Substrate cleaning device and substrate cleaning method

Abstract

The present invention relates to a substrate cleaning device and a substrate cleaning method. The central area of ​​the lower surface of a substrate held by a first holding portion is cleaned by contacting a cleaning tool with the central area of ​​the lower surface. The outer area of ​​the lower surface of a substrate is cleaned by contacting a cleaning tool with the outer area of ​​the lower surface of the substrate rotated by a second holding portion. When cleaning the central area of ​​the lower surface, the second holding portion is rotated around a vertical axis without holding the substrate. Alternatively, when cleaning the central area of ​​the lower surface, a gas ejection portion disposed between the cleaning tool and the second holding portion ejects gas toward the substrate from a first height that is only a specific distance away from the substrate, and when drying the central area of ​​the lower surface, the gas ejection portion ejects gas toward the substrate from a second height that is closer to the substrate than the first height.

Description

Technical Field

[0001] The present invention relates to a substrate cleaning device and a substrate cleaning method for cleaning a substrate. Background Art

[0002] Substrate processing equipment is used to perform various processes on various substrates, including FPD (Flat Panel Display) substrates used in liquid crystal displays and organic EL (Electro Luminescence) displays, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, mask substrates, ceramic substrates, and solar cell substrates. Substrate cleaning equipment is used to clean substrates.

[0003] For example, the substrate cleaning device described in Patent Gazette No. 5904169 includes two suction pads that hold the peripheral edge of the back side of a wafer, a rotating chuck that holds the center of the back side of the wafer, and a brush that cleans the back side of the wafer. The two suction pads hold the wafer and move it laterally. In this state, the center of the back side of the wafer is cleaned with a brush. Thereafter, the rotating chuck receives the wafer from the suction pads, holds the center of the back side of the wafer, and rotates. In this state, the peripheral edge of the back side of the wafer is cleaned with a brush. Summary of the Invention

[0004] In the substrate cleaning apparatus described in Patent No. 5904169, an air knife dries the backside of the wafer when transferring it to the spin chuck, ensuring dry contact between the spin chuck surface and the wafer backside. However, fully preventing the cleaning liquid from adhering to the spin chuck surface is difficult. When contaminated cleaning liquid adheres to the spin chuck surface, the spin chuck's cleanliness is reduced. Therefore, maintaining the spin chuck clean is essential.

[0005] An object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method capable of maintaining a substrate holding portion clean.

[0006] (1) According to one aspect of the present invention, a substrate cleaning device comprises: a first holding portion having a reference position for holding the substrate in a manner such that the center of the substrate is located at the reference position; a second holding portion configured to be rotatable around a vertical axis for holding the central area of ​​the lower surface of the substrate; a cleaning tool for cleaning the central area of ​​the lower surface by contacting the central area of ​​the lower surface of the substrate held by the first holding portion, and for cleaning the outer area of ​​the lower surface by contacting the outer area of ​​the lower surface surrounding the central area of ​​the lower surface of the substrate rotated by the second holding portion; and a movable table provided with the second holding portion and the cleaning tool for moving in a horizontal plane in a manner such that the second holding portion overlaps with the reference position of the first holding portion when the substrate is transferred between the first holding portion and the second holding portion, and the cleaning tool overlaps with the reference position of the first holding portion when the central area of ​​the lower surface is cleaned when the central area of ​​the lower surface is cleaned; and the second holding portion rotates without holding the substrate when the central area of ​​the lower surface is cleaned.

[0007] In the substrate cleaning apparatus of the invention, when cleaning the central area of ​​the substrate's lower surface, the cleaning tool is brought into contact with the central area of ​​the substrate's lower surface while the first holding portion holds the substrate with its center at a reference position. Furthermore, the second holding portion is rotated about a vertical axis without holding the substrate. When cleaning the outer areas of the substrate's lower surface, the cleaning tool is brought into contact with the outer areas of the substrate's lower surface while the second holding portion holds the central area of ​​the substrate's lower surface and the substrate is rotated about a vertical axis.

[0008] The second holding unit and cleaning tool are mounted on a movable stage. When transferring a substrate between the first and second holding units, the movable stage moves horizontally so that the second holding unit overlaps the reference position of the first holding unit when viewed from above. When cleaning the central area of ​​the lower surface, the movable stage moves horizontally so that the cleaning tool overlaps the reference position of the first holding unit when viewed from above.

[0009] According to this configuration, when cleaning the central area of ​​the substrate's lower surface, the second holding portion retreats to a position where it does not overlap the substrate. Furthermore, even if liquid containing contaminants scattered from the substrate adheres to the second holding portion, the liquid is shaken off the second holding portion by the rotation of the second holding portion. This allows the second holding portion to be kept clean.

[0010] (2) The substrate cleaning apparatus may further include a gas ejection unit, which is disposed between the cleaning tool and the second holding unit and ejects gas toward the substrate. In this case, when cleaning the central area of ​​the lower surface, the gas ejected from the gas ejection unit can prevent liquid containing contaminants from scattering from the substrate toward the second holding unit. Furthermore, the gas ejected from the gas ejection unit can efficiently dry the central area of ​​the lower surface. This prevents liquid from adhering to the second holding unit, thereby maintaining the second holding unit clean.

[0011] (3) The substrate cleaning apparatus further includes a linear guide rail extending in one direction in a horizontal plane, and the movable table can move linearly along the linear guide rail. In this case, the movable table can be moved in the horizontal plane with a simple structure.

[0012] (4) The rotation speed of the second holding portion during cleaning of the central area of ​​the lower surface can be above 500 rpm. In this case, the liquid attached to the second holding portion is thrown off from the second holding portion in a short time. Thus, the second holding portion can be kept clean more efficiently.

[0013] (5) According to another aspect of the present invention, the substrate cleaning device comprises: a first holding portion for holding a substrate; a second holding portion for holding a central area of ​​a lower surface of the substrate and rotating the substrate around a vertical axis; a cleaning tool for cleaning the central area of ​​the lower surface by contacting the central area of ​​the lower surface of the substrate held by the first holding portion, and cleaning the outer area of ​​the lower surface by contacting the outer area of ​​the lower surface surrounding the central area of ​​the lower surface of the substrate rotated by the second holding portion; and a gas ejection portion arranged to be movable up and down between the cleaning tool and the second holding portion, ejecting gas from a first height that is only a specific distance away from the substrate toward the substrate when cleaning the central area of ​​the lower surface, and ejecting gas from a second height that is closer to the substrate than the first height when drying the central area of ​​the lower surface.

[0014] In the substrate cleaning apparatus, when cleaning the central area of ​​the substrate's lower surface, a cleaning tool is brought into contact with the central area of ​​the substrate's lower surface while the substrate is held by a first holding portion. During cleaning of the central area of ​​the lower surface, a gas ejection portion disposed between the cleaning tool and the second holding portion ejects gas toward the substrate from a first height, a specific distance from the substrate. During drying of the central area of ​​the lower surface, the gas ejection portion ejects gas toward the substrate from a second height, closer to the substrate than the first height.

[0015] According to this configuration, when cleaning the central area of ​​the lower surface, the gas ejected from the gas ejection unit prevents liquid containing contaminants from scattering from the substrate toward the second holding unit. Furthermore, when drying the central area of ​​the lower surface, the gas ejection unit ejects gas toward the lower surface of the substrate while the substrate's lower surface is in close proximity to the gas ejection unit, effectively drying the central area of ​​the lower surface. This prevents liquid from adhering to the second holding unit, thereby maintaining the second holding unit clean.

[0016] (6) The second holding portion can be rotated without holding a substrate during cleaning of the central area of ​​the lower surface. With this configuration, even if liquid containing contaminants scattered from the substrate adheres to the second holding portion, the liquid is shaken off the second holding portion by the rotation of the second holding portion. This allows the second holding portion to be more reliably kept clean.

[0017] (7) The substrate cleaning apparatus may further include a common support portion for supporting the cleaning tool and the gas ejection portion. In this case, the cleaning tool and the gas ejection portion are moved in unison according to the position of the substrate. Thus, the lower surface of the substrate can be cleaned efficiently. In addition, since the gas ejection portion is configured to be movable up and down, even when the cleaning tool and the gas ejection portion are supported by a common support portion, the gas ejection portion can be brought closer to the substrate when drying the central area of ​​the lower surface of the substrate than when cleaning the central area of ​​the lower surface of the substrate. Thus, the lower surface of the substrate can be dried efficiently.

[0018] (8) According to another aspect of the present invention, the substrate cleaning method comprises: when cleaning the central area of ​​the lower surface of the substrate, holding the substrate by the first holding portion in such a manner that the center of the substrate is located at a reference position; when cleaning the central area of ​​the lower surface, rotating the second holding portion around the vertical axis without holding the substrate; when cleaning the central area of ​​the lower surface, bringing the cleaning tool into contact with the central area of ​​the lower surface of the substrate held by the first holding portion; when cleaning the outer area of ​​the lower surface of the substrate surrounding the central area of ​​the lower surface, holding the outer area of ​​the lower surface of the substrate by the second holding portion. The first holding portion holds the central area of ​​the lower surface of the substrate and rotates the substrate around a vertical axis; when cleaning the outer area of ​​the lower surface, the cleaning tool is brought into contact with the outer area of ​​the lower surface of the substrate rotated by the second holding portion; and when the substrate is transferred between the first holding portion and the second holding portion, the reference position of the second holding portion overlaps with the reference position of the first holding portion when viewed from above, and when cleaning the central area of ​​the lower surface, the cleaning tool overlaps with the reference position of the first holding portion when viewed from above.

[0019] According to the substrate cleaning method, when cleaning the central area of ​​the substrate's lower surface, the second holding portion retreats to a position where it does not overlap the substrate. Furthermore, even if liquid containing contaminants scattered from the substrate adheres to the second holding portion, the liquid is shaken off the second holding portion by the rotation of the second holding portion. This allows the second holding portion to be kept clean.

[0020] (9) The substrate cleaning method may further include ejecting gas toward the substrate via a gas ejection unit disposed between the cleaning tool and the second holding unit. In this case, the gas ejected from the gas ejection unit can prevent liquid containing contaminants from scattering from the substrate toward the second holding unit during cleaning of the central region of the lower surface. Furthermore, the gas ejected from the gas ejection unit can efficiently dry the central region of the lower surface. This prevents liquid from adhering to the second holding unit, thereby maintaining the second holding unit clean.

[0021] (10) Moving the movable pedestal in the horizontal plane may include moving the movable pedestal linearly along a linear guide rail extending in one direction in the horizontal plane. In this case, the movable pedestal can be moved in the horizontal plane with a simple structure.

[0022] (11) Rotating the second holding member about the vertical axis without holding the substrate may include rotating the second holding member at a rotational speed of 500 rpm or higher. In this case, liquid adhering to the second holding member is quickly removed from the second holding member. This allows the second holding member to be more efficiently kept clean.

[0023] (12) According to another aspect of the present invention, a substrate cleaning method includes: when cleaning the central area of ​​the lower surface of the substrate, holding the substrate by a first holding portion; when cleaning the central area of ​​the lower surface, making a cleaning tool contact the central area of ​​the lower surface of the substrate held by the first holding portion; when cleaning the outer area of ​​the lower surface of the substrate surrounding the central area of ​​the lower surface, holding the central area of ​​the lower surface of the substrate by a second holding portion and rotating the substrate around a vertical axis; when cleaning the outer area of ​​the lower surface, making the cleaning tool contact the outer area of ​​the lower surface of the substrate rotated by the second holding portion; and when cleaning the central area of ​​the lower surface, spraying gas toward the substrate from a first height that is only a specific distance away from the substrate by a gas ejection portion arranged between the cleaning tool and the second holding portion, and when drying the central area of ​​the lower surface, spraying gas toward the substrate from a second height that is closer to the substrate than the first height by the gas ejection portion.

[0024] According to the substrate cleaning method, when cleaning the central area of ​​the lower surface, the gas ejected from the gas ejection unit prevents liquid containing contaminants from scattering from the substrate toward the second holding unit. Furthermore, when drying the central area of ​​the lower surface, the gas ejection unit ejects gas toward the lower surface of the substrate while the lower surface of the substrate is in close proximity to the gas ejection unit, effectively drying the central area of ​​the lower surface. This prevents liquid from adhering to the second holding unit, thereby maintaining the second holding unit clean.

[0025] (13) The substrate cleaning method may further include rotating the second holding member about the vertical axis while not holding the substrate during cleaning of the central area of ​​the lower surface. With this configuration, even if liquid containing contaminants scattered from the substrate adheres to the second holding member, the liquid is shaken off the second holding member by the rotation of the second holding member. This allows the second holding member to be more reliably kept clean.

[0026] (14) The cleaning tool and the gas ejection unit can be supported by a common support. In this case, the cleaning tool and the gas ejection unit are moved in unison according to the position of the substrate. Therefore, the lower surface of the substrate can be cleaned efficiently. In addition, because the gas ejection unit is configured to be movable up and down, even when the cleaning tool and the gas ejection unit are supported by a common support, the gas ejection unit can be brought closer to the substrate when drying the central area of ​​the lower surface of the substrate than when cleaning the central area of ​​the lower surface of the substrate. Thus, the lower surface of the substrate can be dried efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to one embodiment of the present invention.

[0028] Figure 2 To express Figure 1 A three-dimensional appearance diagram of the internal structure of the substrate cleaning device.

[0029] Figure 3 This is a block diagram showing the structure of a control system of a substrate cleaning apparatus.

[0030] Figure 4 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0031] Figure 5 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0032] Figure 6 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0033] Figure 7 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0034] Figure 8 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0035] Figure 9 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0036] Figure 10 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0037] Figure 11 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0038] Figure 12 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0039] Figure 13 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0040] Figure 14 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0041] Figure 15 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0042] Figure 16 To express Figure 3 Flowchart of a substrate cleaning process of a control device.

[0043] Figure 17 To express Figure 3 Flowchart of a substrate cleaning process of a control device. DETAILED DESCRIPTION

[0044] The following describes a substrate cleaning apparatus according to an embodiment of the present invention using the accompanying drawings. In the following description, a substrate refers to a semiconductor substrate, a flat panel display (FPD) substrate such as a liquid crystal display (LCD) or organic EL (electroluminescence) display, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a mask substrate, a ceramic substrate, or a solar cell substrate. Furthermore, at least a portion of the substrate used in this embodiment has a circular outer periphery. For example, the outer periphery, excluding the positioning notch, has a circular shape.

[0045] (1) Configuration of substrate processing apparatus

[0046] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to one embodiment of the present invention. Figure 2 To express Figure 1 The external perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, mutually orthogonal X direction, Y direction and Z direction are defined to clarify the positional relationship. Figure 1 and Figure 2 In the specific figures below, the X direction, Y direction, and Z direction are indicated by arrows as appropriate. The X direction and the Y direction are perpendicular to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

[0047] like Figure 1 As shown, the substrate cleaning device 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an end cleaning device 80, and an opening and closing device 90. The above components are arranged in a unit housing 2. Figure 2 In FIG, the unit housing 2 is indicated by a dotted line.

[0048] The unit housing 2 has a rectangular bottom 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening serves as a loading and unloading port 2x for substrates W, and is used when loading and unloading substrates W into and out of the unit housing 2. Figure 2 In the figure, the loading / unloading port 2x is indicated by a thick dotted line. In the following description, the direction in the Y direction from the interior of the unit case 2 through the loading / unloading port 2x toward the outside of the unit case 2 (the direction from the side wall portion 2c toward the side wall portion 2b) is referred to as the front, and the opposite direction (the direction from the side wall portion 2b toward the side wall portion 2c) is referred to as the rear.

[0049] An opening and closing device 90 is provided in the portion of the side wall 2b where the loading and unloading port 2x is formed and in the vicinity thereof. The opening and closing device 90 includes a shutter 91 configured to open and close the loading and unloading port 2x and a shutter driving unit 92 for driving the shutter 91. Figure 2 In FIG, the shutter 91 is indicated by a thick two-dot chain line. The shutter driving unit 92 drives the shutter 91 so as to open the loading / unloading port 2x when loading and unloading substrates W into and out of the substrate cleaning apparatus 1. Furthermore, the shutter driving unit 92 drives the shutter 91 so as to close the loading / unloading port 2x when cleaning the substrate W in the substrate cleaning apparatus 1.

[0050] A pedestal device 30 is provided in the center of the bottom portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is arranged to extend in the Y direction from near the side wall 2b to near the side wall 2c when viewed from above. The movable pedestal 32 is arranged to be movable in the Y direction along the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction along the linear guide 31.

[0051] On the movable pedestal 32, the lower holding device 20 and the lower surface cleaning device 50 are arranged in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22. The suction holding unit 21 is a so-called spin chuck having a circular suction surface that can suction-hold the lower surface of the substrate W and is configured to rotate about an axis extending in the vertical direction (the Z-axis). In the following description, when the substrate W is suction-held by the suction holding unit 21, the area of ​​the lower surface of the substrate W that is to be suctioned by the suction holding unit 21 is referred to as the lower surface center area. On the other hand, the area of ​​the lower surface of the substrate W surrounding the lower surface center area is referred to as the lower surface outer area.

[0052] The suction and holding drive unit 22 includes a motor. The motor of the suction and holding drive unit 22 is mounted on the movable pedestal 32 with its rotational axis projecting upward. The suction and holding unit 21 is attached to the upper end of the rotational axis of the suction and holding drive unit 22. Furthermore, a suction path for suctioning and holding the substrate W in the suction and holding unit 21 is formed along the rotational axis of the suction and holding drive unit 22. This suction path is connected to a suction device (not shown). The suction and holding drive unit 22 rotates the suction and holding unit 21 about the rotational axis.

[0053] On the movable pedestal 32, a delivery device 40 is also provided near the lower holding device 20. The delivery device 40 includes a plurality of (3 in this example) support pins 41, a pin connecting component 42 and a pin lifting drive unit 43. The pin connecting component 42 is formed to surround the adsorption holding portion 21 when viewed from above, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward from the pin connecting component 42 by a certain length while being connected to each other by the pin connecting component 42. The pin lifting drive unit 43 raises and lowers the pin connecting component 42 on the movable pedestal 32. As a result, the plurality of support pins 41 are raised and lowered relative to the adsorption holding portion 21.

[0054] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, a lower surface brush lifting drive unit 55b, a lower surface brush moving drive unit 55c, and a gas lifting drive unit 55d. The moving support unit 55 is configured to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. Figure 2 As shown in FIG. 1 , a lifting support portion 54 is provided on the movable support portion 55 so as to be movable. The lifting support portion 54 has an upper surface 54u that is inclined obliquely downward in a direction away from the adsorption holding portion 21 (rearward in this example).

[0055] like Figure 1 As shown, the lower surface brush 51 has a circular shape when viewed from above and is relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the suction surface of the suction holding unit 21, for example, 1.3 times the diameter of the suction surface of the suction holding unit 21. Furthermore, the diameter of the lower surface brush 51 is larger than 1 / 3 and smaller than 1 / 2 the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0056] The lower surface brush 51 has a cleaning surface that can contact the lower surface of the substrate W. The lower surface brush 51 is mounted on the upper surface 54u of the lifting support portion 54 so that the cleaning surface faces upward and is rotatable about an axis extending in the vertical direction through the center of the cleaning surface.

[0057] The two liquid nozzles 52 are each mounted on the upper surface 54u of the lifting support 54 in such a manner that the liquid nozzles are located near the lower surface brush 51 and the liquid ejection ports are directed upward. Figure 3 The lower surface cleaning liquid supply unit 56 supplies cleaning liquid to the liquid nozzle 52. When the lower surface brush 51 cleans the substrate W, the liquid nozzle 52 ejects the cleaning liquid supplied from the lower surface cleaning liquid supply unit 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzle 52.

[0058] The gas ejection part 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas ejection part 53 is attached to the upper surface 54u of the lifting support part 54 so that the gas ejection port faces upward and is located between the lower surface brush 51 and the adsorption holding part 21 in a plan view. The ejection gas supply part 57 ( Figure 3 The ejection gas supply unit 57 supplies gas to the gas ejection unit 53 .

[0059] In this embodiment, an inert gas such as nitrogen is used as the gas supplied to the gas ejection unit 53. The gas supplied to the gas ejection unit 53 may also be other gases such as clean dry air (CDA). The gas ejection unit 53 ejects gas supplied from the ejection gas supply unit 57 onto the lower surface of the substrate W when the lower surface brush 51 cleans the substrate W, or when the lower surface of the substrate W is dried (described later). In this case, a strip-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction and holding unit 21.

[0060] The lower surface brush rotation drive unit 55a includes a motor, which rotates the lower surface brush 51 when the lower surface brush 51 cleans the substrate W. The lower surface brush lifting drive unit 55b includes a stepping motor or a cylinder, which lifts and lowers the lifting support unit 54 relative to the movable support unit 55. The lower surface brush moving drive unit 55c includes a motor, which moves the movable support unit 55 in the Y direction on the movable base 32. Here, the position of the lower side holding device 20 in the movable base 32 is fixed. Therefore, when the lower surface brush moving drive unit 55c moves the movable support unit 55 in the Y direction, the movable support unit 55 moves relative to the lower side holding device 20. In the following description, the position of the lower surface cleaning device 50 on the movable base 32 when it is closest to the lower side holding device 20 is referred to as the approach position, and the position of the lower surface cleaning device 50 on the movable base 32 when it is farthest from the lower side holding device 20 is referred to as the departure position. The gas lift driving unit 55 d includes a stepping motor or an air cylinder, and moves the gas ejection unit 53 up and down on the lift support unit 54 .

[0061] A cup device 60 is also provided in the center of the bottom portion 2a. The cup device 60 includes a cup 61 and a cup driving unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the pedestal device 30 in a plan view and to be able to be raised and lowered. Figure 2 In the figure, the cup 61 is indicated by a dotted line. The cup driver 62 moves the cup 61 between a lower cup position and an upper cup position depending on which portion of the lower surface of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is when the upper end of the cup 61 is located below the substrate W held by the suction and holding unit 21. The upper cup position is when the upper end of the cup 61 is located above the suction and holding unit 21.

[0062] A pair of upper holding devices 10A and 10B are provided at a height position higher than the cup 61, facing each other across the stage device 30 when viewed from above. The upper holding devices 10A and 10B have a reference position 10R. The upper holding devices 10A and 10B hold the substrate W so that the center of the substrate W is located at the reference position 10R. Specifically, the upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driver 13A, and an upper chuck driver 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driver 13B, and an upper chuck driver 14B.

[0063] The lower chucks 11A and 11B are arranged symmetrically with respect to a vertical plane extending in the Y direction (front-back direction) through the center of the suction holding unit 21 when viewed from above, and are configured to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B includes two support plates that support the lower peripheral edge of the substrate W from below. Lower chuck driving units 13A and 13B move the lower chucks 11A and 11B to move the lower chucks 11A and 11B closer to each other or farther away from each other.

[0064] Like the lower chucks 11A and 11B, the upper chucks 12A and 12B are arranged symmetrically with respect to a vertical plane extending in the Y direction (front-back direction) through the center of the suction holding portion 21 when viewed from above, and are configured to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B includes two holding pieces configured to abut against two portions of the outer peripheral end of the substrate W to thereby hold the outer peripheral end of the substrate W. Upper chuck driving units 14A and 14B move the upper chucks 12A and 12B so that the upper chucks 12A and 12B approach each other or move the upper chucks 12A and 12B away from each other.

[0065] like Figure 1 As shown, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotation support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0066] The rotation support shaft 71 is supported on the bottom surface 2a in a manner extending in the vertical direction and being able to be raised and lowered and rotated by the upper surface cleaning drive unit 74. Figure 2 As shown in FIG. 1 , the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotation support shaft 71. A spray nozzle 73 is attached to the front end of the arm 72.

[0067] The spray nozzle 73 is connected to the upper surface cleaning fluid supply unit 75 ( Figure 3The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and then sprays the generated mixed fluid downward.

[0068] The upper surface cleaning drive unit 74 includes one or more pulse motors and air cylinders, and moves the rotary support shaft 71 upward and downward, and rotates the rotary support shaft 71. With this configuration, the spray nozzle 73 is moved in an arc shape over the upper surface of the substrate W, which is being sucked and held by the suction and holding unit 21 and rotating, thereby cleaning the entire upper surface of the substrate W.

[0069] like Figure 1 As shown, an end cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The end cleaning device 80 includes a rotation support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0070] The rotation support shaft 81 is supported on the bottom surface 2a in a manner extending in the vertical direction and being able to be raised and lowered and rotated by the bevel brush driving unit 84. Figure 2 As shown, it is provided above the upper holding device 10A and extends horizontally from the upper end of the rotation support shaft 81. A bevel brush 83 is provided at the front end of the arm 82 so as to protrude downward and be rotatable around an axis in the vertical direction.

[0071] The upper half of the bevel brush 83 has an inverted truncated cone shape and the lower half has a truncated cone shape. According to the bevel brush 83, the outer peripheral edge of the substrate W can be cleaned at the center portion in the vertical direction of the outer peripheral surface.

[0072] The bevel brush driving unit 84 includes one or more pulse motors and air cylinders, and moves the rotary support shaft 81 upward and downward, and rotates the rotary support shaft 81. With this configuration, the outer peripheral edge of the substrate W, which is being held and rotated by the adsorption and holding unit 21, can be entirely cleaned by bringing the center portion of the outer peripheral surface of the bevel brush 83 into contact with the outer peripheral edge.

[0073] Here, the bevel brush driving unit 84 also includes a motor built into the arm 82. This motor rotates a bevel brush 83 provided at the tip of the arm 82 about a vertical axis. Therefore, when cleaning the outer edge of the substrate W, the bevel brush 83 rotates, thereby enhancing the cleaning power of the bevel brush 83 at the outer edge of the substrate W.

[0074] Figure 3It is a block diagram showing the structure of a control system of the substrate cleaning apparatus 1. Figure 3 The control device 9 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a storage device. The RAM serves as the CPU's work area. The ROM stores system programs. The storage device stores control programs.

[0075] like Figure 3 As shown, the control unit 9 includes, as functional units, a chuck control unit 9A, a suction control unit 9B, a stage control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, a slope cleaning control unit 9H, and a loading and unloading control unit 9I. The functional units of the control unit 9 are implemented by the CPU executing a substrate cleaning program stored in a storage device on RAM. Some or all of the functional units of the control unit 9 may be implemented using hardware such as electronic circuits.

[0076] The chuck control unit 9A controls the lower chuck driving units 13A and 13B and the upper chuck driving units 14A and 14B to receive a substrate W loaded into the substrate cleaning apparatus 1 and hold it above the suction holding unit 21. The suction control unit 9B controls the suction holding driving unit 22 to suction-hold the substrate W by the suction holding unit 21 and to rotate the suction-held substrate W.

[0077] The stage control unit 9C controls the stage drive unit 33 to move the movable stage 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holding unit 21.

[0078] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush movement drive unit 55c, the gas lifting drive unit 55d, the lower surface cleaning liquid supply unit 56, and the ejection gas supply unit 57 to clean the lower surface of the substrate W. The cup control unit 9F controls the cup drive unit 62 to receive, with the cup 61, the cleaning liquid that scatters from the substrate W while the substrate W is being suctioned and held by the suction holding unit 21.

[0079] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by suction by the suction holding unit 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W held by suction by the suction holding unit 21. The loading and unloading control unit 9I controls the shutter drive unit 92 to open and close the loading and unloading port 2x of the unit housing 2 when loading and unloading substrates W into and out of the substrate cleaning apparatus 1.

[0080] (2) General Operation of the Substrate Cleaning Device

[0081] Figures 4 to 15 For illustration Figure 1 Schematic diagram of the general operation of the substrate cleaning device 1. Figures 4 to 15 In each figure, the upper section shows a top view of the substrate cleaning device 1. In addition, the middle section shows a side view of the lower holding device 20 and its surroundings viewed along the Y direction, and the lower section shows a side view of the lower holding device 20 and its surroundings viewed along the X direction. Figure 1 The side view of the AA line corresponds to the side view of the lower section. Figure 1 In addition, in order to facilitate understanding of the shape and operation status of each component in the substrate cleaning device 1, the scaling ratio of some components is different between the top view in the upper section and the side views in the middle section and the lower section. Figures 4 to 15 In FIG. 6 , the cup 61 is indicated by a two-dot chain line, and the outer shape of the substrate W is indicated by a thicker one-dot chain line.

[0082] In the initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening and closing apparatus 90 closes the loading / unloading port 2x. Figure 1 As shown, the lower chucks 11A and 11B are maintained at a distance sufficiently greater than the diameter of the substrate W. Furthermore, the upper chucks 12A and 12B are also maintained at a distance sufficiently greater than the diameter of the substrate W. Furthermore, the movable pedestal 32 of the pedestal device 30 is configured so that the center of the adsorption holding portion 21 is located at the center of the cup 61 when viewed from above. The lower surface cleaning device 50 is positioned in a close position on the movable pedestal 32. In the lifting support portion 54 of the lower surface cleaning device 50, the cleaning surface (upper end) of the lower surface brush 51 is located below the adsorption holding portion 21.

[0083] Furthermore, in the transfer device 40, the plurality of support pins 41 are positioned below the adsorption holding unit 21. Furthermore, in the cup device 60, the cup 61 is positioned at the lower cup position. In the following description, the center position of the cup 61, as viewed from above, is referred to as the plane reference position rp. Furthermore, the position of the movable pedestal 32 on the bottom surface portion 2a when the center of the lower adsorption holding unit 21 is positioned at the plane reference position rp, as viewed from above, is referred to as the first horizontal position.

[0084] The substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading port 2x immediately before the substrate W is loaded. Figure 4 As shown by the thick solid arrow a1, the hand (substrate holding portion) RH of the substrate transport robot (not shown) carries the substrate W into the substantially central position of the unit housing 2 through the carry-in / out port 2x. At this time, the substrate W held by the hand RH is as shown in FIG. Figure 4 As shown, it is located between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B.

[0085] Then, if Figure 5 As indicated by the thick solid arrow a2, the lower chucks 11A and 11B approach each other so that the supporting pieces of the lower chucks 11A and 11B are positioned below the lower peripheral edge of the substrate W. In this state, the hand RH descends and exits the loading / unloading port 2x. Consequently, portions of the lower peripheral edge of the substrate W held by the hand RH are supported by the supporting pieces of the lower chucks 11A and 11B. After the hand RH exits, the shutter 91 closes the loading / unloading port 2x.

[0086] Then, if Figure 6 As indicated by the arrow a3 of the thick solid line, the upper chucks 12A and 12B approach each other so that the plurality of holding pieces of the upper chucks 12A and 12B abut against the outer peripheral end of the substrate W. As the plurality of holding pieces of the upper chucks 12A and 12B abut against the plurality of portions of the outer peripheral end of the substrate W, the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B.

[0087] In addition, if Figure 6 As indicated by the thick solid arrow a4, the movable pedestal 32 moves forward from the first horizontal position so that the suction holding portion 21 is offset a specific distance from the plane reference position rp and the center of the lower surface brush 51 is positioned at the plane reference position rp. In this situation, when viewed from above, the lower surface brush 51 overlaps with the reference position 10R of the upper holding devices 10A and 10B. At this time, the position of the movable pedestal 32 on the bottom portion 2a is referred to as the second horizontal position.

[0088] Then, if Figure 7As shown by the thick solid arrow a5, the lifting support portion 54 rises so that the cleaning surface of the lower surface brush 51 contacts the central area of ​​the lower surface of the substrate W. Figure 7 As indicated by the thick solid arrow a6 , the lower surface brush 51 rotates (spins) around the central axis 51 c , thereby physically removing contaminants adhering to the central region of the lower surface of the substrate W by the lower surface brush 51 .

[0089] exist Figure 7 The lower portion of the dialog box shows an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W. As shown in the dialog box, while the lower surface brush 51 is in contact with the substrate W, the liquid nozzle 52 and the gas ejection portion 53 are maintained in a position close to the lower surface of the substrate W. At this time, the liquid nozzle 52 ejects cleaning liquid toward the lower surface of the substrate W from a position near the lower surface brush 51, as indicated by the white arrow a51. Consequently, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is directed toward the contact portion between the lower surface brush 51 and the substrate W, thereby flushing away contaminants removed from the back surface of the substrate W by the lower surface brush 51. In this manner, in the lower surface cleaning apparatus 50, the liquid nozzle 52 is mounted together with the lower surface brush 51 on the lifting support portion 54. This allows for efficient supply of cleaning liquid to the portion of the lower surface of the substrate W being cleaned by the lower surface brush 51. This reduces cleaning liquid consumption and prevents excessive scattering of cleaning liquid.

[0090] Here, the upper surface 54u of the lift support 54 is inclined obliquely downward in a direction away from the adsorption holding portion 21. In this case, when cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lift support 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the adsorption holding portion 21.

[0091] When the lower surface brush 51 cleans the central area of ​​the lower surface of the substrate W, the upper end of the gas ejection portion 53 is at a height of a specific distance from the substrate W. The height of the upper end of the gas ejection portion 53 at this time is referred to as a first height. Figure 7 As shown by the white arrow a52 in the dialog box, gas is sprayed toward the lower surface of the substrate W from the first height at a position between the lower surface brush 51 and the adsorption holding portion 21 .

[0092] In this embodiment, the gas ejection unit 53 is mounted on the lifting support unit 54 so that the gas ejection port extends in the X-direction. In this case, when gas is ejected from the gas ejection unit 53 toward the lower surface of the substrate W, a belt-shaped gas curtain extending in the X-direction is formed between the lower surface brush 51 and the suction and holding unit 21. This prevents cleaning liquid containing contaminants from scattering toward the suction and holding unit 21 when the lower surface brush 51 cleans the lower surface of the substrate W. Consequently, cleaning liquid containing contaminants is prevented from adhering to the suction and holding unit 21 when the lower surface brush 51 cleans the central area of ​​the lower surface of the substrate W, thereby keeping the suction surface of the suction and holding unit 21 clean.

[0093] In addition, Figure 7 In the example shown in FIG. 5 , the gas ejection unit 53 ejects gas obliquely upward from the gas ejection unit 53 toward the lower surface brush 51 as indicated by the white arrow a52. However, the present invention is not limited thereto. The gas ejection unit 53 may also eject gas in the Z direction toward the lower surface of the substrate W.

[0094] In addition, if Figure 7 As indicated by the thick solid arrow a53, while the lower surface brush 51 cleans the central area of ​​the lower surface of the substrate W, the suction and holding unit 21 rotates without holding the substrate W. The rotation speed of the suction and holding unit 21 at this time is, for example, 500 rpm or higher. In this case, even if scattered cleaning liquid containing contaminants adheres to the suction and holding unit 21 during cleaning of the central area of ​​the lower surface of the substrate W, the cleaning liquid is swept away from the suction and holding unit 21. This keeps the suction surface of the suction and holding unit 21 clean.

[0095] Then, in Figure 7 When the cleaning of the central area of ​​the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is away from the substrate W by a specific distance. In addition, the spraying of the cleaning liquid from the liquid nozzle 52 to the substrate W is stopped, and the rotation of the adsorption holding part 21 is stopped. On the other hand, Figure 8 As shown, the gas continues to be ejected from the gas ejection portion 53 toward the substrate W.

[0096] At this time, if Figure 8 As shown by the thick solid arrow a54, the gas ejection portion 53 passes through Figure 3The gas lift drive unit 55d is raised. As a result, the upper end of the gas ejection unit 53 is closer to the lower surface of the substrate W than when cleaning the central area of ​​the lower surface of the substrate W. The upper end of the gas ejection unit 53 can be located above the cleaning surface of the lower surface brush 51. The height of the upper end of the gas ejection unit 53 at this time is referred to as the second height. In this case, the gas ejection unit 53 ejects gas toward the substrate W from the second height, which is closer to the lower surface of the substrate W than the first height. In this case, since the lower surface of the substrate W is close to the upper end of the gas ejection unit 53, the lower surface of the substrate W is efficiently dried.

[0097] Afterwards, if Figure 8 As indicated by the thick solid arrow a7, the movable pedestal 32 moves rearward so that the suction holding unit 21 is positioned at the planar reference position rp. In other words, the movable pedestal 32 moves from the second horizontal position to the first horizontal position. In this case, when viewed from above, the suction holding unit 21 overlaps with the reference position 10R of the upper holding devices 10A and 10B. At this point, the gas ejection unit 53 continues to spray gas onto the substrate W, sequentially drying the central area of ​​the lower surface of the substrate W through the gas curtain.

[0098] Then, if Figure 9 As shown by the arrow a8 of the thick solid line, the lifting support portion 54 descends in such a manner that the cleaning surface of the lower surface brush 51 is located below the adsorption surface (upper end portion) of the adsorption holding portion 21. Figure 9 As indicated by the thick solid arrow a9, the upper chucks 12A and 12B move away from each other so that the plurality of holding pieces of the upper chucks 12A and 12B are separated from the outer peripheral end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A and 11B.

[0099] Afterwards, if Figure 9 As shown by the thick solid arrow a10 , the pin coupling member 42 rises so that the upper ends of the support pins 41 are slightly above the lower chucks 11A and 11B.

[0100] Then, if Figure 10 As indicated by the thick solid arrow a11, the lower chucks 11A and 11B move away from each other. At this point, the lower chucks 11A and 11B move to positions where they do not overlap with the substrate W supported by the support pins 41 when viewed from above. As a result, both upper holding devices 10A and 10B return to their initial positions.

[0101] Then, if Figure 11As shown by the thick solid arrow a12, the pin coupling member 42 descends so that the upper ends of the plurality of support pins 41 are located below the adsorption holding member 21. As a result, the substrate W supported on the plurality of support pins 41 is received by the adsorption holding member 21. In this state, the adsorption holding member 21 adsorbs and holds the center area of ​​the lower surface of the substrate W. Simultaneously with the descent of the pin coupling member 42 or after the descent of the pin coupling member 42 is completed, as shown in FIG. Figure 11 As shown by the thick solid arrow a13, the cup 61 rises from the lower cup position to the upper cup position.

[0102] Then, if Figure 12 As indicated by the thick solid arrow a14, the suction holding unit 21 rotates around the vertical axis (the axis of rotation of the suction holding drive unit 22). As a result, the substrate W suction-held by the suction holding unit 21 rotates in a horizontal posture.

[0103] Then, the rotation support shaft 71 of the upper surface cleaning device 70 rotates and descends. Figure 12 As shown by the thick solid arrow a15, the spray nozzle 73 moves to a position above the substrate W and descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of cleaning liquid and gas onto the upper surface of the substrate W. In addition, the rotary support shaft 71 rotates. As a result, Figure 12 As indicated by a thick solid arrow a16, the spray nozzle 73 moves to a position above the rotating substrate W. By spraying the mixed fluid onto the entire upper surface of the substrate W, the entire upper surface of the substrate W is cleaned.

[0104] In addition, when the spray nozzle 73 cleans the upper surface of the substrate W, the rotary support shaft 81 of the end cleaning device 80 also rotates and descends. Figure 12 As indicated by the thick solid arrow a17, the bevel brush 83 moves to a position above the outer edge of the substrate W. Furthermore, it descends so that the center portion of the outer peripheral surface of the bevel brush 83 contacts the outer edge of the substrate W. In this state, the bevel brush 83 rotates (spins) about its vertical axis. Consequently, contaminants adhering to the outer edge of the substrate W are physically removed by the bevel brush 83. The contaminants removed from the outer edge of the substrate W are rinsed away by the cleaning fluid of the mixed fluid sprayed onto the substrate W from the spray nozzle 73.

[0105] Furthermore, when the spray nozzle 73 cleans the upper surface of the substrate W, the lifting support 54 rises so that the cleaning surface of the lower surface brush 51 contacts the outer area of ​​the lower surface of the substrate W. Figure 12As indicated by the thick solid arrow a18, the lower surface brush 51 rotates (spins) about the central axis 51c. Furthermore, the liquid nozzle 52 sprays cleaning liquid onto the lower surface of the substrate W, and the gas ejection unit 53 sprays gas onto the lower surface of the substrate W. Thus, the lower surface brush 51 can clean the entire outer area of ​​the lower surface of the substrate W, which is being sucked and held by the suction and holding unit 21 and rotated.

[0106] In addition, when the lower surface brush 51 is not relatively large, as shown in FIG. Figure 12 As indicated by the thick solid arrow a19, the movable support portion 55 can also move forward and backward between the approach position and the distance position on the movable stage 32. Even in this case, the lower surface brush 51 can clean the entire outer area of ​​the lower surface of the substrate W that is being sucked and held by the suction and holding portion 21 and rotated.

[0107] Next, when the cleaning of the upper surface, the outer peripheral end portion, and the outer region of the lower surface of the substrate W is completed, the spraying of the mixed fluid from the spray nozzle 73 toward the substrate W is stopped. Figure 13 As shown by the thick solid arrow a20, the spray nozzle 73 moves to a position on one side of the cup 61 (the position of the initial state). Figure 13 As indicated by the thick solid arrow a21, the bevel brush 83 moves to the position on the other side of the cup 61 (the initial position). Furthermore, the rotation of the lower surface brush 51 is stopped, and the elevating support 54 is lowered so that the cleaning surface of the lower surface brush 51 is a predetermined distance away from the substrate W. Furthermore, the spraying of cleaning liquid from the liquid nozzle 52 onto the substrate W and the injection of gas from the gas ejector 53 onto the substrate W are stopped. In this state, the suction and holding unit 21 rotates at high speed, thereby shaking off the cleaning liquid adhering to the substrate W and drying the entire substrate W.

[0108] Then, if Figure 14 As shown by the thick solid arrow a22, the cup 61 descends from the upper cup position to the lower cup position. In addition, in preparation for moving a new substrate W into the unit housing 2, as shown in FIG. Figure 14 As indicated by the thick solid arrow a23, the lower chucks 11A and 11B approach each other until they are positioned to support a new substrate W.

[0109] Finally, the substrate W is unloaded from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading port 2x just before the substrate W is unloaded. Figure 15 As indicated by the thick solid arrow a24, the hand (substrate holder) RH of the substrate transport robot (not shown) enters the unit housing 2 through the loading / unloading port 2x. The hand RH then receives the substrate W from the suction holder 21 and exits the loading / unloading port 2x. After the hand RH exits, the shutter 91 closes the loading / unloading port 2x.

[0110] (3) Substrate cleaning

[0111] Figure 16 and Figure 17 To express Figure 3 Flowchart of the substrate cleaning process of the control device 9. Figure 16 and Figure 17 The substrate cleaning process is performed by the CPU of the control device 9 executing the substrate cleaning program stored in the storage device on the RAM. Figure 16 and Figure 17 Process Figure 1 Start using Figure 3 The control device 9 and Figures 4 to 15 The substrate cleaning apparatus 1 illustrates a substrate cleaning process.

[0112] First, the substrate W is carried into the unit housing 2 by controlling the shutter driving unit 92 by the carrying-in / out control unit 9I ( Figure 4 、 Figure 5 Then, the chuck control unit 9A controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B, and the upper holding devices 10A, 10B hold the substrate W ( Figure 5 、 Figure 6 and step S2).

[0113] Next, the pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 from the first horizontal position to the second horizontal position ( Figure 6 Then, the adsorption control unit 9B controls the adsorption and holding drive unit 22, so that the adsorption and holding unit 21 rotates around the axis of rotation of the adsorption and holding drive unit 22 without the adsorption and holding unit 21 holding the substrate W ( Figure 7 and step S4).

[0114] Furthermore, the lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejection gas supply unit 57, thereby cleaning the entire central area of ​​the lower surface of the substrate W ( Figure 7 At this time, the upper end of the gas ejection portion 53 is located at the first height.

[0115] Next, the lower surface cleaning control unit 9E controls the gas lifting drive unit 55d to raise the gas ejection unit 53 ( Figure 8 In the above case, the upper end of the gas ejection part 53 is located at the second height. In addition, the ejection gas supply part 57 is controlled by the lower surface cleaning control part 9E to dry the substrate W ( Figure 8Furthermore, the pedestal driving unit 33 is controlled by the pedestal control unit 9C, so that the movable pedestal 32 is moved from the second horizontal position to the first horizontal position ( Figure 8 In this example, steps S7 and S8 are performed substantially simultaneously. Thus, the central area of ​​the lower surface of the substrate W is dried sequentially.

[0116] Next, the chuck control unit 9A controls the lower chuck driving units 13A and 13B and the upper chuck driving units 14A and 14B, and the transfer control unit 9D controls the pin lifting and lowering driving unit 43, thereby transferring the substrate W from the upper holding devices 10A and 10B to the lower holding device 20 ( Figures 8 to 11 In the above state, the adsorption control unit 9B controls the adsorption and holding drive unit 22 to adsorb the central area of ​​the lower surface of the substrate W, and the substrate W is held by the lower holding device 20 ( Figure 11 and step S10).

[0117] Thereafter, the upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the entire upper surface of the substrate W ( Figure 12 And step S11). In addition, the outer peripheral edge of the substrate W is cleaned by controlling the bevel brush driving unit 84 through the bevel cleaning control unit 9H ( Figure 12 In addition, the lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejection gas supply unit 57 to clean the entire outer area of ​​the lower surface of the substrate W ( Figure 12 and step S13).

[0118] Steps S11 to S13 are executed substantially simultaneously. During the execution of steps S11 to S13, the suction control unit 9B controls the suction and holding drive unit 22 to rotate the substrate W about the axis of rotation of the suction and holding drive unit 22. Furthermore, the cup control unit 9F controls the cup drive unit 62 to raise the cup 61 from the lower cup position to the upper cup position.

[0119] After the cleaning is completed, the adsorption control unit 9B controls the adsorption and holding driving unit 22 to rotate the adsorption and holding unit 21 at a high speed, thereby drying the entire substrate W ( Figure 13 After drying, the upper holding devices 10A, 10B and the cup 61 return to their initial state ( Figure 14 Finally, the substrate W is carried out from the unit housing 2 by controlling the shutter driving unit 92 by the loading and unloading control unit 9I ( Figure 15 and step S15), completing the substrate cleaning process.

[0120] (4) Effect

[0121] In the substrate cleaning apparatus 1 of this embodiment, when cleaning the central area of ​​the lower surface of a substrate W, the upper holding devices 10A and 10B hold the substrate W so that its center is located at the reference position 10R. In this position, the lower surface brush 51 contacts the central area of ​​the lower surface of the substrate W. At this time, the suction holding unit 21 is rotated about its vertical axis without holding the substrate W. Furthermore, a gas ejection unit 53, positioned between the lower surface brush 51 and the suction holding unit 21, ejects gas toward the substrate W from a first height, a specific distance from the substrate W.

[0122] When drying the central region of the lower surface of the substrate W, the gas ejection unit 53 ejects gas toward the substrate W from a second height closer to the substrate W than the first height. When cleaning the outer regions of the lower surface of the substrate W, the lower surface brush 51 contacts the outer regions of the lower surface of the substrate W while the central region of the lower surface of the substrate W is held by the suction holding unit 21 and the substrate W is rotated about the vertical axis. By moving the movable stage 32 to the first horizontal position, the substrate W can be easily transferred between the upper holding devices 10A and 10B and the suction holding unit 21.

[0123] According to the above configuration, when cleaning the lower surface center area, the movable stage 32 moves to the second horizontal position, causing the suction and holding unit 21 to retreat to a position where it does not overlap with the substrate W. Furthermore, the gas ejection unit 53 forms an air curtain between the lower surface brush 51 and the suction and holding unit 21. This prevents the cleaning liquid containing contaminants from scattering from the substrate W toward the suction and holding unit 21. Furthermore, when drying the lower surface center area, the gas ejection unit 53 ejects gas toward the lower surface of the substrate W while the lower surface of the substrate W is in close proximity to the gas ejection unit 53, effectively drying the lower surface center area. This prevents the cleaning liquid from adhering to the suction and holding unit 21.

[0124] Even if cleaning liquid containing contaminants scattered from the substrate W adheres to the adsorption and holding unit 21, the rotation of the adsorption and holding unit 21 causes the cleaning liquid to be shaken off the adsorption and holding unit 21. This allows the adsorption and holding unit 21 to be kept clean. Here, when the rotation speed of the adsorption and holding unit 21 is 500 rpm or higher, the cleaning liquid adhering to the adsorption and holding unit 21 can be shaken off quickly.

[0125] The lower surface brush 51 and the gas ejection unit 53 are supported by a common lifting support unit 54. In this case, the lower surface brush 51 and the gas ejection unit 53 move in unison according to the position of the substrate W. Therefore, the lower surface of the substrate W can be cleaned efficiently. Furthermore, because the gas ejection unit 53 is configured to move vertically, even when the lower surface brush 51 and the gas ejection unit 53 are supported by the common lifting support unit 54, the gas ejection unit 53 can be brought closer to the substrate W when drying the center area of ​​the lower surface of the substrate W than when cleaning the center area of ​​the lower surface of the substrate W. This allows for efficient drying of the lower surface of the substrate W.

[0126] (5) Other Implementation Methods

[0127] (a) In the above embodiment, the suction holding unit 21 is rotated without holding the substrate W during cleaning of the central area of ​​the lower surface of the substrate W. Furthermore, the gas ejection unit 53 ejects gas toward the substrate W from different heights during cleaning and drying of the central area of ​​the lower surface of the substrate W. However, the embodiment is not limited to this. As long as one of the two operations is performed, the other may not be performed.

[0128] Specifically, when the suction holding unit 21 is rotated during cleaning of the central area of ​​the lower surface without holding the substrate W, the gas ejection unit 53 need not be raised or lowered during cleaning and drying of the central area of ​​the lower surface. Alternatively, the substrate cleaning apparatus 1 may not include the gas ejection unit 53. On the other hand, when the gas ejection unit 53 is raised or lowered during cleaning and drying of the central area of ​​the lower surface, the suction holding unit 21 need not be rotated during cleaning of the central area of ​​the lower surface without holding the substrate W.

[0129] (b) In the above embodiment, the lower surface brush 51 may be cleaned using a brush or sprayer (not shown). The sprayer may be a two-fluid sprayer that supplies liquid and gas. Furthermore, the gas ejection unit 53 may be used to eject gas during cleaning of the lower surface brush 51. In this case, the liquid containing contaminants is prevented from scattering from the lower surface brush 51 toward the adsorption and holding unit 21.

[0130] Alternatively, during cleaning of the lower surface brush 51, the suction holding unit 21 may be rotated without holding the substrate W. In this case, even if liquid containing contaminants scattered from the lower surface brush 51 adheres to the suction holding unit 21, the rotation of the suction holding unit 21 will shake the liquid off the suction holding unit 21. This allows the suction holding unit 21 to be kept clean.

[0131] (c) In the above embodiment, after the central region of the lower surface of the substrate W is cleaned in the upper holding apparatuses 10A and 10B, the outer region of the lower surface of the substrate W is cleaned in the lower holding apparatus 20. However, the embodiment is not limited to this. Alternatively, after the outer region of the lower surface of the substrate W is cleaned in the lower holding apparatus 20, the central region of the lower surface of the substrate W may be cleaned in the upper holding apparatuses 10A and 10B.

[0132] (d) In the above embodiment, the lower surface brush 51 and the gas ejection unit 53 are supported by a common lifting support unit 54, but the embodiment is not limited to this. The lower surface brush 51 and the gas ejection unit 53 may also be supported by separate support units. Furthermore, the adsorption holding unit 21, the lower surface brush 51, and the gas ejection unit 53 are disposed on the movable base 32, but the embodiment is not limited to this. The adsorption holding unit 21, the lower surface brush 51, and the gas ejection unit 53 may not be disposed on the movable base 32.

[0133] (e) In the above embodiment, the movable pedestal 32 moves linearly in the horizontal plane, but the embodiment is not limited thereto. The movable pedestal 32 may also move in a curved shape in the horizontal plane.

[0134] (f) In the above embodiment, the substrate cleaning apparatus 1 includes the transfer device 40 for transferring substrates W between the upper holding apparatuses 10A and 10B and the lower holding apparatus 20. However, the embodiment is not limited to this. If the upper holding apparatuses 10A and 10B and the lower holding apparatus 20 are configured to directly transfer substrates W, the substrate cleaning apparatus 1 may not include the transfer device 40.

[0135] (g) In the above embodiment, the upper surface and outer peripheral edge of the substrate W are cleaned, but the embodiment is not limited to this. The upper surface of the substrate W may not be cleaned. In this case, the substrate cleaning apparatus 1 does not include the upper surface cleaning apparatus 70. Similarly, the outer peripheral edge of the substrate W may not be cleaned. In this case, the substrate cleaning apparatus 1 does not include the end cleaning apparatus 80.

[0136] (h) In the above embodiment, the substrate cleaning apparatus 1 includes the control device 9, but the embodiment is not limited thereto. When the substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, the substrate cleaning apparatus 1 may not include the control device 9.

[0137] (6) Correspondence between the constituent elements of the claims and the components of the embodiments

[0138] Hereinafter, examples of correspondence between the constituent elements of the claims and the constituent elements of the embodiments will be described, but the present invention is not limited to the following examples. As the constituent elements of the claims, various other elements having the structures or functions described in the claims may also be used.

[0139] In the embodiment described above, the reference position 10R is an example of a reference position, the substrate W is an example of a substrate, the upper holding devices 10A and 10B and the suction holding unit 21 are examples of the first and second holding units, respectively, and the lower surface brush 51 is an example of a cleaning tool. The movable stage 32 is an example of a movable stage, the substrate cleaning device 1 is an example of a substrate cleaning device, the linear guide 31 is an example of a linear guide, the gas ejection unit 53 is an example of a gas ejection unit, and the lifting support unit 54 is an example of a support unit.

Claims

1. A substrate cleaning device comprising: a first holding portion having a reference position and holding the substrate so that the center of the substrate is located at the reference position; a second holding portion configured to be rotatable about a vertical axis and to hold a central area of ​​a lower surface of the substrate; a cleaning tool that cleans the lower surface central area of ​​the substrate held by the first holding portion by contacting the lower surface central area, and cleans the lower surface outer areas of the substrate rotated by the second holding portion by contacting the lower surface outer areas surrounding the lower surface central area; and a movable pedestal on which the second holding portion and the cleaning tool are provided, and which moves in a horizontal plane so that when the substrate is transferred between the first holding portion and the second holding portion, the second holding portion overlaps with the reference position of the first holding portion in a plan view, and when the central area of ​​the lower surface is cleaned, the cleaning tool overlaps with the reference position of the first holding portion in a plan view; and The second holding portion and the cleaning tool move integrally with the movable base in a horizontal plane; During cleaning of the central region of the lower surface, the second holding portion rotates without holding the substrate.

2. The substrate cleaning apparatus according to claim 1, further comprising: a gas ejection unit disposed between the cleaning tool and the second holding unit and configured to eject gas toward the substrate.

3. The substrate cleaning apparatus according to claim 1 or 2, further comprising: a linear guide rail extending in one direction within the horizontal plane; and The movable pedestal moves linearly along the linear guide rail. 4 . The substrate cleaning apparatus according to claim 1 , wherein the rotation speed of the second holding portion during cleaning of the lower surface central area is 500 rpm or higher.

5. A substrate cleaning device comprising: a first holding portion having a reference position and holding the substrate so that the center of the substrate is located at the reference position; a second holding portion for holding a central area of ​​a lower surface of the substrate and rotating the substrate around a vertical axis; a cleaning tool that cleans the lower surface center area of ​​the substrate held by the first holding portion by contacting the lower surface center area, and cleans the lower surface outer areas of the substrate rotated by the second holding portion by contacting the lower surface outer areas surrounding the lower surface center area; a gas ejection portion disposed so as to be movable up and down between the cleaning tool and the second holding portion, and ejecting gas toward the substrate from a first height that is a specific distance away from the substrate when cleaning the central area of ​​the lower surface, and ejecting gas toward the substrate from a second height that is closer to the substrate than the first height when drying the central area of ​​the lower surface; and a movable pedestal on which the second holding portion and the cleaning tool are provided, and which moves in a horizontal plane so that when the substrate is transferred between the first holding portion and the second holding portion, the second holding portion overlaps with the reference position of the first holding portion in a plan view, and when the central area of ​​the lower surface is cleaned, the cleaning tool overlaps with the reference position of the first holding portion in a plan view; and The second holding portion and the cleaning tool move integrally with the movable pedestal within a horizontal plane.

6. The substrate cleaning apparatus according to claim 5, wherein the second holding portion rotates without holding the substrate during cleaning of the central region of the lower surface. 7 . The substrate cleaning apparatus according to claim 5 , further comprising a common support portion for supporting the cleaning tool and the gas ejection portion.

8. A substrate cleaning method comprising: When cleaning the central area of ​​the lower surface of the substrate, the substrate is held by the first holding portion in such a manner that the center of the substrate is located at a reference position; When the central area of ​​the lower surface is cleaned, the second holding portion is rotated around the vertical axis without holding the substrate; When cleaning the central area of ​​the lower surface, a cleaning tool is brought into contact with the central area of ​​the lower surface of the substrate held by the first holding portion; When cleaning the lower surface outer region of the substrate surrounding the lower surface central region, the lower surface central region of the substrate is held by the second holding portion, and the substrate is rotated about the vertical axis; When cleaning the lower surface outer region, bringing the cleaning tool into contact with the lower surface outer region of the substrate rotated by the second holding portion; and The movable pedestal on which the second holding portion and the cleaning tool are provided is moved in a horizontal plane so that when the substrate is transferred between the first holding portion and the second holding portion, the second holding portion overlaps with the reference position of the first holding portion in a plan view, and when the central area of ​​the lower surface is cleaned, the cleaning tool overlaps with the reference position of the first holding portion in a plan view. Moving the movable pedestal within the horizontal plane includes moving the second holding portion and the cleaning tool integrally with the movable pedestal within the horizontal plane.

9. The substrate cleaning method according to claim 8, further comprising: ejecting gas toward the substrate through a gas ejection portion disposed between the cleaning tool and the second holding portion. 10 . The substrate cleaning method according to claim 8 , wherein moving the movable stage within a horizontal plane includes moving the movable stage linearly along a linear guide extending in one direction within the horizontal plane.

11. The substrate cleaning method according to claim 8 or 9, wherein rotating the second holding portion around the vertical axis without holding the substrate includes rotating the second holding portion at a rotation speed of 500 rpm or higher.

12. A substrate cleaning method comprising: When cleaning the central area of ​​the lower surface of the substrate, the substrate is held by the first holding portion in such a manner that the center of the substrate is located at a reference position; When cleaning the central area of ​​the lower surface, a cleaning tool is brought into contact with the central area of ​​the lower surface of the substrate held by the first holding portion; When cleaning the lower surface outer region of the substrate surrounding the lower surface central region, the substrate is rotated about a vertical axis while the lower surface central region of the substrate is held by a second holding portion; When cleaning the lower surface outer region, bringing the cleaning tool into contact with the lower surface outer region of the substrate rotated by the second holding portion; and During cleaning of the central area of ​​the lower surface, the gas is ejected toward the substrate from a first height that is a specific distance away from the substrate by a gas ejection portion disposed between the cleaning tool and the second holding portion, and during drying of the central area of ​​the lower surface, the gas is ejected toward the substrate from a second height that is closer to the substrate than the first height by the gas ejection portion. The movable pedestal on which the second holding portion and the cleaning tool are provided is moved in a horizontal plane so that when the substrate is transferred between the first holding portion and the second holding portion, the second holding portion overlaps with the reference position of the first holding portion in a plan view, and when the central area of ​​the lower surface is cleaned, the cleaning tool overlaps with the reference position of the first holding portion in a plan view. Moving the movable pedestal within the horizontal plane means moving the second holding portion and the cleaning tool integrally with the movable pedestal within the horizontal plane.

13. The substrate cleaning method according to claim 12, further comprising: rotating the second holding portion around the vertical axis without holding the substrate during cleaning of the central area of ​​the lower surface. 14 . The substrate cleaning method according to claim 12 , wherein the cleaning tool and the gas ejection portion are supported by a common support portion.

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