Preheating method for substrate processing device and computer program for the method

Abstract

The present invention provides a preheating method for a substrate processing apparatus that can shorten preheating time and simultaneously perform maintenance operations, and a computer program for use with the method. The preheating method includes: setting parameters related to preheating of a preheating object constituting the substrate processing apparatus; and preheating the preheating object based on the parameters, wherein the movement range of the preheating object is limited to a movable range.

Description

Technical Field

[0001] The present invention relates to a method for preheating a substrate processing apparatus and a computer program for use in the method. More particularly, the present invention relates to a method for preheating a substrate processing apparatus for printing substrates and a computer program for use in the method. Background Art

[0002] When a printing process (eg, RGB patterning) is performed on a transparent substrate to manufacture a display device such as an LCD panel, a PDP panel, or an LED panel, a printing device having an inkjet head unit may be used. Summary of the Invention

[0003] In the case of large-scale printing equipment, as the equipment is driven, a slight temperature rise may occur due to internal heating elements, and the position of the equipment may change accordingly. Therefore, in the prior art, a dry run is performed to create a consistent environment under certain driving conditions before the main process is performed.

[0004] However, this method has the following problems. First, since the dry run takes a long time to complete, it may cause a decrease in productivity, such as delays in substrate printing. Second, when performing a dry run, MT (Maintenance) operations such as head care cannot be performed.

[0005] The technical problem to be solved by the present invention is to provide a preheating method for a substrate processing apparatus and a computer program for the method, which can shorten the preheating time and perform maintenance operations simultaneously during preheating.

[0006] The technical problems of the present invention are not limited to the above technical problems, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0007] One aspect of the preheating method for a substrate processing apparatus of the present invention for solving the above-mentioned technical problem includes: a step of setting parameters related to preheating of a preheating object constituting the substrate processing apparatus; and a step of preheating the preheating object based on the parameters, wherein a moving range of the preheating object is limited to a movable range.

[0008] The preheating target may be an inkjet head unit that ejects a substrate processing liquid onto a substrate.

[0009] The preheating method of the substrate processing apparatus may further include performing maintenance on the inkjet head unit to correct dotting, wherein the performing maintenance is performed simultaneously with the preheating.

[0010] The inkjet head unit may reciprocate within a region where ejection is performed.

[0011] The area where the ejection is performed may be determined based on the width of the substrate.

[0012] The region where the ejection is performed may be determined based on positional information of both ends of the substrate positioned on the stage, or may be determined based on positional information of both ends of the stage.

[0013] When the ejection region is determined based on positional information of both ends of the stage, the positional information of both ends of the substrate may be estimated based on outermost positional information of the air holes that float the substrate above the stage.

[0014] The inkjet head unit may reciprocate by moving minutely.

[0015] The inkjet head unit can be finely moved in micrometer units or millimeter units.

[0016] The parameter may be at least one of a moving distance of the inkjet head unit, a number of repetitions of movement of the inkjet head unit, a moving time of the inkjet head unit, and a waiting time after movement of the inkjet head unit.

[0017] The substrate processing apparatus may be a substrate printing apparatus, and the preheating step may be performed before printing the substrate.

[0018] The preheating object may be a fixture for holding the substrate.

[0019] The method for preheating a substrate processing apparatus may further include determining whether to end preheating of the preheating target based on a peripheral temperature of a motor that operates the preheating target.

[0020] The determining step may include comparing the ambient temperature with a reference temperature, and ending preheating of the preheating object when the ambient temperature is above the reference temperature, and continuing preheating of the preheating object when the ambient temperature is below the reference temperature.

[0021] In addition, another aspect of the preheating method of the substrate processing device of the present invention for solving the above-mentioned technical problem includes: a step of setting parameters related to the preheating of an inkjet head unit that sprays substrate processing liquid onto a substrate; a step of preheating the inkjet head unit based on the parameters; and a step of performing maintenance on the inkjet head unit to correct dotting, wherein the preheating step is performed simultaneously with the step of performing maintenance, and the inkjet head unit reciprocates within the area where the spraying is performed.

[0022] In addition, one aspect of a computer program for a preheating method for a substrate processing apparatus of the present invention for solving the above-mentioned technical problem, as a computer program installed in a control unit for controlling the operation of the substrate processing apparatus, includes: a module for setting parameters related to the preheating of a preheating object constituting the substrate processing apparatus; and a module for preheating the preheating object based on the parameters, wherein the movement range of the preheating object is limited to a movable range.

[0023] The preheating target may be any one of an inkjet head unit that ejects a substrate processing liquid onto a substrate and a jig that holds the substrate.

[0024] In a case where the preheating target is the inkjet head unit, the computer program may further include a module for performing maintenance on the inkjet head unit to correct dotting, and the module for performing maintenance may be run simultaneously with the module for preheating.

[0025] Details of other embodiments are included in the detailed description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 FIG. 1 is a diagram schematically illustrating an internal structure of a substrate processing apparatus according to an embodiment of the present invention.

[0027] Figure 2 FIG. 1 is a first exemplary diagram for explaining a preheating method for a substrate processing apparatus according to an embodiment of the present invention.

[0028] Figure 3 FIG. 1 is a second exemplary diagram for explaining a preheating method for a substrate processing apparatus according to an embodiment of the present invention.

[0029] Figure 4 FIG. 3 is a third exemplary diagram for explaining a preheating method of a substrate processing apparatus according to an embodiment of the present invention.

[0030] Figure 5 is a graph showing various parameter setting values ​​for a preheating method for a substrate processing apparatus according to an embodiment of the present invention.

[0031] Figure 6 1 is a flow chart sequentially illustrating a preheating method for a substrate processing apparatus according to an embodiment of the present invention.

[0032] Figure 7 FIG. 4 is a fourth exemplary diagram for explaining a preheating method of a substrate processing apparatus according to an embodiment of the present invention.

[0033] Description of Reference Signs

[0034] 100: substrate processing device 110: process processing unit

[0035] 111: First station 112: Air hole

[0036] 120: Maintenance unit 121: Second unit

[0037] 125: Vision module 130: Gantry unit

[0038] 140: Inkjet head unit 150: Substrate treatment liquid supply unit

[0039] 160: Control unit 410: First point

[0040] 420: Second point 430: Third point DETAILED DESCRIPTION

[0041] Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention and methods for achieving these advantages and features will be described in detail with reference to the accompanying drawings. Figure 1 The present invention will become clear from the detailed description of the embodiments below. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in a variety of different forms. These embodiments are provided only to complete the disclosure of the present invention and to fully inform those skilled in the art of the present invention of the scope of the invention. The present invention is limited only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0042] When an element or layer is referred to as being “on” or “over” another element or layer, it includes not only being directly over the other element or layer but also including the case where other layers or other elements are interposed. In contrast, when an element is referred to as being “directly on” or “over” another element, it means that there are no other elements or layers interposed.

[0043] In order to easily describe the relationship between one element or constituent element and another element or constituent element as shown in the figure, the spatial relative terms "below", "beneath", "lower", "above", "upper", etc. can be used. It should be understood that, in addition to the directions shown in the figures, spatial relative terms are terms that also include different directions of the elements when in use or operation. For example, when the elements shown in the figures are turned over, the element described as "below" or "beneath" another element can be located "above" another element. Therefore, the exemplary term "below" can include both below and above directions. The elements can also be oriented in another direction, whereby the spatial relative terms can be interpreted according to the orientation.

[0044] Although the terms "first," "second," etc. are used to describe various elements, constituents, and / or parts, these elements, constituents, and / or parts are clearly not limited by these terms. These terms are only used to distinguish one element, constituent, and / or part from another element, constituent, and / or part. Therefore, the first element, first constituent, or first part mentioned below may also be the second element, second constituent, or second part within the technical concept of the present invention.

[0045] The terms used in this specification are intended to illustrate the embodiments and are not intended to limit the present invention. In this specification, unless otherwise specified in a sentence, the singular also includes the plural. The use of "comprises" and / or "comprising" in the specification does not exclude the presence or addition of one or more other constituent elements, steps, operations and / or elements in addition to the mentioned constituent elements, steps, operations and / or elements.

[0046] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with the meanings commonly understood by those skilled in the art to which the present invention belongs. In addition, terms defined in commonly used dictionaries shall not be interpreted ideally or excessively unless specifically defined otherwise.

[0047] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals regardless of the reference numerals, and repeated description thereof will be omitted.

[0048] The present invention relates to a preheating method for a substrate processing apparatus capable of shortening the preheating time and performing maintenance operations simultaneously during preheating, and a computer program for the method.

[0049] Figure 1 FIG. 1 is a diagram schematically illustrating an internal structure of a substrate processing apparatus according to an embodiment of the present invention.

[0050] according to Figure 1 The substrate processing apparatus 100 may include a process unit 110 , a maintenance unit 120 , a gantry unit 130 , an inkjet head unit 140 , a substrate processing liquid supply unit 150 , and a control unit 160 .

[0051] The substrate processing apparatus 100 processes a substrate G (e.g., a glass substrate) used to manufacture a display device. The substrate processing apparatus 100 can be implemented as a printing device that uses an inkjet head unit 140 to jet a substrate processing liquid onto the substrate G. The apparatus can also be implemented as a circulating inkjet device to prevent the nozzle from being clogged by the substrate processing liquid.

[0052] The process unit 110 supports the substrate G during the PT operation performed on the substrate G. The process unit 110 may support the substrate G in a non-contact manner. For example, the process unit 110 may support the substrate G by suspending the substrate G in mid-air using air. However, the present embodiment is not limited thereto. The process unit 110 may also support the substrate G in a contact manner. For example, the process unit 110 may support the substrate G using a support member having a seating surface on its upper portion.

[0053] On the other hand, in the above description, the PT operation refers to printing the substrate G using a substrate treatment liquid, and the substrate treatment liquid refers to a liquid used for printing the substrate G. For example, the substrate treatment liquid may be QD (Quantum Dot) ink containing ultrafine semiconductor particles.

[0054] In the case where the substrate G is supported by air, the process unit 110 may include a first stage (1 st Stage) 111 and air hole (Air Hole) 112.

[0055] The first stage 111 is a base, which is provided on top of which the substrate G can be placed. The air holes 112 can be formed by penetrating the upper surface of the first stage 111 , and a plurality of air holes 112 can be formed in a PT zone on the first stage 111 .

[0056] The air holes 112 may spray air toward the upper direction (the third direction 30 ) of the first stage 111 , thereby allowing the substrate G placed on the first stage 111 to float in the air.

[0057] On the other hand, despite Figure 1 Although not shown, the process unit 110 may further include a gripper. The gripper is used to prevent the substrate G from detaching from the first stage 111 when the substrate G moves along the length direction (first direction 10) of the first stage 111. The gripper can clamp the substrate G to prevent it from detaching from the first stage 111, and can slide along a guide rail (not shown) while clamping the substrate G when the substrate G moves.

[0058] The maintenance unit 120 measures the ejection position (i.e., dot) of the substrate processing liquid on the substrate G, whether the substrate processing liquid is ejected, etc. The maintenance unit 120 can measure the ejection position of the substrate processing liquid, whether the substrate processing liquid is ejected, etc. for each of the plurality of nozzles provided in the inkjet head unit 140, and can provide the measurement results obtained in this manner to the control unit 160.

[0059] The maintenance unit 120 may include a second (2 nd Stage)121、Third rail(3 rd Guide Rail)122、First Board(1 st Plate) 123, Calibration Board 124 and Vision Module 125.

[0060] The second stage 121 is a base like the first stage 111 and can be arranged in parallel with the first stage 111. The second stage 121 can be set to the same size as the first stage 111, or can be set to be smaller or larger than the size of the first stage 111. The second stage 121 can include an MT zone (MT zone) on its upper portion.

[0061] The third guide rail 122 guides the movement path of the first plate 123. Such a third guide rail 122 may be provided on the second stage 121 along at least one line along the length direction (first direction 10) of the second stage 121. For example, the third guide rail 122 may be implemented as an LM guide system (Linear Motor Guide System).

[0062] On the other hand, despite Figure 1 Not shown, but the maintenance unit 120 may further include a fourth guide rail (4 th Like the third guide rail 122, the fourth guide rail guides the movement path of the first plate 123 and can be provided on the second stage 121 along at least one line in the width direction (second direction 20) of the second stage 121. Like the third guide rail 122, the fourth guide rail can also be implemented as an LM guide rail system.

[0063] The first plate 123 moves on the second stage 121 along the third guide rail 122 and / or the fourth guide rail. The first plate 123 can move parallel to the substrate G along the third guide rail 122, or move closer to or farther away from the substrate G along the fourth guide rail 122.

[0064] The calibration plate 124 is used to measure the ejection position of the substrate processing liquid on the substrate G. The calibration plate 124 may include an alignment mark, a scale, etc. and is disposed on the first plate 123 and along the length direction (first direction 10 ) of the first plate 123 .

[0065] The vision module 125 acquires image information about the substrate G to measure the ejection position of the substrate processing liquid, whether the substrate processing liquid is ejected, etc. The vision module 125 may include an area scan camera, a line scan camera, etc., and may acquire image information about the substrate G in real time. Furthermore, the vision module 125 may acquire and provide information not only about the substrate G onto which the substrate processing liquid is ejected, but also about the calibration plate 124.

[0066] The vision module 125 can be provided on the side or below the gantry unit 130 to image the substrate G, etc. For example, the vision module 125 can be provided in a form attached to the side surface of the inkjet head unit 140. However, this embodiment is not limited thereto. The vision module 125 can also be provided on the first plate 123. Alternatively, a plurality of vision modules 125 can be provided within the substrate processing apparatus 100, and can be fixedly or removably provided.

[0067] The gantry unit 130 supports the inkjet head unit 140. The gantry unit 130 may be disposed above the first stage 111 and the second stage 121 so that the inkjet head unit 140 can eject the substrate processing liquid onto the substrate G.

[0068] The gantry unit 130 may be provided on the first stage 111 and the second stage 121 as a length direction along the width direction (second direction 20) of the first stage 111 and the second stage 121. st Guide Rail) 170a and second guide rail (2 nd The first guide rail 170a and the second guide rail 170b move in the length direction (first direction 10) of the first stage 111 and the second stage 121. On the other hand, the first guide rail 170a and the second guide rail 170b can be provided outside the first stage 111 and the second stage 121 along the length direction (first direction 10) of the first stage 111 and the second stage 121.

[0069] On the other hand, despite Figure 1Although not shown in the figure, the substrate processing apparatus 100 may further include a gantry moving unit. The gantry moving unit moves the gantry unit 130 along the first guide rail 170a and the second guide rail 170b. The gantry moving unit may be disposed within the gantry unit 130 and may include a first moving module (not shown) and a second moving module (not shown). The first moving module and the second moving module may be disposed at both ends of the gantry unit 130 and may enable the gantry unit 130 to slide along the first guide rail 170a and the second guide rail 170b.

[0070] The inkjet head unit 140 ejects the substrate processing liquid in the form of droplets onto the substrate G. The inkjet head unit 140 may be disposed on the side or below the gantry unit 130 .

[0071] At least one inkjet head unit 140 may be provided at the gantry unit 130. When a plurality of inkjet head units 140 are provided at the gantry unit 130, the plurality of inkjet head units 140 may be arranged in a row along the length direction (second direction 20) of the gantry unit 130.

[0072] The inkjet head unit 140 can be moved along the length direction (second direction 20) of the gantry unit 130 to be positioned at a desired position on the substrate G. However, the present embodiment is not limited thereto. The inkjet head unit 140 can be moved along the height direction (third direction 30) of the gantry unit 130 and can also be rotated in a clockwise or counterclockwise direction.

[0073] On the other hand, the inkjet head unit 140 may be provided to be fixed to the gantry unit 130. In this case, the gantry unit 130 may be provided to be movable.

[0074] On the other hand, despite Figure 1 Although not shown, the substrate processing apparatus 100 may further include an inkjet head moving unit. The inkjet head moving unit causes the inkjet head unit 140 to move linearly or rotate. In the case where the substrate processing apparatus 100 includes multiple inkjet head units 140, the inkjet head moving units may be provided in the substrate processing apparatus 100 in a number corresponding to the number of inkjet head units 140, so that the multiple inkjet head units 140 operate independently. Alternatively, a single inkjet head moving unit may be provided in the substrate processing apparatus 100, so that the multiple inkjet head units 140 operate in a unified manner.

[0075] On the other hand, despite Figure 1Although not shown, the inkjet head unit 140 may include a nozzle plate, a plurality of nozzles, a piezoelectric element, and the like. The nozzle plate constitutes the main body of the inkjet head unit 140. A plurality of nozzles (e.g., 128, 256, etc.) may be arranged in multiple rows and columns at regular intervals below the nozzle plate, and the piezoelectric elements may be arranged within the nozzle plate in a number corresponding to the number of nozzles. With such a configuration, the inkjet head unit 140 can eject a substrate processing liquid onto the substrate G through the nozzles in response to the operation of the piezoelectric elements.

[0076] On the other hand, the inkjet head unit 140 may also independently adjust the discharge amount of the substrate processing liquid provided through each nozzle according to the voltage applied to the piezoelectric element.

[0077] The substrate treating liquid supply unit 150 supplies ink to the inkjet head unit 140. Such a substrate treating liquid supply unit 150 may include a storage tank 151 and a pressure control module 152.

[0078] The storage tank 151 stores the substrate treating liquid, and the pressure control module 152 adjusts the internal pressure of the storage tank 151. The storage tank 151 may supply an appropriate amount of the substrate treating liquid to the inkjet head unit 140 based on the pressure provided by the pressure control module 152.

[0079] The control unit 160 performs maintenance on the inkjet head unit 140. Based on the measurement results of the maintenance unit 120, the control unit 160 can correct the substrate processing liquid ejection position of each nozzle included in the inkjet head unit 140, or detect defective nozzles (i.e., nozzles that do not eject substrate processing liquid) among the multiple nozzles and perform cleaning operations on the defective nozzles. To this end, the control unit 160 can control the operation of various components that constitute the substrate processing apparatus 100.

[0080] The control unit 160 can be implemented as a computer or server including a process controller, a control program, an input module, an output module (or a display module), a storage module, etc. In the above description, the process controller may include a microprocessor that controls the various components of the substrate processing apparatus 100, and the control program may execute various processes on the substrate processing apparatus 100 under the control of the process controller. The storage module stores programs, i.e., process recipes, for executing various processes on the substrate processing apparatus 100 based on various data and processing conditions.

[0081] On the other hand, despite Figure 1 Although not shown in the figure, the substrate processing apparatus 100 may further include a nozzle inspection unit. The nozzle inspection unit is used to determine whether there is an abnormality in each nozzle provided in the inkjet head unit 140. For example, the nozzle inspection unit may use optical inspection to determine whether there is an abnormality in the nozzle.

[0082] Next, a preheating method of the substrate processing apparatus 100 that can shorten the preheating time and simultaneously perform a maintenance operation will be described.

[0083] The preheating method of the substrate processing apparatus 100 may be executed before the substrate G is subjected to a printing process using the substrate processing apparatus 100. This preheating method of the substrate processing apparatus 100 may be executed by the control unit 160. Specifically, the preheating method of the substrate processing apparatus 100 may be executed by a computer program (control program) installed in the control unit 160.

[0084] The control unit 160 may control the operations of the respective structures constituting the substrate treating apparatus 100 to preheat the substrate treating apparatus 100. This will be described below.

[0085] When performing a dry run to preheat the substrate processing apparatus 100, each component of the substrate processing apparatus 100 moves in all regions of the stroke.

[0086] In the case where an idle run is performed in order to warm up the motor driving the inkjet head unit 140, as shown in FIG. Figure 2 As shown, the inkjet head unit 140 can reciprocate along the length direction (second direction 20) of the gantry unit 130 from one end 210 to the other end 220 of the gantry unit 130. In this case, the movement range of the inkjet head unit 140 can be the length L of the gantry unit 130. Figure 2 FIG. 1 is a first exemplary diagram for explaining a preheating method for a substrate processing apparatus according to an embodiment of the present invention.

[0087] However, if the inkjet head unit 140 reciprocates in this manner, MT operations such as head care cannot be performed while the motor driving the inkjet head unit 140 is warmed up. Furthermore, when performing a printing process on the substrate G, the printing process must be started after the idle run operation is stopped and the MT operation is performed. Therefore, there is also the problem of a long time required before the printing process starts.

[0088] In this embodiment, in order to solve this problem, when the motor ages (Motor Aging), the inkjet head unit 140 can reciprocate in the area where the inkjet head unit 140 performs jetting (Jetting). Figure 3 As shown, the inkjet head unit 140 may reciprocate within the width W of the substrate G along the length direction (the second direction 20 ) of the gantry unit 130 . Figure 3FIG. 1 is a second exemplary diagram for explaining a preheating method for a substrate processing apparatus according to an embodiment of the present invention.

[0089] The substrate G can be placed on the first station 111 for maintenance. Figure 4 As shown, the vision module 125 can measure position information P3 and P4 of both ends of the substrate G located on the first stage 111 in the width direction, and the control unit 160 can determine the moving range of the inkjet head unit 140 based on the position information P3 and P4 measured by the vision module 125. Then, since the moving range of the inkjet head unit 140 does not deviate from the substrate G, maintenance work can be performed during the warm-up of the motor driving the inkjet head unit 140. Figure 4 FIG. 3 is a third exemplary diagram for explaining a preheating method of a substrate processing apparatus according to an embodiment of the present invention.

[0090] On the other hand, in this embodiment, the vision module 125 can also measure the position information P1 and P2 of the two ends of the first stage 111 in the width direction, and the control unit 160 can estimate the position information P3 and P4 of the two ends of the substrate G in the width direction based on the position information P1 and P2 measured by the vision module 125. In this case, the control unit 160 can know in advance the distance difference between the position information P1 and P2 of the two ends of the first stage 111 and the position information P3 and P4 of the two ends of the substrate G.

[0091] The distance differences P1-P3 and P2-P4 between the ends of the first stage 111 and the ends of the substrate G can be stored in the storage module of the control unit 160. The distance differences P1-P3 and P2-P4 between the ends of the first stage 111 and the ends of the substrate G can be calculated based on the air holes 112 formed on the first stage 111. That is, among the plurality of air holes 112 formed on the first stage 111, the position information of the air holes 112 located at the outermost points on both sides with respect to the width direction of the first stage 111 can correspond to the position information P3 and P4 of the ends in the width direction of the substrate G. Therefore, the distance differences P1-P3 and P2-P4 between the ends of the first stage 111 and the ends of the substrate G can be estimated based on the distance difference between the position information P1 and P2 of the ends of the first stage 111 and the position information of the air holes 112 located at the outermost points on both sides.

[0092] On the other hand, when an idle operation is performed to preheat the substrate processing apparatus 100 , it takes a long time to complete the idle operation, which also causes a problem of reduced product productivity.

[0093] In this embodiment, to solve this problem, the movement of the inkjet head unit 140 can be controlled based on various parameter settings related to the optimization of preheating, thereby achieving the effect of not wasting preheating time and improving product productivity. This will be described below.

[0094] Figure 5 1 is a graph showing various parameter setting values ​​for a preheating method for a substrate processing apparatus according to an embodiment of the present invention. Figure 5 Provide explanation.

[0095] If the inkjet head unit 140 is determined to need to be warmed up, the control unit 160 may set a warm-up mode. In this case, the control unit 160 may set a first warm-up mode based on time or a second warm-up mode based on the number of reciprocating cycles.

[0096] When the second preheating mode is set based on a reciprocating cycle, the control unit 160 can set the reciprocating cycle based on distance or time. For example, if the movement range of the inkjet head unit 160 is determined based on the width of the substrate G, the control unit 160 can use this movement range as the distance to set the reciprocating cycle. Alternatively, the control unit 160 can determine the time period for reciprocating motion within the aforementioned movement range and set the reciprocating cycle based on this time period.

[0097] After executing the preheating mode, the control unit 160 may also set details of the preheating mode based on the moving distance of the inkjet head unit 140, the number of movement repetitions of the inkjet head unit 140, the moving time of the inkjet head unit 140, the waiting time of the inkjet head unit 140, etc.

[0098] When the details of the warm-up mode (Warm Up Moving Distance) are set based on the moving distance of the inkjet head unit 140, the control unit 160 can set the moving distance (Motion Stroke) toward both sides with respect to the reference position as the center. In this case, the moving distance toward both sides with respect to the reference position as the center can be within the width of the substrate G.

[0099] Furthermore, when the warmup mode details (Warmup Cycle Count) are set based on the number of repetitions of movement of the inkjet head unit 140, the control unit 160 may set the number of repetitions of the reciprocating cycle. Here, the reciprocating cycle may be the movement range of the inkjet head unit 140 based on the width of the substrate G.

[0100] In addition, in the case where the details of the warm-up mode (Warm up Time) are set based on the movement time of the inkjet head unit 140 , the control unit 160 may set the time during which the inkjet head unit 140 operates.

[0101] Furthermore, when the details of the warm-up mode (Warm Up Delay Time) are set based on the waiting time of the inkjet head unit 140, the control unit 160 can set the waiting time between the end of the current operation and the next operation of the inkjet head unit 140. The waiting time of the inkjet head unit 140 refers to the time required for the operation of the inkjet head unit 140 to stabilize.

[0102] The control unit 160 can also set the preheating mode of the inkjet head unit 140 by combining multiple settings from among various parameter settings. For example, the control unit 160 can set the number of repetitions of the inkjet head unit 140 after setting the movement distance of the inkjet head unit 140. In this embodiment, the waiting time of the inkjet head unit 140 can also be set in addition to this. Furthermore, the control unit 160 can also sequentially set the movement time and waiting time of the inkjet head unit 140 after setting the movement distance of the inkjet head unit 140.

[0103] As mentioned above Figures 1 to 5 As described above, the preheating method of the substrate processing device 100 according to this embodiment is a method for preheating the substrate processing device 100 to an optimal state before starting a printing job. It is an equipment preheating method that can shorten or eliminate the preheating time through idle operation and can perform MT operations (i.e., head care (HeadCare)) that cannot be performed when performing idle operation.

[0104] Dry run warms up the motor by applying current while the servo is stopped. This requires turning the servo on and off and setting the device's origin. Therefore, there is a high risk of the motor running during dry run.

[0105] In contrast, the preheating method of the substrate processing apparatus 100 according to this embodiment preheats the motor by finely moving the motor in the positive and negative directions from its reference position. Furthermore, the preheating method can also perform a MT operation during the preheating of the motor. Furthermore, the preheating method of the substrate processing apparatus 100 according to this embodiment can shorten the time required for printing preparations before starting a printing job, and can also achieve the effect of shortening the preheating time.

[0106] On the other hand, refer to Figures 1 to 5The described preheating method of the substrate processing device 100 can obviously be applied not only to the case where the inkjet head unit 140 is reciprocated in the second direction 20 to preheat the inkjet head unit 140, but also to the case where the fixture is reciprocated in the first direction 10 to preheat the fixture.

[0107] Next, the preheating method of the substrate processing apparatus 100 will be described in detail step by step. Figure 6 1 is a flow chart showing a preheating method of a substrate processing apparatus according to an embodiment of the present invention. Figure 6 The following description will be given taking the case of preheating the inkjet head unit 140 as an example.

[0108] First, the control unit 160 sets a parameter value related to the preheating of the inkjet head unit 140 (S610). The control unit 160 may set the parameter value related to the preheating of the inkjet head unit 140 based on at least one factor selected from the moving distance of the inkjet head unit 140, the number of repetitions of the inkjet head unit 140, the moving time of the inkjet head unit 140, and the waiting time of the inkjet head unit 140. Figure 5 The detailed description is omitted here.

[0109] When the parameter value related to the warm-up of the inkjet head unit 140 is set, the control unit 160 controls the movement of the inkjet head unit 140 based on the set parameter value (S620).

[0110] like Figure 7 As shown, the inkjet head unit 140 can be finely moved toward the second point 420 located in the positive direction and the third point 430 located in the negative direction with the first point 410 as a reference. In this case, the distance d1 between the first point 410 and the second point 420 can be determined in units of μm to mm (for example, 5 mm). Similarly, the distance d2 between the first point 410 and the third point 430 can also be determined in units of μm to mm (for example, 5 mm). In other words, the inkjet head unit 140 can reciprocate between the first point 410 and the second point 420, the first point 410 and the third point 430, and the second point 420 and the third point 430 at a speed of μm to mm per second (μm / sec to mm / sec).

[0111] On the other hand, in the above, the positive direction may be a direction from the center of the gantry unit 130 toward the one end 210 with reference to the longitudinal direction (second direction 20) of the gantry unit 130, and the negative direction may be a direction from the center of the gantry unit 130 toward the other end 220. The positive direction may also be a direction from the center of the gantry unit 130 toward the other end 220, and the negative direction may also be a direction from the center of the gantry unit 130 toward the one end 210. Figure 7FIG. 4 is a fourth exemplary diagram for explaining a preheating method of a substrate processing apparatus according to an embodiment of the present invention.

[0112] On the other hand, when all movements of the inkjet head unit 140 have been executed based on the set parameter values, the control unit 160 may determine that preheating of the inkjet head unit 140 has been completed. However, this embodiment is not limited to this. The control unit 160 may also measure the ambient temperature of the motor that drives the inkjet head unit 140 and determine whether preheating of the inkjet head unit 140 is complete by comparing this ambient temperature with a reference temperature.

[0113] Specifically, if the motor's ambient temperature is determined to be above the reference temperature, the control unit 160 may terminate motor preheating. If the motor's ambient temperature is determined to be below the reference temperature, the control unit 160 may continue motor preheating. At this point, if the movement control of the inkjet head unit 140 has been fully executed according to the set parameter values, the process may return to step S610 to reset the parameter values. If the movement control of the inkjet head unit 140 has not been fully executed according to the set parameter values, the movement control of the inkjet head unit 140 may be executed based on unused parameter values. In the foregoing, the reference temperature refers to the motor's ambient temperature at the time motor preheating is complete.

[0114] While the embodiments of the present invention have been described above with reference to the accompanying drawings, it should be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not restrictive.

Claims

1. A method for preheating a substrate processing apparatus, comprising: a step of setting parameters related to preheating of a preheating object constituting the substrate processing apparatus; as well as a step of preheating the preheating object based on the parameters, and performing maintenance on the substrate processing apparatus to correct a discharge position of the substrate processing liquid simultaneously with the preheating step; The moving range of the preheating object is limited to the movable range. The performing of the maintenance includes measuring whether the substrate treating liquid is ejected and a position at which the substrate treating liquid is ejected, and correcting the position at which the substrate treating liquid is ejected based on the measurement result.

2. The preheating method of a substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus is an inkjet head unit that ejects the substrate processing liquid onto a substrate.

3. The method for preheating a substrate processing apparatus according to claim 2, wherein performing maintenance on the substrate processing apparatus comprises: Maintenance is performed on the inkjet head unit.

4. The preheating method of a substrate processing apparatus according to claim 2, wherein: The inkjet head unit reciprocates in a region where ejection is performed.

5. The preheating method of a substrate processing apparatus according to claim 4, wherein: The region where the ejection is performed is determined based on the width of the substrate.

6. The preheating method of a substrate processing apparatus according to claim 4, wherein: The region where the ejection is performed is determined based on positional information of both ends of the substrate positioned on the stage.

7. The preheating method of a substrate processing apparatus according to claim 4, wherein: The substrate is positioned on a stage, and the region where ejection is performed is determined based on positional information of both ends of the stage.

8. The preheating method of a substrate processing apparatus according to claim 7, wherein: Position information of both ends of the substrate is estimated based on outermost position information of the air hole that causes the substrate to float on the stage.

9. The preheating method of a substrate processing apparatus according to claim 4, wherein: The inkjet head unit reciprocates by moving minutely.

10. The preheating method of a substrate processing apparatus according to claim 9, wherein: The inkjet head unit moves minutely in micrometer units or millimeter units.

11. The preheating method of a substrate processing apparatus according to claim 2, wherein: The parameter is at least one of a moving distance of the inkjet head unit, a number of repetitions of movement of the inkjet head unit, a moving time of the inkjet head unit, and a waiting time after movement of the inkjet head unit.

12. The preheating method for a substrate processing apparatus according to claim 1, wherein: The substrate processing device is a substrate printing device, and The preheating step is performed before printing the substrate.

13. The preheating method of a substrate processing apparatus according to claim 1, wherein: The preheating object is a clamp that clamps the substrate.

14. The preheating method of a substrate processing apparatus according to claim 1, further comprising: and determining whether to terminate the preheating of the preheating target based on an ambient temperature of a motor that operates the preheating target.

15. The preheating method of a substrate processing apparatus according to claim 14, wherein: The determining step includes comparing the ambient temperature with a reference temperature, and ending preheating of the preheating object when the ambient temperature is above the reference temperature, and continuing preheating of the preheating object when the ambient temperature is below the reference temperature.

16. A method for preheating a substrate processing device, comprising: a step of setting parameters related to preheating of an inkjet head unit that ejects a substrate processing liquid onto a substrate; preheating the inkjet head unit based on the parameters; as well as performing maintenance on the inkjet head unit to correct a discharge position of the substrate processing liquid, the performing maintenance comprising: measuring whether the substrate processing liquid is discharged and a discharge position of the substrate processing liquid, and correcting the discharge position of the substrate processing liquid based on the measurement result, wherein the preheating step and the maintenance step are performed simultaneously, and The inkjet head unit reciprocates in a region where ejection is performed.

17. A computer program installed in a control unit for controlling the operation of a substrate processing apparatus, comprising: a module for setting parameters related to preheating of a preheating object constituting a substrate processing apparatus; as well as means for preheating the preheating object based on the parameter, and a module for performing maintenance on the substrate processing apparatus to correct a discharge position of the substrate processing liquid, which is operated simultaneously with the module for preheating; The moving range of the preheating object is limited to the movable range. The performing of the maintenance includes measuring whether the substrate treating liquid is ejected and a position at which the substrate treating liquid is ejected, and correcting the position at which the substrate treating liquid is ejected based on the measurement result.

18. The computer program according to claim 17, wherein The preheating target is any one of an inkjet head unit that ejects a substrate processing liquid onto a substrate and a jig that holds the substrate.

19. The computer program according to claim 18, wherein In a case where the preheating target is the inkjet head unit, the module for performing maintenance on the substrate processing apparatus includes a module for performing maintenance on the inkjet head unit to correct the ejection position of the substrate processing liquid.

20. The computer program according to claim 18, wherein When the preheating target is the inkjet head unit, the inkjet head unit reciprocates in a region where ejection is performed.

21. The computer program according to claim 20, wherein The inkjet head unit reciprocates by finely moving in micrometer units or millimeter units.

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