temperature threshold range, so as to achieve phased over-temperature control of the IGBT.

[0076] In an embodiment of the present invention, the judgment module 202 is specifically used to determine that the temperature of the IGBT meets a preset temperature over-temperature control condition when the temperature of the IGBT is greater than or equal to a preset first temperature threshold; when the temperature of the IGBT is greater than or equal to the preset first temperature threshold and less than a preset second temperature threshold, determine that the temperature of the IGBT belongs to the first temperature threshold range; when the temperature of the IGBT is greater than or equal to the preset second temperature threshold, determine that the temperature of the IGBT belongs to the second temperature threshold range; wherein, the first temperature threshold and the second temperature threshold are determined according to the over-temperature protection temperature set for the IGBT.

[0077] In an embodiment of the present invention, the acquisition module 201 is also used to obtain the temperatures of the top and bottom of the inner cavity of the cooking utensil when the temperature of the IGBT falls within the first temperature threshold range; the judgment module 202 is also used to judge whether the temperature of the top of the inner cavity is greater than or equal to a preset third temperature threshold, and whether the temperature of the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold; the third temperature threshold is less than the fourth temperature threshold.

[0078] The control module 203 is specifically used to calculate the first target heating parameter of the cooking appliance using a preset first calculation model when the temperature of the IGBT falls within the first temperature threshold range, the temperature at the top of the inner cavity is greater than or equal to the preset third temperature threshold, and the temperature at the bottom of the inner cavity is greater than or equal to the preset fourth temperature threshold, and perform a first-stage adjustment based on the first target heating parameter.

[0079] In an embodiment of the present invention, the acquisition module 201 is further used to obtain the temperatures of the top and bottom of the inner cavity of the cooking utensil when the temperature of the IGBT falls within the second temperature threshold range; the judgment module 202 is further used to judge whether the temperature of the top of the inner cavity is greater than or equal to a preset third temperature threshold, and whether the temperature of the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold; the third temperature threshold is less than the fourth temperature threshold.

[0080] The control module 203 is further configured to stop heating and continue executing the step of obtaining the temperature of the IGBT in real time when the temperature of the IGBT falls within the second temperature threshold range, the temperature at the top of the inner cavity is greater than or equal to a preset third temperature threshold, and the temperature at the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold.

[0081] The control module 203 is also used to calculate the second target heating parameter of the cooking appliance using a preset second calculation model when the temperature of the IGBT falls within the second temperature threshold range, and the temperature of the top of the inner cavity is lower than the preset third temperature threshold, and / or the temperature of the bottom of the inner cavity is lower than the preset fourth temperature threshold, and perform a second stage adjustment based on the second target heating parameter.

[0082] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0083] In addition, an embodiment of the present invention further provides a cooking appliance, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the steps of the above-mentioned method for controlling overtemperature of an IGBT in a cooking appliance are implemented. Figure 1 Alternatively, when the processor executes the computer program, the functions of each module / unit in the embodiment of the over-temperature control device for IGBT in the cooking appliance are realized, for example Figure 3 The acquisition module 201, the judgment module 202 and the control module 203 are shown.

[0084] In this embodiment, the cooking appliance further includes at least three sets of temperature sensing devices. For example, these may be temperature sensing components integrated into an IGBT chip for monitoring the temperature of the IGBT chip, or temperature sensing packages located at the top and bottom of the cooking appliance's internal cavity for monitoring the temperatures of the top and bottom of the cooking appliance's internal cavity. The choice of temperature sensing devices and their specific installation locations can be freely determined as needed and are not specifically limited by the present invention.

[0085] Embodiments of the present invention provide a method, device, and cooking appliance for controlling overtemperature of an IGBT in a cooking appliance. These methods utilize real-time acquisition of the IGBT's temperature during the cooking appliance's heating process. When the IGBT's temperature meets a preset overtemperature control condition, the method determines whether the IGBT's temperature falls within a temperature threshold range. The method then adjusts the cooking appliance's heating parameters based on a temperature control strategy that matches the temperature threshold range, thereby achieving phased overtemperature control of the IGBT. This method effectively controls IGBT overtemperature and ensures normal heating operation during this adjustment and control period, preventing IGBT overheating while also ensuring optimal cooking results.

[0086] In addition, by setting multiple temperature monitoring points, the present invention can also monitor the temperature rise of the IGBT in different zones, improve the accuracy of the temperature monitoring and adjustment process, and thus achieve precise temperature control of the IGBT.

[0087] Those skilled in the art will appreciate that although some embodiments herein include certain features included in other embodiments but not other features, the combination of features from different embodiments is intended to be within the scope of the present invention and to form different embodiments. For example, in the claims, any one of the claimed embodiments may be used in any combination.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A method for controlling overtemperature of an IGBT in a cooking appliance, characterized in that: The method comprises: During the heating process of the cooking appliance, the temperature of the IGBT is acquired in real time; when the temperature of the IGBT meets a preset over-temperature control condition, the temperature threshold range to which the temperature of the IGBT belongs is determined; and the heating parameters of the cooking appliance are adjusted according to a temperature control strategy that matches the temperature threshold range to achieve staged over-temperature control of the IGBT; When the temperature of the IGBT is greater than or equal to a preset first temperature threshold, it is determined that the temperature of the IGBT meets a preset over-temperature control condition; when the temperature of the IGBT is greater than or equal to the preset first temperature threshold and less than a preset second temperature threshold, it is determined that the temperature of the IGBT belongs to a first temperature threshold range; when the temperature of the IGBT is greater than or equal to a preset second temperature threshold, it is determined that the temperature of the IGBT belongs to a second temperature threshold range; Adjusting a heating parameter of the cooking appliance according to a temperature control strategy that matches the temperature threshold range includes: if the temperature of the IGBT falls within a first temperature threshold range, obtaining the temperatures of a top portion and a bottom portion of an inner cavity of the cooking appliance; determining whether the temperature of the top portion of the inner cavity is greater than or equal to a preset third temperature threshold, and whether the temperature of the bottom portion of the inner cavity is greater than or equal to a preset fourth temperature threshold; the third temperature threshold is less than a fourth temperature threshold; when the temperature of the IGBT falls within the first temperature threshold range, and the temperature of the top portion of the inner cavity is greater than or equal to the preset third temperature threshold, and the temperature of the bottom portion of the inner cavity is greater than or equal to the preset fourth temperature threshold, calculating a first target heating parameter of the cooking appliance using a preset first calculation model, and performing a first-stage adjustment based on the first target heating parameter; The first target heating parameter includes: a first heating power and a first heating extension time; the first calculation model is: P1 = P0*{1-[(TG0-TG1) / TG1]}, T01 = [1-(P1 / P0)]*the heating time set by the heating function of the cooking appliance; wherein, P1 represents the first heating power, P0 represents the current heating power of the cooking appliance obtained in real time, TG0 represents the IGBT temperature obtained in real time, TG1 represents the preset first temperature threshold, and T01 represents the first heating extension time.

2. The method according to claim 1, characterized in that The method further comprises: If the temperature of the IGBT falls within a second temperature threshold range, obtaining the temperatures of the top and bottom of the inner cavity of the cooking utensil; Determining whether the temperature at the top of the inner cavity is greater than or equal to a preset third temperature threshold, and whether the temperature at the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold; When the temperature of the IGBT falls within the second temperature threshold range, the temperature at the top of the inner cavity is greater than or equal to a preset third temperature threshold, and the temperature at the bottom of the inner cavity is greater than or equal to a preset fourth temperature threshold, heating is stopped and the step of obtaining the temperature of the IGBT in real time is continued.

3. The method according to claim 2, characterized in that The method further comprises: When the temperature of the IGBT falls within a second temperature threshold range, and the temperature of the top of the inner cavity is lower than a preset third temperature threshold, and / or the temperature of the bottom of the inner cavity is lower than a preset fourth temperature threshold, a second target heating parameter of the cooking appliance is calculated using a preset second calculation model, and a second-stage adjustment is performed based on the second target heating parameter. The second target heating parameters include: a second heating power and a second heating extension time; the second calculation model is: P2 = P0*{1-[(TG0-TG2) / TG2]}, T02 = [1-(P2 / P0)]*the heating time set by the heating function of the cooking appliance; wherein, P2 represents the second heating power, P0 represents the current heating power of the cooking appliance obtained in real time, TG0 represents the IGBT temperature obtained in real time, TG2 represents the preset second temperature threshold, and T02 represents the second heating extension time.

4. The method according to any one of claims 1 to 3, characterized in that The first temperature threshold TG1 = 0.65*Z, and the second temperature threshold TG2 = 0.85*Z, wherein Z is the temperature at which the IGBT reports over-temperature protection.

5. An IGBT over-temperature control device in a cooking appliance, used to control the implementation of the method according to claim 1, characterized in that: The device comprises: An acquisition module is used to obtain the temperature of the IGBT in real time during the heating process of the cooking appliance; a judgment module is used to judge whether the temperature of the IGBT belongs to a temperature threshold range when the temperature of the IGBT meets a preset temperature over-temperature control condition; A control module is used to adjust the heating parameters of the cooking appliance according to a temperature control strategy that matches the temperature threshold range, so as to achieve staged over-temperature control of the IGBT.

6. A cooking utensil, characterized in that: The method comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method according to any one of claims 1 to 4 when executing the computer program.

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