Gold wire optical automatic detection equipment

Abstract

The present invention relates to the technical field of gold wire detection equipment, and specifically, discloses a gold wire optical automatic detection equipment, which includes a detection equipment body, the detection equipment body includes a first detection station for visually detecting the front side of a chip module and a second detection station for visually detecting the back side of the chip module; and also includes a conveying mechanism for conveying the chip module to the first detection station and the second detection station in sequence, and the conveying mechanism is provided with a flipping mechanism located between the first detection station and the second detection station, and the flipping mechanism is used to flip the chip module. The present invention can realize the detection of the front and back sides of the chip module in sequence, and compared with the currently common optical detection equipment that only has the detection capability of one side, it preferably improves the detection efficiency of the chip module.

Description

Technical Field

[0001] The invention relates to the technical field of gold wire detection equipment, in particular to a gold wire optical automatic detection equipment. Background Art

[0002] In the production process of chips, gold wire is usually needed. The function of gold wire is to connect the integrated circuit chip with the lead frame. The diameter of a single gold wire is about 20 microns, which is about one-third of the diameter of a human hair. After the gold wire is welded, the following problems may occur: collapsed wire, missed wire, wrong wire, flying wire, double wire, gold wire falling off, gold wire residue, PCB gold ball falling off, gold finger wire without ball, gold ball deviation, gold finger chip ball offset, chip offset, chip scratch, capacitor and resistor falling off, capacitor and resistor damage, driver chip damage. Therefore, after the gold wire welding is completed, the gold wire needs to be inspected by a testing agency. Currently, common chip detection methods include visual inspection, which uses a visual inspection camera to capture chip images and analyze the images to achieve gold wire detection. Since the current gold wire detection equipment lacks a better chip flipping mechanism, it is impossible to achieve better double-sided detection of the chip, and usually only single-sided detection of the chip can be completed. Therefore, after the chip detection is completed, the chip needs to be re-transported to the detection equipment to detect the undetected side of the chip, resulting in low efficiency in chip detection. Summary of the invention

[0003] In order to solve the above technical problems, the present invention is solved by the following technical solutions:

[0004] A gold wire optical automatic detection device comprises a detection device body, wherein the detection device body comprises a first detection station for visually detecting the front side of a chip module and a second detection station for visually detecting the back side of the chip module; and further comprises a conveying mechanism for conveying the chip module to the first detection station and the second detection station in sequence, wherein a flipping mechanism located between the first detection station and the second detection station is provided in the conveying mechanism, and the flipping mechanism is used to flip the chip module.

[0005] The present invention can detect the front and back sides of the chip module in sequence, and compared with the currently common optical detection equipment that only has the detection capability of one side, it can better improve the detection efficiency of the chip module.

[0006] Preferably, the first inspection station includes a camera mounting frame arranged at the main body of the inspection equipment, the camera mounting frame is provided with a short-wave infrared scanning camera for scanning the chip module, the camera mounting frame is also provided with a shading plate located below the short-wave infrared scanning camera, and the shading plate is provided with an image acquisition port; the camera mounting frame is provided with a first micrometer displacement platform for installing the short-wave infrared scanning camera.

[0007] In the present invention, by setting up a short-wave infrared scanning camera, the image of the chip module can be collected, and the image can be analyzed by a visual algorithm, so as to detect the chip module.

[0008] Preferably, the second inspection station includes a fixed frame arranged at the inspection equipment body, a second micrometer displacement platform is provided at the fixed frame, and a short-wave line scan camera for scanning the chip module is provided at the second micrometer displacement platform.

[0009] In the present invention, by setting up a short-wave line scan camera, the image of the chip module can be collected, and the image can be analyzed by an image algorithm, thereby realizing detection of the back side of the chip module.

[0010] Preferably, the fixing frame includes a fixing plate, the fixing plate is provided with two groups of arc-shaped through holes respectively located at the two ends of the short-wave line scan camera, the fixing plate is provided with a lamp mounting plate located at the arc-shaped through holes, the lamp mounting plate is provided with an LED lamp, the lamp mounting plate can move along the direction of the arc-shaped through holes to adjust the illumination angle of the LED lamp, the lamp mounting plate is provided with mounting plate screw holes corresponding to the arc-shaped through holes, and the arc-shaped through holes are provided with first fixing bolts that cooperate with the mounting plate screw holes to fix the lamp mounting plate.

[0011] In the present invention, by setting the LED lamp, the chip module can be illuminated by the LED lamp, so that the short-wave line scan camera can collect a clear image of the chip module.

[0012] Preferably, the conveying mechanism includes a first belt pulley group arranged below the first inspection station and a second belt pulley group arranged below the second inspection station. The first belt pulley group and the second belt pulley group have the same structure. The first belt pulley group and the second belt pulley group both include two pulley mounting plates arranged at intervals. Two pulleys are provided at the opposite end surfaces of the two pulley mounting plates. The two pulleys are arranged at intervals along the length direction of the pulley mounting plates. A round belt for supporting the edge of the chip module is provided between the two pulleys.

[0013] In the present invention, by disposing the first belt pulley group and the second belt pulley group structure, the chip module can be supported by the round belt and the chip module can be driven to move.

[0014] Preferably, a motor mounting plate is provided at the pulley mounting plate, a strip through hole is provided at the motor mounting plate along the height direction of the motor mounting plate, a pulley motor that can move along the height direction of the motor mounting plate is provided at the motor mounting plate corresponding to the strip through hole, a second fixing bolt that passes through the strip through hole and is used to fix the pulley motor is provided at the strip through hole, and a driving wheel that matches the round belt is provided at the rotating shaft of the pulley motor; two driven wheels are provided at the motor mounting plate, and the two driven wheels are respectively located at the two ends of the driving wheel, and the two driven wheels are used together to press the round belt against the driving wheel.

[0015] In the present invention, the round belt can be driven to rotate by arranging the pulley motor and the driving wheel, thereby realizing the driving of the round belt.

[0016] Preferably, the flipping mechanism includes a rotating rod mounting frame arranged between the first belt pulley group and the second belt pulley group, a rotatable rotating rod is provided at the rotating rod mounting frame, and a rotating rod motor for driving the rotating rod to rotate is provided at the rotating rod mounting frame; the rotating rod is provided with two flip plates arranged along the axial direction of the rotating rod, and both ends of the flip plates along the radial direction of the rotating rod are provided with strip grooves for cooperating with the edge of the chip module, and an inclined surface is provided at the opening of the strip groove; the strip grooves at the same end of the two flip plates at the rotating rod are used together to flip the chip module from the first belt pulley group to the second belt pulley group.

[0017] In the present invention, by setting the flipping mechanism structure, not only the chip module is transferred from the first belt pulley assembly to the second belt pulley assembly, but also the flipping of the chip module is achieved.

[0018] Preferably, the flap mechanism further includes two baffles, which are arranged between the first belt pulley set and the second belt pulley set, and the two baffles are arranged at intervals along the axis of the rotating rod, and the two baffles are used to limit the chip module along the axial direction of the rotating rod.

[0019] In the present invention, the baffle is provided to prevent the chip module from falling from the edge of the strip groove when the flip plate rotates, thereby further improving the stability of the flip mechanism when in use.

[0020] Preferably, it also includes a loading mechanism arranged at the detection equipment body, the loading mechanism is used to transport the chip module to the first detection station; the loading mechanism includes a first pulley transmission module, the first pulley transmission module includes two side plates, a group of rotatable first synchronous belts for conveying the chip box are provided between the two side plates, a group of rotating shafts are provided between the two side plates, a first synchronous pulley matching the first synchronous belt is provided at the rotating shaft, and a reduction motor for driving the rotating shaft to rotate is also provided at the loading mechanism; the first pulley transmission module is provided with a lifting mechanism for lifting the chip box at the end portion along its conveying direction, the lifting mechanism includes a placement rack for receiving the chip box, and the placement rack is provided with a motor for driving the placement rack to move in the vertical direction A movable screw drive module is provided at the feeding mechanism, and an ejection module for ejecting the chip module in the chip box on the placement rack is also provided; the ejection module includes a motor plate mounting frame, a motor plate is provided at the motor plate mounting frame, a second pulley transmission module is provided at the motor plate, the second pulley transmission module includes a rotatable second synchronous belt and a second synchronous pulley matched with the second synchronous belt, and a synchronous pulley motor for driving the second synchronous pulley to rotate is provided at the motor mounting plate; a slide rail arranged along the conveying direction of the second synchronous belt is also provided at the motor plate mounting frame, a slider is provided at the slide rail, a push plate for pushing the chip module in the chip box out of the chip box is provided at the slider, and a connecting block connected to the second synchronous belt so that the slider moves synchronously with the second synchronous belt is provided at the slider.

[0021] In the present invention, by setting the feeding mechanism structure, the chip modules in the chip box can be pushed out layer by layer to the round belt at the first belt pulley group, so that the automatic feeding of the chip modules can be realized.

[0022] Preferably, the feeding mechanism is also provided with a collecting module for collecting the chip boxes, the collecting module includes an empty box rack arranged above the first pulley transmission module, and the empty box rack includes a placement plate; a double-axis cylinder is provided near the placement plate at the screw drive module for pushing the chip box on the placement rack to the placement plate.

[0023] In the present invention, by setting up the collection module, the chip box can be pushed to the placement plate by the double-axis cylinder, so that the automatic collection of the empty chip box can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a three-dimensional diagram of the gold wire optical automatic detection equipment in Example 1.

[0025] Figure 2 for Figure 1 Schematic diagram of the internal structure of Zhongjinxian optical automatic detection equipment.

[0026] Figure 3This is a schematic diagram of the structure of the first detection station and the second detection station in Example 2.

[0027] Figure 4 for Figure 3 Schematic diagram of the structure of the first inspection station.

[0028] Figure 5 for Figure 2 Schematic diagram of the structure of the second detection station.

[0029] Figure 6 This is a schematic diagram of the structure of the first belt pulley assembly in Example 3.

[0030] Figure 7 for Figure 6 Enlarged view of part A.

[0031] Figure 8 for Figure 2 Schematic diagram of the structure of the flip mechanism.

[0032] Fig. 9 for Figure 2 Schematic diagram of the structure of the feeding mechanism.

[0033] Fig.10 for Fig. 9 Structural explosion diagram of the middle loading mechanism.

[0034] Fig.11 for Fig.10 Schematic diagram of the structure of the ejector module. DETAILED DESCRIPTION

[0035] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments are only for explaining the present invention and are not intended to limit it.

[0036] Example 1

[0037] like Figure 1 , 2 As shown, the present embodiment provides a gold wire optical automatic inspection device, which includes an inspection device body 100, the inspection device body 100 includes a first inspection station 210 for visually inspecting the front side of the chip module and a second inspection station 220 for visually inspecting the back side of the chip module; and also includes a conveying mechanism 230 for conveying the chip module to the first inspection station 210 and the second inspection station 220 in sequence, and the conveying mechanism 230 is provided with a flipping mechanism 240 located between the first inspection station 210 and the second inspection station 220, and the flipping mechanism 240 is used to flip the chip module.

[0038] When in use, the chip module is transported to the bottom of the first inspection station 210 by the transport mechanism 230, and the front side of the chip module is inspected by the first inspection station 210. Then, the chip module is transported to the bottom of the second inspection station 220 by the transport mechanism 230, and the back side of the chip module is inspected by the second inspection station 220. The gold wire optical automatic inspection equipment in this embodiment can sequentially realize the inspection of the front and back sides of the chip module through the cooperation between the first inspection station 210, the second inspection station 220 and the flip mechanism 230, which is better than the currently common optical inspection equipment that only has the ability to inspect one side, and the inspection efficiency of the chip module is improved.

[0039] Combination Figure 3 , 4 As shown, the first inspection station 210 includes a camera mounting frame 310 arranged at the inspection equipment body 100, and the camera mounting frame 310 is provided with a short-wave infrared scanning camera 320 for scanning the chip module, and the camera mounting frame 310 is also provided with a shading plate 330 located below the short-wave infrared scanning camera 320, and the shading plate 330 is provided with an image acquisition port 340; the camera mounting frame 310 is provided with a first micrometer displacement platform 350 for installing the short-wave infrared scanning camera 320.

[0040] When in use, the chip module is transported to the short-wave infrared scanning camera 320 at the first inspection station 210 through the conveying mechanism 230, and the image of the chip module is collected by the short-wave infrared scanning camera 320, and the image is analyzed by the visual algorithm, so as to detect the chip module. Among them, through the setting of the shading plate 330, the short-wave infrared scanning camera 320 only collects the image of the chip module, avoiding the short-wave infrared scanning camera 320 collecting redundant images outside the chip module and thus interfering with the algorithm analysis, thereby further improving the effect of the algorithm analysis. Among them, through the setting of the first micrometer displacement platform 350, the angle between the short-wave infrared scanning camera 320 and the shading plate 330 can be adjusted, so that the short-wave infrared scanning camera 320 can only scan the image of the chip module.

[0041] Combination Figure 3 as well as Figure 5 As shown, the second inspection station 220 includes a fixed frame 360 ​​arranged at the inspection equipment body 100, and a second micrometer displacement platform 370 is provided at the fixed frame 360. The second micrometer displacement platform 370 is provided with a short-wave line scan camera 380 for scanning the chip module. The model of the short-wave line scan camera 380 in this embodiment is MV-CL042-90GC-2.

[0042] In this embodiment, when the chip module moves to the bottom of the shortwave line scan camera 380, the shortwave line scan camera 380 can capture the image of the chip module and analyze the image through an image algorithm, thereby realizing detection of the back side of the chip module.

[0043] In this embodiment, the fixing frame 360 ​​includes a fixing plate 550, and the fixing plate 550 is provided with two groups of arc-shaped through holes 510 respectively located at the two ends of the short-wave line scan camera 380, and the fixing plate 550 is provided with a lamp mounting plate 520 located at the arc-shaped through hole 510, and the lamp mounting plate 520 is provided with an LED lamp 530. The lamp mounting plate 520 can move along the direction of the arc-shaped through hole 510 to adjust the illumination angle of the LED lamp 530, and the lamp mounting plate 520 is provided with a mounting plate screw hole 540 corresponding to the arc-shaped through hole 510, and the arc-shaped through hole 510 is provided with a first fixing bolt that cooperates with the mounting plate screw hole 540 to fix the lamp mounting plate 520.

[0044] In this embodiment, by setting the LED lamp 530, the chip module can be illuminated by the LED lamp 530, so that the short-wave line scan camera 380 can collect a clear image of the chip module, thereby improving the accuracy of the image algorithm analysis. Among them, by setting the annular through hole 510, the position of the lamp mounting plate 520 can be adjusted along the arc through hole 510, so as to adjust the illumination angle of the LED lamp 530, so that the LED lamp 530 can illuminate the chip module from a better angle, avoiding the interference of light reflection on the image acquisition of the short-wave line scan camera 380.

[0045] Combination Figure 6 As shown, the conveying mechanism 230 includes a first belt pulley group 390 arranged below the first inspection station 210 and a second belt pulley group 3100 arranged below the second inspection station 220. The first belt pulley group 390 and the second belt pulley group 3100 have the same structure. The first belt pulley group 390 and the second belt pulley group 3100 both include two pulley mounting plates 610 that are spaced apart. Two pulleys 620 are provided at the opposite end surfaces of the two pulley mounting plates 610. The two pulleys 620 are spaced apart along the length direction of the pulley mounting plates 610, and a round belt 630 for supporting the edge of the chip module is provided between the two pulleys 620.

[0046] In this embodiment, when the chip module reaches the first belt pulley set 390 or the second belt pulley set 3100, the chip module is supported by the circular belt 630, so that the chip module can move with the rotation of the circular belt 630, thereby enabling the chip module to move to the short-wave infrared scanning camera 320 and the short-wave line scanning camera 380.

[0047] Combination Figure 7 As shown, a motor mounting plate 640 is provided at the pulley mounting plate 610, and a strip through hole 710 arranged along the height direction of the motor mounting plate 640 is provided at the motor mounting plate 640, and a pulley motor 720 that can move along the height direction of the motor mounting plate 640 is provided at the motor mounting plate 640 corresponding to the strip through hole 710, and a second fixing bolt passing through the strip through hole 710 for fixing the pulley motor 720 is provided at the strip through hole 710, and a driving wheel 730 matched with the round belt 630 is provided at the rotating shaft of the pulley motor 720; two driven wheels 740 are provided at the motor mounting plate 640, and the two driven wheels 740 are respectively located at the two ends of the driving wheel 730, and the two driven wheels 740 are used together to press the round belt 630 against the driving wheel 730.

[0048] When in use, the power supply of the pulley motor 720 is turned on, so that the driving wheel 730 at the pulley motor 720 drives the round belt 630 to rotate, thereby realizing the driving of the round belt 630. Among them, through the setting of the bar-shaped through hole 710, when installing the pulley motor 720, the installer can adjust the position of the pulley motor 720 to tighten the round belt 630, so that the driving wheel 730 can drive the round belt 630 to rotate. Through the setting of the driven wheel 740, the round belt 630 can be pressed against the driving wheel 730, thereby further improving the friction between the round belt 630 and the driving wheel 730, so that the driving wheel 730 can stably drive the round belt 630 to rotate.

[0049] Combination Figure 8 As shown, the flipping mechanism 240 includes a rotating rod mounting frame 810 arranged between the first belt pulley group 390 and the second belt pulley group 3100, a rotatable rotating rod 820 is provided at the rotating rod mounting frame 810, and a rotating rod motor 860 for driving the rotating rod 820 to rotate is provided at the rotating rod mounting frame 810; two flaps 830 arranged along the axial direction of the rotating rod 820 are provided at the rotating rod 820, and both ends of the flaps 830 along the radial direction of the rotating rod 820 are provided with strip grooves 840 for cooperating with the edge of the chip module, and an inclined surface 850 is provided at the opening of the strip groove 840; the strip grooves 840 at the same end of the two flaps 830 at the rotating rod 820 are used together to flip the chip module from the first belt pulley group 390 to the second belt pulley group 3100.

[0050] When the chip module moves from the first belt pulley group 390 to the strip groove 840 in the flap 830, the rotating rod motor 860 is started, so that the flap 830 rotates with the rotation of the rotating rod 820, thereby flipping the chip module 180° from the first belt pulley group 390 and flipping it to the round belt 630 at the second belt pulley group 3100, thereby not only transferring the chip module from the first belt pulley group 390 to the second belt pulley group 3100, but also flipping the chip module, so that the second inspection station 220 can inspect the back of the chip module.

[0051] In this embodiment, the flipping mechanism 240 also includes two baffles 3110, which are arranged between the first belt pulley set 390 and the second belt pulley set 3100, and the two baffles 3110 are arranged at intervals along the axis of the rotating rod 820. The two baffles 3110 are used to limit the chip module along the axial direction of the rotating rod 820.

[0052] In this embodiment, the provision of the baffle 3110 can prevent the chip module from falling from the edge of the strip groove 840 when the flip plate 830 rotates, thereby further improving the stability of the flip mechanism 240 when in use.

[0053] Combination Figure 9-11As shown, it also includes a feeding mechanism arranged at the detection device body 100, and the feeding mechanism is used to transport the chip module to the first detection station 210; the feeding mechanism includes a first pulley transmission module 910, and the first pulley transmission module 910 includes two side plates 1010, and a group of rotatable first synchronous belts 1020 for conveying chip boxes are arranged between the two side plates 1010, and a group of rotating shafts 1030 are arranged between the two side plates 1010, and the rotating shafts 10 A first synchronous pulley 1040 matched with the first synchronous belt 1020 is provided at 30, and a reduction motor 1050 for driving the rotating shaft 1030 to rotate is also provided at the feeding mechanism; a lifting mechanism for lifting the chip box is provided at the end portion of the first pulley transmission module 910 along its conveying direction, the lifting mechanism includes a placement rack 920 for receiving the chip box, a screw drive module 930 is provided at the placement rack 920 for driving the placement rack 920 to move in a vertical direction, and an ejection module 940 is also provided at the feeding mechanism for ejecting the chip module in the chip box at the placement rack 920; the ejection module 940 includes a motor plate mounting frame 1110, a motor plate is provided at the motor plate mounting frame 1110, a second pulley transmission module 1120 is provided at the motor plate, the second pulley transmission module 1120 includes a rotatable second synchronous belt 1130 and a second synchronous pulley 1140 matched with the second synchronous belt 1130, and a second synchronous belt driving module 1140 is provided at the motor mounting plate 640 The wheel 1140 rotates the synchronous pulley motor 1150; the motor plate mounting frame 1110 is also provided with a slide rail 1160 arranged along the conveying direction of the second synchronous belt 1130, and a slider 1170 is provided at the slide rail 1160 to match it. The slider 1170 is provided with a push plate 1180 for pushing the chip module in the chip box out of the chip box, and the slider 1170 is provided with a connecting block 1190 connected to the second synchronous belt 1130 so that the slider 1170 moves synchronously with the second synchronous belt 1130.

[0054] When loading, place the chip box containing the chip module on the first pulley transmission module 910, move the chip box to the placement rack 920 of the lifting mechanism through the first synchronous belt 1020, start the synchronous pulley motor 1150 so that the second synchronous belt 1130 drives the push plate 1180 on the slider 1170 to move back and forth, and drive the chip box upward along the height direction of the screw drive module 930 through the screw drive module 930, so that the chip modules in the chip box are pushed out layer by layer to the round belt 630 at the first belt pulley group 390, so that automatic loading of the chip module can be realized.

[0055] In this embodiment, a collecting module 950 for collecting chip boxes is also provided at the loading mechanism, and the collecting module 950 includes an empty box rack 1060 arranged above the first pulley transmission module 910, and the empty box rack 1060 includes a placement plate 1070; a double-axis cylinder 1080 is provided at the screw drive module 930 near the placement plate 1070 for pushing the chip box at the placement rack 920 to the placement plate 1070.

[0056] After the chip module in the chip box is completely pushed out, the screw drive module 930 is driven to make the placement rack 920 continue to move upward, and then the chip box is pushed to the placement plate 1070 by the dual-axis cylinder 1080, so that the empty chip box can be automatically collected.

[0057] In conclusion, the above is only a preferred embodiment of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the patent of the present invention.

Claims

1. Gold wire optical automatic detection equipment, characterized by: The detection device body (100) comprises a first detection station (210) for visually detecting the front side of a chip module and a second detection station (220) for visually detecting the back side of the chip module; the detection device body (100) also comprises a conveying mechanism (230) for conveying the chip module to the first detection station (210) and the second detection station (220) in sequence, the conveying mechanism (230) being provided with a flipping mechanism (240) located between the first detection station (210) and the second detection station (220), the flipping mechanism (240) being used to flip the chip module; The conveying mechanism (230) comprises a first belt pulley group (390) arranged below the first inspection station (210) and a second belt pulley group (3100) arranged below the second inspection station (220), the first belt pulley group (390) and the second belt pulley group (3100) having the same structure, both of which comprise two belt pulley mounting plates (610) arranged at intervals, two belt pulleys (620) being arranged at opposite end surfaces of the two belt pulley mounting plates (610), the two belt pulleys (620) being arranged at intervals along the length direction of the belt pulley mounting plates (610), and a round belt (630) for supporting the edge of the chip module being arranged between the two belt pulleys (620); The flipping mechanism (240) comprises a rotating rod mounting frame (810) arranged between the first belt pulley group (390) and the second belt pulley group (3100); a rotatable rotating rod (820) is arranged at the rotating rod mounting frame (810); a rotating rod motor (860) for driving the rotating rod (820) to rotate is arranged at the rotating rod mounting frame (810); two flaps (830) arranged along the axial direction of the rotating rod (820) are arranged at the rotating rod (820); both ends of the flaps (830) along the radial direction of the rotating rod (820) are provided with strip grooves (840) for matching with the edge of the chip module; an inclined surface (850) is arranged at the opening of the strip grooves (840); the strip grooves (840) at the same end of the two flaps (830) at the rotating rod (820) are used to flip the chip module from the first belt pulley group (390) to the second belt pulley group (3100); The flip mechanism (240) further comprises two baffles (3110), wherein the two baffles (3110) are arranged between the first belt pulley assembly (390) and the second belt pulley assembly (3100), and the two baffles (3110) are arranged at intervals along the axis of the rotating rod (820), and the two baffles (3110) are used to limit the chip module along the axial direction of the rotating rod (820); The device also includes a loading mechanism disposed at the detection device body (100), the loading mechanism being used to transport the chip module to the first detection station (210); the loading mechanism includes a first belt pulley transmission module (910), the first belt pulley transmission module (910) includes two side panels (1010), a group of rotatable first synchronous belts (1020) for transporting the chip box are disposed between the two side panels (1010), a group of rotating shafts (1030) are disposed between the two side panels (1010), and a rotating shaft (1030) is disposed at the rotating shaft (1030). A first synchronous pulley (1040) is provided to cooperate with the first synchronous belt (1020); a reduction motor (1050) is also provided at the feeding mechanism for driving the rotating shaft (1030) to rotate; a lifting mechanism for lifting the chip box is provided at the end portion of the first pulley transmission module (910) along its conveying direction; the lifting mechanism includes a placement rack (920) for receiving the chip box; a screw drive module (930) is provided at the placement rack (920) for driving the placement rack (920) to move in a vertical direction; and a screw drive module (930) is also provided at the feeding mechanism for moving the placement rack The ejection module (940) is used to eject the chip module in the chip box at (920); the ejection module (940) includes a motor plate mounting frame (1110), a motor plate is provided at the motor plate mounting frame (1110), a second pulley transmission module (1120) is provided at the motor plate, the second pulley transmission module (1120) includes a rotatable second synchronous belt (1130) and a second synchronous pulley (1140) matched with the second synchronous belt (1130), and a second synchronous pulley (1140) is provided at the motor mounting plate (640) for driving the second synchronous pulley A rotating synchronous pulley motor (1150); a slide rail (1160) arranged along the conveying direction of the second synchronous belt (1130) is also provided at the motor plate mounting frame (1110); a slider (1170) is matched with the slide rail (1160); a push plate (1180) is provided at the slider (1170) for pushing a chip module in the chip box out of the chip box; and a connecting block (1190) is provided at the slider (1170) for connecting with the second synchronous belt (1130) so that the slider (1170) moves synchronously with the second synchronous belt (1130).

2. The gold wire optical automatic detection equipment according to claim 1, characterized in that: The first inspection station (210) comprises a camera mounting frame (310) arranged at the inspection equipment body (100); a short-wave infrared scanning camera (320) for scanning the chip module is arranged at the camera mounting frame (310); a light shielding plate (330) located below the short-wave infrared scanning camera (320) is also arranged at the camera mounting frame (310); an image acquisition port (340) is arranged at the light shielding plate (330); and a first micrometer displacement platform (350) for mounting the short-wave infrared scanning camera (320) is provided at the camera mounting frame (310).

3. The gold wire optical automatic detection equipment according to claim 1, characterized in that: The second inspection station (220) comprises a fixing frame (360) arranged at the inspection device body (100), a second micrometer displacement platform (370) being arranged at the fixing frame (360), and a short-wave line scan camera (380) for scanning the chip module being arranged at the second micrometer displacement platform (370).

4. The gold wire optical automatic detection device according to claim 3, characterized in that: The fixing frame (360) comprises a fixing plate (550), wherein the fixing plate (550) is provided with two groups of arc-shaped through holes (510) respectively located at two ends of the short-wave line scan camera (380), wherein the fixing plate (550) is provided with a lamp mounting plate (520) located at the arc-shaped through hole (510), wherein the lamp mounting plate (520) is provided with an LED lamp (530), wherein the lamp mounting plate (520) is capable of moving along the direction of the arc-shaped through hole (510) to adjust the illumination angle of the LED lamp (530), wherein the lamp mounting plate (520) is provided with a mounting plate screw hole (540) corresponding to the arc-shaped through hole (510), and wherein the arc-shaped through hole (510) is provided with a first fixing bolt which cooperates with the mounting plate screw hole (540) to fix the lamp mounting plate (520).

5. The gold wire optical automatic detection equipment according to claim 1, characterized in that: A motor mounting plate (640) is provided at the pulley mounting plate (610), a strip through hole (710) arranged along the height direction of the motor mounting plate (640) is provided at the motor mounting plate (640), a pulley motor (720) that can move along the height direction of the motor mounting plate (640) is provided at the motor mounting plate (640) corresponding to the strip through hole (710), a second fixing bolt that passes through the strip through hole (710) and is used to fix the pulley motor (720) is provided at the strip through hole (710), and a driving wheel (730) that matches the round belt (630) is provided at the rotating shaft of the pulley motor (720); two driven wheels (740) are provided at the motor mounting plate (640), the two driven wheels (740) are respectively located at the two ends of the driving wheel (730), and the two driven wheels (740) are used together to make the round belt (630) abut against the driving wheel (730).

6. The gold wire optical automatic detection equipment according to claim 1, characterized in that: The loading mechanism is also provided with a collecting module (950) for collecting chip boxes, the collecting module (950) comprising an empty box rack (1060) arranged above the first pulley transmission module (910), the empty box rack (1060) comprising a placement plate (1070); a double-axis cylinder (1080) for pushing the chip box on the placement rack (920) to the placement plate (1070) is provided at the screw drive module (930) near the placement plate (1070).

Images