A debonding apparatus applicable to wafers of various sizes

Abstract

The application discloses a debonding device applicable to wafers of multiple sizes, which comprises a base, a supporting frame fixedly installed on the top of the base, a separation box fixedly installed on the top of the supporting frame, a pressing mechanism arranged on the top of the supporting frame, a clamping plate fixedly installed on the output end of the pressing mechanism, a groove arranged on the bottom of the clamping plate, a supporting seat fixedly installed on the top of the base, a heating plate arranged on the top of the supporting seat, and a suction mechanism and an air-drying mechanism arranged on the top of the base. The first liquid inlet pipe and the second liquid inlet pipe are used for conveniently feeding the bonding adhesive dissolvent or clean water into the separation box, so that the wafers with large sizes are subjected to debonding, and then are cleaned. The heating plate is used for heating the separation box, so that the clean water in the separation box is heated, heat is transferred to the connecting position of the carrier and the wafer, and then the wafers with small sizes are subjected to debonding, thereby avoiding the influence of the long heating time on the bonding between the wafers.

Description

Technical Field

[0001] This invention relates to the field of wafer fabrication technology, and more particularly to a debonding device applicable to wafers of various sizes. Background Technology

[0002] A wafer is a silicon chip used to fabricate silicon semiconductor circuits. Wafer bonding is a process that combines two wafers together and fixes them through chemical and physical means. After bonding is completed, the wafer needs to be separated from the substrate supporting it. The wafer and the substrate are usually bonded together with bonding adhesive.

[0003] However, due to the different sizes of wafers, using the same debonding method can easily lead to an increase in the scrap rate. Furthermore, if the wafer and the carrier are separated by dragging, the carrier may cause scratches on the bottom surface of the wafer. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a debonding device applicable to wafers of various sizes, thus solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A debonding device applicable to wafers of various sizes includes a base, a support frame fixedly mounted on the top of the base, a separation box fixedly mounted on the top of the support frame, a pressing mechanism provided on the top of the support frame, a clamping plate fixedly mounted on the output end of the pressing mechanism, a groove provided on the bottom of the clamping plate, a support seat fixedly mounted on the top of the base, a heating plate provided on the top of the support seat, an adsorption mechanism and a drying mechanism provided on the top of the base, and a platform fixedly mounted on the top of the base.

[0007] Preferably, the separation chamber is equipped with a temperature sensor and a liquid level sensor. The top of the separation chamber is fixedly connected to a first liquid inlet pipe and a second liquid inlet pipe via a fixing plate. The bottom of the separation chamber is fixedly connected to a liquid outlet pipe. The top of the base is provided with a through groove, which is located below the liquid outlet pipe, so as to facilitate the rapid discharge of liquid inside the separation chamber through the liquid outlet pipe.

[0008] Preferably, the pressing mechanism includes a first electric push rod, a sliding sleeve, a first motor, a threaded rod, a slider, and a connecting rod. The first electric push rod is fixedly installed on the top of the support frame. The free end of the first electric push rod is fixedly installed with a sliding sleeve via a connecting seat. The first motor is fixedly installed on one side wall of the sliding sleeve. The output end of the first motor is fixedly connected to a threaded rod. A slider is threadedly installed on the surface of the threaded rod. A connecting rod is fixedly installed on the front side wall of the slider.

[0009] Preferably, the threads on both sides of the middle part of the threaded rod have opposite directions, the number of sliders is two sets, and the two sets of sliders are symmetrically arranged about the threaded rod. The sliders are fitted to the inner wall of the sleeve, which facilitates the stable opposite movement of the two sets of sliders in the sleeve.

[0010] Preferably, the support base is located below the separation box, and the top of the heating plate is fitted to the bottom of the separation box, so that the heating plate can quickly transfer heat to the separation box.

[0011] Preferably, the adsorption mechanism includes a vacuum pump, a first pipe, a second pipe, a second motor, and a second electric push rod. The vacuum pump is mounted on the top of the base. The output end of the vacuum pump is fixedly connected to the first pipe. The free end of the first pipe is fixedly connected to the second pipe. An adsorption cover is mounted on the free end of the second pipe. The second motor is fixedly mounted on the top of the base. The output end of the second motor is fixedly connected to the second electric push rod. The second electric push rod is fixedly connected to the second pipe via a limiting ring, which facilitates control of the movement of the adsorption cover to remove the wafer.

[0012] Preferably, the air-drying mechanism includes an air box, a protective net, a fan, and a third pipe. The air box is fixedly installed on the top of the base, the protective net is embedded in the front side wall of the air box, the fan is installed inside the air box, and the third pipe is fixedly connected to the rear side wall of the air box.

[0013] Preferably, the first pipe is a flexible pipe to avoid affecting the operation of the second electric push rod and the second motor. The second and third pipes are both rigid pipes, and valves are provided on the surface of the first, second, and third pipes to facilitate the control of the opening and closing of the first, second, and third pipes.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: This debonding equipment is applicable to wafers of various sizes. Temperature and level sensors monitor the temperature and level of the solution in the separation chamber in real time, thereby controlling the solution to precisely immerse the connection between the carrier and the wafer. The first and second inlet pipes facilitate the introduction of bonding adhesive solvent or purified water into the separation chamber, enabling the debonding of larger wafers. After debonding, cleaning is performed. A first electric push rod moves the sliding sleeve, and a first motor drives a threaded rod to rotate. The threaded rod drives a slider to slide within the sliding sleeve, thereby controlling the movement of two sets of clamping plates to hold carriers of different sizes. The separation chamber is fixed and pressed to a limit. The heating plate heats the water inside the separation chamber, which transfers heat to the connection between the carrier and the wafer, thereby debonding the smaller wafers. This avoids excessive heating time from affecting the bonding between the wafers. A vacuum pump draws air to cause the adsorption cover at the second pipe to adsorb and fix the wafer. The second electric push rod lifts the second pipe, and the second motor rotates the second electric push rod to remove the wafer from the top of the carrier, avoiding scratches on the bottom surface of the wafer. The wafer is then moved stably to the placement platform, where a fan blows air to dry the wafer through the third pipe. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the orthogonal isometric structure of the present invention;

[0016] Figure 2 This is a side view of the structure of the present invention;

[0017] Figure 3 This is a schematic diagram of the structure in a first partial cross-section of the present invention;

[0018] Figure 4 This is a schematic diagram of the second partial cross-section of the present invention.

[0019] In the diagram: 1. Base; 2. Support frame; 3. Separation box; 4. Temperature sensor; 5. Liquid level sensor; 6. First inlet pipe; 7. Second inlet pipe; 8. Outlet pipe; 9. First electric push rod; 10. Sliding sleeve; 11. First motor; 12. Threaded rod; 13. Sliding block; 14. Connecting rod; 15. Clamping plate; 16. Groove; 17. Support seat; 18. Heating plate; 19. Vacuum pump; 20. First pipe; 21. Second pipe; 22. Second motor; 23. Second electric push rod; 24. Platform; 25. Bellows; 26. Protective net; 27. Fan; 28. Third pipe. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example: Refer to Figure 1-4A debonding device applicable to wafers of various sizes includes a base 1, a support frame 2 fixedly mounted on the top of the base 1, and a separation chamber 3 fixedly mounted on the top of the support frame 2. The separation chamber 3 is equipped with a temperature sensor 4 and a liquid level sensor 5. These sensors monitor the temperature and liquid level of the solution within the separation chamber 3 in real time, thereby controlling the solution to precisely submerge the junction between the carrier and the wafer. A first inlet pipe 6 and a second inlet pipe 7 are fixedly connected to the top of the separation chamber 3 via a fixing plate. These pipes facilitate the introduction of bonding adhesive solvent or purified water into the separation chamber 3, enabling the debonding of larger wafers and subsequent cleaning. An outlet pipe 8 is fixedly connected to the bottom of the separation chamber 3. The top of the base 1 has a through groove located below the liquid outlet pipe 8, facilitating the rapid discharge of liquid from the separator 3 through the liquid outlet pipe 8. The top of the support frame 2 is equipped with a pressing mechanism, which includes a first electric push rod 9, a sliding sleeve 10, a first motor 11, a threaded rod 12, a slider 13, and a connecting rod 14. The first electric push rod 9 is fixedly mounted on the top of the support frame 2. The free end of the first electric push rod 9 is fixedly mounted with the sliding sleeve 10 via a connecting seat. The first motor 11 is fixedly mounted on one side wall of the sliding sleeve 10. The output end of the first motor 11 is fixedly connected to the threaded rod 12. The threads on both sides of the middle section of the threaded rod 12 have opposite directions. Two sets of sliders 13 are threaded onto the surface of the threaded rod 12, and the two sets of sliders 13 are related to the threads. The rods 12 are symmetrically arranged, and the sliders 13 are fitted against the inner wall of the sliding sleeve 10, which facilitates the stable opposite movement of the two sets of sliders 13 within the sliding sleeve 10. A connecting rod 14 is fixedly installed on the front side wall of the slider 13, and a clamping plate 15 is fixedly installed at the output end of the pressing mechanism. The sliding sleeve 10 is moved by the first electric push rod 9, and the threaded rod 12 is rotated by the first motor 11. The threaded rod 12 drives the sliders 13 to slide within the sliding sleeve 10, thereby controlling the movement of the two sets of clamping plates 15 to clamp and fix different sized carrier plates and to press and limit their movement. A groove 16 is provided at the bottom of the clamping plate 15, and a support seat 17 is fixedly installed on the top of the base 1. A heating plate 18 is provided on the top of the support seat 17. The support seat 17 is located below the separation box 3, and the heating plate 18... The top of the base 1 is fitted to the bottom of the separation chamber 3, allowing the heating plate 18 to quickly transfer heat to the separation chamber 3. Heating the separation chamber 3 via the heating plate 18 raises the temperature of the purified water inside, transferring heat to the connection between the carrier and the wafer, thereby debonding smaller wafers and preventing excessive heating time from affecting the bonding between wafers. The top of the base 1 is equipped with an adsorption mechanism and a drying mechanism. The adsorption mechanism includes a vacuum pump 19, a first pipe 20, a second pipe 21, a second motor 22, and a second electric push rod 23. The top of the base 1 is equipped with a vacuum pump 19, the output end of which is fixedly connected to the first pipe 20. The free end of the first pipe 20 is fixedly connected to the second pipe 21, and the free end of the second pipe 21 is equipped with an adsorption cover.A second motor 22 is fixedly installed on the top of the base 1. A second electric push rod 23 is fixedly connected to the output end of the second motor 22. The second electric push rod 23 is fixedly connected to the second pipe 21 through a limiting ring, which facilitates the control of the adsorption hood movement and wafer removal. The drying mechanism includes a wind box 25, a protective net 26, a fan 27, and a third pipe 28. A wind box 25 is fixedly installed on the top of the base 1. A protective net 26 is embedded in the front side wall of the wind box 25. A fan 27 is installed inside the wind box 25. A third pipe 28 is fixedly connected to the rear side wall of the wind box 25. The first pipe 20 is a flexible pipe to prevent it from affecting the operation of the second electric push rod 23 and the second motor 22. The second pipe 21 and the third pipe... All three channels 28 are rigid pipes, and valves are installed on the surfaces of the first channel 20, the second channel 21, and the third channel 28 to facilitate the opening and closing of these channels. Airflow is generated by a fan 27, allowing air to dry the wafer through the third channel 28. A platform 24 is fixedly installed on the top of the base 1. Airflow is generated by a vacuum pump 19, causing the adsorption hood at the second channel 21 to adsorb and fix the wafer. The second channel 21 is then lifted by a second electric push rod 23, and a second motor 22 rotates the second electric push rod 23, thereby removing the wafer from the top of the wafer carrier, preventing scratches on the bottom surface of the wafer, and stably moving it onto the platform 24.

[0022] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that provides control.

[0023] In use: The operator places the carrier and wafer in the separation chamber 3. The first electric push rod 9 moves the sliding sleeve 10, and the first motor 11 drives the threaded rod 12 to rotate. The threaded rod 12 drives the slider 13 to slide within the sliding sleeve 10, thereby controlling the movement of the two sets of clamping plates 15. This allows the carrier to fit into the groove 16 of the clamping plate 15, clamping and fixing carriers of different sizes and pressing them to limit their movement. If the wafer size is small, clean water is introduced into the separation chamber 3. The liquid level sensor 5 detects the liquid level height, and the separation chamber 3 is heated by the heating plate 18, causing the clean water inside the separation chamber 3 to heat up and transfer heat to the connection between the carrier and the wafer. The temperature sensor 4 detects the water temperature in real time, quickly debonding the wafer. After the wafer and carrier are separated, the liquid is discharged through the outlet pipe. 8. The liquid is discharged, and the air is drawn by the vacuum pump 19 so that the adsorption hood at the second pipe 21 adsorbs and fixes the wafer. The second electric push rod 23 lifts the second pipe 21, and the second motor 22 makes the second electric push rod 23 rotate, thereby removing the wafer from the top of the carrier to avoid the carrier scratching the bottom surface of the wafer. It is then moved stably to the platform 24. The fan 27 is started to blow air, and the air passes through the third pipe 28 to dry the wafer on the platform 24. If the wafer size is large, bonding adhesive solvent is introduced into the separation box 3 and soaked for a long time until the wafer debonds. After the wafer is separated from the carrier, the bonding adhesive solvent is discharged, and clean water is introduced for cleaning. After the wastewater is discharged, the wafer is moved to the platform 24 to air dry.

[0024] In summary, this debonding equipment, applicable to wafers of various sizes, uses temperature sensor 4 and liquid level sensor 5 to monitor the temperature and liquid level of the solution in the separation chamber 3 in real time, thereby controlling the solution to precisely immerse the connection between the carrier and the wafer. The first inlet pipe 6 and the second inlet pipe 7 facilitate the introduction of bonding adhesive solvent or purified water into the separation chamber 3, enabling the debonding of larger wafers. After debonding, cleaning is performed. The first electric push rod 9 moves the sliding sleeve 10, and the first motor 11 drives the threaded rod 12 to rotate. The threaded rod 12 drives the slider 13 to slide within the sliding sleeve 10, thereby controlling the movement of the two sets of clamping plates 15 to clamp and fix carriers of different sizes and to press and limit their movement. The heating plate... 18. The separation chamber 3 is heated, causing the purified water inside the separation chamber 3 to heat up and transfer heat to the connection between the carrier and the wafer, thereby debonding the smaller wafers and avoiding excessive heating time that may affect the bonding between wafers. The vacuum pump 19 draws air to cause the adsorption cover at the second pipe 21 to adsorb and fix the wafer, and the second electric push rod 23 lifts the second pipe 21. The second motor 22 causes the second electric push rod 23 to rotate, thereby removing the wafer from the top of the carrier, avoiding scratches on the bottom surface of the wafer, and moving it stably to the placement platform 24. The fan 27 blows air to dry the wafer through the third pipe 28, solving the problems in the background art.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0026] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A debonding apparatus suitable for multiple size wafers, comprising a base (1), characterized in that, The top of the base (1) is fixedly installed with a support frame (2), the top of the support frame (2) is fixedly installed with a separation box (3), the top of the support frame (2) is provided with a pressing mechanism, the output end of the pressing mechanism is fixedly installed with a clamping plate (15), the bottom of the clamping plate (15) is provided with a groove (16), the top of the base (1) is fixedly installed with a support seat (17), the top of the support seat (17) is provided with a heating plate (18), the top of the base (1) is provided with a suction mechanism and an air drying mechanism, the top of the base (1) is fixedly installed with a storage platform (24), the inside of the separation box (3) is provided with a temperature sensor (4) and a liquid level sensor (5), the top of the separation box (3) is fixedly connected with a first liquid inlet pipe (6) and a second liquid inlet pipe (7) through a fixed plate, the bottom of the separation box (3) is fixedly connected with a liquid outlet pipe (8), the top of the base (1) is provided with a through groove, and the through groove is located below the liquid outlet pipe (8), the pressing mechanism comprises a first electric push rod (9), a sliding sleeve (10), a first motor (11), a threaded rod (12), a sliding block (13), and a connecting rod (14), the top of the support frame (2) is fixedly installed with the first electric push rod (9), the free end of the first electric push rod (9) is fixedly installed with the sliding sleeve (10) through a connecting seat, one side wall of the sliding sleeve (10) is fixedly installed with the first motor (11), the output end of the first motor (11) is fixedly connected with the threaded rod (12), the surface of the threaded rod (12) is threadedly installed with the sliding block (13), and the front side wall of the sliding block (13) is fixedly installed with the connecting rod (14).

2. The debonding apparatus for wafers of various sizes according to claim 1, wherein The middle portions of the threaded rods (12) are oppositely threaded, the number of the sliding blocks (13) is two groups, and the two groups of sliding blocks (13) are symmetrically arranged about the threaded rod (12), and the sliding block (13) is in abutment with the inner wall of the sliding sleeve (10).

3. The debonding apparatus for wafers of various sizes according to claim 1, wherein The support seat (17) is located below the separation box (3), and the top of the heating plate (18) is in abutment with the bottom of the separation box (3).

4. The debonding apparatus for wafers of various sizes according to claim 1, wherein The suction mechanism comprises a vacuum pump (19), a first pipeline (20), a second pipeline (21), a second motor (22), and a second electric push rod (23), the top of the base (1) is provided with the vacuum pump (19), the output end of the vacuum pump (19) is fixedly connected with the first pipeline (20), the free end of the first pipeline (20) is fixedly connected with the second pipeline (21), the free end of the second pipeline (21) is provided with a suction cover, the top of the base (1) is fixedly installed with the second motor (22), the output end of the second motor (22) is fixedly connected with the second electric push rod (23), and the second electric push rod (23) is fixedly connected with the second pipeline (21) through a limiting ring.

5. The debonding apparatus for multiple size wafers of claim 4, wherein, The air-drying mechanism comprises a wind box (25), a protective net (26), a fan (27) and a third pipeline (28), the top of the base (1) is fixedly provided with the wind box (25), the front side wall of the wind box (25) is inlaidly provided with the protective net (26), the inside of the wind box (25) is provided with the fan (27), and the rear side wall of the wind box (25) is fixedly connected with the third pipeline (28).

6. The debonding apparatus for multiple size wafers of claim 5, wherein, The first pipeline (20) is a soft pipeline, the second pipeline (21) and the third pipeline (28) are hard pipelines, and the surfaces of the first pipeline (20), the second pipeline (21) and the third pipeline (28) are all provided with valves.

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