Camera components and electronic equipment

Abstract

Embodiments of the present application provide a camera assembly and electronic device. The electronic device may include a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker / headphone, or a vehicle-mounted front-mounted device, etc., which has a mobile or fixed terminal with a camera function. The carrier has an inner wall that is compatible with the outer wall of the camera module, and a buffer layer is provided on at least a portion of the inner wall, so that the assembly and disassembly between the camera module and the carrier are more flexible, convenient for maintenance or replacement, and thus can reduce the scrapping cost to a certain extent.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of terminal technology, and in particular to a camera assembly and an electronic device. Background Art

[0002] With the continuous development of smart phones, the shooting function has become an indispensable function for electronic devices (such as mobile phones, tablets, etc.). In order to obtain good image quality and camera effects, electronic devices will be installed with multiple camera modules to provide a wide range of shooting functions.

[0003] At present, the camera device mainly includes: a camera, a support base and a flexible printed circuit (FPC). Specifically, the electronic device is provided with a flexible printed circuit board, one end of which is electrically connected to the camera, and the other end is connected to a connector. The flexible printed circuit board is electrically connected to the main board of the electronic device through the connector. The camera and the support base are fixed by bonding. For example, the method generally adopts the method of applying glue around the support base to bond the camera. That is, a circle of glue is applied at the position where the support base and the camera are connected, and then the camera is fixed and bonded inside the support base.

[0004] Then, in the above solution, if the camera fails or becomes abnormal, it is inconvenient to disassemble, repair or replace it, which easily leads to the scrapping of the entire camera device, thereby increasing the scrapping cost to a certain extent. Summary of the Invention

[0005] The embodiments of the present application provide a camera assembly and electronic equipment, which can make the assembly and disassembly between the camera module and the carrier more flexible, facilitate maintenance or replacement, and thus reduce the scrapping cost to a certain extent.

[0006] A first aspect of an embodiment of the present application provides a camera assembly, which is applied to an electronic device with a shooting function. The camera assembly includes: a camera module and a bracket, the bracket is used to support the camera module, and the bracket includes: at least one supporting member; the supporting member has an inner wall adapted to the outer wall of the camera module, the inner wall forms a receiving cavity for accommodating the camera module; and a buffer layer is provided on at least part of the inner wall.

[0007] The camera assembly provided in the embodiments of the present application has a carrier having an inner sidewall that matches the outer sidewall of the camera module, and a buffer layer disposed on at least a portion of the inner sidewall. This makes assembly and disassembly between the camera module and the carrier more flexible, facilitating repair or replacement, and thus reducing scrapping costs to a certain extent. Furthermore, the buffer layer facilitates assembly and fixation between the camera module and the carrier, avoiding problems such as hard extrusion caused by tolerance matching issues or tilting of the camera module relative to the carrier.

[0008] In one possible implementation, at least a portion of the first end of the buffer layer extends into the accommodating cavity to form a blocking portion; the first end is the end of the buffer layer that is closest to the upper end surface of the carrier. Providing the blocking portion at the first end of the buffer layer as a special position-limiting design allows the blocking portion to function as a position-limiting device during assembly of the camera module, thereby preventing the camera module from being over-assembled or under-assembled.

[0009] In a possible implementation, the extending direction of the blocking portion is parallel to the upper end surface of the carrier, so as to better limit the position of the camera module and ensure the stability and reliability of the camera module when assembled in the carrier.

[0010] In one possible implementation, the thickness of the buffer layer gradually decreases along a preset position on the buffer layer toward the second end of the buffer layer, and a preset area is formed between the preset position and the second end, and the height of the preset area is one-fifth to one-third of the height of the supporting member; the second end is the end of the buffer layer close to the lower end surface of the supporting member.

[0011] In this way, a special chamfer design can be formed at one end of the buffer layer close to the lower end surface of the carrier, which can make the assembly and disassembly of the camera module more labor-saving and convenient.

[0012] In one possible implementation, the first end of the buffer layer is flush with the upper end surface of the carrier, and the second end of the buffer layer is flush with the lower end surface of the carrier. This can further improve the stability of the assembly and fixation between the camera module and the carrier, and to a greater extent avoid problems such as hard extrusion caused by tolerance matching or tilting of the camera module relative to the carrier.

[0013] In a possible implementation, the first end of the buffer layer is lower than the upper end surface of the carrier, so that the camera module can be firmly positioned while saving costs.

[0014] In one possible implementation, the inner side wall includes: a first inner side wall and a second inner side wall relative to each other, and a third inner side wall and a fourth inner side wall relative to each other; and the third inner side wall is connected to both the first inner side wall and the second inner side wall, and the fourth inner side wall is connected to both the first inner side wall and the second inner side wall; the buffer layer is provided on at least one of the first inner side wall, the second inner side wall, the third inner side wall and the fourth inner side wall.

[0015] By providing a buffer layer on at least one of the first inner side wall, the second inner side wall, the third inner side wall and the fourth inner side wall, the assembly and disassembly between the camera module and the carrier can be made more flexible, thereby facilitating maintenance or replacement.

[0016] In one possible implementation, the buffer layer is provided on both the first inner sidewall and the second inner sidewall; or the buffer layer is provided on both the third inner sidewall and the fourth inner sidewall. Providing buffer layers on two opposing inner sidewalls ensures flexibility in assembly and disassembly.

[0017] In one possible implementation, the buffer layer is provided on each of the first inner sidewall, the second inner sidewall, the third inner sidewall, and the fourth inner sidewall. Providing the buffer layer on each of the first inner sidewall, the second inner sidewall, the third inner sidewall, and the fourth inner sidewall can prevent the inner sidewalls from scratching or even damaging the camera module.

[0018] In one possible implementation, the at least one carrier includes: a first carrier and a second carrier; one of the outer walls of the first carrier is connected to one of the outer walls of the second carrier; or the first carrier and the second carrier share a side wall.

[0019] In one possible implementation, the at least one carrier also includes: a third carrier; one of the outer walls of the third carrier is connected to one of the outer walls of the first carrier or one of the outer walls of the second carrier; or, the third carrier shares a side wall with the first carrier or the second carrier.

[0020] In a possible implementation, the buffer layer is made of cured soft glue.

[0021] In one possible implementation, the camera module includes: a camera and a flexible circuit board, wherein the camera is located on one end of the bracket extending out of the electronic device; one end of the flexible circuit board is electrically connected to the camera, and the other end of the flexible circuit board is used to be electrically connected to a circuit board inside the electronic device.

[0022] In one possible implementation, the camera includes: a lens and a module body; the lens is electrically connected to the module body, and the module body is located in the accommodating cavity of the bracket; one end of the flexible circuit board is electrically connected to the end of the module body facing away from the lens, and the other end of the flexible circuit board extends along the bottom end of the module body, and the other end of the flexible circuit board is electrically connected to the circuit board.

[0023] A second aspect of an embodiment of the present application provides an electronic device, which includes at least: a display screen, a middle frame and a back cover, wherein the display screen and the back cover are respectively located on both sides of the middle frame; and further includes: at least one camera assembly as described above; the camera assembly is arranged on the middle frame, and the camera of the camera assembly is facing the display screen or the back cover.

[0024] The electronic device provided in an embodiment of the present application includes at least a camera assembly, which is arranged on a middle frame, with the camera of the camera assembly facing the display screen or the rear housing, and the camera assembly includes at least a bracket, which has an inner sidewall adapted to the outer sidewall of the camera module through a carrier, and a buffer layer is provided on at least a portion of the inner sidewall, so that the assembly and disassembly between the camera module and the carrier are more flexible, convenient for maintenance or replacement, and thus can reduce scrapping costs to a certain extent. Moreover, the buffer layer can facilitate the assembly and fixation between the camera module and the carrier, avoiding problems such as hard extrusion or tilting of the camera module relative to the carrier due to tolerance matching problems.

[0025] In addition, when the camera assembly is a rear-facing camera assembly, the rear-facing camera assembly can be arranged on the side of the metal middle plate of the middle frame facing the rear shell, an opening is provided on the display screen, the lens of the rear-facing camera assembly corresponds to the opening, and a mounting hole can be provided on the rear shell for mounting a portion of the rear-facing camera assembly. Alternatively, the rear-facing camera assembly can also be installed on the side of the rear shell facing the metal middle plate. When the camera assembly is a front-facing camera assembly, the front-facing camera assembly can be arranged on the side of the metal middle plate facing the display screen, or the front-facing camera assembly can be arranged on the side of the metal middle plate facing the rear shell, or the front-facing camera assembly can also be arranged on the side of the rear shell facing the display screen, and an opening is provided on the metal middle plate for exposing the lens end of the front-facing camera assembly.

[0026] In one possible implementation, the camera assembly is a front-facing camera assembly, or the camera assembly is a rear-facing camera assembly. When the camera assembly is a front-facing camera assembly, assembly and disassembly between the front-facing camera module and the carrier can be made more flexible, facilitating repair or replacement, thereby reducing scrapping costs to a certain extent. When the camera assembly is a rear-facing camera assembly, assembly and disassembly between the rear-facing camera module and the carrier can be made more flexible, facilitating repair or replacement, thereby reducing scrapping costs to a certain extent.

[0027] In one possible implementation, there are two camera assemblies, one of which is a rear camera assembly and the other is a front camera assembly. This allows for more flexible assembly and disassembly between the front camera module and the carrier, as well as between the rear camera module and the carrier, facilitating repair or replacement, thereby significantly reducing scrapping costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the overall structure of an electronic device provided in one embodiment of the present application;

[0029] Figure 2 A schematic diagram of the disassembled structure of an electronic device provided in one embodiment of the present application;

[0030] Figure 3 A schematic structural diagram of a camera assembly provided in one embodiment of the present application;

[0031] Figure 4 A schematic structural diagram of a bracket provided in one embodiment of the present application;

[0032] Figure 5 for Figure 4 A partial cross-sectional schematic diagram of the stent shown;

[0033] Figure 6 A schematic structural diagram of a bracket provided in one embodiment of the present application;

[0034] Figure 7 A schematic structural diagram of a bracket provided in one embodiment of the present application;

[0035] Figure 8 A schematic structural diagram of a bracket provided in one embodiment of the present application.

[0036] Description of reference numerals:

[0037] 100- bracket; 10- bearing member; 11- inner wall;

[0038] 111- first inner side wall; 112- second inner side wall; 113- third inner side wall;

[0039] 12-accommodation cavity; 13-upper end surface; 14-lower end surface;

[0040] 101-first carrier; 102-second carrier; 1021-first common side wall;

[0041] 103 - third supporting member; 1031 - second common side wall; 20 - buffer layer;

[0042] 201-first end; 2011-blocking portion; 202-second end;

[0043] 203 - preset position; S1 - preset area; L1 - extension length of the blocking portion;

[0044] 1-camera assembly; 30-camera module; 301-camera;

[0045] 3011-Lens; 3012-Module body; 302-Flexible circuit board;

[0046] 200-mobile phone; 21-display screen; 211-opening;

[0047] 22-middle frame; 221-frame; 222-metal middle plate;

[0048] 23-Circuit board; 24-Battery; 25-Back cover. DETAILED DESCRIPTION

[0049] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0050] An embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a point of sales (POS) machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker / headphone, or a mobile or fixed terminal with a camera function, such as a vehicle-mounted front-end device, a driving recorder, and a security device.

[0051] Among them, in the embodiment of the present application, the mobile phone 200 is taken as an example of the above-mentioned electronic device for description. The mobile phone 200 provided in the embodiment of the present application can be a curved screen mobile phone or a flat screen mobile phone. In the embodiment of the present application, the flat screen mobile phone is taken as an example for description. Figure 1 and Figure 2 The overall structure and split structure of the mobile phone 200 are shown respectively. The display screen 21 of the mobile phone 200 provided in the embodiment of the present application can be a water drop screen, a notch screen, a full screen or a hole screen (see Figure 1 As shown), for example, a hole 211 is provided on the display screen 21, and the following description is made using the hole-punch screen as an example.

[0052] See also Figure 2As shown, the mobile phone 200 may include: a display screen 21, a middle frame 22 and a rear shell 25, wherein the display screen 21 and the rear shell 25 are respectively located on both sides of the middle frame 22. In addition, the mobile phone 200 may further include a battery 24 located between the middle frame 22 and the rear shell 25, wherein the battery 24 may be located on a side of the middle frame 22 facing the rear shell 25 (such as Figure 2 As shown), or the battery 24 can be arranged on the side of the middle frame 22 facing the display screen 21, for example, the side of the middle frame 22 facing the rear shell 25 can have a battery compartment (not shown in the figure), and the battery 24 is installed in the battery compartment. In some other examples, the mobile phone 200 can also include a circuit board 23, wherein the circuit board 23 can be arranged on the middle frame 22, for example, the circuit board 23 can be arranged on the side of the middle frame 22 facing the rear shell 25 (as shown in the figure). Figure 2 As shown), or the circuit board 23 can be set on the side of the middle frame 22 facing the display screen 21, and the display screen 21 and the rear shell 25 are respectively located on both sides of the middle frame 22.

[0053] The battery 24 can be connected to the charging management module and the circuit board 23 through a power management module. The power management module receives input from the battery 24 and / or the charging management module and provides power to the processor, internal memory, external memory, display screen 21, camera module, and communication module. The power management module can also be used to monitor parameters such as the capacity of the battery 24, the number of cycles of the battery 24, and the health status of the battery 24 (leakage, impedance). In some other embodiments, the power management module can also be set in the processor of the circuit board 23. In other embodiments, the power management module and the charging management module can also be set in the same device.

[0054] When the mobile phone 200 is a flat-screen mobile phone, the display screen 21 can be an organic light-emitting diode (OLED) display screen or a liquid crystal display (LCD) display screen. When the mobile phone 200 is a curved-screen mobile phone, the display screen 21 can be an OLED display screen. It should be understood that the display screen 21 can include a display and a touch device, where the display is used to output display content to the user, and the touch device is used to receive touch events input by the user on the display screen 21.

[0055] Continue to refer to Figure 2The middle frame 22 may include a metal middle plate 222 and a frame 221, and the frame 221 is arranged around the outer periphery of the metal middle plate 222. Generally, the frame 221 may include a top frame, a bottom frame, a left frame and a right frame, and the top frame, the bottom frame, the left frame and the right frame form a frame of a square ring structure. Among them, the material of the metal middle plate 222 includes but is not limited to aluminum plate, aluminum alloy, stainless steel, steel-aluminum composite die-cast plate, titanium alloy or magnesium alloy. The frame 221 can be a metal frame, a ceramic frame, or a glass frame. When the frame 221 is a metal frame, the material of the metal frame is but is not limited to aluminum alloy, stainless steel, steel-aluminum composite die-cast plate or titanium alloy. Among them, the metal middle plate 222 and the frame 221 can be clamped, welded, bonded or integrally formed, or the metal middle plate 222 and the frame 221 can be fixedly connected by injection molding.

[0056] The top and bottom frames are positioned opposite each other, and the left and right frames are positioned opposite each other. The top frame is connected to one end of the left and right frames with rounded corners, respectively. The bottom frame is connected to the other end of the left and right frames with rounded corners, respectively, thereby forming a rounded rectangular area. The back cover ground plane is positioned within the rounded rectangular area and is connected to the top, bottom, left, and right frames, respectively. It is understood that the back cover ground plane can be the back cover 25 of the mobile phone 200.

[0057] The back cover 25 may be a metal back cover, a glass back cover, a plastic back cover, or a ceramic back cover. In the embodiment of the present application, the material of the back cover 25 is not limited and is not limited to the above examples.

[0058] It should be noted that, in some examples, the back shell 25 of the mobile phone 200 can be connected to the frame 221 to form an integrally molded (Unibody) back shell. For example, the mobile phone 200 may include: a display screen 21, a metal middle plate 222 and a back shell. The back shell can be a back shell formed by integrally molding (Unibody) the frame 221 and the back shell 25, so that the circuit board 23 and the battery 24 are located in the space surrounded by the metal middle plate 222 and the back shell.

[0059] In order to realize the shooting function, the mobile phone 200 may further include: a camera component 1 (see Figure 2 As shown in FIG2 , the camera assembly 1 can be disposed on the middle frame 22, with the camera of the camera assembly 1 facing the display screen 21 or the rear housing 25. The camera assembly 1 can be a front-facing camera assembly or a rear-facing camera assembly, or there can be two camera assemblies 1, one of which is a front-facing camera assembly and the other is a rear-facing camera assembly.

[0060] Specifically, the rear camera assembly can be disposed on the side of the metal middle plate 222 facing the rear housing 25, with an opening 211 provided on the display screen 21, and the lens of the rear camera assembly corresponding to the opening 211. The rear housing 25 can have mounting holes (not shown) for mounting a portion of the rear camera assembly. Of course, the rear camera assembly can also be mounted on the side of the rear housing 25 facing the metal middle plate 222. The front camera assembly can be disposed on the side of the metal middle plate 222 facing the display screen 21, or the front camera assembly can be disposed on the side of the metal middle plate 222 facing the rear housing 25. Alternatively, the front camera assembly can also be disposed on the side of the rear housing 25 facing the display screen 21, with an opening provided on the metal middle plate 222 for exposing the lens end of the front camera assembly.

[0061] In the embodiments of the present application, the locations of the front camera assembly and the rear camera assembly include but are not limited to the above description. In some embodiments, the number of the front camera assembly and the rear camera assembly provided in the mobile phone 200 may be 1 or N, where N is a positive integer greater than 1.

[0062] It should be understood that the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the mobile phone 200. In other embodiments of the present application, the mobile phone 200 may include more or fewer components than shown, or may combine or separate certain components, or arrange the components differently. The components shown in the illustrations may be implemented in hardware, software, or a combination of software and hardware.

[0063] In the examples of this application, refer to Figure 3 As shown, the camera assembly 1 may include: a camera module 30 and a bracket 100, wherein the bracket 100 is used to support the camera module 30, and the camera module 30 may include: a camera 301 and a flexible circuit board 302, wherein the camera 301 may be located on the end of the bracket 100 extending out of the mobile phone 200, and one end of the flexible circuit board 302 is electrically connected to the camera 301, and the other end of the flexible circuit board 302 is used to be electrically connected to the circuit board 23 in the mobile phone 200.

[0064] In one possible implementation, continue to refer to Figure 3 As shown, the camera 301 may include a lens 3011 and a module body 3012, wherein the lens 3011 is electrically connected to the module body 3012, and the module body 3012 is located in the receiving cavity of the bracket 100. One end of the flexible circuit board 302 is electrically connected to the end of the module body 3012 facing away from the lens 3011, and the other end of the flexible circuit board 302 extends along the bottom end of the module body 3012 and is electrically connected to the circuit board 23.

[0065] As an optional embodiment, the other end of the flexible circuit board 302 can be electrically connected to the circuit board 23 through a connector (not shown in the figure). Specifically, the connector is fixed on the other end of the flexible circuit board 302, and the connector electrically connects the flexible circuit board 302 to the circuit board 23.

[0066] It is understood that the lens 3011 and the module body 3012 can be fixedly connected by welding, clamping, gluing, or threading. The module body 3012 and the flexible circuit board 302 can also be fixedly connected by gluing, clamping, or welding. The module body 3012 can be made of plastic or metal.

[0067] It should be noted that the camera assembly 1 in the embodiment of the present application may have a camera 301 with a fixed focal length or a camera with a variable focal length. When the camera 301 is a camera with a variable focal length, the camera 301 may further include a focus module (not shown), such as a focus motor, which may be provided on the module body 3012.

[0068] The lens 3011 may include a lens barrel and a plurality of lenses (not shown) located inside the lens barrel. The lenses may include: plastic lenses (Plastic) and glass lenses (Glass). The lens 3011 may include a 5P lens and a 6P lens according to the number of lenses. The 5P lens may include 5 lenses, for example, 5 plastic lenses, or 4 plastic lenses and 1 glass lens (4P1G lens 411). The 6P lens may include 6 lenses, for example, 6 plastic lenses, or 5 plastic lenses and 1 glass lens. It should be noted that the number of lenses in the lens 411 may be, but is not limited to, 5 or 6. The number of lenses may be selected based on the actual application. For example, when the camera 41 is used as a rear camera, the lens 411 may include 7 lenses.

[0069] In the prior art, electronic devices with a camera module 30, such as mobile phones, generally have the camera module 30 and the bracket 100 fixed together by gluing. In this way, when one of the camera module 30 or the bracket 100 fails or is damaged, the other cannot be disassembled and replaced, resulting in the entire camera module 30 and the bracket 100 being scrapped.

[0070] Especially for mobile phones with multiple camera modules 30, there is usually a need for multiple camera modules 30 to share the same bracket 100, such as dual-camera modules, triple-camera modules and quad-camera modules. The current multi-camera solution is generally that multiple camera modules 30 are fixed in the bracket 100 by gluing to form an integral camera device. In this way, when one of the camera modules 30 fails or is damaged, not only the bracket 100 cannot be disassembled and replaced, but other camera modules 30 cannot be disassembled and replaced either, which will cause multiple camera modules 30 and the bracket 100 to be scrapped, greatly increasing the scrapping cost.

[0071] Alternatively, another prior art solution eliminates the need for dispensing glue and instead directly places one or more camera modules 30 within the bracket 100. However, this approach exerts a downward pulling force on the camera module 30 when the flexible circuit board 302 is electrically connected to the circuit board, causing an upward elastic force on the side of the flexible circuit board 302 closest to the camera module 30. This upward elastic force then causes the camera module 30 to tilt. Consequently, when the cumulative tolerance between the camera module 30 and the bracket 100 is large, the gap between the bracket 100 and the camera module 30 becomes larger, and the camera module 30 is tilted. This can easily cause the camera module 30 to become loose or tilt within the bracket 100, impacting the camera module's performance.

[0072] Based on this, an embodiment of the present application provides a bracket 100. The bracket 100 includes an inner sidewall 11 that matches the outer sidewall of the camera module 30 through a carrier 10, and a buffer layer 20 is provided on at least a portion of the inner sidewall 11. This makes assembly and disassembly between the camera module 30 and the carrier 10 more flexible, facilitating repair or replacement, thereby reducing scrap costs to a certain extent. Furthermore, the buffer layer 20 can facilitate assembly and fixation between the camera module 30 and the carrier 10, avoiding problems such as hard extrusion caused by tolerance matching issues or tilting of the camera module 30 relative to the carrier 10.

[0073] The specific structure of the bracket 100 is described in detail below with reference to the accompanying drawings.

[0074] like Figure 4 As shown, the bracket 100 provided in the embodiment of the present application may include: at least one carrier 10, wherein the carrier 10 has an inner sidewall 11 adapted to the outer sidewall of the camera module 30, and the inner sidewall 11 forms an accommodating cavity 12 for accommodating the camera module 30. The camera module 30 of the camera assembly 1 is located in the accommodating cavity 12, and a buffer layer 20 is provided on at least a portion of the inner sidewall 11.

[0075] The buffer layer 20 can buffer and fix the outer wall of the camera module 30, and is also beneficial to the assembly and disassembly of the camera module 30, avoiding the problems in the prior art where the camera module 30 is difficult to fix, prone to tilting, or prone to hard extrusion damage due to tolerance between the camera module 30 and the bracket 100.

[0076] In the examples of this application, refer to Figure 5 As shown, at least a portion of the first end 201 of the buffer layer 20 can extend into the accommodating cavity 12 to form a blocking portion 2011, wherein the first end 201 is the end of the buffer layer 20 that is close to the upper end surface 13 of the carrier 10. By providing the blocking portion 2011 at the first end 201 of the buffer layer 20 as a special limiter, the blocking portion 2011 can serve as a limiter when assembling the camera module 30, thereby preventing the camera module 30 from being over-assembled or under-assembled.

[0077] It should be noted that the first end 201 of the buffer layer 20 can be entirely extended toward the interior of the accommodating cavity 12 to form a blocking portion 2011, for example, Figure 4 As shown, the barrier portion 2011 at the first end 201 of the buffer layer 20 can be a continuous and complete barrier structure. Alternatively, in other embodiments, the barrier portion 2011 can be formed by a portion of the first end 201 of the buffer layer 20 extending into the accommodating cavity 12. That is, the barrier portion 2011 at the first end 201 of the buffer layer 20 can be a small portion of the barrier structure disposed on the first end 201, or the barrier portion 2011 at the first end 201 of the buffer layer 20 can be a plurality of barrier structures disposed at intervals on the first end 201.

[0078] As an optional embodiment, the extending direction of the blocking portion 2011 can be parallel to the upper end surface 13 of the carrier 10. In this way, the camera module 30 can be better limited, ensuring the stability and reliability of the camera module 30 when assembled in the carrier 10, and avoiding the problem in the prior art that the camera module 30 is installed too tightly or not in place, resulting in poor camera performance of the mobile phone 200.

[0079] Furthermore, in the embodiment of the present application, the length of the blocking portion 2011 along its extension direction (ie Figure 5 The extension length L1 of the blocking portion can be 0.5mm-1.5mm. For example, the extension length L1 of the blocking portion can be 0.8mm, 1.0mm or 1.2mm, etc. The embodiment of the present application does not limit this, as long as it can play a role in stable limiting.

[0080] Of course, in some other embodiments, the extending direction of the blocking portion 2011 may also be non-parallel to the upper end surface 13 of the carrier 10. Specifically, the extending direction of the blocking portion 2011 may be parallel to the height direction of the buffer layer 20 (i.e. Figure 5 For example, the extending direction of the blocking portion 2011 may be at an angle of 75 degrees or 115 degrees to the height direction of the buffer layer 20, which is not limited in this embodiment of the present application.

[0081] In the embodiments of this application, continue to refer to Figure 5 As shown, the thickness of the buffer layer 20 may gradually decrease along a predetermined position 203 on the buffer layer 20 toward a second end 202 of the buffer layer 20. The second end 202 is an end of the buffer layer 20 close to the lower end surface 14 of the carrier 10.

[0082] It should be noted that a predetermined area S1 is formed between the predetermined position 203 and the second end 202. The height of the predetermined area S1 may be one-fifth to one-third of the height of the carrier 10. Thus, a special chamfered design can be formed at the end of the buffer layer 20 near the lower end surface 14 of the carrier 10, which can make upward assembly and downward disassembly of the camera module 30 more labor-saving and convenient.

[0083] When the height of the carrier 10 is 5 mm, the height of the preset area S1 can be 1 mm to 5 / 3 mm, that is, the distance between the preset position 203 and the second end 202 can be 1 mm to 5 / 3 mm. For example, the distance between the preset position 203 and the second end 202 can be 1.1 mm, 1.2 mm, or 1.3 mm, etc., which is not limited in this embodiment of the present application.

[0084] It should be noted here that the numerical values ​​and numerical ranges involved in the embodiments of the present application are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors. Those skilled in the art may consider this part of the error to be negligible.

[0085] Furthermore, in one possible implementation, the first end 201 of the buffer layer 20 can be flush with the upper end surface 13 of the carrier 10, and the second end 202 of the buffer layer 20 can be flush with the lower end surface 14 of the carrier 10. In other words, the distance between the first end 201 and the second end 202 of the buffer layer 20 is equal to the distance between the upper end surface 13 and the lower end surface 14 of the carrier 10, i.e., the height of the buffer layer 20 is equal to that of the carrier 10. This can further improve the stability of the assembly and fixation between the camera module 30 and the carrier 10, and to a greater extent avoid problems such as hard extrusion caused by tolerance matching or tilting of the camera module 30 relative to the carrier 10.

[0086] Of course, in other embodiments, the first end 201 of the buffer layer 20 may be lower than the upper end surface 13 of the carrier 10. This can provide a secure position for the camera module 30 while also saving costs. Alternatively, the first end 201 of the buffer layer 20 may be higher than the upper end surface 13 of the carrier 10, although this is not a limitation in the present embodiment.

[0087] Reference Figure 4 and Figure 5 As shown, the inner side wall 11 of the carrier 10 may include: a first inner side wall 111 and a second inner side wall 112 opposite to each other, and a third inner side wall 113 and a fourth inner side wall opposite to each other (not shown in the figure), and the third inner side wall 113 is connected to both the first inner side wall 111 and the second inner side wall 112, and the fourth inner side wall is connected to both the first inner side wall 111 and the second inner side wall 112.

[0088] A buffer layer 20 is provided on at least one of the first inner sidewall 111, the second inner sidewall 112, the third inner sidewall 113, and the fourth inner sidewall. This makes the assembly and disassembly between the camera module 30 and the carrier 10 more flexible, facilitating maintenance or replacement.

[0089] It is understood that the specific configuration of the buffer layer 20 includes but is not limited to the following possible implementations:

[0090] One possible implementation is: a buffer layer 20 is provided on the first inner sidewall 111 , or a buffer layer 20 is provided on the second inner sidewall 112 , or a buffer layer 20 is provided on the third inner sidewall 113 , or a buffer layer 20 is provided on the fourth inner sidewall.

[0091] Another possible implementation is to provide a buffer layer 20 on both the first inner sidewall 111 and the second inner sidewall 112, or to provide a buffer layer 20 on both the third inner sidewall 113 and the fourth inner sidewall. Providing buffer layers 20 on two opposing inner sidewalls 11 ensures flexibility in assembly and disassembly.

[0092] Another possible implementation is: a buffer layer 20 is provided on the first inner wall 111, the second inner wall 112 and the third inner wall 113, or a buffer layer 20 is provided on the first inner wall 111, the second inner wall 112 and the fourth inner wall, or a buffer layer 20 is provided on the first inner wall 111, the third inner wall 113 and the fourth inner wall, or a buffer layer 20 is provided on the second inner wall 112, the third inner wall 113 and the fourth inner wall.

[0093] Another possible implementation is to provide a buffer layer 20 on each of the first inner sidewall 111, the second inner sidewall 112, the third inner sidewall 113, and the fourth inner sidewall. Providing the buffer layer 20 on each of the first inner sidewall 111, the second inner sidewall 112, the third inner sidewall 113, and the fourth inner sidewall can prevent the inner sidewall 11 from scratching or even damaging the camera module 30.

[0094] It should be noted that when a buffer layer 20 is provided on the inner wall 11, taking the buffer layer 20 provided on the first inner wall 111 as an example, the buffer layer 20 may be provided on the entire wall surface of the first inner wall 111, or may be provided on a portion of the wall surface of the first inner wall 111. The embodiments of the present application do not limit this.

[0095] Furthermore, when the bracket 100 is applied to multiple camera modules, the bracket 100 can be designed as a structure that can accommodate two or more camera modules 30 as needed. Specifically, taking the camera module 30 as a dual camera module, that is, the camera assembly 1 has two camera modules 30 as an example, Figure 6 and Figure 7 As shown, the at least one carrier 10 may include a first carrier 101 and a second carrier 102 , and the first carrier 101 is connected to the second carrier 102 .

[0096] Figure 6 In the embodiment, the first carrier 101 and the second carrier 102 are two carriers 10 of the same size, that is, the bracket 100 can hold two camera modules 30 of the same size. Figure 7 In the embodiment, the sizes of the first carrier 101 and the second carrier 102 are different, and the size of the first carrier 101 is larger than that of the second carrier 102 , that is, the bracket 100 can hold two camera modules 30 of different sizes.

[0097] It should be noted that the embodiment of the present application does not limit the specific dimensions of the first carrier 101 and the second carrier 102. The specific dimensions of the first carrier 101 and the second carrier 102 can be flexibly set according to the actual dimensions of the camera module 30 that needs to be installed in the bracket 100 in the actual application scenario.

[0098] In addition, the connection between the first carrier 101 and the second carrier 102 includes but is not limited to the following two possible implementations:

[0099] One possible implementation is: one of the outer walls of the first carrier 101 is connected to one of the outer walls of the second carrier 102 .

[0100] Another possible implementation is that the first carrier 101 and the second carrier 102 share a side wall. For example, Figure 6 In the embodiment, the first carrier 101 and the second carrier 102 may share a first common side wall 1021 , that is, the first common side wall 1021 serves as both a side wall of the first carrier 101 and a side wall of the second carrier 102 .

[0101] Take the camera module 30 as a three-camera module, that is, the camera assembly 1 has three camera modules 30 as an example. Figure 8 As shown, at least one carrier 10 may further include: a third carrier 103 , the third carrier 103 being connected to the first carrier 101 or the second carrier 102 , or the third carrier 103 being connected to both the first carrier 101 and the second carrier 102 . Figure 8 In the figure, the third carrier 103 is connected to the first carrier 101, and the third carrier 103 and the first carrier 101 are two carriers 10 of the same size. The sizes of the third carrier 103 and the first carrier 101 are larger than the size of the second carrier 102, that is, the bracket 100 can hold three camera modules 30, the sizes of the camera modules 30 in the first carrier 101 and the third carrier 103 are the same, and the size of the camera module 30 in the second carrier 102 is smaller than the size of the camera modules 30 in the first carrier 101 and the third carrier 103.

[0102] It is easy to understand that in the embodiment of the present application, the material of the first carrier 101, the second carrier 102 and the third carrier 103 can be a metal material, which can ensure that the material strength of the first carrier 101, the second carrier 102 and the third carrier 103 is relatively high. During use, the metal material can protect the camera module 30. For example, when the mobile phone 200 falls or collides, the carrier 10 made of metal material is not easily damaged, thereby being able to better protect the camera module 30.

[0103] As an optional implementation, the first carrier 101 , the second carrier 102 and the third carrier 103 may be made of aluminum alloy.

[0104] Of course, in some other embodiments, the materials of the first carrier 101, the second carrier 102 and the third carrier 103 may include but are not limited to metal materials, and other plastic materials with higher strength may also be selected. This application does not limit the specific materials of the first carrier 101, the second carrier 102 and the third carrier 103.

[0105] It should be noted that the embodiment of the present application does not limit the specific size of the third carrier 103. The specific size of the third carrier 103 can be flexibly set according to the size of the camera module 30 to be installed in the bracket 100 in the actual application scenario.

[0106] In addition, the combination of the third carrier 103 and the first carrier 101 or the second carrier 102 includes but is not limited to the following possible implementations:

[0107] One possible implementation is: one of the outer walls of the third carrier 103 is connected to one of the outer walls of the first carrier 101 , or one of the outer walls of the third carrier 103 is connected to one of the outer walls of the second carrier 102 .

[0108] Another possible implementation is: the third carrier 103 and the first carrier 101 share a side wall. Figure 8 In the embodiment, the third carrier 103 and the first carrier 101 share a second common side wall 1031 , that is, the second common side wall 1031 serves as both a side wall of the third carrier 103 and a side wall of the first carrier 101 .

[0109] Alternatively, the third carrier 103 and the second carrier 102 may share a side wall (not shown in the figure), or part of the side wall of the third carrier 103 may be shared with part of the side wall of the first carrier 101, and the remaining part of the side wall of the third carrier 103 may be shared with part of the side wall of the third carrier 103.

[0110] Of course, in some other embodiments, the bracket 100 may include more carriers 10, that is, the bracket 100 can be applied to usage scenarios with more camera modules 30, and has the advantage of flexible and changeable assembly and matching.

[0111] Furthermore, in one possible implementation, the material of the buffer layer 20 can be a cured soft rubber. Specifically, the material of the buffer layer 20 can be silicone. It should be noted that the specific material of the buffer layer 20 is not limited to the above examples in this application, as long as it can provide a buffering or protective effect.

[0112] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0113] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0114] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "may include" and "have" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0115] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A camera assembly, applied to an electronic device with a shooting function, characterized in that: include: A camera module and a bracket, wherein the bracket is used to carry the camera module; The bracket includes: at least one bearing member; The carrier has an inner sidewall adapted to the outer sidewall of the camera module, and the inner sidewall forms an accommodating cavity for accommodating the camera module; A buffer layer is provided on at least a portion of the inner sidewall, at least a portion of a first end of the buffer layer extends toward the accommodating cavity to form a blocking portion, and a thickness of the buffer layer gradually decreases along a preset position on the buffer layer toward a second end of the buffer layer; The first end is an end of the buffer layer close to the upper end surface of the carrier, and the second end is an end of the buffer layer close to the lower end surface of the carrier.

2. The camera assembly according to claim 1, wherein: The extending direction of the blocking portion is parallel to the upper end surface of the supporting member.

3. The camera assembly according to claim 1 or 2, wherein: A preset area is formed between the preset position and the second end, and the height of the preset area is one fifth to one third of the height of the supporting member.

4. The camera assembly according to claim 3, wherein: The first end of the buffer layer is flush with the upper end surface of the bearing member, and the second end of the buffer layer is flush with the lower end surface of the bearing member.

5. The camera assembly according to any one of claims 1-2 and 4, characterized in that: The inner side wall includes: a first inner side wall and a second inner side wall opposite to each other, and a third inner side wall and a fourth inner side wall opposite to each other; the third inner side wall is connected to both the first inner side wall and the second inner side wall, and the fourth inner side wall is connected to both the first inner side wall and the second inner side wall; The buffer layer is disposed on at least one of the first inner sidewall, the second inner sidewall, the third inner sidewall, and the fourth inner sidewall.

6. The camera assembly according to claim 5, wherein: The buffer layer is provided on both the first inner side wall and the second inner side wall; Alternatively, the buffer layer is provided on both the third inner sidewall and the fourth inner sidewall.

7. The camera assembly according to claim 5, wherein: The buffer layer is disposed on the first inner sidewall, the second inner sidewall, the third inner sidewall, and the fourth inner sidewall.

8. The camera assembly according to any one of claims 1-2, 4, 6-7, characterized in that: The at least one carrier comprises: a first carrier and a second carrier; One of the outer side walls of the first bearing member is connected to one of the outer side walls of the second bearing member; Alternatively, the first supporting member and the second supporting member share a side wall.

9. The camera assembly according to claim 8, wherein: The at least one carrier further comprises: a third carrier; One of the outer sides of the third carrier is connected to one of the outer sides of the first carrier or one of the outer sides of the second carrier; Alternatively, the third supporting member shares a side wall with the first supporting member or the second supporting member.

10. The camera assembly according to any one of claims 1-2, 4, 6-7, and 9, characterized in that: The material of the buffer layer is cured soft glue.

11. The camera assembly according to any one of claims 1-2, 4, 6-7, and 9, characterized in that: The camera module includes: a camera and a flexible circuit board, wherein the camera is located on an end of the bracket extending outward from the electronic device; One end of the flexible circuit board is electrically connected to the camera, and the other end of the flexible circuit board is used to be electrically connected to a circuit board in the electronic device.

12. The camera assembly according to claim 11, wherein: The camera includes: a lens and a module body; The lens is electrically connected to the module body, and the module body is located in the accommodating cavity of the bracket; One end of the flexible circuit board is electrically connected to an end of the module body away from the lens, and the other end of the flexible circuit board extends along the bottom end of the module body and is electrically connected to the circuit board.

13. An electronic device, characterized in that: At least: A display screen, a middle frame, and a rear cover, wherein the display screen and the rear cover are respectively located on two sides of the middle frame; Also includes: at least one camera assembly according to any one of claims 1 to 12; The camera assembly is arranged on the middle frame, and the camera of the camera assembly faces the display screen or the rear shell.

14. The electronic device according to claim 13, wherein: The camera assembly is a front camera assembly, or the camera assembly is a rear camera assembly.

15. The electronic device according to claim 14, characterized in that There are two camera assemblies, one of which is a rear camera assembly and the other is a front camera assembly.

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