Cutting method of diamond wire

Abstract

The application relates to the photovoltaic technical field and provides a cutting method of a diamond wire, which comprises the following steps: arranging a crystal bar on a workbench of a cutting machine; setting a feeding speed of the workbench and a running speed of the diamond wire; running the workbench at the feeding speed and running the diamond wire at the running speed to cut the crystal bar; setting the feeding speed to increase from a first speed to a second speed when the cutting depth of the crystal bar is before a first depth; setting the feeding speed to decrease from the second speed to a third speed when the cutting depth of the crystal bar is between the first depth and a second depth; running the diamond wire at a first preset speed for a first preset time according to zero acceleration, slowing down to zero, then running the diamond wire at a second preset speed for a second preset time according to zero acceleration, and slowing down to zero from the second preset speed. The cutting method effectively reduces the acceleration time of the diamond wire, shortens the non-effective cutting time, reduces the cutting cumulative wire bow, improves the surface quality of the silicon wafer, and improves the cutting efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photovoltaic technology, in particular to a cutting method of diamond wire. BACKGROUND

[0002] At present, solar monocrystalline silicon wafer cutting mainly adopts electroplated diamond wire cutting. With the upgrading of technology, the optimization of cost is constantly pursued. Large-size silicon wafer thinning pursues higher wafer output per kilogram. Under the same loading condition, more wafer output per kilogram will cause the load to increase during the slicing process, and the force on the wire net will increase, thereby causing the wire net bow to increase, and further causing cutting abnormalities such as wire breakage and wire mark TTV. SUMMARY

[0003] The present application provides a cutting method of diamond wire to solve the defects that more wafer output per kilogram will cause the load to increase during the slicing process, and the force on the wire net will increase, thereby causing the wire net bow to increase, and further causing cutting abnormalities such as wire breakage and wire mark TTV.

[0004] The present application provides a cutting method of diamond wire, comprising:

[0005] setting a crystal bar on a workbench of a cutting machine;

[0006] setting a feed speed of the workbench and a running speed of the diamond wire;

[0007] making the workbench run at the set feed speed, and making the diamond wire run forward and backward at the set running speed, to cut the crystal bar;

[0008] wherein, before the cutting depth of the diamond wire on the crystal bar is a first depth, the feed speed of the workbench is set to increase from a first speed to a second speed; and when the cutting depth of the diamond wire on the crystal bar is between the first depth and a second depth, the feed speed of the workbench is set to decrease from the second speed to a third speed;

[0009] the diamond wire first runs forward at a speed increasing from zero to a first preset speed, and then runs forward at the first preset speed for a first preset time, and then, after the speed decreasing from the first preset speed to zero, the diamond wire runs backward at a speed increasing from zero to a second preset speed, and then runs backward at the second preset speed for a second preset time, and then, after the speed decreasing from the second preset speed to zero.

[0010] According to the cutting method of the diamond wire provided by the present application, the crystal bar is set on the workbench of the cutting machine, comprising:

[0011] adhering and curing the crystal bar to a plastic plate;

[0012] Cleaning the solidified crystal rod;

[0013] The cleaned crystal rod is placed into the clamping guide rail of the workbench to ensure that the crystal rod is clamped normally in the clamping guide rail of the workbench.

[0014] According to a diamond wire cutting method provided by the present invention, the feed speed of the workbench increases or decreases in a step-by-step manner.

[0015] According to a diamond wire cutting method provided by the present invention, the running speed of the diamond wire increases in a curve, and the running speed of the diamond wire decreases in a curve.

[0016] According to a diamond wire cutting method provided by the present invention, before cutting the crystal rod, the forward routing distance and the reverse routing distance of the diamond wire are set so that the forward routing distance of the diamond wire is greater than the reverse routing distance of the diamond wire.

[0017] A diamond wire cutting method according to the present invention further includes:

[0018] The running motor speeds of the respective cutting main rollers driving the diamond wire are set so that the running motors of the respective cutting main rollers run synchronously, or a speed difference exists between the running motors of at least two cutting main rollers.

[0019] According to a diamond wire cutting method provided by the present invention, during the process of cutting the crystal rod, the method further comprises:

[0020] measuring the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is the first depth;

[0021] The distance between the diamond wire and the top of the crystal ingot is measured when the cutting depth of the crystal ingot is the second depth.

[0022] According to a diamond wire cutting method provided by the present invention, before the diamond wire cuts the crystal ingot to a first depth, setting the feed speed of the workbench to increase from a first speed to a second speed includes:

[0023] Before the cutting depth of the crystal ingot accounts for 10% of the total thickness of the crystal ingot, setting the feed speed of the workbench to the first speed;

[0024] When the cutting depth of the crystal ingot accounts for 10% to 20% of the total thickness of the crystal ingot, the feed speed of the workbench is set to a first intermediate speed;

[0025] When the cutting depth of the crystal ingot accounts for 20% to 30% of the total thickness of the crystal ingot, the feed speed of the workbench is set to a second intermediate speed;

[0026] When the cutting depth of the crystal ingot accounts for 30% to 40% of the total thickness of the crystal ingot, the feed speed of the workbench is set to a third intermediate speed;

[0027] When the cutting depth of the crystal ingot accounts for 40% to 50% of the total thickness of the crystal ingot, the feed speed of the workbench is set to a fourth intermediate speed;

[0028] When the cutting depth of the crystal ingot accounts for 50%-60% of the total thickness of the crystal ingot, the feed speed of the workbench is set to the fifth intermediate speed;

[0029] When the cutting depth of the crystal ingot accounts for 60% of the total thickness of the crystal ingot, the feed speed of the workbench is set to the second speed.

[0030] According to a diamond wire cutting method provided by the present invention, when the cutting depth of the diamond wire on the crystal ingot is between the first depth and the second depth, the feed speed of the workbench is set to be reduced from the second speed to a third speed, comprising:

[0031] When the cutting depth of the crystal ingot accounts for 60% to 70% of the total thickness of the crystal ingot, the feed speed of the workbench is set to the second speed;

[0032] When the cutting depth of the crystal ingot accounts for 70% to 80% of the total thickness of the crystal ingot, the feed speed of the workbench is set to a sixth intermediate speed;

[0033] When the cutting depth of the crystal ingot accounts for 80% of the total thickness of the crystal ingot, the feed speed of the workbench is set to the third speed.

[0034] According to a diamond wire cutting method provided by the present invention, the time for the running speed of the diamond wire to accelerate from zero to the first preset speed is 4.5 seconds to 7 seconds; the time for the running speed of the diamond wire to decelerate from the first preset speed to zero is 4.5 seconds to 7 seconds; the time for the running speed of the diamond wire to accelerate from zero to the second preset speed is 4.5 seconds to 7 seconds, and the time for the running speed of the diamond wire to decelerate from the second preset speed to zero is 4.5 seconds to 7 seconds.

[0035] The application provides a cutting method of the diamond wire, which comprises the following steps: accelerating the running speed of the diamond wire from zero to a first preset speed, running the diamond wire at the first preset speed for a first preset time, then reducing the running speed of the diamond wire from the first preset speed to zero, and then reversing the running direction of the diamond wire, so that the diamond wire runs forward and backward repeatedly, thereby effectively reducing the acceleration time of the diamond wire, shortening the non-effective cutting time, improving the cutting capacity, reducing the cumulative wire bow of cutting, improving the surface quality of the silicon wafer, improving the cutting efficiency, and prolonging the service life of the diamond wire; in addition, the feeding speed of the workbench is accelerated and reduced according to the cutting depth of the crystal bar, so that the feeding speed of the workbench can be effectively improved, the production efficiency of the silicon wafer cutting can be effectively improved, the manufacturing cost of the silicon wafer can be reduced, the production capacity can be improved, the wire bow can be effectively reduced, and the wire breakage rate can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0037] Figure 1 is one of the flowcharts of the cutting method of the diamond wire provided by the application;

[0038] Figure 2 is the second flowchart of the cutting method of the diamond wire provided by the application;

[0039] Figure 3 is a speed change diagram of the diamond wire provided by the application (the diamond wire increases or decreases according to the first S-shaped curve);

[0040] Figure 4 is a speed change diagram of the diamond wire provided by the application (the diamond wire increases or decreases according to the second S-shaped curve). DETAILED DESCRIPTION

[0041] In order to make the objects, technical solutions and advantages of the application clearer, the technical solutions in the application will be described clearly and completely in combination with the drawings in the application. Obviously, the described embodiments are some embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without any creative effort belong to the protection scope of the application.

[0042] The cutting method of the diamond wire provided by the application will be described below in combination with Figures 1 to 2

[0043] As Figure 1 ​As shown, the present invention provides a diamond wire cutting method, comprising:

[0044] Step S1: placing the crystal ingot on the workbench of the cutting machine;

[0045] Step S2: setting the feed speed of the workbench and the running speed of the diamond wire;

[0046] Step S3: The workbench is operated at a set feed speed, and the diamond wire is operated back and forth at a set operating speed to cut the crystal rod.

[0047] Wherein, before the cutting depth of the diamond wire on the crystal ingot reaches the first depth, the feed speed of the worktable is set to increase from the first speed to the second speed; and when the cutting depth of the diamond wire on the crystal ingot reaches between the first depth and the second depth, the feed speed of the worktable is set to decrease from the second speed to the third speed;

[0048] The diamond wire is first routed in a forward direction by accelerating from zero to a first preset speed, and routed in a forward direction at the first preset speed for a first preset time, and then decelerated from the first preset speed to zero. The diamond wire is then routed in a reverse direction by accelerating from zero to a second preset speed, and routed in a reverse direction at the second preset speed for a second preset time, and then decelerated from the second preset speed to zero.

[0049] With such an arrangement, the diamond wire is made to run back and forth by accelerating the running speed from zero to a first preset speed, then running at a constant speed at the first preset speed for a first preset time, and then reducing the first preset speed to zero, and then making the diamond wire run in the opposite direction. This can effectively reduce the acceleration time of the diamond wire, shorten the ineffective cutting time, improve the cutting capacity, reduce the accumulated wire bow during cutting, improve the surface quality of the silicon wafer, improve the cutting efficiency, and increase the service life of the diamond wire. In addition, increasing and decreasing the descending speed of the workbench according to the cutting depth of the crystal rod can effectively increase the feed speed of the workbench, effectively improve the production efficiency of silicon wafer cutting, and help reduce the manufacturing cost of silicon wafers, improve production capacity, and effectively reduce wire bow and wire breakage rate.

[0050] In an optional embodiment of the present invention, placing the crystal ingot on a workbench of a cutting machine may include:

[0051] Bonding and curing the crystal rod to the plastic plate;

[0052] Clean the solidified crystal rod;

[0053] Place the cleaned crystal rod into the clamping guide rail of the workbench and ensure that the crystal rod is clamped properly in the clamping guide rail of the workbench.

[0054] In an optional embodiment of the present application, before cutting the crystal bar, the cutting method of the diamond wire can further include:

[0055] Laying the cutting wire net, using the diamond wire as the cutting wire, laying the cutting wire on the cutting main roller to form the wire net, and setting the cutting tension of the cutting wire to 4N;

[0056] Adding the cutting liquid, adding a certain amount of mixed liquid of pure water and cooling liquid into the cutting liquid circulating system, setting the temperature of the cutting liquid to 20 degrees Celsius, and setting the circulating flow of the cutting liquid to 200L / min.

[0057] In this way, the subsequent crystal bar cutting work can be prepared.

[0058] In an optional embodiment of the present application, the feeding speed of the workbench can be increased or decreased in steps.

[0059] In an optional embodiment, before the cutting depth of the diamond wire on the crystal bar reaches the first depth, setting the feeding speed of the workbench from the first speed to the second speed can include:

[0060] Before the cutting depth of the crystal bar accounts for 10% of the total thickness of the crystal bar, the feeding speed of the workbench can be set to the first speed;

[0061] During the stage when the cutting depth of the crystal bar accounts for between 10% and 20% of the total thickness of the crystal bar, the feeding speed of the workbench can be set to the first intermediate speed;

[0062] During the stage when the cutting depth of the crystal bar accounts for between 20% and 30% of the total thickness of the crystal bar, the feeding speed of the workbench can be set to the second intermediate speed;

[0063] During the stage when the cutting depth of the crystal bar accounts for between 30% and 40% of the total thickness of the crystal bar, the feeding speed of the workbench can be set to the third intermediate speed;

[0064] During the stage when the cutting depth of the crystal bar accounts for between 40% and 50% of the total thickness of the crystal bar, the feeding speed of the workbench can be set to the fourth intermediate speed;

[0065] During the stage when the cutting depth of the crystal bar accounts for between 50% and 60% of the total thickness of the crystal bar, the feeding speed of the workbench can be set to the fifth intermediate speed;

[0066] When the cutting depth of the crystal bar accounts for 60% of the total thickness of the crystal bar, the feeding speed of the workbench can be set to the second speed.

[0067] Here, the first depth can be 60% of the total thickness of the crystal bar.

[0068] With this arrangement, before the diamond wire cuts the crystal rod to a depth of 60%, the speed of the workbench can be set to increase in a step-by-step manner, even if the descending speed of the crystal rod increases in a step-by-step manner, thereby effectively improving the feed speed of the workbench and effectively improving the production efficiency of silicon wafer cutting, which is beneficial to reducing the manufacturing cost of silicon wafers and improving production capacity.

[0069] In an optional embodiment of the present invention, when the cutting depth of the diamond wire on the crystal ingot is between the first depth and the second depth, setting the feed speed of the worktable to decrease from the second speed to the third speed may include:

[0070] When the cutting depth of the crystal ingot is between 60% and 70% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to the second speed;

[0071] When the cutting depth of the crystal ingot is between 70% and 80% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to the sixth intermediate speed;

[0072] When the cutting depth of the crystal ingot accounts for 80% of the total thickness of the crystal ingot, the feed speed of the workbench can be set to the third speed.

[0073] Here, the second depth may be 80% of the total thickness of the crystal ingot.

[0074] With this arrangement, after the cutting depth of the diamond wire on the crystal rod reaches 60%, the feed speed of the workbench is reduced in a step-by-step manner, that is, the descending speed of the crystal rod is reduced in a step-by-step manner, which can flatten the wire mesh, thereby reducing the wire bow and the wear of the diamond wire, thereby reducing the wire consumption of the diamond wire, reducing the slicing cost, and reducing the cutting time.

[0075] It should be noted that when the cutting depth reaches 60%-80%, the wire bow of the diamond wire reaches its maximum value. At this time, the longitudinal force generated by the diamond wire is relatively large, which is conducive to fast cutting. Lowering the feed speed of the workbench will not increase the cutting time of the crystal rod.

[0076] In an optional embodiment of the present invention, the cutting speed of the diamond wire can be increased or decreased in a curve. This helps reduce the acceleration time of the diamond wire, optimizes the wire's linear velocity and acceleration, shortens the ineffective cutting time, improves the diamond wire's cycle cutting capacity, reduces the load on the diamond wire, reduces wear and deformation of the diamond wire during the cutting process, reduces accumulated wire bow during cutting, and effectively improves the surface quality of the silicon wafer, shortens the cutting time, and improves cutting efficiency.

[0077] In an optional embodiment, the time for the running speed of the diamond wire to accelerate from zero to the first preset speed can be 4.5 seconds to 7 seconds, and the time for the running speed of the diamond wire to decelerate from the first preset speed to zero can be 4.5 seconds to 7 seconds; the time for the running speed of the diamond wire to accelerate from zero to the second preset speed can be 4.5 seconds to 7 seconds, and the time for the running speed of the diamond wire to decelerate from the second preset speed to zero can be 4.5 seconds to 7 seconds.

[0078] In an optional embodiment, the cutting speed of the diamond wire may increase in an S-shaped curve, and the cutting speed of the diamond wire may decrease in an S-shaped curve.

[0079] Specifically, when the forward running time of the diamond wire is from 0 to 4.5 seconds, the linear speed of the diamond wire increases to the maximum linear speed in an S-shaped curve, that is, when the forward running of the diamond wire is accelerated to 4.5 seconds, the linear speed of the diamond wire is the first preset speed; when the diamond wire runs forward at a constant speed at the first preset speed for the first preset time, the linear speed of the diamond wire decreases to zero in an S-shaped curve. During this deceleration process, the forward running time of the diamond wire can be 4.5 seconds.

[0080] During the forward acceleration and deceleration of the diamond wire, Figure 3 As shown, the diamond wire runs according to the first S-shaped curve.

[0081] During the forward acceleration of the diamond wire, the acceleration of the diamond wire from 0 to 2.5 seconds is less than the acceleration of the diamond wire from 2.5 seconds to 4.5 seconds, that is, the acceleration of the diamond wire from 0 to 2.5 seconds is less than the acceleration of the diamond wire from 2.5 to 4.5 seconds. In this way, the diamond wire can be accelerated slowly first and then quickly increased to the first preset speed, which is beneficial for reducing the acceleration time of the diamond wire and shortening the non-effective cutting time.

[0082] Furthermore, during the forward deceleration of the diamond wire, the acceleration of the diamond wire during the deceleration time from 0 to 2.5 seconds is greater than the acceleration during the deceleration time from 2.5 to 4.5 seconds. This allows the diamond wire to be decelerated quickly first and then slowly to zero, which not only helps to reduce the deceleration time of the diamond wire, but also shortens the non-effective cutting time, reduces the deformation of the diamond wire, and improves the wire bow.

[0083] During the reverse acceleration and deceleration of the diamond wire, Figure 4 As shown, the diamond wire runs according to the second S-shaped curve.

[0084] When the reverse running time of the diamond wire is from 0 to 4.5 seconds, the linear speed of the diamond wire increases to the maximum linear speed in the form of a second S-shaped curve, that is, when the reverse running of the diamond wire is accelerated to 4.5 seconds, the linear speed of the diamond wire is the second preset speed; when the diamond wire runs in the reverse direction at a uniform speed according to the second preset speed for the first preset time, the linear speed of the diamond wire decreases to zero in the form of a second S-shaped curve. During this deceleration process, the reverse running time of the diamond wire can be 4.5 seconds.

[0085] During the reverse acceleration of the diamond wire, the acceleration of the diamond wire from 0 to 2.5 seconds is greater than the acceleration of the diamond wire from 2.5 seconds to 4.5 seconds. That is, the acceleration of the diamond wire from 0 to 2.5 seconds is greater than the acceleration of the diamond wire from 2.5 to 4.5 seconds. In this way, the diamond wire can be accelerated quickly first and then slowly increased to the first preset speed, which is beneficial for reducing the acceleration time of the diamond wire and shortening the non-effective cutting time.

[0086] Furthermore, during the reverse deceleration of the wire, the wire's acceleration during the deceleration time from 0 to 2.5 seconds is greater than during the deceleration time from 2.5 to 4.5 seconds. This allows the wire to be decelerated slowly before rapidly returning to zero, which not only reduces the wire's deceleration time but also shortens the ineffective cutting time, reduces wire deformation, and improves wire bow.

[0087] In an optional embodiment of the present invention, the forward and reverse run distances of the diamond wire can be set before slicing the ingot, so that the forward run distance is greater than the reverse run distance. This helps reduce wear on the diamond wire and increase its service life.

[0088] Here, the forward routing distance of the diamond wire can be 800m, that is, the forward wire feeding amount of the diamond wire can be 800m; the reverse routing distance of the diamond wire can be 700m, that is, the reverse wire feeding amount of the diamond wire can be 700m.

[0089] In an optional embodiment of the present invention, the diamond wire cutting method may further include:

[0090] The speed difference of the running motors of the various cutting main rollers that drive the diamond wire to run is set so that the running motors of the various cutting main rollers run synchronously.

[0091] In another optional embodiment of the present invention, the diamond wire cutting method may further include:

[0092] The speed difference of the running motors of the cutting main rollers that drive the diamond wire is set so that there is a speed difference between the running motors of the cutting main rollers. This is conducive to ensuring that the wire feeding amount and the wire return amount of the diamond wire are inconsistent.

[0093] In an optional embodiment of the present invention, the process of cutting the crystal ingot may further include:

[0094] measuring the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is a first depth;

[0095] Measure the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is the second depth.

[0096] In this way, the bow of the diamond wire when the cutting depth of the crystal rod is the first depth and the second depth can be obtained according to the measured distance between the diamond wire and the top of the crystal rod, thereby monitoring the bow value of the diamond wire.

[0097] In an optional embodiment, a straight steel ruler may be used to measure the distance between the diamond wire and the top of the crystal ingot.

[0098] Here, the actual wire bow value of the diamond wire = the cutting depth actually displayed by the cutting machine - (crystal rod thickness - the distance between the diamond wire and the top of the crystal rod).

[0099] It should be noted that the actual cutting depth displayed by the cutting machine is the cutting depth of the diamond wire on the crystal rod.

[0100] In a first embodiment of the present invention, a method for cutting a diamond wire may include the following steps:

[0101] Step S11: bonding and curing the crystal rod onto the plastic plate;

[0102] Step S12: Cleaning the solidified crystal rod;

[0103] Step S13: Loading the cleaned crystal ingot into the clamping guide rail of the workbench of the cutting machine to ensure that the crystal ingot is properly clamped in the clamping guide rail of the workbench;

[0104] Step S14: Arranging a cutting wire net, using diamond wire as the cutting wire, laying the cutting wire on the cutting main roller to form a wire net, and setting the cutting tension of the cutting wire to 4N;

[0105] Step S15: adding cutting fluid, adding a certain amount of pure water and coolant mixture to the cutting fluid circulation system, and setting the cutting fluid temperature to 20 degrees Celsius and the cutting fluid circulation flow rate to 200 L / min;

[0106] Step S16: setting the feed speed of the workbench and the running speed of the diamond wire;

[0107] Step S17: lowering the workbench at a feed speed and causing the diamond wire to circulate back and forth to cut the crystal ingot;

[0108] Step S18: measuring the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is 60% of the total thickness of the crystal ingot;

[0109] Step S19: measuring the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is 80% of the total thickness of the crystal ingot.

[0110] Among them, setting the feed speed of the workbench and the running speed of the diamond wire can include:

[0111] Before the cutting depth of the crystal ingot accounts for 10% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1500m / min;

[0112] When the cutting depth of the crystal ingot is between 10% and 20% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1700 μm / min;

[0113] When the cutting depth of the crystal ingot is between 20% and 30% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1900 μm / min;

[0114] When the cutting depth of the crystal ingot is between 30% and 40% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2100 μm / min;

[0115] When the cutting depth of the crystal ingot is between 40% and 50% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2300μm / min;

[0116] When the cutting depth of the crystal ingot is between 50% and 60% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2500μm / min;

[0117] When the cutting depth of the crystal ingot accounts for 60% of the total thickness of the crystal ingot, the feed speed of the workbench can be set to 2800μm / min;

[0118] When the cutting depth of the crystal ingot is between 60% and 70% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2800μm / min;

[0119] When the cutting depth of the crystal ingot is between 70% and 80% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2500μm / min;

[0120] When the cutting depth of the crystal ingot accounts for 80% of the total thickness of the crystal ingot, the feed speed of the workbench can be set to 2300μm / min;

[0121] The diamond wire is first routed in a forward direction by accelerating from zero to 2400m / min, and routes in a forward direction at 2400m / min for a first preset time, and then decelerates from 2400m / min to zero. The diamond wire is then routed in a reverse direction by accelerating from zero to 2400m / min, and routes in a reverse direction at 2400m / min for a second preset time, and then decelerates from 2400m / min to zero.

[0122] In addition, the acceleration time and deceleration time of the diamond wire are both set to 4.5 seconds; the diamond wire is accelerated and decelerated according to the first S-shaped curve, and the speed of the running motor of the cutting main roller is set to synchronization, and the speed of the running motor is set to 3500r / min.

[0123] In a second embodiment of the present invention, a method for cutting a diamond wire may include the following steps:

[0124] Step S11: bonding and curing the crystal rod onto the plastic plate;

[0125] Step S12: Cleaning the solidified crystal rod;

[0126] Step S13: Loading the cleaned crystal ingot into the clamping guide rail of the workbench of the cutting machine to ensure that the crystal ingot is properly clamped in the clamping guide rail of the workbench;

[0127] Step S14: Arranging a cutting wire net, using diamond wire as the cutting wire, laying the cutting wire on the cutting main roller to form a wire net, and setting the cutting tension of the cutting wire to 4N;

[0128] Step S15: adding cutting fluid, adding a certain amount of pure water and coolant mixture to the cutting fluid circulation system, and setting the cutting fluid temperature to 20 degrees Celsius and the cutting fluid circulation flow rate to 200 L / min;

[0129] Step S16: setting the feed speed of the workbench and the running speed of the diamond wire;

[0130] Step S17: lowering the workbench at a feed speed and causing the diamond wire to circulate back and forth to cut the crystal ingot;

[0131] Step S18: measuring the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is 60% of the total thickness of the crystal ingot;

[0132] Step S19: measuring the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is 80% of the total thickness of the crystal ingot.

[0133] Among them, setting the feed speed of the workbench and the running speed of the diamond wire can include:

[0134] Before the cutting depth of the crystal ingot accounts for 10% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1500m / min;

[0135] When the cutting depth of the crystal ingot is between 10% and 20% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1700 μm / min;

[0136] When the cutting depth of the crystal ingot is between 20% and 30% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1900 μm / min;

[0137] When the cutting depth of the crystal ingot is between 30% and 40% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2100 μm / min;

[0138] When the cutting depth of the crystal ingot is between 40% and 50% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2300μm / min;

[0139] When the cutting depth of the crystal ingot is between 50% and 60% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2500μm / min;

[0140] When the cutting depth of the crystal ingot accounts for 60% of the total thickness of the crystal ingot, the feed speed of the workbench can be set to 2800μm / min;

[0141] When the cutting depth of the crystal ingot is between 60% and 70% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2800μm / min;

[0142] When the cutting depth of the crystal ingot is between 70% and 80% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2500μm / min;

[0143] When the cutting depth of the crystal ingot accounts for 80% of the total thickness of the crystal ingot, the feed speed of the workbench can be set to 2300μm / min;

[0144] The diamond wire is first routed in a forward direction by accelerating from zero to 2400m / min, and routes in a forward direction at 2400m / min for a first preset time, and then decelerates from 2400m / min to zero. The diamond wire is then routed in a reverse direction by accelerating from zero to 2400m / min, and routes in a reverse direction at 2400m / min for a second preset time, and then decelerates from 2400m / min to zero.

[0145] In addition, the acceleration time and deceleration time of the diamond wire are both set to 4.5 seconds; the diamond wire is accelerated and decelerated according to the second S-shaped curve, and the speed of the running motor of the cutting main roller is set to synchronization, and the speed of the running motor is set to 3500r / min.

[0146] In a third embodiment of the present invention, a method for cutting a diamond wire may include the following steps:

[0147] Step S11: bonding and curing the crystal rod onto the plastic plate;

[0148] Step S12: Cleaning the solidified crystal rod;

[0149] Step S13: Loading the cleaned crystal ingot into the clamping guide rail of the workbench of the cutting machine to ensure that the crystal ingot is properly clamped in the clamping guide rail of the workbench;

[0150] Step S14: Arranging a cutting wire net, using diamond wire as the cutting wire, laying the cutting wire on the cutting main roller to form a wire net, and setting the cutting tension of the cutting wire to 4N;

[0151] Step S15: adding cutting fluid, adding a certain amount of pure water and coolant mixture to the cutting fluid circulation system, and setting the cutting fluid temperature to 20 degrees Celsius and the cutting fluid circulation flow rate to 200 L / min;

[0152] Step S16: setting the feed speed of the workbench and the running speed of the diamond wire;

[0153] Step S17: lowering the workbench at a feed speed and causing the diamond wire to circulate back and forth to cut the crystal ingot;

[0154] Step S18: measuring the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is 60% of the total thickness of the crystal ingot;

[0155] Step S19: measuring the distance between the diamond wire and the top of the crystal ingot when the cutting depth of the crystal ingot is 80% of the total thickness of the crystal ingot.

[0156] Among them, setting the feed speed of the workbench and the running speed of the diamond wire can include:

[0157] Before the cutting depth of the crystal ingot accounts for 10% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1500m / min;

[0158] When the cutting depth of the crystal ingot is between 10% and 20% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1700 μm / min;

[0159] When the cutting depth of the crystal ingot is between 20% and 30% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 1900 μm / min;

[0160] When the cutting depth of the crystal ingot is between 30% and 40% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2100 μm / min;

[0161] When the cutting depth of the crystal ingot is between 40% and 50% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2300μm / min;

[0162] When the cutting depth of the crystal ingot is between 50% and 60% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2500μm / min;

[0163] When the cutting depth of the crystal ingot accounts for 60% of the total thickness of the crystal ingot, the feed speed of the workbench can be set to 2800μm / min;

[0164] When the cutting depth of the crystal ingot is between 60% and 70% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2800μm / min;

[0165] When the cutting depth of the crystal ingot is between 70% and 80% of the total thickness of the crystal ingot, the feed speed of the worktable can be set to 2500μm / min;

[0166] When the cutting depth of the crystal ingot accounts for 80% of the total thickness of the crystal ingot, the feed speed of the workbench can be set to 2300μm / min;

[0167] The diamond wire is first routed in a forward direction by accelerating from zero to 2400m / min, and routes in a forward direction at 2400m / min for a first preset time, and then decelerates from 2400m / min to zero. The diamond wire is then routed in a reverse direction by accelerating from zero to 2400m / min, and routes in a reverse direction at 2400m / min for a second preset time, and then decelerates from 2400m / min to zero.

[0168] In addition, the acceleration time and deceleration time of the diamond wire are both set to 4.5 seconds; the diamond wire is accelerated and decelerated according to the second S-shaped curve, and the speed of the running motor of the cutting main roller is set to be asynchronous. When the diamond wire runs forward, the speed of the left running motor is set to 3497r / min, and the speed of the right running motor is set to 3500r / min; when the diamond wire runs reversely, the speed of the left running motor is set to 3500r / min, and the speed of the right running motor is set to 3497r / min.

[0169] In the first embodiment, when the ingot cutting depth is 60% of the total thickness, the actual wire bow value of the diamond wire measured is 14.5; when the ingot cutting depth is 80% of the total thickness, the actual wire bow value of the diamond wire measured is 13.5.

[0170] In the second embodiment, when the cutting depth of the crystal ingot is 60% of the total thickness, the measured actual wire bow value of the diamond wire is 14; when the cutting depth of the crystal ingot is 80% of the total thickness, the measured actual wire bow value of the diamond wire is 13.

[0171] In the third embodiment, when the cutting depth of the crystal rod is 60% of the total thickness, the measured actual wire bow value of the diamond wire is 13; when the cutting depth of the crystal rod is 80% of the total thickness, the measured actual wire bow value of the diamond wire is 12.

[0172] When the crystal rod is cut using an existing cutting machine, the actual wire bow value of the diamond wire measured is 15 when the cutting depth of the crystal rod is 60% of the total thickness; when the cutting depth of the crystal rod is 80% of the total thickness, the actual wire bow value of the diamond wire measured is 14.

[0173] Therefore, the diamond wire cutting method provided by the present invention reduces the large wire bow generated when cutting large-size silicon wafers, reduces the abnormal wire breakage caused by the large shear tension borne by the large wire bow, reduces the wire breakage rate, and improves the silicon wafer cutting qualification rate and production efficiency during the cutting process; it has a significant improvement on the surface appearance texture and TTV of the silicon wafer, reduces the scratches generated during material lifting, and improves the stable yield.

[0174] It should be noted that the cutting machine includes two cutting main rollers, which are arranged side by side on the left and right. The two cutting main rollers can be respectively the left main roller and the right main roller. The motors that drive the left main roller and the right main roller to rotate are respectively the left running motor and the right running motor, and the diamond wire is sleeved on the cutting main roller to form a wire net.

[0175] The cutting machine may also include three main cutting rollers, which are distributed in a triangle, and the diamond wires are sleeved outside the three main cutting rollers. The rotational speeds of at least two running motors of the three main cutting rollers are synchronized or there is a speed difference.

[0176] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0177] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A method for cutting a diamond wire, characterized in that: include: Place the crystal ingot on the workbench of the cutting machine; Setting the feed speed of the workbench and the running speed of the diamond wire; The workbench is operated at the set feed speed, and the diamond wire is operated back and forth at the set operating speed to cut the crystal rod; Wherein, before the diamond wire cuts the crystal ingot to a first depth, setting the feed speed of the workbench to increase from the first speed to the second speed specifically includes: Before the cutting depth of the crystal ingot accounts for 10% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the first speed; when the cutting depth of the crystal ingot accounts for 10%-20% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the first intermediate speed; when the cutting depth of the crystal ingot accounts for 20%-30% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the second intermediate speed; when the cutting depth of the crystal ingot accounts for 30%-40% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the third intermediate speed; when the cutting depth of the crystal ingot accounts for 40%-50% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the fourth intermediate speed; when the cutting depth of the crystal ingot accounts for 50%-60% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the fifth intermediate speed; when the cutting depth of the crystal ingot accounts for 60% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the second speed; When the cutting depth of the diamond wire on the crystal ingot is between the first depth and the second depth, setting the feed speed of the workbench to decrease from the second speed to a third speed specifically includes: When the cutting depth of the crystal ingot accounts for 60%-70% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the second speed; when the cutting depth of the crystal ingot accounts for 70%-80% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the sixth intermediate speed; when the cutting depth of the crystal ingot accounts for 80% of the total thickness of the crystal ingot, the feed speed of the worktable is set to the third speed; The diamond wire is firstly accelerated from zero to a first preset speed in a forward direction, and is then moved forward at the first preset speed for a first preset time, and then decelerated from the first preset speed to zero, and then the diamond wire is then accelerated from zero to a second preset speed in a reverse direction, and is then moved reversely at the second preset speed for a second preset time, and then decelerated from the second preset speed to zero; The running speed of the diamond wire increases in an S-shaped curve, and the running speed of the diamond wire decreases in an S-shaped curve.

2. The method for cutting a diamond wire according to claim 1, wherein: The step of placing the crystal ingot on a workbench of a cutting machine comprises: fixing the crystal rod on the workbench; The crystal ingot is cleaned, and the crystal ingot and the workbench are pushed into the guide rail of the cutting machine.

3. The method for cutting a diamond wire according to claim 1, wherein: Before cutting the crystal ingot, the forward routing distance and the reverse routing distance of the diamond wire are set so that the forward routing distance of the diamond wire is greater than the reverse routing distance of the diamond wire.

4. The method for cutting a diamond wire according to claim 1, wherein: Also includes: The running motor speeds of the respective cutting main rollers driving the diamond wire are set so that the running motors of the respective cutting main rollers run synchronously, or a speed difference exists between the running motors of at least two cutting main rollers.

5. The method for cutting a diamond wire according to claim 1, wherein: The process of cutting the crystal ingot also includes: When the cutting depth of the crystal ingot is the first depth, measuring the distance between the diamond wire and the top of the crystal ingot; When the cutting depth of the crystal ingot is the second depth, the distance between the diamond wire and the top of the crystal ingot is measured.

6. The method for cutting a diamond wire according to claim 1, wherein: The time for the running speed of the diamond wire to accelerate from zero to the first preset speed is 4.5 seconds to 7 seconds; the time for the running speed of the diamond wire to decelerate from the first preset speed to zero is 4.5 seconds to 7 seconds; the time for the running speed of the diamond wire to accelerate from zero to the second preset speed is 4.5 seconds to 7 seconds, and the time for the running speed of the diamond wire to decelerate from the second preset speed to zero is 4.5 seconds to 7 seconds.

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