Heat reflection temperature calculation method, system, device and terminal equipment

Abstract

This application is applicable to the field of microthermography technology and provides a method, system, apparatus, and terminal device for calculating heat reflection temperature. The method includes: obtaining a reference temperature of the device under test when it is not powered on, a color camera reference image, and a color camera measurement image at the temperature to be measured, as well as a first color camera image at a first preset temperature and a second color camera image at a second preset temperature; vectorizing the color camera reference image, the color camera measurement image, the first color camera image, and the second color camera image to obtain a reference vector, a measurement vector, a first vector, and a second vector; and obtaining the temperature to be measured based on the first preset temperature, the second preset temperature, the reference temperature, the first vector, the second vector, the reference vector, and the measurement vector. This application can simultaneously measure the temperature of different materials.

Description

Technical Field

[0001] The present application belongs to the field of microthermal imaging technology, and in particular relates to a method, system, device and terminal equipment for calculating heat reflection temperature. Background Art

[0002] Existing single-wavelength thermal reflection temperature calculations require selecting monochromatic light of appropriate wavelength based on the target material, which makes it difficult to measure the temperature of multiple materials simultaneously.

[0003] There are also proposals for using dual- or multi-wavelength light sources in conjunction with color cameras. These solutions require filtering or modulation and demodulation to obtain measurement signals at each wavelength. These solutions require multiple light sources or color cameras, as well as the necessary hardware for filtering and modulation, resulting in relatively high costs. Summary of the Invention

[0004] The embodiments of the present application provide a heat reflection temperature calculation method, system, apparatus, and terminal device to achieve temperature measurement of different materials without increasing cost and complexity.

[0005] This application is achieved through the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a method for calculating heat reflection temperature, comprising:

[0007] A reference temperature of the device under test when it is not powered on, a reference image of the color camera, a measurement image of the color camera at the temperature to be measured, a first image of the color camera at a first preset temperature, and a second image of the color camera at a second preset temperature are acquired.

[0008] Vectorize the color camera reference image to obtain a reference vector.

[0009] The color camera measurement image is vectorized to obtain the measurement vector.

[0010] Vectorization is performed on the first image of the color camera to obtain a first vector.

[0011] Vectorization is performed on the second image of the color camera to obtain a second vector.

[0012] A temperature to be measured is obtained based on the first preset temperature, the second preset temperature, the reference temperature, the first vector, the second vector, the reference vector and the measurement vector.

[0013] In combination with the first aspect, in some possible implementations, the color camera first image, the color camera second image, the color camera reference image, and the color camera measurement image are the results of a single exposure of the color camera or the result of multi-frame averaging.

[0014] In conjunction with the first aspect, in some possible implementations, vectorization processing is performed on the color camera reference image to obtain a reference vector, specifically including:

[0015] Extract the readings of the three channels R, G, and B in the color camera reference image to obtain the reference vector, which is:

[0016] The vectorization processing process of the measurement vector, the first vector and the second vector is the same as the vectorization processing process of the reference vector.

[0017] In conjunction with the first aspect, in some possible implementations, the temperature to be measured is: Where T r is the reference temperature, is the measurement vector, is the reference vector, is the first vector, is the second vector, T1 is the first preset temperature, and T2 is the second preset temperature.

[0018] In conjunction with the first aspect, in some possible implementations, vectorization processing is performed on the color camera reference image to obtain a reference vector, specifically including:

[0019] Extract the readings of the three channels R, G, and B in the color camera reference image, normalize the readings of the three channels, and obtain the reference vector. The reference vector is: in,

[0020] The vectorization processing process of the measurement vector, the first vector and the second vector is the same as the vectorization processing process of the reference vector.

[0021] In conjunction with the first aspect, in some possible implementations, the temperature to be measured is: Where T r is the reference temperature, is the measurement vector, is the reference vector, is the first vector, is the second vector, T1 is the first preset temperature, and T2 is the second preset temperature.

[0022] In a second aspect, an embodiment of the present application provides a thermal reflection temperature calculation system, comprising: a color camera, a broadband light source, a temperature control platform, a three-axis nano-displacement platform, a computer, and an optical platform.

[0023] The temperature control platform is located on the three-axis nano-displacement platform and can place the device under test. It is used to control the temperature of the device under test and input temperature information into the computer. The temperature information includes a reference temperature, a first preset temperature and a second preset temperature.

[0024] The color camera is used to capture images of the device under test, obtain image data of the device under test, and input the image data of the device under test into a computer. The image data information of the device under test includes a color camera reference image, a color camera measurement image, a color camera first image, and a color camera second image.

[0025] The broadband light source generates broadband light, and the broadband light is directed directly to the device under test.

[0026] The three-axis nano-displacement stage is placed on the optical platform and is used to control the movement of the device under test.

[0027] The computer implements the heat reflection temperature calculation method as described in any one of the first aspects based on the temperature information and the image data information of the device under test.

[0028] The computer is also used to control the temperature control stage to adjust the temperature and control the movement of the three-axis nano-displacement stage.

[0029] In a third aspect, an embodiment of the present application provides a heat reflection temperature calculation device, comprising:

[0030] The measurement module is used to obtain the reference temperature of the device under test when it is not powered on, the color camera reference image, and the color camera measurement image at the temperature to be measured, as well as the color camera first image at a first preset temperature and the color camera second image at a second preset temperature.

[0031] The vectorization processing module is used to perform vectorization processing on the color camera reference image to obtain a reference vector; perform vectorization processing on the color camera measurement image to obtain a measurement vector; perform vectorization processing on the color camera first image to obtain a first vector; and perform vectorization processing on the color camera second image to obtain a second vector.

[0032] The calculation module is used to obtain the temperature to be measured based on the first preset temperature, the second preset temperature, the reference temperature, the first vector, the second vector, the reference vector and the measurement vector.

[0033] In a fourth aspect, an embodiment of the present application provides a terminal device, comprising: a processor and a memory, the memory being used to store a computer program, and the processor implementing the heat reflection temperature calculation method as described in any one of the first aspects when executing the computer program.

[0034] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the heat reflection temperature calculation method as described in any one of the first aspects is implemented.

[0035] In a sixth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on a terminal device, the terminal device executes the heat reflection temperature calculation method described in any one of the first aspects above.

[0036] It can be understood that the beneficial effects of the second to sixth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0037] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0038] This application calibrates the thermal reflectance coefficient of the device under test using a first vector and a second vector to obtain a more accurate thermal reflectance coefficient. Vectorized processing is performed on multiple images captured by a color camera to obtain readings of the three color channels (R, G, and B) corresponding to the images. The measured temperature is calculated using the readings of the three color channels of the multiple images. Compared with the measured temperature calculated using a monochrome camera, this application provides more accurate results. The use of a color camera in this application enriches the information contained in the obtained images. When measuring the temperature of multiple materials simultaneously, the application provides better adaptability to different measured materials and more reliable calculation results.

[0039] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 1 is a flow chart of a method for calculating heat reflection temperature provided in one embodiment of the present application;

[0042] Figure 2 This is a schematic diagram of a heat reflection temperature calculation system provided in one embodiment of the present application;

[0043] Figure 3 This is a schematic structural diagram of a heat reflection temperature calculation device provided in one embodiment of the present application;

[0044] Figure 4 It is a structural diagram of a terminal device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0045] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0046] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0047] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0048] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0049] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0050] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0051] Figure 1 This is a schematic flow chart of a heat reflection temperature calculation method provided in an embodiment of the present application, referring to Figure 1 , the calculation method of the heat reflection temperature is described in detail as follows:

[0052] Step 101 : obtaining a reference temperature of a device under test when it is not powered on, a reference image of a color camera, a measurement image of a color camera at a temperature to be measured, a first image of the color camera at a first preset temperature, and a second image of the color camera at a second preset temperature.

[0053] Exemplarily, the first image captured by the color camera, the second image captured by the color camera, the reference image captured by the color camera, and the measurement image captured by the color camera are the result of a single exposure or the result of averaging multiple frames.

[0054] Step 102: Vectorize the color camera reference image to obtain a reference vector. Vectorize the color camera measurement image to obtain a measurement vector. Vectorize the color camera first image to obtain a first vector. Vectorize the color camera second image to obtain a second vector.

[0055] Exemplarily, vectorizing the color camera reference image to obtain a reference vector specifically includes:

[0056] Extract the readings of the three channels R, G, and B in the color camera reference image to obtain the reference vector, which is:

[0057] Exemplarily, performing vectorization processing on the color camera reference image to obtain a reference vector may specifically include:

[0058] Extract the readings of the three channels R, G, and B in the color camera reference image, normalize the readings of the three channels, and obtain the reference vector. The reference vector is: in,

[0059] The vectorization processing process of the measurement vector, the first vector and the second vector is the same as the vectorization processing process of the reference vector.

[0060] Specifically, normalizing the readings of the three channels can suppress the influence of intensity drift.

[0061] Step 103 : obtaining a temperature to be measured based on the first preset temperature, the second preset temperature, the reference temperature, the first vector, the second vector, the reference vector, and the measurement vector.

[0062] For example, the temperature to be measured is: Where T r is the reference temperature, is the measurement vector, is the reference vector, is the first vector, is the second vector, T1 is the first preset temperature, and T2 is the second preset temperature.

[0063] Exemplarily, the temperature to be measured may also be: Where T r is the reference temperature, is the measurement vector, is the reference vector, is the first vector, is the second vector, T1 is the first preset temperature, and T2 is the second preset temperature.

[0064] Optional, Figure 2 This is a structural schematic diagram of a heat reflection temperature calculation system provided in one embodiment of the present application. As shown in the figure, the heat reflection temperature calculation system includes: a color camera 201, a broadband light source 202, a temperature control platform 203, a three-axis nano-displacement platform 204, a computer 205 and an optical platform 206.

[0065] The temperature control stage 203 is located on the three-axis nano-displacement stage 204 and can be used to place the device under test. It is used to control the temperature of the device under test and input temperature information into the computer 205. The temperature information includes a reference temperature, a first preset temperature, and a second preset temperature. The color camera 201 is used to capture images of the device under test, obtain image data of the device under test, and input the image data of the device under test into the computer 205. The image data of the device under test includes a color camera reference image, a color camera measurement image, a color camera first image, and a color camera second image. The broadband light source 202 generates broadband light that directly illuminates the device under test. The three-axis nano-displacement stage 204 is placed on the optical platform 206 and is used to control the movement of the device under test. The computer 205 executes the steps of any of the above-described methods for calculating the thermal reflection temperature based on the temperature information and the image data of the device under test. The computer 205 is also used to control the temperature adjustment of the temperature control stage 203 and the movement of the three-axis nano-displacement stage 204.

[0066] Specifically, the broadband light source 202 may also be a white light LED, a halogen lamp, a supercontinuum light source, or the like.

[0067] The above-mentioned thermal reflection temperature calculation method calibrates the thermal reflection coefficient of the device under test through the first vector and the second vector to obtain a more accurate thermal reflection coefficient. The vectorization processing of the multiple images captured by the color camera can respectively obtain the readings of the three color channels R, G and B corresponding to the images. The temperature to be measured is calculated by the readings of the three color channels of the multiple images. Compared with the temperature to be measured calculated by the monochrome camera, the results of this application are more accurate. The use of the color camera in this application makes the information contained in the obtained image itself richer. When measuring the temperature on multiple materials at the same time, it has better adaptability to different materials under test and the calculation results are more reliable. Moreover, there is no need to add or replace color cameras and wide-spectrum light sources when measuring the temperature of different materials, and there is no increase in cost and complexity. In addition, normalizing the readings of the three channels can also suppress the influence of intensity drift.

[0068] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0069] Corresponding to the transient heat reflection test method described in the above embodiment, Figure 3 A structural block diagram of a transient thermal reflection testing device provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0070] See also Figure 3 The transient thermal reflection testing device in the embodiment of the present application may include an acquisition module 301, a vectorization processing module 302 and a calculation module 303.

[0071] Optionally, the measurement module 301 is used to obtain a reference temperature of the device under test when it is not powered on, a color camera reference image, and a color camera measurement image at the temperature to be measured, as well as a first image of the color camera at a first preset temperature and a second image of the color camera at a second preset temperature.

[0072] Exemplarily, the first image captured by the color camera, the second image captured by the color camera, the reference image captured by the color camera, and the measurement image captured by the color camera are the result of a single exposure or the result of averaging multiple frames.

[0073] Optionally, the vectorization processing module 302 is used to perform vectorization processing on the color camera reference image to obtain a reference vector; perform vectorization processing on the color camera measurement image to obtain a measurement vector; perform vectorization processing on the color camera first image to obtain a first vector; and perform vectorization processing on the color camera second image to obtain a second vector.

[0074] Exemplarily, the vectorization processing module 302 is specifically used to extract the readings of the three channels R, G and B in the color camera reference image to obtain a reference vector, which is: Exemplarily, the vectorization processing module 302 may be further configured to extract readings of the three channels R, G, and B in the color camera reference image, perform normalization processing on the readings of the three channels, and obtain a reference vector, where the reference vector is: in,

[0075] The vectorization processing process of the measurement vector, the first vector and the second vector is the same as the vectorization processing process of the reference vector.

[0076] Optionally, the calculation module 303 is configured to obtain the temperature to be measured based on the first preset temperature, the second preset temperature, the reference temperature, the first vector, the second vector, the reference vector, and the measurement vector.

[0077] For example, the temperature to be measured is: Where T r is the reference temperature, is the measurement vector, is the reference vector, is the first vector, is the second vector, T1 is the first preset temperature, and T2 is the second preset temperature.

[0078] Exemplarily, the temperature to be measured may also be: Where T r is the reference temperature, is the measurement vector, is the reference vector, is the first vector, is the second vector, T1 is the first preset temperature, and T2 is the second preset temperature.

[0079] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiment of this application. Their specific functions and technical effects can be found in the method embodiment section and will not be repeated here.

[0080] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0081] The present application also provides a terminal device. Figure 4 The terminal device 500 may include: at least one processor 510 and a memory 520, wherein the memory 520 is used to store a computer program, and the processor 510 is used to call and run the computer program stored in the memory 520 to implement the steps in any of the above-mentioned method embodiments, for example Figure 1 Steps 101 to 103 in the embodiment shown. Alternatively, when the processor 510 executes the computer program, the functions of the modules / units in the above-mentioned device embodiments are realized, for example Figure 3 Functions of modules 301 to 303 are shown.

[0082] For example, the computer program may be divided into one or more modules / units, one or more modules / units being stored in the memory 520 and executed by the processor 510 to complete the present application. The one or more modules / units may be a series of computer program segments capable of completing specific functions, and the program segments are used to describe the execution process of the computer program in the terminal device 500.

[0083] Those skilled in the art will understand that Figure 4 These are merely examples of terminal devices and do not constitute a limitation on the terminal devices. The terminal devices may include more or fewer components than shown in the figure, or a combination of certain components, or different components, such as input and output devices, network access devices, buses, etc.

[0084] The processor 510 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0085] The memory 520 can be an internal storage unit of the terminal device or an external storage device of the terminal device, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. The memory 520 is used to store the computer program and other programs and data required by the terminal device. The memory 520 can also be used to temporarily store data that has been output or is about to be output.

[0086] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus. Buses can be classified into address buses, data buses, and control buses. For ease of illustration, the buses in the drawings of this application are not limited to just one bus or just one type of bus.

[0087] The transient thermal reflection test method provided in the embodiment of the present application can be applied to transient thermal reflection testing, computers, wearable devices, vehicle-mounted devices, tablet computers, laptops, netbooks, mobile phones and other terminal devices. The embodiment of the present application does not impose any restrictions on the specific type of terminal device.

[0088] An embodiment of the present application further provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the steps in each embodiment of the above-mentioned transient thermal reflection test method can be implemented.

[0089] An embodiment of the present application provides a computer program product. When the computer program product is run on a mobile terminal, the mobile terminal can implement the steps in each embodiment of the above-mentioned transient thermal reflection test method when executing the computer program product.

[0090] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, it can implement the steps of the above-mentioned various method embodiments. Among them, the computer program includes computer program code, which can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the camera / terminal device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunications signal and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk.

[0091] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0092] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0093] In the embodiments provided in this application, it should be understood that the disclosed devices / network equipment and methods can be implemented in other ways. For example, the device / network equipment embodiments described above are merely illustrative. For example, the division of the modules or units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0094] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0095] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A method for calculating heat reflection temperature, characterized in that: include: Acquire a reference temperature of the device under test when it is not powered on, a reference image of the color camera, and a measurement image of the color camera at a temperature to be measured, as well as a first image of the color camera at a first preset temperature and a second image of the color camera at a second preset temperature; Performing vectorization processing on the color camera reference image to obtain a reference vector; performing vectorization processing on the color camera measurement image to obtain a measurement vector; Performing vectorization processing on the first image of the color camera to obtain a first vector; performing vectorization processing on the second image of the color camera to obtain a second vector; A temperature to be measured is obtained based on the first preset temperature, the second preset temperature, the reference temperature, the first vector, the second vector, the reference vector, and the measurement vector.

2. The heat reflection temperature calculation method according to claim 1, wherein: The color camera first image, the color camera second image, the color camera reference image, and the color camera measurement image are the results of a single exposure of an image captured by the color camera or the results of multi-frame averaging.

3. The heat reflection temperature calculation method according to claim 1, wherein: The vectorization processing of the color camera reference image to obtain a reference vector specifically includes: Extract the readings of the three channels R, G and B in the color camera reference image to obtain the reference vector, which is: The vectorization processing process of the measurement vector, the first vector and the second vector is the same as the vectorization processing process of the reference vector.

4. The heat reflection temperature calculation method according to claim 3, wherein: The temperature to be measured is: Where T r is the reference temperature, is the measurement vector, is the reference vector, is the first vector, is the second vector, T1 is the first preset temperature, and T2 is the second preset temperature.

5. The heat reflection temperature calculation method according to claim 1, wherein: The vectorization processing of the color camera reference image to obtain a reference vector specifically includes: Extract the readings of the three channels R, G and B in the color camera reference image, normalize the readings of the three channels, and obtain the reference vector. The reference vector is: in, The vectorization processing process of the measurement vector, the first vector and the second vector is the same as the vectorization processing process of the reference vector.

6. The heat reflection temperature calculation method according to claim 5, characterized in that: The temperature to be measured is: Where T r is the reference temperature, is the measurement vector, is the reference vector, is the first vector, is the second vector, T1 is the first preset temperature, and T2 is the second preset temperature.

7. A heat reflection temperature calculation system, characterized in that: include: Color camera, broadband light source, temperature control stage, three-axis nano-displacement stage, computer and optical platform; The temperature control platform is located on the three-axis nano-displacement platform, can be used to place the device under test, and is used to control the temperature of the device under test and input temperature information into the computer, wherein the temperature information includes a reference temperature, a first preset temperature, and a second preset temperature; The color camera is used to capture an image of the device under test, obtain image data of the device under test, and input the image data of the device under test into the computer, wherein the image data information of the device under test includes a color camera reference image, a color camera measurement image, a color camera first image, and a color camera second image; The broadband light source generates broadband light, and the broadband light directly irradiates the device under test; The three-axis nano-displacement stage is placed on the optical platform and is used to control the movement of the device under test; The computer implements the method according to any one of claims 1 to 6 based on the temperature information and the image data information of the device under test; The computer is also used to control the temperature control stage to adjust the temperature and control the three-axis nano-displacement stage to move.

8. A heat reflection temperature calculation device, characterized in that: include: A measurement module is configured to obtain a reference temperature of the device under test when it is not powered on, a reference image of the color camera, and a measurement image of the color camera at a temperature to be measured, as well as a first image of the color camera at a first preset temperature and a second image of the color camera at a second preset temperature; a vectorization processing module, configured to perform vectorization processing on the color camera reference image to obtain a reference vector; perform vectorization processing on the color camera measurement image to obtain a measurement vector; perform vectorization processing on the color camera first image to obtain a first vector; and perform vectorization processing on the color camera second image to obtain a second vector; A calculation module is configured to obtain a temperature to be measured based on the first preset temperature, the second preset temperature, the reference temperature, the first vector, the second vector, the reference vector, and the measurement vector.

9. A terminal device, characterized in that: include: A processor and a memory, the memory being used to store a computer program, the processor being used to call and run the computer program stored in the memory to implement the heat reflection temperature calculation method according to any one of claims 1 to 6.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the heat reflection temperature calculation method according to any one of claims 1 to 6 is implemented.

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